JP4981637B2 - Printed circuit board and conductor pattern structure thereof - Google Patents

Description

  The present invention relates to a printed circuit board and a conductor pattern structure thereof, and in particular, in a printed circuit board in which signal wiring and a component mounting area for mounting circuit components are formed by a conductor layer, the plane pattern (wiring pattern) of the signal wiring The present invention relates to a conductor pattern structure in which a planar pattern (mounting pattern) in a component mounting area is separated.

  In general, a printed circuit board is formed by forming a conductor layer constituting a wiring having a predetermined pattern and a component mounting area on the surface of an insulating plate made of an insulating material, and an integrated circuit, a resistor on the surface. A large number of electronic components (hereinafter also referred to as circuit components) such as capacitors are fixed, and the circuit components are connected by wiring to constitute an electronic circuit.

  In such a printed circuit board design stage, when circuit components for impedance matching to high-frequency signal lines are mounted, the circuit configuration and constant values of circuit components may not be determined. The planar pattern (conductor pattern) of the conductor layer of the board has a structure that can be changed to adjust the circuit configuration in the process of mounting circuit components on the printed board or in the subsequent process.

  For example, Patent Document 1 discloses a circuit pattern having a jumper land for adjusting a circuit configuration in a process of mounting circuit components on a printed board.

  7A and 7B are diagrams for explaining the jumper land connection structure disclosed in Patent Document 1. FIG. 7A is a plan view and FIG. 7B is a cross-sectional view.

  On the printed wiring board 11, a pair of half-moon shaped conductive patterns arranged close to each other are formed as jumper lands 12 and 13, and each jumper land 12 and 13 constitutes a circuit pattern. One end of the wiring layers 14 and 15 is connected. A plurality of such a pair of jumper lands are included in the circuit pattern on the printed wiring board, and as shown in FIG. 7, a predetermined pair of jumper lands 12 and 13 have 0 ohms across them. A resistance component 16 is mounted, and the jumper lands 12 and 13 are short-circuited by the 0 ohm resistance component 16.

  In the printed wiring board 11 having the circuit pattern including the plurality of jumper land pairs as described above, the 0 ohm resistor component 16 is selectively mounted on the predetermined jumper land pair in the step of mounting the circuit component on the printed wiring board. By doing so, the circuit configuration can be adjusted.

  Patent Document 2 discloses a short land structure for adjusting a circuit configuration after mounting an electronic component (circuit component) on a printed board.

  FIG. 8 is a diagram for explaining the short land structure disclosed in Patent Document 2. FIG. 8A shows an example in which the circuit pattern is configured to be adjustable using the short land structure. b) is an enlarged plan view showing the short land structure.

  As shown in FIG. 8A, series-connected resistors R1 and R2 are mounted on a printed circuit board (not shown), and a short land 20 is provided between lands on which the resistor 2 is mounted. ing.

  Here, as shown in FIG. 8B, the short land 20 is provided with, for example, a circular conductive portion in a part of the wiring pattern, and a slit 20a is formed in the central portion thereof so that the conductive portion is paired with a pair of half lands. The circular conductive portions 21 and 22 are divided. A wiring 23 connected to one end of the resistor R2 is connected to the one semicircular conductive portion 21, and a wiring 24 connected to the other end of the resistor R2 is connected to the other semicircular conductive portion 22. .

  In a printed circuit board having such a circuit pattern, after mounting circuit components such as the resistors R1 and R2 on the printed circuit board by immersion soldering, the pair of semicircular conductor portions 21 and 22 facing each other in the short land 20 are mounted. Is not connected by the slit 20a. When it is necessary to short-circuit the opposing conductor portions 21 and 22 of the short land 20 during circuit adjustment of the printed circuit board, the short land is brought into a connected state by filling the slit 20a with solder. can do.

As described above, at the design stage of a printed circuit board, when circuit components for impedance matching with respect to a high-frequency signal line are mounted, the circuit configuration and constant values of the circuit components cannot be determined. As disclosed in Japanese Patent Application Laid-Open No. H11-228688 and Patent Document 2, it is often performed that a 0Ω resistance component is mounted on a printed circuit board or a short land pattern is installed.
JP-A-7-86729 Japanese Patent Laid-Open No. 7-154037

  However, as disclosed in Patent Document 1 and Patent Document 2, the adjustment of the circuit configuration in the printed circuit board is not only performed using a jumper land or a short land, but also has the same configuration as the jumper land or the short land. Depending on whether or not circuit components are mounted on the component mounting lands, there may be cases. Particularly in such a case, when a circuit component is mounted on a component mounting land included in the wiring pattern of the printed circuit board to constitute an electronic circuit, the width of the circuit component expected to be mounted is less than the width of the wiring pattern. If a land pattern larger than the wiring width is required for component mounting, for example, it is necessary to change the wiring width and shape of the wiring in the component mounting land portion and to enlarge it for component mounting.

  Specifically, as shown in FIG. 9, the component mounting land 30 includes a pair of opposed semicircular conductive portions 31 and 32, and signal wirings 33 and 34 are connected to the circular conductive portions 31 and 32, respectively. Has been. Here, the circuit component 36 to be mounted has a width wider than that of the signal wirings 33 and 34, and the width of the pair of semicircular conductive portions 31 and 32 constituting the component mounting land 30 is determined by the above-described signal. It is wider than the width of the wiring.

  As shown in FIG. 9A, the circuit component 36 is mounted on such a component mounting land 30 so as to straddle the pair of semicircular conductive portions 31 and 32 using a conductive member 35 a such as solder. As a result, the circuit component 36 can be connected in series to the signal wirings 33 and 34.

  However, depending on the condition of the circuit adjustment, as shown in FIG. 9B, the circuit board 36 is not mounted on the component mounting land 30 but the pair of semicircular conductive portions 31 and 32 facing each other. There is a case where a conductive member 35b such as solder is embedded in the slit to cause a short circuit.

  In such a case, although the circuit component is not mounted on the component mounting land 30, the component mounting land 30 portion of the signal wiring has a wider wiring width than the other portions of the signal wiring. Become.

  Therefore, the wiring pattern on which the component mounting land is formed can be adjusted in the process of mounting the circuit component on the printed circuit board on which the wiring pattern is formed. There is a possibility that it cannot be applied to a high-frequency signal line or the like in which the change in signal affects the signal.

  The present invention has been made to solve the above-described conventional problems, and can reduce the electrical influence on the signal wiring of the layout of the component mounting area that appears when the component is not mounted. An object of the present invention is to obtain a printed circuit board having a land pattern for mounting components and its conductor pattern structure.

A printed board according to the present invention is a printed board for mounting an electronic circuit by mounting a circuit component, and a component mounting area for mounting the circuit component, and a component connecting portion connected to the circuit component At least one signal wiring, and the component mounting portion is a portion in which the component mounting area is disposed as an area for supporting circuit components connected to the signal wiring on both sides of the signal wiring. The signal wiring has a structure in which the wiring width does not change at least at the component connecting portion, the signal wiring and the component mounting region are configured by a conductor layer, and the planar pattern of the conductor layer is the signal wiring Are separated into a wiring pattern, which is a flat pattern, and a mounting pattern, which is a flat pattern of the component mounting area, thereby achieving the above object.

  According to the present invention, in the printed circuit board, the mounting pattern is arranged as a component mounting land pattern on which a mounting surface of the circuit component is disposed so as to be adjacent to each other along one side of the signal wiring. A pattern of first and second component mounting lands, and a pattern of third and fourth component mounting lands disposed adjacent to each other along the other side of the signal wiring in the component mounting area. The first and third component mounting lands are positioned so as to face each other with the signal wiring interposed therebetween, and the second and fourth component mounting lands sandwich the signal wiring. It is preferable that they are positioned so as to face each other.

  In the printed circuit board according to the present invention, the first and third component mounting lands are lands on which one end side mounting surfaces of the circuit components are disposed, and the second and fourth component mounting lands are The land on which the mounting surface on the other end of the circuit component is disposed is preferable.

  In the printed circuit board according to the present invention, the signal wiring is mounted on one end side of the circuit component so that the circuit component is connected in series to the signal wiring when the circuit component is mounted in the component mounting region. It is preferable that it is divided at a corresponding portion between the first and other end-side mounting surfaces.

  According to the present invention, in the printed circuit board, the first and third component mounting lands and a portion of the signal wiring located between the lands are different from a conductor layer constituting the signal wiring. The second and fourth component mounting lands, which are connected by the first reinforcing conductor layer, and a portion of the signal wiring located between the lands are conductor layers constituting the signal wiring. Are connected by a second reinforcing conductor layer that is different from the first reinforcing conductor layer, and the conductor portion connected by the first reinforcing conductor layer is a portion to which the one end side mounting surface of the circuit component is fixed. The conductor part connected by the reinforcing conductor layer is preferably a part to which the mounting surface on the other end side of the circuit component is fixed.

  According to the present invention, in the printed circuit board, the signal wiring is between a portion where the first and third component mounting lands face each other and a portion where the second and fourth component mounting lands face each other. It is preferable that the divided portion of the signal wiring is electrically connected by a conductor layer different from the conductive layer constituting the signal wiring.

  In the printed circuit board according to the present invention, it is preferable that the conductor layer that electrically connects the divided portions of the signal wiring has the same width as the wiring width of the signal wiring.

  In the printed circuit board according to the present invention, it is preferable that the conductor layer that electrically connects the divided portions of the signal wiring is removed when the circuit component is mounted.

  In the printed circuit board according to the present invention, the mounting pattern is disposed on one side of the signal wiring along the signal wiring and surrounding the first and third component mounting lands. A pattern of the first shield layer that shields the signal wiring and the other side of the signal wiring are arranged along the signal wiring and surrounding the second and fourth component mounting lands. And a pattern of a second shield layer for shielding the signal wiring.

  According to the present invention, in the printed board, the mounting pattern electrically connects the first and second component mounting lands located on one side of the signal wiring to the first shield layer. 1 connection conductor pattern and a second connection conductor pattern for electrically connecting the third and fourth component mounting lands located on the other side of the signal wiring to the second shield layer Are preferably included.

  According to the present invention, in the printed circuit board, the first shield layer, the first and second component mounting lands, and the first connection conductor are arranged on one side of the signal wiring. The second shield layer, the third and fourth component mounting lands, and the second connection conductor are arranged on the other side of the signal wiring. It is preferable that a continuous shield portion for the signal wiring is formed on the side.

  According to the present invention, in the printed circuit board, the mounting pattern is arranged as a component mounting land pattern in which a mounting surface of the circuit component is disposed so as to be positioned on one side of the signal wiring. Preferably, the component mounting land pattern and the second component mounting land pattern arranged to be positioned on the other side of the signal wiring are included.

  According to the present invention, in the printed circuit board, the first component mounting land is a land on which a mounting surface on one end side of the circuit component is disposed, and the second component mounting land is the other of the circuit component. A land on which the end-side mounting surface is disposed is preferable.

  In the printed circuit board according to the present invention, it is preferable that the second component mounting land also serves as a potential supply wiring for supplying a power supply potential or a ground potential to the circuit component.

  In the printed circuit board according to the aspect of the invention, it is preferable that the one-end-side mounting surface of the circuit component is electrically connected to the signal wiring when the circuit component is mounted in the component mounting region.

  According to the present invention, in the printed circuit board, the first component mounting land and a portion of the signal wiring facing the first component mounting land are different from a conductor layer constituting the signal wiring. It is preferable that the conductor part connected by the reinforcing conductor layer is a part to which the one end side mounting surface of the circuit component is fixed.

  According to the present invention, in the printed circuit board, the mounting pattern is disposed on one side of the signal wiring along the signal wiring and surrounding the first component mounting land. It is preferable that the pattern of the shield layer which shields is included.

  According to the present invention, in the printed circuit board, the mounting pattern has a pattern of a connection conductor that electrically connects the first component mounting land located on one side of the signal wiring to the shield layer. Is preferred.

  According to the present invention, in the printed circuit board, the shield layer, the first component mounting land, and the connection conductor form a continuous shield portion for the signal wiring on one side of the signal wiring. It is preferable that they are arranged.

A printed circuit board conductor pattern structure according to the present invention is a printed circuit board conductor pattern structure for mounting an electronic circuit by mounting circuit components, the component mounting area for mounting the circuit component, and the circuit At least one signal wiring having a component connecting portion connected to the component, and the component mounting portion mounts the component as an area for supporting a circuit component connected to the signal wiring on both sides of the signal wiring. The signal wiring has a structure in which the wiring width does not change at least in the component connection portion, the signal wiring and the component mounting region are configured by a conductor layer, and the conductor layer The plane pattern is separated into a wiring pattern that is a plane pattern of the signal wiring and a mounting pattern that is a plane pattern of the component mounting area. The purpose is achieved.

  The operation of the present invention will be described below.

  In the present invention, the plane pattern of the conductor layer formed on the printed circuit board and constituting the component mounting area and the signal wiring is divided into a wiring pattern that is the planar pattern of the signal wiring and a mounting pattern that is the planar pattern of the component mounting area. Since it is separated from the pattern, the component mounting land pattern can be arranged without changing the pattern shape of the signal wiring.

  Also, when mounting the component, the signal wiring is disconnected at a portion located below the circuit component, and the circuit component is mounted when the circuit component is mounted on the land pattern in the component mounting area. By connecting the surface not only to the land pattern but also to signal wiring on both sides of the disconnected portion, circuit components are connected in series to the signal wiring without installing a component mounting pattern on the signal wiring. be able to.

  Further, in the present invention, the first component mounting land pattern and the second component mounting land pattern are arranged on both sides of the signal wiring. Can be arranged without changing the shape. Further, at the time of component mounting, the circuit component is connected to the signal wiring together with the component mounting land pattern, whereby the circuit component is connected to the signal wiring and another wiring that also serves as the component mounting land pattern. Can be connected between the pattern.

  In the present invention, since the shield layer is disposed on both sides or one side of the signal wiring so as to surround the component mounting land, the component mounting land pattern and the signal wiring shield pattern are connected to each other. Thus, it is possible to prevent the shield pattern for the signal wiring from being interrupted in a state in which the component is not mounted, thereby preventing the signal wiring from being adversely affected by the shielding failure of the signal wiring.

  Further, in the present invention, the connection strength between the mounted circuit component and the signal wiring and the component mounting land pattern is increased by connecting the component mounting land pattern and the adjacent signal wiring portion with the reinforcing conductor layer. Can be increased.

  Further, the signal wiring is divided at a portion located in the component mounting area, and the divided portion of the signal wiring is electrically connected by a conductor layer different from the conductive layer constituting the signal wiring. Therefore, when circuit components are mounted in the component mounting area, the signal wiring can be easily disconnected in the component mounting area.

  As described above, according to the present invention, the component mounting land pattern can be arranged and the circuit components can be mounted in series on the signal wiring without changing the shape of the signal wiring.

  In addition, a component mounting land pattern can be arranged without changing the shape of the signal wiring, and the component can be mounted between the signal wiring and another land pattern.

  Further, when the component is not mounted, it is possible to prevent the signal wiring shield pattern and the like from becoming discontinuous by the component mounting land pattern.

  Furthermore, the reliability of the connection between the mounted component and the signal wiring can be improved and the connection can be enhanced at the time of component mounting.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(Embodiment 1)
FIG. 1 is a plan view for explaining a printed circuit board according to Embodiment 1 of the present invention, and shows a structure when components are not mounted, particularly a component mounting land pattern formed on the printed circuit board.

  The printed circuit board 100 of the first embodiment is formed by forming a conductor layer made of a conductor material such as a metal material having a predetermined pattern on the surface of an insulating plate 101 made of an insulating material. A signal wiring 111 having a predetermined pattern constituting the electronic circuit and a component mounting area having a predetermined pattern for mounting a circuit component constituting the electronic circuit are provided. Hereinafter, the planar pattern of the component mounting area is also referred to as a mounting pattern.

  2 (a) and 2 (b) are schematic views showing the circuit component, and are an upper perspective view and a lower perspective view, respectively.

  As shown in FIGS. 2A and 2B, the circuit component 116 has a rectangular parallelepiped shape, and mounting surfaces 116a fixed to the mounting pattern of the printed circuit board by solder or the like at both ends of the back surface thereof. 116b is formed. Here, the mounting surface is subjected to, for example, metallization processing so that it can be soldered.

  In addition, the mounting pattern is a pattern of a pair of lands arranged on both sides of the mounting surface arrangement part A where the one end side mounting surface 116a of the circuit component 116 to be mounted is positioned (component mounting). Land pattern) 112a and 112b and a pair of lands arranged so as to sandwich the signal wiring 101 on both sides of the mounting surface arrangement part B where the other end side mounting surface 116b of the circuit component 116 to be mounted is located. Patterns (component mounting land patterns) 122a and 122b are provided, and the mounting surfaces 116a and 116b of the circuit component 116 are fixed to these land patterns.

  The mounting pattern is disposed on both sides of the signal wiring 111 so as to surround the signal wiring 111 and the land patterns 112a, 112b, 122a, 122b, and shield patterns 113a and 113b for shielding the signal wiring 111, and Connection conductor patterns 114a and 114c connecting the land pattern 112a and the shield land pattern 113a, connection conductor patterns 114b and 114d connecting the land pattern 112b and the shield land pattern 113b, and the land pattern 122a and the shield Connection conductor patterns 124a and 124c connecting the land pattern 113a, and connection conductor patterns 124b and 124d connecting the land pattern 122b and the shield land pattern 113b, It is.

  Here, the shield land pattern 113a, the land patterns 112a and 122a, and the connection conductor patterns 114a, 114c, 124a, and 124c have one side that is opposite to these patterns of the signal wiring 111, respectively. It arrange | positions so that it may be located on a parallel straight line. The shield land pattern 113b, the land patterns 112b and 122b, and the connection conductor patterns 114b, 114d, 124b, and 124d are connected to the other sides of the signal wiring 111 that are opposite to these patterns. It arrange | positions so that it may be located on a parallel straight line.

  In addition, when the circuit component 116 is mounted across the mounting surface arrangement parts A and B, the part 115 located between the two mounting surface arrangement parts A and B of the signal wiring 111 When the wiring material is removed so that the signal wiring 116 is cut at 115 and the circuit component 116 is not mounted, it remains as a part of the wiring.

  As described above, in the printed circuit board 100 according to the first embodiment, the mounting pattern for forming the component mounting area on the circuit board is the two sets of land patterns 112a, 112b, 122a, and 122b that sandwich the signal wiring 111. And shield patterns 113a and 113b of the signal wiring 111, and connection conductor patterns 114a to 114d and 124a to 124d for connecting the land pattern and the shield land pattern. Therefore, in the printed circuit board 100 having such a mounting pattern, the signal wiring 111 is removed by removing the portion 115 located between the mounting surface placement portions A and B of the signal wiring 111, and the signal wiring is cut at the portion 115, The circuit component 116 is mounted so that the mounting surfaces 116a and 116b at both ends thereof are fixed to the mounting surface arrangement portions A and B, so that the circuit component 116 is connected to the signal wiring 111 in series. can do.

  Further, when the component is not mounted, the signal wiring 111 does not change its shape for mounting the component, and the shield of the signal wiring by the shield patterns 113a and 113b arranged on both sides of the signal wiring 111 is also the land pattern 112a. 112b, 124a and 124b are not interrupted.

  In the first embodiment, each land pattern is connected to the shielding pattern at two places on the left and right. However, the place and the connection area where the land pattern is connected to the shielding pattern by the connection conductor pattern are the same as those in the first embodiment. It is not limited to what was shown by.

  Next, a circuit component mounting method will be described.

  FIGS. 3A and 3B are views for explaining a method of mounting circuit components on the printed circuit board shown in FIG. 1, and FIG. 3A is a component mounting portion of the signal wiring before component mounting. FIG. 3B shows a state in which circuit components are mounted in the component mounting region.

  When circuit components are arranged in a predetermined component mounting area where the land patterns 112a, 112b, 122a, and 122b of the printed circuit board 100 shown in FIG. 1 are arranged, as shown in FIG. 111, the portion 115 located between the component placement portions A and B is removed, the signal wiring 111 is disconnected at this portion (signal wiring cut portion) 115, and the connection conductor patterns 114a to 114d and 124a are further connected. Remove ~ 124d.

  Next, as shown in FIG. 3B, the circuit component 116 is mounted such that the mounting surfaces 116a and 116b at both ends thereof are fixed to the component arrangement portions A and B. At this time, the mounting points 116 a and 116 b of the circuit component 160 and the signal wiring 111 are also connected at the connection points 117 and 127. As a result, the circuit component can be mounted so as to be inserted into the signal wiring 111 in series.

  When the circuit component 116 is mounted, the land patterns 112a, 112b, 122a, 122b and the connection points 117 and 127 of the signal wiring 111 are connected in advance by a conductor layer (reinforcing conductor layer) or the like, and then the conductor layer is connected. The mounting surfaces 116a and 116b of the circuit component 116 may be fixed to the conductor portions connected by the above, thereby strengthening the connection between the circuit component and the printed board.

  As described above, in the present embodiment, the planar pattern of the conductor layer formed on the printed circuit board 100 and constituting the component mounting region and the signal wiring is divided into the wiring pattern that is the planar pattern of the signal wiring 111 and the component mounting region. Since it is separated from the mounting pattern which is a planar pattern, the component mounting land patterns 112a, 112b, 122a and 122b can be arranged without changing the pattern shape of the signal wiring 111.

  Further, when mounting the component, the signal wiring 111 is disconnected at the portion 115 located below the circuit component 116, and when the circuit component 116 is mounted on the land pattern in the component mounting area, By connecting the mounting surfaces 116a and 116b of the circuit component not only to the land pattern but also to the signal wiring 111 on both sides of the disconnected portion, the signal wiring can be provided without installing a component mounting pattern on the signal wiring. The circuit component 116 can be connected in series to the circuit 111.

  In addition, since the shield layer is arranged on both sides of the signal wiring so as to surround the component mounting land, the structure in which the component mounting land pattern and the signal wiring shield pattern are connected to each other in the unmounted state. It is possible to prevent the shield pattern for the signal wiring from being interrupted, thereby preventing the signal wiring from being adversely affected by the shielding failure of the signal wiring.

  In addition, by connecting the component mounting land pattern and the signal wiring portion adjacent thereto with the reinforcing conductor layer, the connection strength between the mounted circuit component, the signal wiring, and the component mounting land pattern can be increased.

  In the first embodiment, the conductive layer is manually removed from the disconnection portion 115 of the signal wiring 116. However, the method of removing the disconnection portion is not limited to this, and the signal portion is previously removed. The disconnection position may be made conductive by a conductor layer having the same width as the wiring, and the conductor layer may be removed at the time of component mounting to achieve a disconnection state.

  Hereinafter, another method for disconnecting the disconnected portion of the signal wiring will be described with reference to FIG.

  This method uses a printed circuit board 100a shown in FIG.

  The printed circuit board 100a includes a signal wiring 111a having a structure divided at the center of the component mounting area instead of the signal wiring 111 of the printed circuit board 100 shown in FIG. 1, and the divided portion 115 of the signal wiring 111a is connected to the signal wiring 111a. A conductor member 115a having the same width as 111a is connected.

  The other parts of the printed board 100a shown in FIG. 4 are the same as those in the printed board 100 shown in FIG.

  In the printed circuit board 100a having such a structure, the divided portion 115 of the signal wiring 111a in the component mounting area is in a state of being connected in advance by the conductor member 115a, so that a circuit component is mounted in the component mounting area. Then, the conductor member 115a is removed, and then the circuit component is mounted in the component mounting region as in the first embodiment.

  Even in the printed circuit board 100a having such a structure, when the circuit component is not mounted in the component mounting region, it is possible to avoid the change of the width of the signal wiring in the component mounting region.

As described above, in the printed circuit board 100a shown in FIG. 4, the signal wiring is divided at a portion located in the component mounting region, and the divided portion of the signal wiring is different from the conductive layer constituting the signal wiring. Since the structure is such that the conductor layers are electrically connected, when the circuit component is mounted in the component mounting area, the signal wiring can be easily disconnected in the component mounting area.
(Embodiment 2)
5 and 6 are plan views for explaining a printed circuit board according to Embodiment 2 of the present invention. FIG. 5 shows a land pattern for component mounting formed on the printed circuit board. FIG. 6 shows the printed circuit board. Shows a state where circuit components are mounted.

  The printed circuit board 100b of Embodiment 2 is formed by forming a conductive layer made of a conductive material such as a metal material having a predetermined pattern on the surface of an insulating plate 101 made of an insulating material. It has a signal wiring 111b having a predetermined pattern constituting an electronic circuit, and a component mounting area (hereinafter referred to as a mounting pattern) having a predetermined pattern for mounting a circuit component 116 constituting the electronic circuit. . Hereinafter, the planar pattern of the component mounting area is also referred to as a mounting pattern. The circuit component 116 is the same as that shown in FIG.

  Here, the mounting pattern is disposed so as to surround the signal wiring 111b on one side along the signal wiring 111b and the land pattern 132 disposed adjacent to the one side of the signal wiring. A shield pattern 133 that shields the wiring 111b, connection conductor patterns 134a and 134b that connect the land pattern 132 and the shield land pattern 133, and a second wiring line disposed along the other side of the signal wiring. And a land pattern 138.

  Here, the second land pattern 138 also serves as a ground potential supply wiring pattern for supplying a ground potential. However, the second land pattern 138 may also serve as a power supply potential supply wiring pattern for supplying a power supply potential. The shield land pattern 133, the land pattern 132, and the connection conductor patterns 134a and 134b are arranged so that the respective sides are positioned on a straight line parallel to one side of the signal wiring 111b that faces these patterns. ing.

  As described above, in the printed circuit board 100 according to the second embodiment, the mounting pattern for forming the component mounting area on the board is the land pattern 132 arranged on one side of the predetermined portion of the signal wiring 111b and the signal wiring 111b. A shielding pattern 133 disposed on one side of the wiring pattern, connection conductor patterns 134a to 134b connecting the land pattern and the shielding land pattern, and a second land pattern 138 disposed on the other side of the signal wiring 111b, It consists of Therefore, in the printed circuit board 100b having such a mounting pattern, the circuit component 116 is mounted in the component mounting region of the signal wiring 111b, and the mounting surfaces 116a and 116b at both ends thereof are the first and second land patterns 132 and 138. By mounting so as to be fixed to the circuit component, the circuit component can be mounted so as to be connected between the signal wiring and the ground line.

  In addition, the signal wiring does not change in shape due to the fact that the circuit component can be mounted so as to be connected to the signal wiring when the component is not mounted, and is arranged on one side of the signal wiring 111b. Since the shield pattern 133 is also connected to the land pattern, the shield portion on one side of the signal wiring 111 is not electrically interrupted by the land pattern.

  Next, the mounting method will be briefly described.

  Further, when the circuit component 116 is arranged in a predetermined component mounting area where the land patterns 132 and 138 of the printed circuit board 100b shown in FIG. 5 are arranged, the connection conductor patterns 134a and 134b are arranged as shown in FIG. Then, the circuit component 116 is mounted so that the mounting surfaces 116 a and 116 b at both ends thereof are fixed to the first and second land patterns 132 and 138. At this time, the circuit component 116 and the signal wiring 111 b are also connected at the connection point 137. As a result, the circuit component 116 can be connected and mounted between the signal wiring 111b and the second land pattern 138 as a power supply or ground line.

  In addition, since the first component mounting land pattern and the second component mounting land pattern are arranged on both sides of the signal wiring, the component mounting land pattern changes the shape of the signal wiring. It can arrange without. Further, at the time of component mounting, the circuit component is connected to the signal wiring together with the component mounting land pattern, whereby the circuit component is connected to the signal wiring and another wiring that also serves as the component mounting land pattern. Can be connected between the pattern.

  In the second embodiment, the first land pattern is connected to the shield pattern at two places on the left and right, but the place and the connection area where the first land pattern is connected to the shield pattern by the connection conductor pattern. Is not limited to that shown in the second embodiment.

  In addition, when the component is mounted, the first land pattern 132 and the connection point 137 of the signal wiring 111b are connected in advance by a conductor member (reinforcing conductor layer) or the like, and then the circuit component is connected to the conductor portion connected by the conductor member. By fixing each mounting surface 116, the connection between the circuit component and the printed board may be strengthened.

  As mentioned above, although this invention has been illustrated using preferable embodiment of this invention, this invention should not be limited and limited to this embodiment. It is understood that the scope of the present invention should be construed only by the claims. It is understood that those skilled in the art can implement an equivalent range based on the description of the present invention and the common general technical knowledge from the description of specific preferred embodiments of the present invention. Patents, patent applications, and documents cited herein should be incorporated by reference in their entirety, as if the contents themselves were specifically described herein. Understood.

  In the field of a printed circuit board having a plurality of component mounting areas for mounting circuit components, the present invention avoids a change in signal wiring width in a component mounting area in which the circuit components are not mounted. Thus, it is possible to provide a printed circuit board conductor pattern structure that can also be applied to high-frequency signal lines.

FIG. 1 is a plan view for explaining a printed circuit board according to Embodiment 1 of the present invention, and shows a pattern for series mounting of conductor layers formed on the printed circuit board. 2A and 2B are schematic views showing the external appearance of a circuit component mounted on the printed circuit board according to the first embodiment. FIG. 2A is a top perspective view and FIG. 2B is a bottom perspective view. FIG. 3 is a plan view for explaining a method of mounting circuit components on the printed circuit board of the first embodiment, and FIG. 3A shows a state in which the component mounting portion of the signal wiring is disconnected before mounting the components. FIG. 5B shows a state in which circuit components are mounted in the component mounting area. FIG. 4 is a plan view illustrating a printed circuit board according to a modification of the first embodiment of the present invention, and shows a pattern for series mounting of conductor layers formed on the printed circuit board. FIG. 5 is a plan view for explaining a printed circuit board according to Embodiment 2 of the present invention, and shows a pattern for non-series mounting of conductor layers formed on the printed circuit board. FIG. 6 is a plan view for explaining the printed circuit board according to the second embodiment, and shows a state in which circuit components are mounted in a component mounting region of the printed circuit board. 7A and 7B are diagrams for explaining a jumper land connection structure disclosed in Patent Document 1. FIG. 7A is a plan view and FIG. 7B is a cross-sectional view. FIG. 8 is a diagram for explaining the short land structure disclosed in Patent Document 2. FIG. 8A shows an example in which the circuit pattern is configured to be adjustable using the short land structure, and FIG. ) Is an enlarged plan view showing the short land structure. FIG. 9 is a diagram for explaining the problems of a conventional printed circuit board component mounting land pattern, in which circuit components are mounted on the component mounting land (FIG. 9A) and circuit components mounted on the component mounting land. The state (FIG. (B)) which is not mounted is shown.

Explanation of symbols

100, 100a, 100b Printed circuit board 101 Insulating plate 111, 111a, 111b Signal wiring 112a, 112b, 122a, 122b, 132 Land pattern for component mounting 113a, 113b 133 Land pattern for shielding 114a-114d, 124a-124d, 134a, 134b Land pattern connection conductor 115 Signal wiring cut portion 115a Wiring connection conductor 116 Circuit component (mounting component)
116a, 116b Mounting surface 117, 137 Electrical connection 138 Ground land pattern

Claims (20)

A printed circuit board for configuring an electronic circuit by mounting circuit components,
Component mounting area for mounting the circuit component;
And at least one signal wiring having a component connecting portion connected to the circuit component,
The component mounting portion is a portion where the component mounting area is arranged as an area for supporting circuit components connected to the signal wiring on both sides of the signal wiring,
The signal wiring has a structure in which the wiring width does not change at least at the component connection portion,
The signal wiring and the component mounting area are constituted by a conductor layer,
The printed circuit board in which the planar pattern of the conductor layer is separated into a wiring pattern that is a planar pattern of the signal wiring and a mounting pattern that is a planar pattern of the component mounting region. The printed circuit board according to claim 1,
The mounting pattern is
As a component mounting land pattern on which the circuit component mounting surface is arranged,
A pattern of first and second component mounting lands disposed adjacent to each other along one side of the signal wiring;
A pattern of third and fourth component mounting lands arranged adjacent to each other along the other side of the signal wiring,
The first and third component mounting lands are positioned to face each other across the signal wiring,
The printed circuit board in which the second and fourth component mounting lands are positioned so as to face each other with the signal wiring interposed therebetween. The printed circuit board according to claim 2,
The first and third component mounting lands are lands on which one end side mounting surfaces of the circuit components are disposed,
The second and fourth component mounting lands are printed circuit boards which are lands on which the other end mounting surface of the circuit component is disposed. The printed circuit board according to claim 3,
The signal wiring is provided between one end mounting surface and the other end mounting surface of the circuit component so that the circuit component is connected in series to the signal wiring when the circuit component is mounted in the component mounting region. Printed circuit board that is divided at the part corresponding to. The printed circuit board according to claim 2,
The first and third component mounting lands and the portion of the signal wiring located between the lands are connected by a first reinforcing conductor layer different from the conductor layer constituting the signal wiring. And
The second and fourth component mounting lands and the portion of the signal wiring located between the lands are connected by a second reinforcing conductor layer different from the conductor layer constituting the signal wiring. And
The conductor portion connected by the first reinforcing conductor layer is a portion to which the one end side mounting surface of the circuit component is fixed,
The printed circuit board, wherein the conductor part connected by the second reinforcing conductor layer is a part to which the mounting surface on the other end side of the circuit component is fixed. The printed circuit board according to claim 2,
The signal wiring is divided between a portion where the first and third component mounting lands face each other and a portion where the second and fourth component mounting lands face each other,
The printed circuit board in which the divided portion of the signal wiring is electrically connected by a conductive layer different from the conductive layer constituting the signal wiring. The printed circuit board according to claim 6,
The conductor layer that electrically connects the divided portions of the signal wiring is a printed circuit board having the same width as the wiring width of the signal wiring. The printed circuit board according to claim 7,
A printed circuit board in which the conductor layer that electrically connects the divided portions of the signal wiring is removed when the circuit component is mounted. The printed circuit board according to claim 2,
The mounting pattern is
A pattern of a first shield layer disposed on one side of the signal wiring along the signal wiring and surrounding the first and third component mounting lands, and shielding the signal wiring; ,
A pattern of a second shield layer disposed on the other side of the signal wiring along the signal wiring and surrounding the second and fourth component mounting lands and shielding the signal wiring; Including printed circuit board. The printed circuit board according to claim 9, wherein
The mounting pattern is
A pattern of first connection conductors for electrically connecting the first and second component mounting lands located on one side of the signal wiring to the first shield layer;
A printed circuit board including a second connection conductor pattern for electrically connecting the third and fourth component mounting lands located on the other side of the signal wiring to the second shield layer. The printed circuit board according to claim 10,
The first shield layer, the first and second component mounting lands, and the first connection conductor form a continuous shield portion for the signal wiring on one side of the signal wiring. Has been placed,
The second shield layer, the third and fourth component mounting lands, and the second connection conductor form a continuous shield portion for the signal wiring on the other side of the signal wiring. Printed circuit board that is placed. The printed circuit board according to claim 1,
The mounting pattern is
As a component mounting land pattern on which the circuit component mounting surface is arranged,
A pattern of first component mounting lands arranged to be positioned on one side of the signal wiring;
And a second component mounting land pattern disposed on the other side of the signal wiring. The printed circuit board according to claim 12, wherein
The first component mounting land is a land on which one end side mounting surface of the circuit component is disposed,
The second component mounting land is a printed circuit board which is a land on which a mounting surface on the other end side of the circuit component is disposed. The printed circuit board according to claim 13,
The second component mounting land also serves as a potential supply wiring for supplying a power supply potential or a ground potential to the circuit component. The printed circuit board according to claim 14, wherein
A printed circuit board in which the one end side mounting surface of the circuit component is electrically connected to the signal wiring when the circuit component is mounted in the component mounting region. The printed circuit board according to claim 12, wherein
The first component mounting land and the portion of the signal wiring facing the first component mounting land are connected by a reinforcing conductor layer different from a conductor layer constituting the signal wiring,
The printed circuit board, wherein the conductor portion connected by the reinforcing conductor layer is a portion to which the one end side mounting surface of the circuit component is fixed. The printed circuit board according to claim 12, wherein
The mounting pattern is
A printed circuit board including a pattern of a shield layer disposed on one side of the signal wiring along the signal wiring and surrounding the first component mounting land, and shielding the signal wiring. The printed circuit board according to claim 17,
The mounting pattern is
A printed circuit board having a pattern of connection conductors for electrically connecting a first component mounting land located on one side of the signal wiring to the shield layer. The printed circuit board according to claim 18,
The printed circuit board, wherein the shield layer, the first component mounting land, and the connection conductor are arranged to form a continuous shield portion for the signal wiring on one side of the signal wiring. A printed circuit board conductor pattern structure for mounting circuit components to form an electronic circuit,
Component mounting area for mounting the circuit component;
And at least one signal wiring having a component connecting portion connected to the circuit component,
The component mounting portion is a portion where the component mounting area is arranged as an area for supporting circuit components connected to the signal wiring on both sides of the signal wiring,
The signal wiring has a structure in which the wiring width does not change at least at the component connection portion,
The signal wiring and the component mounting area are constituted by a conductor layer,
A conductor pattern structure of a printed circuit board in which the planar pattern of the conductor layer is separated into a wiring pattern that is a planar pattern of the signal wiring and a mounting pattern that is a planar pattern of the component mounting region.

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