JP5439216B2 - Power supply - Google Patents

Description

  The present invention relates to a power supply device for a railway vehicle including a plurality of electronic components such as a power conversion device and an auxiliary power supply.

  In general, a railway vehicle is provided with a power supply device such as a drive power conversion device that supplies power used for driving a motor and an auxiliary power supply device that generates a three-phase AC power supply for air conditioning and lighting. An inverter device using a semiconductor switching element is applied to such a power supply device. The power conversion efficiency of the inverter device using the switching element is very high as compared with the conventional conversion method, but since a loss due to switching occurs, it is necessary to release this loss as heat energy to the outside. For this reason, there has been proposed a power conversion device that includes a semiconductor cooling unit in which a semiconductor switching element and a cooler are integrated to discharge heat (for example, Patent Document 1).

  The semiconductor cooling unit includes a plate-shaped heat receiving block, a heat pipe extending from the heat receiving block, and a plurality of heat radiating fins attached around the heat pipe. The semiconductor switching element is mounted on the surface of the heat receiving block. The heat generated in the semiconductor switching element is transferred to the heat receiving block, and by this heat, the refrigerant in the heat pipe is heated and evaporated, and the heat is dissipated to the atmosphere and condensed on the side of the radiation fin.

  When mounting a semiconductor cooling unit that integrates a semiconductor element and a cooler as described above to the main body of a device, the semiconductor cooling is performed using a machine that can lift and lower heavy objects such as a lifter crane from the weight and outline of the unit. After the unit is moved to an appropriate position, it is fixed to the main body with a plurality of bolts. Further, the semiconductor element and the high-voltage electric circuit (hereinafter referred to as a main circuit) are connected to the apparatus main body from the inside of the unit through conductors and electric wires and via a terminal block. Similarly, the low-voltage circuit (hereinafter, control circuit) is connected through a small connector or the like.

JP 2006-121847 A

  However, it is very troublesome and difficult to attach and fix the semiconductor cooling unit to the main body of the conversion device while using the lifter crane as described above. For example, it is difficult to accurately align the semiconductor cooling unit and the apparatus main body, and since the crane operator and the unit mounting person are different, there are more dangers than the mounting work of other units. Since the connection work between the unit control circuit and the device side control circuit is performed through the inside of the device from the opposite side of the device, a space for installing a bolt and moving a tool in a narrow device is required, and workability is poor. In order to solve this problem, if the work space is set wide, the apparatus becomes large. When it is necessary to remove the semiconductor cooling unit from the main body with the power converter installed under the floor of the railroad car body, a hanging ear for fixing the device near the semiconductor cooling unit, beams / rails from the body side, other frames, piping Projecting, it is difficult to secure a sufficient work space for the unit mounting bolts.

  The present invention has been made in view of the above points, and an object of the present invention is to provide a power supply device in which a semiconductor cooling unit can be easily attached and detached and the assembling property is improved.

Power supply according to the embodiment of the present invention includes a housing having an opening provided with a control unit therein, attached to the opening of the housing by a connecting mechanism, a cooling device for cooling the semiconductor element and the semiconductor element in the power supply device including a semiconductor cooling unit, a with a said coupling mechanism, and detachable and the said housing semiconductor cooling unit, provided with the body side coupling connector provided on the housing the semiconductor cooling unit A unit side connection connector , the main body side connection connector is inserted into an engagement hole provided in the unit side connection connector, and has a main body side hook that engages with the unit side connection connector. The connection connector is inserted into an engagement hole provided in the main body side connection connector and engaged with the main body side connection connector. With the Tsu-up side hook.

  According to the said structure, a semiconductor cooling unit can be attached or detached easily, and the power supply device which improved the assembly property can be provided.

FIG. 1 is a perspective view showing an appearance of a power converter according to a first embodiment of the present invention. FIG. 2 is a plan view of the power converter. FIG. 3 is a cross-sectional view of the power conversion device taken along line AA in FIG. 1. FIG. 4 is an exploded side view of the casing of the power converter and the semiconductor cooling unit. FIG. 5 is an exploded perspective view showing the casing of the power converter and the semiconductor cooling unit. FIG. 6 is a side view showing a coupling mechanism of the electrode conversion device. FIG. 7 is a side view showing a unit side connection connector of the connection mechanism. FIG. 8 is a perspective view showing a unit side connection connector of the connection mechanism. FIG. 9 is a perspective view showing a unit side connection connector of the connection mechanism in an operation state different from that in FIG. 8. FIG. 10 is a perspective view of the power conversion device showing a connecting step of the semiconductor cooling unit. FIG. 11 is a plan view showing a partially broken state of the connection mechanism. FIG. 12 is an exploded perspective view showing the casing and the semiconductor cooling unit of the power conversion device according to the second embodiment. FIG. 13 is a side view and a rear view showing a unit side connection connector of the power conversion device according to the second embodiment.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
1, 2, and 3 are a perspective view, a plan view, and a cross-sectional view showing the power conversion device according to the first embodiment as a power supply device. As shown in FIGS. 1 to 3, the power conversion device 10 includes a rectangular box-shaped housing 12, in which various electronic components and a cooling device described later are disposed. The casing 12 is attached under the floor with its upper wall facing the floor of the railway vehicle 14.

  The power converter 10 includes an inverter circuit 16 that converts DC power into AC power and supplies it to an electric motor, an air conditioner, and the like, a control unit 18 that transmits and receives a switching signal to and from a power semiconductor element of the inverter circuit, a detector, and a power supply unit Etc., and these are arranged in the housing 12.

  The inverter circuit 16 includes a plurality of power semiconductor elements 20, for example, an IGBT (insulated gate bipolar transistor), a diode (not shown), a capacitor 22 for suppressing a surge voltage of the power semiconductor element, and on / off of the power semiconductor element. A plurality of gate substrate amplifiers 24 and the like for outputting signals are provided.

  The power conversion device 10 includes a semiconductor cooling unit 26 having a semiconductor element 20 and a cooling device for cooling them. As shown in FIG. 3, the cooling device of the cooling unit 26 includes a rectangular base frame 27, a plurality of cooling blocks 30 supported by the base frame, and a heat radiating portion 32 that radiates heat from the cooling blocks. ing. Each cooling block 30 is formed in a plate shape with a material having high heat conductivity such as aluminum and has an installation surface. On the installation surface of the cooling block 30, a plurality of power semiconductor elements 20 of the inverter circuit 16 are attached via thermal conductive grease or the like.

  The heat radiating unit 32 of the cooling device includes a plurality of heat pipes 34 extending from the cooling block 30 and a plurality of heat radiating fins 36 attached to the heat pipes 34. The end of each heat pipe 34 is embedded in the cooling block 30. The extending portion of each heat pipe 34 extends outward from the cooling block 30 and inclined upward by a predetermined angle with respect to the horizontal direction. The plurality of heat pipes 34 are provided in parallel, for example, with a predetermined interval in the vertical direction. Each heat pipe 34 is filled with a refrigerant, for example, pure water. Heat is transported by changes in boiling (vaporization) and condensation (liquefaction) of the refrigerant.

  A plurality of heat radiating fins 36 are fitted to the plurality of heat pipes 34 at predetermined intervals in the longitudinal direction. Each radiating fin 36 is formed in a rectangular plate shape, for example, and extends along the vertical direction. In order to prevent the radiation fins 36 from being damaged by flying stones or the like, a protective cover 40 that covers the radiation fins 36 is attached to the base frame 27. The protective cover 40 is provided with a large number of blow-through holes in order to improve the air permeability and heat dissipation of the traveling wind.

  The semiconductor cooling unit 26 having the above-described configuration is connected to the main body side, that is, the housing 12 side by a connecting mechanism described later. The semiconductor cooling unit 26 is attached to the housing 12 with a part from the front wall 12 a of the housing 12, that is, with the heat radiating portion 32 protruding outward.

  As shown in FIGS. 4 and 5, a rectangular mounting opening 42 is formed at a substantially central portion of the front wall 12 a of the housing 12. A rectangular frame-shaped waterproof packing 44 made of rubber or the like is provided around the mounting opening 42 and fixed to the front wall 12a. In addition, four support brackets 46 are fixed and erected on the front wall 12 a and are respectively arranged outside the corners of the mounting opening 42.

  The power conversion device 10 includes a connection mechanism 50 that mechanically and electrically connects the semiconductor cooling unit 26 to the housing 12 side. As shown in FIGS. 3 to 5, the coupling mechanism 50 is fixedly disposed in a plurality of, for example, four unit-side coupling connectors 52 provided in the semiconductor cooling unit 26 and the housing 12, and the corresponding units. Four main body side connection connectors 54 connected to the side connection connectors 52 are provided.

  The four unit side connection connectors 52 are fixed to four corners of the base frame 27 of the semiconductor cooling unit 26, respectively. As shown in FIGS. 6 and 7, each unit-side connecting connector 52 includes a substantially prismatic connector base 56 a that is fixed to the base frame 27 and protrudes into the housing 12, and the connector base 56 a to the housing 12. And a hook (unit side hook) 58a protruding inward. The hook 58a has an engaging claw 60a provided at its extended end so as to protrude and retract. The engaging claw 60a is urged and held at a protruding position by an elastic member (not shown) provided in the hook 58a, for example, a spring. The hook 58a is provided so that the protrusion length with respect to the connector base 56a can be adjusted. The connector base 56a is provided with an adjusting screw 61a for adjusting the protruding length of the hook 58a.

  The connector base 56a is formed with an engagement hole 62a into which a hook 58b of a main body side connecting connector 54 described later is inserted and fitted. The engagement hole 62a is formed in substantially the same shape as the hook 58b. The engaging hole 62a also functions as a guide hole for positioning when connecting the connecting connectors. When electrical connection is also performed, slits or protrusions are formed in the engaging claws 60a of the hooks 58a and the corresponding portions of the engaging holes 62a, and these are electrically connected to the power semiconductor element 20 and the like. The conductive portions 66a and 68a may be used. The conductive portion 66a of the hook 58a and the conductive portion 68a of the engagement hole 62a may be either slits or protrusions, but each of them is fitted to the engagement hole of the mating body side connection connector 54 and the conductive portion of the hook, that is, When the mating conductive portion is a projection, it is formed in a slit, and when the mating conductive portion is a slit, it is formed in a projection.

  As shown in FIGS. 6 to 9, an operation lever 64a is rotatably attached to the connector base 56a, and the operation lever 64a is connected to the engaging claw 60a via a transmission mechanism (not shown). Then, by rotating the operation lever 64a from the mounting position shown in FIG. 8 to the release position shown in FIG. 9, the engagement claw 60a is submerged in the hook 58a, and the connection between the connection connectors can be released. Can do.

  On the other hand, as shown in FIGS. 3, 4, and 6, the four main body side connection connectors 54 are fixed in corresponding positions in the housing 12 so as to be connectable to the unit side connection connector 52. Each of the four main body side connection connectors 54 has the same structure as the unit side connection connector 52 and is formed on the unit side connection connector 52.

  Each of the main body side connection connectors 54 is fixed to a support in the housing 12 and extends toward the mounting opening 42, and has a substantially prismatic connector base 56b, and a hook projecting from the connector base 56b into the housing 12 ( Main body side hook) 58b. The hook 58b has an engaging claw 60b provided at its extended end so as to protrude and retract. The engaging claw 60b is urged and held at the protruding position by an elastic member (not shown) provided in the hook 58b, for example, a spring. The hook 58b is provided so that the protrusion length with respect to the connector base 56b can be adjusted. The connector base 56b is provided with an adjusting screw 61b for adjusting the protruding length of the hook 58b.

  The connector base 56b is formed with an engagement hole 62b into which the hook 58a of the unit side connection connector 52 is inserted and fitted. The engagement hole 62b is formed in substantially the same shape as the hook 58a. The engagement hole 62b also functions as a guide hole for positioning when the connection connector is connected. When electrical connection is also performed, slits or protrusions are formed in the engaging claws 60ba of the hooks 58b and the corresponding portions of the engaging holes 62b, and these are electrically connected to the power semiconductor element 20 and the like. It may be a conductive part.

  An operation lever 64b is rotatably attached to the connector base 56b, and the operation lever 64b is connected to the engaging claw 60b via a transmission mechanism (not shown). Then, by rotating the operation lever 64b from the attachment position to the release position, the engagement claw 60b can be submerged in the hook 58b, and the connection between the connection connectors can be released.

  When mounting and connecting the semiconductor cooling unit 26 configured as described above to the housing 12, as shown in FIGS. 4 and 10, the semiconductor cooling unit 26 is lifted with a crane lift or mounted on a lifting carriage 70. After being placed, it moves to a predetermined position facing the mounting opening 42 of the housing 12 and aligns. At this time, the semiconductor cooling unit 26 is positioned so that the power semiconductor element 20 side faces the mounting opening 42, and the four unit side connection connectors 52 are aligned with and face the corresponding main body side connection connectors 54. Further, the operation lever 64a of the unit side connection connector 52 and the operation lever 64b of the main body side connection connector 54 are respectively set to the mounting positions.

  Subsequently, the semiconductor cooling unit 26 is pushed toward the housing 12, pressed against the mounting opening 42 of the housing 12 of the base frame 27, that is, against the waterproof packing 44, and corresponds to the four unit side connection connectors 52. The main body side connection connectors 54 are respectively connected. That is, as shown in FIG. 11, the hook 58a of the unit side connection connector 52 is inserted and fitted into the engagement hole 62b of the corresponding main body side connection connector 54, and at the same time, the hook 58b of the main body side connection connector 54 is inserted into the corresponding unit. It is inserted and fitted into the engagement hole 62a of the side connection connector 52. Accordingly, the semiconductor cooling unit 26 is mechanically connected to the housing 12 by the connecting mechanism 50, and is fixed to the housing 12 in a state where the base frame 27 is in close contact with the housing 12 via the waterproof packing 44. At the same time, the conducting portions 66a and 68a of the unit side connecting connector 52 are engaged and conducted with the conducting portions 68b and 66b of the main body side connecting connector 54, and the semiconductor cooling unit 26 is electrically connected to the equipment in the housing 12. . During the connection, the bracket 46 of the housing 12 guides and positions the semiconductor cooling unit 26, and the engagement hole 62a of the unit side connection connector 52 and the engagement hole 62b of the main body side connection connector 54 are provided as connectors. Guide the connection between. Thereby, it becomes possible to perform a connection operation | work easily.

  After the connection, fine adjustment of the connection connector is performed with the adjusting screws 61a and 61b as necessary. By closing or loosening the adjusting screws 61a and 61b, the hook 58a of the unit side connection connector 52 or the hook 58b of the main body side connection connector 54 is moved in the insertion / removal direction to adjust the connection state between the connection connectors. The unit side and main body side connection connectors are finally adjusted by adjusting screws 61a and 61b so that the semiconductor cooling unit 26 is pressed against the mounting surface of the housing 12 with a uniform force. The error can be absorbed by the waterproof packing 44 formed of a shock absorbing material such as rubber.

  When the semiconductor cooling unit 26 is removed from the housing 12, the operation lever 64a of the unit side connection connector 52 and the operation lever 64b of the main body side connection connector 54 are set to the release positions, and then the semiconductor cooling unit 26 is moved. Pull out from the housing 12. Thereby, the connection between the unit side connection connector 52 and the main body side connection connector 54 is released, and the semiconductor cooling unit 26 is removed. In this case, the semiconductor cooling unit 26 can be removed even when only the operation lever 64a of the unit side connection connector 52 is set to the release position.

  According to the power conversion device configured as described above, the semiconductor cooling unit 26 can be easily attached to and detached from the device main body, that is, the housing 12, and a power supply device with improved assemblability can be obtained. . In other words, the semiconductor cooling unit 26 can be mechanically and electrically connected to the housing simply by pushing it in, and the bolting work, wiring connection work, etc. can be omitted, and the assembly man-hours can be reduced and simplified. . As a result, it is not necessary to secure a work space for the bolting or wiring connection of the semiconductor cooling unit in the housing, and the size of the entire apparatus can be reduced accordingly. In addition, the semiconductor cooling unit 26 can be mounted at an accurate position, and the semiconductor cooling unit can be brought into contact with the waterproof packing with a uniform force, thereby improving the waterproof and dustproof effect. From the above, the semiconductor cooling unit can be attached and detached without an installation tool, and the interface between the unit and the apparatus main body can be improved. This makes it possible to reduce the number of man-hours mainly by downsizing the apparatus in the height direction and simplifying the work.

  When connecting the control (low voltage) circuit through the unit side connector and the main body side connector, the number of the conductive portions 66a and 68a on the unit side and the slits or protrusions of the conductive portion on the main body side is increased. You may make it have a role. Also in this case, as described above, all the slits / projections of the combination of the conductive portion on the unit side to be fitted and the conductive portion on the main body side are staggered.

Next, a power converter according to a second embodiment of this invention will be described.
FIG. 12 shows an exploded view of the casing 12 and the semiconductor cooling unit 26 of the power conversion device according to the second embodiment. According to the present embodiment, the semiconductor cooling unit 26 has a unit side main circuit connector 72a connected to the main circuit, and a main body side main circuit connector 72b corresponding to the connector 72a is fixed in the housing 12. Has been placed. The unit-side main circuit connector 72 a is fixed to the base frame 27 and protrudes toward the housing 12. The height of the unit-side main circuit connector 72 a matches the position of the unit-side connection connector 52, that is, simultaneously with the connection of the unit-side connection connector 52. It is formed at a height that can be connected to the main circuit connector 72a on the side. The main body side main circuit connector 72 b is provided at a position aligned with the unit side main circuit connector 72 a and toward the mounting opening 42 of the housing 12. Other configurations of the power conversion device are the same as those of the first embodiment described above, and the same reference numerals are given to the same portions, and detailed description thereof is omitted.

  According to the power conversion device according to the present embodiment, the semiconductor cooling unit 26 is mechanically coupled to the housing 12 by the coupling mechanism 50, and at the same time, the unit side main circuit connector 72a and the main body side main circuit connector 72b are coupled, The main circuit of the semiconductor cooling unit 26 is connected to the main circuit and control circuit of the apparatus main body. Thereby, the mechanical connection of the semiconductor cooling unit and the connection and removal of the connection of the main circuit and the control circuit can be performed in conjunction with each other, and the assemblability can be further improved.

  As in the third embodiment shown in FIG. 13, at least one of the unit side connection connector 52 and the main body side connection connector 54 may be provided with a lock key 74 that locks the operation lever 64 a in the illustrated connection position. By providing such a lock key 74, the connection connector can be removed only when the key is used. In this case, anyone other than those who are permitted to handle the power conversion device cannot access the semiconductor cooling unit and the inside of the device (high-pressure portion). Accordingly, it is possible to prevent detachment work or careless detachment work by an unfamiliar operator.

The present invention is not limited to the above-described embodiments as they are, and can be embodied by modifying the constituent elements without departing from the scope of the invention in the implementation stage. In addition, various inventions can be formed by appropriately combining a plurality of components disclosed in the embodiment. For example, some components may be deleted from all the components shown in the embodiment. Furthermore, constituent elements over different embodiments may be appropriately combined.

For example, in each of the above-described embodiments, the IGBT is used as the semiconductor element, but another type of transistor, thyristor, or the like may be used. The power supply device according to the present invention is not limited to the power conversion device, and can be applied to other power supply devices such as an auxiliary power supply device.
Hereinafter, the invention described in the scope of claims at the beginning of the application of the present application will be added.
(1)
A housing having a mounting opening;
A control unit disposed in the housing;
A semiconductor element having a semiconductor element and a cooling device for cooling the semiconductor element, and a semiconductor cooling unit attached to the housing through the mounting opening;
A connection mechanism for connecting the semiconductor cooling unit and the housing;
The connection mechanism includes a main body side connection connector fixed in the housing, and a unit side connection connector fixed to the semiconductor cooling unit and detachably connected to the main body side connection connector through the mounting opening. Power supply.
(2)
The main body side connection connector has a main body side hook that engages with the unit side connection connector, and the unit main body side connection connector has a unit side hook that engages with the main body side connection connector. The power connector according to (1), wherein the connection connector and the unit side connection connector are mechanically connected to each other.
(3)
The main body side connection connector has an engagement hole into which the unit side hook is inserted and guides connection. The unit main body side connection connector has an engagement hole into which the main body side hook is inserted and guides connection. The power supply device according to (2).
(4)
The main body side connection connector has a conductive portion electrically connected to the device in the housing, and the unit main body side connection connector has a conductive portion electrically connected to the semiconductor element, and the main body side The power connector according to (1) or (2), wherein the connection connector and the unit side connection connector are electrically connected to each other by the conductive portion.
(5)
The coupling mechanism includes a main body side circuit connector fixed in the casing and electrically connected to a device in the casing, and a unit side circuit connector fixed to the semiconductor cooling unit and electrically connected to the semiconductor element. The power supply apparatus according to (1), wherein the main body side circuit connector and the unit side circuit connector are detachably connected.
(6)
The power supply device according to (1), wherein the unit side connection connector includes an operation lever that releases the connection of the unit side hook.
(7)
The power supply device according to (6), wherein the unit side connection connector includes a lock key that locks the operation of the operation lever.
(8)
The power supply device according to (1), further including an annular packing attached to the housing and positioned around the mounting opening, wherein the semiconductor cooling unit includes a support frame that is airtightly pressed against the packing.

DESCRIPTION OF SYMBOLS 10 ... Power converter device, 12 ... Housing, 12a ... Front wall, 14 ... Railway vehicle,
16 ... inverter circuit, 18 ... control unit, 20 ... power semiconductor element, 22 ... capacitor,
26 ... Semiconductor cooling unit, 27 ... Support frame, 50 ... Connection mechanism,
52 ... Unit side connection connector, 54 ... Body side connection connector,
56a, 56b ... Connector base, 58a, 58b ... Hook,
60a, 69b ... engaging claw, 62a, 62b ... engaging hole, 61a, 61b ... adjusting screw,
64a, 64b ... control lever, 72a ... unit side main circuit connector,
72b ... Main circuit side main circuit connector, 74 ... Lock key

Claims (6)

Power supply having a housing with an opening provided with a control unit therein, attached to the opening of the housing by a connecting mechanism, the semiconductor cooling unit and a cooling device for cooling the semiconductor element and the semiconductor element, the In the device
The connection mechanism is detachable from the housing and the semiconductor cooling unit, and includes a main body side connection connector provided in the housing and a unit side connection connector provided in the semiconductor cooling unit ,
The main body side connection connector is inserted into an engagement hole provided in the unit side connection connector, and has a main body side hook that engages with the unit side connection connector.
The unit side connection connector has a unit side hook that is inserted into an engagement hole provided in the main body side connection connector and engages with the main body side connection connector.
A power supply device characterized by that.   The main body side connection connector and the unit side connection connector each have a conductive portion, and the main body side connection connector and the unit side connection connector are engaged with each other, so that the semiconductor element is inserted through the conductive portion. The power supply device according to claim 1, wherein the power supply device is electrically connected to the housing side.   The semiconductor device further includes a main body side circuit connector provided in the housing detachable from each other and a unit side circuit connector provided in the semiconductor cooling unit, and the main body side circuit connector and the unit side circuit connector are connected to each other, so that the semiconductor The power supply device according to claim 1, wherein an element is electrically connected to the housing side.   The power supply apparatus according to claim 1, wherein the unit side connection connector includes an operation lever for releasing engagement between the unit side hook and the main body side connection connector.   The power unit according to claim 4, wherein the unit side connection connector includes a lock key for locking the operation lever.   The power supply device according to claim 1, wherein a packing is attached along the periphery of the opening.

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