JP4469832B2 - Power converter - Google Patents

Description

  The present invention relates to a power conversion device that is installed under a floor of a vehicle such as a railway and supplies vehicle driving power.

  As shown in FIG. 17, a power conversion device for driving a vehicle installed under the floor of a railway vehicle includes a semiconductor element 1 connected in a three-phase bridge, a phase capacitor 2 connected between AKs of each phase, and a DC terminal. A circuit having a filter capacitor 3 connected between the PNs converts the DC power input from the railway overhead line to the DC terminal PN into AC power by switching the semiconductor element 1 and outputs the AC power from the AC terminal UVW. Supplied to the motor for driving the vehicle. The circuit is provided in the semiconductor element cooling unit 4 in order to efficiently remove the heat generated from the semiconductor element 1.

  As shown in FIG. 18, the semiconductor element cooling unit 4 is attached to a box 6 attached below the vehicle body 5, and the semiconductor element 1, the phase capacitor 2, the filter capacitor 3, the gate amplifier 7, etc. The electrical connection between the semiconductor element cooling unit 4 and the box 6 is also performed by connecting both terminals or conductors 30 with bolts or the like in this sealed portion.

  The heat pipe 8 attached to the heat receiving block to which the semiconductor element 1 is attached and the radiating fins 9 attached to the heat pipe 8 are arranged in an open portion outside the box body 6. The semiconductor element 1 constitutes a heat generating part 10, the heat pipe 8 and the heat radiating fin 9 constitute a heat radiating part 11, and the heat generating part 10 and the heat radiating part 11 constitute a stack 12. Reference numeral 13 denotes an apparatus partition plate, and reference numeral 14 denotes a fitting limit.

  The heat dissipating unit 11 is disposed on the side of the vehicle body so that the exhaust heat is not accumulated under the vehicle floor and the wiring, piping, and the like under the floor are not heated. The heat pipe 8 is installed to be inclined so that the heat generating part 10 side is downward, and the refrigerant enclosed in the heat pipe 8 evaporates by heat generated from the semiconductor element 1 on the heat generating part 10 side and condenses on the heat radiating fin 9 side. And dissipate heat to the atmosphere. The condensed refrigerant repeats a cycle in which the inside of the heat pipe 8 returns to the heat generating part 10 side by gravity. Since the heat dissipating fins 9 dissipate heat to the atmosphere by natural cooling, they are installed almost perpendicularly to the ground, so that the rising air current easily passes between the heat dissipating fins 9.

  In the semiconductor element cooling unit 4, the heat pipe 8 for three phases is attached to the semiconductor element cooling unit frame 15 in a watertight structure, and then electrical components of each phase such as the semiconductor element 1, the phase capacitor 2, etc. The heat receiving block and the semiconductor element cooling unit frame 15 are attached, and the filter capacitor 3 and the gate amplifier 7 are attached to the semiconductor element cooling unit frame 15.

  In the conventional power conversion apparatus as described above, since the electrical product and other components are attached after the heat pipe 8 is attached to the semiconductor element cooling unit frame 15, it is difficult to divide the assembly. In addition, since the installation of electrical products and other products is performed in a narrow space between the heat pipe heat receiving blocks of each phase, workability such as tool handling and maintenance are poor.

  In other words, the semiconductor element cooling unit 4 is attached to and detached from the box 6 from the side of the vehicle body, and there is a heat dissipating part 11 of the cooler in that direction. In this attaching / detaching operation, it is necessary not only to mechanically fix the semiconductor element cooling unit 4 to the box 6, that is, to release the attachment portion, but also to cancel the electrical connection.

  Here, since the electrical connection is made on the center side of the vehicle body of the apparatus, it is necessary to enter the center side of the vehicle body, and a work space for that is required inside the power conversion device. Or it is set as the vehicle underfloor equipment arrangement | positioning which took the work space between the other apparatuses arrange | positioned adjacent to a power converter device in the vehicle body center side, and the lid | cover 31 which can be opened and closed is provided in this part of a power converter device. Necessary. In addition, it is naturally necessary to provide a structure that allows direct access to the electrical connection portion when the lid 31 is removed.

  As described above, the conventional power conversion device has a problem that workability becomes a problem in the mounting and detaching work of the semiconductor element cooling unit 4, and the work space is required, and the limited space under the vehicle floor cannot be used effectively. is there.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a power conversion device for a vehicle that can divide the assembly, has good detachability of the semiconductor element cooling unit, effectively uses space, and has good workability and maintainability. To do.

A power converter according to the present invention includes a stack including a heat generating unit having a circuit for converting from direct current to alternating current or alternating current to direct current by switching of a semiconductor element, and a heat dissipating unit coupled to the heat generating unit to cool the heat generating unit. A box that is attached under the floor of the vehicle and removably supports the stack, accommodates the heat generating part in a sealed part, and holds the heat radiating part in an open part on the vehicle side , the stack comprising a power conversion circuit It is configured for each phase, and the attachment portion of the stack to the box body is provided with a boundary plate and a locking member for maintaining watertightness. When the stack is attached to the box body, The fixing member is bolted using an attachment hole provided in the fin .

  ADVANTAGE OF THE INVENTION According to this invention, an assembly can be divided and a power conversion device for vehicles can be provided which has good detachability of the semiconductor element cooling unit, good utilization of space, and good workability and maintainability. .

(First embodiment)
A power converter according to a first embodiment of the present invention will be described with reference to FIGS. 1A is a side view of the semiconductor element cooling unit 4 attached to the lower portion of the vehicle body 5, FIG. 1B is a side view of an image of attaching the boundary plate 16 to the stack 12, and FIG. FIG. 3A is a side view of an image attached to the unit frame 15, FIG. 3A is a plan view of the semiconductor element cooling unit 4 taken along the line AA of FIG. 1A, and FIG. FIG. 3C shows a view of the semiconductor element cooling unit frame 15 as seen from the stack insertion surface, which is a view taken in the direction of arrow C in FIG.

  As shown in these drawings, the semiconductor element cooling unit 4 is attached to a box 6, and a semiconductor element cooling unit frame 15 constituting a part of the box 6 is used as a boundary, and the inner side is a sealed portion. The outside is an open part. The semiconductor element cooling unit frame 15 is provided with three attachment windows 18, and the stack 12 is attached to the attachment windows 18. The stack 12 includes a heat generating part 10 provided with the semiconductor element 1 and a heat radiating part 11 provided with heat radiating fins 9.

  A boundary plate 16 in which a packing 17 is attached to a circumferentially formed packing guide 19 is fixed to the fin 9a closest to the heat generating portion 10 by waterproofing. The semiconductor cooling unit frame 15 is provided with three stacks 12 attached so as to accommodate the electrical components for one phase composed of the semiconductor element 1 and the phase capacitor 2 and the conductors connecting them to the periphery of the packing 17. It is attached from the direction of arrow K in the form of being inserted from the vehicle side into the provided attachment window 18. Thus, the semiconductor element cooling unit 4 having one inverter circuit is configured.

  When the stack 12 is attached, the packing 17 attached to the boundary plate 16 is pressed by using the attachment holes 20 of the boundary plate 16 attached to the fins 9a closest to the heat generating portion 10 of the stack 12 Thus, the water tightness of the boundary between the semiconductor element cooling unit frame 15 and the stack 12 is maintained. With the above configuration, the heat radiating portion 11 is disposed on the side of the vehicle body 5 with respect to the vehicle body 5 and is fitted so as to fall within the fitting limit 14.

  In the power conversion device of the first embodiment, one inverter circuit is configured by configuring three stacks 12 in one semiconductor element cooling unit 4. Since the configuration is such that the electrical components and other components including the semiconductor element 1 and the phase capacitor 2 are mounted around the packing 17 of the boundary plate 16 mounted on the fin 9a closest to the heat generating portion of the heat pipe 8 in the stack 12. The stack 12 is detachable from the semiconductor cooling unit frame 15.

  Therefore, according to the first embodiment, the handleability is improved because the inverter circuit is in units of stacks. Further, since the stack can be attached and detached, high assembly workability and maintainability can be obtained.

(Second Embodiment)
Next, a power converter according to a second embodiment of the present invention will be described with reference to FIGS. 4 (a) is a side view of the semiconductor element cooling unit 4, FIG. 4 (b) is a plan view taken along the line bb of FIG. 4 (a), and FIG. 6 (a) is a side view of the stack 12, FIG. 6 (b) is a front view seen from the left side of FIG. 6 (a), and FIG. 6 (c) is D in FIG. The figure of the semiconductor element cooling unit frame 15 seen from the stack insertion surface which is an arrow view is shown.

  In this second embodiment, the four sides of the fin 9a attached to the side closest to the heat generating part 10 of the heat pipe 8 constituting the stack 12 are bent to the heat generating part 10 side, and the folded four-dimensional gaps are welded. Alternatively, it is filled with a waterproof seal or the like to form a watertight structure. A packing guide 19 and a packing 17 are mounted on the stack 12 mounting surface of the semiconductor element cooling unit frame 15 so as to have a circumferential shape. Electrical components such as the semiconductor element 1 for one phase and the phase capacitor 2 are attached to the heat generating portion 10 of the stack 12 within a range surrounded by the packing 17.

  When the stack 12 is attached to the semiconductor element cooling unit frame 15, the bent portion of the fin 9 a presses the packing 17 by using a mounting hole 20 provided in the fin 9 a closest to the heat generating portion 10 of the stack 12. In addition, the water tightness of the boundary between the semiconductor element cooling unit frame 15 and the stack 12 is maintained.

  In the power conversion device of the second embodiment, the shape of the fin 9a attached to the heat pipe 8 in the stack 12 closest to the heat generating portion 10 is configured to bite into the packing 17 of the semiconductor cooling unit frame 15. In addition, the stack 12 can be attached to and detached from the semiconductor element cooling unit frame 15 by configuring the electrical product and other articles in the range of the packing 17 formed on the periphery of the semiconductor cooling unit frame 15. In this case, the same effect can be obtained without providing the boundary plate 16 in the first embodiment.

  Therefore, according to the second embodiment, the number of parts is reduced, the stack 12 is reduced in weight, the workability when the stack 12 is attached to and detached from the semiconductor element cooling unit frame 15 is improved, and the boundary is waterproofed. Reduction in processing improves the quality of the watertight structure.

(Third embodiment)
Next, a power converter according to a third embodiment of the present invention will be described with reference to FIG. FIG. 7A shows a side view of the semiconductor element cooling unit 4, and FIG. 7B shows a side view of an image in which the stack 12 is attached to the semiconductor cooling unit frame 15.

  In this embodiment, a packing guide 19 and a packing 17 that maintain water tightness are attached to a fin 9a that is attached to the heat pipe 8 in the stack 12 closest to the heat generating portion 10 so as to have a circumferential shape. . Electrical components such as the semiconductor element 1 and the phase capacitor 2 for one phase are attached to the heat generating portion 10 of the stack 12 in the periphery of the packing 17.

  When the stack 12 is attached to the semiconductor element cooling unit frame 15, the fins 9 a are attached to the semiconductor element cooling unit frame 15 by bolting using the attachment holes provided in the fin 9 a from the most heat generating portion of the stack 12. The packing 17 is pressed to maintain the water tightness of the boundary between the semiconductor cooling unit frame 15 and the stack 12.

  In the power conversion device of the third embodiment, the shape of the fin 9a attached to the heat pipe 8 in the stack 12 closest to the heat generating portion is similar to the configuration of the boundary plate 16 in the first embodiment. By doing so, it acts in the same manner as when the boundary plate 16 is attached. As in the second embodiment, it is possible to reduce the number of parts of the structure at the boundary and to reduce the waterproof seal process applied to the boundary. In addition, in the configuration of the boundary portion, unlike the second embodiment, the packing 17 is mounted on the upper side in the direction of gravity, so that dust, rainwater and the like are not accumulated in the packing 17.

  Therefore, according to the third embodiment, it is possible to attach and detach the stack 12 from the semiconductor element cooling unit frame 15 by attaching a product to the periphery of the packing 17, and the stack 12 can be reduced in weight by reducing the number of parts. As a result, workability at the time of attaching and detaching the stack 12 is improved, and the quality of the watertight structure can be improved by reducing the waterproof treatment. Further, since the packing 17 is attached to the upper side in the direction of gravity, accumulation of dust, rainwater and the like on the packing 17 is reduced, and there is an effect of suppressing early deterioration of the packing 17.

(Fourth embodiment)
Next, a power converter according to a fourth embodiment of the present invention will be described with reference to FIG. FIG. 8A shows a side view of the semiconductor element cooling unit 4 and FIG. 4B shows a side view of an image in which the stack 12 is attached to the semiconductor cooling unit frame 15.

  In the fourth embodiment, the fin 9a attached to the heat pipe 8 closest to the heat generating portion 10 in the stack 12 has the same configuration as that of the third embodiment and is lower than the other fins. Use large dimensions. The gate amplifier 7 is arranged below the heat generating part 10 and the inspection cover 22 of the gate amplifier 7 is attached to the lower part of the fin 9a closest to the heat generating part 10. The packing guide 19 on the fin 9 a is configured to be on the outer periphery from the gate amplifier 7. The semiconductor element 1 and the gate amplifier 7 are connected by a gate wiring 21.

  In the power converter of the fourth embodiment, the semiconductor element cooling unit 4 is provided by providing the gate amplifier inspection cover 22 at the lower part of the heat radiating fin 9a attached to the heat pipe 8 closest to the heat generating part 10. The gate amplifier 7 can be easily inspected from the vehicle side without sinking into the center of the vehicle in a state where is attached to the vehicle. In addition, since the gate amplifier 7 is attached to the lower part of the heat generating portion 10 and immediately below the semiconductor element 1, the gate wiring 21 connecting the semiconductor element 1 and the gate amplifier 7 can be shortened.

  Therefore, according to the fourth embodiment, since the gate amplifier 7 can be inspected from the vehicle side, the operability of the confirmation test is improved, the maintainability is improved, and the work time is shortened. be able to. In addition, since the gate wiring 21 is shortened, it is less susceptible to noise and reliability is improved. The radiating fin 9a in the fourth embodiment may be a separate boundary plate 16 as in the first embodiment.

(Fifth embodiment)
Next, a power converter according to a fifth embodiment of the present invention will be described with reference to FIG. FIG. 9A is an image diagram for attaching the stack 12 of the semiconductor element cooling unit 4 to the semiconductor element cooling unit frame 15, and FIG. 9B is a plan view of the one-touch connector 23 portion.

  In this embodiment, a one-touch connector 23 is provided on the main circuit side of the electrical connection between the stack 12 of the semiconductor element cooling unit 4 and the filter capacitor 3 and the like, and a normal connector 24 is attached on the control circuit side. . In the main circuit one-touch connector 23, the opening on the semiconductor element cooling unit frame 15 side, which is the fixed side, has a tapered shape, and the conductor on the stack 12 side, which is the movable side, has a tapered shape with a narrow tip.

  Similarly to the main circuit, the control circuit connector 24 is provided with a fixed connector on the semiconductor element cooling unit frame 15 side, a movable connector on the stack 12 side, and a guide 25 to improve fitting. When the stack 12 is attached, the water tightness of the fitting portion between the semiconductor element cooling unit frame 15 and the stack 12 is secured by bolting using the attachment hole of the fin 9a closest to the heat generating portion 10 of the stack 12. In this configuration, electrical connection is made.

  In the power conversion device according to the fifth embodiment, by providing the main circuit one-touch connector 23, the stack 12 can be attached by work from the vehicle side. In the semiconductor element cooling unit 4, it is not necessary to secure a fastening work area for connection with the stack 12.

  Therefore, according to the fifth embodiment, since the stack 12 is attached only from the vehicle side, the assembly workability and the stack exchange workability are improved, and each work time can be shortened. it can. Further, the semiconductor element cooling unit 4 and thus the power conversion device can be reduced in size and weight by deleting the fastening work area of the connecting portion, the frontage for maintenance work, and the effective use of space. The radiating fin 9a in the fifth embodiment may be a separate boundary plate 16 as in the first embodiment.

(Sixth embodiment)
Next, a power converter according to a sixth embodiment of the present invention will be described with reference to FIG. 10 (a) is a side view of the semiconductor element cooling unit 4, FIG. 9 (b) is a side view of the stack 12, and FIG. 10 (c) is a front view as viewed from the left side of FIG. 10 (b). 10 (d) shows an image diagram for attaching the stack 12 to the semiconductor element cooling unit frame 15. FIG.

  In the sixth embodiment, as in the second to fifth embodiments, watertightness is provided between the fin 9a attached to the heat generating portion 10 closest to the heat generating portion 10 and the semiconductor element cooling unit frame 15. The configuration is to be retained. When the stack 12 is attached to the semiconductor element cooling unit frame 15, the packing 17 at the boundary portion is bolted to the engaging member 26 using an attachment hole provided in the fin 9 b closest to the vehicle side of the stack 12. Is pressed and the watertightness of the boundary between the semiconductor element cooling unit frame 15 and the stack 12 is maintained.

  According to the sixth embodiment, the mounting location of the stack 12 to the semiconductor element cooling unit frame 15 uses the mounting holes of the fins 9b on the vehicle side, which is the front side, not the deep heat generating portion 10 side. Therefore, the mounting workability is improved and the working time can be shortened. The radiating fin 9a in the sixth embodiment may be a separate boundary plate 16 as in the first embodiment.

(Seventh embodiment)
Next, a power converter according to a seventh embodiment of the present invention will be described with reference to FIG. FIG. 11A is a plan view showing a state in which the stack 12 is assembled into the box 6, and the box 6 side partially shows a cross section. FIG. 11B is a side view (in the vehicle body cross-sectional direction) in the same state, and the box 6 side partially shows a cross-section similarly to FIG. 11A. FIG.11 (c) is a CC arrow view of FIG.11 (b), and shows only an electrical connection part.

  In this embodiment, filter capacitors 3 connected to both ends of a power conversion circuit switching unit composed of semiconductor elements 1 connected in series are installed on the box body 6 side, and are electrically connected to the stack 12. However, a high current connector which is a one-touch connector is used for the main circuit electrical connection portion.

  This high-current connector is mainly composed of two elements, a male connector and a female connector. One is installed on the stack 12 side, and the other is attached on the box 6 side. The male side connector is a fitting conductor 29 with a tapered end that is fitted in a plate blade shape, and the female side connector to which the male side connector is mated widens in a tapered shape. This is a U-shaped cross-sectional connector 23a.

  In the present embodiment, a plurality of U-shaped connectors 23 a are attached to the box 6 side of the electrical connection between the stack 12 and the filter capacitor 3, and a laminated conductor 32 is provided between the filter capacitor 3 and the U-shaped connector 23 a. Connected with. On the other hand, a plurality of fitting conductors 29 are attached to the stack 12 side. The fitting direction of the U-shaped connector 23 a and the fitting conductor 29 is matched with the insertion direction K of the stack 12 into the box 6.

  In the power conversion device of this embodiment, when the stack 12 is assembled into the box 6, the stack 12 is inserted into the U-shaped connector 23 a installed on the box 6 side when the stack 12 is inserted from the side of the vehicle body. The fitting conductor 29 installed on the side starts to be fitted. At this time, since both tip shapes are tapered, a slight dimensional deviation can be started without any problem. When the stack 12 is further inserted into the box body 6 as it is, the U-shaped connector 23a and the fitting conductor 29 are completely fitted to complete electrical connection, but at the same time, the stack 12 is completely inserted into the box body 6. The stack 12 is attached to the box 6 by tightening it with a bolt or the like from the side of the vehicle body.

  According to the power conversion device of the seventh embodiment, the main circuit is electrically connected by a large current connector that is a one-touch connector, so that the stack 12 can be attached to the box 6 from the side of the vehicle body. Is possible. Further, it is not necessary to secure a fastening work area for electrical connection with the stack 12 in the box 6.

  Further, since the stack 12 is attached only from the side of the vehicle body, the assembly workability and the stack exchange workability are improved. Further, the semiconductor element cooling unit, and thus the power conversion device can be made smaller and lighter by deleting the fastening work area of the connecting portion, deleting and effectively using the space for maintenance work.

(Eighth embodiment)
Next, an eighth embodiment of the present invention will be described with reference to FIG. The power conversion device of this embodiment is provided with guide holes 28 and guide pins 27 for positioning on the box body 6 side and the stack 12 side, respectively, and a large current connector comprising a U-shaped connector 23 a and a fitting conductor 29. The guide hole 28 and the guide pin 27 are fitted before the high current connector starts to be fitted.
According to this embodiment, the fitting accuracy of the large current connector can be easily obtained by the mechanism of the guide hole 28 and the guide pin 27.

(Ninth embodiment)
Next, a ninth embodiment of the present invention will be described with reference to FIG. In the power conversion device of this embodiment, a plurality of large current connectors composed of a U-shaped connector 23a and a fitting conductor 29 are arranged in a straight line, and the blade direction is also the same direction.
According to this embodiment, the mounting positions of the plurality of large current connectors can be accurately configured, and the mutual dimensional error can be reduced.

(Tenth embodiment)
Next, a tenth embodiment of the present invention will be described with reference to FIG. The power conversion device of this embodiment has a configuration in which the positions of the tips of a plurality of U-shaped connectors 23a provided on the box 6 side are displaced in the insertion / removal direction and a step is provided. The plurality of fitting conductors 29 provided on the stack 12 side are arranged in the same position in the insertion / extraction direction, and as a result, the biting dimensions for each large current connector at the time of completion of fitting are different lengths. .

  According to this embodiment, when attaching and inserting the stack 12 to the box 6, the plurality of large current connectors are sequentially fitted one by one. Since the pressing force is reduced and the positioning of each high current connector becomes one, the stack insertion workability is improved.

(Eleventh embodiment)
Next, an eleventh embodiment of the present invention will be described with reference to FIG. In the power conversion device of this embodiment, the gate amplifier 7 mounted in the stack 12 is disposed below the cooler cooling block to which the semiconductor element 1 is attached, and the gate amplifier inspection port 7a is provided below the gate amplifier 7. Usually, the inspection cover 22a is watertight and closed. The gate amplifier 7 is provided with check terminals for confirming the potentials at both ends of the semiconductor element 1, and is connected to the semiconductor element 1 by gate signal wiring. In addition, a connector or a terminal is provided for electrical connection with the control circuit on the box 6 side, and is connected by fitting the connector or screwing the terminal.

  In the power conversion device of this embodiment, the gate wiring work in a state where the stack 12 is attached to the box body 6 is easy by providing the gate amplifier inspection port 7a and the inspection cover 22a. Inspection such as confirming the potential at both ends of the can be made.

(Twelfth embodiment)
Next, a twelfth embodiment of the present invention will be described with reference to FIG. In the power conversion device of this embodiment, the control wiring connection is installed on the side of the box 6 and the other side on the stack 12 side in the same manner as the high current connector for main circuit connection, 12 is attached to and removed from the box 6 so that the control circuit connector 24 can be inserted and removed by moving in the same direction as the stack insertion direction K.
According to this embodiment, not only the main circuit but also the control circuit can be electrically connected and disconnected simultaneously with the mechanical attachment / detachment work of the stack 12.

  According to each of the embodiments described above, workability in attaching and detaching the stack 12 is remarkably improved, stack replacement at the time of failure is easy, and work on the center side of the vehicle body is not required. Also disappear. In addition, since it is not necessary to secure a work space in the center of the car body, it also leads to a reduction in the size and weight of the power converter, and no work space is required between other equipment installed next to it under the car body floor. Therefore, the limited space under the vehicle body floor can be used effectively.

BRIEF DESCRIPTION OF THE DRAWINGS The power converter device of the 1st Embodiment of this invention is shown, (a) is a side view which shows the state which equipped the semiconductor element cooling unit under the vehicle body floor. (B) is a figure which shows the condition which attaches a boundary board to a stack. The figure which shows the power converter device of the 1st Embodiment of this invention, and shows the condition which attaches a stack | stuck to a semiconductor element cooling unit frame. The power converter device of the 1st Embodiment of this invention is shown, (a) is a top view which follows the AA line of Fig.1 (a), (b) is a B arrow view of FIG. 2, (c). FIG. The power converter device of the 2nd Embodiment of this invention is shown, (a) is a side view which shows the state which equipped the semiconductor element cooling unit under the vehicle body floor, (b) follows the bb line of (a). Plan view. The figure which shows the power converter device of the 2nd Embodiment of this invention, and shows the condition which attaches a stack | stuck to a semiconductor element cooling unit frame. The power converter device of the 2nd Embodiment of this invention is shown, (a) is a side view of a stack, (b) is the front view seen from the left of (a), (c) is D arrow of FIG. Visual view. The power converter device of the 3rd Embodiment of this invention is shown, (a) is a side view of a semiconductor element cooling unit, (b) is a figure which shows the condition which attaches a stack to a semiconductor element cooling unit frame. The power converter device of the 4th Embodiment of this invention is shown, (a) is a side view of a semiconductor element cooling unit, (b) is a figure which shows the condition which attaches a stack to a semiconductor element cooling unit frame. The power converter device of the 5th Embodiment of this invention is shown, (a) is a figure which shows the condition which attaches a stack to a semiconductor element cooling unit frame, (b) is a bb arrow line view of (a). The power converter device of the 6th Embodiment of this invention is shown, (a) is a side view of a semiconductor element cooling unit, (b) is a side view of a stack, (c) is seen from the left side of (b). FIG. 4D is a diagram illustrating a state in which the stack is attached to the semiconductor element cooling unit frame. The power converter device of the 7th Embodiment of this invention is shown, (a) is a top view which shows the condition which integrates a stack in a box, (b) is the same side view, (c) is C- of (b). C arrow figure. The top view which shows the power converter device of the 8th Embodiment of this invention, and shows the condition which integrates a stack in a box. The top view which shows the power converter device of the 9th Embodiment of this invention, and shows the condition which integrates a stack in a box. The top view which shows the power converter device of the 10th Embodiment of this invention, and shows the condition which integrates a stack in a box. The side view which shows the power converter device of the 11th Embodiment of this invention, and shows the condition which integrates a stack in a box. The side view which shows the power converter device of the 12th Embodiment of this invention, and shows the condition which integrates a stack in a box. The circuit diagram of a power converter device. The conventional power converter device is shown, (a) is a side view, (b) is a top view of the semiconductor element cooling unit along the bb line of (a).

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Semiconductor element, 2 ... Phase capacitor, 3 ... Filter capacitor, 4 ... Semiconductor element cooling unit, 5 ... Vehicle body, 6 ... Box, 7 ... Gate amplifier, 7a ... Gate amplifier inspection port, 8 ... Heat pipe, 9 ... Heat-radiating fins, 9a ... heat-source-side fins, 9b ... vehicle-side fins, 10 ... heat-generating portions, 11 ... heat-radiating portions, 12 ... stacks, 13 ... device partition plates, 14 ... equipment limit, 15 ... semiconductor element cooling unit frame, DESCRIPTION OF SYMBOLS 16 ... Boundary board, 17 ... Packing, 18 ... Mounting window, 19 ... Packing guide, 20 ... Mounting hole, 21 ... Gate wiring, 22, 22a ... Cover for gate amplifier inspection, 23 ... Main circuit one-touch connector, 23a ... U character Connector 24, control circuit connector 25 ... control circuit connector guide, 26 ... locking member, 27 ... guide pin, 28 ... guide hole, 29 ... fitting conductor, 30 Conductor 31 ... lid, 32 ... laminated conductor, K ... mounting direction.

Claims (10)

A stack comprising a heat generating part having a circuit for converting from direct current to alternating current or from alternating current to direct current by switching of a semiconductor element, and a heat dissipating part coupled to the heat generating part to cool the heat generating part, and attached to the vehicle floor under the floor A box that removably supports the stack, accommodates the heat generating part in a sealed part, and holds the heat radiating part in the open part on the vehicle side ;
The stack is configured for each phase of the power conversion circuit, and the attachment portion to the box of the stack is provided with a boundary plate and a locking member for maintaining watertightness, and when the stack is attached to the box A power conversion device , wherein a bolt is fastened to the locking member using an attachment hole provided in a fin of the stack near the vehicle . Boundary plate power converter according to claim 1, wherein the gate amplifier and the gate amplifier inspection cover for the power conversion circuit is provided in the.   The power converter according to claim 1, further comprising a one-touch connector that contacts and separates the main circuit at the sealed portion of the stack and the box. The power converter according to claim 3 , wherein either one of the one-touch connectors can be inserted / removed by linearly moving, and the attaching / detaching direction of the one-touch connector is the same as the inserting / removing direction of the stack. The power converter according to claim 4 , wherein a positioning guide is provided in the vicinity of the one-touch connector to start fitting before the one-touch connector when the stack is attached to the box. 5. The power conversion device according to claim 4 , wherein the one-touch connector includes a plate-like fitting conductor and a U-shaped connector that sandwiches the fitting conductor from both sides. The one-touch connectors provided in plurality, the have been displaced in the insertion direction in either side of the stack or the box body, according to claim 4, wherein the different respective embedding dimension at the time of loading completion Power conversion device. A lid that can be opened and closed on the lower surface of the stack, and a check terminal for confirming the potential of the wiring connection part from the box side to the gate amplifier mounted in the stack or the both ends of the semiconductor element above the lid The power conversion device according to claim 4 , wherein the power conversion device is provided. A control circuit connector for electrical connection to a control circuit provided in the stack is provided, and this control circuit connector can be inserted / removed by moving one of them linearly, and is the same as the insertion / removal direction of the one-touch connector The power conversion device according to claim 4 , wherein the power conversion device has an insertion / extraction direction. 5. The power conversion device according to claim 4, wherein the stack is provided with one or more semiconductor elements for a power conversion circuit and three or more one-touch connectors.

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