JP4935113B2 - IC tag membrane - Google Patents

Description

  The present invention relates to a film for an IC tag that is laminated on the surface of an attachment to which an IC tag that performs wireless communication is attached, and in particular, when the IC tag is attached to a container, regardless of the material of the container and the presence or absence of contents. The present invention relates to a film for an IC tag that can maintain good communication characteristics of the IC tag.

Generally, resin containers made of PET resin, etc., and metal containers such as aluminum cans and steel cans, for example, containers for beverages such as beer, cola, cider, etc. Widely used in food containers and various liquid product containers.
In addition, pouch containers made of packaging materials in which a metal layer such as an Al foil is laminated on a soft packaging material such as a resin film are lightweight, flexible, durable, gas barrier properties, etc., easy to process and can be manufactured at low cost. It is widely used as a container for mainly liquid products such as detergents and cosmetics as well as food and beverages.
And in such various resin or metal containers, predetermined product information such as product names, contents components, producers, production locations, expiration dates, etc. are displayed in characters, barcodes, etc. . This type of product information display is usually printed on a container or a package for packaging the container, or printed on a label or the like and attached to the container.

However, the display of product information, etc., is generally displayed in a small size so as not to impair the design of the container. As a result, the display area, the size of displayed characters, the number of characters, etc. are limited. There is a problem that sufficient information cannot be displayed.
In the case of bar code display, the bar code itself must be displayed in a flat shape on the surface of the container in order to be read by the reader. Since the amount of information that can be encoded with is limited, there is a certain limit as a means for displaying and recognizing product information, as in the case of display by characters.

Therefore, as a means for eliminating such disadvantages and inconveniences of conventional product information display and displaying necessary and sufficient product information simply and accurately, an IC tag has recently been used.
An IC tag is also called a non-contact IC tag, RFID (Radio Frequency Identification) tag, RF tag, etc., and is an ultra-compact type in which an IC chip and a wireless antenna are sealed with resin, glass, etc. and formed into a tag (tag) shape. The communication terminal records predetermined information on the IC chip, attaches a tag to the object, and picks up the recorded information on the reading device (reader / writer) side by wireless communication. Recognize and display.

Such an IC tag can record hundreds of bytes to several kilobytes of data in the memory of the IC chip, can record sufficient information, etc., and is non-contact with the reader side, so that the wear or damage of the contacts In addition, there is no worry about dirt, etc. Furthermore, since the tag itself can be powered off, it is possible to process it according to the object and to make it smaller and thinner.
By using such an IC tag, various information related to the product, such as the name and weight of the product, the content, the name of the manufacturer / seller, the manufacturing location, the date of manufacture, the expiration date / expiration date, etc. Information can be recorded, and even a wide variety of product information that was impossible with conventional product display using characters and barcodes can be used simply by attaching a small and thin tag to the product. It became possible.

However, when such an IC tag is attached to a resin container such as a PET bottle, the communication characteristics of the tag deteriorate due to the influence of the contents of the container, and the contents (for example, beverages) are contained in the container. There is a problem that the communication distance of the IC tag changes depending on whether it is not included.
When the IC tag is attached to the container, the electromagnetic wave generated by the IC tag is generated in a direction penetrating the container (see FIG. 11). However, when the contents are contained in the container, the dielectric constant ( If the antenna characteristics change depending on the amount of electricity stored, and the contents are contained in the container, the communication distance of the tag becomes shorter than when the container is empty.

For this reason, when an IC tag is attached to a PET container as it is, the communication characteristics change due to the contents, and the contents are contained (for example, at the time of shipment / sales) and the contents are not contained. (For example, when the container is collected / discarded), the communication distance of the IC tag varies, which may cause problems such as unstable operation of the IC tag.
In particular, the higher the frequency of the IC tag, the greater the influence of such contents.

On the other hand, when an IC tag is attached to a metal container such as an aluminum can, a steel can, or a pouch container, the IC tag is affected by the conductivity of the metal container, and accurate wireless communication cannot be performed. .
When the IC tag is attached to the container, the magnetic flux generated by the IC tag is generated in a direction penetrating the container. For this reason, when a tag is attached to a metal container, a heat loss or the like in which a magnetic wave / electromagnetic wave generated by the antenna unit is absorbed to the metal container side occurs, and the communication characteristics of the tag are impaired.

For example, as shown in FIG. 11A, when the IC tag 120 is attached to the metal container 130, as shown in FIG. 11B, the magnetic flux generated by the IC tag 120 is applied to the surface of the metal container 130. An eddy current is induced, and this eddy current cancels out the magnetic flux of the IC tag 120 and causes heat loss.
In addition, the inductance of the antenna coil portion of the tag 120 changes due to the influence of the metal container 130, and the resonance frequency of the resonance circuit of the antenna is also shifted.
In this way, when a general-purpose IC tag that is generally used is attached to a metal container as it is, a problem occurs that the tag malfunctions or wireless communication with a reader / writer cannot be performed.

Therefore, in the past, as an IC tag attached to a metal container such as an aluminum can or a steel can, there has been a proposal for a metal-dedicated IC tag that can avoid the influence from the metal container by making the tag configuration dedicated to the metal container. (For example, refer to Patent Document 1-2.)
Conventionally proposed metal-dedicated IC tags have a magnetic body (high permeability body) or dielectric formed in a sheet shape or the like on the side facing the metal container inside the tag. As a result, the magnetic flux generated by the IC tag is allowed to pass through the magnetic body, thereby preventing an eddy current from being generated on the metal container side.

Specifically, Patent Document 1 proposes a packaging material for an IC tag dedicated to a metal container made of a sheet containing 40 to 90% of a soft ferrite having a permeability of 12 or more.
Moreover, in patent document 2, the electromagnetic wave absorber which attenuates electromagnetic wave noise by disperse | distributing 100 weight part of silicon steel powder with a particle size of 5-100 micrometers and thickness 0.5-5 micrometers in resin 0.5-30 weight part. Proposed.

JP 2004-127057 A (page 2-4, FIG. 1) JP 2002-158482 A (page 2-6, FIG. 4)

However, even though the conventionally proposed IC tag for a metal container can avoid the influence of the metal container, no consideration has been given to the problem of the IC tag due to the influence of the contents in the resin container as described above. .
Further, in such a conventional IC tag exclusively for metal, the tag itself is designed and configured exclusively for metal, and the existing IC tag cannot be used for a metal container. That is, it has not solved the problem when a general-purpose tag is used for a metal container.
IC tags can be used as a wireless communication means with low cost, small size, light weight and large storage capacity only by using general-purpose tags that are inexpensive and mass-produced. In the case of a tag having a large and complicated configuration that cannot be applied to a resin container, the merit of the general-purpose tag is remarkably reduced.

Furthermore, what is proposed in Patent Document 1-2 cannot fully utilize the original communication characteristics of the IC tag, and the thickness of the entire tag increases by the amount of the packaging material for the IC tag and the electromagnetic wave absorber. There was a problem to do.
In the IC tag packaging material described in Patent Document 1, the communication distance of the IC tag is extremely short compared to its thickness. For example, according to the same document, a packaging material constituted by laminating a ferrite layer having a thickness of 0.25 mm on a film layer (PE) having a thickness of 2 to 4 mm can obtain a communication distance of only 2 mm. For this reason, it was difficult to adopt as a base material for mounting an actual general-purpose tag.

Further, in the case of the electromagnetic wave absorber described in Patent Document 2 described above, when the frequency characteristics are seen, the imaginary part of the complex relative permeability in a low frequency band of 50 MHz or less is almost 0 (zero) (the same document). FIG. 4).
Here, the imaginary part of the complex relative permeability is a magnetic loss term, and the larger the value, the larger the loss, and the more the electromagnetic wave is absorbed. Therefore, the amount of electromagnetic wave absorption decreases as the imaginary part of the complex relative permeability decreases, thereby increasing the amount of electromagnetic wave transmission to the metal surface, inducing a demagnetizing field due to eddy currents, and adversely affecting the IC tag. An IC tag mounted on such an electromagnetic wave absorber deteriorates communication characteristics.
For this reason, when an electromagnetic induction type IC tag using a relatively low frequency band is mounted on the electromagnetic wave absorber described in the document, for example, it is clear that the communication characteristics of the IC tag deteriorate. Therefore, application to the 13.56 MHz band IC tag widely used at present is virtually impossible.

  The present invention has been proposed in order to solve the problems of the conventional techniques as described above. The flat magnetic metal and the resin composition are mixed at a certain ratio, and the flat magnetic metal is obtained. By uniformly orienting and dispersing, an IC tag film having a high magnetic permeability can be applied and formed on the tag mounting surface. An object of the present invention is to provide a film for an IC tag that can maintain good communication characteristics of the IC tag, can be reduced in thickness and size, and can use a general-purpose IC tag as it is.

To achieve the above object, the IC tag membrane of the present invention, an IC tag film provided on the surface of the mounted object for mounting the IC tag performing wireless communication, of the complex relative permeability at 10MHz~50MHz The real part is 10 or more.
Also, the complex relative permeability is as a imaginary part is 10 or more.
And the film | membrane for IC tags of this invention is set as the structure laminated | stacked by application | coating on the surface of the to-be-mounted object and / or base material which mount | wear with the said IC tag.

According to the film for an IC tag of the present invention having such a configuration, as a film for mounting the IC tag, a film having a high magnetic permeability is generated with the real part and the imaginary part of the complex relative permeability being equal to or greater than a certain value. By applying the IC tag to the IC tag mounting surface or substrate after coating the film, electromagnetic waves transmitted and received by the IC tag pass through the high permeability magnetic film, and therefore do not pass through the metal container side. Generation of eddy current generated on the side can be suppressed.
Here, the complex relative permeability of the IC tag film is excellent in the communication characteristics of the mounted IC tag when the real part and the imaginary part are 10 or more, and particularly suitable for 13.56 MHz band RFID, etc. It is possible to improve the communication distance of the IC tag when the IC tag that performs communication in the low frequency band is attached to a metal or the like.

Such a film for an IC tag according to the present invention is made into a paint as an electromagnetic wave shielding paint, and can be laminated by being applied to the surface of a substrate or a container on which the tag is mounted.
Thus, the IC tag film can be easily laminated by simply applying the electromagnetic wave shielding paint according to the present invention to the surface of the container or the substrate.
Here, the film for an IC tag applied and formed by the electromagnetic wave shielding paint can be applied and formed at any location on the surface of the container or the substrate.
For example, by applying an electromagnetic shielding paint only to the mounting part to which the IC tag is attached, an IC of any size and shape can be placed on any part of the container or base material according to the size or mounting part of the IC tag to be used. The tag film can be easily and rapidly applied and formed.

For example, when an IC tag is later attached to a can container in which the entire can is packaged with a plastic material such as a label can, the IC tag is randomly attached to any part of the container. Therefore, a magnetic paint is applied to the entire packaging material of the can container to form an IC tag film.
As a result, it is possible to realize a package and a tag base material with high versatility and high expandability that can be applied to any IC tag at low cost.

The IC tag film of the present invention has a surface resistance of 0.1 MΩ / cm ² or more.
Thus, by making the surface resistance of the IC tag film 0.1 MΩ / cm ² or more, the insulation effect of the IC tag film can be enhanced, and the generation of eddy currents on the film surface can be suppressed, and an error can be prevented. A stable communication environment without operation can be realized.

The film for an IC tag of the present invention is composed of 100 parts by weight of a flat magnetic metal and 10 to 50 parts by weight of the resin composition.
In particular, the flat magnetic metal is constituted by an average particle size 5~50μm powder also can thickness is constituted by a powder of 0.2 to 5 .mu.m.
Further , the flat magnetic metal may have an average thickness of aggregates in the resin composition of 5 μm or less.

According to the IC tag film of the present invention having such a configuration, the electromagnetic wave shielding paint capable of coating and forming an IC tag film by mixing a flat magnetic metal and a resin composition at a certain ratio. Is configured.
Further, the magnetic metal contained and kneaded in the electromagnetic wave shielding coating is made into a powder of a certain size, and the size of the aggregates generated for each powder is suppressed as much as possible.
Thereby, while being able to orient uniformly the magnetic body in a film | membrane, a dispersibility can be improved and the electromagnetic wave shielding coating material which is uniform and has no nonuniformity can be produced | generated.

The magnetic metal in the IC tag film is uniformly dispersed in the binder by setting the average particle size, thickness, and aggregate thickness to suitable values within a certain range. Thus, the mounted IC tag can be kept in good communication characteristics.
Therefore, according to the configuration of the flat magnetic metal according to the present invention, the thickness of the IC tag film formed by applying the electromagnetic wave shielding paint is reduced, and the film for IC tag exhibiting a good electromagnetic wave shielding effect. Can be realized.

The film for an IC tag of the present invention has a configuration in which the flat magnetic metal has an average angle (filler average angle) of 10 degrees or less with respect to an object to be mounted and / or a surface of a substrate on which the IC tag is mounted. It is as.
As described above, in the film for IC tag of the present invention, the average angle of the filler is reduced, and the film is formed by aligning the electromagnetic shield coating surface (tag mounting surface) and the flat magnetic metal metal as parallel as possible. is doing.
Accordingly, it is possible to effectively absorb the electromagnetic wave that attempts to penetrate the coated and formed IC tag film, and to exhibit an excellent electromagnetic wave shielding effect while suppressing the distribution of the magnetic material.
In particular, when the filler average angle is 10 degrees or less, the mounted IC tag can exhibit good communication characteristics.

In the IC tag film of the present invention , the flat magnetic metal is Fe-Si, Fe-Ni, Fe-Ni-Al, Fe-Cu-Si-Nb-Cr-B, Ni, or ferrite. It consists of at least one of the following.
According to the IC tag film of the present invention having such a configuration, any magnetic material can be selected and used as the flat magnetic metal constituting the IC tag film.
Accordingly, it is possible to set an IC tag film having a suitable magnetic permeability corresponding to the output and frequency of the IC tag to be used, and to provide an IC tag film excellent in versatility and expandability. it can.

Further, the IC tag for film of the present invention has a configuration comprising a distance layer to separate the IC tag from the surface of the mounting object and / or the substrate mounting the IC tag.
According to the IC tag film of the present invention having such a configuration, the base layer for coating and forming the IC tag film may include a resin layer made of plastic such as PET resin, a nonwoven fabric, and a foamed resin layer. The resin layer and the nonwoven fabric layer can function as a distance layer (air layer) for separating the IC tag from the IC tag film.

In order to reduce the influence of the contents of the container on the IC tag, it is ideally desirable that the effective relative dielectric constant of the mounting portion of the tag is 1.0 (air). It means that it is levitated, and it is difficult to make such a configuration with a single plastic material.
Therefore, in the present invention, a resin layer made of a plastic such as PET resin, a non-woven fabric, a foamed resin, or the like, which becomes a base material layer for applying the IC tag film, these resin layers, non-woven fabric layers, The IC tag is caused to function as a distance layer (air layer) for separating the IC tag from the IC tag film.

If the nonwoven fabric is a nonwoven fabric made of, for example, a PET resin, a large number of cavities are formed inside. Therefore, the effective relative dielectric constant can be made smaller than that of the PET resin itself, and can be set to a value closer to the ideal value of 1.0. It is possible and is most suitable as a substance constituting a distance layer for separating the IC tag from the container. Similarly, in the case of foamed resin, the inside is filled with gas such as air, nitrogen, carbon dioxide, etc., and the effective relative dielectric constant can be made a value close to 1.0.
Further, the feature of the nonwoven fabric and the foamed resin lies in the degree of design freedom, and a distance layer having a desired thickness and size can be formed easily and at low cost.

Therefore, in the present invention, a non-woven fabric or a foamed resin is used as a distance layer for separating the IC tag from the container, whereby the communication characteristics due to the influence of the dielectric constant of the container contents caused by the IC tag approaching and contacting the container. It is possible to effectively prevent a change in resonance frequency, a shift in resonance frequency due to the influence of the metal container, and heat loss due to metal.
In addition, from the same viewpoint, the distance layer can be formed, for example, by having a cavity inside by applying a resin coating in a lattice shape in addition to the nonwoven fabric and the foamed resin, and this is adopted as the distance layer of the present invention. You can also

In addition, the resin layer made of PET resin or the like can be set to an arbitrary thickness as the distance layer, and can be formed thin and long, for example, in a thin film form that can be wound into a roll shape. It is suitable as a base material for mounting an IC tag having an arbitrary shape and size by applying a coating film.
A distance layer made of a nonwoven fabric or the like can be further laminated on the resin layer formed in a film shape or the like, and an electromagnetic wave shielding paint or the like can be easily applied to the surface of the resin layer.
Thus, the resin layer made of a plastic such as PET resin can suitably function as a distance layer according to the present invention and as a base material layer on which an electromagnetic wave shielding paint is applied and laminated.

As described above, according to the film for an IC tag of the present invention, the flat magnetic metal in the film is appropriately dispersed and uniformly oriented. An effect can be obtained.
Accordingly, the film for an IC tag according to the present invention can be formed into a thin film by coating and forming on the surface of a container or substrate on which the IC tag is mounted. By mounting the IC tag on the film for the IC tag, No matter what type of IC tag is used, the tag side does not require any special configuration, is not affected by the presence or absence of the contents of the container, and is attached to a container of any material. Can be used, and accurate wireless communication is possible within the proper communication range of the tag.
As a result, the original good communication characteristics of the IC tag can be obtained even if it is used for various resin containers and metal containers without any loss of the advantages of a general-purpose IC tag that is small, thin and lightweight. It is possible to provide an IC tag film suitable for resin containers such as PET bottles, and metal containers such as aluminum cans, steel cans, label cans, and pouch containers.

Hereinafter, preferred embodiments of the film for an IC tag of the present invention will be described with reference to the drawings.
FIG. 1 is a perspective view schematically showing a main part of an IC tag film according to an embodiment of the present invention. FIG. 1A shows a case where an IC tag film is directly laminated on a container, and FIG. It shows a case where a film for an IC tag is laminated on a distance layer as a base material and the distance layer is attached to a container.
As shown in FIG. 1, the IC tag film 10 of the present embodiment is a part of the tag on which the IC tag 20 is mounted, and a reader / writer (not shown) is formed at a predetermined position on the film surface. IC tag 20 for performing wireless communication with the device is attached.

Specifically, as shown in FIG. 1A, the IC tag film 10 of the present embodiment is laminated on the surface of the container by being directly applied to the surface of the container 30 made of metal or PET resin. It is like that.
The IC tag film 10 functions as an electromagnetic wave shielding layer, and the IC tag 20 is attached to an arbitrary location on the IC tag film 10 to radiate from the IC tag 20 and try to pass through the container 30. Electromagnetic waves can be effectively shielded.
The IC tag film 10 on which the IC tag 20 is mounted is covered with a cover film made of a PET film or the like (not shown).

Further, as shown in FIG. 1B, the IC tag film 10 is formed on the surface of the distance layer 11 made of a nonwoven fabric, foamed resin, PET resin or the like on the container 30 side, and on the opposite side of the coated surface. The IC tag 20 can be attached to the container 30 together with the distance layer 11 with the IC tag 20 attached. In this case, the distance layer 11 functions as a base material for the IC tag film 10 and also functions as an air layer for separating the IC tag 20 mounted on the distance layer 11 from the IC tag film 10 and the container 30 side. It will be. As a result, the IC tag 20 can be separated from the surface of the IC tag film 10 and the surface of the container 30 by a certain distance to improve the communication characteristics. The IC tag film 10 may be applied to the surface of the distance layer 11 on the IC tag 20 side.
In addition, by providing the distance layer 11 that functions as a base material in this way, the distance layer 11 coated with the IC tag film 10 can be used as a packaging body such as a metal can or a PET resin container. In the process, the distance layer 11 on which the IC tag film 10 and the IC tag 20 are mounted can be wound and mounted on a container, and can be used to increase productivity.
Also in this case, the surfaces of the IC tag film 10 and the IC tag 20 mounted on the distance layer 11 are covered with a cover film (not shown).

[IC tag membrane]
As described above, the IC tag film 10 is laminated on the surface of the container 30 and the distance layer 11 serving as a base material, and functions as a layer that shields the magnetic field (electromagnetic wave) of the IC tag 20 from the container 30 side.
Specifically, the IC tag film 10 of the present embodiment is configured such that the real part of the complex relative permeability at 10 MHz to 50 MHz is 10 or more.
The IC tag film 10 is configured such that the imaginary part of the complex relative permeability at 10 MHz to 50 MHz is 10 or more.
Further, the IC tag film 10 is configured to have a surface resistance of 0.1 MΩ / cm ² or more.

With such a configuration, the IC tag film 10 is formed as an electromagnetic wave shielding layer having a high permeability by setting the real part and the imaginary part of the complex relative permeability to a certain value or more as a film for mounting the IC tag 20. By mounting the IC tag 20 on this electromagnetic wave shielding layer, the electromagnetic wave transmitted / received by the IC tag 20 can be passed through the magnetic film having a high magnetic permeability, and the electromagnetic wave does not permeate the metal container side, but on the metal container side. Generation of eddy currents can be suppressed.
Here, the complex relative permeability of the IC tag film is excellent in the communication characteristics of the mounted IC tag when the real part and the imaginary part are 10 or more, and particularly suitable for 13.56 MHz band RFID, etc. It is possible to improve the communication distance of the IC tag when the IC tag that performs communication in the low frequency band is attached to a metal or the like.
In addition, by setting the surface resistance of the IC tag film to a predetermined value or more, the insulation effect of the IC tag film 10 can be enhanced, and the generation of eddy currents on the film surface can be suppressed and stable operation without malfunction. Communication environment can be realized.

Further, the complex relative permeability of the IC tag film can be measured by the S-parameter reflection method (Technical Institute of Electrical Communication Vol.84 No.310).
Hereinafter, an outline of the S parameter reflection method will be described.
[S-parameter reflection method]
The method for measuring the complex relative permeability by the S-parameter reflection method is to measure the complex relative permeability by measuring the reflection amount, transmission amount and phase when a radio wave signal having a frequency to be measured is vertically incident on the sample. This is a technique obtained by calculation.
Specifically, the measurement procedure is as follows using a network analyzer and a coaxial tube.
(1) Complete reflection measurement (reference)
First, a metal plate is attached to the tip of the coaxial tube (no sample is attached).
Next, the frequency to be measured is transmitted from the network analyzer to the coaxial tube, and S11 and the phase are measured.
Here, S11 means the radio field intensity received by the network analyzer and the radio field intensity transmitted by the network analyzer, and the phase means the phase difference between the radio field intensity received by the network analyzer and the radio wave transmitted by the network analyzer. Say.
(2) Pseudo transmission measurement (reference)
First, attach a jig that easily transmits radio waves to the end of the coaxial tube (no sample).
Next, the frequency to be measured is transmitted from the network analyzer to the coaxial tube, and S11 and the phase are measured.
(3) Sample reflection measurement First, a metal plate is attached to the tip of the coaxial tube, and the sample is placed on the surface of the metal plate inside the coaxial tube.
Next, the frequency to be measured is transmitted from the network analyzer to the coaxial tube, and S11 and the phase are measured.
(4) Sample transmission measurement First, a jig that easily transmits radio waves is attached to the end of the coaxial tube, and the sample is placed on the surface of the jig inside the coaxial tube.
Next, the frequency to be measured is transmitted from the network analyzer to the coaxial tube, and S11 and the phase are measured.
By performing the above four measurements, the complex relative permeability can be derived by calculation.

In the present embodiment, the IC tag film 10 having the above characteristics is specifically composed of the following components.
FIG. 3 is an explanatory view schematically showing the configuration of the IC tag film according to the embodiment of the present invention. As shown in the figure, the IC tag film 10 of the present embodiment is configured by mixing a flat magnetic metal 101 serving as a filler and a resin composition 102 serving as a binder for the filler.

The magnetic metal 101 is uniformly oriented in the resin composition 102 and is appropriately dispersed.
This magnetic metal 101 is, for example, Fe-Si, Fe-Si-Cr, Fe-Ni, Fe-Ni-Al, Fe-Cu-Si, Fe-Cu-Si-Nb, Fe-Cu-Si-Nb. -It consists of Cr-B, Ni, Nb, Cr, a ferrite, etc.
Here, the magnetic metal 101 is preferably a flat metal having an average particle diameter of 5 to 50 μm and a thickness of 0.2 to 5 μm.

When the thickness of the magnetic metal 101 is less than 0.2 μm, there is a high possibility that the powder will be damaged during the preparation of the paint, thereby causing a decrease in magnetic permeability.
On the other hand, if the thickness of the magnetic metal 101 exceeds 5 μm, it is difficult to arrange the powder uniformly, which causes a decrease in magnetic permeability.
On the other hand, when the average particle diameter of the magnetic metal 101 is less than 5 μm, there are problems such as powder aggregation easily occurring.
Further, when the average particle diameter of the magnetic metal 101 exceeds 50 μm, there are problems such as difficulty in uniform dispersion.
On the other hand, when the magnetic metal 101 has an average particle diameter of 5 to 50 μm and a thickness of 0.2 to 5 μm, the powder can be efficiently dispersed and arranged uniformly. This is preferable because it can be easily performed.

In addition, as the orientation of the magnetic metal 101 is smaller, the smaller the filler angle, the better the electromagnetic shielding effect, and a film having an average filler angle of 10 degrees or less is particularly suitable.
As the filler angle decreases, the flat surface of the magnetic metal and the coating surface of the film approach parallel to each other, and electromagnetic waves can be absorbed effectively, and the average filler angle is preferably 10 degrees or less.

The resin composition 102 is made of an epoxy resin such as varnish or primer, a polyester resin, or the like.
By using these as a solvent, the magnetic metal 101 can be evenly dispersed in the resin composition 102 and can be uniformly or uniformly oriented (layered arrangement) throughout the binder.
That is, the resin composition 102 functions as a so-called “floating powder” of the magnetic metal 101.

In this embodiment, the mixing ratio of the resin composition 102 and the magnetic metal 101 is 10 to 50 parts by weight of the resin composition with respect to 100 parts by weight of the magnetic metal.
When the resin composition is less than 10 parts by weight with respect to 100 parts by weight of the flat magnetic metal, the magnetic metal is not uniformly dispersed, so that an excellent electromagnetic wave shielding effect cannot be obtained, and suitable adhesive strength ( Viscosity) is difficult to obtain.
Moreover, when the resin composition exceeds 50 parts by weight with respect to 100 parts by weight of the flat magnetic metal, it is difficult to achieve a sufficient electromagnetic wave shielding effect because the proportion of the magnetic substance is relatively reduced.
Therefore, in this embodiment, the resin composition is configured to be 10 to 50 parts by weight with respect to 100 parts by weight of the magnetic metal.

The IC tag film 10 composed of the above components is applied to the surface of the resin layer 11 because the resin composition 102 containing and kneading the magnetic metal 101 is liquefied with an appropriate viscosity. It is designed as a possible electromagnetic shielding paint.
Thereby, the film | membrane 10 for IC tags is laminated | stacked on the surface of the container 30 or the distance layer 11 by apply | coating a coating material. As a result, the manufacturing process of the IC tag film 10 can be performed very easily and quickly.
In addition, since the IC tag film 10 can be formed simply by applying the electromagnetic wave shielding paint as described above, by applying the paint only to the mounting portion to which the IC tag 20 is attached, the size and mounting portion of the IC tag 20 to be used, etc. Accordingly, the IC tag film 10 having an arbitrary size and shape can be easily and rapidly applied and formed on an arbitrary portion of the container or the distance layer 11. When the IC tag 20 is randomly attached to an arbitrary part of the container 30, the IC tag film 10 can be formed by applying an electromagnetic wave shielding paint to the entire surface of the container 30.

[Distance layer]
The distance layer 11 is a layer serving as a base material on which the IC tag film 10 is laminated, and is a layer for separating the IC tag 20 from the IC tag film 10 and the container 30 (see FIG. 1B).
The distance layer 11 can be formed of a nonwoven fabric or a foamed resin.
In order to reduce the influence of the contents of the resin container on the IC tag 20 and the influence of the metal container, ideally, it is desirable that the effective relative dielectric constant of the mounting portion of the tag is 1.0 (air). Then, it means that the IC tag is levitated in the air, and it is difficult to adopt such a configuration with the IC tag film 10 alone.
Therefore, by forming the distance layer 11 made of a nonwoven fabric or foamed resin, an effective relative dielectric constant close to that when the IC tag is levitated in the air can be obtained.

If the nonwoven fabric is a nonwoven fabric made of, for example, a PET resin, a large number of cavities are formed inside. Therefore, the effective relative dielectric constant can be made smaller than that of the PET resin itself, and can be set to a value closer to the ideal value of 1.0. It becomes possible. Similarly, in the case of foamed resin, the inside is filled with gas such as air, nitrogen, carbon dioxide, etc., and the effective relative dielectric constant can be made a value close to 1.0.
Further, the feature of the nonwoven fabric and the foamed resin lies in the degree of design freedom, and a distance layer having a desired thickness and size can be formed easily and at low cost.

In this embodiment, a non-woven fabric or a foamed resin is used as the distance layer 11 that separates the IC tag 20 from the container, and thereby, the resonance frequency shift caused by the IC tag coming into contact with or close to the IC tag film and the metal is reduced. It is possible to prevent heat loss due to metal, deterioration of communication characteristics due to the influence of contents, and the like.
The nonwoven fabric can be selected from any material such as synthetic fiber or natural fiber, and the thickness, size, shape, etc. can be arbitrarily set according to the IC tag 20 to be mounted. .
The foamed resin suitable for the distance layer 11 can be formed by various methods. For example, a method using a foaming agent, a method of injecting air or nitrogen gas when mixing (kneading) a polymer, There are methods using chemical reactions.

The thickness of the distance layer 11 is preferably about 15 μm in consideration of the thickness of the IC tag film 10 as a substrate .
In addition, the nonwoven fabric and foamed resin which comprise the distance layer 11 are functioning also as a base material of the film | membrane 10 for IC tags in the example shown in FIG.1 (b), However, as shown in FIG. And a distance layer 11 made of a nonwoven fabric or a foamed resin can be bonded and laminated on the surface of the base material layer 12 by an adhesive, heat fusion, or the like.
In this case, as shown in FIG. 2, the IC tag film 10 is preferably applied to the surface of the base material layer 12 on the container 30 side, but between the distance layer 11 and the base material layer 12 or between the distance layer 11 and the IC. You may apply | coat so that it may come between tags 20.
In addition to the non-woven fabric and the foamed resin, from the same viewpoint, for example, a distance layer having a cavity inside can be formed by applying a resin coating in a lattice shape, and this can be adopted as the distance layer 11. it can.
Further, the distance layer 11 made of a nonwoven fabric or the like is provided with the base material layer 12 described above, and when the base material layer 12 functions as the distance layer 11 and the communication gain of the IC tag is sufficiently secured, By using the base material layer 12 as the distance layer 11, the distance layer 11 made of a nonwoven fabric or the like can be omitted.

As shown in FIG. 2, the base material layer 12 is a layer serving as a base material for the IC tag film 10, and is formed into a thin film from PET resin or the like.
Specifically, the base material layer 12 is formed of a thermoplastic plastic such as polyester, polyethylene, polypropylene, or polyamide.
For example, the base material layer 12 can be formed by forming a thin film of a thermoplastic polyester resin. The thermoplastic polyester resin can be, for example, a copolymer or blend having polyethylene terephthalate or polybutylene terephthalate as a main component and having a melting point of about 200 to 260 ° C. The thickness of the polyester resin film is Usually, it is about 5 to 50 μm.
Considering the thickness, strength, durability and the like as the IC tag film 10, the thickness of the base material layer 12 is preferably about 5 μm to 100 μm.

Here, the thin film of the thermoplastic polyester resin is preferably an amorphous and non-stretched film which is formed by an extrusion laminating method, an unstretched cast film or laminating method, etc., and rapidly cooled after thermal bonding. The non-stretched, amorphous thermoplastic polyester resin film is excellent in stretchability and adhesion, and can be peeled off or stretched due to thinning of the metal layer 12 serving as a substrate. It is possible to follow without causing damage such as cracks.
The base material layer 12 may be a single layer (one layer) or may be a multilayer such as two layers or three layers. In the case of multiple layers, the stretched film can be formed by bonding through thermal bonding or an adhesive layer.

Thus, by providing the base material layer 12 serving as a base material, the IC tag film 10 can be formed thin and long into a thin film film that can be wound into a roll shape, and can be of any shape and size. It is suitable as an IC tag base material for packaging containers.
The base material layer 12 can be omitted as appropriate. As described above, in the present embodiment, the distance layer 11 that separates the IC tag 20 from the container can be provided (see FIG. 1B). When the application film 10 is laminated, the base material layer 12 can be omitted. In this sense, the base material layer 12 can be regarded as a layer constituting a part of the distance layer 11, and the IC tag 20 is separated from the container by the thickness of the base material layer 12 together with the distance layer 11 made of a nonwoven fabric or the like. Thus, good communication characteristics can be obtained. That is, by providing the base material layer 12 together with the distance layer 11, the IC tag 20 can be separated from the container by a predetermined distance depending on the thickness of “distance layer + resin layer”.

[Manufacture of paint]
As a manufacturing method of electromagnetic wave shielding coating constituting the IC tag film 10, the above-described magnetic metal 101 such as Fe—Si is used as a solvent for a resin composition 102 such as an epoxy resin or a polyester resin such as a varnish or a primer. Can be manufactured by mixing.
Here, the magnetic metal 101 is preferably in the form of a powder processed into a flat shape. However, the magnetic metal 101 can be a spherical one, or a flat one and a spherical one can be mixed and used.
The major axis of the flat shape of the magnetic material used is preferably, for example, in the range of 5 μm to 50 μm, and when the magnetic material is spherical, the particle diameter is preferably in the range of 15 μm to 30 μm.
As the solvent, an oily or water-based paint can be used, and there is no particular limitation such as a heat drying type or a UV curing type.
The mixing ratio of the magnetic substance and the solvent is preferably in the range of 40% to 75% in consideration of the electromagnetic wave shielding effect and the viscosity applicable to the metal.

[Dispersion of paint material]
The mixing and kneading of the magnetic metal 101 serving as the filler and the resin composition 102 serving as the binder can disperse the filler in the binder even by a general manual mixing method, and there is a certain degree of dispersion effect. It is preferable to increase the dispersion efficiency by preparing a paint or spraying with a kneader (hereinafter referred to as a three-roller mill 50) as shown in FIG.
Hereinafter, the specific procedure of the kneading method of the filler and binder using the three roller mill 50 will be described.

First, as shown in FIG. 4, the gap between the first roll 501 and the second roll 502 is minimized, and a material a (for example, Fe—Si powder, which is a magnetic metal) is mixed in the resin solvent therebetween. ) And kneading for a predetermined time to disperse the magnetic metal 101 appropriately. At this time, the second roll 502 and the third roll 503 are widened to the maximum so that a material with insufficient dispersion does not adhere to the third roll.
Thereafter, the gap between the first roll 501 and the second roll 502 is appropriately widened, and the thickness of the material attached to the second roll 502 is increased.

Next, the gap between the second roll 502 and the third roll 503 is gradually narrowed, the material attached to the second roll 502 is attached to the third roll 503, and the kneaded material attached to the third roll 503 ( The electromagnetic shielding paint a) is collected by the doctor blade 504.
Thereby, the electromagnetic wave shielding paint is completed.

[Paint application / heat treatment]
In order to apply the electromagnetic wave shielding paint mixed and kneaded as described above to the surface of the container 30 or the base material (distance layer 11, base material layer 12), a bar coater, a roll coat, a brush, a spray, or the like is used. it can. The coating material may be applied directly to the container or the substrate. However, in consideration of adhesion, it is preferable to apply an electromagnetic wave shielding coating material on the coated surface after applying an adhesive such as a primer.
Alternatively, electromagnetic wave shielding paint and varnish, primer, resin, or the like may be alternately applied to the application surface and laminated. In this case, the uppermost layer is preferably not an electromagnetic wave shielding paint.
The coating thickness of the coating is preferably about 50 to 300 μm when the thickness of the IC tag film 10 is taken into consideration, although it depends on the concentration of the magnetic powder in the solvent and the size of the powder. Further, the thicker the coating thickness, the higher the electromagnetic shielding effect.

The electromagnetic wave shielding paint applied to the application surface of the container or the substrate is then formed as an IC tag film 10 by performing a heat treatment.
FIG. 5 is an explanatory view schematically showing a state in which the electromagnetic wave shielding coating material used as the IC tag film according to the present embodiment is subjected to heat treatment.
First, after the electromagnetic wave shielding paint is applied to the application surface of the container 30 or the like to which the IC tag 20 is attached, the application surface is heated at a predetermined temperature for a certain time.
By this heat treatment, as shown in FIG. 5A, the solvent contained in a large amount before heating is volatilized, and the surface of the coating film is lowered.
At this time, a force in the direction of the metal surface from the coated surface (see the arrow in FIG. 5A) acts on the magnetic metal 101, so that the magnetic metal 101 gradually becomes parallel to the coated surface, and finally, FIG. Thus, the magnetic metal 101 is uniformly oriented.
As a result, the IC tag film 10 can be laminated on any application surface.

By forming the IC tag film 10 of the present embodiment as described above, the real part and the imaginary part of the complex relative permeability of the IC tag film 10 are set to 10 or more, and the surface resistance value is set as described above. It becomes possible to set it as 0.1 MΩ / cm ² or more.
That is, when the IC tag film 10 satisfies the above-described conditions, an excellent electromagnetic wave shielding effect can be obtained, and the communication characteristics of the IC tag can be kept good.
Thereby, the magnetic permeability of the entire IC tag film 10 can be effectively increased, and the thickness of the IC tag film 10 can be suppressed as much as possible while improving the electromagnetic wave absorption characteristics of the IC tag film 10.
In addition, the IC tag film 10 can effectively increase the surface resistance of the film, thereby suppressing the generation of eddy currents and the like and providing a stable shielding effect without malfunction.

[IC tag]
The IC tag 20 includes an IC chip and an antenna. The IC chip and the antenna are mounted on a base material made of resin, glass, or the like and are integrally sealed to form one IC tag.
In this embodiment, the IC tag film 10 forms a part of the base material of the IC tag 20, and the IC tag 20 is placed on the surface of the container 30 via the IC tag film 10 as shown in FIG. 1. To be implemented.
As described above, the IC tag film 10 can be laminated on the distance layer 11 made of a nonwoven fabric or the like. In this case, the IC tag 20 has the IC tag film 10 by the thickness of the distance layer 11. And mounted away from the container surface.

The IC tag 20 can simultaneously mount the IC tag 20 in the manufacturing process of the container on which the IC tag film 10 is applied and formed, and the manufactured and shipped IC tag film 10 and the IC tag film The IC tag 20 can be attached later to a container or the like in which 10 is laminated.
Here, the IC chip provided in the IC tag 20 is formed of a semiconductor chip such as a memory, and can record data of, for example, several hundred bytes to several kilobytes.
Then, reading and writing (data calling / registration / deletion / update etc.) is performed by wireless communication with the reader / writer via the antenna, and the data recorded on the IC chip is recognized.
As data to be recorded on the IC chip, for example, arbitrary information and various data such as product name, weight, content, manufacturer / seller name, manufacturing location, date of manufacture, expiration date, etc. can be recorded. Moreover, rewriting is also possible. Data can be recorded and rewritten by a dedicated reader / writer.

The frequency band used in the IC tag 20 includes several types of frequency bands such as a band of 135 kHz or less, a 13.56 MHz band, an 860 M to 960 MHz band belonging to a so-called UHF band, and a 2.45 GHz band. The communication distance that enables wireless communication varies depending on the frequency band used, and the optimum antenna length varies depending on the frequency band.
In the present embodiment, the IC tag film 10 made of an electromagnetic wave shielding paint can prevent eddy currents and the like from being generated in the metal container 30.

Moreover, since the IC tag 20 can be sufficiently separated from the IC tag film 10 and the container 30 by including the distance layer 11 and the base material layer 12 made of nonwoven fabric or the like, the tag is affected by the contents of the container 30. The change of the inductance etc. of a side can also be prevented and, thereby, the fluctuation | variation of the communication distance by the shift | offset | difference of the resonant frequency of the antenna of IC tag 20, the presence or absence of the contents, etc. can be prevented.
As a result, even if the IC tag 20 has any frequency band, good communication characteristics can be maintained by mounting the IC tag 20 on the container 30 via the IC tag film 10 according to the present embodiment.

[container]
Next, an example of a container in which the IC tag film 10 of the present embodiment as described above is laminated is shown in FIGS.
FIG. 6 is a perspective view showing an example of a PET bottle container in which a packaging material on which the IC tag 20 is mounted by applying the IC tag film 10 according to this embodiment is wound.
FIG. 7 is a perspective view showing an example of a can container in which the IC tag film 10 according to the present embodiment is applied to the surface of the can container and the IC tag is mounted on the application surface.

As shown in FIG. 6, the IC tag film 10 of the present embodiment is obtained by applying a packaging material (base material layer) 12 on which the IC tag film 10 is applied on the surface and the IC tag 20 is mounted thereon to the PET. The container 30 can be wrapped around the body of the bottle 30A.
The packaging material 12 including the IC tag 20 is cut into an appropriate size, wound around the body of the PET bottle container 30A or the can container 30B, and fixed and attached to both ends of the package with heat welding, an adhesive, or the like.
Further, as shown in FIG. 7, the IC tag film 10 of the present embodiment can be formed by laminating an electromagnetic wave shielding paint directly on the surface of the container without using a packaging material or a base material. In the example shown in FIG. 7, the IC tag film 10 is applied and laminated at a predetermined location of the body portion of the can container 30B, and the IC tag 20 is mounted thereon.

[Communication characteristics]
Next, communication characteristics of the IC tag mounted on the container through the IC tag film according to the present embodiment will be described with reference to FIGS.
FIG. 8 shows the film thickness of the IC tag film 10 when an IC tag having a resonance frequency of 13.56 MHz is applied to the distance layer 11 made of a nonwoven fabric and mounted on a metal container. It is a graph which shows the relationship between the communication distance of IC tag.
In this figure, as an electromagnetic wave shielding paint constituting the IC tag film 10, 30 parts by weight (“-●-”) of resin (varnish) and 45 parts by weight (“-Δ-” with respect to 100 parts by weight of Fe—Si. )), 67 parts by weight (“− × −”), and shows the relationship between the paint film thickness and the communication distance when the paint is manufactured by kneading by hand mixing.

As shown in the figure, it is understood that not only the film thickness of the IC tag film 10 but also the resin distribution in the paint affects the communication characteristics.
Specifically, it can be seen that the communication distance increases when the paint film thickness is increased in any resin distribution.
As for resin distribution, the communication distance is the longest in the case of 30 parts by weight of resin with respect to 100 parts by weight of Fe-Si, and a communication distance of 40 mm or more is obtained with a film thickness of 300 μm, and the resin part by weight is 45 parts. It can be seen that the communication distance becomes shorter as the number increases to 67.

9 is similar to FIG. 8 in that the resin material and the kneading method are different when mounted on a metal container through the IC tag film 10 of the present embodiment using an IC tag having a resonance frequency of 13.56 MHz. Each of the patterns represents the relationship between the film thickness of the IC tag film 10 and the communication distance of the IC tag.
Specifically, the binder was mixed with FeSi powder using 7850 (Clasp coating 7850 made by Valsparlock) and kneaded using a three roller mill (see FIG. 4) (“-○-”), Similarly, a binder 7850 in which FeSi powder is mixed and kneaded by hand mixing ("-△-"), and a binder varnish is used and FeSi powder is mixed and kneaded by hand mixing ("-□-") In each case, the relationship between the paint film thickness and the communication distance was examined.

As shown in the figure, it can be seen that the communication distance increases as the paint film thickness increases in any binder and kneading method.
As a kneading method, the paint kneaded by the three roller mill has a longer communication distance than the case of hand mixing, and the kneading using the three roller mill has sufficient magnetic metal in the binder. It can be seen that the shielding effect of the IC tag film 10 is improved.
In particular, with a paint kneaded by a three roller mill, a communication distance of 60 mm or more is obtained with a film thickness of 300 μm, and it can be seen that better communication characteristics can be ensured as compared with the case shown in FIG.
This is because the real part of the complex relative dielectric constant of 10 and the imaginary part of the paint kneaded by mixing the FeSi powder using varnish as the binder is 10 and the imaginary part is 5 This is because the real part of the complex relative dielectric constant is 22 and the imaginary part is 10, which is a very high value.

FIG. 10 shows changes in presence or absence of container contents and communication distance of the IC tag when an IC tag having a resonance frequency of 13.56 MHz is mounted on a container made of PET resin via the IC tag film 10 of the present embodiment. It is a graph which shows a relationship.
As shown in the figure, the IC tag 20 has a difference in communication distance of about 150 mm depending on the presence or absence of water when there is no film for the IC tag. On the other hand, the IC tag 20 mounted on the PET resin container through the IC tag film 10 applied to the nonwoven fabric (distance layer 11) has contents (water) in the container ("-●-"). )) And when it is not ("-△-"), there is almost no change in the communication distance. This is because the IC tag film prevents electromagnetic waves from being transmitted to the contents side and suppresses loss.

On the other hand, when the IC tag 20 is directly attached to the PET resin container without using the IC tag film 10, there is a case where the contents are present (“-○-”) and a case where the contents are present ( The disparity in communication distance with “-×-”) is increasing. Further, when the nonwoven fabric is not provided, when the film thickness of the IC tag film 101 is increased, the communication characteristics are deteriorated in proportion to the presence or absence of the contents.
For this reason, the IC tag film 10 can be attached to the resin container by setting the IC tag 20 at a certain distance from the container side and having an appropriate film thickness to shield the electromagnetic waves of the IC tag 20. It can be seen that the communication characteristics can be maintained well.

As described above, according to the IC tag film 10 of the present embodiment, it can be applied and formed on the surface of the container 30 to which the IC tag such as a resin container or a metal container is mounted, and the paint is the magnetic metal 101. And a resin composition 102 can be formed. This coating prevents deterioration of communication characteristics due to the influence of the contents of the resin container and accompanying fluctuations in the communication distance due to the presence or absence of the contents, as well as heat loss and resonance of the communication gain due to the influence of the metal container. The frequency shift can be prevented.
More specifically, the magnetic permeability of the IC tag film 10 can be increased by uniformly orienting and dispersing the magnetic metal 101 constituting the IC tag film 10. When the IC tag 20 is attached to a metal container or a resin container via the film 10, it is possible to prevent the electromagnetic waves radiated from the IC tag 20 from being transmitted through these containers 30.

As a result, any existing IC tag can be attached to a metal container or resin container via the IC tag film 10 of the present embodiment, so that accurate wireless communication within the proper proper communication range of the tag can be achieved. Communication becomes possible.
Therefore, according to the film for IC tag 10 of the present embodiment, it is possible to prevent a malfunction of the IC tag and a decrease in communication distance, which are excellent in electromagnetic wave absorption and shielding properties, and realize a stable operating environment.
As described above, according to the IC tag film 10 of the present embodiment, no matter what IC tag 20 is attached to any container 30, and whether the container 30 has contents or not, The communication gain of the tag 20 can always be kept in a good state, accurate wireless communication is possible, and even an existing general-purpose tag can be used as it is, and the IC tag has excellent versatility and reliability. Films and substrates can be provided.

[Example]
Hereinafter, an embodiment of a film for an IC tag according to the present invention will be described.
Example 1
Silicon filler flat powder (Fe—Si, particle size average 25 μm, thickness average 1 μm) and polyester binder (Clasp Coating 7850, Valsparlock Co., Ltd., 30% solids) as filler, 100 parts by weight of filler, 30 binders A part by weight was blended. 50 g of the blended filler and binder were gently mixed by hand to disperse, and further mixed with a three roller mill for 10 minutes. This was applied to the surface of an aluminum DI can and dried at 180 ° C. for 5 minutes. The thickness of the coating film was 200 μm.
About the complex relative magnetic permeability of the coating film, it measured using the S parameter system reflection method coaxial-tube type | shaft (epsilon) r and a μr measuring device system by Keycom Corporation. The measurement results were a real part μ ′ = 22 and an imaginary part μ ″ = 10 of the complex relative permeability. The surface resistance was 1.0 × 10 ⁸ Ω / cm ² .
As a result of attaching a IC tag (manufactured by Texas Instruments, operating frequency 13.56 MHz) on the coating film and conducting a communication test, the communication distance was 50 mm, which was favorable.

(Example 2)
Fe-Cu-Si-Nb-Cr-B filler ("Finemet" manufactured by Hitachi Metals, Ltd., particle size average 35 µm, thickness average 1 µm) and polyester binder (clear coating 7850 made by Valsparlock) as fillers 45% by weight of a binder was blended with 100 parts by weight of filler. 50 g of the blended filler and binder were gently mixed by hand to disperse, and further mixed with a three roller mill for 10 minutes. This was applied to the surface of an aluminum DI can and dried at 180 ° C. for 5 minutes. The thickness of the coating film was 200 μm.
Regarding the magnetic permeability of the coating film, the real part μ ′ = 30.5 and the imaginary part μ ″ = 10.2 of the complex relative permeability. The surface resistance was 4.5 × 10 ¹¹ Ω / cm ² .
As a result of performing a communication test by attaching the same IC tag as in Example 1 on the coating film, the communication distance was 55 mm, which was favorable.

(Example 3)
Permalloy (Fe—Ni, average particle size: 50 μm, thickness average: 1 μm) and polyester binder (Clasp Coating 7850 manufactured by Vals Parlock Co., Ltd., 30% solids) as fillers are mixed with 45 parts by weight of binder with 100 parts by weight of filler did. 50 g of the blended filler and binder were gently mixed by hand to disperse, and further mixed with a three roller mill for 10 minutes. This was applied to the surface of an aluminum DI can and dried at 180 ° C. for 5 minutes. The thickness of the coating film was 200 μm.
As for the permeability of the coating film, the real part μ ′ = 10.2 and the imaginary part μ ″ = 3.3 of the complex relative permeability. The surface resistance was 1.2 × 10 ⁵ Ω / cm ² .
As a result of performing a communication test by attaching the same IC tag as in Example 1 on the coating film, the communication distance was 22 mm, which was favorable.

Example 4
Silicon filler flat powder (Fe—Si, particle size average 25 μm, thickness average 1 μm) and polyester binder (Clasp Coating 7850, Valsparlock Co., Ltd., 30% solids) as filler, 100 parts by weight of filler, 30 binders A part by weight was blended. The blended filler and 50 g of binder were lightly mixed by hand and mixed. This was applied to the surface of an aluminum DI can and dried at 180 ° C. for 5 minutes. The thickness of the coating film was 200 μm.
As for the permeability of the coating film, the real part μ ′ = 14 and the imaginary part μ ″ = 9.8 of the complex relative permeability. The surface resistance was 1.0 × 10 ⁸ Ω / cm ² .
As a result of attaching the same IC tag as Example 1 on the coating film and conducting a communication test, the communication distance was 30 mm, which was favorable.

(Example 5)
Silicon filler flat powder (Fe—Si, particle size average 25 μm, thickness average 1 μm) and epoxy binder (varnish “TFA5-217” manufactured by Toyo Ink Mfg. Co., Ltd., solid content 45%) as filler are 100 weights of filler. 30 parts by weight of binder was blended with respect to parts. The blended filler and 50 g of binder were lightly mixed by hand and mixed. This was applied to the surface of an aluminum DI can and dried at 200 ° C. for 2 minutes. The thickness of the coating film was 200 μm.
As for the permeability of the coating film, the real part μ ′ = 10.0 and the imaginary part μ ″ = 5.0 of the complex relative permeability. The surface resistance was 8.0 × 10 ⁸ Ω / cm ² .
As a result of attaching the same IC tag as Example 1 on the coating film and conducting a communication test, the communication distance was 30 mm, which was favorable.

(Comparative Example 1)
Silicon filler flat powder (Fe—Si, particle size average 25 μm, thickness average 1 μm) and epoxy binder (varnish “TFA5-217” manufactured by Toyo Ink Mfg. Co., Ltd., solid content 45%) as filler are 100 weights of filler. 67 parts by weight of binder was blended with respect to parts. The blended filler and 50 g of binder were lightly mixed by hand and mixed. This was applied to the surface of an aluminum DI can and dried at 200 ° C. for 2 minutes. The thickness of the coating film was 200 μm.
As for the permeability of the coating film, the real part μ ′ = 6.9 and the imaginary part μ ″ = 2.7 of the complex relative permeability. The surface resistance was 1.0 × 10 ⁸ Ω / cm ² .
As a result of carrying out a communication test by attaching the same IC tag as in Example 1 on the coating film, the communication distance was about 10 mm, and good communication characteristics were not obtained.

The IC tag film of the present invention has been described with reference to a preferred embodiment. However, the IC tag film according to the present invention is not limited to the above-described embodiment, and may be variously within the scope of the present invention. Needless to say, it is possible to implement this change.
For example, in the above-described embodiment, the description has been given by taking, as an example, a PET bottle, a can container, or a pouch container used as a beverage or food container as a container to which the IC tag is attached via the IC tag film of the present invention. The container to which the IC tag film of the invention can be applied is not particularly limited in terms of the purpose of the container, the contents to be stored, the components of the container, and the like. That is, as long as the container is made of resin or metal, any size, shape, material, etc. may be used, and any contents stored in the container may be used. .

  The film for an IC tag of the present invention described above is, for example, a PET bottle container, a metal can (label can) such as an aluminum can or a steel can, an arbitrary resin container such as a pouch container, or an IC tag attached to a metal container. It can be suitably used as a film / base material.

It is a perspective view which shows typically the film | membrane for IC tag which concerns on one Embodiment of this invention, (a) is the case where the film | membrane for IC tag is directly laminated | stacked on a container, (b) is a distance layer for the film | membrane for IC tag The distance layer is attached to the container. It is a perspective view which shows typically the film | membrane for IC tags which concerns on one Embodiment of this invention, the case where the distance layer which laminated | stacked the film | membrane for IC tags is laminated | stacked on a base material layer, and the base material layer is mounted | worn to a container. Show. It is explanatory drawing which shows typically the structure of the film | membrane for IC tags which concerns on one Embodiment of this invention. 1 shows a three-roller mill used in the process of producing a film for an IC tag according to an embodiment of the present invention, wherein (a) is a perspective view showing an appearance, and (b) is an A-shown in (a). It is A sectional view. It is explanatory drawing which showed the mode of the production | generation of the film | membrane for IC tags which concerns on one Embodiment of this invention typically, (a) is the state before heat-processing a mixed material, (b) is heat-processed to a mixed material. The state after applying is shown. BRIEF DESCRIPTION OF THE DRAWINGS It is a perspective view which shows typically the state which apply | coats the film | membrane for IC tags which concerns on one Embodiment of this invention to a packaging material, and attaches the packaging material which attached the IC tag to the application surface to a PET bottle container, (a) The state before attaching a packaging material to a container, (b) has shown the state which attached the package to the container. It is the perspective view which showed the state which apply | coated the film | membrane for IC tag which concerns on one Embodiment of this invention directly to a metal can container, and attached the IC tag to the application surface. It is a graph which shows the relationship between the film thickness and the communication distance of an IC tag when the film | membrane for IC tags which concerns on one Embodiment of this invention is apply | coated to a metal container, (a) is 30 weight part of resin, (b) Shows a case where 45 parts by weight of resin and (c) 67 parts by weight of resin are mixed with 100 parts by weight of Fe—Si. It is a graph which shows the relationship between a film thickness and the communication distance of an IC tag when the film for IC tags which concerns on one Embodiment of this invention is apply | coated to a metal container, (a) is the clear coating 7850 made from Valsparlock as resin. Used are kneaded with a three roller mill, (b) shows the same resin mixed by hand mixing, and (c) shows the resin kneaded by hand mixing. It is a graph which shows the relationship between the presence or absence of the contents of a container, and the communication distance of an IC tag at the time of mounting an IC tag to the resin container through the film | membrane for IC tags which concerns on one Embodiment of this invention. It is explanatory drawing which shows typically the state of the communication characteristic at the time of mounting an IC tag in the conventional general metal container, (a) is the state of the IC tag mounted in the metal container, (b) is ( The state of the magnetic flux which the IC tag shown to a) emits is shown.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 IC tag film | membrane 11 Distance layer 12 Base material layer 20 IC tag 30 Container 40 Contents 50 3 roller mill 101 Magnetic body metal 102 Resin composition

Claims (10)

A film for an IC tag provided on an object to be mounted and / or a surface of a substrate on which an IC tag for performing wireless communication is mounted,
A predetermined flat magnetic metal serving as a filler is mixed with a predetermined resin composition serving as a binder, and the flat magnetic metal is mixed with Fe-Si, Fe-Ni, Fe-Ni-Al, Fe- It consists of at least one of Cu-Si-Nb-Cr-B, Ni, and ferrite,
A film for an IC tag, wherein the real part and the imaginary part of the complex relative permeability at 10 MHz to 50 MHz are each 10 or more. A film for an IC tag provided on an object to be mounted and / or a surface of a substrate on which an IC tag for performing wireless communication is mounted,
A predetermined flat magnetic metal serving as a filler is mixed with a predetermined resin composition serving as a binder, and the flat magnetic metal is mixed with Fe-Si, Fe-Ni, Fe-Ni-Al, Fe- It consists of at least one of Cu-Si-Nb-Cr-B, Ni, and ferrite,
A film for an IC tag , wherein the real part of the complex relative permeability at 10 MHz to 50 MHz is 10.0 to 30.5, and the imaginary part is 3.3 to 10.2 .   The film for an IC tag according to claim 1 or 2, wherein the film is laminated by coating on a surface of an article to be mounted and / or a substrate on which the IC tag is mounted. The film for an IC tag according to claim 1, wherein the surface resistance is 0.1 MΩ / cm ² or more.   The film for an IC tag according to any one of claims 1 to 4, comprising 100 parts by weight of a flat magnetic metal and 10 to 50 parts by weight of the resin composition. The film for an IC tag according to any one of claims 1 to 5, wherein the flat magnetic metal is a powder having an average particle diameter of 5 to 50 µm. The film for an IC tag according to claim 1, wherein the flat magnetic metal is a powder having a thickness of 0.2 to 5 μm. The flat-shaped magnetic metal, IC tag film according to any of claims 1 to 7 the thickness of the metal powder dispersed in the resin composition is 5μm or less. The film for an IC tag according to any one of claims 1 to 8, wherein an angle of the flat magnetic metal with respect to an object to be mounted and / or a surface of a substrate on which the IC tag is mounted is an average of 10 degrees or less. The IC tag film according to any one of claims 1 to 9 , further comprising a distance layer that separates the IC tag from a surface to be mounted and / or a surface of the substrate on which the IC tag is mounted.

Images