JP4940831B2 - Method for manufacturing organic EL element and organic EL element - Google Patents

Description

  The present invention relates to an organic electroluminescent element and a method for manufacturing the same, and more particularly to an electroluminescent element in which an organic light emitting layer is formed by a printing method and a method for manufacturing the same.

  The basic structure of an organic electroluminescence element (hereinafter referred to as an organic EL element) is a sandwich structure in which an organic light emitting layer is sandwiched between an anode and a cathode, and emits light by passing a current through the organic light emitting layer. . Although the organic light emitting layer includes one to a plurality of layers, the thickness of each layer is very important in order to emit light efficiently, and the entire organic light emitting layer needs to be a thin film of 1 μm or less. Furthermore, in order to make this a display, it is necessary to pattern the organic light emitting layer with high definition, and this patterning method is one of the important issues.

  In manufacturing an organic EL display, since a low molecular material is generally formed into a thin film by a dry process such as a vacuum deposition method, there are problems that the manufacturing cost is high and the patterning accuracy is reduced as the size is increased.

  Therefore, recently, a polymer material is used as an organic light emitting material, or a low molecular light emitting material and a polymer material are mixed, and the organic light emitting material is dispersed or dissolved in a solvent to form ink, which is then used as a wet coating method. Therefore, a method for forming a thin film on a substrate has been tried. Examples of the wet coating method for forming a thin film include spin coating, dipping, bar coating, slit coating (die coating), and printing. In order to make an organic EL element into a display, high-definition patterning and RGB three colors need to be applied separately. Therefore, it is considered that the formation of a thin film by a printing method that is good at application and patterning is most effective.

Examples of the printing method include various printing methods such as intaglio printing, planographic printing, screen printing, and relief printing. However, in organic EL elements and displays that use a glass substrate or the like as a substrate to be printed, scratches or distortions of the substrate are not preferable, so that a hard metal printing plate or the like such as a gravure printing method that is representative of intaglio printing is used. The method using a plate is not suitable. In addition, an ink in which an organic light emitting layer forming material is dissolved or dispersed in a solvent generally has a low viscosity, and is not suitable for offset printing or screen printing, which is representative of lithographic printing. On the other hand, the relief printing method using a photosensitive resin plate mainly composed of rubber or other resin is suitable for low-viscosity organic light-emitting inks without damaging the glass substrate. Actually, formation of an organic light emitting layer by a relief printing method has been proposed (Patent Document 1).
JP 2001-155858 A

  The relief printing method is a method in which a printing plate having a convex shape, i.e., relief printing, is used to supply ink to the relief of the relief printing plate with an anilox roller, and to transfer and print the ink on the projection on the substrate. is there.

  In an organic EL element, when an organic EL ink in which an organic light emitting material is dissolved or dispersed is printed over the first electrode on the substrate by a letterpress printing method using a resin relief printing, high positional accuracy is required.

  For example, in a passive matrix type organic EL device, if a stripe-shaped first electrode having a partition formed between patterns has a line width of 40 μm and a space of 20 μm, different light emission is generated above the stripe-shaped first electrode. In order to print organic EL ink having color (RGB) in a stripe shape, the required positional accuracy is as high as ± 10 μm or less, depending on the size of the convex pattern of the resin plate. The

  When the organic EL ink is used to form the light emitting layer by the relief printing method, the convex pattern is in direct contact with the substrate. If a hard material such as metal is used for the convex pattern, the substrate is damaged. A resin relief plate having a resin pattern is used.

  As a method for producing a resin relief plate, for example, for a plate material in which a photosensitive resin is formed on a base material, a method of forming a convex pattern by a photolithographic method, a resin by a metallic sword or a laser ablation method, and the like. There is a way to scrape. Moreover, when forming a convex pattern by a photolithographic method using a photosensitive resin, as a developing method thereof, a method of blowing off the uncured resin with compressed air or the like, a spray solution is sprayed on the plate surface at a constant pressure, and the uncured resin is removed. A method of removing, a method of eluting uncured resin by brushing while immersing a plate in a developer, and the like are used. The resin layer is relatively thick from the standpoint of printing durability, and each pattern is usually integrated (continuous) with the adjacent convex pattern at the bottom of the resin layer even after the printing pattern is formed. FIG. 1 shows an explanatory sectional view of a conventional resin relief printing plate. Although the convex pattern is formed on the base material 200, the convex pattern is continuous with the adjacent convex pattern and forms the resin layer 201.

  However, since the resin layer is soft, it is deformed by the pressure during printing. Furthermore, the resin layer is greatly expanded and contracted due to the environment such as temperature and humidity and the influence of the solvent used in the ink. For this reason, when forming a light emitting layer using organic EL ink in an organic EL element that requires high positional accuracy, positional deviation of the relief printing pattern occurs, and the patterning accuracy of the printed matter is reduced, and ink is applied at a desired position. There was a problem that it could not be placed. Moreover, in the case of a resin relief plate with a conventional convex pattern integrated, even when a resin layer is formed on a base material using high rigidity steel or the like, the positional accuracy of the lower part of the resin layer is maintained by the base material. However, there was a problem that it was not possible to completely suppress the position variation of the upper part of the resin layer. Therefore, an object of the present invention is to achieve high-definition patterning of an organic EL element by using a resin relief plate that suppresses the dimensional variation of the resin relief plate as much as possible.

  In order to solve the above problems, an invention according to claim 1 of the present invention is an organic EL element including at least a substrate, a first electrode supported by the substrate, an organic light emitting layer, and a second electrode. A resin relief printing plate having a convex pattern made of resin on a substrate using an ink in which the organic light emitting material forming the organic light emitting layer or the light emitting auxiliary material forming the light emission auxiliary layer is dissolved or dispersed in a solvent. In the method for manufacturing an organic EL element in which at least one of an aerobic light emitting layer or a light emitting auxiliary layer is formed by printing above the first electrode by a letterpress printing method using the method, the convex pattern is formed on an adjacent convex pattern. On the other hand, using an organic resin relief plate formed on a substrate independently, the ink is printed on the first electrode by a relief printing method to form an organic light emitting layer or a light emission auxiliary layer. It was the method of manufacturing the device.

  The invention according to claim 2 of the present invention is the method for producing an organic EL element according to claim 1, wherein the base material constituting the resin relief printing plate is made of metal.

The invention according to claim 3 of the present invention is characterized in that the thickness of the convex pattern constituting the resin relief plate is 0.01 mm or more and 1 mm or less. It was set as the manufacturing method of the organic EL element.

  The invention according to claim 4 of the present invention is characterized in that the base material constituting the resin relief printing plate is made of a material having a longitudinal elastic modulus of 70 GPa or more and 250 GPa or less. It was set as the manufacturing method of the luminescence element.

In the invention according to claim 5 of the present invention, the base material constituting the resin relief printing plate is made of a material having a thermal expansion coefficient of 0.1 × 10 ⁻⁶ / K or more and 20.0 × 10 ⁻⁶ / K or less. It was set as the manufacturing method of the organic electroluminescent element in any one of the Claims 1 thru | or 4 characterized by the above-mentioned.

The invention according to claim 6 of the present invention is that the substrate constituting the resin relief printing plate is made of a substance having a thermal expansion coefficient of 0.5 × 10 ⁻⁶ / K or more and 5.5 × 10 ⁻⁶ / K or less. It was set as the manufacturing method of the organic electroluminescent element in any one of the Claims 1 thru | or 4 characterized by the above-mentioned.

  The invention according to claim 7 of the present invention is the organic EL element according to any one of claims 1 to 6, wherein the resin material forming the convex pattern constituting the resin relief plate is water-soluble. It was set as the manufacturing method of this.

  According to an eighth aspect of the present invention, in the organic EL according to any one of the first to seventh aspects, the resin material forming the convex pattern constituting the resin relief plate is made of a photosensitive resin. It was set as the manufacturing method of an element.

The invention according to claim 9 of the present invention has a convex pattern made of a resin on a metal substrate, and the convex pattern is formed on the metal substrate independently of the adjacent convex pattern. It was set as the resin letterpress characterized by having.
In the invention according to claim 10 of the present invention, the resin relief printing plate according to claim 9 is characterized in that a thickness of the projection pattern is 0.01 mm or more and 1 mm or less.

  In the manufacturing method of the organic EL element of the present invention, since the convex pattern of the resin relief plate is formed independently on the substrate, the pattern can be fixed on the substrate and high positional accuracy can be obtained. It is possible to suppress patterning shift due to layer deformation as much as possible and achieve high-definition patterning of the light-emitting layer, and to obtain a good panel free from mixed color light emission due to printing position shift.

  Further, by setting the thickness of the convex pattern constituting the resin relief plate to 0.01 mm or more and 1 mm or less, sufficient strength can be obtained in the pattern portion, and high-definition patterning can be performed while ensuring the printing resistance of the resin relief plate. did it.

In addition, by using a rigid metal for the base plate of the resin relief plate, expansion / shrinkage of the base material is suppressed compared to a base material using a soft material such as a film, and the positional variation of the convex pattern is effective. Could be suppressed. Further, by using a material having a longitudinal elastic modulus of 70 GPa or more and 250 GPa or less for the base material, the distortion of the base material due to the stress was reduced, and the convex pattern could be formed and maintained with high accuracy. Further, by using a material having a thermal expansion coefficient of 0.5 × 10 ⁻⁶ / K or more and 20.0 × 10 ⁻⁶ / K or less for the base material, high patterning accuracy can be maintained even if the printing environment temperature changes. I was able to.

  Further, since the resin material of the resin relief printing contains a photosensitive resin as a main component, it is possible to make the plate making of the resin relief relief more easily by exposure and development. In addition, since the resin material has a water-soluble resin material as a main component, even if an ink containing an organic solvent is used, the swelling of the resin is small, and high patterning accuracy and printing durability can be maintained. .

  A preferred embodiment of the present invention will be described using a case where a passive matrix type organic EL element is formed as an example. FIG. 2 shows an explanatory cross-sectional view of the organic EL device of the present invention. There are a passive matrix type and an active matrix type as a driving method of the organic EL element, but the organic EL element of the present invention can be applied to either a passive matrix type organic EL element or an active matrix type organic EL element. .

  The passive matrix method is a method in which stripe-shaped electrodes are opposed to each other so as to be orthogonal to each other, and light is emitted at the intersection, whereas the active matrix method uses a so-called thin film transistor (TFT) substrate in which a transistor is formed for each pixel. Thus, the light is emitted independently for each pixel.

  As shown in FIG. 2, the organic EL device of the present invention has a first electrode 2 in a stripe shape on a substrate 1 as an anode. The partition wall is provided between the first electrodes, and preferably covers the first electrode end portion for the purpose of preventing a short circuit due to burrs or the like at the first electrode end portion.

  And the organic EL element of this invention has an organic light emitting layer and a light emission auxiliary layer in the area | region (light emission area | region L, pixel part) on the 1st electrode 2 and divided by the partition 7. FIG. The layer sandwiched between the electrodes may be composed of an organic light emitting layer alone, or may be composed of a laminated structure of an organic light emitting layer and a light emission auxiliary layer. Examples of the light emission auxiliary layer include a hole transport layer, a hole injection layer, an electron transport layer, and an electron injection layer. In FIG. 2, the structure which consists of a laminated structure of the positive hole transport layer 3 which is a light emission auxiliary layer, and an organic light emitting layer (41, 42, 43) is shown. A hole transport layer 3 is provided on the first electrode 2, and a red (R) organic light-emitting layer 41, a green (G) organic light-emitting layer 42, and a blue (B) organic light-emitting layer 43 are provided on the hole transport layer 3. Is provided.

  Next, the 2nd electrode 5 is arrange | positioned as a cathode so as to oppose the 1st electrode 2 which is an anode on an organic luminescent medium layer. In the case of the passive matrix method, the second electrode is provided in a stripe shape so as to be orthogonal to the first electrode having a stripe shape. In the case of the active matrix method, the second electrode is formed on the entire surface of the organic EL element. Further, although not shown, a sealing body such as a glass cap is provided on the entire effective pixel in order to prevent moisture and oxygen in the environment from entering the first electrode, the organic light emitting layer, the light emitting auxiliary layer, and the second electrode. It is provided and bonded to the substrate via an adhesive.

  The organic EL device of the present invention includes at least a substrate, a patterned first electrode supported by the substrate, an organic light emitting layer, and a second electrode. In contrast to FIG. 2, the organic EL element of the present invention may have a structure in which the first electrode is a cathode and the second electrode is an anode. In addition, in order to protect the organic light emitting medium layer and the electrode from the ingress of external oxygen and moisture in place of a sealing body such as a glass cap, a sealing layer having a function of a passivation layer and a protective layer for protecting from external stress, or both, is provided. You may provide a stop base material.

  The manufacturing method of the organic EL element of this invention is demonstrated. As the substrate according to the present invention, any substrate can be used as long as it has an insulating property. In the case of a bottom emission type organic EL element that extracts light from the substrate side, it is necessary to use a transparent substrate.

  For example, a glass substrate or a quartz substrate can be used as the substrate. Further, it may be a plastic film or sheet such as polypropylene, polyethersulfone, polycarbonate, cycloolefin polymer, polyarylate, polyamide, polymethyl methacrylate, polyethylene terephthalate, polyethylene naphthalate. Metal oxide thin film, metal fluoride thin film, metal nitride thin film, metal oxynitride thin film, or polymer resin film for the purpose of preventing moisture from entering the organic light emitting medium layer in these plastic films and sheets You may utilize what laminated | stacked these as a board | substrate.

  In addition, it is more preferable to reduce the moisture adsorbed on the inside or the surface of the substrate as much as possible by performing a heat treatment on these substrates in advance. Further, in order to improve the adhesion depending on the material to be laminated on the substrate, it is preferable to use after performing surface treatment such as ultrasonic cleaning treatment, corona discharge treatment, plasma treatment, UV ozone treatment.

  Further, a thin film transistor (TFT) can be formed on these to form a substrate for an active matrix organic EL element. FIG. 3 shows an explanatory cross-sectional view of an example of an active matrix substrate of the present invention. In the case of the organic EL element substrate of the present invention, the planarization layer 117 is formed on the TFT 120, and the lower electrode (first electrode 2) of the organic EL element is provided on the planarization layer 117. In addition, the TFT and the lower electrode are preferably electrically connected through a contact hole 118 provided in the planarization layer 117. By comprising in this way, the outstanding electrical insulation can be obtained between TFT and an organic EL element.

  The TFT 120 and the organic EL element formed above the TFT 120 are supported by a support 111. The support is preferably excellent in mechanical strength and dimensional stability. Specifically, the materials described above as the substrate can be used.

  As the TFT 120 provided on the support, a known thin film transistor can be used. Specifically, a thin film transistor mainly including an active layer in which a source / drain region and a channel region are formed, a gate insulating film, and a gate electrode can be given. The structure of the thin film transistor is not particularly limited, and examples thereof include a staggered type, an inverted staggered type, a top gate type, and a coplanar type.

The active layer 112 is not particularly limited, and examples thereof include amorphous semiconductor materials such as amorphous silicon, polycrystalline silicon, microcrystalline silicon, cadmium selenide, thiophene oligomers, poly (p-ferylene vinylene), and the like. The organic semiconductor material can be used. These active layers are formed by, for example, laminating amorphous silicon by plasma CVD, ion doping, forming amorphous silicon by LPCVD using SiH ₄ gas, and crystallizing amorphous silicon by solid phase growth. After obtaining silicon, ion doping by ion implantation, LPCVD using Si ₂ H ₆ gas, and amorphous silicon by PECVD using SiH ₄ gas, and excimer laser or other laser After annealing and crystallizing amorphous silicon to obtain polysilicon, polysilicon is laminated by ion doping (low temperature process), low pressure CVD or LPCVD, and thermally oxidized at 1000 ° C. or higher. Gate insulation film Form, the n + polysilicon of the gate electrode 114 is formed thereon, then, a method of ion doping (high temperature process), and the like by an ion implantation method.

As the gate insulating film 113, a film normally used as a gate insulating film can be used. For example, SiO ₂ formed by PECVD, LPCVD, etc., SiO obtained by thermally oxidizing a polysilicon film ₂ etc. can be used.

  As the gate electrode 114, those normally used as the gate electrode can be used. For example, metals such as aluminum and copper, refractory metals such as titanium, tantalum and tungsten, polysilicon, silicide of refractory metals And polycide.

  The TFT 120 may have a single gate structure, a double gate structure, or a multi-gate structure having three or more gate electrodes. Moreover, you may have a LDD structure and an offset structure. Further, two or more thin film transistors may be arranged in one pixel.

  The display device of the present invention needs to be connected so that the thin film transistor (TFT) functions as a switching element of the organic EL element, and the drain electrode 116 of the transistor and the pixel electrode (first electrode 2) of the organic EL element are electrically connected. Connected. Further, it is generally necessary to use a metal that reflects light as a pixel electrode for taking a top emission structure.

  The TFT 120, the drain electrode 116, and the pixel electrode (first electrode 2) of the organic EL element are connected through a connection wiring formed in a contact hole 118 that penetrates the planarizing film 117.

Regarding the material of the planarizing film 117, inorganic materials such as SiO ₂ , spin-on glass, SiN (Si ₃ N ₄ ), TaO (Ta ₂ O ₅ ), organic materials such as polyimide resin, acrylic resin, photoresist material, and black matrix material are used. Materials and the like can be used. Spin coating, CVD, vapor deposition, etc. can be selected according to these materials. If necessary, a contact hole 118 is formed by dry etching, wet etching, or the like at a position corresponding to the lower TFT 120 after photolithography using a photosensitive resin as the planarizing layer, or once the planarizing layer is formed on the entire surface. Form. The contact hole is then filled with a conductive material to establish conduction with the pixel electrode formed in the upper layer of the planarization layer. The thickness of the planarizing layer is not limited as long as it can cover the lower TFT, capacitor, wiring, etc., and the thickness may be several μm, for example, about 3 μm.

  A first electrode is provided on the substrate. When the first electrode is used as an anode, the material is a metal composite such as ITO (indium tin composite oxide), IZO (indium zinc composite oxide), tin oxide, zinc oxide, indium oxide, zinc aluminum composite oxide. A single layer or a stacked layer of metal materials such as oxide, gold, platinum, and chromium can be used. As a method for forming the first electrode, a dry film forming method such as a resistance heating vapor deposition method, an electron beam vapor deposition method, a reactive vapor deposition method, an ion plating method, or a sputtering method can be used.

  In addition, ITO is preferably used because of its low resistance, solvent resistance, and high transparency when the bottom mission method is adopted. ITO is formed on a glass substrate by a sputtering method, and is patterned by a photolithography method to form a first electrode.

After forming the first electrode, a partition is formed so as to cover the edge of the first electrode. The partition wall needs to have insulating properties, and a photosensitive material or the like can be used. The photosensitive material may be a positive type or a negative type, a photo-curing resin of a photo radical polymerization system, a photo cationic polymerization system, or a copolymer containing an acrylonitrile component, polyvinyl phenol, polyvinyl alcohol. , Novolac resin, polyimide resin, cyanoethyl pullulan, and the like can be used. Further, SiO ₂ , TiO ₂ or the like can be used as the partition wall forming material.

  When the partition wall forming material is a photosensitive material, the entire surface of the forming material solution is coated by a slit coating method or a spin coating method, and then patterning is performed by a photolithography method such as exposure and development. In the case of the spin coating method, the height of the partition wall can be controlled by conditions such as the number of rotations when spin coating, but there is a limit height in one coating, and if it is higher than that, multiple spin coatings are performed. Use an iterative approach.

When the barrier rib is formed by a photolithography method using a photosensitive material, its shape can be controlled by exposure conditions and development conditions. For example, when a negative photosensitive resin is applied, exposed and developed, and then post-baked to obtain a partition wall, if the shape of the partition wall end portion is to have a forward tapered shape, development under this development condition The type, concentration, temperature, or development time of the liquid may be controlled. If the development conditions are mild, the partition wall ends have a forward taper shape, and if the development conditions are severe, the partition wall ends have a reverse taper shape.

Further, when the partition wall forming material is SiO ₂ or TiO ₂ , it can be formed by a dry film forming method such as a sputtering method or a CVD method. In this case, patterning of the partition walls can be performed by a mask or a photolithography method.

  Next, an organic light emitting layer and a light emission auxiliary layer are formed. The layer sandwiched between the electrodes may be composed of an organic light emitting layer alone, or assists light emission such as an organic light emitting layer and a hole transport layer, a hole injection layer, an electron transport layer, and an electron injection layer. It is good also as a laminated structure with a light emission auxiliary layer. The hole transport layer, hole injection layer, electron transport layer, and electron injection layer are appropriately selected as necessary.

  In the present invention, an organic light emitting material for forming an organic light emitting layer or a light emitting auxiliary material for forming a light emitting auxiliary layer such as a hole transport layer, a hole injection layer, an electron transport layer, and an electron injection layer is dissolved or dispersed in a solvent. At least one layer of an aerobic light emitting layer or a light emitting auxiliary layer printed on the first electrode by a relief printing method using a resin relief plate having a convex pattern made of resin on a base material as a printing plate. It can be applied when forming. Hereinafter, in the present invention, a case where an organic light emitting ink in which an organic light emitting material is dissolved or dispersed in a solvent is used will be described.

  The organic light emitting layer is a layer that emits light when an electric current is passed. Organic light-emitting materials formed by the organic light-emitting layer include 9,10-diarylanthracene derivatives, pyrene, coronene, perylene, rubrene, 1,1,4,4-tetraphenylbutadiene, tris (8-quinolato) aluminum complex, tris (4-methyl-8-quinolato) aluminum complex, bis (8-quinolato) zinc complex, tris (4-methyl-5-trifluoromethyl-8-quinolato) aluminum complex, tris (4-methyl-5-cyano-) 8-quinolato) aluminum complex, bis (2-methyl-5-trifluoromethyl-8-quinolinolato) [4- (4-cyanophenyl) phenolate] aluminum complex, bis (2-methyl-5-cyano-8-quinolinolato) [4- (4-Cyanophenyl) phenolate] aluminum complex, Lis (8-quinolinolato) scandium complex, bis [8- (paratosyl) aminoquinoline] zinc complex and cadmium complex, 1,2,3,4-tetraphenylcyclopentadiene, poly-2,5-diheptyloxy-paraphenylene vinylene, etc. The low molecular weight light emitting material can be used.

  Also, coumarin phosphors, perylene phosphors, pyran phosphors, anthrone phosphors, polyphyrin phosphors, quinacridone phosphors, N, N′-dialkyl-substituted quinacridone phosphors, naphthalimide phosphors, A material obtained by dispersing a low molecular weight light emitting material such as an N, N′-diaryl-substituted pyrrolopyrrole fluorescent material or a phosphorescent light emitting material such as an Ir complex in a polymer can be used. As the polymer, polystyrene, polymethyl methacrylate, polyvinyl carbazole and the like can be used.

Also, poly (2-decyloxy-1,4-phenylene) (DO-PPP), poly [2,5-bis- [2- (N, N, N-triethylammonium) ethoxy] -1,4-phenyl- Alto-1,4-phenylylene] dibromide (PPP-NEt3 +), poly [2- (2′-ethylhexyloxy) -5-methoxy-1,4-phenylenevinylene] (MEH-PPV), poly [5- Methoxy- (2-propanoxysulfonide) -1,4-phenylenevinylene] (MPS-PPV), poly [2,5-bis- (hexyloxy) -1,4-phenylene- (1-cyanovinylene)] Polymer light-emitting materials such as (CN-PPV), poly (9,9-dioctylfluorene) (PDAF), and polyspiro may be used. Examples thereof include polymer precursors such as a PPV precursor and a PPP precursor. Other existing light emitting materials can also be used.

  Examples of the hole transport material forming the hole transport layer include metal phthalocyanines such as copper phthalocyanine and tetra (t-butyl) copper phthalocyanine, and metal-free phthalocyanines, quinacridone compounds, 1,1-bis (4-di-p -Tolylaminophenyl) cyclohexane, N, N′-diphenyl-N, N′-bis (3-methylphenyl) -1,1′-biphenyl-4,4′-diamine, N, N′-di (1- Naphthyl) -N, N′-diphenyl-1,1′-biphenyl-4,4′-diamine and other aromatic amine-based low molecular hole injection transport materials, polyaniline, polythiophene, polyvinylcarbazole, poly (3,4 -Polymer hole transport materials such as a mixture of ethylenedioxythiophene) and polystyrene sulfonate, polythiophene oligomer materials, and other existing hole transport materials It can be selected from the fee.

  Moreover, as a hole transport material which forms an electron carrying layer, 2- (4-bifinylyl) -5- (4-t-butylphenyl) -1,3,4-oxadiazole, 2,5-bis ( 1-naphthyl) -1,3,4-oxadiazole, oxadiazole derivatives, bis (10-hydroxybenzo [h] quinolinolato) beryllium complexes, triazole compounds, and the like can be used.

  Solvents that dissolve or disperse the organic light emitting material include toluene, xylene, acetone, hexane, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, methanol, ethanol, isopropyl alcohol, ethyl acetate, butyl acetate, 2-methyl- (t-butyl) Benzene, 1,2,3,4-tetramethylbenzene, pentylbenzene, 1,3,5-triethylbenzene, cyclohexylbenzene, 1,3,5-tri-isopropylbenzene and the like can be used alone or in combination. . Moreover, surfactant, antioxidant, a viscosity modifier, a ultraviolet absorber, etc. may be added to organic luminescent ink as needed.

  Examples of the solvent for dissolving or dispersing the hole transport material and the electron transport material include, for example, toluene, xylene, acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, methanol, ethanol, isopropyl alcohol, ethyl acetate, butyl acetate, water and the like Alternatively, a mixed solvent thereof can be used. In particular, water or alcohols are suitable when forming a hole transport material into an ink.

  The organic light emitting layer and the light emission auxiliary layer are formed by a wet film forming method. Note that in the case where these layers have a laminated structure, it is not necessary to form all of the layers by a wet film formation method. As the wet film forming method, spin coating method, die coating method, dip coating method, discharge coating method, pre-coating method, roll coating method, bar coating method and the like, relief printing method, inkjet printing method, offset printing method, Examples of the printing method include a gravure printing method. In particular, when patterning organic light emitting layers of three colors of RGB, it can be selectively formed on the pixel portion by a printing method, and an organic EL element capable of color display can be manufactured. The film thickness of the organic light emitting medium layer is 1000 nm or less, preferably 50 nm to 150 nm, even when formed by a single layer or stacked layers.

  The organic light emitting layer of the present invention is formed by a relief printing method. For example, in ink jet printing, ink is ejected from a nozzle, which is an ink supply body, toward the substrate. That is, since a distance is required between the nozzle and the substrate, the landing position accuracy of the ink ejected on the substrate is reduced. It tends to end up. On the other hand, in the relief printing method, the ink is transferred so that the plate as the ink supply body and the printing substrate are in contact with each other, so that the predetermined ink can be accurately placed at a predetermined position.

  In the resin relief printing used for forming the organic light emitting layer by the relief printing method in the present invention, the projection pattern made of resin is formed on the substrate independently of the adjacent projection pattern. FIG. 4 shows an explanatory sectional view of the resin relief printing plate of the present invention. In the resin relief plate of the present invention, the convex pattern 202 made of resin is formed on the substrate 200 independently of the adjacent convex pattern, and is not continuous with the adjacent convex pattern. Therefore, the convex pattern as shown in FIG. 1 is continuous, and compared with the conventional plate integrated as a resin layer, the positional accuracy deviation due to the deformation of the resin forming the convex pattern is greatly increased. Therefore, high-definition patterning is possible.

  The convex pattern of the resin relief printing plate of the present invention can be used as a line pattern, a dot pattern or the like, and the pattern shape is not particularly limited. Further, the relief shape of the resin relief printing plate may be a forward taper shape or a reverse taper shape.

  As a base material used for the resin letterpress of the present invention, it is sufficient that the base material has mechanical strength for printing. Polyethylene, polystyrene, polybutadiene, polyvinyl chloride, polyvinylidene chloride, polyvinyl acetate, polyamide, poly Known synthetic resins such as ether sulfone, polyethylene terephthalate, polyethylene naphthalate, polyether sulfone, and polyvinyl alcohol, known metals such as iron, copper, and aluminum, or laminates thereof can be used. In addition, as a base material which comprises the resin relief printing plate used for this invention, it is requested | required that it should have sufficient rigidity to suppress the dimensional change of a resin part, and that a base material itself cannot change a dimension easily. Moreover, the thing with high tolerance with respect to the organic solvent contained in organic luminescent ink is desirable. Therefore, a metal is preferably used as the material used as the substrate. Among the base materials made of metal, a steel base material and an aluminum base material are preferable from the viewpoint of processability and economy.

Furthermore, a dimensional change due to a temperature change can be considered as a factor causing the dimensional change of the resin relief printing plate. With respect to this, if the base material itself is difficult to cause dimensional change due to temperature, it is possible to suppress the dimensional change as a plate. Therefore, the base material used has a thermal expansion coefficient of 0.1 × 10 ^−6. A substance having a / K value of 20.0 × 10 ⁻⁶ / K or less is desirable. Further, if the thermal expansion coefficient of the base material is approximately the same as the thermal expansion coefficient of the glass substrate (about 3 × 10 ⁻⁶ / K), the influence of dimensional change due to temperature change is reduced, so that 0.5 × 10 ⁻ It is more preferable if the substance is ⁶ / K or more and 5.5 × 10 ⁻⁶ / K or less. A metal such as iron exhibits a sufficiently low thermal expansion coefficient as compared with a polyester film having a thermal expansion coefficient of 1.0 × 10 ⁻⁴ / K or more, and from this point as well, it is suitable as a base material for the resin letterpress of the present invention. Incidentally, the thermal expansion coefficient of iron is 1.2 × 10 ⁻⁵ / K. Furthermore, iron and nickel alloys exhibit a lower coefficient of thermal expansion than iron. Among them, alloys having a ratio of 64% iron and 36% nickel have a coefficient of thermal expansion less than one-tenth that of iron and general metals. The most preferred alloy shown. However, a material having a coefficient of thermal expansion smaller than 0.1 × 10 ⁻⁶ / K is not preferable because other properties important as a base material, that is, mechanical strength and chemical resistance are lowered.

  In addition, since the resin relief plate is distorted due to various stress loads during plate making and printing, the convex portion pattern is displaced. For example, when a negative photosensitive resin is used to form a convex pattern by a photolithography method, the resin is cured and contracted during exposure to cause distortion in the resin plate. Further, during printing, a printing pressure is applied during transfer, so that the resin relief plate is distorted. In order to suppress such strain, it is desirable to use a material having a longitudinal elastic modulus of 70 GPa or more and 250 GPa or less for the base material. When a material having a longitudinal elastic modulus smaller than 70 GPa is used as a base material, sufficient stress resistance cannot be obtained. In addition, when a material having a longitudinal elastic modulus greater than 250 GPa is used as the base material, it is difficult to mount the resin letterpress around the cylinder because the base material is rigid.

  The resin for forming the convex pattern in the resin relief printing plate according to the present invention is only required to have solvent resistance to the organic light-emitting ink. Nitrile rubber, silicone rubber, isoprene rubber, styrene butadiene rubber, butadiene rubber, chloroprene rubber, butyl rubber, acrylonitrile In addition to rubber such as rubber, ethylene propylene rubber, urethane rubber, polyethylene, polystyrene, polybutadiene, polyvinyl chloride, polyvinylidene chloride, polyvinyl acetate, polyamide, polyethersulfone, polyethylene terephthalate, polyethylene naphthalate, polyethersulfone, Synthetic resins such as polyvinyl alcohol, copolymers thereof, cellulose derivatives, etc., fluorine elastomers, polytetrafluoroethylene, polyvinylidene fluoride, polyhexafluoride A fluororesin such as isopropylidene or a copolymer thereof can be selected one or more.

  Among these, water-soluble resin materials such as polyamide, polyvinyl alcohol, and cellulose derivatives can be suitably used because they have good resistance to solvents used in organic light-emitting inks.

  As the solvent used in the organic light emitting ink, an aromatic organic solvent is preferably used. The solubility parameter (hereinafter referred to as SP value) of toluene representing an aromatic organic solvent is 8.9, and the SP value of xylene is 8.8. In contrast, the SP value of polyamide (nylon) which is a water-soluble resin material is 13.6, the SP value of polyvinyl alcohol is 12.6, the SP value of cellulose is 15.7, and the SP values of toluene and xylene are It is clear that these water-soluble resins are sufficiently resistant to aromatic organic solvents such as toluene and xylene because they are sufficiently separated.

  Further, it is desirable to use a photosensitive resin as the resin material because it is easy to process. For example, the photosensitive resin which has a polymer and the monomer containing an unsaturated bond, and a photoinitiator as a component is mentioned. At this time, as the polymer, it is preferable that the polymer is water-soluble for the same reason as described above, and polyamide, polyvinyl alcohol, cellulose derivative, and acrylic resin can be used. Further, as the monomer containing an unsaturated bond, for example, methacrylates having a vinyl bond can be used, and as the photopolymerization initiator, for example, an aromatic carbonyl compound can be used.

  In addition, the thickness h of the convex pattern is preferably 0.01 mm or more and 1 mm or less. When the thickness is less than 0.01 mm, it is difficult to form a uniform resin layer thickness, and it becomes difficult to obtain a uniform film thickness of the organic light emitting layer. In addition, when the thickness is 1 mm or more, the influence of deformation of the resin layer on high-definition patterning becomes large. Furthermore, since the strength of the convex pattern is not sufficient, the resin layer portion may be destroyed when a strong force is applied from the outside.

  A method for producing a resin relief printing plate according to the present invention will be described in the case where a photosensitive resin is used as a resin and a convex portion is formed by a photolithography method. FIG. 5 shows an explanatory sectional view of a method for producing a resin relief printing plate. First, as shown in FIG. 5A, a plate material in which a photosensitive resin is formed on one surface on a base material 200 is prepared. Next, as shown in FIG. 5B, a photomask 206 having a light-shielding portion and a light-transmitting portion and having a pattern formed by the light-transmitting portion is placed on the photosensitive resin. The photomask has a structure in which a light shielding portion 205 made of, for example, a chromium thin film is patterned on a light-transmitting glass 104, and a portion where the chromium thin film is formed is not a light shielding portion and a chromium thin film is not formed. A location becomes a translucent part.

  Next, as shown in FIG. 5C, exposure is performed by irradiating an active energy ray 207 typified by ultraviolet light through the photomask. At this time, the portion irradiated with the active energy ray through the light transmitting portion of the photomask is cured.

  Next, the photomask is removed from the resin relief printing and development is performed. The uncured portion that was not irradiated with light by exposure is removed by development, and the resin relief printing plate of the present invention as shown in FIG. At this time, when using a water-developing type resin relief plate in which the uncured portion can be dissolved and removed with water, water is used as the developer. Further, after the development, baking or post-exposure may be performed for the purpose of further curing the resin layer.

  In addition to the photolithography method, the convex pattern can be formed by laser ablation or cutting as a method for forming the convex pattern in the resin relief printing plate of the present invention.

  Next, the letterpress printing method using the resin letterpress in the present invention will be described. The letterpress printing apparatus used for forming the organic light emitting layer can be any letterpress printing apparatus that prints on a flat plate, but a printing apparatus as shown below is desirable. FIG. 6 shows a schematic diagram of the relief printing apparatus of the present invention. This manufacturing apparatus has a plate cylinder 18 to which an ink tank 10, an ink chamber 12, an anilox roll 14, and a resin relief plate 16 are attached. The ink tank 10 contains organic light-emitting ink diluted with a solvent, and the organic light-emitting ink is fed into the ink chamber 12 from the ink tank 10. The anilox roll 14 rotates in contact with the ink supply section of the ink chamber 12 and the plate cylinder 18.

  As the anilox roll 14 rotates, the organic light emitting ink 14a supplied from the ink chamber 12 is uniformly held on the surface of the anilox roll 14 and then has a uniform film thickness on the convex portions of the resin relief plate 16 attached to the plate cylinder. It will transfer at. Furthermore, the substrate to be printed is fixed on a slidable substrate fixing base, moved to the printing start position while adjusting the position by the position adjustment mechanism of the plate pattern and the substrate pattern, and in accordance with the rotation of the plate cylinder. The convex portion of the resin relief plate 16 further moves while contacting the substrate, and the ink is transferred by patterning to a predetermined position of the substrate 24 to be printed on the stage 20.

  Again, the present invention is not only for forming an organic light emitting layer by a relief printing method using an organic light emitting ink, but also for a hole transport layer or an electron transport layer by a relief printing method using a hole transport ink or an electron transport ink. It can also be used when forming a light emission auxiliary layer.

  Next, a second electrode is formed. When the second electrode is a cathode, a material having high electron injection efficiency is used as the material. Specifically, a single metal such as Mg, AL, or Yb is used, or a compound such as Li, oxidized Li, or LiF is sandwiched by about 1 nm at the interface in contact with the light emitting medium, and Al or Cu having high stability and conductivity is laminated. And use. Or, in order to achieve both electron injection efficiency and stability, one or more metals such as Li, Mg, Ca, Sr, La, Ce, Er, Eu, Sc, Y, Yb, etc., which have low work function, and stable Ag, Al An alloy system with a metal element such as Cu is used. Specifically, alloys such as MgAg, AlLi, and CuLi can be used. Further, in the case of a top emission type organic EL device, the cathode needs to have transparency, and for example, transparency can be achieved by a combination of these metals and a transparent conductive layer such as ITO.

  As a method for forming the second electrode, a dry film formation method such as a resistance heating vapor deposition method, an electron beam vapor deposition method, a reactive vapor deposition method, an ion plating method, or a sputtering method can be used. Moreover, when it is necessary to make a 2nd electrode into a pattern, it can pattern by a mask etc. The thickness of the second electrode is preferably 10 nm to 1000 nm. In the present invention, the first electrode can be a cathode and the second electrode can be an anode.

As an organic EL element, it is possible to emit light by sandwiching an organic light emitting layer between electrodes and letting an electric current flow. However, some of the organic light emitting material, the light emission auxiliary layer forming material, and the electrode forming material contain moisture in the atmosphere. Since it is easily deteriorated by oxygen, a sealing body is usually provided for shielding from the outside.

  For example, the sealing body includes a first electrode, an organic light emitting layer, a light emitting auxiliary layer, and a substrate on which the second electrode is formed. Sealing is performed by allowing the cap and the substrate to pass through an adhesive agent in the periphery of the second electrode so that the recess is in the air.

  In addition, the sealing body is provided with a resin layer on a sealing material with respect to the substrate on which, for example, the first electrode, the organic light emitting layer, the light emission auxiliary layer, and the second electrode are formed. It is also possible to carry out by bonding the substrates.

At this time, the sealing material needs to be a base material having low moisture and oxygen permeability. Examples of the material include ceramics such as alumina, silicon nitride, and boron nitride, glass such as alkali-free glass and alkali glass, metal foil such as quartz, aluminum, and stainless steel, and moisture-resistant film. Examples of moisture-resistant films include films formed by CVD of SiOx on both sides of plastic substrates, films with low permeability and water-absorbing films, or polymer films coated with a water-absorbing agent. The water vapor transmission rate is preferably 10 ⁻⁶ g / m ² / day or less.

  Examples of the resin layer include a photo-curing adhesive resin made of an epoxy resin, an acrylic resin, a silicone resin, a thermosetting adhesive resin, a two-component curable adhesive resin, and an ethylene ethyl acrylate (EEA) polymer. Examples thereof include acrylic resins, vinyl resins such as ethylene vinyl acetate (EVA), thermoplastic resins such as polyamide and synthetic rubber, and thermoplastic adhesive resins such as acid-modified products of polyethylene and polypropylene. Examples of methods for forming a resin layer on a sealing material include solvent solution method, extrusion lamination method, melting / hot melt method, calendar method, nozzle coating method, screen printing method, vacuum laminating method, hot roll laminating method, etc. Can be mentioned. A material having a hygroscopic property or an oxygen absorbing property may be contained as necessary. Although the thickness of the resin layer formed on a sealing material is arbitrarily determined by the magnitude | size and shape of the organic EL element to seal, about 5-500 micrometers is desirable.

  The substrate on which the first electrode, the organic light emitting layer, the light emission auxiliary layer, and the second electrode are formed and the sealing body are bonded together in a sealing chamber. When the sealing body has a two-layer structure of a sealing material and a resin layer, and a thermoplastic resin is used for the resin layer, it is preferable to perform only pressure bonding with a heated roll. When a thermosetting adhesive resin is used, it is preferable to perform heat curing at a curing temperature after pressure bonding with a heated roll. In the case where a photocurable adhesive resin is used, curing can be performed by further irradiating light after pressure bonding with a roll. Note that although the resin layer is formed over the sealing material here, the resin layer can be formed over the substrate and bonded to the sealing material.

  Before or instead of sealing with a sealing body, for example, as a passivation film, it is also possible to form a sealing body with an inorganic thin film, such as a silicon nitride film having a thickness of 150 nm using a CVD method. It is also possible to combine these.

  Examples of the present invention and comparative examples will be specifically described below.

[Preparation of transfer substrate]
An ITO film was formed on a 300 mm square glass substrate by sputtering, and the ITO film was patterned by photolithography and etching with an acid solution. The line pattern of the first electrode as the anode was a pattern in which 1950 lines were formed with a line width of 40 μm and a space of 20 μm. On top of that, poly (3,4) ethylenedioxythiophene / polystyrene sulfonic acid (PEDOT / PSS) was formed to a thickness of 100 nm as a hole transport layer using a spin coater. Further, the PEDOT / PSS thin film thus formed was dried at 100 ° C. under reduced pressure for 1 hour to produce a transfer substrate.

[Preparation of organic light-emitting layer forming ink]
The following organic light-emitting inks comprising three colors of red, green, and blue (RGB) were prepared.
Red luminescent ink (R): 1% by weight toluene solution of polyfluorene derivative (red luminescent material trade name Red 1100 manufactured by Sumitomo Chemical Co., Ltd.).
Green light-emitting ink (G): a 1% by weight toluene solution of a polyfluorene derivative (green light-emitting material, trade name Green 1300, manufactured by Sumitomo Chemical Co., Ltd.).
Blue light emitting ink (B): 1% by weight toluene solution of a polyfluorene derivative (blue light emitting material trade name Blue 1100 manufactured by Sumitomo Chemical Co., Ltd.).

[Preparation of resin letterpress]
The resin relief printing used for printing to form the organic light emitting layer in Example 1 is composed of a polyamide-based photosensitive resin layer having a thickness of 0.3 mm and a base material made of a polyethylene terephthalate plate (longitudinal elastic modulus 0.76 GPa, thermal expansion). Using a plate material composed of a coefficient of 1.0 × 10 ⁻⁴ / K), this is UV-exposed using a mask that transmits light to the image area, that is, a negative mask, developed with water, and the convex portions are made independent. A patterned resin relief was used. This resin letterpress was attached to the printing apparatus mentioned above, and the organic light emitting layer was printed.

[Printing of organic light-emitting layer forming ink by resin letterpress]
The resin relief printing on which the independent pattern was formed was mounted on a relief printing press, and RGB organic light-emitting inks were printed on the substrate to be printed. The positional accuracy of the printed pattern was within ± 10 μm. The substrate on which the organic light emitting layer is formed in a stripe shape is dried at 150 ° C. for 5 hours, and then a cathode (second electrode) made of calcium and aluminum is laminated on the substrate in a line pattern orthogonal to the pixel electrode line pattern. Formed. Finally, these organic EL components were hermetically sealed using a glass cap and an adhesive to produce an organic EL element panel. When a voltage was applied to check the light emission state, good light emission was obtained.

The relief printing plate used for printing to form the organic light emitting layer in Example 2 is composed of a polyamide-based photosensitive resin layer having a thickness of 0.3 mm and a steel plate substrate (longitudinal elastic modulus 196 GPa, thermal expansion coefficient 17.3. × 10 ⁻⁶ / K) was used, and this resin plate was exposed to UV light using a mask that transmits light to the image area, that is, a negative mask, and then developed with water to form an independent pattern of convex portions. A resin relief was prepared. This resin relief plate was attached to the printing apparatus mentioned above, and the organic light emitting layer was printed. The positional accuracy of the printed pattern was within ± 4 μm. When a voltage was applied to check the light emission state, good light emission was obtained.

The relief plate used for printing to form the organic light emitting layer in Example 3 is a base made of an alloy plate having a nickel content of 36% with a polyamide-based photosensitive resin layer having a thickness of 0.3 mm and an alloy of iron and nickel. A resin plate composed of a material (longitudinal elastic modulus 142 GPa, thermal expansion coefficient 2 × 10 ⁻⁶ / K) was used. The resin plate was subjected to UV exposure using a mask through which light passes through the image area, that is, a negative mask, and then developed with water to prepare a resin relief plate in which the convex portions were independently patterned. This resin relief plate was attached to the printing apparatus mentioned above, and the organic light emitting layer was printed. The positional accuracy of the printed pattern was within ± 2 μm. When a voltage was applied to check the light emission state, good light emission was obtained.

The relief printing plate used in the printing for forming the organic light emitting layer in Example 4 was made of a polyamide-based photosensitive resin layer having a thickness of 0.1 mm and a steel plate substrate (longitudinal elastic modulus 196 GPa, thermal expansion coefficient 17.3. × 10 ⁻⁶ / K), a resin relief plate in which convex portions are independently patterned by developing with UV using a mask that transmits light to the image area, ie, a negative mask, after UV exposure. Was made. This resin relief plate was attached to the printing apparatus mentioned above, and the organic light emitting layer was printed. The positional accuracy of the printed pattern was within ± 2 μm. When a voltage was applied to check the light emission state, good light emission was obtained.

(Comparative Example 1)
The letterpress used for printing to form the organic light emitting layer in Comparative Example 1 uses a resin plate composed of a polyamide-based photosensitive resin layer having a thickness of 2 mm and a base material made of a polyethylene terephthalate plate. Using a mask that transmits light to the part, that is, a negative mask, UV exposure was performed, followed by development with water to form a pattern, thereby producing a resin relief plate having a relief depth of 100 μm. This resin relief plate was attached to the printing apparatus mentioned above, and the organic light emitting layer was printed. Since the positional accuracy of the printed pattern is within ± 200 μm and sufficient positional accuracy could not be obtained, the organic light-emitting ink penetrates into the organic light-emitting layer having different luminescent colors across the partition walls, resulting in color mixing Has occurred.

(Comparative Example 2)
The letterpress used for printing to form the organic light-emitting layer in Comparative Example 2 was a polyamide-based photosensitive resin layer having a thickness of 2 mm and a steel plate substrate (longitudinal elastic modulus 196 GPa, thermal expansion coefficient 17.3 × 10 ^-6 / K), and using a mask that transmits light to the image area, that is, a negative mask, after UV exposure, the pattern is developed with water, and the relief depth is 100 μm. Was made. This resin relief plate was attached to the printing apparatus mentioned above, and the organic light emitting layer was printed. Since the positional accuracy of the printed pattern was within ± 50 μm, and sufficient positional accuracy could not be obtained, color mixing occurred and color loss occurred at both ends of the panel.

It is explanatory sectional drawing of the conventional resin letterpress. It is explanatory sectional drawing of this first organic EL element. FIG. 3 is an explanatory cross-sectional view of an example of an active matrix substrate of the present invention. It is explanatory sectional drawing of the resin letterpress of this invention. It is explanatory sectional drawing of the manufacturing method of a resin letterpress. It is the schematic of the relief printing apparatus of this invention.

Explanation of symbols

1: Substrate 2: First electrode 3: Hole transport layer 41: Red (R) organic light emitting layer 42: Green (G) organic light emitting layer 43: Blue (B) organic light emitting layer 7, 7x, 7y: Partition 111: Support 112: Active layer 113: Gate insulating film 114: Gate electrode 115: Interlayer insulating film 116: Drain electrode 117: Planarizing layer 118: Contact hole 119: Data line 120: TFT
200: base material 201: resin layer 202 having a convex pattern 202: convex pattern 202a: photosensitive resin (uncured)
202b: convex pattern 204 made of photosensitive resin: glass 205: light shielding part 206: photomask 207: active energy ray h: convex pattern thickness 10: ink tank 12: ink chamber 14: anilox roll 14a: ink 16: letterpress 18: Plate cylinder 20: Stage 24: Printed substrate

Claims (10)

  An organic electroluminescent device comprising at least a substrate, a first electrode supported by the substrate, an organic light emitting layer, and a second electrode, wherein an organic light emitting material or a light emitting auxiliary layer forming the organic light emitting layer is provided. Organic light emission is printed above the first electrode by a relief printing method using a resin relief plate having a projection pattern made of resin on a substrate using an ink in which a light emission auxiliary material to be formed is dissolved or dispersed in a solvent. In the method of manufacturing an organic electroluminescence element for forming at least one layer of a layer or a light emitting auxiliary layer, using a resin relief plate that is formed on a substrate independently of the convex pattern adjacent to the convex pattern, The ink is printed on the first electrode by a relief printing method to form an organic light emitting layer or a light emitting auxiliary layer. Manufacturing method of the scan element.   2. The method of manufacturing an organic electroluminescent element according to claim 1, wherein the base material constituting the resin relief plate is made of metal.   The method for producing an organic electroluminescence element according to claim 1, wherein a thickness of the convex pattern constituting the resin relief plate is 0.01 mm or more and 1 mm or less.   4. The method of manufacturing an organic electroluminescence element according to claim 1, wherein the base material constituting the resin relief plate is made of a material having a longitudinal elastic modulus of 70 GPa or more and 250 GPa or less.   The base material constituting the resin relief printing plate is made of a substance having a thermal expansion coefficient of 0.1 x 10-6 / K or more and 20.0 x 10-6 / K or less. The manufacturing method of the organic electroluminescent element of description.   The base material constituting the resin relief printing plate is made of a substance having a thermal expansion coefficient of 0.5 × 10 −6 / K or more and 5.5 × 10 −6 / K or less. The manufacturing method of the organic electroluminescent element of description.   The method for producing an organic electroluminescent element according to any one of claims 1 to 6, wherein a resin material for forming a convex pattern constituting the resin relief plate is water-soluble.   8. The method of manufacturing an organic electroluminescence element according to claim 1, wherein the resin material forming the convex pattern constituting the resin relief plate is made of a photosensitive resin. Having a convex pattern made of resin on the metal substrate,
The resin relief printing plate, wherein the projection pattern is formed on the metal substrate independently of the adjacent projection pattern. The thickness of the said convex part pattern is 0.01 mm or more and 1 mm or less, The resin letterpress of Claim 9 characterized by the above-mentioned.