JP4954631B2 - Method for manufacturing power insulating device, power insulating device and insulating film - Google Patents

Description

  The present invention relates to a method for forming an insulating layer at a place to be insulated, such as a conductor of a power insulating device made of gas insulation or solid insulation, a power insulating device having an insulating layer formed thereon, and an insulating film. .

Conventionally, gas insulation equipment (hereinafter also referred to as C-GIS) using the excellent insulation characteristics of sulfur hexafluoride gas (SF ₆ ) has been used in substations and the like for stable power supply. It was.
However, the sulfur hexafluoride gas was designated as an emission reduction target gas at the Kyoto Conference on Global Warming Prevention (COP3) held in December 1997. For this reason, the insulation apparatus which used gas, such as air, nitrogen gas, or a carbon dioxide gas, as an insulating medium instead of sulfur hexafluoride gas came to be provided.
In addition, solid insulation equipment (hereinafter also referred to as SIS), in which a vacuum circuit breaker or vacuum disconnector is integrally molded with epoxy resin, has been developed and used without using alternative gas. Yes.

  In Patent Document 1, for example, a gas-insulated pipe bus is described as C-GIS. Examples of the bus bar include a single-layer pipe bus bar configured by housing one high-voltage conductor in a metal container, and a three-phase channel bus bar configured by storing three high-voltage conductors. In both cases, an insulating gas such as sulfur hexafluoride gas is enclosed in a metal container, and a high voltage conductor is provided in the inside via an insulating spacer. The insulating spacer is provided with an insulating coating such as an oxide coating by anodizing or an epoxy coating on the surface of the high voltage shield of the insulating spacer.

Patent Document 2 describes a gas insulating device provided with an insulating layer in which a plurality of insulating films are wound around a surface of a high-voltage conductor while providing a gap that is equal to or greater than the thickness of the film and 1 mm or less.
Patent Document 3 discloses a high-voltage conductor that is covered with an insulating film by being wound with an insulating film, and the curved portion and the connecting portion of the high-voltage conductor and their peripheral portions are wound with a thermoplastic elastomer film. A gas static induction machine having a high voltage conductor comprising an insulating coating is described.
Since it is preferable to insulate the surface of the high-voltage conductor, the insulating film described in Patent Document 2 and the stationary gas induction apparatus described in Patent Document 3 both cause the insulating film to deviate from the conductor. In order to prevent this, a gap such as embossing is formed on the film surface.

Furthermore, Patent Document 4 describes the following insulating film for electric equipment and gas-insulated electric equipment.
The insulating film for electrical equipment is formed by applying an adhesive on the insulating film in a checkered pattern, wherein each dot constituting the pattern is surrounded by eight dots and the center of each dot. And four straight lines connecting the centers of the eight adjacent dots are formed so as to be inclined with respect to the length direction of the insulating base material. The gas-insulated electric device uses this insulating film for electric devices.
The said insulating film for electrical devices forms the unevenness | corrugation in the surface similarly to the above-mentioned patent document 2 and patent document 3 by using an adhesive agent, and prevents the shift | offset | difference from the conductor in the said gas insulated electrical device. In addition, the occurrence of unevenness on the outer periphery is suppressed, adhesion strength is ensured, and air passages are formed between the films, so that the space is sufficiently spread over the space where the gas is formed to improve the insulation.
JP 62-163506 A Japanese Patent Laid-Open No. 2-16705 Japanese Patent Laid-Open No. 11-176657 JP 2004-193410 A

  Insulating films described in Patent Documents 2, 3, and 4 are provided with a gap by embossing or an adhesive on the film surface in order to prevent deviation from the conductor during transportation, etc. There is a tendency to decrease. In order to prevent this deterioration of the insulating property, an insulating gas is introduced into the gap portion to insulate with the insulating gas, but the insulating property of the gap portion is lower than that of the other portions. Today, it is difficult to use sulfur hexafluoride gas having excellent insulating performance, and the deterioration of the insulating property of the gap portion is one of the problems to be solved.

In addition, high-voltage power insulation equipment that requires higher voltage tends to be larger because it requires high insulation performance, so there is a strong demand for downsizing, but gas insulation that does not use sulfur hexafluoride gas, which has excellent insulation performance. For example, insulation with nitrogen is inferior in insulation performance. For this reason, the insulation apparatus for electric power must increase the capacity | capacitance of insulating gas in order to ensure insulation performance, and will be enlarged.
Recently developed resin molding technology that integrally molds metal and resin can provide a molded product with excellent insulation performance. However, resin molding technology cannot be used for all parts.

  The problem to be solved by the present invention is that a method for manufacturing a power insulating device that can efficiently form an insulating layer without contributing to the downsizing of the device without employing sulfur hexafluoride gas and It is to provide a power insulation device.

  As a result of intensive studies to solve the above problems, the present inventor has found that an insulating layer including an insulating fiber layer or a powder coating can be used to form a simple and highly reliable insulating layer. It came to be completed. That is, the present invention provides the following method for manufacturing a power insulating device, power insulating device, and insulating film.

1st invention of this application concerns on the manufacturing method of the electric power insulation apparatus which forms an insulating layer in the surface of the component of the electric power insulation apparatus which consists of conductor materials.
The insulating layer includes an insulating film, and the insulating film includes a base film and an adhesive layer formed on one side of the base film, and a fiber layer made of insulating fibers on the other side. The adhesive layer is formed by impregnating an adhesive composed of an epoxy resin composition in the adhesive layer into the fiber layer by heating and pressurizing the adhesive layer, and curing the impregnated adhesive. .

Here, “insulating equipment for power” refers to buses in substations, main circuit conductors in power disconnectors and power circuit breakers, and the like. The power circuit breaker includes a gas insulator and a vacuum circuit breaker.
As the “base film”, a synthetic resin film having no electrical conductivity is used.
Examples of the material film include polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polyimide, polyamide, polyamideimide, polyetherimide, polyethersulfone, liquid crystal polymer, polyphenylene sulfide, polyetheretherketone, polyolefin, and polycarbonate. , Triacetyl cellulose, cellophane, aramid paper, insulating paper and the like.

The “fiber layer” is provided to ensure the overall thickness and strength of the insulating layer. If the base film constituting the insulating film is thickened, the insulating layer is also thickened. However, since the thick film has high rigidity, it is difficult to fix the insulating film to the component parts of the power insulating device.
As the “fiber layer”, since insulating properties are required, synthetic resin or glass fiber is used. As a synthetic resin, what made the material of the base film of an insulating film into the fiber form is mentioned.

  The “adhesive layer” is a layer containing an adhesive that can reliably adhere the surface of the component parts of the power insulating device and the insulating film, and if the fiber layer is provided, has an impregnation property to the fiber layer. It is. For example, an adhesive sheet mainly composed of an epoxy resin.

The insulating film is fixed to the surface of the component of the power insulating device by an adhesive layer formed on one side or both sides of the base film, or is fixed to the lower base film by winding.
By heating the adhesive layer, the adhesive layer component is impregnated into the fiber layer, and the adhesive layer and the fiber layer are integrated to improve insulation and durability.

The first invention of the present application can also be formed as follows.
That is, the insulating layer is formed including a coating layer by powder coating.
The said insulating layer is good also as forming the coating layer by a powder coating, after fixing an insulating film on the surface of the component of the electric power insulation apparatus.

With “powder coating”, generally used powder coating technology is employed. Insulating properties are required for coating materials such as powders, curing agents, and fillers.
When a film layer is formed on the surface of a component part of a power insulating device and powder coating is performed on the film layer, electrostatic coating is generally used.
When powder coating is performed on the surface of components of power insulation equipment and a film layer is formed on the coating layer, electrostatic coating or fluidized immersion coating should be used for powder coating. Can do.

  Powder coating has high workability and economical efficiency, and a thickness of about 500 μm can be secured relatively easily, but its thickness nonuniformity and the presence of pinholes are disadvantageous. The drawback can be compensated by an insulating film layer superimposed on the powder coating. This is because the film layer has a uniform thickness and does not have pinholes. In addition, the disadvantage that the number of turns must be increased only by the film layer can be compensated by the combined use with the powder coating.

  About 2nd invention of this application, it can also be provided with the fiber layer which consists of an insulating fiber with respect to a film layer.

About 1st or 2nd invention, it is desirable that an insulating film shall be 100 micrometers or more in thickness.
The insulating film does not need to have a thickness of 100 μm or more alone, and the total of the base film and the adhesive layer or the total of the base film, the adhesive layer, and the fiber layer may be 100 μm or more.
This is because if the thickness is less than 100 μm, the number of windings must be increased in order to ensure necessary insulation performance (for example, a thickness of 1000 μm or more), resulting in poor workability.

The second invention relates to a power insulating device in which an insulating layer is formed on the surface of a component made of a conductive material.
That is, the insulating layer includes an insulating film, and the insulating film includes a base film and an adhesive layer formed on one side of the base film, and a fiber made of insulating fibers on the other side. The adhesive layer is formed by impregnating the adhesive made of the epoxy resin composition in the adhesive layer into the fiber layer by heating and pressing, and curing the impregnated adhesive. It is characterized by.

In the second invention, the insulating layer may be formed including a coating layer by powder coating .

  About the 4th invention of this application, it can also be provided with the fiber layer which consists of an insulating fiber with respect to a film layer.

  About 3rd or 4th invention, it is desirable that an insulating film shall be 100 micrometers or more in thickness.

ADVANTAGE OF THE INVENTION According to this invention, even if it does not employ | adopt sulfur hexafluoride gas, the insulating layer can be formed efficiently, and the manufacturing method of the electric power insulation apparatus which contributes also to size reduction of an apparatus, and the electric power insulation apparatus Could be provided. In addition, the use of insulating gas such as sulfur hexafluoride gas, carbon dioxide gas, and nitrogen gas could be reduced by downsizing the equipment.
Since there is no need to provide an embossed or adhesive gap on the surface of the insulating film, the insulating film manufacturing process or the adhesive layer forming process is simplified.

  Hereinafter, although the manufacturing method of the electric power insulation apparatus of this invention and the best form for implementing the electric power insulation apparatus are demonstrated concretely, this invention is not limited to the following forms.

[Method of manufacturing power insulation equipment, power insulation equipment]
FIG. 1 is a cross-sectional view schematically showing one embodiment of a power insulating device.
The power insulating device 1 according to this embodiment includes a bus 2, a disconnector 3, a circuit breaker 4, a cable connection 6, and a current transformer 7. The bus 2, the disconnector 3, the circuit breaker 4, and the current transformer 7 are connected by a conductor.
Although the bus bar 2, the disconnector 3, the circuit breaker 4, and the cable connection portion 6 are provided with an insulating layer, the insulating layer may be disposed on other members.

  In the method for manufacturing a power insulating device according to this embodiment, a method for manufacturing the bus 2, the disconnector 3, the circuit breaker 4, the cable connection 6, the current transformer 7, and the like, and a power insulating device using these There is no particular limitation on the method for manufacturing the device, and a known manufacturing method can be used as a method for manufacturing a power insulating device. Moreover, the component of the electric power insulation apparatus of this embodiment is not limited to the said bus-bar 2, the disconnector 3, etc., You may have another well-known component.

The insulating layer provided on the bus 2, the disconnector 3, the circuit breaker 4, and the cable connecting portion 6 is formed as follows.
First, it is a method of fixing an insulating film to a portion requiring insulation in the bus 2, the disconnector 3, the circuit breaker 4, and the cable connecting portion 6.
Second, after powder coating is applied to the bus 2, the disconnector 3, the circuit breaker 4, and the cable connecting portion 6, an insulating film is further fixed to the surface of the powder coating.
Hereinafter, each component for forming an insulating layer is demonstrated.

[Insulating film]
The aforementioned insulation film is
(1) Method of using a base film as an insulating film as it is (2) Method of having an adhesive layer on at least one side of the base film (3) Adhesive layer and glass fiber or synthetic resin fiber on at least one side of the base film For example, there is a method of sequentially laminating a fiber layer composed of the like.

Examples of the base film include polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polyimide, polyamide, polyamideimide, polyetherimide, polyethersulfone, liquid crystal polymer, polyphenylene sulfide, polyetheretherketone, polyolefin, and polycarbonate. , Triacetyl cellulose, cellophane, aramid paper, insulating paper and the like.
The thickness of the base film is about 100 to 350 μm from the viewpoint of workability when the base film is used alone as an insulating film. This is because it is difficult to fix to parts that require insulation, whether it is lower or higher than this range.
In the case of using an adhesive layer or the like, the thickness of the base film is preferably about 4 to 250 μm.
The thickness of the base film may be appropriately selected depending on the device for forming the insulating layer.In the case of a conductor of an insulating bus, since the diameter of the conductor is small, select a thin object as easy as possible to wind, When insulating the surface of a circuit breaker or an insulated bus container, a relatively thick material may be used.

  It is desirable that the insulating film to be employed has an insulation performance with a dielectric breakdown voltage of 10 kV or higher, preferably 13 kV or higher, more preferably 15 kV or higher. This is because, in the present invention, it is desirable to obtain an insulation performance equal to or higher than that of the prior art in which the insulating gas is wound without winding an insulating gas between the wound insulating films.

[Adhesive layer]
The adhesive layer adheres the base film to a high voltage conductor or inside and / or outside of a gas enclosure, a circuit breaker, a disconnector, a gas insulation transformer, a gas insulation switch, a solid insulation switch, or the like. To do. As such an adhesive, an epoxy-based, urethane-based, or silicone-based thermosetting adhesive can be used, but an epoxy-based adhesive is preferably used. This is because the insulating properties of the base film can be improved.
The epoxy adhesive is composed of an epoxy resin composition composed of components such as an epoxy resin, a curing agent, and a curing accelerator used as required, a filler, a pigment, an anti-sagging agent, and a leveling agent.

〔Epoxy resin〕
Examples of the epoxy resin used in the epoxy resin composition include bisphenol A type epoxy resin, bisphenol F type epoxy resin, phenol novolac type or cresol novolac type epoxy resin, alicyclic epoxy resin, hydrogenated bisphenol A type or AD type epoxy. Resin, aliphatic epoxy resin such as propylene glycol diglycidyl ether, pentaerythritol polyglycidyl ether, epoxy resin obtained from aliphatic or aromatic carboxylic acid and epichlorohydrin, epoxy obtained from aliphatic or aromatic amine and epichlorohydrin Examples thereof include resins, heterocyclic epoxy resins, spiro ring-containing epoxy resins, epoxy-modified resins, bisphenol S-type epoxy resins, and biphenol-type epoxy resins.
These epoxy resins can be used alone or in combination of two or more.

[Curing agent]
A curing agent is used for the epoxy resin composition. Examples of the curing agent used include curing agents conventionally used for epoxy resin compositions, such as acid anhydrides, imidazoles, phenolic compounds, and amides. Examples of these curing agents include acid anhydrides, amines, imidazoles, dihydrogins, Lewis acids, Bronsted acid salts, polymercaptons, isocyanates, blocked isocyanates, and phenol resins. Of these, phenol resins are preferred. Examples of the phenol resin include bisphenol A, bisphenol F, bisphenol S, 4,4′-biphenylphenol, 2,2′-methylene-bis (4-methyl-6-tert-butylphenol), 2,2′- Methylene-bis (4-ethyl-6-tert-butylphenol), 4,4′-butylene-bis (3-methyl-6-tert-butylphenol), 1,1,3-tris (2-methyl-4-hydroxy) -5-tert-butylphenol), trishydroxyphenylmethane, pyrogallol, phenols having a diisopropylidene skeleton, phenols having a fluorene skeleton such as 1,1-di-4-hydroxyphenylfluorene, and polyphenols such as phenolized polybutadiene Compound, phenol, cresols , Novolak resins made from various phenols such as ethylphenols, butylphenols, octylphenols, bisphenol A, bisphenol F, bisphenol S, naphthols, xylylene skeleton-containing phenol novolac resins, dicyclopentadiene skeleton-containing phenol novolak resins, fluorenes Examples thereof include novolak resins such as skeleton-containing phenol novolac resins.
Among the above, amides and acid anhydrides are preferable from the viewpoints of heat resistance and adhesiveness.

  The mixing ratio of the epoxy resin and the curing agent is in the range of 100: 0.5 to 100: 7 by mass ratio. When the proportion of the epoxy resin is larger than this range, for example, even when heated at 200 ° C. for 30 minutes, the adhesive layer is not sufficiently cured, and the properties of the coating film as the insulating layer are deteriorated or the adherend such as a conductor is adhered. The adhesiveness may decrease. On the other hand, when the proportion of the epoxy resin is smaller than this range, the storage stability is lowered and the curing is too fast, so that the smoothness of the insulating layer surface may be lowered.

[Other ingredients]
If necessary, other additives can be added to the epoxy resin composition. Examples of the additive include phosphorus compounds such as triphenylphosphine, such as triethylamine, tetraethanolamine, 1,8-diaza-bicyclo [5.4.0] -7-undecene (DBU), N, N-dimethyl. Tertiary amine compounds such as benzylamine, 1,1,3,3-tetramethylguanidine, 2-ethyl-4-methylimidazole, N-methylpiperazine, various imidazoles, various imidazoles and polyvalent carboxylic acids And a curing accelerator composed of salts thereof, amides, diaza compounds and their and phenols, salts of the polyvalent carboxylic acids or phosphinic acids, phosphines, phenols and the like.
Examples of the various imidazoles include 2-methylimidazole, 2-phenylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-phenylimidazole, 1- Benzyl-2-methylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazole, 2,4-diamino-6 (2′-methylimidazole (1 ')) Ethyl-s-triazine, 2,4-diamino-6 (2'-undecylimidazole (1')) ethyl-s-triazine, 2,4-diamino-6 (2'-ethyl, 4- Methylimidazole (1 ′)) ethyl-s-triazine, 2,4-diamino-6 (2 '-Methylimidazole (1')) ethyl-s-triazine-isocyanuric acid adduct, 2-methylimidazole isocyanuric acid 2: 3 adduct, 2-phenylimidazole isocyanuric acid adduct, 2-phenyl-3,5- Examples thereof include dihydroxymethylimidazole, 2-phenyl-4-hydroxymethyl-5-methylimidazole, 1-cyanoethyl-2-phenyl-3,5-dicyanoethoxymethylimidazole and the like.

Examples of the polyvalent carboxylic acid in the salts of various imidazoles and polyvalent carboxylic acids include aromatic polyvalent carboxylic acids such as phthalic acid, isophthalic acid, terephthalic acid, trimellitic acid, pyromellitic acid, and naphthalenedicarboxylic acid. And aliphatic polycarboxylic acids such as maleic acid and succinic acid.
Examples of the amides include dicyandiamide. Examples of the diaza compound include 1,8-diaza-bicyclo (5.4.0) undecene-7. Examples of phosphines include triphenylphosphine and tetraphenylphosphonium tetraphenylborate. Examples of phenols include 2,4,6-trisaminomethylphenol.

Preferable examples of these curing accelerators include various imidazoles, salts of various imidazoles and polyvalent carboxylic acids, and phosphines. Preferred imidazoles include, for example, 2,4-diamino-6 (2′-methylimidazole (1 ′)) ethyl-s-triazine, 2,4-diamino-6 (2′-undecylimidazole (1 ′)). Ethyl-s-triazine, 2,4-diamino-6 (2′-ethyl, 4-methylimidazole (1 ′)) ethyl-s-triazine, 2,4-diamino-6 (2′-methylimidazole (1 ′) )) Imidazolylethyl-s-triazines such as ethyl-s-triazine / isocyanuric acid adducts, 2: 3 adducts of 2-methylimidazole isocyanuric acid, alkyls or allylimidazoles such as 2-phenylimidazole isocyanuric acid adducts Examples include isocyanuric acid adducts.
Moreover, as preferable imidazoles in salts of various imidazoles and polyvalent carboxylic acids, for example, 2-methylimidazole, 2-phenylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 2-phenyl-4-methyl Examples include imidazole, 1-benzyl-2-phenylimidazole, 1-benzyl-2-methylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazole, and the like. It is done. Examples of preferable polyvalent carboxylic acids include aromatic polyvalent carboxylic acids such as terephthalic acid, trimellitic acid, and pyromellitic acid. Examples of phosphines include triphenylphosphine and tetraphenylphosphonium tetraphenylborate.

  Further preferred curing accelerators include, for example, 2-undecylimidazole terephthalate, trimellitic acid salt or pyromellitic acid salt, 2-heptadecylimidazole terephthalic acid salt, trimellitic acid salt or pyromellitic acid salt, 2 Terephthalate, trimellitic acid or pyromellitic acid salt of phenyl-4-methylimidazole, 1-benzyl-2-phenylimidazole, terephthalic acid salt of 1-benzyl-2-methylimidazole, trimellitic acid salt or pyro Examples include merit acid salts and triphenylphosphine.

Other additives include plasticizers such as natural waxes, synthetic waxes and metal salts of long-chain aliphatic acids, release agents such as acid amides, esters and paraffins, nitrile rubber, butadiene rubber, etc. Inorganic flame retardants such as antimony trioxide, antimony pentoxide, tin oxide, tin hydroxide, molybdenum oxide, zinc borate, barium metaborate, red phosphorus, aluminum hydroxide, magnesium hydroxide, calcium aluminate, Brominated flame retardants such as tetrabromobisphenol A, tetrabromophthalic anhydride, hexabromobenzene, brominated phenol novolak, silane coupling agents, titanate coupling agents, coupling agents such as aluminum coupling agents, fused silica , Crystalline silica, low alpha silica, glass flakes, glass beads, Las balloon, talc, alumina, calcium silicate, aluminum hydroxide, calcium carbonate, barium sulfate, magnesia, silicon nitride, boron nitride, ferrite, rare earth cobalt, gold, silver, nickel, copper, lead, iron powder, iron oxide , Metal powders such as iron sand, graphite, carbon, petals, inorganic fillers such as yellow lead or conductive particles, colorants such as dyes and pigments, carbon fibers, glass fibers, boron fibers, silicon carbide fibers, alumina fibers , Inorganic fiber such as silica alumina fiber, organic fiber such as aramid fiber, polyester fiber, cellulose fiber, carbon fiber, oxidation stabilizer, light stabilizer, moisture resistance improver, thixotropy imparting agent, diluent, antifoaming agent And various other resins, tackifiers, antistatic agents, lubricants, ultraviolet absorbers and the like.
Among them, the silane coupling agent is preferably used in terms of adhesion between the epoxy resin and the filler. Moreover, it is preferable to use aluminum hydroxide etc. when providing a flame retardance and flow resistance.

The mixing ratio of the curing accelerator used as desired is usually 0.01 to 5 parts by mass, preferably 0.05 to 3 parts by mass, and more preferably 0.1 to 2 parts by mass with respect to 100 parts by mass of the epoxy resin. The range of is preferable.
As the filler, silica and alumina are advantageous in terms of insulation. The blending ratio of the filler is preferably in the range of 10 to 60% by mass in the epoxy resin composition. The filler having a number average particle diameter of 0.01 to 30 μm is preferably used in terms of adhesion to the adherend. In addition, the filler is preferable because it is advantageous in terms of insulation by adjusting the particle size.

The adherend (in this embodiment, the bus 2, the disconnector 3, the circuit breaker 4, and the cable connecting portion 6) for fixing the insulating layer is not composed of the same material but composed of two or more materials. In such a case, it is preferable to add a phenolic hydroxyl group-containing aromatic polyamide-polybutadiene-acrylonitrile copolymer to the epoxy resin composition.
The reason for this is as follows. That is, as will be described later with reference to FIG. 2, the insulator is composed of parts such as metal, ceramic, and silver wax. Moreover, the conductor which consists of a metal is provided in the metal container via the insulating spacer. For this reason, since each material has a different coefficient of thermal expansion, even if an insulating layer is formed on the surface, a gap may be generated between the adhesive layer and the adherend due to temperature conditions. It is not preferable that the insulating properties are lowered by the voids.

（式中、ｘ、ｙ、ｚ、ｌ、ｍ及びｎは、それぞれ平均重合度であって、ｘ＝３〜７、ｙ＝１〜４、ｚ＝５〜１５、ｌ＋ｍ＝２〜２００の整数をそれぞれ示し、ｍ／（ｌ＋ｍ）≧０．０４である。）で示される共重合体である。 The phenolic hydroxyl group-containing aromatic polyamide-polybutadiene-acrylonitrile copolymer is a dicarboxylic acid component having a phenolic hydroxyl group-containing aromatic polyamide-polybutadiene-acrylonitrile copolymeric hydroxyl group, such as 5-hydroxyisophthalic acid, 4-hydroxy Isophthalic acid, 2-hydroxyphthalic acid, 3-hydroxyphthalic acid, 2-hydroxyterephthalic acid, dicarboxylic acids having no phenolic hydroxyl group include phthalic acid, isophthalic acid, terephthalic acid, dicarboxyl naphthalene, succinic acid, fumaric acid , Glutaric acid, adipic acid, 1,3-dichlorohexanedicarboxylic acid, 4,4′-diphenyldicarboxylic acid, 3,3′-methylenedibenzoic acid and the like diamines such as 3,3′-diamine-4 , 4'-Dihydroxyfe Nylmethane, 2,2-bis (3-amino-4-hydroxyphenyl) hexafluoropropane, 2,2-bis (3-amino-4-hydroxyphenyl) difluoromethane, 3,4-diamino-1,5-benzenediol 3,3′-dihydroxy-4,4′-diaminobisphenyl, 3,3′-diamino-4,4′-dihydroxybiphenyl, 2,2-bis (3-amino-4-hydroxyphenyl) ketone, 2, , 2-bis (3-amino-4-hydroxyphenyl) sulfide, 2,2-bis (3-amino-4-hydroxyphenyl) ether, 2,2-bis (3-amino-4-hydroxyphenyl) sulfone, 2,2-bis (3-amino-4-hydroxyphenyl) propane, 2,2-bis (3-hydroxy-4-aminophenyl) propane, 2 Diamines containing no phenolic hydroxyl group such as 2-bis (3-hydroxy-4-aminophenyl) methane, 3,3′-diaminodiphenyl ether, 3,4′-diaminodiphenyl ether, 4,4′-diaminodiphenyl ether, diamino Naphthalene, piperazine, hexanetylenediamine, tetramethylenediamine, m-xylenediamine, 4,4'-diaminodiphenylmethane, 4,4'-diaminobenzophenone, 2,2'-bis (4-aminophenyl) propane, 3, 3'-diaminodiphenylsulfone, 3,3'-diaminodiphenyl, etc. are added and these are represented by N-methyl-2-pyrrolidone, for example, using a condensing agent in the presence of phosphite and pyridine derivatives. In an inert atmosphere such as nitrogen in an organic solvent Heating and stirring Te, by performing condensation reaction, the polyamide containing a phenolic hydroxyl group - polybutadiene - to produce acrylonitrile copolymer.
Among them, it is preferable to use a compound represented by the following formula (Formula 1).

(Wherein, x, y, z, l, m and n are average polymerization degrees, and x = 3 to 7, y = 1 to 4, z = 5 to 15, and l + m = 2 to 200 integers. And m / (l + m) ≧ 0.04.).

  This is necessary for imparting flexibility and adhesiveness, and by adding it, flexibility can be imparted to the cured product and at the same time the adhesive strength with the conductor or the like can be increased. The blending ratio of the phenolic hydroxyl group-containing aromatic polyamide-polybutadiene-acrylonitrile copolymer is preferably in the range of 5 to 300 parts by mass with respect to 100 parts by mass of the total amount of the epoxy resin and the curing agent. If there is less phenolic hydroxyl group-containing aromatic polyamide-polybutadiene-acrylonitrile copolymer than this range, flexibility and adhesiveness will decrease, and if it exceeds this range, the electrical properties and handling properties when varnished will be reduced. It is not preferable. A particularly preferable blending ratio is in the range of 10 to 150 parts by mass from the viewpoints of flexibility, adhesiveness, electrical characteristics, and handling properties in varnish.

  The other components used as desired may be used alone or in combination of two or more. Furthermore, each main component such as a curing accelerator, a filler, and a flame retardant can be used in combination according to the physical properties of the insulating layer to be obtained.

The thickness of the adhesive layer is 1 μm or more, preferably 5 to 50 μm, more preferably 10 to 35 μm. By providing the adhesive layer, the total thickness (base film + adhesive layer) can be made thicker than when the film is used alone, so a thick and highly insulating layer can be obtained with a small amount of winding. be able to.
The insulating film has various structures depending on the method for forming the insulating layer. The insulating film when powder coating is not used for forming the insulating layer is (1) an adhesive layer provided on both sides of the base film, and (2) the surface of at least one adhesive layer of (1) above. The thing provided with the fiber layer which consists of insulating fibers, (3) The thing which provided the adhesive bond layer on the single side | surface of the base film, and also provided the fiber layer on it etc. are mentioned. In the case of using powder coating, the insulating film is (a) only the base film, (b) an adhesive layer provided on one side of the base film, and (c) to (e) the powder coating described above. The thing similar to the insulating films (1)-(3) in the case of not doing is mentioned.

[Fiber layer]
As the insulating film for forming the insulating layer of the present invention, a fiber layer may be provided between the adhesive layer and the adherend. As the fiber layer, for example, it is a layer made of synthetic resin fiber or glass fiber. By heating the adhesive layer, the adhesive layer component is impregnated into the fiber layer, and the adhesive layer and the fiber layer are integrated. Insulation and durability can be improved. Examples of the synthetic resin fiber used at this time include a fiber made of the synthetic resin constituting the above-described insulating film.
In this case, the total thickness (base film + adhesive layer + fiber layer) can be further increased by providing the fiber layer as compared with the case where the fiber layer is not provided. High insulation can be obtained with a small amount of winding.

  The power insulating device manufactured by the method for manufacturing the power insulating device according to the above-described embodiment may be a gas insulating device described below or a solid insulating device.

In FIG. 2, the circuit breaker 4 which comprises the electric power insulation apparatus 1 mentioned above is shown.
The circuit breaker 4 is formed by including a cylinder 12 made of ceramic or metal, copper conductors 10 and 11 in an internal space 13 of the cylinder 12, and lids 9 that close both ends of the cylinder 12. ing. The conductors 10 and 11 are provided with a gap so as not to contact each other, and the lid body 9 and the cylinder body 12 are sealed with a sealant 8 such as silver wax. The sealed internal space 13 of the cylinder 12 may be a vacuum, or may be filled with a gas such as air, carbon dioxide gas, sulfur hexafluoride gas. The one in which the inside of the cylinder 12 is vacuum is called a vacuum circuit breaker, and the one in which gas is sealed is called a gas insulator.
By providing the cylindrical body 12 with the internal space 13, when electric power must be cut off for power transmission troubles and maintenance, a discharge (spark) generated by the electric power interruption is generated in the gap between the conductor 10 and the conductor 11. Therefore, it is possible to reliably insulate in a short time.

Although it is necessary to insulate the circuit breaker 4 as a whole, in the method for manufacturing a power insulating device according to this embodiment, the entire circuit breaker 4 (here, the cylinder 12, the lid 9, and the sealant 8) is described above. By stacking the insulating films, an insulating layer having a thickness of 500 μm or more, preferably about 1000 to 1500 μm is formed.
Examples of the method for forming the insulating layer include a method in which the above-described insulating film is taped and wound around the surface of the circuit breaker 4 and the like, and a method in which the insulating film is adhered through the above-described adhesive layer. A method of adhering an insulating film through a layer is preferable. In that case, it is more preferable if the above-mentioned fiber layer is included.
Furthermore, as a method of forming the insulating layer, a method of forming a hybrid insulating layer, such as a method of fixing an insulating film after powder coating or a method of applying powder coating after fixing an insulating film may be used.

  It is preferable to provide an insulating layer also on part or all of the surfaces of the conductors 10 and 11. The insulating layer is formed using the insulating film as described above. Moreover, the method of forming an insulating layer in the said circuit breaker 4 can also be employ | adopted for the method of forming an insulating layer in the bus-bar 2, the disconnector 3, the current transformer 7, and the cable connector 6. FIG.

Next, an embodiment in which an insulating layer is provided on the gas-insulated pipeline bus will be described with reference to FIG.
The gas-insulated pipeline bus according to this embodiment is used for the power insulating device 1 and the power transmission device shown in FIG. 1, and is made of metal or ceramic in which an insulating gas is sealed in the internal space 17. A copper conductor 14 provided in the container 15 is installed, and an insulating layer 16 is formed on the surface of the conductor 14.
More specifically, a conductor 14 to which a high voltage is applied is provided in a container 15 in which air, carbon dioxide gas, sulfur hexafluoride gas or the like is sealed in the internal space 17, and the conductor 14 is supported by an insulating spacer. Alternatively, the container 12 and the conductor 14 are arranged at the center of the container 12 with a belt-like object made of fiber or the like. The insulating layer 16 is formed on the surface of the conductor 14 by laminating and fixing the above-described insulating film via an adhesive. In such a forming method, an insulating layer having a desired thickness and high insulating properties can be obtained regardless of the shape of the surface on which the insulating layer 16 is desired to be formed.
In addition, it is more preferable that the insulating film includes the above-described fiber layer. Moreover, the formation of the insulating layer by the insulating film may be performed not only on the surface of the conductor 14 but also on the surface of the container 15 or the inside of the container 15.
Furthermore, when forming an insulating layer, it is good also as a hybrid insulating layer of the powder coating material and insulating film which were mentioned above. In this case, an insulating layer having high surface smoothness and high insulating properties can be obtained by first fixing the insulating film and then applying with a powder paint.

In one embodiment of the power insulating device of the present invention, an insulating layer can be formed by laminating the insulating film at a location to be insulated in the disconnector or the cable connecting portion in addition to the above-described circuit breaker and busbar. . In this case, the circuit breaker and / or disconnector, and even the main circuit conductor including the circuit breaker and / or disconnector can be integrated with an insulating film, or after being stored in a metal container, the container is insulated. An insulating layer can also be formed by laminating films.
Here, the main circuit conductor is a conductor provided between the bus bar and the cable connector, and has a circuit breaker or a disconnector in its configuration. When the power insulating device of the present embodiment is a solid insulating device, it is preferable to form an insulating layer on the entire surface of the main circuit conductor including the vacuum circuit breaker and / or the vacuum disconnector. When the method for manufacturing a power insulating device according to the present invention is used, an insulating layer having a high adhesiveness can be obtained even for a complicated shape although a thick insulating layer of 500 μm or more can be formed.

  Next, the present invention will be described in more detail with reference to examples. Various insulating layers were formed for the circuit breaker (see FIG. 2) constituting the power insulating device, and the results were compared and examined as examples and comparative examples of the present invention.

Example 1
An insulating layer was formed on the circuit breaker having the structure shown in FIG. 2 using powder paint. As the circuit breaker, the ceramic cylinder 12, the lid 9, and the conductors 10 and 11 are all made of copper. Moreover, the cylinder 12, the lid 9, and the conductors 10 and 11 are sealed with silver wax. Furthermore, the cylinder is evacuated. The insulating film is composed of 100 parts by mass of epoxy resin (bisphenol A type epoxy resin having an average molecular weight of 2900, an average epoxy equivalent of 2000 and a melting point of 130 ° C.) on both sides of a 50 μm thick polyethylene terephthalate film, and a curing agent [10 (2,5-dihydroxy Phenyl) -10H-9 oxa-10-phosphaphenanthrene-10-oxide (Sanko Co., Ltd., trade name “HCA-HQ”) 65.1 parts by mass and biphenyl type naphthol novolak resin (Maywa Kasei Co., Ltd., trade name “ MEH-7851-3H ") 29.9 parts by mass] 95 parts by mass, 1 part by mass of 2-methylimidazole, phenolic hydroxyl group-containing aromatic polyamide-polybutadiene-acrylonitrile copolymer (solid content 40% DMF solution product) 243 parts by mass Are mixed and dissolved in 400 parts by mass of methyl ethyl ketone. After preparation of the adhesive layer forming coating solution, coating, drying (100 ° C., 3 minutes), the thickness of one side provided with an adhesive layer of about 30 [mu] m. This insulating film was wound four times, and then pressed and cured at 160 ° C. under a load of 400 kgf / cm 2 for 60 minutes to form an insulating layer having a thickness of 500 μm.
When the dielectric breakdown voltage of this insulating layer was measured by the following test method, the dielectric breakdown voltage was 15 kV or higher, and the insulating property was high. In addition, although the cylinder 12 and the lid 9 and the conductors 10 and 11 have different materials, the coefficients of thermal expansion are different. In this case, no peeling is observed at the interface between the insulating layer and the circuit breaker, and the followability, insulation Sex did not decline.

  Note that the cylinder constituting the circuit breaker does not necessarily need to be in a vacuum, and a similar result can be obtained even if an insulating gas such as sulfur hexafluoride gas, air, or carbon dioxide gas is sealed. it can. Furthermore, for the purpose of improving the insulation, the circuit breaker is housed in a ceramic or metal container, and the insulating gas is sealed between the circuit breaker and the container wall. Similar results can be obtained. In that case, an insulating layer can also be provided on the outer surface of the container in the same manner as the circuit breaker.

[Insulation test]
Measurement method: Using a dielectric breakdown test apparatus (manufactured by Hitachi Chemical Co., Ltd., model number HAT-300-50R), it was confirmed whether the dielectric breakdown voltage was 15 kV or more in accordance with JIS C 2161. If it is 15 kV or more, the insulation is good.

(Example 2)
In Example 1, as an insulating film, a glass cloth (110 g / m 2, thickness 133 μm) in which glass fibers are plain woven is laminated on one adhesive layer of a polyethylene terephthalate film, and this insulating film is made of glass cloth. An insulating layer having a thickness of 550 μm was formed in the same manner as in Example 1 except that the wire was wound four times so that the wire was on the circuit breaker side.
When the dielectric breakdown voltage of this insulating layer was measured by the above test method, the dielectric breakdown voltage was 15 kV or higher, and the insulating property was high. Further, as in Example 1, no peeling was observed at the interface between the insulating layer and the circuit breaker, and the followability and insulation were not deteriorated.

(Example 3)
In Example 1, after forming the insulating layer of 500 m, an insulating layer was further formed by powder coating on the insulating layer of 500 μm by using a triboelectric electrostatic spray method as a coating method. As the insulating layer, an insulating layer of 600 μm was obtained by painting three times, and an insulating layer of 1100 μm was obtained as a whole. When the dielectric breakdown voltage of this insulating layer was measured by the above test method, the dielectric breakdown voltage was 15 kV or higher, and the insulating property was high. Further, as in the case of Example 1, no peeling was observed at the interface between the insulating layer and the circuit breaker, and the followability and insulation were not deteriorated.

Example 4
In Example 2, after forming the insulating layer of 550 m, an insulating layer was further formed by powder coating on the insulating layer of 550 μm by using a triboelectric electrostatic spray method as a coating method. As the insulating layer, an insulating layer having a thickness of 400 μm was obtained by painting twice, and an insulating layer having a thickness of 950 μm was obtained as a whole. When the dielectric breakdown voltage of this insulating layer was measured by the above test method, the dielectric breakdown voltage was 15 kV or higher, and the insulating property was high. Further, as in the case of Example 1, no peeling was observed at the interface between the insulating layer and the circuit breaker, and the followability and insulation were not deteriorated.

(Comparative Example 1)
In Example 1, except that the insulating film to be used was an embossed polyethylene terephthalate film (embossed: depth 5 μm) having a thickness of 50 μm and was wound so that the thickness of the insulating layer was 440 μm. When an insulating layer was formed in the same manner as in Example 1, the number of windings was 8, and the insulation by the insulation test had a dielectric breakdown voltage of less than 15 kV, which was lower than that of Example 1. It was.

  From the above, it is possible to efficiently form an insulating layer having a desired thickness by laminating an insulating film at a place where the power insulating device is insulated. From this, it contributes to forming an insulating layer efficiently also at the time of manufacture of electric power insulation equipment other than the above-mentioned circuit breaker, for example, an insulation bus bar and a main circuit conductor.

  INDUSTRIAL APPLICABILITY The present invention can be used for stable power supply in substations and the like, and contributes to efficiently forming an insulating layer having a desired thickness on a conductor or the like of a power insulating device.

It is sectional drawing which shows typically one Embodiment of the electric power insulation apparatus of this invention. It is sectional drawing which shows typically the circuit breaker which comprises one Embodiment of the electric power insulation apparatus of this invention. It is a perspective view which shows typically the principal part of one Embodiment of the gas insulated pipe bus-line of this invention.

Explanation of symbols

1: Power insulation device 2: Busbar 3: Disconnector 4: Circuit breaker 6: Cable connection part 7: Current transformer 8: Sealant 9: Lid bodies 10, 11, 14: Conductor 12: Tubes 13, 17 : Internal space 15: Container 16: Insulating layer

Claims (7)

A method of manufacturing a power insulating device, wherein an insulating layer is formed on the surface of a component of the power insulating device made of a conductive material,
The insulating layer is formed including an insulating film,
The insulating film includes an insulating base film, an adhesive layer formed on one side of the base film, and a fiber layer made of insulating fibers on the other side,
The adhesive layer is formed by impregnating the fiber layer with an adhesive composed of an epoxy resin composition in the adhesive layer by heating and pressing the adhesive layer, and curing the impregnated adhesive. Manufacturing method for insulation equipment.   The method for manufacturing a power insulating device according to claim 1, wherein the insulating layer is formed by including a coating layer by powder coating.   The method for manufacturing a power insulating device according to claim 2, wherein the insulating layer is formed by coating a powder coating after fixing an insulating film on a surface of a component of the power insulating device.   The method for manufacturing a power insulating device according to any one of claims 1 to 3, wherein the insulating film has a thickness of 100 µm or more. A power insulating device in which an insulating layer is formed on the surface of a component made of a conductive material,
The insulating layer is formed including an insulating film,
The insulating film includes an insulating base film, an adhesive layer formed on one side of the base film, and a fiber layer made of insulating fibers on the other side,
The adhesive layer is formed by impregnating the adhesive made of the epoxy resin composition in the adhesive layer into the fiber layer by heating and pressurizing, and curing the impregnated adhesive. Power insulation equipment. The power insulating device according to claim 5, wherein the insulating layer includes a coating layer formed by powder coating.   The insulating film for electric power according to claim 5, wherein the insulating film has a thickness of 100 μm or more.

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