JP5017144B2 - Semiconductor cooling device mounting structure and semiconductor cooling device mounting method - Google Patents

Description

  The present invention relates to a semiconductor cooling device mounting structure and a semiconductor cooling device mounting method, and more particularly to a semiconductor cooling device mounting structure and a semiconductor cooling device mounting capable of easily attaching and detaching a heavy semiconductor cooling device. Regarding the method.

  FIG. 7 is a diagram showing an example of a semiconductor cooling device mounting operation when a conventional semiconductor cooling device mounting structure is used. The conventional vehicle control device structure includes a bottom plate frame 11 on which the semiconductor cooling device is mounted and a semiconductor cooling device mounting frame 3 for fixing the semiconductor cooling device. In this case, in order to attach the semiconductor cooling device, as shown in FIG. 7, the semiconductor cooling device is placed on the carriage, carried to the vicinity of the vehicle control device, from the end of the bottom plate frame 11 to the semiconductor cooling device mounting frame at the back, The semiconductor cooling device is pushed and slid on the bottom plate frame by human power and fixed.

  However, in this semiconductor cooling device mounting structure, the semiconductor cooling device is slid and moved on the bottom plate frame at the time of attachment and removal, so that the paint can be peeled off or scratched at the part of the bottom plate frame where the semiconductor cooling device is pushed and slid. As a result, there is a problem of electrical contact at that part. Also, since the semiconductor cooling device is heavy, there is a problem that it is difficult to align the bolt hole position of the semiconductor cooling device mounting frame with the bolt hole position on the semiconductor cooling device side.

  In view of the above problems, an object of the present invention is to provide a semiconductor cooling device mounting structure and a semiconductor cooling device mounting method capable of easily attaching and detaching a heavy semiconductor cooling device.

  In order to achieve the above object, a mounting structure for a semiconductor cooling device according to the present invention is a mounting structure for a semiconductor cooling device attached to a lower part of a railway vehicle. A frame, and a bottom plate frame that is positioned on the front side of the semiconductor cooling device mounting frame and places the semiconductor cooling device thereon, and is wider than a base portion of a carriage on which the semiconductor cooling device is placed on the bottom plate frame, An opening having a width narrower than that of the cooling device is provided, and the semiconductor cooling device can be moved together with the carriage to a position where the semiconductor cooling device can be mounted on the semiconductor cooling device mounting frame.

Further mounting structure of the semiconductor cooling device of the present invention, the bottom plate frame, characterized a flange for supporting the front Symbol semiconductor cooling device from both ends, by being composed of space between them, that the opening is formed And Further mounting structure of the semiconductor cooling device of the present invention, the lower surface of Installing with is the semiconductor cooling device, characterized in that it is constituted by a frame having a punch hole.

Further, the mounting method of the semiconductor cooling device of the present invention is a mounting method of the semiconductor cooling device attached to the lower part of the railway vehicle, and the lower part of the railway vehicle has a semiconductor cooling device mounting frame for attaching the semiconductor cooling device, and located on the front side of the semiconductor cooling device mounting frame has a bottom plate frame Ru surmounted the semiconductor cooling device, the bottom plate opening provided in the frame is wider than the base portion of the truck, narrower than the semiconductor cooling device , and the said mounting of the semiconductor cooling device, put carriage in which the height of the base portion of the carriage carrying the semiconductor cooling device higher than the height of the bottom plate frame in the opening, the semiconductor cooling device of the truck The semiconductor cooling device is advanced to a position where it can be mounted on the semiconductor cooling device mounting frame, and the semiconductor cooling device is fixed to the semiconductor cooling device mounting frame.

According to the present invention, in the mounting structure and the mounting method of the semiconductor cooling device of a semiconductor cooling device, attachment and detachment of the semiconductor cooling device since the provided space of the carriage carrying the bottom plate frame of the semiconductor cooling device mounting portion of the car 輌用 controller Work can be done easily.

  The best mode for carrying out the present invention will be described.

  FIG. 2 is a diagram illustrating an example of a vehicle control device. As shown in FIG. 2, the vehicle control device 5 (in this figure, with the (network-like) semiconductor cooling device cover removed) is disposed under the floor of the vehicle body 4. A semiconductor cooling device 6 is attached to the vehicle control device 5.

  FIG. 1 is an enlarged view showing an embodiment of a mounting structure for a semiconductor cooling device 6 according to the present invention. The mounting structure of the semiconductor cooling device 6 according to the present invention includes a semiconductor cooling device mounting frame 3 formed on the rear surface, and a bottom plate frame 13 on which the semiconductor cooling device 6 is placed on the front side of the semiconductor cooling device mounting frame 3. It has an upper frame 14 on the top and side walls 12 on both sides. The bottom plate frame 13 has an opening for receiving a carriage shown below. This opening is opened from the front side. In FIG. 1, it is comprised by the flange 2 formed from the both-sides wall 12, and the space 1 between flanges. The semiconductor cooling device mounting frame 3 is used for fixing the semiconductor cooling device 6.

  FIG. 3 is a diagram showing the relationship between the size of the space 1 provided in the bottom plate frame 13 and the carriage 7 in the present invention. The cart 7 is a cart that can adjust the height of the platform 15 by, for example, hydraulic pressure. The size of the space 1 provided in the bottom plate frame 13 is set to be larger than the width of the base portion 15 of the carriage 7 for carrying the semiconductor cooling device 6 as shown in FIG.

  FIG. 4 is a diagram of the semiconductor cooling device 6 in which punch holes are provided in the lower part. The semiconductor cooling device 6 is configured by fins 16 and a configuration frame 17 and the like, and a semiconductor is mounted on the opposite side of the fins 16 shown in FIG. The punch hole 8 shown in FIG. 4 is provided in the lower part of the component frame 17 of the semiconductor cooling device 6, and serves to protect the radiator (fin 16) and the like from foreign matters (ballast and the like) that are wound up from below during traveling. It serves as a passage for air to cool. Conventionally, the punch hole is provided on the bottom plate frame 11 side of the conventional structure, and conventionally, the portion of the punch hole 8 of the component frame 17 is configured to have a large opening.

  FIG. 5 shows the relationship between the semiconductor cooling device 6 and the flange 2. When the semiconductor cooling device 6 is mounted on the vehicle control device 5, both ends of the semiconductor cooling device 6 are supported by the two flanges 2. Note that a gap is provided between the side wall 12 and the semiconductor cooling device 6 or between the upper frame 14 and the semiconductor cooling device 6 so that the semiconductor cooling device 6 can be easily inserted by the carriage 7.

  Next, a method for mounting the semiconductor cooling device when the semiconductor cooling device mounting structure provided by the present invention is used will be described with reference to FIGS.

  First, the worker 10 sets the height of the base portion 15 of the carriage 7 higher than the position of the flange 2 and places the semiconductor cooling device 6 on the carriage 7 as shown in FIG. The operator 10 moves the carriage 7 on which the semiconductor cooling device 6 is mounted to the semiconductor cooling device mounting frame 3. At that time, in the semiconductor cooling device mounting structure provided in the present invention, the space 1 provided in the bottom plate frame is larger than the width of the base portion 15 of the carriage 7, so that the carriage 7 and the bottom plate frame (flange 2) do not contact each other. The semiconductor cooling device 6 can be moved together with the carriage 7 to the semiconductor cooling device mounting frame 3.

As a result, the operator 10 does not slide the semiconductor cooling device 6 on the bottom plate frame (flange 2), so that the paint is not peeled off or damaged, and the problem of electrical contact is eliminated. Further, since the semiconductor cooling device 6 can be moved by the carriage 7 to the semiconductor cooling device mounting frame 3, the position adjustment of the four bolt holes 19 can be facilitated.

  Finally, the height of the carriage 7 is adjusted, and the semiconductor cooling device 6 can be attached to the vehicle control device 5 by placing both ends of the semiconductor cooling device 6 on the flange 2 as shown in FIG. it can.

  The mounting of the semiconductor cooling device 6 is performed by aligning the bolt holes 19 on the mounting side surface of the component frame 17 of the semiconductor cooling device 6 with the mounting portions 18 provided on the semiconductor cooling device mounting frame 3 and tightening them with bolts or the like. . In some cases, attachment holes or the like may be provided on the lower surface of the flange 2 and the component frame 17 and fixed with bolts or the like.

  When the operator 10 moves or adjusts the position of the semiconductor cooling device 6, the operation is performed not by directly pressing the semiconductor cooling device 6 but by using the carriage 7, and thus the semiconductor cooling device mounting structure provided by the present invention is provided. When used, the workability at the time of attaching the semiconductor cooling device 6 can be improved. Also, since it does not slide, the paint is not peeled off or scratched, and the problem of electrical contact at that portion does not occur.

It is an enlarged view which shows one Embodiment of the attachment structure of the semiconductor cooling device of this invention. It is a figure which shows an example of the control apparatus for vehicles. It is a figure which shows the relationship between the space provided in the baseplate frame in this invention, and the magnitude | size of a trolley | bogie. It is a figure of the semiconductor cooling device with which the punch hole was provided in the lower part. It is a related figure of the flange and semiconductor cooling device in the present invention. It is a figure which shows the example of the semiconductor cooling device attachment operation | work at the time of using the attachment structure of the semiconductor cooling device of this invention. (A) It is a figure before mounting | wearing. (B) It is a figure at the time of mounting | wearing. It is a figure which shows the example of the semiconductor cooling device attachment operation | work at the time of using the conventional semiconductor cooling device attachment structure. (A) It is a figure before mounting | wearing. (B) It is a figure at the time of mounting | wearing.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Space 2 Flange 3 Semiconductor cooling device mounting frame 4 Car body 5 Vehicle control device 6 Semiconductor cooling device 7 Bogie 8 Punch hole 10 Worker 11 Bottom plate frame 12 of conventional structure Side wall 13 Bottom plate frame 14 Upper frame 15 Base portion 16 Fin 17 Configuration Frame 18 Mounting part 19 Bolt hole

Claims (4)

In the mounting structure of the semiconductor cooling device attached to the lower part of the railway vehicle,
The lower part of the railway vehicle has a semiconductor cooling device mounting frame for mounting the semiconductor cooling device, and a bottom plate frame that is located on the near side of the semiconductor cooling device mounting frame and places the semiconductor cooling device on top.
The bottom plate frame is provided with an opening that is wider than the pedestal of the carriage on which the semiconductor cooling device is placed and narrower than the semiconductor cooling device, and moves to the position where the semiconductor cooling device can be mounted on the semiconductor cooling device mounting frame. A mounting structure of a semiconductor cooling device, characterized in that it is possible. In the mounting structure of the semiconductor cooling device according to claim 1,
Said bottom plate frame, mounting structure before Symbol a flange for supporting the semiconductor cooling device from both ends, by being composed of space between them, characterized in that the opening is formed semi-conductor cooler. In the mounting structure of the semiconductor cooling device according to claim 1 or 2,
The lower surface of Installing with is the semiconductor cooling device, the mounting structure of a semiconductor cooling device, characterized in that it is constituted by a frame having a punch hole. A method of mounting a semiconductor cooling device attached to the lower part of a railway vehicle,
The The railcar bottom has a semiconductor cooling device mounting frame for mounting a semiconductor cooling device, a bottom plate frame located on the front side than the semiconductor cooling device mounting frame Ru surmounted the semiconductor cooling device,
The opening provided in the bottom plate frame is wider than the base of the carriage, and narrower than the semiconductor cooling device,
The mounting of the semiconductor cooling device is as follows:
A carriage in which the height of the pedestal of the carriage on which the semiconductor cooling device is placed is set higher than the height of the bottom plate frame is inserted into the opening, and the carriage is moved to a position where the semiconductor cooling device can be attached to the semiconductor cooling device mounting frame. Proceeding and fixing the semiconductor cooling device to the semiconductor cooling device mounting frame.

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