JP5009393B2 - Package for microwave processing - Google Patents

Description

The present invention, by irradiating microwaves, for the desired cut can form luma microwave treatment package to the deposition film of the package.

Conventionally, as a technique for sticking a label provided with a conductor to an enveloping film of a microwave processing packaging body and making it easier to open the encapsulating film using induction heating by microwave irradiation, A package described in Japanese Patent No. 281 is known. This publication discloses a microwave processing package in which an opening label provided with a layer that generates heat by microwaves is provided on the back surface of a label substrate, and is attached to the surface of an encapsulating film via an adhesive. Such a package is exposed to microwaves, the heat generation layer generates heat, and a part of the encapsulated film corresponding to the heat generation deteriorates, and then the opening label is peeled off. The encapsulated film can be opened from the starting point.
Further, a technique described in Japanese Patent Publication No. 6-67341 is known as a technique for forming a steaming opening in a container lid by heating a conductor by microwave irradiation. This publication discloses a sealed container for cooking a microwave oven in which a cover film of a container containing food is provided with an antenna made of a conductor and a heating element made of a high resistance at the end of the antenna. When the sealed container is exposed to microwaves, the heating element generates heat, and a part of the corresponding lid film is melted by heat, so that water vapor generated during microwave irradiation can be released to the outside.

However, since the packaging body of the actual fair No. 8-281 is covered with a label at a portion that has been thermally deteriorated by microwave irradiation, the change in the encapsulating film is not known from the outside. Some users (those who perform microwave processing) do not notice that they can be used in the past, so the enveloping film may be opened without using the opening label. In addition, since the label is attached so as to cover the part that can be thermally deteriorated, when the package is hermetically packaged with the encapsulated film, the water vapor generated from the contents during microwave irradiation is released to the outside. It is difficult to use for steaming purposes.
On the other hand, in Japanese Patent Publication No. 6-67341, at the time of microwave irradiation, a small hole is opened in the cover material and vapor can escape, but nothing is disclosed regarding opening of the encapsulated film after microwave irradiation, In addition, since there are many kinds of shapes and materials depending on the shape of the container, the contents of the container, etc., the two types of the antenna and the heating element must be provided in accordance with these kinds of lids. There must be. In addition, this publication discloses an example in which only an antenna is provided, in which the ends of an antenna having a planar view line are opposed to each other. However, such means can not only open a very small hole at the time of microwave irradiation, and not only can the lid be opened from this part, but also, for example, when the vapor is ejected, the solid container has a small hole from the inside. There is a risk of sticking to this, and it is not sufficient as a means for forming a hole for steaming.

Japanese Utility Model Publication No. 8-281 Japanese Patent Publication No. 6-67341

Accordingly, the present invention is, by microwave irradiation, it is possible to inexpensively form a cut for a desired opening to an adherend film, a microwave treatment capable of easily opening the deposition film as a starting point It is an object to provide a package.

The present invention is a microwave processing package in which a film to be deposited is packaged in a container in a hermetically sealed manner, and a label substrate on which a conductor layer is laminated, and a label provided on the back surface of the label substrate. An adhesive layer, and a breakable label in which a slit portion is formed in the conductor layer within a range in which the adhesive layer is provided , the adhesive film on one surface of the adhesive film, Provided is a microwave processing package which is attached corresponding to a gap existing between containers, and in which a cut is formed in the adherent film along a slit portion of the breakable label at the time of microwave irradiation. .

Such a breakable label is used by being attached to an adherent film of a microwave treatment packaging body, and by exposing the obtained packaging body to microwaves, a cut along the shape of the slit portion is formed on the adherent film. It is formed. This is because, when exposed to microwaves, eddy currents are generated throughout the conductor layer, and the generated current is caused by the edge runaway phenomenon in the slit portion of the conductor layer (the portion where the side end surfaces of the conductor layer face each other). Collected to cause sparks, and this spark acts on the adherent film through the slit part, and the adherent film forms a cut having substantially the same shape as the slit part, or the current near the slit part generates heat to a high temperature. By doing so, it is inferred that the deposited film melts. Therefore, by forming the slit portion relatively large, a large hole portion that is not blocked by the solid container can be formed in a portion of the film to be deposited during microwave irradiation. Therefore, the vapor generated in the deposited film can be surely escaped to the outside.
In the microwave processing package, a cut having a shape along the slit portion is formed in the adherent film by the action of the breaking label during microwave irradiation, so that the cut and the opening are surely performed by the cut. be able to.
In addition, by forming the slit portion in a desired shape, it is possible to form a break for opening which is excellent in the convenience of opening in the deposited film.

In a preferred embodiment of the present invention, there is provided a microwave processing package which the slits are formed by cutting in the thickness direction over the entire layer of label.

In the microwave processing package according to the present invention, since the breaking label is attached to the adherent film, a cut along the shape of the slit portion can be formed in the adherent film by microwave irradiation. . Therefore, if the slit portion of the breakable label is formed in a desired shape, a microwave treatment packaging body that can form not only steaming but also, for example, an opening break that is easily noticeable and excellent in opening convenience can be formed on the coated film. It can be manufactured at low cost.

The perspective view which shows the package for microwave processing of 1st Embodiment. FIG. 2 is a partially omitted perspective view including a cross-sectional view taken along line AA in FIG. 1. (A)-(m) is a top view of the label in which various slit parts were formed. The top view which shows other embodiment of a label base material. (A) is a principal part expansion perspective view which shows the state by which the cut | interruption was formed in the package, (b) is a partially abbreviated sectional view in the BB line of (a). (A) is a perspective view which shows the package for microwave processing of 2nd Embodiment, (b) is a perspective view which shows the state which stood up the bag piece part of the package. 6, 7, and 10, hatching indicates a heat welded portion. (A) is a perspective view showing a state in which the package is stored in the package, (b) is a partially omitted sectional view taken along the line CC, and (c) is a microwave diagram of the package. Partially omitted sectional view showing a state when irradiated. (A) is a partially-omission perspective view including the cross section which shows the state by which the cut was formed in the package of other embodiment, (b) is a top view which shows other embodiment of a label. (A), (b) is sectional drawing which shows other embodiment of a package. The perspective view which shows other embodiment of a package body.

Hereinafter, the present invention will be specifically described with reference to the drawings.
<First Embodiment>
1 and 2, reference numeral 1 denotes an enveloping film 3 (corresponding to an adherent film) around a container 2 in which a container to be heated by microwaves such as a microwave oven cooked food is stored. A microwave processing package comprising: a package 4 formed by hermetically wrapping; and a breaking label 5 attached to a part of the surface of the encapsulating film 3 of the package 4 is shown.
A lid member 2a made of, for example, a resin molded product is fitted in the upper surface opening of the container 2 in order to wrap a container such as food, and a part of the lid member 2a is recessed inside. A concave portion is formed.

The breakable label 5 is a back surface (conductor layer 7) of a label base material comprising a base material 6 composed of two layers of a decorative film 61 and a base film 62, and a conductor layer 7 laminated on the back surface of the base material 6. The adhesive layer 8 made of an adhesive is provided on the back surface) except for the peeling tab 10 for peeling at one side end. Further, the breakable label 5 has a slit portion 9 extending from the uppermost decorative film 61 to the back surface of the lowermost adhesive layer 8. The slit portion 9 is formed by cutting the label 5 with a cutter or the like over the entire layer in the thickness direction.
The planar shape of the slit portion 9 is not particularly limited. For example, as shown in FIGS. 3A to 3D, a single straight line or a non-straight line such as a linear shape, a substantially V shape, or a substantially U shape. A shape consisting of a plurality of straight lines or non-linear intersections, such as a substantially X shape, a substantially cross shape, and two generally U-shapes that face each other, as shown in FIGS. As shown in FIGS. (H) to (j), a shape in which a plurality of non-straight lines such as straight lines and substantially V shapes are arranged in parallel, and a plurality of non-linear shapes such as straight lines and substantially V shapes are non-parallel (for example, The shape arranged in the opposite direction, as shown in the same figure (k) and (l), a shape composed of endless lines such as a substantially circular shape (including an ellipse), a substantially rectangular shape, a substantially triangular shape, etc. As shown in (m), the shape etc. which combined these each line suitably are illustrated.

As will be described later, since the planar shape of the slit portion 9 is substantially the same as the cut formed in the encapsulating film 3 by microwave irradiation, the preferable shape of the slit portion 9 is formed in the encapsulating film 3. The desired shape is determined in consideration of the desired shape. For example, when it is desired to form a cut mainly for the purpose of steaming by microwave irradiation, any of the examples in the figure may be used. In addition, when aiming only at vaporization, it is preferable to form the slit part 9 in the length of about 3 mm or more, for example, so that the cut is not blocked by the contained solid matter.
Moreover, when it is desired to form a relatively large hole in the encapsulating film 3 by microwave irradiation to form an opening start point, for example, FIGS. 3 (c) to 3 (i), (k) to ( m) or the like, the slit portion 9 having a shape as shown in FIG. 5 may be formed. In addition, when it is desired to form an opening tab on the enveloping film 3, for example, (c) to (i), What is necessary is just to form the slit part 9 which consists of shapes as shown to (m). Among these, a substantially X shape or a substantially cross shape is preferable from the viewpoint that an opening cut can be suitably used when opening. Moreover, since the slit part 9 shown to the same figure (k)-(m) has an endless part, when sticking the label 5, the area | region enclosed by the endless slit part 9 isolate | separated and is one. Since it cannot sometimes stick, it is preferable to form the end-shaped slit part 9 as shown to the same figure (a)-(j). Note that the length of the slit portion 9 for the purpose of opening is appropriately designed in consideration of the cuts to be formed.
Furthermore, as shown in FIG. 2, the gap W (the gap between the side end faces 7a and 7a of the conductor layer 7) of the slit portion 9 is 1.0 mm or less, preferably 0.5 mm or less, more preferably 0.2 mm or less. The side end surfaces 7a and 7a may be substantially in contact with each other (the slit portion 9 is substantially free of gaps).

Next, the substrate 6 is not particularly limited, and a synthetic resin film, synthetic paper, paper, a laminate of different materials, or the like can be used. The decorative film 61 is provided with a design printing layer (not shown) on which a product name, a trademark, an instruction for use, a picture, and the like are printed.
The conductor layer 7 is a layer containing a conductive substance such as a metal such as aluminum, nickel, or chromium, an alloy, or a metal oxide, for example, metal deposition, printing with ink containing a conductive substance, The substrate 6 is laminated by thermal spraying, adhesion of a metal foil or a conductive film, or the like. Among these, it is preferable to use a vapor deposition layer as the conductor layer 7 because a large spark hardly occurs and does not surprise the user. In the case of metal deposition, the thickness of the conductor layer 7 is about 0.005 to 0.1 μm, preferably 0.015 μm or more, more preferably 0.04 μm or more, and preferably 0.08 μm or less. . For example, in the case of aluminum vapor deposition, the thickness is 0.01 to 0.08 μm, preferably 0.04 to 0.06 μm. Moreover, in the case of metal foil, although it changes with the electrical resistances of the metal, thickness is about 1-30 micrometers, for example, when apply | coating a conductive substance containing ink, thickness about 1-20 micrometers is illustrated. When a metal foil (for example, an aluminum foil having a thickness of 5 to 15 μm) is used, fine unevenness, preferably convexity with a sharp tip, is formed on the cut surface of the slit portion 9 (side end surface 7a of the conductor layer 7). If a fine unevenness having a portion (for example, a saw blade shape) is formed, a spark is easily generated, which is a preferable mode. The conductor layer 7 is preferably laminated on the entire surface of the substrate 6 because it can be easily provided on the substrate 6 by metal vapor deposition, adhesion of a metal foil, solid printing of conductive ink, or the like. However, the present invention is not necessarily limited to the case of being laminated on the entire surface of the substrate 6, and may be partially provided on a part of the substrate 6. In addition, the magnitude | size of the conductor layer 7 is suitably designed by the structure of the container to be microwave-processed, and the envelope film 3.

The planar shape of the label substrate 6 is not particularly limited. For example, in addition to a rectangle as shown in FIG. 2 or the like, a substantially bow-tie shape (a shape in which two trapezoidal upper bases are abutted) as shown in FIG. Although not shown, it can be formed in a circular shape, an elliptical shape, a triangular shape, or other shapes.
Further, in order to surely form a cut along the shape of the slit portion 9 at the time of microwave irradiation, the conductor layer 7 (the label base material 6 when the conductor layer 7 is laminated on the entire surface) is A certain area is considered necessary. As will be described later, the reason why the cut is formed by the microwave irradiation is considered to be that the current generated in the conductor layer 7 gathers in the slit portion 9 of the conductor layer 7a and causes a spark or the like. If the conductor layer 7 that receives a wave and generates a current is narrow, the current is not sufficiently generated, or the current flows only in a part of the slit part 9 to form a large cut along the shape of the slit part 9 It will be difficult to do. In consideration of such a viewpoint and the configuration of the encapsulating film 3, the size of the conductor layer 7 may be appropriately designed.

By attaching the breakable label 5 to the upper surface of the encapsulating film 3 of the package 4 packaged in a hermetically sealed manner with the encapsulating film 3 via an adhesive layer 8, packaging for microwave processing is performed. The body 1 can be obtained.
Normally, the breaking label 5 is provided in a state of being attached to a release paper, but its form is not particularly shown.
The location to be attached to the encapsulating film 3 is not particularly limited, but when the breakable label 5 is adhered to the portion where the encapsulating film 3 and the container 2 are in close contact, the material of the container 2 (including the lid material) Depending on the thickness, there is a possibility that a break may occur up to the container 2. Therefore, preferably, as shown in FIG. 2, in a portion having a gap 11 between the encapsulating film 3 and the container 2 (for example, the concave portion of the lid member 2 a). It is preferable to attach the breakable label 5.
In addition, the encapsulating film 3 is a film that can be melted by heat and is not particularly limited as long as it is suitable for packaging, and may be a heat-shrinkable film (shrink film). A stretch film (self-stretchable film) may be used, and the properties thereof are not limited.

When the microwave processing package 1 is put in a microwave oven or the like and exposed to microwaves, the envelope film 3 has substantially the same shape as the slit portion 9 (substantially X-shaped) as shown in FIG. An opening cut 12 is formed. This is because the electric current generated in the conductor layer 7 gathers at the opposing portions (slit portions 9) of the side end faces 7a, 7a of the conductor layer 7 to generate sparks, etc., which are passed through the slit portions 9 of the adhesive layer 8. It is considered that the film 3 is heated and melted by acting on the encapsulating film 3 so that the encapsulating film 3 has a cut 12 having substantially the same shape as the slit portion 9.
And when the cut 12 concerning the encapsulating film 3 is formed, for example, a relatively large hole portion 14 is formed in the encapsulating film 3 due to heat shrinkage of the encapsulating film 3, so that the user can easily understand it. Using the hole 14 as an opening start point, the encapsulating film 3 can be easily opened. In this way, the opening cut 12 is formed along the shape of the slit portion 9, so that the shape of the slit portion 9 is formed into a shape that can form a knob (such as a substantially X-shaped plane). In this case, as the shape is transferred, a part of the encapsulating film 3 is cut out, so that the encapsulating film 3 can be torn and opened.
For example, the slit portion 9 is formed so as to open the enveloping film 3 while picking the peeling tab 10 for peeling off the label 5 and peeling the label 5 or to form the opening tab 15 as shown in the figure. In the case where it is formed, the enveloping film 3 can be easily opened by picking the knob 15.

According to the present invention, it is assumed that a preferable cut 12 is desired to be formed, and by attaching the breakable label 5 formed with the slit portion 9 having substantially the same shape as this to the encapsulating film 3, the intended opening The cut 12 can be reliably formed. Moreover, since the cut | interruption 12 is formed after microwave irradiation only by sticking the breakable label 5 on the enveloping film 3 etc., for example, a lot of the breakable labels 5 are prepared, and a known package is used with a labeler or the like. By attaching to an appropriate location of the encapsulating film 3, a package for microwave processing that can be easily opened by microwave irradiation can be obtained at a low cost and in a large amount.
Further, in the case where the package 1 is formed by covering the contents with the enveloping film 3 in a hermetically sealed manner, a large amount of steam is surely released to the outside through the cuts 12 along the slit portion 9, and the internal pressure is reduced. The rise can be prevented.
Further, according to the present invention, even if the encapsulating film 3 is formed by laminating a material having relatively high heat resistance such as polyester or polyamide, or the encapsulating film 3 having a film thickness of about 100 μm, for example, 12 can be formed.

  Further, since the label base material having the conductor layer 7 laminated on the entire surface is used, it is not necessary to individually provide a predetermined shape of the conductor layer as in the conventional means for providing an antenna. If the label base material on which 7 is laminated is cut in the thickness direction, the slit portion 9 having a desired shape can be easily formed, so that the label 5 can be easily manufactured.

Second Embodiment
2nd Embodiment is related with the package for microwave processing by which the label for a fracture | rupture is affixed on the bag piece part. Hereinafter, parts different from those of the above-described embodiments will be mainly described. For the same configuration, terms and drawing numbers are used, and description thereof is omitted.

In FIG. 6, the microwave processing package 1 according to the present embodiment includes a main body portion 22 in which a housing portion 21 capable of hermetically housing a container is formed, and a film extending from a part of the main body portion 22. A flat bag piece 24 formed of a piece and having a space portion 23 communicating with the housing portion 21, and the breaking label 5 is attached to one surface 24 a of the bag piece 24. Become.
Specifically, for example, the main body portion 22 can heat and seal the peripheral portions of the overlapped front and back films 25 and 26 (corresponding to a film to be deposited), thereby hermetically containing a container such as food. It consists of a packaging bag in which a housing part is formed. The front and back films 25 and 26 are heat-meltable films that are generally used as microwave heating packaging bags. For example, a base film having a gas barrier property (single or multi-layer film) ), And a film in which a sealant film is laminated.

The bag piece portion 24 is formed with a projecting piece made of a film folded back at the upper edge by drawing out the entire length of the front film 25 in the longitudinal direction, and the sealing property of the housing portion 21 of the main body portion 22 is improved. In order to ensure, it consists of the flat bag made from a film formed by heat-welding the both-sides edge part of a protrusion piece so that the peripheral part of the main-body part 22 may be followed. A space portion 23 communicating with the accommodating portion 21 of the main body portion 22 is formed inside the bag piece portion 24 with the three side edges (upper edge and both side edges) closed. In addition, as shown in the drawing, both side edges of the bag piece 24 are thermally welded and sealed in an arc shape in which the inner edge of the weld swells outward, so that the space 23 of the bag piece 24 is outward. It is formed in an arc shape that swells.
Further, the bag piece portion 24 made of a flexible film can be inverted with respect to the main body portion 22, but in a normal state (a state before microwave irradiation), as shown in FIG. 24 is bent at the connecting portion 27 with the main body portion 22 and tilted to the main body portion 22 side. Therefore, the one surface 24 a of the bag piece 24 is overlapped so as to be in contact with the surface of the front film 25 of the main body 22.
The breakable label 5 via the adhesive layer 8 so that the slit portion 9 of the breakable label 5 corresponds to (overlaps) the region where the space portion 23 is formed in the one surface 24a of the bag piece portion 24. Is attached.

  As shown in FIGS. 7A and 7B, the microwave processing package 1 is used in a state in which an accommodation for microwave heating such as food is accommodated in the accommodation portion 21. When the package 1 is put in a microwave oven or the like and exposed to microwaves, the microwaves do not sufficiently act on the breaking label 5 sandwiched between the main body 22 and the bag piece 24. The break 12 does not occur at an early stage. On the other hand, when the vapor is generated from the accommodation by the microwave irradiation, and the internal pressure of the accommodating portion 21 is increased by the vapor, the vapor flows into the space portion 23 of the bag piece portion 24 through the communication path 28, and a predetermined time has elapsed. Then, the space part 23 expand | swells and the bag piece part 24 stands up (the figure (c)). When the bag piece portion 24 stands up, microwaves sufficiently act on the breaking label 5, the slit portion 9 generates heat, and a cut 12 is generated at a location corresponding to the space portion 23 of the bag piece portion 24. Since the steam surely comes out from the cut 12, the package 1 can be prevented from rupturing.

According to the present embodiment, since the bag piece portion 24 stands up with the increase in internal pressure and the breaking label 5 is separated from the main body portion 22, the microwave acts on the breaking label 5. For a certain period, the internal pressure of the accommodating portion can be maintained high. Therefore, it is particularly suitable as the packaging body 1 for packaging foods that are expected to improve flavor due to the steaming effect.
In the present embodiment, the bag piece portion 24 is not limited to the one provided in the central portion of the front film 25, and may be provided in other portions.

<Other embodiments>
In addition, the present invention is not limited to the above-described embodiments, and appropriate configurations can be added, substituted, combined, and changed in design within the range intended by the present invention. Hereinafter, parts different from those of the above-described embodiments will be mainly described. For the same configuration, terms and drawing numbers are used, and description thereof is omitted.
(About breakable labels)
In each said embodiment, although the base material 6 consists of a 2 layer film, a single layer may be sufficient and a laminated film of 3 layers or more may be sufficient. Further, a synthetic resin film or the like may be interposed between the conductor layer 7 and the adhesive layer 8.
Moreover, the slit part 9 is not restricted to the case where it forms over the thickness direction whole layer of the label 5, The slit part 9 may be formed over the adhesive agent layer 8 from the conductor layer 7, or The slit portion 9 may be formed only in the conductor layer 7. In short, it is sufficient that at least the slit portion 9 is formed in the conductor layer 7. In addition, as described above, the slit portion 9 is preferably formed by cutting with a cutter or the like as described above. However, the method of forming the slit portion 9 is not limited to this. For example, the slit portion 9 may be formed of an ink containing a conductive material. You may form by the method of printing the conductor layer 7, etc., ensuring the part 9 (gap in the side end surfaces 7a and 7a of the adjacent conductor layer 7).
The adhesive layer 8 is preferably a pressure-sensitive adhesive, but can also be composed of an adhesive such as a heat-sensitive adhesive. Moreover, the peeling allowance 10 for peeling does not need to be provided.

  Moreover, if the base material 6 is composed of a heat-shrinkable film, the opening tab 15 cut out by the cut 12 at the time of microwave irradiation protrudes outward as shown in FIG. 8 (a). This is preferable. In this case, the base material 6 has a larger thermal shrinkage than the film to be coated such as the encapsulating film 3 (when the film to be coated is substantially non-shrinkable, the base material 6 is slightly heat-shrinked). In the case where the substrate 6 is composed of a plurality of layers, the uppermost layer (outermost layer) film having a larger thermal shrinkage than the deposited film may be used (the entire layer of the substrate 6 is heated). If it has shrinkability, use the one whose top layer heat shrinks the most). Further, in order to make the opening knob 15 protrude greatly, a virtual line connecting both end portions 9a, 9a of the slit 9 having a shape capable of forming the knob is substantially orthogonal to the heat shrinkage direction X of the substrate 6. It is preferable to arrange so as to.

(About the package)
In the first embodiment, the microwave processing package 1 is configured by sticking the breakable label 5 to the package 4 formed by sealing the container 2 with the encapsulating film 3 in a sealed manner. However, the breaking label 5 may be attached to the package 4 that is not packaged in a sealed manner by the encapsulating film 3. Also, for example, as shown in FIG. 9A, by attaching the breakable label 5 to a lid film 3 ′ (corresponding to an adherent film) that covers the opening of the container 2 in a sealing manner, You may comprise the package 1 for microwave processing. In the package 1, the opening cut 12 is formed on the label 5 attachment portion of the lid film 3 ′, as described above, so that the lid film 3 ′ can be easily opened, and the cut is generated from the contents. It also functions as a steam passage opening to release steam. Furthermore, as shown in FIG. 9 (b), when the periphery of the container 2 provided with the sealed lid film 3 ′ is further packaged with the envelope film 3, the lid film 3 ′ and the envelope film 3 ′ are covered. You may stick the label 5 for a fracture | rupture to both the wrapping films 3. FIG. In this way, the label 5 for breakage is appropriately attached to the film to be packaged (for example, the film that needs to be opened after the microwave irradiation, such as the film 3 or the lid film 3 '). Thus, the microwave processing package 1 of the present invention can be configured, and the specific structure of the package is not limited.
Note that the breaking label 5 is not limited to being attached to the surface of the encapsulating film 3, and may be attached to the back surface of the encapsulating film 3.

  Further, the package 4 is not limited to the one constituted by the container 2 and the lid material. For example, as shown in FIG. 10, the package 4 formed in a bag shape with flexible front and back films 25 and 26 ( The package 1 for microwave processing comprised by sticking the label 5 for a fracture | rupture on one surface of what is called a pouch) may be sufficient.

Example 1
Polyolefin synthetic paper (trade name: YUPO) with a thickness of 60 μm is used as the base material, and an aluminum vapor-deposited film (polyethylene terephthalate film 25 μm + aluminum vapor-deposited 0.04 μm) is dry laminated to create a label base material, which is an acrylic adhesive. It laminated | stacked with the release paper through the agent. The label for break according to the present invention was obtained by cutting from the base material side of the label to the adhesive with a cutter knife to form a substantially X-shaped slit portion shown in FIG. The length and width of the label was 20 mm × 30 mm, the length of one slit part was 20 mm, and the width of the slit part was about 0 to 0.1 mm. Next, a synthetic resin molded container (commercially available lunch box) containing food is placed in a gas barrier encapsulating film (trade name: Eco Wrap G (thickness 22 μm, nylon 8 μm + EVOH 2 μm + linear low density polyethylene 12 μm), Japan Eco Wrap Co., Ltd. The above-mentioned breakage label was attached to the surface of the encapsulated film of the package packaged in a hermetically sealed manner by a company, and heated in a 500 W microwave oven. As a result, the enveloping film had a cut having the same shape as the slit portion, and the encapsulating film could be easily opened by picking that portion.

Example 2
The same label substrate as that used in Example 1 was cut into the shape shown in FIG. As shown in FIG. 4, D was 15 mm, E was 17.5 mm, and F was 10 mm. Moreover, the slit part cut | disconnected the label base material with the cutter knife similarly to Example 1, and formed it in length 5mm. This product was attached to a substantially central part of a lid film of a commercially available cup soup for cooking in a microwave oven (for example, product name: vegetable soup manufactured by Kagome Co., Ltd.) and heated in a 500 W microwave oven for a predetermined time. During the heating, steam spouted out of the container, and the lid film did not expand greatly. When the lid film after heating was viewed, a cut having the same length as the slit portion was found.

  DESCRIPTION OF SYMBOLS 1 ... Microwave processing packaging body, 2 ... Container, 3 ... Covering film, 3 '... Cover film, 4 ... Packaging body, 5 ... Breaking label, 6 ... Base material, 61 ... Decoration film, 62 ... Base material Film, 7 ... Conductor layer, 8 ... Adhesive layer, 9 ... Slit part, 10 ... Peeling allowance for peeling, 12 ... Cut for opening, 14 ... Hole part, 15 ... Picking piece for opening, W ... Gap in slit part Width, 21 ... accommodating part, 22 ... body part, 23 ... space part, 24 ... bag piece part, 24a ... one side of bag piece part, 25, 26 ... front and back films, 27 ... connecting part, 28 ... communication path

Claims (2)

A package for microwave treatment in which an adherent film is packaged in a sealed manner in a container ,
It has a label base material on which a conductor layer is laminated, and an adhesive layer provided on the back surface of the label base material, and within the range where the adhesive agent layer is provided, a slit portion in the conductor layer Is formed on one surface of the adherent film so as to correspond to a gap existing between the adherent film and the container. A package for microwave processing, wherein a cut is formed along the slit portion of the breaking label. The package for microwave processing according to claim 1, wherein the slit portion is formed by cutting in the thickness direction over the entire layer of the label .

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