JP4936368B2 - Vacuum chamber and electron beam drawing apparatus - Google Patents

Description

  The present invention relates to a vacuum chamber and an electron beam lithography apparatus, and more particularly to a vacuum chamber that hermetically seals an internal space in which a processing apparatus is disposed from an external space, and an electron beam lithography apparatus including the vacuum chamber.

  In recent years, electron beam mastering such as an electron beam recording device (EBR: Electron Beam Recorder) that generates an electron beam with a large current and a small beam diameter in order to write data to the next generation Blu-ray disc and the next generation DVD. Development of equipment is underway.

  This type of electron beam recording apparatus includes a stage device (see Patent Document 1) that holds a substrate on which a resist layer is formed, and an irradiation device that irradiates an electron beam onto the substrate held by the stage device. In general, from the viewpoint of preventing attenuation due to collision of an electron beam with gas molecules, the irradiation device and the stage device are arranged in an airtight space in a vacuum chamber in which a predetermined degree of vacuum is maintained.

  However, when the degree of vacuum in the internal space is increased, the vacuum chamber is slightly deformed due to the difference in atmospheric pressure between the external space and the internal space, and adversely affects the drawing accuracy of the electron beam recording apparatus disposed in the internal space. May affect. Therefore, in recent years, a method for suppressing the deformation of the vacuum chamber has been proposed from the viewpoint of avoiding this problem (see, for example, Patent Document 2).

  In the method described in Patent Document 2, a dual-structure vacuum chamber is configured by providing a main chamber that houses an electron beam recording apparatus and a sub-chamber that covers the outside of the main chamber. It is a method aimed at preventing deformation of the main chamber by evacuating the air in the hollow layer surrounded by a vacuum pump.

  However, in this method, since the surface on which the stage device is placed is integrated with the main chamber, it is difficult to ensure high surface accuracy. Further, as a material for the sub chamber, a very thin steel plate with a thickness of 3 mm is used from the viewpoint of weight reduction. For this reason, when the air in the hollow layer is exhausted by a vacuum pump, there is a problem that the sub-chamber is greatly deformed and vibration is caused. This vibration is transmitted to the main chamber and deteriorates the positioning accuracy of the stage device, and consequently reduces the recording accuracy of the electron beam recording device.

JP 2002-118054 A JP 2004-218862 A

  The present invention has been made under such circumstances, and a first object of the present invention is to provide a vacuum chamber capable of suppressing the deformation amount of the base holding the device in the internal space.

  A second object of the present invention is to provide an electron beam drawing apparatus capable of improving the drawing accuracy.

According to a first aspect of the present invention, an internal space in which a precision stage is disposed is isolated from an external space in an airtight state, and an airtight chamber that maintains the degree of vacuum in the internal space; and gas is exhausted from the internal space A vacuum pump; a base for holding the precision stage and partitioning the internal space into a first space and a second space; between the internal space and the external space as the gas is exhausted by the vacuum pump And a correction mechanism that suppresses deformation of the base using a pressure difference generated in the vacuum chamber.

  According to this, even if force is applied to the base due to deformation of the container due to the exhaust of gas from the internal space of the hermetic chamber, the difference in pressure between the internal space and the external space is applied to the base via the correction mechanism. Acts to counteract the acting force. Therefore, it is possible to suppress the deformation of the base.

From a second viewpoint, the present invention is an electron beam drawing apparatus for recording information on the surface of a sample using an electron beam, the vacuum chamber of the present invention; an irradiation apparatus for irradiating the sample with an electron beam; And a precision stage for holding the sample on the base of the vacuum chamber.

  According to this, the electron beam drawing apparatus includes the vacuum chamber of the present invention, and the precision stage for holding the sample is arranged on the base of the vacuum chamber of the present invention. For this reason, even if a pressure difference occurs between the internal space and the external space by making the hermetic chamber vacuum, the deformation of the base is effectively suppressed and the precision stage is not affected by the pressure difference. Therefore, the electron beam irradiation accuracy to the sample is improved, and as a result, the drawing accuracy can be improved.

<< First Embodiment >>
Hereinafter, a first embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a ZX cross-sectional view of the vacuum chamber 10 supported by the vibration isolator 20. FIG. 2 is a perspective view showing the vacuum chamber 10 with a partial cross-section. 1 and 2, the vacuum chamber 10 is fixed to the base 15 supported by a vibration isolator 20 (for example, a pneumatic servo mounter) near the four corners, and the upper and lower surfaces of the base 15, respectively. The first housing 12 and the second housing 17 are provided.

  The base 15 is formed of a square plate-like member in which a through hole 15a having a longitudinal direction in the X-axis direction is formed at the center, and is supported by the vibration isolator 20 so as to be substantially horizontal. The upper surface of the base 15 is finished with surface accuracy such that the flatness is 1 μm or less, for example, and a pair of rectangular supports whose longitudinal direction is the X-axis direction are provided on the + Y side and the −Y side of the through hole 15a. Each part 15b is formed. Each of the support portions 15b can support a predetermined processing apparatus or the like substantially horizontally at a position indicated by a virtual line in FIG. 1, for example.

  The first housing 12 includes a square plate-like lid member 13 and a side wall member 14 fixed along the outer edge of the lower surface of the lid member 13. As shown in FIGS. 3A and 3B, the side wall member 14 has an annular groove 14b and an annular groove 14c formed on the upper surface and the lower surface thereof, and an O-ring 32 is provided in each of the annular grooves 14b and 14c. It is inset.

  As shown in FIG. 3 (A), the lid member 13 and the side wall member 14 include a bolt 30 inserted from above into a plurality of stepped openings 13 a provided along the outer edge of the lid member 13. 14 to be integrated. 3B, the side wall member 14 placed on the upper surface of the base 15 is inserted into the plurality of stepped openings 15c provided along the outer edge of the lower surface of the base 15 from below. The bolt 30 is fixed to the upper surface of the base 15 by being screwed to the base 15. Thereby, the internal space 10A defined by the first housing 12 and the base 15 is hermetically sealed with the external space.

  As can be understood from FIGS. 1 and 2, the second housing 17 is made of a box-like member that is open at the top, and a flange portion 17 b is formed at the upper end of the outer peripheral surface. As shown in FIG. 3B, an annular groove 17c is formed along the inner edge of the upper surface of the flange portion 17b, and an O-ring 32 is fitted in the annular groove 17c. In addition, a vacuum pump 22 that exhausts the gas in the internal space 10B of the second housing 17 is fixed to the central portion of the lower surface of the second housing 17 through the opening 17a.

  As shown in FIG. 3 (B), the second housing 17 is configured such that the bolts 30 inserted from below into a plurality of openings provided in the flange portion 17b are engaged with the base 15 so that the bottom surface of the base 15 is removed. It is fixed to. Thereby, the internal space 10B is hermetically sealed with respect to the external space.

  As described above, the internal space of the vacuum chamber 10 according to the present embodiment is partitioned into the internal space 10A of the first housing 12 and the internal space 10B of the second housing 17 by the base 15, and both internal spaces are separated. 10 </ b> A and 10 </ b> B are communicated with each other through a through hole 15 a formed in the base 15. Therefore, when the gas in the internal space 10B is exhausted using the vacuum pump 22, the inside of the vacuum chamber 10 is set to a predetermined degree of vacuum without causing a pressure difference between the internal space 10A and the internal space 10B. Can do. Accordingly, it is possible to avoid the base 15 from being deformed due to the influence of the atmospheric pressure difference between the internal space 10A and the internal space 10B.

<< Second Embodiment >>
Next, a second embodiment of the present invention will be described with reference to FIGS. Here, the same reference numerals are used for the same or equivalent components as those in the first embodiment described above, and the description thereof is omitted or simplified.

  FIG. 4 is a ZX sectional view of the vacuum chamber 11 supported by the vibration isolator 20. FIG. 5 is a perspective view showing the vacuum chamber 11 partially in cross section. 4 and 5, the vacuum chamber 11 includes a base 15, a first housing 12, and a second housing 17, and four correction mechanisms 50 are disposed in the internal space 10B. ing.

  As shown in FIG. 5, the correction mechanism 50 is disposed along the periphery of a through hole 15 a provided in the base 15. FIG. 6 is a diagram showing a schematic configuration of the correction mechanism 50. As shown in FIG. 6, the correction mechanism 50 is fixed to the annular base 52 fixed to the inner bottom surface of the second housing 17, the circular plate 60 whose outer edge is supported by the annular base 52, and the annular base 52. And a support column 51 whose upper end is fixed to the base 15.

  The annular base 52 is an annular member having an L-shaped cross section, and a step portion is formed on the inner peripheral surface. As shown in FIG. 6, the annular base 52 is fixed to the inner bottom surface of the second housing 17 with, for example, a bolt (not shown).

  The circular plate 60 is a circular plate-like member having an outer diameter of 110 mm, a thickness of 3 mm, and a rigidity value of 120 N / μm, and an outer edge portion thereof is supported by a step portion of the annular base 52.

  The fixing plate 53 is an annular member having a circular opening 53a formed at the center, and is fixed to the upper surface of the annular base 52 with, for example, a bolt (not shown).

  The support column 51 is a columnar member, the upper end of which is fixed to the lower surface of the base 15 with, for example, a bolt, and the lower end is in contact with the upper surface of the circular plate 60 supported by the annular base 52.

  In the present embodiment, the four correction mechanisms 50 configured as described above are arranged so as to surround the through hole 15a of the base 15, and the support column 51 of each correction mechanism 50 is about 1200 N by the circular plate 60. It is urged upward by the force of.

  Next, a simulation result showing the deformation that occurs in the base 15 when the internal spaces 10A and 10B are in a predetermined vacuum state in the vacuum chamber 11 configured as described above will be described.

  In the vacuum chamber 11 according to the second embodiment, as shown in the following table, the material of each component 12, 13, 15, 17 and the size in each direction (unit: mm) were set. In Table 1, the size of the side wall member 14 in the X direction and the Y direction indicates the outside dimension of the member. In the second housing 17, the size in the X direction and the Y direction does not include the flange portion 17b. It is shown. Further, it is assumed that a force (load) of 50 kgf acts on the support portions 15b formed on the base 15 in the vertical direction.

  As a comparative example for the vacuum chamber 11, the vacuum chamber 10 according to the first embodiment, the vacuum chambers 101 and 102 shown in FIGS. 7A and 7B, and the vacuum chamber shown in FIG. 103 was assumed. In the vacuum chamber 101, the first housing 12 is fixed to the upper surface of the base 15, and a vacuum pump 22 that exhausts the gas in the internal space 10 </ b> A from the opening 15 a ′ provided in the center of the base 15 on the lower surface of the base 15. It is fixed. The vacuum chamber 101 is largely different from the vacuum chamber 10 in that the second housing 17 is not provided. Further, the vacuum chamber 102 has the same configuration as the vacuum chamber 10, but the size of the second housing 17 in the Z-axis direction is 450 mm, and the vacuum pump 22 is provided in the second housing 17. It differs from the vacuum chamber 10 in that it is provided on the side surface. The vacuum chamber 103 has the same configuration as the vacuum chamber 11, but the vacuum chamber 11 is in that the lower end of the support column 51 of the correction mechanism 50 is directly fixed to the inner bottom surface of the second housing 17. Is different.

In the simulation for each of the vacuum chambers 10, 11, 101, 102, the vacuum pump 22 is driven to reduce the degree of vacuum in the internal space of each vacuum chamber 10, 11, 101, 102 from atmospheric pressure to 10 ⁻⁴ Pa. The amount of deformation of the base 15 when it was at atmospheric pressure and the amount of deformation of the base 15 after evacuation were measured. Specifically, as shown in FIG. 9, the deformation of the base 15 is measured by measuring the displacement (ΔZ (μm)) from the point A to the point E on the −Y side of the through hole 15 a provided in the base 15. This was done by measuring. In addition, the displacement of each point AE shall mean the displacement from the part supported by the vibration isolator 20 among the upper surfaces of the base 15. FIG.

  Table 2 below shows the simulation result of the vacuum chamber 101. A pressure obtained by subtracting the pressure of the internal space 10A from the atmospheric pressure is applied to the base 15 upward. For this reason, the point C at the center is lifted by 22.4 μm, and there is a deformation of 26.5 μm before and after evacuation.

  Table 3 below shows simulation results of the vacuum chamber 10 according to the first embodiment. In the vacuum chamber 10, since there is no pressure difference between the internal space 10 </ b> A of the first housing 12 and the internal space 10 </ b> B of the second housing 17, the base 15 is not deformed by the influence of the pressure difference. However, since the volume of the internal space 10A is larger than the volume of the internal space 10B, it is more greatly affected by the deformation of the first housing 12. Further, since the weight of the load also acts on the support portion 15b formed on the base 15, the deformation due to this is also superimposed. For this reason, the displacement of the center part C point became -9.6 micrometers.

  Table 4 below shows simulation results of the vacuum chamber 102. In the vacuum chamber 102, since there is no pressure difference between the internal space 10A of the first housing 12 and the internal space 10B of the second housing 17, the base 15 is not deformed by the influence of the pressure difference. Further, since the volume of the internal space 10B is increased, the deformation of the first housing 12 and the second housing 17 cancel each other, and the weight of the load acting on the support portion 15b suppresses the deformation of the base 15. It works to do. For this reason, the displacement of the C point in the center is −1.6 μm, and the displacement of the C point is reduced from −3.3 μm to −1.6 μm as compared to before vacuuming. Further, the displacements of the points B, C, and D are substantially uniformly −1.6 μm to −1.5 μm, which is sufficient to achieve the accuracy of the device placed on the support portion 15b.

  Table 5 below shows simulation results of the vacuum chamber 11. In the vacuum chamber 11, since there is no pressure difference between the internal space 10 </ b> A of the first housing 12 and the internal space 10 </ b> B of the second housing 17, the base 15 is not deformed by the influence of the pressure difference. However, since the volume of the internal space 10A is larger than the volume of the internal space 10B, it is more greatly affected by the deformation of the first housing 12. Further, since the weight of the load also acts on the support portion 15b formed on the base 15, the deformation due to this is also superimposed. For this reason, the base 15 tends to be deformed so as to protrude downward. On the other hand, the inner bottom surface of the second housing 17 is largely lifted upward by the differential pressure between the internal space 10B of the second housing 17 and the atmospheric pressure. That is, the base 15 and the inner bottom surface of the second housing 17 are deformed in directions opposite to each other.

  In the vacuum chamber 11 according to the second embodiment, since the inner bottom surface of the second housing 17 is deformed, the support columns 51 of the four correction mechanisms 50 are urged upward, so that the base 15 is deformed. It is suppressed. That is, the amount of deformation of the base 15 and the amount of deformation of the inner bottom surface of the second housing 17 are mutually suppressed by the correction mechanism 50. Accordingly, the displacement at the center C point is −1.9 μm, and the displacements at the B point, the C point, and the D point are approximately −2.0 μm to −1.9 μm. This is sufficient to achieve the accuracy of the device supported by the support 15b of the stage 15. In the vacuum chamber 11 according to the second embodiment, the variation in displacement at the points B, C, and D is the smallest before and after evacuation. This indicates that the support portion 15b of the base 15 is not affected by the pressure change caused by evacuation, and it is possible to prevent the flatness of the base 15 from deteriorating even when evacuation is repeated. It becomes.

  Table 6 below shows simulation results of the vacuum chamber 103. In the vacuum chamber 103, the force that deforms the inner bottom surface of the second housing 17 upwards acts on the base 15, and the displacement of the central point C becomes extremely large as +6.7 μm.

  As described above, according to the vacuum chamber 11 according to the second embodiment, when the internal space 10A, 10B of the vacuum chamber 11 is evacuated, even if a force that deforms the base 15 acts, the internal space The difference in pressure between 10B and the external space acts so as to cancel the deformation of the base 15 via the correction mechanism 50. Therefore, as shown in the simulation results shown in Table 5, displacement deviations at points B, C, and D near the center of the base 15 are suppressed to within 0.1 μm, and the flatness of the base 15 is improved. Can be maintained.

  In the second embodiment, since the deformation of the base 15 is mainly corrected by the correction mechanism 50, an actuator or the like for suppressing the deformation of the base 15 is not required.

  In the second embodiment, the case where the correction mechanism 50 includes the circular plate 60 has been described. However, the present invention is not limited to this, and an elastic member that can ensure a desired rigidity value is used instead of the circular plate. Also good. The correction mechanism is not limited to a diaphragm structure, and may be a parallel leaf spring structure using a hinge mechanism, for example.

  The annular base 52 is fixed to the second housing 17 and the fixing plate 53 is attached to the annular base 52 by using bolts, screws or the like, for example, changing the weight of the device placed on the base 15 or the like. Can be changed to a circular plate with a desired stiffness value.

  In the second embodiment, the auxiliary mechanism 50 is disposed so as to surround the through hole 15 a provided in the base 15. Thereby, even when the largest deformation occurs at the position of the through hole 15a, the peripheral portion of the through hole 15a of the base 15 can be kept horizontal as much as possible.

  In the second embodiment, the deformation of the base 15 is suppressed by the auxiliary mechanism 50. Therefore, even when the second casing 17 is smaller than the first casing 12 or when the second casing 17 is larger than the first casing 12, the circular plate 60 By changing the thickness and size, the deformation of the base 15 can be effectively suppressed.

  Next, a third embodiment of the present invention will be described with reference to FIG. Here, the same reference numerals are used for the same or equivalent components as those in the first and second embodiments described above, and the description thereof is omitted or simplified.

  FIG. 10 shows a schematic configuration of an electron beam drawing apparatus 90 according to the third embodiment. The electron beam drawing apparatus 90 is a drawing apparatus that records information on the surface of the sample 83 using the electron beam irradiated from the electron beam irradiation apparatus 70. The electron beam drawing apparatus 90 includes a vacuum chamber 11 supported by the vibration isolator 20, an electron beam irradiation apparatus 70 disposed above the vacuum chamber 11, and a support portion 15 b formed on the base 15 of the vacuum chamber 11. The rotating device 71 is supported, and the transport unit 84 is disposed on the −X side surface of the vacuum chamber 11.

  The rotating device 71 includes a reference base 73 supported by a support portion 15b formed on the base 15, a moving table 75 disposed on the upper surface of the reference base 73 so as to be movable in the X-axis direction via a bearing 76, and a drive. A feed screw mechanism 78 that includes a motor 72 and a rotary shaft 77 and drives the moving table 75 in the X-axis direction; an air spindle 87 that is disposed on the upper surface of the moving table 75 and rotates the rotary table 82 at a predetermined rotational speed; A sealing mechanism 79 for sealing the air supplied to 87 to the internal space 10A is provided.

  In the rotation device 71, the rotation table 82 can be rotated via the air spindle 87 by driving the rotation motor 80 while monitoring the output from the encoder 81. Further, by driving the feed screw mechanism 78 and moving the moving table 75 in the X-axis direction, the rotary table 82 rotating at a predetermined speed can be moved in the X-axis direction.

  The transfer unit 84 is disposed in a second vacuum chamber 88 provided on the −X side of the vacuum chamber 11 via a gate valve 85, and an internal space of the second vacuum chamber 88 (hereinafter also referred to as a load lock chamber). A transport device 86 is provided.

  The internal space 10A of the vacuum chamber 11 is hermetically sealed with respect to the load lock chamber when the gate valve 85 is closed, and communicates with the load lock chamber when the gate valve 85 is opened. When the gate valve 85 is opened, the transfer device 86 loads the sample 83 transferred from the outside to the load lock chamber into the turntable 82 and loads the sample 83 that has been processed from the turntable 82. Take it out to the lock room.

  Next, a method for drawing a pattern on the sample 83 using the electron beam drawing apparatus 90 configured as described above will be described. Note that the operation of each unit of the electron beam drawing apparatus 90 is performed by a control device (not shown).

  When the sample 83 is transported to the load lock chamber by a transport system (not shown), the control device drives the transport device 86 to carry the sample 83 onto the turntable 82. Then, the transfer device 86 is retracted to the load lock chamber and the gate valve 85 is closed.

  Next, the control device drives the vacuum pump 22 to perform evacuation until the internal spaces 10A and 10B of the vacuum chamber 11 have a predetermined degree of vacuum. Then, the electron beam irradiation device 70 is driven to irradiate the sample 83 with the electron beam, and the rotary table 82 and the feed screw mechanism 78 are driven to draw a predetermined pattern on the sample 83.

  When the drawing of the pattern on the sample 83 is completed, the control device instructs the electron beam irradiation device 70 to blank the electron beam, thereby stopping the irradiation of the electron beam, and driving the transport device 86 to move the sample 83. Unload from the turntable 82.

  As described above, the electron beam drawing apparatus 90 according to this embodiment includes the vacuum chamber 11. Then, the processing in the electron beam drawing apparatus 90 is performed by irradiating the sample 83 rotated by the rotating device 71 supported by the base 15 of the vacuum chamber 11 with an electron beam. According to this, even if the internal space of the vacuum chamber 11 is evacuated, the correction mechanism 50 suppresses deformation of the base 15, so that the rotating device 71 placed on the base 15 receives deformation of the base 15. It is supported with high accuracy. Therefore, the accuracy of electron beam irradiation on the sample 83 is improved, and as a result, a pattern can be drawn on the sample 83 with high accuracy.

  In the second embodiment, the case where the electron beam drawing apparatus 90 includes the vacuum chamber 11 according to the second embodiment has been described. However, the present invention is not limited thereto, and the vacuum chamber according to the first embodiment is used. 10 may be provided. Also in this case, since the through hole 15a is formed in the base 15, deformation of the base 15 due to evacuation is suppressed, so that a pattern can be drawn on the sample 83 with high accuracy.

  In the electron beam drawing apparatus 90, an air spindle 87 is mounted on the rotating device 71. Since the air spindle 87 requires a predetermined length in the depth direction, it is possible to pass through the through hole 15a of the base 15. The holding position of the sample 83 on the air spindle 87 of the rotating device 71 can be lowered. Considering that the base 15 is connected to the vibration isolator 20, it is desirable that the sample 83 be as close to the upper surface of the base 15 as possible. Accordingly, there is an effect that it is possible to make it difficult to transmit vibration from the outside to the sample 83.

  As described above, the vacuum chamber of the present invention is suitable for maintaining the internal space at a predetermined pressure, and the electron beam drawing apparatus of the present invention is suitable for drawing a pattern on a sample using an electron beam. ing.

1 is a diagram showing a schematic configuration of a vacuum chamber 10 according to a first embodiment of the present invention. 1 is a perspective view of a vacuum chamber 10. FIG. 3A is a view for explaining the connection between the lid member 13 and the side wall member 14, and FIG. 3B is a view for explaining the connection of the first housing 12 and the second housing 17 to the base 15. It is a figure for doing. It is a figure which shows schematic structure of the vacuum chamber 11 which concerns on 2nd Embodiment. 2 is a perspective view of a vacuum chamber 11. FIG. 2 is a diagram illustrating a schematic configuration of an auxiliary mechanism 50. FIG. FIG. 7A is a diagram schematically showing the configuration of the vacuum chamber 101 according to the comparative example, and FIG. 7B is a diagram schematically showing the configuration of the vacuum chamber 102 according to the comparative example. It is a figure which shows schematically the structure of the vacuum chamber 103 which concerns on a comparative example. It is a figure which shows measurement point AE. It is a figure which shows schematically the electron beam drawing apparatus 90 which concerns on 3rd Embodiment.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10,11 ... Vacuum chamber, 12 ... 1st housing | casing, 13 ... Lid member, 13a ... Stepped opening, 14 ... Side wall member, 14b, 14c ... Annular groove, 15 ... Base, 15a ... Through-hole, 15b ... Support part 15c: Stepped opening, 17 ... Second housing, 17a ... Opening, 17b ... Flange, 17c ... Annular groove, 20 ... Vibration isolator, 22 ... Vacuum pump, 30 ... Bolt, 32 ... O-ring, 50 ... Correction mechanism 51... Support pillar 52. Ring base 53 53 Fixed plate 60 Circular plate 70 Electron beam irradiation device 72 Drive motor 71 71 Rotating device 73 Reference base 75 Moving table 77 ... Rotating shaft, 78 ... Feed screw mechanism, 79 ... Seal mechanism, 80 ... Rotary motor, 81 ... Encoder, 82 ... Rotary table, 83 ... Sample, 84 ... Transport unit, 85 ... Gate valve, 86 ... Transfer device, 7 ... air spindle, 88 ... second vacuum chamber, 90 ... electron beam lithography system.

Claims (6)

An airtight chamber that isolates the internal space in which the precision stage is disposed from the external space in an airtight state and maintains a vacuum degree of the internal space;
A vacuum pump for exhausting gas from the internal space;
A base for holding the precision stage and partitioning the internal space into a first space and a second space;
A correction mechanism that suppresses deformation of the base by utilizing a pressure difference generated between the internal space and the external space as the gas is exhausted by the vacuum pump. The vacuum chamber according to claim 1 , wherein the base has a through-hole that communicates the first space and the second space. The vacuum chamber according to claim 2 , wherein a plurality of the correction mechanisms are arranged around the through hole. The correction mechanism includes a vacuum chamber according to claim 1, characterized in that it comprises an elastic member having elasticity in a vertical direction. The airtight chamber is airtightly disposed on the upper surface of the base to define the first space, and the airtight chamber is airtightly disposed on the lower surface of the base to define the second space. The vacuum chamber according to any one of claims 1 to 4, further comprising a second container. An electron beam lithography apparatus for recording information on the surface of a sample using an electron beam,
A vacuum chamber according to any one of claims 1 to 5 ;
An irradiation device for irradiating the sample with an electron beam;
An electron beam lithography apparatus comprising: a precision stage for holding the sample on the base of the vacuum chamber.

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