JP4974181B2 - Printed wiring board with carrier and method for manufacturing the same - Google Patents

Description

  The present invention relates to a wiring board with a carrier and a manufacturing method thereof, and more particularly to a flexible printed wiring board having a carrier and a manufacturing method thereof.

  In recent years, electronic devices represented by mobile phones, digital cameras, and liquid crystal displays have been used as substrates for mounting electronic devices such as semiconductor chips mounted on these electronic devices because of demands for miniaturization, thinning, and high functionality. A flexible printed wiring board having flexibility is used.

  Conventionally, as a flexible printed wiring board, for example, a printed wiring board manufactured using a substrate in which a copper foil layer is laminated on both sides of an insulating film such as polyimide, liquid crystal polymer, aramid, glass epoxy, and polyester is used. Are known. This printed circuit board forms a hole penetrating from one copper foil layer to the other copper foil layer in order to electrically connect the copper foil layers on both sides of the insulating film, and copper plating is applied to the side surface of this hole. Then, a desired conductor pattern is formed by performing etching treatment on both copper foil layers (see Patent Document 1).

  In addition, in order to realize a wiring pattern composed of wiring with a fine line width and a pitch between lines, that is, a so-called fine pattern, a copper foil having a thickness of 9 μm or less is required. Such a thin copper foil has a mechanical strength. Because it is weak and may cause copper foil breakage, a print formed by using an ultra-thin copper foil with a carrier in which an ultra-thin copper foil layer is directly electrodeposited via a release layer on one side of a metal foil as a carrier A wiring board is known. This printed circuit board is made of glass epoxy base material with an ultrathin copper foil layer with a carrier and the surface of the ultrathin copper foil layer is superposed and thermocompression bonded, and the carrier foil is peeled off and removed through the peeling layer. After exposing the bonding side of the layer to the release layer, through-hole drilling and through-hole plating are sequentially performed, and then the ultrathin copper foil layer is etched to obtain the desired line width and desired line spacing. A conductor pattern having a pitch is formed (see Patent Document 2).

JP 2006-13495 A JP 2004-169181 A

  In the printed circuit board described in the above patent document, since a copper foil layer laminated on the surface of the insulating film is used as a base material, holes for electrically connecting the copper foil layers on both sides of the insulating film are used. This hole is formed by laser processing. However, this laser processing is expensive, and there is a problem in that it is necessary to remove the smear (scrap) adhering to the hole and its periphery after the laser processing by an alkaline desmear treatment, which requires man-hours and costs. . Here, a hole is also formed by a drill. However, in this case, the hole diameter is limited to 150 μm and is not suitable for a printed wiring board requiring a fine pitch.

  Moreover, in the manufacturing process of such a printed wiring board, a roll-to-roll method is introduced in which a circuit pattern is formed and wound again in the process of feeding and transporting a long base material wound in a roll shape. However, in the printed wiring board described in the above-mentioned patent document, when using this roll-to-roll method, because a copper foil layer is laminated on the surface of an insulating film such as polyimide as a base material, There is a problem that the circuit pattern is formed in a different position by expanding and contracting due to the tension applied between the rolls to cause dimensional deformation.

  Furthermore, the printed wiring board described in the above-mentioned patent document has a problem that, when it is thinned, the rigidity as the board is lowered, and it is difficult to handle when joining an electronic device such as a semiconductor chip.

  Accordingly, an object of the present invention is to provide a printed wiring board with a carrier on which a circuit pattern is accurately formed at low cost and is easy to handle, and a method for manufacturing the same.

In order to achieve the above object, a method for manufacturing a printed wiring board with a carrier according to the present invention comprises a metal foil and a metal ultrathin foil that are electrically conductive and are detachably bonded to each other. The carrier layer is used as a base material for a printed wiring board with a carrier, and the base material is roll-to-roll
Of printed wiring board with carrier on the surface of the base material
A method of manufacturing a printed wiring board with a carrier, which forms a member, and is an insulating layer forming step of forming an insulating layer using patterning on the surface of the metal ultrathin foil as a base material.
, An external connection electrode for connecting to an external electrode on the surface side of the insulating layer to be formed is formed Sarena
An insulating layer forming step for forming the insulating layer only at a predetermined position, and the external connection electrode is formed by electroplating on the surface of the ultrathin metal foil where the insulating layer is not formed. After forming a metal underlayer on the surface of the external connection electrode and the insulating layer and the external connection electrode, a metal layer is formed on the surface of the metal underlayer by electroplating, A wiring pattern forming step of forming a wiring pattern by removing the ground layer and the metal layer; and an electronic device connecting electrode forming step of forming an electronic device connecting electrode electrically connected to the electronic device at a predetermined position of the wiring pattern; It is characterized by having.
The method for producing a carrier with a printed wiring board according to the present invention, with a carrier the carrier layer consisting of at least one another releasably adhered metal foil and the metal electrode thin foil has conductivity
Used as a base material for printed wiring boards, and transports the base material in a roll-to-roll manner.
While forming the constituent member of the printed wiring board with the carrier on the surface of the base material, the carrier
A method of manufacturing a printed wiring board with a pattern , wherein a pattern is formed on a surface of the ultrathin metal foil as a base material.
Insulating layer forming step of forming an insulating layer by using the annealing,
An insulating layer forming step of forming the insulating layer only at a position where an external connection electrode for connecting to the external electrode on the surface side is not formed; and a surface of the ultrathin metal foil and the insulating layer An external connection electrode forming step of forming the external connection electrode by electroplating at a position where no layer is formed; and after forming a metal underlayer on the surfaces of the insulating layer and the external connection electrode, Forming a metal layer by electroplating on the surface of the base layer, removing the metal base layer and the metal layer at predetermined locations to form a wiring pattern; and forming a wiring pattern on the surface of the wiring pattern and the insulating layer. Except for the connection points between the wiring pattern and other wiring patterns,
Another insulating layer forming step for forming another insulating layer, and after forming a metal underlayer on the surface of the wiring pattern and the other insulating layer, a metal layer is formed on the surface of the metal underlayer by electroplating. And forming the other wiring pattern by removing the metal base layer and the metal layer at a predetermined location, and electrically connecting the electronic device to a predetermined position of the other wiring pattern. And an electronic device connection electrode forming step for forming an electronic device connection electrode to be connected.

The method of manufacturing a carrier with a printed wiring board described above, the carrier layer is better to have a thickness that does not cause dimensional variations due Oite load applied to the printed circuit board with a carrier.

Furthermore, in the above-described method for manufacturing a printed wiring board with a carrier, the metal foil and the metal ultrathin foil may be made of copper. In this case, the carrier layer has a thickness of 1
It is good in it being 8 micrometers or more and 70 micrometers or less.

Moreover, in the manufacturing method of the above-mentioned printed wiring board with a carrier, the metal ultrathin foil is
The thickness is preferably 1 to 10 μm.

In the above-described method for manufacturing a printed wiring board with a carrier, the electronic device connection electrode may be a metal bump.

Furthermore, a plurality of wiring patterns may be stacked in the method for manufacturing a printed wiring board with a carrier described above.

  According to the present invention, when used as a printed wiring board, the carrier layer is removed, but since it also functions as a base material in the manufacturing process, an insulating film such as polyimide is used as the base material. It is not necessary to form holes for electrical continuity by laser processing and can be manufactured at low cost. In addition, since the carrier layer is formed of a metal foil having a high elastic modulus, even if a load is applied in the manufacturing process, the carrier layer does not expand and contract and dimensional deformation does not occur, and the circuit pattern formation accuracy is high. Furthermore, since the printed wiring board is supported by a highly rigid carrier layer, if the carrier layer is removed after bonding an electronic device such as a semiconductor chip, the printed wiring board can be transported or the electronic device Easy handling during joining.

  Hereinafter, embodiments of the present invention will be described with reference to FIGS. 1 to 4.

The printed wiring board 1 with a carrier according to the present embodiment includes a peelable copper foil 5 in which an ultrathin copper foil 4 that is a metal ultrathin foil is bonded to a copper foil 2 that is a metal foil via a release layer 3 as a carrier layer. Have. More specifically, it comprises Cr, Ni, Co, Fe, Mo, Ti, W, P or / and an alloy layer thereof or a hydrated oxide thereof by electroplating on one side of the copper foil 2 having a thickness of 35 μm. A release layer 3 composed of a layer or an organic film is formed, and a copper sulfate plating bath, a copper cyanide plating bath, a copper fluoride plating bath, a copper pyrophosphate plating bath, a copper sulfamate plating bath, An ultrathin copper foil 4 having a thickness of 5 μm is formed. As such peelable copper foil 5, for example, an ultrathin foil with carrier F-DP foil 5/35 (Furukawa Circuit Foil Co., Ltd., trade name) can be used. In addition, in this ultra thin foil with carrier, originally, only the copper foil 2 having a thickness of 35 μm is a carrier, and the ultra thin copper foil 4 having a thickness of 5 μm is used as a conductor pattern by etching or the like after the carrier is removed. However, in this embodiment, the entire ultrathin foil with carrier constitutes the carrier layer, and the ultrathin copper foil 4 having a thickness of 5 μm is not used as the conductor pattern.

  In the present embodiment, the copper foil 2 is used as the metal foil. However, the present invention is not limited to this, and aluminum foil, aluminum alloy foil, stainless steel foil, titanium foil, titanium alloy foil, copper alloy foil, etc. can be used. It is. However, from the viewpoint of cost, it is preferable to use electrolytic copper foil, electrolytic copper alloy foil, rolled copper foil or rolled copper alloy foil. Moreover, since metal foil becomes unnecessary after removal, it is preferable to use copper foil 2 or aluminum foil that can be easily recycled from the viewpoint of reducing environmental burden. Moreover, although the ultrathin copper foil 4 was used as a metal ultrathin foil, it is not limited to this, For example, nickel can also be used. However, the external connection electrode 6 is formed on the surface of the metal ultrathin foil by electroplating. However, when nickel is used as the metal ultrathin foil, it is difficult to remove the oxide on the surface. However, it is preferable to use copper.

  In the present embodiment, the copper foil 2 having a thickness of 35 μm and the ultrathin copper foil 4 having a thickness of 5 μm are used. However, the present invention is not limited to this, and the entire carrier layer is dimensioned by the load applied in the manufacturing process. It is preferable to have a minimum thickness that does not cause deformation. As a result, the circuit pattern can be accurately formed without causing dimensional deformation due to the load in the manufacturing process, and the weight of the entire printed wiring board 1 with the carrier can be suppressed, thereby improving the convenience of conveyance. For example, when the tension applied during the roll-to-roll manufacturing process is within about 50 N and the metal foil and the metal ultrathin foil are made of copper, the elastic limit of copper can be reduced if the thickness of the entire carrier layer is 18 μm or more. Although it does not exceed, since it will become difficult to wind up to a roll when it exceeds 70 micrometers, it is good to set it as 18 micrometers or more and 70 micrometers or less. In addition, in this embodiment, even when a tension of 50 N or more is applied due to a defect in the manufacturing process, it is easy to obtain a common copper foil with a copper foil next to 18 μm, so that no breakage occurs. A copper foil 2 having a thickness of 35 μm is used.

  Moreover, in this embodiment, although the thickness of the ultra-thin copper foil 4 was 5 micrometers, it is good also as 1-10 micrometers. Since the metal ultrathin foil is completely removed by etching after the metal foil is removed, the removal processing time is reduced by setting the thickness to 1 to 10 μm. Moreover, when recycling metal foil, the environmental load can be reduced by increasing the thickness of the recyclable metal foil and reducing the thickness of the metal ultrathin foil as much as possible.

  As shown in FIG. 1, an external connection electrode 6 for connecting to an external electrode is formed at a desired position on the surface of the ultrathin copper foil 4. The external connection electrode 6 is formed by laminating nickel on gold, but is not limited thereto, and for example, copper may be plated. However, from the viewpoint of solder joint reliability, it is preferably formed of gold and nickel. An insulating layer 7 having a thickness of about 50 μm is formed at a position where the external connection electrode 6 is not formed on the surface of the ultrathin copper foil 4.

  A desired wiring pattern 8 is formed on the surface of the external connection electrode 6 and the insulating layer 7 with a metal underlayer 9 interposed therebetween. The metal underlayer 9 is made of a nickel chromium alloy and has a thickness of about 0.003 μm to 0.01 μm. The wiring pattern 8 is made of copper and has a thickness of about 8 μm. The wiring pattern 8 is not limited to about 8 μm and can be designed as appropriate.

  On the surface of the wiring pattern 8, bumps 10 made of tin-silver alloy for flip chip connection are formed as electronic device connection electrodes that are electrically connected to an electronic device such as a semiconductor chip. And the bump 10 are made conductive by the wiring pattern 8. The electronic device connection electrode may not be constituted by the bumps 10, and may be, for example, a wire bonding terminal formed by gold plating.

  Next, the manufacturing method of the printed wiring board 1 with a carrier according to the present embodiment will be described with reference to FIGS. The printed wiring board 1 with a carrier according to this embodiment is manufactured by a roll-to-roll method in which a circuit pattern is formed and wound into a roll again in the process of feeding and transporting a long base material wound in a roll. The

  First, holes 11 for engaging with the roller for feeding and transporting the peelable copper foil 5 are punched at predetermined intervals at both ends in the longitudinal direction of the peelable copper foil 5 (step 1: S1).

  Next, a photosensitive coverlay 12 having a thickness of 50 μm is laminated on the surface of the peelable copper foil 5 (step 2: S2). Then, by exposing and developing the photosensitive cover lay 12 with a mask having a pattern corresponding to the external connection electrode 6, the photosensitive cover lay 12 at the position 13 where the external connection electrode 6 is formed is removed. The photosensitive cover lay 12 is completely cured by performing UV curing and heating curing (step 3: S3). Thereby, the insulating layer 7 is formed on the surface of the peelable copper foil 5. In addition, the process of the said step 2 and step 3 comprises the insulating layer formation process as described in a claim.

  Next, prior to electroplating, a protective dry film 14 is laminated on the surface of the peelable copper foil 5 opposite to the surface on which the insulating layer 7 is formed to protect the plating from adhering (step 4: S4). Then, the external connection electrode 6 is formed by plating gold and nickel by electroplating (step 5: S5). In addition, the process of this step 5 comprises the external connection electrode formation process as described in a claim.

  Next, a nickel chrome alloy and copper are sputtered on the surfaces of the external connection electrode 6 and the insulating layer 7 to form the metal underlayer 9 (step 6: S6). Thereafter, the dry film 15 is laminated on the surface of the metal underlayer 9 (step 7: S7), the pattern corresponding to the desired wiring pattern 8 is masked, and the dry film 15 is exposed and developed (step 8: S8). The metal underlayer 9 is not limited to sputtering, and may be formed by electroless plating, for example.

  Next, copper 16 is plated by electroplating (step 9: S9). Then, the dry film 15 formed on the surface of the metal underlayer 9 is removed (step 10: S10), and further, the metal underlayer 9 formed on the surface of the insulating layer 7 at the position where the dry film 15 is removed. Is removed (step 11: S11). Thereby, a desired wiring pattern 8 is formed.

  In addition, the process from the said step 6 to the step 11 comprises the wiring pattern formation process as described in a claim.

Next, the dry film 17 is laminated on the surfaces of the wiring pattern 8 and the insulating layer 7 (step 12: S12). The dry film 17 is exposed and developed with a mask having a pattern corresponding to the position where the bumps 10 are formed, and the protective dry film 14 laminated on the back surface of the peelable copper foil 5 in step 4 is exposed and developed. The bump 10 is formed by forming a tin-silver alloy layer by electroplating at the position where the dry film 17 is removed (step 13: S13). Steps 12 and 13 constitute the electronic device connection terminal forming step described in the claims.

  Thereafter, the dry film 17 and the protective dry film 14 are peeled and removed to form the printed wiring board 1 with a carrier according to the present embodiment (step 14: S14).

  The printed wiring board 1 with a carrier according to the present embodiment peels the copper foil 2 from the ultrathin copper foil 4 together with the release layer 3, and then removes the ultrathin copper foil 4 by etching, whereby a flexible printed board, flat Used as chip-on-film (COF), interposer, etc. for panel display (FPD). In addition, after removing the peelable copper foil 5, solder bumps may be formed in a matrix on the external connection electrodes 6 and connected to the external electrodes via the solder bumps.

  From the above, according to the printed wiring board 1 with a carrier according to the present embodiment, the peelable copper foil 5 is removed when used as a printed wiring board, but in the manufacturing process, Since it also functions as a material, it is not necessary to use an insulating film such as polyimide as a base material and to form holes for electrical conduction by laser processing, and it can be manufactured at low cost. Further, since the peelable copper foil 5 having a high elastic modulus is used as the carrier layer, even if a load is applied in the manufacturing process, it does not expand and contract and does not cause dimensional deformation, and the circuit pattern formation accuracy is high. Furthermore, since the printed wiring board is supported by the highly rigid peelable copper foil 5, if the carrier layer is removed after bonding an electronic device such as a semiconductor chip, the printed wiring board can be transported and electronic Easy handling during device bonding.

  Next, another embodiment of the present invention will be described with reference to FIGS. The printed wiring board 20 with a carrier according to the present embodiment has a plurality of wiring patterns, and is different from the first embodiment in that it has a wiring pattern 8 and another wiring pattern 21. In addition, the same code | symbol is attached | subjected and demonstrated to the thing same as 1st embodiment.

  As shown in FIG. 5, the printed wiring board 20 with a carrier according to the present embodiment has a peelable copper foil 5 in which an ultrathin copper foil 4 is bonded to a copper foil 2 via a release layer 3 as a carrier layer. An external connection electrode 6 in which nickel is laminated on copper is formed at a desired position on the surface of the ultrathin copper foil 4. An insulating layer 7 is formed at a position where the external connection electrode 6 is not formed on the surface of the ultrathin copper foil 4.

  A wiring pattern 8 made of copper is formed on the surfaces of the external connection electrode 6 and the insulating layer 7 via a metal base layer 9 made of a nickel chromium alloy. On the surface of the wiring pattern 8 and the insulating layer 7, another wiring pattern 21 made of copper and connected to the wiring pattern 8 at a predetermined location is formed via a metal base layer 25 made of nickel-chrome alloy. In a place where the wiring pattern 8 and the other wiring pattern 21 are not connected, another insulating layer 22 is interposed between the wiring pattern 8 and the other wiring pattern 21.

  A bump 10 made of tin-silver alloy is formed on the surface of another wiring pattern 21, and the external connection electrode 6 and the bump 10 are electrically connected by the wiring pattern 8 and the other wiring pattern 21. ing.

  Next, a method for manufacturing the printed wiring board 20 with a carrier according to the present embodiment will be described with reference to FIGS. Since the manufacturing method of the printed wiring board 20 with a carrier according to the present embodiment is common in steps 1 to 11 of the manufacturing method of the printed wiring board 1 with a carrier according to the first embodiment, the description thereof is omitted. To do.

  A photosensitive coverlay 23 is laminated on the surfaces of the wiring pattern 8 and the insulating layer 7 (step 121: S121). Then, a pattern mask corresponding to the connection portion 24 between the wiring pattern 8 and the other wiring pattern 21 is used, and the photosensitive coverlay 23 is exposed and developed, whereby the wiring pattern 8 and the other wiring pattern 21 are The photosensitive cover lay 23 at the connection portion 24 is removed, and further, the photosensitive cover lay 23 is completely cured by performing UV curing and heating curing (step 122: S122). As a result, another insulating layer 22 is formed on the surfaces of the wiring pattern 8 and the insulating layer 7. In addition, the said step 121 and step 122 comprise the other insulating layer formation process as described in a claim.

  Next, a nickel chrome alloy and copper are sputtered on the surface of the wiring pattern 8 and the other insulating layer 22 to form the metal underlayer 25 (step 123: S123). Thereafter, the dry film 26 is laminated on the surface of the metal base layer 25 (step 124: S124), a mask having a pattern corresponding to the desired wiring pattern 8 is exposed, and the dry film 26 is exposed and developed (step 125: S125).

  Next, copper 27 is plated by electroplating (step 126: S126). Then, the dry film 26 formed on the surface of the metal base layer 25 is removed (step 127: S127), and the metal layer formed on the surface of the other insulating layer 22 is further removed at the position where the dry film 26 is removed. The formation 25 is removed (step 128: S128). Thereby, another wiring pattern 21 is formed.

  In addition, the process from the said step 123 to step 128 comprises the other wiring pattern formation process as described in a claim.

Next, the dry film 28 is laminated on the surface of the other wiring pattern 21 and the other insulating layer 22 (step 129: S129). The dry film 26 is exposed and developed with a mask having a pattern corresponding to the position where the bumps 10 are formed, and the protective dry film 14 laminated on the back surface of the peelable copper foil 5 in step 4 is exposed and developed. The bump 10 is formed by forming a tin-silver alloy layer by electroplating at the position where the dry film 26 is removed (step 130: S130). Note that step 129 and step 130 constitute the electronic device connection terminal forming step described in the claims.

  Thereafter, the dry film 28 and the protective dry film 14 are peeled and removed, whereby the printed wiring board 20 with a carrier according to the present embodiment is formed (step 131: S131).

  In the present embodiment, the two wiring patterns 8 and 21 are stacked. However, the present invention is not limited to this, and the same process as the process from step 121 to step 128 is repeated and formed on the outermost layer. An electronic device connection terminal may be formed at a predetermined position of the wiring pattern by a process similar to step 129 and step 130. Thus, by laminating a plurality of wiring patterns, complicated wiring is possible, and the degree of design freedom is increased.

It is sectional drawing which showed typically the structure of one Embodiment of the printed wiring board with a carrier which concerns on this invention. It is a figure which shows to the external connection electrode formation process of the manufacturing method of the printed wiring board with a carrier of FIG. It is a figure which shows to the wiring pattern formation process after the external connection electrode formation process of the manufacturing method of the printed wiring board with a carrier of FIG. It is a figure which shows the process after the wiring pattern formation process of the manufacturing method of the printed wiring board with a carrier of FIG. It is sectional drawing which showed typically the structure of other embodiment of the printed wiring board with a carrier which concerns on this invention. It is a figure which shows to the first half (step 125) of the other wiring pattern formation process after the wiring pattern formation process of the manufacturing method of the printed wiring board with a carrier of FIG. It is a figure which shows the second half (step 126 to step 128) of the other wiring pattern formation process of the manufacturing method of the printed wiring board with a carrier of FIG. It is a figure which shows the process after the second half (step 126 to step 128) of the other wiring pattern formation process of the manufacturing method of the printed wiring board with a carrier of FIG.

Explanation of symbols

1,20 Printed wiring board with carrier 2 Copper foil 3 Release layer 4 Ultrathin copper foil 5 Peelable copper foil 6 External connection electrode 7 Insulating layer 8 Wiring pattern 9, 25 Metal base layer 10 Bump 21 Other wiring pattern 22 Other insulation layer

Claims (8)

A carrier layer comprising a metal foil and a metal ultrathin foil that are electrically conductive and adhered to each other so as to be peelable from each other is used as a substrate of a printed wiring board with a carrier, and the substrate is roll-to-roll.
The components of the printed wiring board with a carrier on the surface of the base material
A method of manufacturing a printed wiring board with a carrier, forming a material,
Insulation that forms an insulating layer using patterning on the surface of the metal ultrathin foil as a base material
An insulating layer forming step of forming the insulating layer only at a position where an external connection electrode for connecting to an external electrode on the surface side of the insulating layer to be formed is formed,
External connection electrode formation step of forming the external connection electrode by electroplating at a position where the insulating layer is not formed on the surface of the ultrathin metal foil,
After forming a metal underlayer on the surfaces of the insulating layer and the external connection electrode, a metal layer is formed on the surface of the metal underlayer by electroplating, and the metal underlayer and the metal layer at predetermined positions are removed. A wiring pattern forming step of forming a wiring pattern,
An electronic device connection electrode forming step of forming an electronic device connection electrode that is electrically connected to the electronic device at a predetermined position of the wiring pattern. A carrier layer comprising a metal foil and a metal ultrathin foil that are electrically conductive and adhered to each other so as to be peelable from each other is used as a substrate of a printed wiring board with a carrier, and the substrate is roll-to-roll.
The components of the printed wiring board with a carrier on the surface of the base material
A method of manufacturing a printed wiring board with a carrier, forming a material,
Insulation that forms an insulating layer using patterning on the surface of the metal ultrathin foil as a base material
An insulating layer forming step of forming the insulating layer only at a position where an external connection electrode for connecting to an external electrode on the surface side of the insulating layer to be formed is formed,
External connection electrode formation step of forming the external connection electrode by electroplating at a position where the insulating layer is not formed on the surface of the ultrathin metal foil,
After forming a metal underlayer on the surfaces of the insulating layer and the external connection electrode, a metal layer is formed on the surface of the metal underlayer by electroplating, and the metal underlayer and the metal layer at predetermined positions are removed. A wiring pattern forming step of forming a wiring pattern,
On the surface of the wiring pattern and the insulating layer, except for the connection portion between the wiring pattern and another wiring pattern, another insulating layer forming step of forming another insulating layer;
After forming a metal underlayer on the surface of the wiring pattern and the other insulating layer, a metal layer is formed on the surface of the metal underlayer by electroplating, and the metal underlayer and the metal layer at predetermined positions are formed. Another wiring pattern forming step of removing and forming the other wiring pattern;
An electronic device connection electrode forming step for forming an electronic device connection electrode that is electrically connected to an electronic device at a predetermined position of the other wiring pattern. The carrier layer, the manufacturing method of the carrier with the printed circuit board according to claim 1 or claim 2, characterized in that it has a thickness that does not cause dimensional variations due Oite load applied to the production of the printed wiring board with a carrier . Wherein the metal foil and the metal electrode thin foil, claims 1 to 3, characterized in that it consists of copper
The manufacturing method of the printed wiring board with a carrier in any one of. The carrier layer may claim, wherein the thickness is 18μm or more 70μm or less 4
The manufacturing method of the printed wiring board with a carrier of description. The metal ultrathin foil, claim from claim 1, wherein the thickness of 1 to 10 [mu] m 5
The manufacturing method of the printed wiring board with a carrier of any one of these. The electronic device connection electrode is a metal bump.
7. A method for manufacturing a printed wiring board with a carrier according to any one of 6 above. Any of claims 1 to 7, characterized in that the wiring pattern and stacked 1
The manufacturing method of the printed wiring board with a carrier of claim | item.

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