JP5010445B2 - Manufacturing method of mold for microlens array - Google Patents

Manufacturing method of mold for microlens array Download PDF

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JP5010445B2
JP5010445B2 JP2007309235A JP2007309235A JP5010445B2 JP 5010445 B2 JP5010445 B2 JP 5010445B2 JP 2007309235 A JP2007309235 A JP 2007309235A JP 2007309235 A JP2007309235 A JP 2007309235A JP 5010445 B2 JP5010445 B2 JP 5010445B2
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mold
transfer
substrate
microlens array
curved surface
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JP2009132010A (en
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雄一 内田
展幸 宮川
忠寛 山路
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パナソニック株式会社
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Description

  The present invention relates to a method for manufacturing a mold for a microlens array.

  Conventionally, as a manufacturing method of micro lens array molds, a micro lens array mold is manufactured by mirror cutting (precision shaper processing) using a three-axis controlled drive of a diamond bite using an ultra-precision machine. Has been proposed (Non-Patent Document 1).

Note that Non-Patent Document 1 exemplifies a microlens array mold in which microlenses having a lens diameter of about 1 mm are two-dimensionally arranged.
"Ultra-precision processing and mass production technology of microlens (array)", 1st edition, Technical Information Association, Inc., April 28, 2003, p. 126-131

  By the way, in the method for manufacturing a microlens array mold disclosed in Non-Patent Document 1, in order to obtain each curved surface corresponding to the lens surface of each microlens, Is moved multiple times for each curved surface, but it is calculated by calculating how the Earl bite should be moved once for each curved surface, and the processing is automatically performed based on the program.

  However, in the method for manufacturing a microlens array mold disclosed in Non-Patent Document 1, when the lens size is further reduced from the mm level to the μm level, an R bit is set to 1 for each curved surface. It is necessary to make an arbite having the same radius of curvature as that of the lens surface in the desired lens shape, and it is necessary to make an arvite for each desired lens shape. The production of Earl Bite was expensive and time consuming. In addition, in the method for manufacturing a microlens array mold disclosed in Non-Patent Document 1, if the lens size is reduced and the number of curved surfaces formed on the microlens array mold is increased, the processing time becomes longer. This will cause a cost increase.

  The present invention has been made in view of the above reasons, and an object of the present invention is to provide a method for manufacturing a microlens array mold that can easily manufacture a microlens array mold having an arbitrary shape. It is in.

  According to the first aspect of the present invention, a resist layer forming step of forming a resist layer on one surface side of the substrate, and a transfer mold in which cones are formed at portions corresponding to the plurality of microlenses are pressed against the resist layer. A transfer step of transferring the shape of each cone of the transfer mold to the resist layer, and each microlens on the one surface side of the substrate by dry etching the substrate from the one surface side of the substrate after the transfer step A curved surface forming process for forming a plurality of curved surfaces corresponding to the lens surface of the lens, and a mold in which the master is inverted by electroforming using a substrate on which each curved surface is formed in the curved surface forming process as a master or a duplicate mold in which the master is duplicated And an electroforming process for forming a microlens array mold.

  According to the present invention, a resist layer forming step of forming a resist layer on one surface side of a substrate, a transfer mold in which cones are formed at portions corresponding to a plurality of microlenses are pressed against the resist layer for transfer A transfer step for transferring the shape of each cone of the mold to the resist layer, and by dry etching the substrate from the one surface side of the substrate, a plurality of surfaces corresponding to the lens surfaces of the respective microlenses on the one surface side of the substrate By sequentially performing the curved surface forming process to form the curved surface, it is possible not only to form a plurality of curved surfaces at the same time on the substrate, but also to set the etching conditions for dry etching in the curved surface forming process as appropriate to make the etching rate isotropic The curvature radius of the curved surface can be controlled and the design of the curved surface shape can be easily handled by increasing the In the electroforming process, it is possible to form a microlens array mold consisting of a mold in which the master is inverted by an electroforming method using a substrate on which each curved surface is formed or a replica mold that duplicates the master. It becomes possible to easily manufacture a microlens array mold having a shape.

  According to a second aspect of the present invention, in the first aspect of the invention, in the transfer step, the transfer die is two-dimensionally arranged and a flat portion is formed between the adjacent cones. The curved surface forming step is characterized in that dry etching is performed until there is no portion corresponding to each flat portion in the resist layer.

  According to the present invention, it is possible to easily manufacture a microlens mold for molding a microlens array having high condensing efficiency without a flat portion between lens surfaces of adjacent microlenses.

  According to a third aspect of the present invention, in the first aspect of the invention, in the transfer step, the transfer die is a pyramid having a pyramid shape and the cones are two-dimensionally arranged without a gap. It is characterized by using.

  According to this invention, it becomes possible to easily manufacture a microlens mold for forming a microlens array having a high light collection efficiency without a flat portion between lens surfaces of adjacent microlenses, Compared to the invention of claim 2, it is possible to easily manufacture a microlens mold for molding a microlens array having finer microlenses.

  According to a fourth aspect of the present invention, in the first or second aspect of the present invention, in the transfer step, each of the cones is formed at the tip of a rod-shaped body as the transfer mold. And

  According to the present invention, the transfer mold can be easily produced at low cost.

  According to a fifth aspect of the present invention, in the first, second or fourth aspect of the present invention, in the transfer step, each lattice point of a virtual two-dimensional triangular lattice having a regular unit lattice as the transfer mold is used as the transfer mold. In this case, a material in which the cone is formed at each part corresponding to the above is used.

  According to the present invention, the outer peripheral shape of the lens surface in a plan view is a hexagonal shape, and there is no flat portion between the lens surfaces of adjacent microlenses. The mold can be easily manufactured.

  The invention according to claim 6 is the invention according to claim 1, claim 2, claim 4, or claim 5, wherein, in the transfer step, the transfer mold has the same outer peripheral shape in plan view and a plurality of different heights. It is characterized by using a material in which a cone is formed.

  According to the present invention, a microlens mold having a plurality of curved surfaces with different curvature radii can be manufactured. Therefore, for a microlens for forming a microlens array having a plurality of microlenses with different radii of curvature. The mold can be easily manufactured.

  According to the first aspect of the present invention, it is possible to easily manufacture a microlens array mold having an arbitrary shape.

(Embodiment 1)
Hereinafter, a method for manufacturing a microlens array mold according to the present embodiment will be described with reference to FIGS.

  First, a resist made of an organic material (thermosetting resin, photocurable resin, etc.) is spin-coated by spin coating on one surface side of the substrate 10 made of a silicon substrate shown in FIG. The structure shown in FIG. 1B is obtained by performing the resist layer forming step to be formed. As the resist of the resist layer 11, a general resist having good transferability and high heat resistance may be used.

  Thereafter, a transfer mold in which cones (in this embodiment, pyramids) 21 are formed at portions corresponding to the plurality of microlenses 31 (see FIG. 6) of the microlens array 30 (see FIG. 6) having a desired shape. The structure shown in FIG. 1E and FIG. 4 is obtained by performing a transfer process in which 20 is pressed against the resist layer 11 to transfer the shape of each cone 21 of the transfer mold 20 to the resist layer 11. Here, in the transfer step, after the transfer mold 20 is opposed to the surface of the resist layer 11 as shown in FIG. 1C, the transfer mold 20 is moved to the resist layer as shown in FIG. Then, the resist layer 11 is cured, and the transfer mold 20 is released from the resist layer 11. The transfer mold 20 is formed of a predetermined mold material (Ni-P in this embodiment), and is a transfer mold substrate 20a that serves as a basis of the transfer mold 20 (see FIG. 2A). 2) by cutting with a diamond cutting tool 240 as shown in FIG. 2 (b). As shown in FIG. 3, a plurality of cones 21 are two-dimensionally arranged without gaps. The resist layer 11 is a concavo-convex pattern in which a portion corresponding to each cone 21 is recessed as shown in FIG.

  After the transfer step described above, the microlenses 31 (FIG. 6) are formed on the one surface side of the substrate 10 by dry etching the substrate 10 from the one surface side of the substrate 10 under an isotropic or nearly isotropic etching condition. Reference) The structure shown in FIG. 1G and FIG. 5 is performed by performing a curved surface forming step for forming a plurality of curved surfaces (concave surfaces) 12 corresponding to the respective lens surfaces 31a (convex curved surfaces in the example of FIG. 6). obtain. FIG. 1F shows a cross-sectional shape in the middle of the curved surface forming process (in the middle of etching).

  By the way, suppose that only one minute circular opening 11b is formed in the resist layer 11 on the one surface side of the substrate 10 as shown in FIG. When isotropic etching is performed from the side, the resist layer 11 is also gradually etched, so that the cross-sectional shape changes as shown in FIG. 7B → FIG. 7C → FIG. 7D. That is, as shown in FIG. 7C, the curved surface 12 is formed with the size of the opening diameter of the resist layer 11 until the resist layer 11 disappears, but if etching is continued even after the resist layer 11 disappears, the etching is performed. Since it proceeds in the direction perpendicular to the one surface of the substrate 10, the curved surface 12 is etched so as to increase the radius of curvature as shown in FIG.

  Therefore, if isotropic etching is performed by forming a plurality of openings 11b adjacent to the resist layer 11, the curved surface 12 as shown by the solid line A in FIG. If the isotropic etching is further continued, the etching proceeds as shown by a broken line (etching progress surface) in FIG. 8A, and the plane portion remaining between the adjacent curved surfaces 12 is obtained. The area 12b gradually decreases (note that the arrow in FIG. 8 indicates the direction of progress of etching). Here, as shown by a solid line C, the boundary portion between the curved surface 12 and the flat surface portion 12b is maintained in an edged corner state and is not rounded. Therefore, as shown in FIG. 8B, even if the etching is continued from the state of the solid line A where the flat surface portion 12b has finally disappeared as shown in FIG. Since the boundary between the curved surface 12 and the curved surface 12 remains clean as shown by the solid line C in FIG. 8B, the outer peripheral shape when these curved surfaces 12 are viewed in plan is determined by the arrangement of the openings 11b. It will be decided.

  Here, in this embodiment, as described above, each cone 21 of the transfer mold 20 in which the plurality of cones 21 are two-dimensionally arranged is transferred to the resist layer 11. Since a bowl-shaped dent is formed in a portion corresponding to each cone 21, when dry etching is performed in the curved surface forming process, the substrate 10 starts to be exposed from the center of the dent in the resist layer 11. The pitch becomes the pitch of the openings, and becomes the final pitch of the microlenses 31. In addition, the arrangement of the cones 21 determines how the microlenses 31 are adjacent to each other. Thus, by changing the shape and arrangement of the cones 21 provided on the transfer mold 20, a microlens array mold for forming a microlens array in which various microlenses 31 are arranged without gaps can be easily manufactured. It becomes possible. In the present embodiment, the cross-sectional shape of the resist layer 11 is a shape in which triangles are arranged. Therefore, when isotropic dry etching is performed, the substrate 10 is exposed from a portion where the thickness of the resist layer 11 is thin, and the exposed portion is Since the substrate 10 is etched as a base point and the etching proceeds in all directions, a curved surface 12 having a circular cross section is formed.

  Here, in the curved surface forming step, the etching conditions for dry etching (for example, etching gas, etching gas flow rate, etching pressure, etching time, etc.) are appropriately set to increase the isotropic etching rate and increase the anisotropy. By doing so, the radius of curvature of the curved surface 12 can be controlled as shown in FIG. In the upper part of FIG. 9, the envelope surface at the tip of the vector arrow in which the etching rate in each etching direction is represented by the direction and length of the arrow is shown, and the sectional shape of the substrate 10 after etching is shown in the lower part. FIG. 9 shows that the curvature radius of the curved surface 12 is smaller as the degree of anisotropy is higher (stronger), and the radius of curvature of the curved surface 12 is larger as the degree of anisotropy is lower (weaker). Yes.

Here, when a silicon substrate is used as the substrate 10 as in this embodiment, for example, by using SF 6 gas as an etching gas, F radicals excited by plasma are mainly involved in etching, Since the reaction on the surface of the substrate 20 easily proceeds chemically, highly isotropic etching is possible. In addition, not only SF 6 gas is used as an etching gas, but also an O 2 gas, N 2 gas, Ar gas, etc. are mixed to add a physical etching effect by ions, thereby making the etching rate isotropic. It is possible to reduce the degree (that is, increase the degree of anisotropy). In addition, since the etching rate ratio (selection ratio) between the substrate 20 and the resist layer 11 varies depending on the type of resist material of the resist layer 11, the curvature radius of the curved surface 12 after etching can also be changed by changing the material of the resist layer 11. Can be changed. Even if the resist material is the same, the etching rate and the total etching amount are changed by changing the etching conditions, so that the curvature radius of the curved surface 12 can be similarly controlled. In the present embodiment, the silicon substrate 10 is used as the substrate 10. However, the substrate 10 is not limited to a silicon substrate, and for example, a glass substrate may be used. In the curved surface forming process, the substrate 10 is used. Etching conditions including an etching gas may be appropriately set depending on the material.

  Next, by performing an electroforming process for forming a microlens array mold 16 composed of a replica mold obtained by replicating the master using the substrate 20 on which each curved surface 12 is formed in the curved surface forming process as a master (mother mold), The microlens array mold 16 shown in FIG. 1 (i) is formed. Here, in the electroforming process, as shown in FIG. 1H, a nickel mold (hereinafter referred to as inversion) in which the master 20 is inverted by electroforming using the substrate 20 on which the curved surfaces 12 are formed as a master (mother mold). (Hereinafter referred to as a mold) 15, and then a nickel microlens array mold 16 is formed by electroforming using the reverse mold 15 as a mold.

  In the present embodiment, since the lens surface 31a of the microlens 31 is a convex curved surface as described above, a replica mold obtained by replicating the master using the substrate 20 on which each curved surface 12 is formed as a master is used as the microlens array mold 16. However, when the lens surface 31a of the microlens 31 is a concave curved surface, a mold obtained by inverting the substrate 20 on which each curved surface 12 is formed as a master may be used as a microlens array mold.

  According to the method for manufacturing the microlens array mold 16 of the present embodiment described above, the resist layer forming step of forming the resist layer 11 on the one surface side of the substrate 10, the portions corresponding to the plurality of microlenses 31. A transfer step of pressing the transfer mold 20 on which the cone 21 is formed to the resist layer 11 to transfer the shape of each cone 21 of the transfer mold 20 to the resist layer 11, from the one surface side of the substrate 10 A plurality of curved surfaces are formed on the substrate 10 by sequentially performing a curved surface forming step of forming a plurality of curved surfaces 12 corresponding to the lens surfaces 31 a of the respective microlenses 31 on the one surface side of the substrate 10 by dry etching the substrate 10. 12 can be formed in a lump, and the etching rate of the dry etching in the curved surface forming process can be set as appropriate. By increasing the isotropic property and increasing the anisotropy, the radius of curvature of the curved surface 12 can be controlled, and the design change of the curved surface shape can be easily handled. The microlens array mold 16 can be formed by using a substrate 10 on which the substrate 12 is formed as a master, a mold in which the master is inverted by an electroforming method, or a duplicate mold in which the master is duplicated. The metal mold 16 can be easily manufactured. Further, by using a wafer as the substrate 10, it becomes possible to easily produce a large-area microlens array mold, and it is also possible to produce a plurality of microlens array molds 16 at once. Become.

  FIG. 6 shows an example of a use example of the microlens array 30 formed by using the above-described microlens array mold 16, and a light receiving element composed of a plurality of infrared detection elements on one surface side of the base substrate 41. Reference numeral 42 denotes a sensor device including a sensor element 40 arranged in a two-dimensional array and a microlens array 30 that collects light on each light receiving element 42 of the sensor element 40. The light receiving element 42 is not limited to the infrared detecting element but may be a photodiode or the like.

  In the method for manufacturing the microlens array mold 16 of the present embodiment, pyramidal pyramids 21 are two-dimensionally arranged as the transfer mold 20 in the transfer step, and a flat portion is formed between adjacent cones 21. 10 is used, it is transferred to the resist layer 11 as shown in FIG. 10A. Therefore, in the curved surface forming step, the transfer gold is transferred to the resist layer 11 as shown in FIG. If dry etching is performed until there is no portion corresponding to each flat portion of the mold 20, the microlens array 30 having a high light collection efficiency is formed without a flat portion between the lens surfaces 31 a of the adjacent microlenses 31. Therefore, the microlens mold 16 can be easily manufactured. FIG. 10B shows the shapes of the resist layer 11 and the substrate 10 in the course of etching in the curved surface forming step. When the curved surface formed by etching gradually spreads and adjacent curved surfaces 12 come into contact with each other. The expansion of the curved surface 12 stops. Further, the upper part of FIGS. 10A and 10B is a plan view, and the lower part is an A-A ′ sectional view of the upper part.

  Further, in the transfer step, when a transfer die 20 is used in which conical cones 21 are two-dimensionally arranged and a flat portion is formed between adjacent cones 21, FIG. As shown in FIG. 11C, dry etching is performed until there is no portion corresponding to each flat portion of the transfer mold 20 in the curved surface forming step as shown in FIG. By doing so, it is possible to easily manufacture the microlens mold 16 for forming the microlens array 30 having no flat portion between the lens surfaces 31a of the adjacent microlenses 31 and having high light collection efficiency. It becomes. The view of FIG. 11 is the same as FIG.

  Further, in the transfer step, when a transfer die 20 is used in which the cone 21 has a pyramid shape and the cone 21 is two-dimensionally arranged without a gap, as shown in FIG. Since it is transferred to the resist layer 11, if dry etching is performed until at least the resist layer 11 disappears as shown in FIG. 12C in the curved surface forming step, the distance between the lens surfaces 31 a of the adjacent microlenses 31. It is possible to easily manufacture the microlens mold 16 for forming the microlens array 30 having no flat portion and high light collection efficiency, and more than the examples of FIGS. 10 and 11. The microlens mold 16 for forming the microlens array 30 having the microlenses 31 can be easily manufactured, and the sensor element 40 side microfabrication can be easily performed. It becomes possible to cope with. Further, there is an advantage that the planar size of the cone 21 of the transfer mold 21 is the same as the size of the outer periphery of the curved surface 12 in plan view. 12 is the same as FIG.

  In the present embodiment, a pyramid shape or a cone shape is exemplified as the shape of the cone 21, but a pyramid shape or a truncated cone shape may be used.

(Embodiment 2)
The manufacturing method of the microlens array mold of this embodiment is substantially the same as that of the first embodiment. In the transfer process, each cone 21 is formed at the tip of the rod-shaped body 22 as shown in FIG. The only difference is the use of things. That is, in the first embodiment, the transfer mold 20 is formed by a simple cutting process, whereas in the present embodiment, a plurality of rod-like bodies 22 are provided on a flat plate serving as a base of the transfer mold 20. It is set at a predetermined pitch. Moreover, in this embodiment, the thing of a round bar shape is used as each rod-shaped body 22, and each cone 21 is formed in the cone shape.

  Thus, according to the microlens array mold manufacturing method of the present embodiment, when the transfer mold 20 is manufactured, only the tip of each rod-like body 22 needs to be processed. It can be easily manufactured at low cost.

(Embodiment 3)
The manufacturing method of the microlens array mold of the present embodiment is substantially the same as that of the first embodiment, and each cone 21 is formed at the tip of the rod-shaped body 22 as shown in FIG. The only difference is the use of things. Here, in this embodiment, the rod-shaped body 22 is used as each rod-shaped body 22, and each cone 21 is formed in a pyramid shape.

  Thus, according to the microlens array mold manufacturing method of the present embodiment, when the transfer mold 20 is manufactured, only the tip of each rod-like body 22 needs to be processed. It can be easily manufactured at low cost. Note that when the rod-like bodies 22 are bundled and set on a flat plate as a base of the transfer mold 20 as in the present embodiment, the cross-section perpendicular to the longitudinal direction of the rod-like body 22 is not limited to a rectangular shape, Any cross-sectional shape that facilitates arrangement may be used, and it may be a circular shape or a hexagonal shape.

(Embodiment 4)
The manufacturing method of the microlens array mold of the present embodiment is substantially the same as that of the first embodiment, and in the transfer process, as the transfer mold 20 described in the first embodiment, the virtual unit 2 is an equilateral triangle. The only difference is that a cone 21 is formed in each part corresponding to each lattice point of the three-dimensional triangular lattice.

  Therefore, in the transfer step, the shape of the transfer mold 20 is transferred to the resist layer 11 as shown in FIG. 15A, so that in the curved surface forming step, adjacent curved surfaces as shown in FIG. If dry etching is performed until the boundary between the two surfaces becomes a straight line, the outer peripheral shape in the plan view is aligned with the hexagonal curved surface 12, so that the outer peripheral shape of the lens surface 31a in the plan view is a hexagonal shape. In addition, it is possible to easily manufacture the microlens mold 16 for forming the microlens array 30 having no flat portion between the lens surfaces 31a of the adjacent microlenses 31 and having high light collection efficiency. 15 is the same as FIG.

(Embodiment 5)
Incidentally, when the sensor device described in the first embodiment is used for an imaging apparatus such as a camera, a lens (imaging lens or the like) 50 is arranged in front of the microlens array 30 as shown in FIG. In consideration of the angle of incident light from 50 to the microlens array 30 and lens aberration, the light collection efficiency of each microlens 31 is higher when the radius of curvature is changed depending on the position of each microlens 31 in the microlens array 30. In some cases, the light collection efficiency of the microlens array 30 as a whole can be increased.

  Therefore, the manufacturing method of the microlens array mold of the present embodiment is substantially the same as that of the first embodiment, and in the transfer step, a plurality of transfer molds 20 having the same outer peripheral shape in plan view and different heights are used. The one in which the cone 21 is formed is used.

  Therefore, in the transfer step, the shape of the transfer mold 20 is transferred to the resist layer 11 as shown in FIG. 17A. Therefore, in the curved surface forming step, as shown in FIG. If dry etching is performed until the boundary between the adjacent curved surfaces 12 becomes a straight line, the curved surfaces 12 having a rectangular outer peripheral shape in a plan view are arranged without gaps. The view of FIG. 17 is the same as FIG.

  Therefore, according to the method for manufacturing the microlens array mold of the present embodiment, the timing at which the substrate 10 is exposed when dry etching is performed in the curved surface forming process causes a difference in the curved surfaces having different curvature radii. Therefore, it is possible to easily manufacture a microlens mold for forming a microlens array 30 including a plurality of microlenses 31 having different curvature radii. Become.

FIG. 6 is a cross-sectional view of main processes for explaining the method for manufacturing the microlens array mold of the first embodiment. It is principal process sectional drawing for demonstrating the manufacturing method of the metal mold | die for microlens arrays same as the above. It is a perspective view for demonstrating the manufacturing method of the metal mold | die for microlens arrays same as the above. It is a perspective view for demonstrating the manufacturing method of the metal mold | die for microlens arrays same as the above. It is a perspective view for demonstrating the manufacturing method of the metal mold | die for microlens arrays same as the above. It is a schematic sectional drawing of the usage example of the micro lens array manufactured by the manufacturing method of the metal mold | die for micro lens arrays same as the above. It is a perspective view for demonstrating the manufacturing method of the metal mold | die for microlens arrays same as the above. It is explanatory drawing of the manufacturing method of the metal mold | die for microlens arrays same as the above. It is explanatory drawing of the manufacturing method of the metal mold | die for microlens arrays same as the above. It is explanatory drawing of the manufacturing method of the metal mold | die for microlens arrays same as the above. It is explanatory drawing of the manufacturing method of the metal mold | die for microlens arrays same as the above. It is explanatory drawing of the manufacturing method of the metal mold | die for microlens arrays same as the above. 6 is a schematic perspective view of a transfer mold used in the method for manufacturing a microlens array mold of Embodiment 2. FIG. 6 is a schematic perspective view of a transfer mold used in the method for manufacturing a microlens array mold of Embodiment 3. FIG. FIG. 10 is an explanatory diagram of a method for manufacturing a microlens array mold according to a fourth embodiment. It is a schematic sectional drawing of the usage example of the micro lens array manufactured with the manufacturing method of the metal mold | die for micro lens arrays of Embodiment 5. It is explanatory drawing of the manufacturing method of the metal mold | die for microlens arrays same as the above.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Substrate 11 Resist layer 12 Curved surface 16 Micro lens array mold 20 Transfer mold 21 Cone 30 Micro lens array 31 Micro lens 31a Lens surface

Claims (6)

  1.   A resist layer forming process for forming a resist layer on one surface side of the substrate, and a transfer mold in which cones are formed at portions corresponding to the plurality of microlenses are pressed against the resist layer to form each cone of the transfer mold. A transfer step for transferring the shape of the body to the resist layer, and a plurality of surfaces corresponding to the respective lens surfaces of each microlens on the one surface side of the substrate by dry etching the substrate from the one surface side of the substrate after the transfer step A microlens array mold comprising a curved surface forming step for forming a curved surface of the substrate, a mold in which the substrate on which each curved surface is formed in the curved surface forming step is a master, and a master that is inverted by electroforming, or a replica that is a duplicate of the master An electroforming process for forming a microlens array mold manufacturing method.
  2.   In the transfer step, the transfer mold is a two-dimensional array of cones formed with flat portions between the adjacent cones. In the curved surface formation step, each flat surface of the resist layer is flattened. 2. The method of manufacturing a microlens array mold according to claim 1, wherein dry etching is performed until there is no portion corresponding to the portion.
  3.   2. The microlens array according to claim 1, wherein, in the transfer step, the transfer die is a pyramid having a pyramid shape and the cones are two-dimensionally arranged without a gap. Mold manufacturing method.
  4.   3. The microlens array mold according to claim 1, wherein each of the cones is formed at a tip of a rod-shaped body as the transfer mold in the transfer step. Production method.
  5.   In the transfer step, as the transfer mold, a unit in which the cone is formed in each portion corresponding to each lattice point of a virtual two-dimensional triangular lattice having a regular triangle is used. The manufacturing method of the metal mold | die for micro lens arrays of Claim 1 or Claim 2 or Claim 4.
  6.   5. The transfer step, wherein the transfer mold is formed with a plurality of cones having the same outer peripheral shape in plan view and different heights. Or the manufacturing method of the metal mold | die for microlens arrays of Claim 5.
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