JP4988447B2 - Peeling apparatus and peeling method - Google Patents

Description

  The present invention relates to a peeling apparatus and a peeling method, and in particular, when grinding a semiconductor wafer to an extremely thin thickness, a peeling apparatus suitable for peeling a glass plate attached to ensure smoothness of the semiconductor wafer and The present invention relates to a peeling method.

  A semiconductor wafer (hereinafter simply referred to as “wafer”) is bonded to a rigid plate-like body such as a glass plate, for example, when processing such as back surface grinding, and uses the smoothness of the wafer. Is being ground to the limit. This glass plate is not necessary in, for example, a dicing step other than the grinding step, and after the grinding treatment, the glass plate is peeled off for reuse.

  The above-described peeling between the wafer and the glass plate can be performed using, for example, the processing apparatus described in Patent Document 1. The processing apparatus is provided with a peeling device, and a configuration is adopted in which the glass plate is peeled off from the wafer by the peeling device and transferred to a ring frame.

JP 2006-156633 A

  In the peeling apparatus disclosed in Patent Document 1, a processing object in which a glass plate is bonded to a wafer via an adhesive sheet is fixed to a table, and the interface outer periphery side between the glass plate and the adhesive sheet is fixed. The wafer and the glass plate are peeled off after the peeling trigger portion is formed using the peeling trigger portion forming means that can be accessed from the same plane.

  However, when a peeling trigger part is formed at the interface between the wafer and the glass plate, it is essential to adjust the horizontal height position between the peeling trigger part forming means and the interface, and a highly accurate apparatus and control means are required. There is a problem that.

[Object of invention]
The present invention has been devised by paying attention to such a problem, and the purpose thereof is not to strictly adjust the height position adjustment when the processing object consisting of the first and second members is supported. Another object of the present invention is to provide a peeling apparatus and a peeling method capable of easily peeling the first and second members.

In order to achieve the above-mentioned object, the present invention crosses the processing object in the surface direction, the supporting means for supporting the processing object in which the first member and the second member are bonded via an adhesive sheet. And a vibration applying means including a shaft-like member that is provided movably along the processing object and applies vibration to the processing object, and a peeling force applying means that applies a peeling force to the outer surface of the processing object. It has the structure of preparing.

In the present invention, the peeling force applying means applies the peeling force in a direction in which the first member and the second member are separated from each other in synchronism with the movement of the shaft-like member in the vibration applying direction. It may be configured as follows.

  Furthermore, the vibration applying means can be provided so as to apply vibration to the processing object in a contact or non-contact state.

Further, the present invention crosses in the surface direction of the processing object and vibrates in a state where the processing object to which the first member and the second member are bonded via the adhesive sheet is supported by the support means. A vibration is applied by moving the shaft- shaped member to be applied along the object to be processed, and the first state in the direction in which the outer surface of the first and second members is separated by releasing the adhesion state by the adhesive sheet by the vibration . And the method of giving peeling force to the outer surface of a 2nd member and peeling is taken.

Since this invention was set as the structure which provides a vibration to the process target object which consists of a 1st member and a 2nd member, the adhesive sheet interposed between the 1st and 2nd member vibrates, and the interface is It is peeled off. Therefore, in a state where vibration is applied to the entire region of the processing object, the adhesiveness between the members is released, and the first and second members can be peeled off.
Further, according to the present invention, it is not necessary to use a peeling trigger portion forming means for accessing the end surface of the processing object from the outside as in the prior art, so that the height position of the processing object is performed with high accuracy. Therefore, the structure of the peeling apparatus can be simplified.
Further, by providing a peeling force applying means for separating the first member and the second member from each other, the peeling operation can be automatically performed, and the vibration applying means is moved along the processing object. It is possible to perform peeling that synchronizes vibration application and peeling operation.
Furthermore, by adopting a configuration in which the shaft-shaped member is subjected to vibration in a contact or non-contact state with respect to the object to be processed, it is possible to select a vibration application mode according to the material of the first and second members. it can.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1A shows a schematic front view of a peeling apparatus according to this embodiment. In this figure, the peeling apparatus 10 includes a table 11 as a supporting means for supporting the processing object D, and a vibration applying means 12 and a peeling force applying means 13 located on the upper surface side of the processing object D. ing.

  The processing object D has a plate shape with a substantially circular planar shape, and includes a wafer W as a first member and a glass plate P as a second member bonded to the wafer W via an adhesive sheet S. Has been. Here, as shown in FIG. 1B, the adhesive sheet S has an ultraviolet curable adhesive layer A1 on one surface (upper surface) of the base sheet BS, and is re-applied on the other surface (lower surface). A three-layer structure having a peelable adhesive layer A2 is used, and the ultraviolet contact curable adhesive layer A1 is adhered to the glass plate P and the most peelable adhesive layer A2 is adhered to the wafer W. ing.

  The table 11 has a large number of suction holes (not shown) on the upper surface side, and the processing object D is sucked and held through the suction holes.

  The vibration applying means 12 includes a shaft-like member 15, and the shaft-like member 15 is in the left-right direction, that is, in the state where the treatment object D is in contact with the upper surface of the treatment object D via a moving device (not shown). 1 is provided so as to be movable in the direction of arrow c while rotating in the direction of arrow d in FIG. The shaft-like member 15 in the present embodiment is configured to incorporate oscillation means, and the shaft-like member 15 itself vibrates at high speed as a whole and is attached to the adhesive sheet S via the glass plate P. It is designed to transmit vibration. Here, a vibrator such as an ultrasonic vibrator or a vibrator using a motor can be used as the vibrator, and the vibration frequency can be appropriately determined according to the characteristics of the adhesive sheet S. Further, the shaft-like member 15 is provided so as to be longer than the processing object D in a direction orthogonal to the traveling direction of the shaft-like member 15. Vibration can be equally applied to the entire interface between the plate P and the adhesive layer A1.

  The peeling force applying means 13 includes a suction pad 17, a vacuum pipe 18 communicating with the suction pad, a displacement means (not shown) for operating the vacuum pipe 18 in a predetermined manner, and a suction (not shown) formed on the upper surface of the table 11. And an adsorption mechanism including holes. The suction pad 17 is provided so as to be movable in the vertical direction as indicated by an arrow a in FIG. 1, and the glass plate P is separated from the wafer W in the direction of the arrow b, as shown in FIG. It is comprised so that it can displace in the direction to make.

  Next, the peeling method by the peeling apparatus 10 in this embodiment is demonstrated.

  First, the processing object D is irradiated with ultraviolet rays from the glass plate P side before being supported by the table 11, and the ultraviolet curable adhesive layer A1 is cured and the adhesive force is almost lost. It shall be.

  Next, the processing object D is held via a transfer arm (not shown), and the processing object D is transferred onto the table 11 with the wafer W positioned on the lower surface side. The processing object D is adsorbed.

  The shaft-like member 15 constituting the vibration applying means 12 is located at the end position (see FIG. 1A) where the wafer W and the glass plate P are initially peeled, and in the direction of the arrow d in FIG. While rotating, it moves in the direction of arrow c to apply vibration to the entire surface of the processing object D. This vibration applying operation acts to peel off the interface between the adhesive layer A1 and the glass plate P. At this time, since the adhesive force of the adhesive layer A1 has almost disappeared, the interface with the once peeled glass plate P remains in a peeled state without re-adhering.

  After completion of the vibration applying operation for the processing object D, the suction pad 17 waiting upward is lowered in the direction of arrow a in FIG. 1 and sucks the end of the processing object D (see FIG. 2). As shown in FIG. 5, the adhesive sheet S and the glass plate P are separated by being displaced in the direction of the arrow b, and the glass plate P can be completely peeled by further displacement of the suction pad 17.

  Therefore, according to such an embodiment, the adhesive force is lost by applying the vibration without the need to form the separation trigger portion at the interface between the glass plate P and the adhesive sheet S as in the prior art. In this state, the effect that the glass plate P can be peeled from the wafer W is obtained.

As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this.
In other words, the present invention has been illustrated and described mainly with respect to specific embodiments, but without departing from the scope of the technical idea and object of the present invention, the shape, position, or With respect to the arrangement and the like, those skilled in the art can make various changes as necessary.

  For example, in the above-described embodiment, the configuration in which the shaft-like member 15 for applying vibration performs the vibration applying operation on the entire surface of the processing object D is illustrated and described in advance, but the present invention is not limited to this. That is, as shown in FIGS. 5 and 6, the suction pad 17 may be displaced in synchronization with the movement of the shaft-like member 15 in the direction of applying the vibration. According to this, the peeling processing time can be shortened.

  In the embodiment, the glass plate P is sucked through the suction pad 17 and the peeling force is applied in the direction away from the wafer W. However, the suction pad 17, that is, the peeling force applying means 13 is necessarily provided. Is not required. That is, if the interface peeling between the adhesive layer A1 and the glass plate P occurs by applying vibration to the entire area of the processing object D, the glass plate P can be peeled manually.

  Further, the vibration applying unit 12 is not limited to the configuration in which the oscillation member is built in the shaft-shaped member 15, and the oscillation device may be interposed between the moving device (not shown) and the shaft-shaped member. The vibration applying means 12 may be configured to apply vibration to the processing object D in a non-contact state with respect to the glass plate P. Note that the application of vibration is not limited to an ultrasonic vibrator or a motor vibrator. The present invention only needs to impart vibration to the adhesive sheet S and contribute to the interfacial peeling between the glass plate P and the adhesive layer A1.

  Further, the processing object D is not limited to the wafer W and the glass plate P, but may be other plate-like bodies.

  Furthermore, in the above embodiment, the vibration applying means 12 is positioned on the glass plate P side. However, for example, the vibration applying means is built in the table 11 constituting the support means, and the wafer W is formed by the vibration applying means. The vibration may be applied to the adhesive sheet S through the through hole. Moreover, while providing a vibration provision means in the table 11, a vibration provision means can also be arrange | positioned also at the glass plate P side, and a vibration can also be provided by these combined use.

  Further, the vibration applying means 12 is not limited to the shaft-like member 15 and is not tested for shapes such as a plate shape and an elliptical shape.

  Furthermore, in the said embodiment, although the shaft-shaped member 15 set the length so that it might become longer than the process target object D in the direction orthogonal to the advancing direction of the said shaft-shaped member 15, it is limited to this. Instead, the length of the shaft-like member 15 may be set shorter than the processing object D. In this case, the shaft-like member 15 may be displaceable so that the vibration applying operation for the processing object D is performed uniformly.

  Further, as shown in FIG. 7, the peeling force applying unit 13 may include a vibration applying unit 12. In this case, the peeling force applying means 13 vibrates and supports the glass plate P, and is displaced in the direction of arrow e in FIG.

(A) is a schematic front view of a peeling apparatus, (B) is the elements on larger scale of a process target object. The front view which shows the state which the shaft-shaped member completed vibration provision operation and the suction pad adsorb | sucked the glass plate. FIG. 3 is a schematic perspective view corresponding to FIG. 2. The schematic front view which shows the state by which the suction pad was displaced and peeling was started. The schematic front view which shows the state which peels in synchronism with the peeling force provision by a suction pad, and the vibration provision by a shaft-shaped member. FIG. 6 is a schematic perspective view corresponding to FIG. 5. The schematic front view which shows a modification.

Explanation of symbols

10 Peeling device 11 Table (support means)
12 Vibration imparting means 13 Peeling force imparting means 15 Axis member D Object to be treated P Glass plate (second member)
S adhesive sheet W semiconductor wafer (first member)

Claims (4)

The first member and the second member support the processing target object bonded via the adhesive sheet, and cross the surface of the processing target object, and are movable along the processing target object. A peeling apparatus comprising: a vibration applying unit that includes a shaft- shaped member that is provided to apply vibration to the processing object; and a peeling force applying unit that applies a peeling force to the outer surface of the processing object . The peeling force applying means is configured to apply a peeling force in a direction in which the first member and the second member are separated in synchronization with the movement of the shaft-shaped member in a direction in which vibration is applied. and stripping apparatus according to claim 1, wherein the are. It said vibrating means is claim 1 or 2 Symbol placement of the peeling apparatus characterized by applying vibration at a contact or non-contact state with respect to the processing object. A shaft-like member that crosses in the surface direction of the processing object and imparts vibration in a state where the processing object to which the first member and the second member are bonded via the adhesive sheet is supported by the support means. Vibration is imparted by moving along the object to be processed, and the first and second members of the first and second members are moved away from each other by releasing the adhesion state of the adhesive sheet by the vibration . A peeling method characterized in that a peeling force is applied to the outer surface for peeling .

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