JP4947483B2 - Device manufacturing processing method, device manufacturing processing system, program, and storage medium - Google Patents

Description

  The present invention relates to a device manufacturing processing method, a device manufacturing processing system, a program, and a storage medium. More specifically, for example, a semiconductor device, a liquid crystal display device, an imaging device such as a CCD (Charge Coupled Device), a thin film magnetic head, etc. The present invention relates to a device manufacturing processing method and system for performing a device manufacturing process including a photolithography process for manufacturing, a program for causing a computer system to execute the method, and a recording medium on which the program is recorded.

  In the recent device manufacturing process, with the miniaturization of a required device pattern, it has become impossible to ignore the aberration of the projection optical system of the exposure apparatus that projects the device pattern image onto the substrate. Therefore, conventionally, in an exposure apparatus, a wavefront aberration (Zernike coefficient) is measured using a wavefront aberration measuring instrument of a PMI (Phase measurement interferometer) measurement method, and spherical aberration, field curvature, astigmatism, which are factors thereof, are measured. The amount of aberration such as coma and distortion is calculated, and the projection optical system is adjusted so that the amount of aberration is less than or equal to the target value (see, for example, Patent Document 1).

  However, in order to measure the aberration of the projection optical system using the measuring instrument of this PMI measuring method, it is necessary to attach the measuring instrument to the exposure apparatus, which takes time. For this reason, when trying to measure the aberration of the projection optical system using a measuring instrument of the PMI measurement method, the lot processing must be interrupted for a long time. Therefore, at present, a PMI measurement type measuring instrument is used in specific cases such as when exposure is started under a new exposure condition at the start of a process or when a significant defect in the exposure line width is detected. There is a demand for providing means for efficiently measuring and adjusting the aberration of the projection optical system even during lot processing.

International Publication No. 2003/065428 Pamphlet

According to a first aspect of the present invention, there is provided a measurement / inspection apparatus for performing a predetermined measurement / inspection on a substrate on which a predetermined pattern image is exposed through the optical system by an exposure apparatus having an optical system. imaging properties measured test, measurement and inspection results at the measuring test device whether below a predetermined criterion, determined using the determining device measures the imaging characteristic information by the optical system of the exposure apparatus using It is a device manufacturing processing method for transmitting the determination result by the determination apparatus to a measurement apparatus.

According to this, whether the actual measurement test result of a substrate a predetermined pattern image through the optical system of the exposure apparatus is formed transfer is below a predetermined criterion, and determine the constant using the determination apparatus, the determination result Is transmitted to an imaging characteristic measuring apparatus that measures imaging characteristic information of the optical system. For this reason, in the imaging characteristic measuring apparatus, it is possible to refer to the determination result.

According to a second aspect of the present invention, there is provided an exposure apparatus comprising an optical system; a substrate connected to the exposure apparatus and exposed in a predetermined pattern through the optical system by the exposure apparatus; a test apparatus for performing the measurement and inspection; is connected to the test apparatus, the measurement test results of the inspection apparatus and a determination device for determine the constant whether below a predetermined reference; forming the optical system of the exposure apparatus An image formation characteristic measurement apparatus that can measure image characteristic information, is connected to the determination apparatus, and receives a determination result of the determination apparatus.

According to this, the measurement inspection result by the measurement inspection device of the substrate on which the predetermined pattern image is transferred and formed via the optical system of the exposure apparatus is sent to the determination apparatus. Then, the determination device, the measurement test results to determine the constant whether below a predetermined criterion, the determination result, and transmits the imaging characteristic measuring device for measuring the imaging characteristic information of the optical system. For this reason, in the imaging characteristic measuring apparatus that measures the imaging characteristics of the optical system of the exposure apparatus, the determination result can be referred to.

According to a third aspect of the present invention, there is provided a measurement / inspection apparatus for performing a predetermined measurement / inspection on a substrate exposed to a predetermined pattern image via the optical system by an exposure apparatus having an optical system. a process of measurement and inspection by using the measurement test results and process for determine the constant whether the below a predetermined reference in the test apparatus, imaging characteristics measurement for measuring the imaging characteristic information by the optical system of the exposure apparatus A program for causing a computer system to execute a process of transmitting the determination result to an apparatus.

According to this, the exposure apparatus actual measurement test result of a substrate a predetermined pattern image is transferred and formed via the optical system to determine the constant whether below a predetermined criterion, the result of the determination of the optical system The image formation characteristic information is transmitted to an image formation characteristic measurement device that measures the image formation characteristic information. For this reason, in the imaging characteristic measuring apparatus, it is possible to refer to the determination result.

According to a fourth aspect of the present invention, there is provided a measurement / inspection apparatus for performing a predetermined measurement / inspection on a substrate on which a predetermined pattern image is exposed through the optical system by an exposure apparatus having an optical system. a process of measurement and inspection by using the measurement test results and process for determine the constant whether the below a predetermined reference in the test apparatus, imaging characteristics measurement for measuring the imaging characteristic information by the optical system of the exposure apparatus A recording medium that reads a program that causes a computer system to execute the process of transmitting the determination result to an apparatus and records the program in an executable manner.

If executing a program recorded on the recording medium by the computer system, whether or not determine a constant actual measurement test result of a substrate a predetermined pattern image through the optical system of the exposure apparatus is formed transfer is below a predetermined reference Then, the determination result is transmitted to the imaging characteristic measuring apparatus that measures the imaging characteristic information of the optical system. For this reason, in the imaging characteristic measuring apparatus, it is possible to refer to the determination result.

  Hereinafter, an embodiment of the present invention will be described with reference to FIGS.

  FIG. 1 shows a schematic configuration of a device manufacturing processing system according to an embodiment of the present invention. As shown in FIG. 1, a device manufacturing processing system 1000 is a system constructed in a device manufacturing factory for processing semiconductor wafers and manufacturing micro devices. As shown in FIG. 1, the device manufacturing processing system 1000 includes an exposure apparatus 100, a track 200 disposed adjacent to the exposure apparatus 100, a management controller 160, an analysis apparatus 500, and a host system 600. And a device manufacturing processing apparatus group 900.

[Exposure equipment]
The exposure apparatus 100 is an apparatus that transfers a device pattern to a wafer coated with a photoresist. FIG. 2 shows an example of a schematic configuration of the exposure apparatus 100. As shown in FIG. 2, the exposure apparatus 100 includes an illumination system 10 that emits exposure illumination light, a reticle stage RST that holds a reticle on which a device pattern illuminated by the illumination light is formed, and exposure illumination light. A double-sided telecentric projection optical system PL that projects a device pattern illuminated by the above, a wafer stage WST that holds a wafer to be exposed, a main controller 20 that performs overall control thereof, and the like.

  Illumination light from the illumination system 10 is irradiated onto the reticle R held on the reticle stage RST via an optical system such as the reflection mirror M and the condenser lens 32. This irradiation area is defined as an illumination area IAR. A device pattern including a circuit pattern and the like is formed on the reticle R. The illumination light that has passed through the illumination area IAR is incident on the wafer W held on the wafer stage WST via the projection optical system PL (optical axis is AX). Thereby, a projected image of the device pattern of the illumination area IAR is formed on the wafer W. The area on the wafer W is defined as an exposure area IA.

  Here, consider an XYZ coordinate system in which the coordinate axis parallel to the optical axis AX of the projection optical system PL is the Z axis. Wafer stage WST is movable in the XY plane and adjusts the surface of wafer W in the Z-axis direction shift, the θx (rotation axis around X axis) direction, and the θy (rotation axis around Y axis) direction. It is possible. In addition, reticle stage RST can move in the Y-axis direction in synchronization with wafer stage WST. By synchronous scanning according to the projection magnification of the projection optical system PL of both stages WST and RST, the surface of the wafer W is exposed to the exposure area IA in synchronization with the device pattern on the reticle R passing through the illumination area IAR. To go through. As a result, the device pattern on the reticle R is transferred onto the wafer W. The exposure apparatus 100 repeats the above-described relative synchronous scanning of both the stages RST and WST and the stepping of the wafer stage WST with respect to the exposure illumination light, so that a device pattern on the reticle R is formed in a plurality of different regions on the wafer W. Is being transcribed. That is, the exposure apparatus 100 is a scanning exposure (step-and-scan) type exposure apparatus.

  The main controller 20 performs stage control under this XYZ coordinate system. In the following, among the stage control systems, a control system that performs synchronous control of both stages WST and RST is a synchronous control system, and controls the Z position of the stage position (wafer surface), the amount of rotation about the X axis, and the amount of rotation about the Y axis. The control system will be described as a focus control system.

  The main controller 20 of the exposure apparatus includes an exposure amount control system (not shown) for controlling the intensity (exposure amount) of illumination light, synchronous control of both stages RST and WST, and a wafer within the depth of focus of the projection optical system PL. And a stage control system (not shown) for performing autofocus / leveling control (hereinafter simply referred to as focus control) for matching the surfaces of W.

  The exposure amount control system performs feedback control for controlling the exposure amount to match the target value based on detection values of various exposure amount sensors capable of detecting the exposure amount. The stage control system performs feedback control based on the measurement value of the interferometer that measures the position of the stage, thereby realizing position control and speed control of both stages. The exposure apparatus 100 is provided with multi-point AF (auto focus) sensors (60a, 60b) that detect a focus / leveling shift on the wafer surface at a plurality of detection points. The stage control system of the main controller 20 detects the wafer surface height at, for example, nine detection points (9 channels) among the plurality of detection points of the multipoint AF sensor (60a, 60b), and corresponds to the exposure area. The focus control is realized by performing feedback control so that the wafer surface to be matched with the image plane of the projection optical system PL.

[Control system parameters]
In the exposure apparatus 100, several factors that define the operation of each control system are converted into control system parameters, and these values can be freely set. Control system parameters are roughly classified into adjustment system parameters that require device adjustment by temporarily stopping the process when changing the set values, and non-adjustment system parameters that do not require device adjustment.

  Some representative examples of the adjustment system parameters will be described. First, in relation to the exposure amount control system, there are an adjustment parameter of an exposure amount sensor (not shown) for detecting the exposure amount, an adjustment parameter of an illuminance measurement sensor (not shown) for measuring the intensity of illumination light on the wafer surface, and the like. . Further, in the case of the synchronous control system, the movable mirror bending correction provided on the stage WST and RST that holds the wafer W and the reticle R in order to reflect the laser beam from the interferometer for measuring the position of the stage WST and RST. Parameters such as the coefficient value of the correction function, position loop gain of feedback control, speed loop gain, integration time constant, and the like. In the focus control system, focus offset, which is an offset adjustment value for focus control when aligning the wafer surface at the time of exposure with the best imaging surface by the projection optical system PL, and the wafer surface at the time of exposure and the projection optical system PL. Leveling adjustment parameters for matching the best imaging plane of the sensor, linearity of the position detection element (PSD) which is a sensor of each detection point of the multi-point AF sensor (60a, 60b), offset between sensors, detection of each sensor There are parameters related to reproducibility, offset between channels, AF beam irradiation position (ie, detection point) on the wafer, and other AF surface correction. These adjustment system parameter values all need to be adjusted by calibration or trial operation of the apparatus.

  Next, some representative examples of the non-adjustment system parameters will be described. First, in relation to the exposure amount control system, for example, there are parameters related to selection of ND filters in the illumination system 10 and exposure amount target values. Further, as for the synchronization control system, for example, there is a scanning speed. In the focus control system, for example, there are a focus sensor selection state for 9 channels, a parameter related to a focus step correction map, which will be described later, a fine adjustment amount of a focus offset, a scan direction in an edge shot of the wafer outer edge, and the like. These parameter setting values are parameters that can be changed without calibrating the apparatus, and are often specified by the exposure recipe. Note that the ND filter is selected based on the result of an average power check that is performed only once with an exposure amount target value set appropriately (for example, at a minimum) at the start of exposure on a certain wafer. Depending on the selection of the ND filter, the scan speed is also finely adjusted to some extent.

  The line width and transfer position of the device pattern transferred and formed on the wafer W are deviated from design values due to exposure control, synchronization accuracy, and focus control errors. Therefore, in the exposure apparatus 100, time-series data of control amounts (exposure amount trace data) related to the exposure amount error obtained from the exposure amount control system, and time series of control amounts related to the synchronization accuracy error obtained from the synchronization control system. Log data (synchronization accuracy trace data), time series data (focus trace data) of control amount related to focus error obtained from the focus control system, and use these data for analysis evaluation of pattern line width etc. Yes.

Incidentally, a pupil aperture stop 15 capable of continuously changing the numerical aperture (NA) within a predetermined range is provided in the vicinity of the pupil plane of the projection optical system PL. As this pupil aperture stop 15, for example, a so-called iris stop is used. The pupil aperture stop 15 is controlled by the main controller 20. The projection optical system PL is an optical system including a plurality of refractive optical elements (lens elements) 13, for example, about 10 to 20, for example. Among the plurality of lens elements 13, for example, five lens elements 13 _{1 to} 13 ₅ on the object plane side (reticle R side) are movable lenses that can be driven from the outside by the imaging performance controller 48. These lens elements 13 _{1 to} 13 ₅ are held by the lens barrel via respective lens structure holders (not shown). These lens elements 13 _{1 to} 13 ₅ are respectively held by the inner lens holder, and these inner lens holders are supported by the driving element (not shown) such as a piezo element with respect to the outer lens holder at three points in the gravity direction. The Then, by independently adjusting the voltages applied to these drive elements, each lens element is driven to shift in the X-axis, Y-axis, and Z-axis (optical axis) directions, and the rotational directions (θx around each axis). , Θy, θz) can be rotationally driven, that is, can be driven with six degrees of freedom. The other lens elements 13 are held by the lens barrel via a normal lens holder. Note that any number of movable lens elements may be provided.

The projection optical system PL has wavefront aberration. Due to this wavefront aberration, the wavefront of the parallel light flux passing through the projection optical system PL deviates from the ideal wavefront. This deviation of the wavefront causes a positional deviation of the imaging position on the image plane of light generated from one point on the object surface. The movable lens elements 13 _{1 to} 13 ₅ are provided to adjust this wavefront aberration.

  The wavefront aberration of the projection optical system PL can be expressed by Seidel aberration or Zernike polynomial. Among them, the Zernike polynomial is suitable for expressing wavefront aberration of higher order components. The Zernike polynomial is a real polynomial related to the pupil coordinates (ρ, θ) of the projection optical system PL, as shown by the following equation.

ツェルニケ多項式は、直交系であるから、各項の係数Ｚ_iを独立に決定することができる。ｉを適当な値で切ることはある種のフィルタリングを行うことに対応する。なお、一例として第１項〜第３７項までのｆ_i（ｆ_i（ρ，θ）：動径ρ、角度θを独立変数とする動径多項式）を係数Ｚ_iとともに例示すると、次の表１のようになる。但し、表１中の第３７項は、実際のツェルニケ多項式では、第４９項に相当するが、本明細書では、ｉ＝３７の項（第３７項）として取り扱うものとする。すなわち、本発明において、ツェルニケ多項式の項の数は、特に限定されるものではない。

Since the Zernike polynomial is an orthogonal system, the coefficient Z _i of each term can be determined independently. Cutting i by an appropriate value corresponds to performing some kind of filtering. As an example, f _i (f _i (ρ, θ): radial polynomial having radial ρ, angle θ as an independent variable) from the first term to the 37th term together with the coefficient Z _i is shown in the following table. It becomes like 1. However, the 37th term in Table 1 corresponds to the 49th term in the actual Zernike polynomial, but is treated as a term of i = 37 (the 37th term) in this specification. That is, in the present invention, the number of terms of the Zernike polynomial is not particularly limited.

ツェルニケ多項式のそれぞれの項は光学収差に対応する。しかも低次の項(ｉの小さい項)は、ザイデル収差にほぼ対応する。例えば、ツェルニケ係数Ｚ₇、Ｚ₈（Ｚ₇、Ｚ₈は直交関係）は、３次のコマ収差に対応し、Ｚ₁₄、Ｚ₁₅は、５次のコマ収差に対応する。これらのコマ収差は、動径多項式が奇関数であるいわゆる奇関数収差とも呼ばれている。ウエハＷ上に形成される像面では、パターンの横ずれ、焦点深度の低減、パターン非対称性の原因となる。また、ツェルニケ係数Ｚ₄は、デフォーカスに対応し、Ｚ₉は、４次の球面収差に対応する。これらの収差は、動径多項式が偶関数であるいわゆる偶関数収差とも呼ばれている。

Each term in the Zernike polynomial corresponds to an optical aberration. Moreover, the low-order terms (terms with a small i) substantially correspond to Seidel aberration. For example, Zernike coefficients Z ₇ and Z ₈ (Z ₇ and Z ₈ are orthogonal) correspond to third-order coma, and Z ₁₄ and Z ₁₅ correspond to fifth-order coma. These coma aberrations are also called so-called odd function aberrations in which the radial polynomial is an odd function. On the image plane formed on the wafer W, it causes a lateral shift of the pattern, a reduction of the focal depth, and a pattern asymmetry. The Zernike coefficient Z ₄ corresponds to defocus, and Z ₉ corresponds to fourth-order spherical aberration. These aberrations are also called so-called even function aberrations in which the radial polynomial is an even function.

As described above, the wavefront aberration of the projection optical system PL can be obtained by using this Zernike polynomial. The Zernike polynomial can be said to be suitable for evaluating the aberration of the projection optical system PL because the aberration amount at an arbitrary position on the image plane can be handled independently of the position coordinates. If the lens elements 13 _{1 to} 13 ₅ are driven by the imaging performance controller 48 under the control of the main controller 20, the wavefront aberration of the projection optical system PL, that is, the aberrations from the first term to the 37th term of the Zernike coefficient. The size of changes. When the magnitude of the aberration from the first term to the 37th term changes, the imaging performance sensitive to the aberration of each term changes. Since the wavefront aberration is different at each point in the exposure area IA (image plane), the state of change in the imaging performance in the exposure area IA is also different for each point. Lens elements 13 _{1 to} 13 ₅ by the imaging performance controller 48 to be described later have the imaging characteristics in the exposure area IA as uniform as possible, that is, the wavefront aberration in the exposure area IA is as uniform as possible. Need to be driven.

  Incidentally, the illumination system 10 can finely adjust the wavelength of the illumination light for exposure under the instruction of the main controller 20. The exposure apparatus 100 is also provided with an uneven illuminance sensor (not shown).

  The main controller 20 is a computer system that controls various components of the exposure apparatus 100 as described above. The main controller 20 is connected to a communication network constructed in the device manufacturing processing system, and can send and receive data to and from the outside via the communication network.

  Although only one is shown in FIG. 2, the exposure apparatus 100 is provided with two wafer stages WST for holding the wafer W. The wafer W to be processed subsequently is alternately loaded on both stages and sequentially exposed. In this way, it is possible to load the wafer W onto the other wafer stage WST and perform alignment or the like while the wafer W held on one wafer stage WST is being exposed. Throughput is improved compared to repeated wafer exchange → alignment → exposure with one wafer stage WST. In FIG. 1, a portion that performs scanning exposure on wafer W held on one wafer stage WST is shown as processing unit 1, and a portion that performs scanning exposure on wafer W held on the other wafer stage WST. Is shown as the processing unit 2.

[truck]
The track 200 is disposed in contact with a chamber (not shown) surrounding the exposure apparatus 100. The track 200 mainly carries the wafer W into and out of the exposure apparatus 100 by a transfer line provided inside.

[Coater / Developer]
In the track 200, a coater / developer (C / D) 110 for applying and developing a resist is provided. The C / D 110 applies and develops a photoresist on the wafer W. The C / D 110 can observe these processing states and record the observation data as log data. The processing state includes, for example, resist coating film thickness uniformity, development module processing, PEB (Post-exposure-bake) temperature uniformity (hot plate temperature uniformity), wafer heating history management (overbaking after PEB processing). There are various states of avoidance and cooling plate. The processing state of the C / D 110 can also be adjusted to some extent by setting the device parameters. As such apparatus parameters, for example, parameters related to uneven application of resist on the wafer, for example, set temperature, wafer rotation speed, resist dropping amount and dropping interval, and the like are apparatus parameters.

  The C / D 110 includes a control device that can operate independently of the main control device 20 of the exposure apparatus 100 and the control device of the measurement / inspection instrument 120. The C / D 110 is disposed along the transport line of the track 200. Therefore, the wafer W can be transferred between the exposure apparatus 100 and the C / D 110 by this transfer line. Further, the C / D 110 is connected to a communication network in the device manufacturing processing system 1000, and can send and receive data to and from the outside. For example, the C / D 110 can output information on the process (information such as the trace data).

[Measurement and inspection equipment]
In the track 200, a composite measurement / inspection instrument 120 capable of performing various measurement / inspections on the wafer W before and after the exposure of the wafer by the exposure apparatus 100 (that is, before and after) is provided. . The measurement / inspection instrument 120 includes a control device that can operate independently from the control device of the exposure apparatus 100 and the C / D 110. The measurement / inspection instrument 120 performs a pre-measurement / inspection process in which measurement is performed before exposure and a post-measurement / inspection process in which measurement is performed after exposure. The measurement / inspection instrument 120 may be configured to perform only one of the pre-measurement / inspection process and the post-measurement / inspection process. Further, separate measurement / inspection instruments may be provided for the preliminary measurement / inspection process and the post-measurement / inspection process.

  In the pre-measurement inspection process, before the wafer W is transferred to the exposure apparatus 100, inspection for foreign matter on the wafer W, inspection of the resist film on the wafer W, and measurement for optimizing the exposure conditions in the exposure apparatus 100 are performed. Do. The measurement target of the pre-measurement / inspection process includes the surface shape of the wafer W before exposure. The measurement / inspection instrument 120 can output the result of the pre-measurement / inspection to the outside via a communication network in the system.

  On the other hand, the post-measurement / inspection instrument of the measurement / inspection instrument 120 is such that the line width and overlay error of the resist pattern etc. on the wafer after exposure (post-exposure) transferred by the exposure apparatus 100 and developed by the C / D 110, and the projection optical system PL. The wavefront aberration and illumination unevenness are measured, and wafer film inspection, wafer defect / foreign particle inspection, etc. are performed. Here, the wafer film inspection includes inspection of the film thickness, film thickness unevenness, film defect, foreign matter, scratch, etc. of the film formed on the wafer.

  Further, the measurement / inspection instrument 120 can also measure the relative positional deviation amount of the aberration measurement mark on the exposed test wafer for the aberration measurement of the projection optical system PL as will be described later. .

  The measurement state of the measurement / inspection instrument 120 can also be recorded as log data (for example, data that affects measurement errors such as residual components when aligning the wafer W for measurement). It has become. This log data can also be output to the outside via a communication network. The measurement / inspection instrument 120 can also adjust the measurement conditions to some extent by setting the apparatus parameters. Such apparatus parameters include, for example, parameters relating to the alignment of the wafer W, which is a precondition for measurement, parameters relating to the focus state of the sensor, selection of wafers to be measured, and parameters relating to selection of measurement shots. .

  Note that the processing units 1 and 2 are also provided in the C / D 110 and the measurement / inspection instrument 120, and the processing time is shortened.

  The measurement / inspection instrument 120 is disposed along the conveyance line of the track 200. Therefore, the wafer W can be transferred between the exposure apparatus 100, the C / D 110, and the measurement / inspection instrument 120 by this transfer line. That is, the exposure apparatus 100, the track 110, and the measurement / inspection instrument 120 are connected in-line to each other. Here, the in-line connection means that the apparatuses and the processing units in each apparatus are connected via a transfer device that automatically transfers the wafer W such as a robot arm or a slider. With this in-line connection, the transfer time of the wafer W among the exposure apparatus 100, the C / D 110, and the measurement / inspection instrument 120 can be remarkably shortened.

  The exposure apparatus 100, the track 110, and the measuring instrument 120 that are connected in-line can be regarded as one substrate processing apparatus (100, 110, 120) as a whole. The substrate processing apparatus (100, 110, 120) applies a photosensitive agent such as a photoresist to the wafer W, and projects and exposes a mask or reticle pattern image onto the wafer coated with the photosensitive agent. An exposure process to be performed, and a development process to develop the wafer W after the exposure process is performed. These steps will be described later.

  In the device manufacturing processing system 1000, a plurality of exposure apparatuses 100, tracks 110, and measurement / inspection instruments 120 (that is, substrate processing apparatuses (100, 110, 120)) are provided. Each substrate processing apparatus (100, 110, 120) and device manufacturing processing apparatus group 900 is installed in a clean room in which temperature and humidity are controlled. In addition, data communication can be performed between devices via a predetermined communication network (for example, LAN: Local Area Network). This communication network is a so-called intranet communication network provided for a customer's factory, business office or company.

  In the substrate processing apparatus (100, 110, 120), a plurality of wafers W (for example, 20 wafers) are processed as one unit (referred to as a lot). In the device manufacturing processing system 1000, the wafer W is processed into a product by processing one lot as a basic unit. Therefore, the wafer process in the device manufacturing processing system is also referred to as lot processing.

  In this device manufacturing processing system 1000, the measurement / inspection instrument 120 is placed in the track 200 and connected in-line with the exposure apparatus 100 and the C / D 110. However, the measurement / inspection instrument 120 is arranged outside the track 200. The exposure apparatus 100 and the C / D 110 may be configured offline.

[Analyzer]
The analysis apparatus 500 is an apparatus that operates independently of the exposure apparatus 100 and the track 200. The analysis apparatus 500 is connected to a communication network in the device manufacturing processing system 1000, and can send and receive data to and from the outside. The analysis apparatus 500 collects various data (for example, processing contents of the apparatus) from various apparatuses via the communication network, and analyzes data related to processes on the wafer W. As hardware for realizing such an analysis apparatus 500, for example, a personal computer can be employed. In this case, the analysis process is realized by executing an analysis program executed by a CPU (not shown) of the analysis apparatus 500. This analysis program is supplied by a medium (information recording medium) such as a CD-ROM and is executed in a state installed in a PC.

  FIG. 3 shows a schematic configuration of the analysis apparatus 500. As illustrated in FIG. 3, the analysis device 500 includes a transmission / reception unit 510, a storage device 520, a simulation unit 530, a determination unit 535, a comparison unit 540, an optimization unit 550, and a database unit 560. ing. The transmission / reception unit 510, the simulation unit 530, the determination unit 535, the comparison unit 540, and the optimization unit 550 can communicate with each other.

  The transmission / reception unit 510 is connected to a communication network in the device manufacturing processing system, and is an interface for performing data transmission / reception with the outside. The transmission / reception unit 510 outputs the data stored in the storage device 520 via the communication network to the outside, and stores the data received from the outside via the communication network in the storage device 520.

  The storage device 520 stores data received from the outside via the transmission / reception unit 510. Such data includes log data 521 obtained from the exposure apparatus 100, C / D 110, measurement / inspection instrument 120, pre-measurement data 522 of the measurement / inspection instrument 120, actual line width measurement value data 523, and data 524 relating to wavefront aberration. is there. Although not shown in FIG. 3, information (process information) related to the processing contents sent from the C / D 110 and the measurement / inspection instrument 120 is also stored in the storage device 520. The storage device 520 also stores the line width estimated value data 525 calculated by the simulation unit 530 and the data 526 related to the optimization result by the optimization unit 550.

  The simulation unit 530 estimates the pattern line width on the wafer W based on the log data of the exposure apparatus 100 stored in the storage device 520, the preliminary measurement result data of the measurement / inspection instrument 120, etc., and the line width estimated value data 525 is stored in the storage device 520. The simulation unit 530 refers to the CD table group 552 stored in the database unit 560 when estimating the line width of the pattern. The CD table group 552 will be described later.

  The determination unit 535 determines whether or not the pattern line width on the wafer W is abnormal based on the measured line width value data 523 using a predetermined threshold criterion, and when the determination result is NG. An activation signal for activating the simulation unit 530 is transmitted to the simulation unit 530. For example, the statistical value of the difference between the measured value of the pattern line width and the design value is compared with a threshold value, and if it exceeds a predetermined level, that is, if it is good, the line width is considered to be normal and the determination is made. The result is OK. On the other hand, the statistical value is compared with the threshold value, and if it is below a predetermined level, that is, it is defective, the line width is regarded as abnormal, and the determination result is NG. In this case, the determination unit 535 activates the simulation unit 530. The determination unit 535 sends the determination result to the device of the device manufacturing processing system 1000 via the transmission / reception unit 510.

  The comparison unit 540 compares the line width actual measurement value data measured by the measurement / inspection instrument 120 with the line width estimation value data estimated by the simulation unit 530, and obtains the degree of coincidence thereof. The comparison unit 540 outputs the comparison result to the optimization unit 550.

The optimization unit 550 optimizes the processing conditions of the substrate processing apparatus (100, 110, 120) based on the comparison result from the comparison unit 540. Here, the processing conditions to be optimized differ depending on the comparison result, and the exposure apparatus such as the control system parameters of the exposure apparatus 100 and the driving amounts of the lens elements 13 _{1 to} 13 ₅ of the projection optical system PL. There are a wide variety of parameters such as 100 parameters, C / D 110, and processing contents of the measurement / inspection instrument 120. When optimizing parameters, the optimization unit 550 refers to various databases such as the CD table group 552, the wavefront aberration change table 562, and the imaging performance change table 563 in the database unit 560. These databases will be described later. In the database unit 560, an imaging performance error allowable value 564 input via the man-machine interface is also registered in advance.

The CD table group 552 is a table group showing the relationship between the pattern line width and the exposure amount, synchronization accuracy, and focus control errors. FIG. 4 schematically shows an example of the CD table group 552. As shown in FIG. 4, this table group includes an index table 51 and several table groups 52. In the index table 51, five representative values out of −0.1 to 0.1 mJ / cm ² are designated as representative values of the exposure amount control error (exposure amount error). Four representative values of 0.00 to 0.03 μm are designated as representative values of (synchronization accuracy error). In the index table 51 of FIG. 4, a moving average within a predetermined period is adopted as the exposure amount error, and a moving standard deviation within the predetermined period is adopted as the synchronization accuracy error. In both cases, statistical values having a high influence on the line width are adopted. Here, the predetermined period is a period from when the slit-shaped exposure region reaches a certain point on the wafer W by the relative scanning of both the stages WST and RST until it leaves.

Each cell of the index table 51, any of the table name of the table group 52 corresponding to the combination of the representative value (T ₁₁ ~T ₅₄₎ is registered. In the plurality of table groups 52, tables each showing a relationship between a Z average offset Z _MEAN and a Z movement standard deviation Z _MSD as statistical values of focus control errors and line width values are prepared. Here, Z _MEAN is a moving average value of the focus control error within the predetermined period (exposure slit passing period), and Z _MSD is a moving standard deviation of the focus control error within the predetermined period. . More precisely, the Z average offset Z _MEAN and the Z movement standard deviation Z _MSD are the Z of the wafer surface from the focus target position based on the device topography of the wafer surface while the exposure slit passes through the pattern portion. This is the deviation of the direction and the inclination direction, that is, the moving average and moving standard deviation of the total focus control error in those directions. Note that even if the same Z _MEAN and Z _MSD are used, the line width value (CD value) at that time differs for each image height (coordinate axis direction orthogonal to the scanning direction). A table is prepared for each representative value (f _{0 to} f _M ).

The simulation unit 530 calculates a statistical value of each control error at a certain point (sample point) on the wafer W based on the exposure amount trace data, the synchronization accuracy trace data, and the focus trace data acquired from the exposure apparatus 100. To do. Then, the simulation unit 530 refers to the index table 51 and selects a table group corresponding to representative values close to those values from the table groups T _{11 to} T ₅₄ based on the exposure amount error and the synchronization accuracy error. To do. For example, assuming that the exposure error is −0.7 and the synchronization accuracy error is 0.005, four table groups T ₁₁ and T ₁₂ registered in the cell corresponding to the combination of representative values in the vicinity of the value. , T ₂₁ , T ₂₂ are selected.

A method for calculating the CD value when four table groups are selected will be described. As a premise, among the representative values of the exposure error corresponding to the selected table group, the smaller one is called the exposure amount error minimum value, and the larger one is called the exposure amount error maximum value. Of the representative values of the synchronization accuracy error corresponding to the selected table group, the smaller one is called the synchronization accuracy error best value, and the larger one is called the synchronization accuracy error worst value. The simulation unit 530 refers to the table of the image height f _k (k = 0 to M) corresponding to the in-shot X coordinate of the pattern from the selected four table groups, and selects the four tables shown below. read out. Here, k = 0 means that the image height is 0, that is, on the optical axis.
(1) Table 1 of the image height f _k of the table group at the minimum exposure error and the best synchronization accuracy error
(2) Table 2 of the image height f _k of the table group at the minimum exposure error and the worst synchronization accuracy error
(3) Table 3 of image height f _k of the table group at the maximum exposure error and the best synchronization accuracy error
(4) Table 4 of image height f _k of the table group at the maximum exposure error and the worst synchronization accuracy error

First, the simulation unit 530 reads the CD values corresponding to Z _MEAN and Z _MSD with reference to Tables 1 and 2. Then, from the CD values read from the tables 1 and 2 by the primary interpolation based on the internal division ratio of the synchronization accuracy error that internally divides between the worst value of the synchronization accuracy error and the best value of the synchronization accuracy error, A CD value corresponding to the synchronization accuracy error is calculated. More specifically, CD values, straight line intercepts and inclinations read from the two tables 1 and 2 in the two-dimensional plane with CD and synchronization accuracy as coordinate axes are obtained, and the straight line in the synchronization accuracy error is obtained. The value is obtained as a CD value corresponding to the synchronization accuracy error. Similarly, with reference to tables 3 and 4, CD values corresponding to Z _MEAN and Z _MSD are read out. Then, from the CD values read from the tables 3 and 4 by primary interpolation based on the internal ratio of the synchronization accuracy error values that internally divide between the synchronization accuracy error worst value and the synchronization accuracy error best value, A CD value corresponding to the synchronization accuracy error is calculated. Subsequently, the calculated two CD values are subjected to exposure by linear interpolation based on the internal ratio of the exposure error value that internally divides between the minimum exposure error value and the maximum exposure error value. A CD value corresponding to the quantity control error is calculated. This CD value becomes the CD value at this sample point. Of course, the interpolation described above is also applied to the case where either the exposure amount error or the synchronization accuracy error is equal to the representative value and two tables are selected instead of the four tables.

  By the way, prior to the estimation of the line width using this table, it is necessary to register the CD value in the table in advance. This CD value is registered based on information obtained from the exposure apparatus 100 and the measurement / inspection instrument 120 before the execution of a series of processes. First, the exposure apparatus 100 performs scanning exposure with a predetermined exposure condition set to transfer a test pattern onto a test wafer, and obtains exposure amount trace data, synchronization accuracy trace data, and focus trace data at that time. Then, the test wafer to which the test pattern is transferred is developed on the C / D 110, and the measurement / inspection instrument 120 is made to measure the line width of the test pattern. Then, the various trace data, the data relating to the set exposure conditions, and the measurement result of the line width are transferred to the analysis apparatus 500.

  The simulation unit 530 calculates the statistical values of the exposure amount, the synchronization accuracy, and the focus control error at the sample point to which the test pattern whose line width is measured is transferred, based on various trace data. Next, the analysis apparatus 500 groups the measurement results for each predetermined range (that is, cells in the table) based on the representative values of various control errors set in the table. Then, the average value of the line width measurement results belonging to the same group is registered in the table as the CD value of the cell. Note that the registered CD value is not based on the measurement result of the measurement / inspection instrument 120, but may be based on the value measured by the SEM or the value measured by the OCD method or the like. Instead of using a wafer, an aerial image sensor that measures the aerial image of the test pattern may be installed instead, and a calculated value of the aerial image simulation obtained from the aerial image of the test pattern measured by the aerial image sensor may be used. .

  Even if the exposure amount error, the synchronization accuracy error, and the focus error are exactly the same, the CD value varies depending on the exposure condition of the exposure apparatus 100 and the design condition of the transferred pattern. Therefore, this table group is prepared for each exposure condition and pattern design condition. As described above, the table group needs to be stored in a database so that an estimated value of the CD value can be searched using exposure conditions, pattern design conditions, exposure amount errors, synchronization accuracy errors, and focus errors as keys. The exposure conditions include exposure wavelength, projection optical system NA, illumination NA, illumination σ, illumination type, depth of focus, etc. The pattern design conditions include mask line width, target line width (for example, 130 nm), pattern There are pitch, mask type (binary, halftone, Levenson), pattern type (isolated line, line and space pattern), and so on. The relationship between these exposure conditions, pattern design conditions, pattern line width, and various conditions such as image height on the table are disclosed in detail in, for example, Japanese Patent Application Laid-Open No. 2001-338870. The detailed explanation is omitted.

  This CD table group 552 is also used for optimization of parameters related to the pattern line width in the optimization unit 550. For example, the CD table group 552 is referred to when obtaining exposure amount control-related, synchronous control-related, focus-related control system parameter combinations, or illumination conditions as preconditions so that the line width approaches the design value. .

The optimization unit 550 can also optimize the wavefront aberration of the projection optical system PL. As described above, the storage device 520 stores data 524 relating to the wavefront aberration of the projection optical system PL measured by the measurement / inspection instrument 120. The data 524 includes the measurement data relating to the wavefront aberration of the projection optical system PL collected from the measurement / inspection instrument 120, as well as the current drive positions of the lens elements 13 ₁ to 15 ₅ of the projection optical system PL collected from the exposure apparatus 100. And the driving range (lens element driving range) of the lens elements 13 ₁ to 15 ₅ is included.

The optimization unit 550 calculates the wavefront aberration of the projection optical system PL, that is, the magnitudes of the first to 37th terms of the Zernike term based on the measurement data regarding the wavefront aberration. The optimization unit 550 includes a size of the Zernike term (that is, wavefront aberration data), a lens element driving range, a wavefront aberration change table 562 with respect to the driving amount of the lens element, an imaging performance change table 563 with respect to wavefront aberration, inputs the imaging performance error tolerance 564, using them, based on wavefront aberration data calculated from the measurement results of the measurement test instrument 120, as an optimization result 526, the lens element _{131-134 5} etc. The adjustment value of the driving position and exposure wavelength, the adjustment value of the attitude of the wafer stage WST, the residual error, and the predicted imaging performance after driving are output. The driving positions of the lens elements 13 _{1 to} 13 ₅ are sent to the exposure apparatus 100. The main controller 20 of the exposure apparatus 100 drives the lens elements 13 _{1 to} 13 ₅ to the drive positions sent via the imaging performance controller 48 to adjust the wavefront aberration of the projection optical system PL, The offset value for the attitude control of wafer stage WST is changed, or the wavelength of exposure illumination light is finely adjusted to bring the imaging performance closer to the target value.

[Wavefront aberration change table]
The wavefront aberration change table 562 shows a plurality of measurements in the field of view of the projection optical system PL (that is, in the exposure area IA) of changes in the adjustment amount of the adjustment parameter that affects the formation state of the projection image of the pattern on the reticle R. It is a change table composed of a data group in which data indicating the imaging performance corresponding to each point, for example, data indicating the relationship between the coefficient variation of the first to 37th terms of the Zernike polynomial described above are arranged according to a predetermined rule. The elements of the wavefront aberration change table 562 can be obtained as a result of simulation using a model that is substantially equivalent to the projection optical system PL. As described above, the adjustment parameters include the driving amount of 6 degrees of freedom of the five movable lenses in the projection optical system PL, the wavelength of the illumination light for exposure, and the driving of Z, θx, and θy of the wafer W surface (ie, wafer stage WST). Amount.

[Imaging performance sensitivity table]
The imaging performance sensitivity table 563 has different exposure conditions, that is, optical conditions (exposure wavelength, maximum NA, use NA, illumination NA, aperture shape of illumination system aperture stop, illumination σ, etc.) and evaluation. The imaging performance of the projection optical system PL obtained under a plurality of exposure conditions determined by items (mask type, line width, evaluation amount, pattern information, etc.) and a combination of these optical conditions and evaluation items, For example, it is a database containing a calculation table composed of variations of various aberrations (or their index values) in each Zernike polynomial, for example, the amount of change per 1λ of the first to 37th terms, that is, a Zernike sensitivity table. The Zernike sensitivity table is also called Zernike Sensitivity. Therefore, a file made up of Zernike sensitivity tables under a plurality of exposure conditions is also called a “ZS file”.

  In the present embodiment, as the imaging performance for which Zernike sensitivity is calculated, the following 12 types of linear aberrations that are linear imaging performance with respect to each Zernike coefficient, that is, distortion in the X-axis direction and the Y-axis direction, 13 types of imaging with line width abnormal values as index values of 4 types of coma aberration, 4 types of curvature of field, 2 types of spherical aberration, and line width CD as nonlinear imaging performance for each Zernike coefficient Performance is included. Here, the line width as the nonlinear imaging performance for each Zernike coefficient includes the line width of the image of the line pattern formed on the image plane by the projection optical system PL, the line pattern extending in the vertical direction, Although there are line width differences with line patterns extending in the direction, line width differences between isolated lines and dense lines, etc., the line width CD of the image of the line pattern will be described below as a representative example. .

The optimization unit 550 calculates each current imaging performance based on the calculated wavefront aberration data and the imaging performance change table 563, and then the lens elements 13 _{1 to} 13 ₅ and the wavelength of the exposure illumination light. Then, a change in imaging performance when the wafer surface is temporarily moved is obtained. Then, the position of the lens elements 13 _{1 to} 13 _{5 in} the state where the imaging performance will be best, the wavelength of the illumination light for exposure, the position of the wafer surface, and the imaging performance prediction information at that time (the driving amount of the lens elements, etc.) (Adjustment parameters), residual error, and imaging performance) are output as optimization results. Here, the imaging performance is calculated in consideration of the lens element driving range acquired from the exposure apparatus 100 and the imaging performance error allowable value 564.

  In other words, here, the imaging performance required when the measured wavefront aberration amount exceeds the threshold value for wavefront aberration determined based on the above-mentioned various database information due to the demand for imaging performance. Adjustment parameters are calculated so that the imaging performance approaches.

In this embodiment, the wavefront aberration change table 562 with respect to the driving amount of the lens elements 13 _{1 to} 13 ₅ and the imaging performance change table 563 with respect to the wavefront aberration are included in the analysis apparatus 500. The exposure apparatus 100 has such information, and the analysis apparatus 500 may acquire the information from the exposure apparatus 100 when it becomes necessary to calculate the adjustment parameters of the projection optical system PL.

[Device manufacturing processing equipment group]
Returning to FIG. 1, the device manufacturing processing apparatus group 900 includes a CVD (Chemical Vapor Depositon) apparatus 910, an etching apparatus 920, and a process of planarizing the wafer W by performing chemical mechanical polishing. A CMP (Chemical Mechanical Polishing) apparatus 930 and an oxidation / ion implantation apparatus 940 are provided. The CVD apparatus 910 is an apparatus that generates a thin film on the wafer W, and the CMP apparatus 920 is a polishing apparatus that planarizes the surface of the wafer W by chemical mechanical polishing. The etching apparatus 920 is an apparatus for etching the developed wafer W, and the oxidation / ion implantation apparatus 940 forms an oxide film on the surface of the wafer W or introduces impurities into a predetermined position on the wafer W. A device for injecting. Also, a plurality of CVD apparatuses 910, etching apparatuses 920, CMP apparatuses 930, and oxidation / ion implantation apparatuses 940 are provided in the same manner as the exposure apparatus 100 and the like, and a transfer path for enabling the wafer W to be transferred between them. Is provided. In addition to this, the device manufacturing processing apparatus group 900 includes apparatuses that perform probing processing, repair processing, dicing processing, packaging processing, bonding processing, and the like.

[Management controller]
The management controller 160 centrally manages the exposure process performed by the exposure apparatus 100, and manages the C / D 110 and the measurement / inspection instrument 120 in the track 200, and controls their cooperative operation. As such a controller, for example, a personal computer can be adopted. The management controller 160 receives information indicating the progress status of processing and operations, information indicating processing results, and measurement / inspection results from each apparatus through a communication network in the device manufacturing processing system 1000, and The status of the entire production line is grasped, and each apparatus is managed and controlled so that the exposure process and the like are performed appropriately.

[Host system]
A host system (hereinafter referred to as “host”) 600 manages the entire device manufacturing processing system 1000 and controls the exposure apparatus 100, the track 110, the measurement / inspection instrument 120, and the device manufacturing processing apparatus group 900. It is. For the host 600, for example, a personal computer can be employed. The host 600 and other devices are connected via a wired or wireless communication network so that data communication can be performed between them. By this data communication, the host 600 realizes overall control of this system.

[Device manufacturing process]
Next, a flow of a series of processes in the device manufacturing processing system 1000 will be described. FIG. 5 shows a flowchart of this process, and FIG. 6 shows a flow of transfer of the wafer W in a part related to the repetitive steps in this series of device manufacturing processes and a flow of data transmitted / received via the communication network. It is shown. A series of processes of the device manufacturing processing system 1000 is scheduled and managed by the host 600 and the management controller 160. As described above, the wafers W are processed in lot units. FIGS. 5 and 6 show a series of processes for one wafer W. Actually, the processing shown in FIGS. 5 and 6 is repeated, for example, in a pipeline manner for each wafer in lot units.

  As shown in FIGS. 5 and 6, first, a film is formed on the wafer W in the CVD apparatus 910 (step 201), the wafer W is transferred to the C / D 110, and the wafer W is transferred onto the wafer W in the C / D 110. A resist is applied (step 202). Next, the wafer W is transferred to the measurement / inspection instrument 120, and the measurement / inspection instrument 120 selects a shot area (hereinafter referred to as a measurement target) from among a plurality of shot areas of the previous layer already formed on the wafer W. , The measurement shot) is subjected to pre-measurement inspection processing such as measurement of shot flatness (focus step in the shot area) and inspection of foreign matter on the wafer (step 203). The number and arrangement of the measurement shots can be arbitrary. For example, as shown in FIG. 6, the shots can be eight shots on the outer periphery of the wafer. The measurement result of the measurement / inspection instrument 120 (that is, the shot flatness of the measurement shot) is sent to the exposure apparatus 100 and the analysis apparatus 500. This measurement result is used for focus control during scanning exposure in the exposure apparatus 100.

  Subsequently, the wafer W is transferred to the exposure apparatus 100, and the circuit pattern on the reticle R is transferred onto the wafer W by the exposure apparatus 100 (step 205). At this time, the exposure apparatus 100 monitors the exposure amount, synchronization accuracy, and focus trace data during measurement shot exposure, and stores them as log data in an internal memory. Next, the wafer W is transferred to the C / D and developed by the C / D 110 (step 207). Thereafter, post-measurement inspection processing such as measurement of the line width of the resist image by the measurement / inspection instrument 120 and inspection of defects transferred onto the wafer W is performed (step 209). The measurement result (line width data) of the measurement / inspection instrument 120 is sent to the analysis apparatus 500. The analysis apparatus 500 performs analysis on the line width based on information from the exposure apparatus 100 or the measurement / inspection instrument 120 (step 211). As shown in FIG. 6, the analysis apparatus 500 issues a transfer request for various data to the measurement / inspection instrument 120 and the exposure apparatus 100 according to the progress of analysis and, as necessary, to each apparatus according to the analysis result. Issue analysis information. Details of the analysis process in the analysis apparatus 500 and the data flow in the analysis process will be described later. Further, after the analysis apparatus 500 acquires various data, the exposure apparatus 100 may promptly delete the trace data stored therein.

  On the other hand, the wafer W is transferred from the measurement / inspection instrument 120 to the etching apparatus 920, etched in the etching apparatus 920, impurity diffusion, wiring processing, film formation in the CVD apparatus 910, planarization in the CMP apparatus 930, oxidation / Ion implantation or the like in the ion implantation apparatus 940 is performed as necessary (step 213). Then, the host 600 determines whether all the processes are completed and all the patterns are formed on the wafer (step 215). If this determination is denied, the process returns to step 201, and if affirmed, the process proceeds to step 217. In this manner, a series of processes such as film formation / resist application to etching are repeatedly performed for the number of steps, whereby circuit patterns are stacked on the wafer W, and a semiconductor device is formed.

  After the repetition process is completed, the probing process (step 217) and the repair process (step 219) are executed in the device manufacturing processing apparatus group 900. In step 217, when a memory failure is detected, in step 219, for example, processing for replacement with a redundant circuit is performed. The analysis apparatus 500 can also send information such as the location where the detected line width abnormality has occurred to an apparatus that performs probing processing and repair processing. In the inspection apparatus (not shown), the portion where the line width abnormality has occurred on the wafer W can be excluded from the processing target for the probing process and the repair process in units of chips. Thereafter, dicing processing (step 221), packaging processing, and bonding processing (step 223) are executed, and a product chip is finally completed. Note that the post-measurement inspection process in step 209 may be performed after the etching in step 213. In this case, line width measurement is performed on the etching image on the wafer W.

[Analysis processing]
Next, the analysis process of the analysis apparatus 500 will be described in detail. FIG. 7 shows a flowchart of analysis processing in the analysis apparatus 500. As shown in FIG. 7, the analysis apparatus 500 first performs an initial setting process (step 301). The initial setting process includes, for example, a process for creating various databases in the database unit 560 described above. These creation processes are performed as described above, but exposure conditions (pattern line width in design, NA of projection optical system PL, illumination σ, illumination type (modified illumination) that may be set in exposure apparatus 100 are described. Etc.))). After this step 301 is performed, the process waits until a processing start command is received from the host 600 in step 303.

  When the processing start command is received, the determination unit 535 collects line width data (measured line width data 523) at each sample point of the measurement shot from the measurement / inspection instrument 120 via the transmission / reception unit 510 and stores the data in the storage device 520. It is stored (step 305), and it is determined whether or not the pattern line width on the wafer W is abnormal based on the measured line width data 523 (step 307). Here, a statistical value related to the difference between the measured value of the line width in the measurement shot and the design value is calculated, and the calculated statistical value is compared with a threshold value to detect a line width abnormality. As such a statistical value, an average value of the line width may be adopted, or an index value indicating a variation in the line width (for example, standard deviation, so-called 3σ that is three times the standard deviation, variance, etc.) may be adopted. Can do. Further, the sum of the average value and the index value indicating the variation (for example, the average value of the line width + 3σ) can be employed.

  The determination using this threshold is performed by comparing the statistical value of the difference between the actually measured line width and the designed line width with a predetermined threshold. Here, when it is determined that the line width is normal, the determination unit 535 transmits the determination result indicating that the line width is normal to the various apparatuses in the device manufacturing processing system 1000 as analysis information (FIG. 6). The process returns to step 303 and waits for the next processing start command. If it is determined that the line width is abnormal, the determination unit 535 transmits an activation signal to the simulation unit 530, and the processing procedure in the analysis apparatus 500 proceeds to step 309.

In step 309, the simulation unit 530 collects focus trace data, synchronization accuracy trace data, exposure amount trace data, log data such as wafer flatness data and control system parameter setting values from the exposure apparatus 100, and the like. Z _MEAN , Z _MSD , synchronization accuracy error (moving standard deviation), and exposure amount error (moving average), which are statistical values of focus control errors, are calculated on the basis of the above data, and the CD table group 552 is referred to for synchronization. An estimated value of the line width corresponding to the accuracy error, the exposure amount error, Z _MEAN , and Z _MSD is calculated. The simulation unit 530 stores the calculated estimated line width (line width estimation data 525) in the storage device 520. In the next step 311, the process proceeds to the processing of the comparison unit 540.

  Next, the comparison unit 540 determines whether the tendency of the estimated value of the line width matches the tendency of the actual measurement value, and checks their consistency (step 311). Then, the comparison unit 540 sends the comparison result to the optimization unit 550.

  Here, when the comparison result of the comparison unit 540 indicates that the actually measured value and the estimated value are substantially the same, the determination in step 311 of the optimization unit 550 is affirmed, and the cause of the line width abnormality Is determined to be the exposure apparatus 100, the process proceeds to step 313.

  In step 313, the optimization unit 550 determines whether each control error and device level difference of the focus / synchronization accuracy / exposure amount calculated in step 309 is within the standard. Here, when the statistical value regarding the focus is out of the standard, it is determined that the focus control or the shot flatness is included as a factor of the line width abnormality. Further, when the statistical value related to the synchronization error is out of the standard, it is determined that the synchronization error is included as a cause of the line width abnormality. Further, when the statistical value related to the exposure amount is out of the standard, it is determined that the exposure amount error is included as a factor of the line width abnormality. If at least one of the statistical values is out of the standard (exposure apparatus specifications), the determination is affirmed and the process proceeds to step 315. In step 315, the optimization unit 550 selects adjustment system parameters and control system parameters related to the control error identified as the cause of the line width abnormality, and optimizes the selected parameters.

  In the optimization of parameters in the optimization unit 550, each control is performed by referring to the CD table group 552 shown in FIG. 4 and executing a simulation with various combinations of control errors of various focus / exposure amounts / synchronization accuracy. Control system parameters may be adjusted so that the error approaches zero. Since the relationship between each control system parameter and each control error of focus / exposure amount / synchronization accuracy is known in advance, a set value of the control system parameter for making each control error close to 0 can be determined.

  On the other hand, if all the statistical values of the control errors are within the standard at step 313, the determination is denied and the process proceeds to step 317. In step 317, it is determined whether or not to optimize the control system parameter even if the statistical value of each control error is within the standard. If this determination is denied, the analysis process is terminated, and if affirmed, the process proceeds to step 317. In step 317, parameters of the non-adjustment system among the control system parameters are adjusted. Here, as in step 315, the control system parameters (however, only the non-adjustment system parameters) are adjusted so that each control error approaches zero. In this way, the pattern line width can be adjusted without stopping the exposure process in the exposure apparatus 100. Here, after adjusting the parameters of the non-adjustment system, the projection optical system PL may be further adjusted in step 323, that is, the lens may be optimized.

  On the other hand, if the comparison result of the comparison unit 540 does not match in step 311, line width abnormality other than exposure processing (film formation / resist processing, pre-measurement processing, development processing, post-measurement processing, etc.) It can be considered that there are other factors. If the optimization unit 550 refers to the comparison result and determines that this is the case this time, the optimization unit 550 proceeds to step 321. In step 321, the optimization unit 550 determines whether the C / D 110, the measurement / inspection instrument 120, or the like is abnormal based on log data from the C / D 110, log data from the measurement / inspection instrument 120, or the like. . For example, this determination is affirmed when there is coating unevenness in the C / D 110 that is considered to have a correlation with the line width abnormality or when the measurement state in the measurement / inspection instrument 120 is bad. If this determination is affirmative, the process proceeds to step 325, and a process stop request is set as the optimization result 526. Accordingly, this stop request is notified to the C / D 110, the measurement / inspection instrument 120, and the like via the transmission / reception unit 510. In various apparatuses, the operation is temporarily stopped and the operator can check the apparatus. The operator inspects the C / D 110, the measurement / inspection instrument 120, etc., investigates the cause of the line width abnormality, and removes it by adjusting the apparatus. Of course, in an apparatus in which the adjustment is automated, the apparatus adjustment may be automatically performed.

  On the other hand, referring to the log data, if there is no problem with the C / D 110 and the measurement / inspection instrument 120 and the determination is negative in step 321, the process proceeds to step 323. In step 323, the projection optical system PL is optimized (lens optimization).

  FIG. 8 shows an example of processing in step 323. This process starts when a test exposure processing request is made to the host 600 from the analysis apparatus 500 (optimization unit 550). In response to this request, the host 600 that manages the series of lot processing shown in FIGS. 5 and 6 suspends the lot processing and interrupts the processing without completely stopping the lot processing. An aberration measurement processing start command is issued to the substrate processing apparatus (100, 110, 120). That is, it can be said that the process shown in FIG. 8 is an interrupt process for the lot process shown in FIGS. The interrupt timing can be set to an arbitrary timing, but may be interrupted when processing for the next wafer is started. In this case, the host 600 needs to save information indicating the current state of lot processing.

  As shown in FIG. 8, in step 401, a test reticle on which a test pattern is formed is loaded onto reticle stage RST by a reticle exchange operation.

[Test pattern]
FIG. 9 shows an example of a test reticle _RT on which a test pattern is formed. In this test pattern, a light transmitting part PA is provided at a position corresponding to the illumination area IAR. This translucent part is provided with an array of 33 measurement points, and aberration measurement marks MP are respectively arranged at the measurement points. The aberration measurement mark MP will be described later.

  Returning to FIG. 8, in C / D 110, a resist is applied onto a test wafer for measurement onto which a test pattern is transferred (step 403). The test wafer is transferred to the measurement / inspection instrument 120 where the shot flatness is measured (step 405). Then, the test wafer is transferred to the exposure apparatus 100 where test exposure is performed (step 407). Since the exposure here is an aberration measurement of the projection optical system PL, the exposure may be performed while the reticle stage RST and the wafer stage WST are stationary. As the transfer position of the test pattern on the wafer W here, it is desirable to select the flattest place based on the measurement result of the shot flatness measured in advance.

  As the aberration measurement mark MP, as shown in FIG. 10, it is possible to employ a mark in which two box-in-box marks are arranged side by side at regular intervals. The arrangement direction is not particularly limited as long as it is an XY plane. In the test exposure of step 407, after the test pattern is transferred once to the test wafer, the wafer stage WST is shifted by the interval between the two marks, and the transfer is performed once more. Then, transfer is formed on the test wafer so that the two mark patterns are superimposed.

  FIG. 11 shows an example of the result of double transfer of two marks on the wafer W. As shown in FIG. 11, an outer thick box mark and several inner thin box marks are transferred and formed as these two marks. If the projection optical system PL has an odd function aberration represented by coma aberration as described above (an aberration in which the radial function of the Zernike polynomial is an odd function), in the transfer pattern shown in FIG. A positional shift occurs between the relative position of the outer thick box mark and the inner thin box mark. In the present embodiment, as will be described later, this lateral shift amount is measured by the measurement / inspection instrument 120, and finally, the optimization unit 550 calculates the odd-function aberration component of the projection optical system PL. Become.

In addition, at each measurement point of the test reticle _RT , two marks for measuring even function aberration (aberration where the radial function of the Zernike polynomial is an even function) are provided. The two marks are the same as the marks shown in FIG. 10 when viewed in shape and arrangement, but the cross-sections are different. FIG. 12 shows a cross section of the left mark of these two marks and a thin diffraction grating box mark inside (a part of the cross section of AA ′ in FIG. 10). As shown in FIG. 12, a step is provided in the transmission part of the thin diffraction grating. The ratio of the widths of the two parts separated by the step is 1: 1 with respect to the arrangement direction of the grating, and the ratio of the light shielding parts to them is n (n is a real number): 1: 1. It has become. This level difference is provided so that the phase difference of light transmitted through each of the two portions is π / 2. Thereby, the intensity | strength of any one of the + 1st order diffracted light and -1st order diffracted light which generate | occur | produce in this diffraction grating is reduced. In this state, the transfer positions of these marks on the wafer W are shifted according to the defocus amount (that is, the direction of the optical axis AX of the projection optical system PL).

  Note that the step direction of the diffraction grating mark (that is, the direction determined by the arrangement order of the convex portion and the concave portion separated by the step) is defined as the direction shown in FIG. 13 (for example, the direction of the arrow is the concave portion). ing. In such a case, if there is even function aberration in the projection optical system PL, the transfer position of the inner diffraction grating-like box mark is laterally shifted from the transfer position of the outer box mark. . As will be described later, this lateral shift amount is measured by the measurement / inspection instrument 120, and finally the component of the odd function aberration of the projection optical system PL is measured.

  Note that the pitch of the diffraction grating mark, the line pattern, or the exposure condition in the exposure apparatus 100 is in accordance with the pattern pitch, the line width, and the exposure condition of the reticle used in the actual process. This is desirable from the viewpoint of sensitivity of imaging performance.

The test wafer subjected to the test exposure is sent to the C / D 110 and developed (step 409). Then, the test wafer is transferred to the measurement / inspection instrument 120, and the measurement / inspection instrument 120 measures the relative displacement between the outer mark and the inner mark of the box-in-box mark (step 411). This measurement result is sent to the analysis device 500 and stored in the storage device 520 as measurement data relating to the wavefront aberration of the projection optical system PL. In addition, the optimization unit 550 requests the exposure apparatus 100 to transfer various data. As the data, the current position and the lens element _{131-134 5} of the projection optical system PL, and there are data such as driving range of the lens elements _{131-134 5.} Based on this measurement result, the optimization unit 550 creates a simultaneous equation of odd-function aberration among the first to 37th terms of the Zernike polynomial, and obtains the magnitude of the coefficient of each term from the simultaneous equation. In other words, the relative displacement of the observed mark includes the effects of low-order odd-function aberration and high-order odd-function aberration, and low-order even-function aberration and high-order even function aberration. They need to be separated into values for each term of the Zernike polynomial. In order to increase the number of simultaneous equations, a plurality of aberration measurement marks having different pitches are prepared at measurement points, or test exposure is performed under a plurality of different exposure conditions to increase the number of measurement data. There is a need. As a result, the coefficients from the first to the 37th terms of the Zernike polynomial, that is, wavefront aberration data are obtained.

Further, the optimization unit 550, as described above, the wavefront aberration data, various data acquired from the exposure apparatus 100, the current position of the lens elements 13 _{1 to} 13 ₅ , the lens element driving range, and the lens element The wavefront aberration change table 562 with respect to the drive amount, the imaging performance change table 563 with respect to the wavefront aberration, and the imaging performance error allowable value 564 are input, and the wavefront calculated from the measurement result of the measurement / inspection instrument 120 using them. based on the aberration data, as an optimization result 526, the adjustment value of the drive amount _{131-134 5} and the exposure wavelength of the lens element, and the adjustment value of the orientation of the wafer stage WST, and residual error, and imaging performance after driving Is set in the storage device 520. Since these calculation methods are disclosed in the pamphlet of International Publication No. 2003/065428, detailed description thereof is omitted here.

Data such as the calculated adjustment amount of the wavefront aberration of the projection optical system PL is sent to the exposure apparatus 100 as the optimization result 526. The main controller 50 of the exposure apparatus 100 sets the calculated adjustment parameter via the imaging performance controller 48 or the like. As a result, the lens elements 13 _{1 to} 13 _{5 of the} projection optical system PL are driven via the imaging performance controller 48 and the like. After this adjustment, step 323 may be performed again, and the wavefront aberration of the projection optical system PL may be measured to check whether the imaging performance satisfies the requirement. In this way, the imaging characteristics of the projection optical system PL may repeat step 323.

Note that the test reticle _RT for measuring the wavefront aberration of the projection optical system PL is not limited to that described above. Various methods can be adopted as a method for measuring the wavefront aberration of the projection optical system PL, and the present invention is not limited to this method.

  After execution of steps 315, 319, 323, and 325, the optimization result 526 of the storage device 520 stores the results of optimization performed in those steps. The transmission / reception unit 510 sends the optimization result 526 to the exposure apparatus 100 as analysis information (see FIG. 6). In the exposure apparatus 100, the set value of the control system parameter is updated to the optimum value sent, and the exposure process is continued in the updated state in the future. Thereafter, the analysis apparatus 500 returns to Step 303 and waits again until a process start command is received. The host 600 resumes the interrupted lot processing.

  Note that the analysis processing in the analysis apparatus 500 described above is independent of the processing in other apparatuses, and hardly affects the throughput of device manufacturing. The lens optimization process in step 323 is also performed as an interrupt process for the normal lot process, and the interrupt process and the test exposure in the lens adjustment are similar to a series of process wafer processes by simply exchanging the reticle. Since it can be performed, it is not necessary to stop the lot processing completely, so that the projection optical system PL can be adjusted quickly.

  As described in detail above, according to the device manufacturing processing system 1000 according to the present embodiment, the wafer on which the device pattern on the reticle R is transferred and formed in the analysis apparatus 500 via the projection optical system PL of the exposure apparatus 100. The pass / fail of the pattern line width is determined by comparing the measurement / inspection result of the actual line width of W with the line width value of the simulation, and the determination result (analysis information in FIG. 6) is sent from the analysis device 500 to the host 600. (Or management controller 160), exposure apparatus 100, C / D 110 and measurement / inspection instrument 120. As shown in FIG. 8, the host 600 (or the management controller 160), the exposure apparatus 100, the C / D 110, and the measurement / inspection instrument 120 (ie, the substrate processing apparatus) measure the aberration of the projection optical system PL as a whole. It can be regarded as an image characteristic measuring apparatus. In this imaging characteristic measurement apparatus, it is possible to determine whether or not the aberration measurement of the projection optical system PL is necessary with reference to the determination result, so that the processing can be made efficient.

  Further, according to the present embodiment, in the determination result by the analysis apparatus 500, when the measurement inspection result (line width actual measurement value data 523) falls below a predetermined reference, in step 323, the imaging characteristic measurement is performed. Before the apparatus performs measurement of the wavefront aberration of the projection optical system PL, the simulation unit of the analysis apparatus 500 performs data related to the measurement inspection result other than the wavefront aberration of the projection optical system PL (that is, the log of the exposure apparatus 100). Data and shot flatness data of the measurement / inspection instrument 120) are collected. Aberration measurement of the projection optical system PL needs to be performed strictly, and it takes time, so the data related to other factors that are relatively easy to correct is preferentially analyzed to optimize the optimization process. It is.

  In the present embodiment, the measurement inspection result for performing the determination is the line width of the line pattern formed on the wafer W in the exposure apparatus 100, but is not limited thereto. For example, the diameter of a circular contact hole or the length of one side of a rectangular pattern may be used. In short, any measurement inspection result that can determine whether or not the pattern is transferred and formed according to the design value may be used.

  In the present embodiment, the control system parameters and the projection optical system PL are optimized only when an abnormality in the line width of the pattern is detected. However, the present invention is not limited to this. Control system parameters and projection optics at any timing, such as when the manufacturing processing system environment, for example, when atmospheric pressure fluctuates significantly, exposure power is large, and line width variation due to lens aberration is recognized to be large The system PL can be optimized. Further, the control system parameters and the projection optical system PL may be always optimized every several wafers or periodically (at intervals such as one week or one month). In this case, in step 307 (FIG. 7), it is determined whether or not the wafer W is the object of optimization. Also in this case, as described above, the number of wafers to be optimized can be increased or decreased according to the detection frequency of the pattern whose line width is determined to be abnormal.

  In the present embodiment, the measurement / inspection instrument 120 measures the line width only for measurement shots selected in advance for each wafer. However, the frequency of line width measurement is increased or decreased according to the frequency of occurrence of abnormality. It may be. For example, when the number of measurement shots in which line width abnormality is confirmed increases, the number of measurement shots in the wafer W can be increased, and when the number of measurement shots in which line width abnormality is confirmed decreases. It is also possible to reduce the number of measurement shots. Further, the measurement of the line width abnormality may not be performed on all the wafers, and may be performed every several sheets. For example, if no abnormality in the line width occurs continuously for a predetermined number of sheets, the line width measurement is performed every three wafers. If no abnormality in the line width continues after that, the number of line width measurements is set to the wafer 10. The line width can be measured only for the wafer at the head of the lot. Of course, when a new line width abnormality occurs, it is of course necessary to increase the measurement frequency of the line width.

  Further, in the present embodiment, the data related to the measurement inspection other than the wavefront aberration of the projection optical system PL collected when the measurement inspection result is below a predetermined reference, that is, the log data during the exposure of the exposure apparatus 100 is the wafer data. Data relating to the focus control error related to the position of the wafer W with respect to the position in the direction of the optical axis AX (Z-axis direction) of the projection optical system when the exposure apparatus 100 exposes the reticle pattern image; , When the exposure apparatus 100 exposes the image of the reticle pattern, data relating to the synchronization accuracy error relating to the relative position between the wafer W and the reticle on which the device pattern of the reticle R is formed, and the wafer W of the reticle R in the exposure apparatus 100 And data relating to an exposure amount error relating to the amount of exposure light when an image of the device pattern is exposed. In the exposure apparatus 100, factors other than the aberration of the projection optical system PL that affect the pattern line width on the wafer W are mainly these three types. However, in the present invention, at least one of these data may be collected.

  Further, according to the present embodiment, in the analysis apparatus 500, the data related to the focus control error, the data related to the synchronization control error, and the data related to the exposure amount error are stored and held in the exposure apparatus 100 when the exposure process is executed. It is calculated | required based on each performance data (log data). According to this embodiment, the exposure result of the reticle pattern by the exposure apparatus 100 is simulated based on the data related to the focus control error, the data related to the synchronization accuracy error, and the data related to the exposure amount error, and the simulation result (line (Estimated width data) and the measurement inspection result (line width actual value data) in the measurement / inspection instrument 120 are compared, and the necessity of measurement of the wavefront aberration of the projection optical system PL is determined according to the comparison result. . Note that it is not necessary to use all of the exposure amount error relating to the amount of exposure light, the data relating to the synchronization accuracy error, and the data relating to the focus control error for the line width estimation. Further, the data used for estimating the line width is not limited to the above three types of data. For example, illumination unevenness information measured by the measurement / inspection instrument 120, log data of the C / D 110 and measurement / inspection instrument 120, process information of the device manufacturing processing apparatus group 900, and the like can also be included.

  In addition, according to the present embodiment, data other than the wavefront aberration of the projection optical system PL collected when the measurement / inspection result of the measurement / inspection instrument 120 is below a predetermined reference is not exposed by the exposure apparatus 100. The processing apparatus for processing the wafer W, for example, data relating to the C / D 110 and data relating to the measurement / inspection instrument 120 are included. By collecting these data, when the C / D 110 and the measurement / inspection instrument 120 cause the measurement / inspection result to fall below a predetermined standard, the wavefront aberration of the projection optical system PL is not measured. , It becomes possible to determine the cause.

  In the present embodiment, the analysis apparatus 500 determines the measurement / inspection result, estimates the line width based on the log data of the exposure apparatus 100, compares the estimated value with the actual measurement value, and various types according to the comparison result. Although the parameter optimization process is performed, the optimization process may be performed by the host 600, the management controller 160, or the main controller 20 of the exposure apparatus 100. In this case, the comparison result of the comparison unit in the analysis apparatus 100 is sent to the main controller 20 of the exposure apparatus 100 via the transmission / reception unit 510 and the communication network, and the wavefront aberration of the projection optical system PL is measured. Whether or not to execute is determined by the host 600 or the main controller 20.

  In this embodiment, in step 323, a test reticle on which a test pattern suitable for measuring wavefront aberration by the projection optical system PL of the exposure apparatus 100 is formed is loaded into the exposure apparatus 100, and the exposure apparatus 100 performs the test. An image of the pattern was exposed on the front wafer, and measurement data related to the wavefront aberration of the exposure apparatus 100 was obtained based on the test pattern exposed on the wafer. In this way, the wavefront aberration of the projection optical system PL can be measured in exactly the same flow as the normal wafer process, and the optimization of the projection optical system PL can be realized without interrupting lot processing. .

  In this embodiment, the aberration measurement mark in the test pattern is a box-in-box mark, but the present invention is not limited to this. For example, it may be a burn-in mark, a frame-in-frame mark, or a combination of a line-and-space pattern in which the X direction and the Y direction are arranged directions. Various types of marks that can be used are described in, for example, Japanese Patent Application Laid-Open No. 2001-93819, and detailed description thereof is omitted.

  In the present embodiment, the method for measuring the aberration of the projection optical system PL is not limited to the test exposure. For example, if a measurement device for measuring the aberration of projection optical system PL is provided on wafer stage WST, the measurement device may be used to measure the aberration of projection optical system PL. In this case, this measuring device and the main controller 20 that controls the measuring device serve as an imaging characteristic measuring device. In this way, it is not necessary to perform test exposure, and the throughput can be further improved.

  In this embodiment, the wavefront aberration of the projection optical system PL is expressed by a Zernike polynomial, and the projection optical system PL is adjusted based on the Zernike polynomial. However, the present invention is not limited to this. For example, each aberration amount such as spherical aberration, field curvature, astigmatism, coma aberration, distortion, etc. of Seidel's 5-aberration projection optical system PL is individually measured, and the projection optical system PL is adjusted based on the measurement results. You may make it.

  Further, according to the present embodiment, when a line width abnormality is detected, the control system parameters and the projection optical system PL of the exposure apparatus 100 are optimized, but the wafer W in which the line width abnormality is detected is optimized. Some kind of measures will be required. For example, for wafers where line width abnormalities have been confirmed in most of the measurement shots, there is a high possibility that line width abnormalities have occurred even in shot areas that are not measurement shots. If the resist image is still formed, the resist image may be peeled off and the processing after the resist coating on the wafer W may be performed again.

  Further, for the wafer W in which the line width abnormality is confirmed to be about one, for example, it is considered that the line width abnormality has occurred locally. Only the measurement shot can be designated as a shot area to be excluded from the subsequent processing target. In addition, when a plurality of chip areas are included in one shot area, the chip area including the circuit pattern can be excluded from subsequent processing targets in units of chips. Examples of such subsequent processing targets include probing processing and repair processing. In this way, it is possible to improve the processing efficiency by omitting those processes for the portion where the problem has occurred. In addition, while the wafer W is being processed in units of lots, if a large number of line width abnormalities occur continuously in a plurality of wafers W, all the wafers W in that lot may be rejected. As described above, by excluding the chip area, shot area, wafer, lot, and the like including the circuit pattern in which the line width abnormality is detected from the subsequent processes, the efficiency of the process can be improved. Information regarding such rejection is also sent to each apparatus as analysis information shown in FIG. Based on the information, each apparatus does not perform processing on the chip area, shot area, wafer, lot, etc. to be excluded.

  In this embodiment, there is one determination level (threshold) for abnormal line width, but a plurality of determination levels can be provided. In this way, it becomes possible to change the processing state of various devices to be executed thereafter according to each determination level. For example, when two threshold values are set, and the deviation between the measured line width and the design value is between the two threshold values, only the control system parameters of the exposure apparatus 100 are optimized, and pattern rejection is performed. If the deviation between the measured line width and the design value exceeds a high threshold value, both optimization of the control system parameters and pattern rejection can be performed. In addition to this, it is possible to adjust the processing contents of the C / D 110, the measurement / inspection instrument 120, each device of the device manufacturing processing apparatus group 900, and the like in addition to the exposure apparatus 100 in a stepwise manner.

  In addition, when the analysis apparatus 500 confirms an abnormality in the line width, the analysis apparatus 500 may notify the various processing apparatuses of the fact as analysis information.

  In the present embodiment, the causal relationship between the log data of the exposure apparatus 100 and the pattern line width on the wafer W is first analyzed. However, the exposure apparatus 100 is not the only processing apparatus that affects the pattern line width. For example, uneven application of the resist applied on the wafer in the C / D 110 greatly affects the line width of the pattern to be formed. Therefore, it is possible to analyze the causal relationship between not only the exposure apparatus 100 but also another processing apparatus and the pattern line width, so that it is possible to specify whether the fluctuation factor of the line width is in the exposure apparatus 100 or in another processing apparatus. It is more desirable to do. Therefore, in the present embodiment, the variation in the size of the circuit pattern on the wafer is determined based on the degree of coincidence between the estimated value of the line width of the circuit pattern estimated from the processing state of the exposure apparatus 100 and the measured value of the line width. It is determined whether or not the factor is in the exposure apparatus. If it is determined that the variation factor is not in the exposure apparatus, the C / D 110 and the measurement / inspection instrument 120 are checked.

  In the present embodiment, the processing contents of the exposure apparatus 100 include processing conditions (control errors in focus, exposure amount, and synchronization accuracy during scanning exposure) in addition to processing conditions such as exposure conditions and pattern design information. It is. A table indicating the relationship between the processing state of the exposure apparatus 100 and the line width of the circuit pattern is provided for each of a plurality of different set values of processing. In this table, only sample values of the relationship between the processing content of the exposure apparatus 100 and the line width of the circuit pattern are registered. An estimated value of the line width corresponding to the processing content can be calculated. In this way, the capacity of the memory for storing the table can be reduced, and the time required for obtaining the estimated value of the pattern line width can be shortened compared to searching for a table having a large number of cells. That is, table management becomes easy.

  The CD table group 552 may be provided not only for each exposure state in the exposure apparatus but also for each processing state of another processing apparatus in addition to the exposure state. For example, the film thickness of the resist applied by C / D 110 can be added as processing conditions similar to the exposure conditions. The processing apparatus corresponding to such processing conditions is mainly a preprocessing apparatus that performs pre-exposure processing. Examples of the pre-processing apparatus include a C / D 110 that applies a resist on the wafer W and a measurement / inspection instrument 120 that measures shot flatness. The processing contents of the measurement / inspection instrument 120 include an error value included in the processing result. Further, even processing conditions of a post-processing apparatus that performs post-exposure processing can be added as processing conditions in the table. For example, measurement errors in the measurement / inspection instrument 120, PEB processing conditions (temperature uniformity, etc.) and development processing conditions in the C / D 110 can be added as processing conditions, and the measurement object in the measurement / inspection instrument 120 is not a resist image. In the case of an etching image, the processing result of the etching apparatus 920 can be added as a processing condition. In this way, not only the exposure apparatus but also the line width abnormality detection, the apparatus identification of the line width variation factor, and the line width variation factor identification can be performed in consideration of the processing contents of various processing apparatuses.

  In addition, according to the present embodiment, based on the focus of the exposure apparatus, the exposure amount, each trace data of the synchronization accuracy, and the wavefront aberration of the projection optical system PL, the variation factor of the line width of the circuit pattern is specified from among them. To do. The identification method is to compare the statistical value of the control error, which is a candidate for the variation factor during the transfer of the pattern calculated from various trace data, with the specified value of the control error, It is specified as a variation factor of the line width. As such statistical values, it is possible to adopt moving average values, moving standard deviations, etc. of control errors, but with regard to synchronization accuracy, the moving standard deviation representing the variation is more line width than the moving average value. In this embodiment, the moving standard deviation is adopted. However, it goes without saying that a moving average may be adopted for the synchronization accuracy, and both the moving average and the moving standard deviation may be adopted for the synchronization accuracy and the exposure amount as well as the focus. Further, although the statistical values of the focus control error are the Z average offset (moving average) and the Z moving standard deviation, SFQR and SFQD can also be used. Here, SFQR is the difference between the maximum value and the minimum value of the residual flatness on the wafer surface from the best-fit reference surface that minimizes the local flatness for each site in a state where the wafer back surface is attracted to the holder plane ( Range). SFQD means the maximum distance (deviation) of the residual flatness of the wafer surface from the best-fit reference surface that minimizes the local flatness for each site in a state where the wafer back surface is attracted to the holder plane.

  In the present embodiment, the measurement / inspection instrument 120 measures the shot flatness of the wafer W before exposure, but the present invention is not limited to this. For example, after loading the wafer W into the exposure apparatus, the stage holding the wafer W is kept horizontal (that is, without performing the focus control), and is synchronously scanned in the same manner as the scanning exposure, and then observed by the focus control system. The shot flatness may be measured based on the variation of the wafer surface, or the gradient obtained by subtracting the Z position and the tilt amount of the wafer stage from the focus trace during the previous scanning exposure may be used as the shot flatness data. You may make it measure as. Note that such a method for measuring shot flatness data is disclosed in, for example, Japanese Patent Application Laid-Open No. 2001-338870, and detailed description thereof is omitted.

  In this embodiment, the Z average offset and the Z movement standard deviation, which are statistical values of the focus control error, are based on the shot flatness (device topography). However, the present invention is not limited to this. In calculation, shot flatness need not be considered.

  Further, according to the present embodiment, the optimum value of the control system parameter is calculated as the adjustment information for adjusting the processing content specified as the variation factor of the pattern size. In this case, as a rule, a table showing the relationship between the statistical value of the processing contents in the exposure apparatus and the line width of the pattern is referred to, and various statistics are set so that the statistical value of focus, exposure amount, and synchronization accuracy approaches zero. Control system parameters will be adjusted, but if such adjustments are difficult, control system parameters should be set so that the effect on the line width of the pattern for the processing content specified as the variation factor is offset. You may make it adjust. Also in this case, the above table group can be used for adjusting the control system parameters. That is, it is possible to search for a cell whose various statistical values are not 0, but whose line width is as designed, and adjust the control system parameters so that the statistical value becomes the value. Further, by referring to this table, it is possible to specify the processing contents that particularly affect the line width, and therefore it is possible to narrow down the control system parameters to be adjusted to those related to the specified processing contents. As a result, the number of control system parameters to be adjusted can be reduced, and the adjustment efficiency can be improved. Further, when it is difficult to adjust the control system parameters only by adjusting the focus, the synchronization accuracy, and the exposure amount, the exposure conditions and the pattern design conditions can be changed. In this case, the processing conditions of other processing apparatuses such as the resist film thickness and PEB temperature control applied by the C / D 110 may be changed.

  In this embodiment, when optimization of the control system parameter is to be performed even if the exposure amount / synchronization accuracy / focus is not out of the standard, only the non-adjustment system parameter is adjusted instead of the adjustment system parameter. It is targeted. In this way, it is not necessary to stop the operation of the apparatus, so that the throughput is improved.

  As described above, in the device manufacturing processing system 1000 according to the present embodiment, the number of adjustable line width fluctuation factors is not limited, so that more parameters can be adjusted. Adjustment is possible and pattern line width accuracy is improved. As a result, it is possible to quickly cope with line width abnormalities and the like, and to quickly optimize parameters, thereby improving the yield of device manufacturing.

  In the device manufacturing processing system 1000 according to the present embodiment, in the analysis process in the analysis apparatus 500, each processing apparatus such as the exposure apparatus 100 and the measurement / inspection instrument 120 can send the contents of each process to the analysis apparatus 500. It has become. In other words, the exposure apparatus 100 can output not only information relating to the processing results but also information relating to the processing conditions and the state during the processing to the outside of the apparatus. Similarly, each device of the measurement / inspection instrument 120, the C / D 110, the device manufacturing processing apparatus group 900, and the like can output not only the processing results but also information on processing conditions and processing states to the analysis apparatus 500. You may be able to.

  In the present embodiment, the analysis result of the analysis apparatus 500 is sent as analysis information to the exposure apparatus 100, the C / D 110, the measurement / inspection instrument 120, and the device manufacturing processing apparatus group 900 even during a series of processes. It is done. Each device includes a receiving unit that receives the analysis information. These pieces of analysis information include device parameter adjustment information for each device, and each device changes its own device parameter setting value based on this adjustment information. In this way, the apparatus can be adjusted even during the lot processing, and a quick response to the deterioration of the line width becomes possible.

  The analysis apparatus 500 may be incorporated in the measurement / inspection instrument 120, the exposure apparatus 100, or another processing apparatus. In this case, since it is necessary to perform analysis regarding the line width by the measurement / inspection instrument 120, the exposure apparatus 100, or another processing apparatus, during the execution of a series of processes, similar to the analysis apparatus 500, A transmission / reception interface for transmitting / receiving data is required.

  In addition, the device manufacturing processing system 1000 according to the present embodiment is a system that appropriately performs line width management in the exposure apparatus 100 by cooperation between the exposure apparatus 100 and the measurement / inspection instrument 120 via the analysis apparatus 500. Since they are connected inline, processes such as resist coating, pre-measurement inspection, exposure, post-measurement inspection, and development are performed in a short period of time, and the measurement results are analyzed. Therefore, effective line width management is possible.

  Further, although the setting value data of the control system parameters is sent from the exposure apparatus 100 to the analysis apparatus 500 together with various trace data, these data need not be sent. The analysis apparatus 500 calculates the change amount of the set value of the control system parameter and sends it to the exposure apparatus 100, and the exposure apparatus 100 may change the set value of the control system parameter by the change amount. Also, the exposure conditions are not limited to those described above, and any exposure conditions that affect the line width, pattern design conditions, synchronous control control conditions, and processing results of other processing apparatuses can be specified. be able to.

  In the present embodiment, the data acquired from the exposure apparatus 100 is the control trace data of exposure amount / synchronization accuracy / focus. However, the exposure apparatus 100 calculates the statistical values of the control errors in advance. You may make it send a statistics value to the analysis apparatus 500. FIG. In this case, it is not necessary to send the trace data to the analysis apparatus 500.

  If a table similar to the CD table group 552 is created for each process such as resist processing, development processing, and etching processing, and each processing condition is notified to the analysis apparatus 500, more optimal line width management is realized. Is done. That is, a table indicating the relationship between the processing state of various apparatuses other than the exposure apparatus and the line width may be managed, and the line width may be analyzed using the table.

  In this embodiment, the measurement / inspection instrument 120 is connected inline with the exposure apparatus 100 and the like. However, the measurement / inspection instrument is an offline measurement / inspection instrument that is not connected inline with the exposure apparatus 100 and the track 200. May be. Moreover, the measurement / inspection instrument for performing the pre-measurement inspection and the measurement instrument for performing the post-measurement inspection may be provided separately, and either one of them may be off-line instead of in-line.

  In the present embodiment, the exposure apparatus 100 is a step-and-scan type exposure apparatus, but is not limited thereto, and may be a step-and-repeat type or other type of exposure apparatus. As represented by this, the various apparatuses are not limited to those types. The present invention is not limited to a semiconductor manufacturing process, and can be applied to a manufacturing process of a display including a liquid crystal display element. Line width in all device manufacturing processes, including the process of transferring the device pattern onto the glass plate, the manufacturing process of the thin film magnetic head, the manufacturing process of the imaging device (CCD, etc.), micromachine, organic EL, DNA chip, etc. Of course, the present invention can be applied to management.

  In the above embodiment, the analysis apparatus 500 is a PC, for example. That is, the analysis processing in the analysis apparatus 500 is realized by executing an analysis program on a PC. As described above, this analysis program may be installable on the PC via a medium, or may be downloadable to the PC via the Internet or the like. Of course, the analysis apparatus 500 may be configured by hardware.

  As described above, the device manufacturing processing method, the device manufacturing processing system, the program, and the storage medium of the present invention are suitable for manufacturing a device by an apparatus including an optical system.

It is a figure which shows schematic structure of the device manufacturing processing system which concerns on one Embodiment of this invention. It is a figure which shows schematic structure of exposure apparatus. It is a figure which shows schematic structure of an analyzer. It is a figure which shows an example of the database with which the relationship between a control error and line | wire width is registered. It is a flowchart which shows the flow of a device manufacturing process. It is a flow which shows the flow of the wafer of a device manufacturing process, and data. It is a flowchart which shows an example of an analysis process. It is a flow for demonstrating the aberration measurement of a projection optical system. It is a figure which shows an example of a test pattern. It is a figure which shows an example of the mark for aberration measurement. It is a figure which shows an example of the transcription | transfer result of the mark for aberration measurement. It is a figure which shows the cross section of the mark for aberration measurement. It is a figure which shows the level | step difference direction of the diffraction grating of the measurement mark of even function aberration.

Explanation of symbols

10 ... illumination system 13, 13 ₁ to 13 ₅ ... lens element, 15 ... iris pupil opening, 20 ... main control unit, 32 ... condenser lens, 48 ... imaging performance controller, 51 ... index table 52 ... table group, 60a, 60b ... multi-point AF sensor, 100 ... exposure device, 110 ... C / D, 120 ... measurement / inspection instrument, 160 ... management controller, 200 ... track, 500 ... analysis device, 510 ... transmission / reception unit, 520 ... storage device, 521 ... Log data, 522 ... Pre-measurement result data, 523 ... Line width estimated value data, 524 ... Data relating to wavefront aberration, 525 ... Line width estimated value data, 526 ... Optimization result, 530 ... Simulation section, 535 ... Determination section 540 ... Comparison unit, 550 ... Optimization unit, 552 ... CD table group, 560 ... Database unit, 562 ... Wavefront aberration change table 563 ... Imaging performance change table, 564 ... Imaging performance error tolerance, 600 ... Host system, 900 ... Device manufacturing processing apparatus group, 1000 ... Device manufacturing processing system, M ... Reflection mirror, IA ... Exposure area, IAR ... Illumination Area, MP ... mark for aberration measurement, PA ... translucent portion, PL ... projection optical system, R ... reticle, R _T ... test reticle, RST ... reticle stage, W ... wafer, WST ... wafer stage.

Claims (34)

Measuring and inspecting a substrate exposed with a predetermined pattern image through the optical system by an exposure apparatus including an optical system, using a measurement and inspection apparatus that performs a predetermined measurement and inspection on the substrate;
Whether the measurement test result in the test apparatus drops below a predetermined criterion, it determined using the determination device,
A device manufacturing processing method in which a determination result is transmitted by the determination device to an image formation characteristic measurement device that measures image formation characteristic information by an optical system of the exposure apparatus. In the device manufacturing processing method according to claim 1,
The determination device according to the determination result, indicating that the measurement and inspection results is below the predetermined reference,
Before the imaging characteristic measurement device executes measurement of the imaging characteristic information of the optical system, information related to the measurement inspection result other than the imaging characteristic information of the optical system is collected. Device manufacturing processing method. The device manufacturing processing method according to claim 2,
The device manufacturing processing method, wherein the measurement / inspection apparatus performs a measurement / inspection of a line width of a pattern on a substrate exposed by the exposure apparatus. In the device manufacturing processing method according to claim 3,
Information on the measurement and inspection of non-imaging characteristic information of the optical system to be collected to indicate that the measurement and inspection results is below the predetermined criterion,
Focus control error information related to the position of the substrate with respect to the position in the optical axis direction of the optical system when the substrate is exposed with the image of the predetermined pattern by the exposure apparatus;
Synchronization accuracy error information regarding the relative position between the substrate and the mask on which the predetermined pattern is formed when the substrate is exposed to the image of the predetermined pattern by the exposure apparatus;
A device manufacturing processing method comprising: at least one of exposure amount error information relating to an amount of exposure light when the substrate is exposed to an image of the predetermined pattern by the exposure apparatus. The device manufacturing processing method according to claim 4,
At least one of the focus control error information, the synchronization accuracy error information, and the exposure amount error information is obtained based on performance data at the time of execution of exposure processing stored and held in the exposure apparatus, Device manufacturing processing method. The device manufacturing processing method according to claim 5,
Based on at least one of the focus control error information, the synchronous control accuracy error information, and the exposure amount error information, the exposure result of the predetermined pattern by the exposure apparatus is simulated,
Compare the result of the simulation with the result of the measurement inspection in the measurement inspection apparatus,
A device manufacturing processing method characterized by determining whether or not the imaging characteristic information of the optical system needs to be measured by the imaging characteristic measuring device according to a comparison result. In the device manufacturing method according to claim 3,
Information relating to the measuring device other than the imaging characteristic information of the optical system to be collected to indicate that the measurement and inspection results is below the predetermined criterion,
The device manufacturing processing method characterized by including the information regarding the processing apparatus which performs a predetermined process with respect to a board | substrate before exposing with the said exposure apparatus, or the information regarding the said measurement / inspection apparatus. In the device manufacturing processing method according to claim 3,
In the imaging characteristic measuring device,
On the basis of the measurement test result information relating to the measurement and inspection of non-imaging characteristic information of the optical system to be collected to indicate that less than the predetermined criterion, whether to execute the measurement of the imaging characteristics A device manufacturing processing method, characterized by: determining. The device manufacturing processing method according to claim 8.
Information on the measurement and inspection of non-imaging characteristic information of the optical system to be collected to indicate that the measurement and inspection results is below the predetermined criterion,
Focus control error information related to the position of the substrate with respect to the position of the optical system in the optical axis direction when the image of the predetermined pattern is exposed by the exposure apparatus;
Synchronization accuracy error information relating to a relative position between the substrate and the mask on which the predetermined pattern is formed when the substrate is exposed to an image of the predetermined pattern by the exposure apparatus;
A device manufacturing processing method comprising: at least one of exposure amount error information relating to an amount of exposure light when the substrate is exposed to an image of the predetermined pattern by the exposure apparatus. In the device manufacturing processing method according to claim 9,
At least one of the focus control error information, the synchronization accuracy error information, and the exposure amount error information is obtained based on performance data at the time of execution of exposure processing stored and held in the exposure apparatus, Device manufacturing processing method. In the device manufacturing processing method according to claim 10,
Based on at least one of the focus control error information, the synchronization accuracy error information, and the exposure amount error information, the exposure apparatus simulates the exposure result of the predetermined pattern,
Compare the result of the simulation with the result of the measurement inspection in the measurement inspection apparatus,
A device manufacturing processing method characterized by determining whether or not the imaging characteristic information of the optical system needs to be measured by the imaging characteristic measuring device according to a comparison result. In the device manufacturing processing method according to claim 9,
Information on the measurement and inspection of non-imaging characteristic information of the optical system to be collected to indicate that the measurement and inspection results is below the predetermined criterion,
The device manufacturing processing method characterized by including the information regarding the processing apparatus which performs a predetermined process with respect to the board | substrate before exposing with the said exposure apparatus, or the information regarding the said measurement inspection apparatus. In the device manufacturing processing method according to claim 9,
The imaging characteristic measuring apparatus loads a mask on which a test pattern suitable for measuring imaging characteristic information by the optical system of the exposure apparatus is loaded onto the exposure apparatus, and the exposure apparatus images the test pattern. A device manufacturing processing method characterized in that information on the imaging characteristics of the exposure apparatus is obtained based on a test pattern exposed on the substrate. An exposure apparatus equipped with an optical system;
A measurement and inspection apparatus that is connected to the exposure apparatus and that performs a predetermined measurement and inspection on a substrate exposed in a predetermined pattern via the optical system in the exposure apparatus;
Which is connected with the measuring test device, a determination device test result in the test apparatus to determine the constant whether below a predetermined criterion;
An image formation characteristic measurement apparatus capable of measuring image formation characteristic information by an optical system of the exposure apparatus, connected to the determination apparatus, and receiving a determination result in the determination apparatus. The device manufacturing processing system according to claim 14.
The determination device according to the determination result, indicating that the measurement and inspection results is below the predetermined reference,
An information collecting device for collecting information related to the measurement inspection result other than the imaging characteristic information of the optical system before the imaging characteristic measuring device performs measurement of the imaging characteristic information of the optical system; A device manufacturing processing system comprising: The device manufacturing processing system according to claim 15.
The device manufacturing processing system, wherein the measurement / inspection apparatus performs a measurement / inspection of a line width of a pattern on a substrate exposed by the exposure apparatus. The device manufacturing processing system according to claim 16.
The imaging characteristic measuring device is
The measurement test results on the basis of the information relating to the measurement and inspection of non-imaging characteristic information of the optical system to be collected by the information collecting device to indicate that below a predetermined criterion, the measurement of the imaging characteristic information A device manufacturing processing system for determining whether to execute or not. The device manufacturing processing system according to claim 17.
Information on the measurement and inspection of non-imaging characteristic information of the optical system to be collected by the information collecting device to indicate that the measurement and inspection results is below the predetermined criterion,
Focus control error information related to the position of the substrate with respect to the position in the optical axis direction of the optical system when the substrate is exposed with the image of the predetermined pattern by the exposure apparatus;
Synchronization accuracy error information regarding the relative position between the substrate and the mask on which the predetermined pattern is formed when the substrate is exposed to the image of the predetermined pattern by the exposure apparatus;
A device manufacturing processing system comprising: at least one of exposure amount error information related to a light amount of exposure light when the exposure apparatus exposes an image of the predetermined pattern by the exposure apparatus. The device manufacturing processing system according to claim 18.
The information collecting device includes:
At least one of the focus control error information, the synchronization accuracy error information, and the exposure amount error information is obtained based on performance data at the time of execution of exposure processing stored and held in the exposure apparatus, Device manufacturing processing system. The device manufacturing processing system according to claim 19.
The information collecting device includes:
A simulation unit that simulates an exposure result of the predetermined pattern by the exposure apparatus based on at least one of the focus control error information, the synchronization accuracy error information, and the exposure amount error information;
A comparison unit for comparing the result of the simulation and the result of the measurement inspection in the measurement inspection apparatus;
The device manufacturing processing system according to claim 1, wherein the imaging characteristic measurement apparatus determines whether or not measurement of imaging characteristic information of the optical system is necessary according to a comparison result in the comparison unit. The device manufacturing processing system according to claim 17, further comprising:
A processing apparatus for performing a predetermined process on the substrate before being exposed by the exposure apparatus;
Information the measurement test results relating to the measurement and inspection of non-imaging characteristic information of the optical system to be collected to indicate that less than the predetermined criterion,
A device manufacturing processing system comprising at least one of information on the processing apparatus and information on the measurement / inspection apparatus. The device manufacturing processing system according to claim 17.
The imaging characteristic measuring apparatus loads a mask on which a test pattern suitable for measuring imaging characteristic information by the optical system of the exposure apparatus is loaded onto the exposure apparatus, and the exposure apparatus images the test pattern. A device manufacturing processing system for measuring information on imaging characteristics of the exposure apparatus based on a test pattern exposed on the substrate. A process of measuring and inspecting a substrate exposed with a predetermined pattern image via the optical system with an exposure apparatus including an optical system, using a measurement and inspection apparatus that performs a predetermined measurement and inspection on the substrate;
A process of measurement and inspection results in the test apparatus to determine the constant whether below a predetermined criterion,
A program that causes a computer system to execute a process of transmitting the determination result to an imaging characteristic measuring apparatus that measures imaging characteristic information by an optical system of the exposure apparatus. The program according to claim 23,
Result of determining the measurement test results, indicating that the measurement and inspection results is below the predetermined reference, before the imaging characteristic measuring device performs a measurement of the imaging characteristic information of the optical system, the optical A program for causing a computer to further execute a process of collecting information related to the measurement / inspection result other than the imaging characteristic information of the system. The program according to claim 24,
A program causing the measurement / inspection apparatus to perform measurement / inspection of a line width of a pattern on a substrate exposed by the exposure apparatus. The program according to claim 25,
On the basis of the measurement test result information relating to the measurement and inspection of non-imaging characteristic information of the optical system to be collected to indicate that less than the predetermined criterion, the measurement of the imaging characteristic on the imaging characteristic measuring device A program for causing a computer system to further execute processing for determining whether or not to execute. The program according to claim 26, wherein
Information on the measurement and inspection of non-imaging characteristic information of the optical system to be collected to indicate that the measurement and inspection results is below the predetermined criterion,
A program including information on a processing apparatus that performs a predetermined process on a substrate before exposure by the exposure apparatus or information on the measurement and inspection apparatus. The program according to claim 26, wherein
A process of loading the exposure apparatus with a mask on which a test pattern suitable for measuring the imaging characteristic information by the optical system of the exposure apparatus is loaded in the imaging characteristic inspection apparatus;
A process of exposing an image of the test pattern onto a substrate with the exposure apparatus;
A program for causing a computer system to further execute processing for obtaining information relating to imaging characteristics of the exposure apparatus based on a test pattern exposed on a substrate. A process of measuring and inspecting a substrate exposed with a predetermined pattern image via the optical system with an exposure apparatus including an optical system, using a measurement and inspection apparatus that performs a predetermined measurement and inspection on the substrate;
A process of measurement and inspection results in the test apparatus to determine the constant whether below a predetermined criterion,
A recording medium on which a program for causing a computer system to execute a process of transmitting the determination result to an imaging characteristic measuring apparatus that measures imaging characteristic information by an optical system of the exposure apparatus is read by the computer system and recorded in an executable manner. The recording medium according to claim 29,
The program is
Result of determining the measurement test results, indicating that the measurement and inspection results is below the predetermined reference, before the imaging characteristic measuring device performs a measurement of the imaging characteristic information of the optical system, the optical A recording medium characterized by being a program for causing a computer system to execute a process for collecting information related to the measurement / inspection result other than the imaging characteristics of the system. The recording medium according to claim 30, wherein
The program is
A recording medium which is a program for causing the measurement / inspection apparatus to perform a measurement / inspection of a line width of a pattern on a substrate exposed by the exposure apparatus. The recording medium according to claim 31,
The program is
On the basis of the measurement test result information relating to the measurement and inspection of non-imaging characteristic information of the optical system for collecting to indicate that less than the predetermined reference, the measurement of the imaging characteristic on the imaging characteristic measuring device A recording medium comprising a program including processing for determining whether to execute the recording medium. The recording medium according to claim 32,
Information on the measurement and inspection of non-imaging characteristic information of the optical system of the measurement test results are collected to indicate that less than the predetermined reference by the program,
A recording medium comprising a program including information on a processing apparatus that performs a predetermined process on a substrate before exposure by the exposure apparatus or information on the measurement / inspection apparatus. The recording medium according to claim 32,
The program is
A process of loading the exposure apparatus with a mask on which a test pattern suitable for measuring imaging characteristic information by the optical system of the exposure apparatus is loaded in the imaging characteristic inspection apparatus;
A process of exposing an image of the test pattern on the substrate with the exposure apparatus;
A recording medium comprising: a program including a process for obtaining information relating to imaging characteristics of the exposure apparatus based on a test pattern exposed on a substrate.

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