JP5016354B2 - 3D wiring board design equipment - Google Patents

Description

  The present invention relates to a three-dimensional wiring board design apparatus for designing a three-dimensional wiring board in which electronic components and wiring are arranged in a three-dimensional structure, and in particular, electronic components, their accessories and wiring are directly designed three-dimensionally and three-dimensional. The present invention relates to a three-dimensional wiring board design apparatus capable of generating manufacturing data of a wiring board.

  Conventionally, when designing a three-dimensional wiring substrate design apparatus of this type, a three-dimensional wiring substrate design apparatus first designs two-dimensional electronic components and wiring, and based on the designed two-dimensional structure design data. Assembling or laminating to form a three-dimensional structure.

  In addition, when the 3D wiring board design apparatus is configured with a 3D simulation system, the 3D wiring board is designed by drawing it in 2D, and the 3D wiring board is designed based on the 2D drawing data. It was. Except for designing the 3D drawing data from the 2D drawing data, the 3D drawing data was created separately from the 2D drawing data.

  Further, as a conventional three-dimensional wiring board design apparatus, Patent Document 1 discloses a method for manufacturing a three-dimensional mounting component, which is shown in FIG. 11 as a developed configuration diagram of the three-dimensional mounting component. In the drawing, the three-dimensional mounting component manufacturing method includes arranging a plurality of electronic components 300 on a plurality of molds 500, attaching the wiring 200 to the mold 500, and sealing the electronic components 300 and the wiring 200 with the molding material 400. It is configured to include a step of three-dimensionally processing the surface shape of the molding material 400 with the mold 500, curing the molding material 400, and peeling the mold 500 from the molding material 400.

Furthermore, as a conventional three-dimensional wiring board design apparatus, Patent Document 2 discloses a case forming body and an electronic apparatus using the same, and FIG. 12 shows a conceptual explanatory diagram of an electronic component mounting structure. In the figure, according to the conventional technique, an electronic component 622 and a wiring 624 for electrically connecting the electronic component 622 are formed inside a plate body formed to be bendable. The plate body is formed in a shape in which the housing is expanded in a plane, and the housing can be formed by assembling the plate body. Thereby, it can be formed as an electronic device in which an electronic component is mounted on the housing itself.
JP 2001-308119 A Japanese Patent Laid-Open No. 2004-71737

  Since the three-dimensional wiring board designing apparatus according to each background art is configured as described above, when designing a three-dimensional wiring board, two-dimensional electric parts and accessories are arranged in advance. The design data for laying each wiring must be created, and the design data for the two-dimensional structure must be reconstructed to design the design data for the three-dimensional structure. In order to design, there has been a problem that the design procedure becomes complicated and a great deal of design effort is required.

  When designing two-dimensional structure design data with three-dimensional CAD without creating the two-dimensional structure design data, the design is much larger than reconstructing the three-dimensional structure based on the two-dimensional structure design data. It had the problem of requiring procedures and labor.

  In addition, the three-dimensional wiring board designing apparatus according to the background art creates secondary structure design data in advance, and assembles this two-dimensional structure to verify whether the three-dimensional three-dimensional wiring board is designed based on optimum conditions. Therefore, there is a problem that the two-dimensional manufacturing data of the optimum three-dimensional wiring substrate such as the wiring route, electrical characteristics, heat resistance characteristics, etc. cannot be generated accurately and easily.

  In addition, when the 3D wiring board design apparatus according to the background technology is configured using a 3D simulation system, 3D design data and 2D manufacturing data for 3D wiring board are created separately. There is a problem that enormous design procedures and creation time are required.

  The present invention has been made to solve the above-mentioned problems, and it is possible to directly design a three-dimensional wiring substrate having a three-dimensional structure for electronic parts, accessories and wiring thereof, and to generate manufacturing data for the three-dimensional wiring substrate. The object is to propose a three-dimensional wiring board design apparatus.

The three-dimensional wiring board design apparatus according to the present invention includes a three-dimensional shape input means for inputting a three-dimensional shape of a three- dimensional wiring board to be designed , a three-dimensional shape display means for displaying the input three-dimensional shape, Design position input means for designating and inputting a design position of an electronic component and an accessory of the electronic component at an arbitrary mounting position of the displayed three-dimensional shape, an electronic component input from the design position input means, and the electronic Based on the design position of the accessory of the component, the wiring design means for designing and inputting the electronic component and the design position of the wiring connected to the accessory of the electronic component, and the input design position is the electronic component and the An electronic component accessory and an arrangement determining means for determining an arrangement by determining whether or not the electronic component and the wiring connected to the electronic component accessory are three-dimensionally arranged; and the arrangement determining means And a manufacturing data generating means for generating and outputting the two-dimensional manufacturing data using the determined three-dimensional arrangement stereoscopic wiring substrate in the production, manufacturing data generating means, three-dimensional as a two-dimensional manufacturing data The cross-section and / or surface development of the arranged three-dimensional wiring substrate is generated so that the number of masks of the two-dimensional plane subjected to the cross-section and / or surface development is minimized.

As described above, in the present invention, the three-dimensional shape of the three-dimensional wiring substrate input by the three-dimensional shape input means is displayed on the three-dimensional shape display means, and an electronic component is displayed at an arbitrary mounting position of the displayed three-dimensional shape. And the design position input means inputs the design position of the accessory of this electronic component and inputs it, and the layout determination means judges whether or not the input design position is an appropriate design of the three-dimensional layout and determines the layout. As a result, the three-dimensional wiring board having a three-dimensional shape can be directly designed, and the three-dimensional wiring board having the intended design contents and characteristics can be designed accurately and simply.
In the present invention, the design position of the wiring connected to the electronic component and the accessory of the electronic component is designed based on the design position of the electronic component and the accessory of the electronic component input from the design position input means. Therefore, it is possible to select the layout of the electronic components and the accessories of the electronic components that match the three-dimensional shape of the three-dimensional wiring substrate to be designed. It is possible to design a three-dimensional wiring substrate having an accurate, simple and quick design.
In the present invention, there is provided manufacturing data generating means for generating and outputting two-dimensional manufacturing data used when manufacturing the three-dimensionally arranged solid wiring substrate determined by the arrangement determining means. Therefore, it is possible to accurately and easily generate 2D manufacturing data for 3D wiring substrates with optimal electrical characteristics, heat resistance, etc. from 3D structure design data without creating 2D structure design data for 3D wiring substrates in advance. It has the effect of being able to.
Further, since the manufacturing data generating means generates the cross section and / or the surface development of the three-dimensional wiring substrate arranged three-dimensionally as two-dimensional manufacturing data, the electronic component disposed on the surface of the three-dimensional wiring substrate In addition, it has an effect that two-dimensional manufacturing data of a three-dimensional wiring substrate having the optimum electrical characteristics, heat resistance characteristics and the like can be generated accurately and easily from the design data of the three-dimensional structure related to the accessories and wiring.
In addition, the manufacturing data generation means may minimize the number of masks on the cross-section and / or surface developed two-dimensional plane of the three-dimensional wiring substrate arranged three-dimensionally as two-dimensional manufacturing data. Therefore, it is possible to select a simpler electronic component, its accessories, and wiring layout, simplify the manufacturing and assembly process of the three-dimensional wiring substrate as much as possible, and manufacture and assemble in an accurate and short time. Has the effect of enabling.

The three-dimensional wiring board design apparatus according to the present invention includes a three-dimensional shape input means for inputting a three-dimensional shape of a three- dimensional wiring board to be designed , a three-dimensional shape display means for displaying the input three-dimensional shape, Design position input means for designating and inputting a design position of an electronic component and an accessory of the electronic component at an arbitrary mounting position of the displayed three-dimensional shape, an electronic component input from the design position input means, and the electronic Based on the design position of the accessory of the component, the wiring design means for designing and inputting the electronic component and the design position of the wiring connected to the accessory of the electronic component, and the input design position is the electronic component and the An electronic component accessory and an arrangement determining means for determining an arrangement by determining whether or not the electronic component and the wiring connected to the electronic component accessory are three-dimensionally arranged; and the arrangement determining means And a manufacturing data generating means for generating and outputting the two-dimensional manufacturing data using the determined three-dimensional arrangement stereoscopic wiring substrate in the production, manufacturing data generating means, three-dimensional as a two-dimensional manufacturing data The cross-section and / or surface development of the arranged three-dimensional wiring substrate is generated so that the number of masks crossing the cross-sectional and / or surface-developed two-dimensional plane wiring is minimized.

  As described above, in the present invention, the manufacturing data generating means performs the cross-sectional and / or surface development of the three-dimensional wiring substrate arranged three-dimensionally as two-dimensional manufacturing data, and the wiring of the two-dimensional plane developed by the cross-section and / or surface. Since the number of masks crossed with each other is designed to be minimized, it is possible to select a simpler electronic component, its accessories, and wiring layout, simplifying the manufacturing and assembly process of the three-dimensional wiring substrate as much as possible. It has the effect of enabling accurate and short-time manufacturing and assembly.

(First embodiment of the present invention)
A three-dimensional wiring board designing apparatus according to a first embodiment of the present invention will be described with reference to FIGS. FIG. 1 is an overall schematic block circuit configuration diagram of a three-dimensional wiring board designing apparatus according to the present embodiment, FIG. 2 is a flow chart for creating three-dimensional wiring board design data by the three-dimensional wiring board designing apparatus shown in FIG. 1, and FIG. FIG. 4 is an explanatory diagram of an arrangement of electronic components and wirings by the three-dimensional wiring board design apparatus shown in FIG.

  In each of the drawings, the three-dimensional wiring board designing apparatus according to the present embodiment creates an input unit 1 for creating design data for the three-dimensional wiring board 100 of the three-dimensional shape 101 to be designed and inputs various commands. The three-dimensional shape input unit 2 for inputting the three-dimensional shape 101 of the three-dimensional wiring substrate 100 designed based on the above command, the display unit 6 for displaying the input three-dimensional shape 101, and the display unit 6 Based on the design position input unit 3 for designating and inputting the design position of the electronic component 110 at an arbitrary mounting position of the three-dimensional shape 101, and the design position of the electronic component 110 input from the design position input unit 3, The wiring design unit 4 for designing and inputting the design position of the wiring 120 connected to the electronic component 110, the three-dimensional shape input unit 2, the design position input unit 3, and the three input from the wiring design unit 4. The display control unit 5 for controlling the design positions of the original shape 101, the electronic component 110, and the wiring 120 to be displayed on the display unit 6, and the input design positions are determined by three-dimensionally arranging the electronic component and the wiring 120. And a design database 8 for storing the determined design positions of the electronic component 110 and the wiring 120 in the three-dimensional shape 101 as design data.

  The arrangement determination control unit 7 determines whether or not the design positions of the input electronic component 110 and the wiring 120 are compatible with the three-dimensional shape 101 input by the three-dimensional shape input unit 2, and is determined not to match. In this case, it is moved to a position where the three-dimensional shape 101 is suitable.

Next, an operation of creating the design data of the three-dimensional wiring board of the three-dimensional wiring board designing apparatus according to this embodiment based on the above configuration will be described.
First, three-dimensional shape data of the three-dimensional shape 101 for the three-dimensional wiring substrate 100 to be designed is input from the three-dimensional shape input unit 2 in accordance with an input command from the input unit 1 (step 1). Based on the three-dimensional shape data of the input three-dimensional shape 101, the display control unit 5 displays the three-dimensional shape 101 on the display unit 6 as shown in FIG. 3 (step 2). A command from the input unit 1 is sequentially sent from the design position input unit 3 to the electronic component 110 (and accessories such as pads not shown) as shown in FIG. The display control unit 5 superimposes and displays the three-dimensional shape 101 on the display unit 6 based on the input design position data related to the dimensions and arrangement position of the electronic component 110 and the like (step 3).

  Whether or not the electronic component 110 superimposed on the three-dimensional shape 101 in this step 3 is an appropriate position suitable for various characteristics (for example, electrical characteristics, heat resistance characteristics, functional characteristics, etc.) of the three-dimensional wiring substrate 100 specified in advance is arranged. The decision control unit 7 determines (step 4). When it is determined by the arrangement determination control unit 7 that the electronic component 110 superimposed and displayed is not an appropriate position of the three-dimensional shape 101, the arrangement determination control unit 7 arranges the electronic component 110 displayed on the display unit 6. It is moved to an appropriate position of the three-dimensional shape 101 that is the shortest distance from the position (step 5).

  When the arrangement position of the electronic component 110 is moved to an appropriate position and when the electronic component 110 is determined to be an appropriate position in the step 4, all electronic components mounted on the three-dimensional wiring substrate 100 to be designed are mounted. The placement determination control unit 7 determines whether or not the placement of 110 (including accessories such as pads not shown) has been completed (step 6). If it is determined in step 6 that the arrangement of all the electronic components 110 has not been completed, the process returns to step 3 and the operations from step 3 to step 6 are repeated.

  If it is determined in step 6 that all the electronic components 110 have been wired, the shape and route of the wiring 120 for the electronic component 110 in which the placement determination control unit 7 is arranged are automatically drawn. To do. This automatic operation diagram determines the route of the entire wiring 120 by a line search method, a maze method, a rip-up method, etc., and takes into consideration specific electrical characteristics and manufacturing yield in the bent portion and each route interval in the determined route. To further adjust the route.

  The route of the drawn wiring 120 is input to the display control unit 5 and the display device 7, and the input shape and route of the wiring 120 are displayed on the display unit 6 under the control of the display control unit 5. The placement determination control unit 7 determines whether or not the shape and route of the input and displayed wiring 120 conforms to a preset design rule (step 7). The controller 7 stores the arrangement data of the electronic component 110 as design data in the design database 8 together with the wiring data of the shape and route of the suitable wiring 120.

  As described above, since the three-dimensional wiring board design apparatus according to the present embodiment can directly design the three-dimensional wiring board 100 to be designed as a three-dimensional shape, the three-dimensional wiring board having the intended design contents and characteristics can be accurately and simply It will be possible to design quickly.

(Second embodiment of the present invention)
A three-dimensional wiring board designing apparatus according to a second embodiment of the present invention will be described with reference to FIGS. 2 to 4 based on FIGS. FIG. 5 is an overall schematic block circuit configuration diagram of the three-dimensional wiring board design apparatus according to the present embodiment, FIG. 6 is a detailed circuit block diagram of a manufacturing data generation unit in the three-dimensional wiring board design apparatus shown in FIG. FIG. 8 is a flowchart showing the operation of generating the three-dimensional manufacturing data by the three-dimensional wiring board designing apparatus shown in FIGS. 5 and 6. FIG. 8 is an explanatory diagram of the three-dimensional manufacturing data in a developed state by the three-dimensional wiring board designing apparatus shown in FIGS. FIG. 9 is an explanatory diagram of two-dimensional manufacturing data in a stacked and divided state by the three-dimensional wiring board design apparatus shown in FIGS. 5 and 6.

  In each of the drawings, the three-dimensional wiring board designing apparatus according to the present embodiment is similar to the first embodiment described in FIG. 1 in that the input unit 1, the three-dimensional shape input unit 2, the design position input unit 3, and the wiring design unit. 4, the display control unit 5, the display unit 6, the arrangement determination control unit 7 and the design database 8 are provided in common, and in addition to this configuration, arrangement data and wiring of the electronic component 110 determined by the arrangement determination control unit 7 The manufacturing data generation unit 9 generates two-dimensional manufacturing data of the three-dimensional wiring substrate 100 having the three-dimensional shape 101 specified by the wiring data 120, and the generated two-dimensional manufacturing data is stored in the manufacturing database 81. is there.

The manufacturing data generation unit 9 reads out the design data determined by the arrangement determination control unit 7 and stored in the design database 8 and executes control for generating two-dimensional manufacturing data of the three-dimensional wiring substrate 100. 91 and a cross-section manufacturing data creation unit that creates two-dimensional manufacturing data by dividing the design data of the three-dimensional wiring substrate 100 into a plurality of cross sections in the three-dimensional shape 101 of the three-dimensional wiring substrate 100 based on the control of the generation control calculation unit 91 92, and a surface development data creation unit 93 that creates the two-dimensional manufacturing data by developing the surface of the three-dimensional shape 101 of the three-dimensional wiring substrate 100 from the design data of the three-dimensional wiring substrate 100 based on the control of the generation control calculation unit 91. In addition, for each of the two-dimensional manufacturing data created, either the number of production masks or the number of wires crossing the mask edge is minimized. A configuration and a minimum value judging unit 94 for judging.
The manufacturing database 81 that stores the two-dimensional manufacturing data generated by the manufacturing data generation unit 9 constitutes a storage unit 80 together with the design database 8.

  Next, the operation | movement which produces | generates the two-dimensional manufacturing data regarding the three-dimensional wiring base | substrate 100 of the three-dimensional wiring base | substrate design apparatus based on this embodiment based on the said structure is demonstrated. First, as a premise, similarly to the three-dimensional wiring board design apparatus according to the first embodiment, the arrangement data of the electronic components 110 and the wiring data of the wiring 120 related to the three-dimensional wiring board 100 are created as design data and stored in the design database 8. Is done.

  The design data is read from the design database 8 by the generation control calculation unit 91 of the manufacturing data generation unit 9, and the generation control calculation unit 91 reads the electronic data 110 and the wiring 120 arranged on the three-dimensional wiring substrate 100 of the read design data. Based on the design data, it is determined whether the three-dimensional wiring substrate is expanded or divided into two-dimensional data based on the design data (step 10). Based on this determination, the manufacturing data generation unit 9 instructs the surface development data creation unit 93 to generate two-dimensional data based on the development and causes the cross-section manufacturing data creation unit 92 to generate two-dimensional data based on the division. When the arrangement of the electronic component 110 and the wiring 120 is arranged on the surface of the three-dimensional shape 101 according to the instruction of the generation control calculation unit 91, the surface development data creation unit 93 displays the above-described FIG. The three-dimensional shape 101 provided with the electronic component 110 and the wiring 120 shown in FIG. 8 is developed into two-dimensional data in a plurality of modes as shown in FIG. 8A or 8B, for example (step 11). Based on the developed two-dimensional data, the minimum value determination unit 94 determines whether or not the number of masks used at the time of manufacture created based on the two-dimensional data is the minimum (step 12).

The determination as to whether or not the number of masks is the minimum value is made by trying a predetermined number of expansions (different types of expansion patterns; for example, shown in FIG. 8A or 8B), and this predetermined number of times. The minimum value determination unit 94 determines the developed pattern created in step (1). If it is determined in step 12 that the number of masks is the minimum, based on the developed two-dimensional data, the minimum value determination unit 94 creates a two-dimensional data wiring with a mask edge created from the two-dimensional data. It is determined whether the number crossing 120 is the minimum (step 13). The determination in step 13 is also made for each number of deployments that are preset and tried in the same manner as in step 12.
If it is determined in steps 12 and 13 that the value is not the minimum, the process returns to step 11 to repeat each operation (steps 11 to 13).

  If it is determined in step 10 that the two-dimensional data is generated by the division, the surface development data creation unit 93 displays the three-dimensional wiring substrate 100 in which the electronic component 110 and the accessory are arranged and the wiring 120 is input. The slice data is divided into secondary data as shown in FIG. 9B (step 14). Based on the sliced two-dimensional data, the minimum value determination unit 94 determines whether or not the number of masks to be used for manufacturing created based on the two-dimensional data is the minimum (step 15).

The determination as to whether or not this is the minimum value of the number of masks is made by trying a preset number of slice divisions (different types of division patterns), and the minimum value determination unit 94 determines the division pattern created by this predetermined number of times. to decide. If it is determined in step 15 that the number of masks is the minimum, based on the divided two-dimensional data, the minimum value determination unit 94 creates a two-dimensional data wiring with a mask edge created from the two-dimensional data. It is determined whether the number crossing 120 is the minimum (step 16). The determination in step 16 is also made for each number of divisions set in advance and tried in the same manner as in step 12.
If it is determined in steps 15 and 16 that the value is not the minimum, the process returns to step 11 and the operations are repeated (steps 14 to 16).

  The minimum value determined by the minimum value determination unit 94 is executed for all the numerical values of the number of expansions or the number of slice divisions, and becomes the smallest value among all the executed numerical values, or a preset threshold value It can be arbitrarily determined in the case of a smaller value.

  If the minimum value determination unit 94 determines that the minimum value is obtained in steps 13 and 16, the two-dimensional data that minimizes the number of masks or the number of wirings traversed by the mask edge pieces is obtained from the two-dimensional data of the three-dimensional wiring substrate 100. It is generated as manufacturing data, and this two-dimensional manufacturing data is stored in the manufacturing database 81 (step 17). It should be noted that the two-dimensional manufacturing data of the three-dimensional wiring substrate 100 can be generated only when the steps 12 and 13, 15 and 16 are minimum values in the step 17.

  As described above, in the three-dimensional wiring board design apparatus according to the present embodiment, the manufacturing data generation unit 9 develops or slices the three-dimensional structure based on the three-dimensional structure design data created by the placement determination control unit 7. It is possible to accurately and easily generate two-dimensional manufacturing data of a three-dimensional wiring substrate having optimum electrical characteristics, heat resistance characteristics, etc. from the data.

(Other embodiments of the present invention)
In each of the above embodiments, the three-dimensional wiring substrate 100 to be designed is a cubic three-dimensional shape. However, as shown in FIG. 10, various three-dimensional wiring substrates to be designed by the present invention are targeted. can do. In the figure, all are three-dimensional manufacturing data developed on a plurality of planes.

  Further, when the electronic component 110 and the wiring 120 are arranged on the surface and / or inside of the various three-dimensional wiring substrates shown in FIG. Dimensional manufacturing data can also be constructed.

1 is an overall schematic block circuit configuration diagram of a three-dimensional wiring board design apparatus according to a first embodiment of the present invention. 3 is a flow chart for creating design data of a three-dimensional wiring board by the three-dimensional wiring board designing apparatus shown in FIG. 1. It is an input explanatory view of a three-dimensional shape by the three-dimensional wiring board design apparatus shown in FIG. The electronic component and wiring arrangement explanatory drawing by the three-dimensional wiring board | substrate design apparatus of FIG. It is a whole block circuit block diagram of the three-dimensional-wiring board | substrate design apparatus which concerns on 2nd Embodiment of this embodiment. FIG. 6 is a detailed circuit block diagram of a manufacturing data generation unit in the three-dimensional wiring board design apparatus shown in FIG. 5. FIG. 7 is a flowchart of a three-dimensional manufacturing data generation operation by the three-dimensional wiring board design apparatus shown in FIGS. 5 and 6. FIG. FIG. 7 is an explanatory diagram of three-dimensional manufacturing data in a developed state by the three-dimensional wiring board design apparatus shown in FIGS. 5 and 6. FIG. 7 is an explanatory diagram of two-dimensional manufacturing data in a stacked and divided state by the three-dimensional wiring board design apparatus described in FIGS. 5 and 6. These are various three-dimensional wiring substrates to be designed by a three-dimensional wiring substrate designing apparatus according to another embodiment of the present invention. It is an expanded block diagram of the three-dimensional mounting component which is a conventional three-dimensional wiring board design apparatus. It is a conceptual explanatory drawing of the mounting structure of the electronic component in the housing | casing formation body which is the conventional three-dimensional wiring board | substrate design apparatus, and an electronic device using the same.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Input part 2 3D shape input part 3 Design position input part 4 Wiring design part 5 Display control part 6 Display part 7 Placement determination control part 8 Design database 9 Manufacturing data generation part 80 Storage part 81 Manufacturing database 91 Generation control calculation part 92 Cross-section manufacturing data creation unit 93 Surface development data creation unit 94 Minimum value determination unit 100 Three-dimensional wiring substrate 500 type 101 Three-dimensional shape 110 Electronic component 120 Wiring 200 Wiring 300 Electronic component 400 Molding material 500 type 622 Electronic component 624 Wiring

Claims (2)

3D shape input means for inputting the 3D shape of the three-dimensional wiring substrate to be designed;
3D shape display means for displaying the input 3D shape;
Design position input means for designating and inputting a design position of an electronic component and an accessory of the electronic component at an arbitrary mounting position of the displayed three-dimensional shape;
Based on the design position of the electronic component and the accessory of the electronic component input from the design position input means, the wiring design for designing and inputting the design position of the wiring connected to the electronic component and the accessory of the electronic component Means,
Judgment is made by determining whether or not the input design position is an appropriate design of an electronic component, an accessory of the electronic component, and a three-dimensional arrangement of wiring connected to the electronic component and the accessory of the electronic component. An arrangement determining means ;
Production data generating means for generating and outputting two-dimensional manufacturing data used when manufacturing the three-dimensionally arranged three-dimensional wiring substrate determined by the arrangement determining means,
The manufacturing data generating means is adapted to minimize the number of masks on the cross-sectional and / or surface-expanded two-dimensional planes of the three-dimensional wiring substrate arranged three-dimensionally as two-dimensional manufacturing data. A three-dimensional wiring board designing apparatus characterized by generating . 3D shape input means for inputting the 3D shape of the three-dimensional wiring substrate to be designed;
3D shape display means for displaying the input 3D shape;
Design position input means for designating and inputting a design position of an electronic component and an accessory of the electronic component at an arbitrary mounting position of the displayed three-dimensional shape;
Based on the design position of the electronic component and the accessory of the electronic component input from the design position input means, the wiring design for designing and inputting the design position of the wiring connected to the electronic component and the accessory of the electronic component Means,
Judgment is made by determining whether or not the input design position is an appropriate design of an electronic component, an accessory of the electronic component, and a three-dimensional arrangement of wiring connected to the electronic component and the accessory of the electronic component. An arrangement determining means;
Production data generating means for generating and outputting two-dimensional manufacturing data used when manufacturing the three-dimensionally arranged three-dimensional wiring substrate determined by the arrangement determining means,
The manufacturing data generating means minimizes the number of masks for crossing the cross-section and / or surface development of the three-dimensional wiring substrate arranged three-dimensionally as two-dimensional production data with the wiring of the cross-sectional and / or surface-developed two-dimensional plane. A three-dimensional wiring board design apparatus , characterized in that

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