JP4872238B2 - IC tag compatible plastic material, IC tag and IC tag compatible container - Google Patents

Description

  The present invention relates to an IC tag-compatible plastic material to which an IC tag for wireless communication with a reader / writer can be attached, an IC tag having the plastic material as a base material, and an IC tag having a plastic material as a package In particular, the present invention relates to an IC tag-compatible plastic material that can maintain good communication characteristics of the IC tag regardless of the material and contents of the container, an IC tag including the plastic material, and an IC tag-compatible container. .

Generally, resin containers made of PET resin, etc., and metal containers such as aluminum cans and steel cans, for example, containers for beverages such as beer, cola, cider, etc. Widely used in food containers and various liquid product containers.
In addition, pouch containers made of packaging materials in which a metal layer such as an Al foil is laminated on a soft packaging material such as a resin film are lightweight, flexible, durable, gas barrier properties, etc., easy to process and can be manufactured at low cost. It is widely used as a container for mainly liquid products such as detergents and cosmetics as well as food and beverages.
And in such various resin or metal containers, predetermined product information such as product names, contents components, producers, production locations, expiration dates, etc. are displayed in characters, barcodes, etc. . This type of product information display is usually printed on a container or a package for packaging the container, or printed on a label or the like and attached to the container.

However, the display of product information, etc., is generally displayed in a small size so as not to impair the design of the container. As a result, the display area, the size of displayed characters, the number of characters, etc. are limited. There is a problem that sufficient information cannot be displayed.
In the case of bar code display, the bar code itself must be displayed in a flat shape on the surface of the container in order to be read by the reader. Since the amount of information that can be encoded with is limited, there is a certain limit as a means for displaying and recognizing product information, as in the case of display by characters.

Therefore, as a means for eliminating such disadvantages and inconveniences of conventional product information display and displaying necessary and sufficient product information simply and accurately, an IC tag has recently been used.
An IC tag is also called a non-contact IC tag, an RFID (Radio Frequency Identification) tag, etc., and is an ultra-small communication terminal in which an IC chip and a radio antenna are sealed with resin, glass, etc. and formed into a tag (tag) shape. , Record predetermined information on the IC chip, attach a tag to the object, and pick up the recorded information on the reading device (reader / writer) side by wireless communication to recognize and display the information recorded on the IC chip To do.

Such an IC tag can record hundreds of bytes of data in the memory of the IC chip, can record sufficient information, etc., and is non-contact with the reader side, so that the contact is worn, scratched, dirty, etc. In addition, since the tag itself can be powered off, it can be processed according to the object and can be made smaller and thinner.
By using such an IC tag, various information related to the product, such as the name and weight of the product, the content, the name of the manufacturer / seller, the manufacturing location, the date of manufacture, the expiration date / expiration date, etc. Information can be recorded, and even a wide variety of product information that was impossible with conventional product display using characters and barcodes can be used simply by attaching a small and thin tag to the product. It became possible.

However, when such an IC tag is attached to a resin container such as a PET bottle, the communication characteristics of the tag deteriorate due to the influence of the contents of the container, and the contents (for example, beverages) are contained in the container. There is a problem that the communication distance of the IC tag changes depending on whether it is not included.
When the IC tag is attached to the container, the electromagnetic wave generated by the IC tag is generated in a direction penetrating the container (see FIG. 12). However, when the contents are contained in the container, the dielectric constant ( If the antenna characteristics change depending on the amount of electricity stored, and the contents are contained in the container, the communication distance of the tag becomes shorter than when the container is empty.

For this reason, when an IC tag is attached to a PET container as it is, the communication characteristics change due to the contents, and the contents are contained (for example, at the time of shipment / sales) and the contents are not contained. (For example, when the container is collected / discarded), the communication distance of the IC tag varies, which may cause problems such as unstable operation of the IC tag.
In particular, the higher the frequency of the IC tag, the greater the influence of such contents.

On the other hand, when an IC tag is attached to a metal container such as an aluminum can, a steel can, or a pouch container, the IC tag is affected by the conductivity of the metal container, and accurate wireless communication cannot be performed. .
When the IC tag is attached to the container, the magnetic flux generated by the IC tag is generated in a direction penetrating the container. For this reason, when a tag is attached to a metal container, a heat loss or the like in which a magnetic wave / electromagnetic wave generated by the antenna unit is absorbed to the metal container side occurs, and the communication characteristics of the tag are impaired.

For example, as shown in FIG. 12A, when the IC tag 120 is attached to the metal container 130, the magnetic flux generated by the tag 120 causes a vortex on the surface of the metal container 130 as shown in FIG. An electric current is induced, and this eddy current cancels out the magnetic flux of the IC tag 120 and causes heat loss. In addition, the inductance of the antenna coil portion of the tag 120 changes due to the influence of the metal container 130, thereby The resonance frequency of the resonance circuit of the antenna is also shifted.
In this way, when a general-purpose IC tag that is generally used is attached to a metal container as it is, a problem occurs that the tag malfunctions or wireless communication with a reader / writer cannot be performed.

Here, as a conventional IC tag attached to a metal container such as an aluminum can or a steel can, a proposal for a metal-only IC tag that can avoid the influence of the metal container by making the structure of the tag dedicated to the metal container (For example, refer to Patent Documents 1-3.)
Specifically, as shown in FIG. 13, a conventionally proposed IC tag 220 dedicated to a metal container has a magnetic body (high magnetic permeability) formed in a sheet shape or the like on the side facing the metal container 130 inside the tag. Body) 221 and a dielectric are arranged, thereby preventing the magnetic flux generated by the IC tag 220 from passing through the magnetic body 221 and preventing an eddy current from being generated on the metal container 130 side. It was like that.

JP 2002-207980 (page 2-4, FIG. 1) Japanese Unexamined Patent Publication No. 2004-127057 (page 3-4, FIG. 1) JP 2004-164055 A (page 4-5, FIG. 1)

However, even if the conventionally proposed IC tag for a metal container can avoid the influence of the metal container, the problem of the IC tag due to the influence of the contents in the resin container as described above can be solved. There wasn't.
Further, in such a conventional IC tag exclusively for metal, the tag itself is designed and configured exclusively for metal, and the existing IC tag cannot be used for a metal container.
That is, it has not solved the problem when a general-purpose tag is used for a metal container.

In addition, the IC tag configured exclusively for metal in this way has a complicated configuration in which a magnetic material and a dielectric material are arranged inside, and the tag becomes larger and heavier, and is small and thin. There also arises a problem that the maximum advantage of the light weight IC tag is impaired.
IC tags can be used as a wireless communication means with low cost, small size, light weight and large storage capacity only by using general-purpose tags that are inexpensive and mass-produced. In the case of a tag having a large and complicated configuration that cannot be applied to a resin container, the merit of the general-purpose tag is remarkably reduced.

  The present invention has been proposed in order to solve the problems of the conventional techniques as described above, and by attaching an IC tag to a container side through a plastic material having a predetermined distance layer and an electromagnetic wave shielding layer. The communication characteristics of the IC tag do not change depending on the presence or absence of the contents of the container, and the communication characteristics of the IC tag are not impaired even if the container is made of metal. IC tag compatible plastic material, IC tag and IC that can maintain the communication characteristics of the IC tag well regardless of the material of the container and can use the general-purpose IC tag as it is. The purpose is to provide a tag-compatible container.

In order to achieve the above object, an IC tag-compatible plastic material of the present invention is a plastic material serving as a base material constituting a package to which an IC tag for performing wireless communication with a reader / writer is attached. It is set as the structure provided with the distance layer which spaces apart from a to-be-packaged body.
In addition, the plastic material corresponding to the IC tag of the present invention is configured to further include an electromagnetic wave shielding layer that shields the electromagnetic wave of the IC tag from the packaged body side.

According to the plastic material corresponding to the IC tag of the present invention having such a configuration, the distance layer for separating the IC tag from the packaging body as a plastic material for packaging the packaging body such as a resin container or a metal container. Thus, it is possible to prevent a change in communication characteristics due to a change in dielectric constant depending on the presence or absence of the contents of the resin container.
Further, by laminating and forming an electromagnetic wave shielding layer for shielding the electromagnetic wave of the IC tag from the packaged body side on this plastic material, it is possible to prevent heat loss of communication gain and resonance frequency shift due to the influence of the metal container. .
As a result, any existing IC tag can be attached to a resin container or metal container via the plastic material of the present invention so that accurate wireless communication can be performed within the proper proper communication range of the tag. become.

That is, by providing a distance layer that separates the IC tag from the container, the IC tag can be separated from the container by a predetermined distance, so that the influence of the dielectric constant of the contents of the resin container can be sufficiently suppressed, Variations in the communication characteristics of the IC tag due to the presence or absence of the contents of the resin container can be effectively prevented.
In addition, by providing an electromagnetic wave shielding layer made of an electromagnetic wave shielding paint or the like, it is possible to suppress the generation of eddy currents generated on the metal container side due to the electromagnetic wave of the IC tag when the tag is attached to the metal container. By the distance layer separated from the container, the IC tag can be sufficiently separated from the metal container to prevent a change in inductance of the IC tag due to the influence of the metal, and to effectively prevent the resonance frequency deviation of the IC tag antenna. become able to.

Thus, by using the plastic material of the present invention, regardless of what IC tag is attached to any container and whether or not the contents are in the container, the communication gain of the IC tag is always increased. It can be ensured in a good state, accurate wireless communication is possible, and even existing general-purpose tags can be used as they are, and it is possible to realize IC tags with excellent versatility and reliability. Become.
In addition, the plastic material of this invention should just be provided with a distance layer at least, and a distance layer can laminate | stack the layer which consists of a nonwoven fabric, a foamed resin, etc. on the PET resin layer etc. which become a base material, for example. Further, the distance layer itself can be used as a base material, and in that case, a base material such as a PET resin layer is not necessary.
And an electromagnetic wave shielding layer can be laminated | stacked by apply | coating an electromagnetic wave shielding coating material etc. to the surface of this distance layer or a base material.

Moreover, the IC tag-compatible plastic material of the present invention is configured such that an electromagnetic wave shielding layer is laminated on the surface of the distance layer by coating.
According to the IC tag-compatible plastic material of the present invention having such a structure, an electromagnetic wave shielding coating is applied to the surface of a plastic material distance layer or a resin layer made of plastic such as PET resin as a base material as an electromagnetic wave shielding layer. By coating, an electromagnetic wave shielding layer can be formed by coating.
Thereby, the electromagnetic wave shielding layer can be easily laminated by simply applying the electromagnetic wave shielding paint on the surface of the plastic material.

Here, the electromagnetic wave shielding layer can be applied and formed at any location on the surface of the resin layer. For example, by applying an electromagnetic wave shielding paint only to the mounting part to which the IC tag is attached, an electromagnetic wave shielding layer having an arbitrary size and shape on an arbitrary part of the plastic material in accordance with the size or mounting part of the IC tag to be used. Can be formed easily and rapidly.
For example, when an IC tag is later attached to a can container in which the entire can is packaged with a plastic material such as a label can, the IC tag is randomly attached to any part of the container. Therefore, an electromagnetic wave shielding paint is applied to the entire plastic material to form an electromagnetic wave shielding layer.
As a result, it is possible to realize a packaging material / plastic material having high versatility and high expandability that can be applied to any IC tag at low cost.

In the plastic material for IC tag of the present invention , the electromagnetic wave shielding layer is made of a metal oxide material.
Specifically, metal oxide material may be a Mn-Zn, consists Ni-Zn or Mg-Zn-based Rubber ferrite structure.
Further , the metal oxide material can be made of a magnetic material containing flakes or particles of Al, C, Cu, Ag, Nb, Co, Cr, Pd, Ni, Mn, W, or Si.

According to the IC tag-compatible plastic material of the present invention having such a configuration, any metal oxide material can be selected and used as the electromagnetic wave shielding layer that shields the electromagnetic waves of the IC tag from the container side.
As a result, it is possible to set an electromagnetic wave shielding layer with suitable permeability corresponding to the output and frequency characteristics of the IC tag to be used, and provide an IC tag compatible plastic material excellent in versatility and expandability. can do.

In the plastic material for IC tag of the present invention , the distance layer is composed of a nonwoven fabric or a foamed resin.
According to the plastic material corresponding to the IC tag of the present invention having such a configuration, a nonwoven fabric, a foamed resin, or the like can be laminated as a distance layer for separating the IC tag from the container.

In order to reduce the influence of the contents of the container on the IC tag, it is ideally desirable that the effective relative dielectric constant of the mounting portion of the tag is 1.0 (air). It means that it is levitated, and it is difficult to make such a configuration with a single plastic material.
If the nonwoven fabric is a nonwoven fabric made of, for example, a PET resin, a large number of cavities are formed inside. Therefore, the effective relative dielectric constant can be made smaller than that of the PET resin itself, and can be set to a value closer to the ideal value of 1.0. It is possible and is most suitable as a substance constituting a distance layer for separating the IC tag from the container. Similarly, in the case of foamed resin, the inside is filled with gas such as air, nitrogen, carbon dioxide, etc., and the effective relative dielectric constant can be made a value close to 1.0.
Further, the feature of the nonwoven fabric and the foamed resin lies in the degree of design freedom, and a distance layer having a desired thickness and size can be formed easily and at low cost.

Therefore, in the present invention, a non-woven fabric or a foamed resin is used as a distance layer for separating the IC tag from the container, whereby the communication characteristics due to the influence of the dielectric constant of the container contents caused by the IC tag approaching and contacting the container. It is possible to effectively prevent a change in resonance frequency, a shift in resonance frequency due to the influence of the metal container, and heat loss due to metal.
In addition, from the same viewpoint, the distance layer can be formed, for example, by having a cavity inside by applying a resin coating in a lattice shape in addition to the nonwoven fabric and the foamed resin, and this is adopted as the distance layer of the present invention. You can also

In the plastic material corresponding to the IC tag of the present invention , the distance layer is composed of a thermoplastic resin layer.
According to the plastic material corresponding to the IC tag of the present invention having such a configuration, a resin layer made of plastic such as PET resin is provided as a base material of the plastic material to be a package, and the IC tag is placed in a container. It can be configured as a distance layer separated from the side.

A resin layer made of PET resin or the like can be set to an arbitrary thickness as a distance layer, and can be formed thin and long, for example, in a thin film film that can be wound into a roll shape, and has an arbitrary shape and size. It is suitable as a base material for plastic materials for packaging containers.
The resin layer formed into a film or the like can be further laminated with a distance layer made of nonwoven fabric, etc., and the electromagnetic wave shielding layer can be easily laminated by applying an electromagnetic wave shielding paint on the surface of the resin layer. Can be formed.
As described above, the resin layer made of plastic such as PET resin can suitably function as the distance layer according to the present invention and as the base material of the plastic material.

The IC tag of the present invention includes an IC chip, an antenna, and a plastic material that is a base material on which the IC chip and the antenna are mounted, and the plastic material constitutes a package body of the package body. The IC tag is attached to a packaged body and performs wireless communication with a reader / writer, and the plastic material is made of the plastic material corresponding to the IC tag according to the present invention .

Thus, in the present invention, the plastic material having the distance layer for separating the IC tag from the container and the electromagnetic wave shielding layer for shielding the electromagnetic wave of the IC tag can be integrally provided on the IC tag side. It can be provided as an attached IC tag.
When considering productivity, etc., it is advantageous to integrally form the plastic material and the IC tag, and the communication characteristics of the tag will not be impaired even if it is attached to any container. The feature of the present invention that enables accurate wireless communication can be realized at a lower cost and with higher productivity.

The IC tag-compatible container of the present invention is a container including a container body capable of storing contents therein and a plastic material for packaging all or part of the container body, the plastic material being the present invention. It is set as the structure which consists of a plastic material corresponding to IC tag.
Further, the IC tag compatible container of the present invention is a container having a container main body capable of storing contents therein, and the container main body is made of a plastic material, and all or part of the container main body is related to the present invention. An IC tag-compatible plastic material can also be used.

Thus, the IC tag compatible container of the present invention is a PET container packaged with a plastic material with an IC tag using the plastic material according to the present invention, a metal can / label can such as an aluminum can and a steel can, Arbitrary metal containers such as pouch containers and resin containers can be formed. Further, a plastic container itself such as a PET container can be formed of a plastic material with an IC tag.
The plastic material used as the package of the container can be used to wrap the entire container with the plastic material according to the present invention, or it can be used as a label for packaging only the portion of the container where the IC tag is mounted with the plastic material. In addition, the plastic container itself can be constructed.
Thus, according to the present invention, any resin tag or metal container of any shape, size, application, etc. can be attached to any IC tag regardless of the presence or absence of the contents of the container. It can be provided as an IC-compatible container that can ensure a good communication gain of the tag.

Furthermore, the IC tag corresponding | compatible container of this invention is set as the structure provided with the 2nd distance layer which spaces apart an IC tag from a to-be-packaged body between a container main body and a package.
Thus, the IC tag-compatible container of the present invention can include a second distance layer that further separates the IC tag from the container between the container body and the package.
Thereby, the IC tag can be sufficiently separated from the container side by the second distance layer together with the distance layer of the package, and the change in the communication characteristics due to the change in the dielectric constant is effective depending on the presence or absence of the contents of the resin container. In addition, the heat loss of the communication gain and the deviation of the resonance frequency due to the influence of the metal container can be prevented.

Here, a 2nd distance layer can be comprised by utilizing the uneven | corrugated shape on the surface of a container, or the shape of container itself.
For example, in the case where the container is a resin-made PET container, the IC tag is disposed at the position of the recess formed by the bead of the container body, so that the depth is about 400 μm to 800 μm, similar to the case of the embossed can. A second distance layer of thickness (thickness) can be configured.
In particular, in the case of a rectangular PET container, a gap is formed between the package and the container body by winding the package on the outer periphery of the container body, and the second distance layer is formed by this gap. Can be configured.

Furthermore, when the container is a metal can container, an IC tag is disposed at the position of the recessed portion of the embossed can where the can body is subjected to uneven processing, whereby the depth of about 400 μm to 800 μm (for example, approximately 400 μm to 800 μm). (Thickness) second distance layer can be constructed.
In this way, in the present invention, the second distance layer that maintains the communication characteristics of the IC tag satisfactorily can be provided by utilizing the uneven shape of the container surface and the shape of the container itself.・ A highly reliable IC tag compatible container can be realized.

According to the IC tag-compatible plastic material of the present invention, any existing IC tag is not affected by the presence or absence of the contents of the container without requiring a special configuration on the tag side. And it can be used even if it mounts | wears with the container of what kind of material, and the exact radio | wireless communication in the proper communication range original of a tag is attained.
As a result, the original good communication characteristics of the IC tag can be obtained even if it is used for various resin containers and metal containers without any loss of the advantages of a general-purpose IC tag that is small, thin and lightweight. Further, it is possible to provide a plastic material corresponding to an IC tag suitable for resin containers such as PET bottles, and metal containers such as aluminum cans, steel cans, label cans, and pouch containers.

Hereinafter, preferred embodiments of a plastic material corresponding to an IC tag according to the present invention, an IC tag including the plastic material, and an IC tag compatible container will be described with reference to the drawings.
[Plastic materials]
1A and 1B are perspective views schematically showing a principal part of a plastic material corresponding to an IC tag according to an embodiment of the present invention. FIG. 1A shows a state before the IC tag is mounted, and FIG. The mounted state is shown.
As shown in FIG. 1, a plastic material 10 according to the present embodiment is a package for packaging a container 30 such as a resin container or a metal container to be packaged, and a reader / writer (not shown) is placed at an arbitrary position on the surface. IC tag 20 for performing wireless communication with the device is attached.

Specifically, the plastic material 10, the resin layer 11 serving as a base material, the distance layer 12 laminated on one surface of the resin layer 11, and the electromagnetic wave shielding layer 13 applied and formed on the other surface of the resin layer 11. The IC tag 20 is mounted at an arbitrary position of the distance layer 12 and is covered with the cover film layer 14.
The plastic material 10 can also be packaged so as to wrap the entire container to be packaged, such as a PET bottle or a label can package, and can be wrapped around the body of the container. You may make it wrap a part (refer FIGS. 3-6).

The plastic material 10 can be used as a packaging body constituting a plastic container itself such as a PET resin container in addition to being used as a thin film film packaging body wound around the outer periphery of the container. is there.
That is, the plastic material 10 of the present invention can be packaged with the plastic material 10 in which the entire container is formed into a film shape, such as a shrink film of a resin container or a label of a label can. Although only the part to be mounted can be used as a label for packaging with a plastic material, the plastic container itself can also be constituted by the plastic material 10 of the present invention having a predetermined thickness and strength.

[Resin layer]
The resin layer 11 is a layer that becomes a base material of the plastic material 10 and is formed of a PET resin or the like into a thin film.
Specifically, the resin layer 11 is formed of a thermoplastic plastic such as polyester, polyethylene, polypropylene, or polyamide.
For example, the resin layer 11 can be formed by forming a thin film of a thermoplastic polyester resin. The thermoplastic polyester resin can be, for example, a copolymer or blend having polyethylene terephthalate or polybutylene terephthalate as a main component and having a melting point of about 200 to 260 ° C. The thickness of the polyester resin film is Usually about 5 to 40 μm.
Considering the thickness, strength, durability and the like of the plastic material 10, the thickness of the resin layer 11 is preferably about 5 μm to 100 μm.

Here, the thin film of the thermoplastic polyester resin is preferably an amorphous and non-stretched film which is formed by an extrusion laminating method, an unstretched cast film or laminating method, etc., and rapidly cooled after thermal bonding. The non-stretched, amorphous thermoplastic polyester resin film is excellent in stretchability and adhesion, and can be peeled off or stretched by thinning the metal layer 11 serving as a base material. It is possible to follow without causing damage such as cracks.
The resin layer 11 may be a single layer (one layer) or may be a multilayer such as two layers or three layers. In the case of multiple layers, the stretched film can be formed by bonding through thermal bonding or an adhesive layer.

Thus, by providing the resin layer 11 as a base material, the plastic material 10 can be formed thin and long into a thin film film that can be wound into a roll, and a container of any shape and size can be packaged. It is suitable as the plastic material 10 to be used.
The resin layer 11 can be omitted as appropriate. As will be described later, the plastic material 10 according to the present embodiment includes a distance layer 12 that separates the IC tag 20 from the container 30. The distance layer 12 is used as a base material, and the electromagnetic wave shielding layer 13 is directly formed on the distance layer 12. If the layers can be formed, the resin layer 11 can be omitted.
In this sense, the resin layer 11 can be regarded as a layer constituting a part of the distance layer 12, and the IC tag 20 is sufficiently separated from the container 30 by the thickness of the resin layer 11 together with the distance layer 12 made of a nonwoven fabric or the like. Thus, good communication characteristics can be obtained. That is, by providing the resin layer 11 together with the distance layer 12, the IC tag 20 is sufficiently separated from the container 30 by the thickness of “distance layer + resin layer”.

[Distance layer]
The distance layer 12 is a layer that is laminated on the resin layer 11 and separates the IC tag 20 from the container 30. In this embodiment, the IC tag 20 is mounted on the surface of the distance layer 12. ing.
The distance layer 12 can be formed of a nonwoven fabric or a foamed resin.
In order to reduce the influence of the contents of the resin container on the IC tag 20 and the influence of the metal container, ideally, it is desirable that the effective relative dielectric constant of the mounting portion of the tag is 1.0 (air). Then, it means that the IC tag is levitated in the air, and it is difficult to take such a configuration with the plastic material 10 alone.
Therefore, in this embodiment, by forming the distance layer 12 made of a nonwoven fabric or foamed resin, an effective relative dielectric constant close to that obtained when the IC tag is floated in the air is obtained.

If the nonwoven fabric is a nonwoven fabric made of, for example, a PET resin, a large number of cavities are formed inside. Therefore, the effective relative dielectric constant can be made smaller than that of the PET resin itself, and can be set to a value closer to the ideal value of 1.0. It becomes possible. Similarly, in the case of foamed resin, the inside is filled with gas such as air, nitrogen, carbon dioxide, etc., and the effective relative dielectric constant can be made a value close to 1.0.
Further, the feature of the nonwoven fabric and the foamed resin lies in the degree of design freedom, and a distance layer having a desired thickness and size can be formed easily and at low cost.

In this embodiment, a non-woven fabric or a foamed resin is used as the distance layer 12 that separates the IC tag 20 from the container 30, thereby causing a resonance frequency shift caused by the IC tag coming into contact with or close to the metal and heat loss due to the metal. In addition, deterioration of communication characteristics due to the influence of contents is prevented.
The nonwoven fabric can be selected from any material such as synthetic fiber or natural fiber, and the thickness, size, shape, etc. can be arbitrarily set according to the IC tag 20 to be mounted. .
The foamed resin suitable for the distance layer 12 can be formed by various methods. For example, a method using a foaming agent, a method of injecting air or nitrogen gas when mixing (kneading) a polymer, There are methods using chemical reactions.

The nonwoven fabric and the foamed resin constituting the distance layer 12 are bonded and laminated on the surface of the resin layer 11 serving as a base material by an adhesive, heat fusion, or the like.
The thickness of the distance layer 12 is preferably about 15 μm considering the thickness of the plastic material 10 and the like.
In addition to the non-woven fabric and the foamed resin, from the same viewpoint, for example, a distance layer having a cavity can be formed by applying a resin coating in a lattice shape, and this can be adopted as the distance layer 12. it can.
Further, as described above, the distance layer 12 made of nonwoven fabric or the like has the resin layer 11 as the distance layer 12 when the resin layer 11 functions as the distance layer 12 and sufficiently secures the communication gain of the IC tag. It is also possible to omit the distance layer 12 made of a nonwoven fabric or the like.

[Electromagnetic wave shielding layer]
The electromagnetic wave shielding layer 13 is a layer that is laminated on the surface of the resin layer 11 opposite to the distance layer 12 and shields the magnetic field (electromagnetic wave) of the IC tag 20 from the container 30 side.
The electromagnetic wave shielding layer 13 is made of a metal oxide material, and can be specifically composed of Mn—Zn, Ni—Zn, or Mg—Zn soft ferrite.
Moreover, it can be comprised with the magnetic material containing the flake or particle | grains of Al, C, Cu, Ag, Nb, Co, Cr, Pd, Ni, Mn, W, or Si.
As described above, in the present embodiment, an arbitrary metal oxide material can be selected and used as the electromagnetic wave shielding layer 13 that shields the magnetic field of the IC tag 20 from passing to the container 30 side. The electromagnetic wave shielding layer 13 having suitable permeability corresponding to the output and frequency characteristics of 20 can be formed.

In this embodiment, the electromagnetic wave shielding layer 13 composed of the above components is made of an electromagnetic wave shielding paint such as a conductive paint that can be liquefied and applied to the surface of the resin layer 11. That is, the electromagnetic wave shielding layer 13 is laminated on the surface of the resin layer 11 by applying a paint. Thereby, the manufacturing process of the electromagnetic wave shielding layer 13 can be performed very easily and rapidly.
In addition, since the electromagnetic wave shielding layer 13 can be formed by simply applying the electromagnetic wave shielding paint in this way, by applying the paint only to the mounting portion to which the IC tag 20 is attached, the size or mounting part of the IC tag 20 to be used is applied. In addition, the electromagnetic wave shielding layer 13 having an arbitrary size and shape can be easily and quickly applied and formed on an arbitrary portion of the plastic material 10.
When the IC tag 20 is randomly attached to an arbitrary part of the plastic material 10, the electromagnetic wave shielding layer 13 is formed by applying an electromagnetic wave shielding paint to the entire surface of the resin layer 11.

[Manufacture of electromagnetic shielding paint]
As a method for producing the electromagnetic wave shielding paint, magnetic powder such as Fe-Si can be mixed with a resin solvent such as varnish, primer, epoxy and the like. The magnetic powder is preferably flat, but may be spherical. Further, the magnetic material may be a mixture of a flat shape and a spherical shape.
The major axis of the flat shape of the magnetic material used is preferably, for example, in the range of 15 μm to 40 μm, and when the magnetic material is spherical, the particle diameter is preferably in the range of 15 μm to 30 μm.
As the solvent, an oily or water-based paint can be used, and there is no particular limitation such as a heat drying type or a UV curing type.
The mixing ratio of the magnetic substance and the solvent is preferably in the range of 40% to 75% in consideration of the electromagnetic wave shielding effect and the viscosity applicable to the metal.

[Method of applying electromagnetic shielding paint]
In order to apply the electromagnetic wave shielding paint to the resin layer 11, a bar coater, a roll coat, a brush or the like can be used. In addition, the paint may be applied directly to the resin layer 11. However, in consideration of adhesion, it is preferable to apply an electromagnetic wave shielding paint on the resin layer 11 after applying an adhesive such as a primer on the resin layer 11. .
Alternatively, electromagnetic wave shielding paint and varnish, primer or resin may be alternately applied and laminated on the resin layer 11. In this case, the uppermost layer is preferably not an electromagnetic wave shielding paint.
Although the coating thickness of the coating material depends on the concentration of the magnetic powder in the solvent and the size of the powder, it is preferably about 50 μm to 300 μm when the thickness of the plastic material 10 is taken into consideration. Further, the thicker the coating thickness, the higher the electromagnetic wave shielding effect.

[IC tag]
The IC tag 20 includes an IC chip and an antenna. The IC chip and the antenna are mounted on a base material made of resin, glass, or the like and are integrally sealed to form one IC tag.
In this embodiment, the plastic material 10 is used as the base material of the IC tag 20, and the IC tag 20 is mounted on the surface of the distance layer 12 of the plastic material 10 as shown in FIG. .
As described above, the distance layer 12 made of a nonwoven fabric or the like can be omitted. In this case, the IC tag 20 is mounted on the surface of the resin layer 11 that functions as a distance layer.

The IC tag 20 can be mounted on the plastic material 10 in advance in the manufacturing process of the container packaged with the plastic material 10, and the plastic material 10 manufactured and shipped, or the container 30 packaged with the plastic material 10. On the other hand, it can be attached later.
In the example shown in FIG. 1, the IC tag 20 is mounted in advance in the manufacturing process of the plastic material 10, and the IC tag 20 mounted on the surface of the distance layer 12 is further covered with the cover film layer 14. It has become.

Here, the IC chip provided in the IC tag 20 is composed of a semiconductor chip such as a memory, and can record, for example, several hundred bytes of data.
Then, reading and writing (data calling / registration / deletion / update etc.) is performed by wireless communication with the reader / writer via the antenna, and the data recorded on the IC chip is recognized.
As data to be recorded on the IC chip, for example, arbitrary information and various data such as product name, weight, content, manufacturer / seller name, manufacturing location, date of manufacture, expiration date, etc. can be recorded. Moreover, rewriting is also possible. Data can be recorded and rewritten by a dedicated reader / writer.

The frequency band used in the IC tag 20 includes several types of frequency bands such as a band of 135 kHz or less, a 13.56 MHz band, an 860 M to 960 MHz band belonging to a so-called UHF band, and a 2.45 GHz band.
The communication distance that enables wireless communication varies depending on the frequency band used, and the optimum antenna length varies depending on the frequency band.

FIG. 2 is an explanatory view schematically showing the state of communication characteristics when the IC tag 20 is mounted on the container 30 via the plastic material 10 shown in FIG. 1, and (a) is an IC mounted on the container 30. (B) shows the state of magnetic flux generated by the IC tag shown in (a).
As shown in the figure, when the IC tag 20 performs wireless communication, a magnetic wave / electromagnetic wave is generated in the antenna coil section. Conventionally, this magnetic wave / electromagnetic wave is affected by the contents of the container, and the inductance of the antenna coil section changes, the resonance frequency of the antenna shifts, and the communication distance varies depending on the presence or absence of the contents. It was.
Further, heat loss or the like in which the magnetic wave / electromagnetic wave of the IC tag 20 is absorbed by the metal container occurs (see FIG. 12), and the communication characteristics of the tag are impaired.

The plastic material 10 of the present embodiment includes the resin layer 11 made of PET resin or the like and the distance layer 12 (or distance layer 12a) made of nonwoven fabric or the like, thereby sufficiently separating the IC tag 20 from the metal layer 11. Therefore, it is possible to prevent changes in the inductance on the tag side due to the influence of the contents of the container 30, thereby preventing a shift in the resonance frequency of the antenna of the IC tag 20 and a change in communication distance due to the presence or absence of the contents. be able to.
Further, the electromagnetic wave shielding layer 13 made of an electromagnetic wave shielding paint or the like can prevent an eddy current or the like from being generated in the metal container 30.

[Manufacturing method of package]
Next, the manufacturing method of the plastic material 10 of this embodiment as described above will be described.
First, the plastic material 10 is formed by forming a resin layer 11 serving as a base material into a thin film of a plastic resin such as PET resin, and applying the electromagnetic wave shielding paint made of the above-described metal oxide material to the surface of the resin layer 11. 13 is formed.
At this time, the electromagnetic wave shielding paint applied to the resin layer 11 can be applied to the entire surface of the resin layer 11, or can be applied only to the portion where the IC tag 20 is mounted.

Then, the distance layer 12 which consists of a nonwoven fabric is laminated | stacked on the surface on the opposite side to the surface which apply | coated the electromagnetic wave shielding coating material of the resin layer 11. FIG. The nonwoven fabric is fixed to the surface of the electromagnetic wave shielding layer 13 so as not to be peeled off by means such as an adhesive or heat fusion.
The distance layer 12 can also be formed by applying a resin paint on the surface of the resin layer 11. That is, the distance layer 12 having a cavity inside can be formed by applying a resin coating in a lattice shape to any part of the surface of the resin layer 11.
The plastic material 10 of this embodiment is completed by the above.

In addition, the above process order is an example and the plastic material 10 can also be manufactured in processes other than this. For example, the distance layer 12 can be laminated on the resin layer 11 before the electromagnetic wave shielding layer 13.
Moreover, the lamination order of the resin layer 11, the distance layer 12, and the electromagnetic wave shielding layer 13 can be arbitrarily changed. In the example shown in FIG. 2, the electromagnetic wave shielding layer 13 → the resin layer 11 → the distance layer 12 are laminated in this order from the container side, but this is made the distance layer 12 → the resin layer 11 → the electromagnetic wave shielding layer 13 or the resin layer 11 → the electromagnetic wave. Other stacking orders may be employed, such as shielding layer 13 → distance layer 12.

[container]
Next, an example of the container packaged by the plastic material 10 of the present embodiment as described above is shown in FIGS.
FIG. 3 is a perspective view showing an example of a PET bottle container 30A packaged with the plastic material 10 according to the present embodiment. As shown in the figure, the plastic material 10 can be wrapped around the trunk of a PET bottle container 30A to wrap the container. The plastic material 10 including the IC tag 20 is cut into an appropriate size, wound around the trunk of the PET bottle container 30A, and both ends of the plastic material 10 are fixed and attached by heat welding, an adhesive, or the like.

In the example shown in FIG. 3, the plastic material 10 wraps only a part of the body of the PET bottle container 30 </ b> A, but it is of course possible to wrap the entire body of the container with the plastic material 10. .
It is also possible to form the PET bottle container 30 </ b> A itself from the plastic material 10.

FIG. 4 is a view showing an example in which the plastic material 10 is wound around the barrels of the PET bottle containers 30B and C, as in FIG. 3. As shown in FIG. 4, the PET bottle container 30 is a rectangular bottle 30B ( 4 (a)) or a round bottle 30C (FIG. 4 (b)).
As shown in FIG. 4, it is preferable that the plastic material 10 is packaged in a container 30 so that the IC tag 20 is positioned in a recess formed by a bead on the body of the PET container. In this case, as shown in FIG. 4C, a space exists between the main body of the container 30 and the plastic material 10, and this constitutes the second distance layer 31, and the IC tag 20 is Further separation from the container 30 is achieved.

Accordingly, the IC tag 20 can be sufficiently separated from the container side by the second distance layer 31 together with the distance layer 12 provided in the plastic material 10, and due to the change in dielectric constant depending on the presence or absence of the contents of the PET container 30. Changes in communication characteristics can be prevented (see FIG. 10).
In addition, the second distance layer can be configured using the concave portion of the PET container. For example, the plastic material 10 is wound around the outer periphery of the body of the square bottle in a stretched state so that the surface of the container 30 A gap may be formed between the plastic materials 10 to form a second distance layer.

FIG. 5 is a diagram illustrating an example in which the plastic material 10 is wound around the body of a can container 30D such as an aluminum can or a steel can.
In the example shown in FIG. 5, the plastic material 10 wraps only a part of the body of the can container 30D. For example, the entire can container 30D is wrapped with the plastic material 10 like a package of a label can. You can also.
In addition, in a can container such as an aluminum can or a steel can, a resin-coated can container in which a metal material serving as a base material is coated with a plastic resin such as a PET resin may be used. Of course, it can also be used for packaging such a resin-coated can container. In the resin-coated can container, the outer surface and inner surface of the container are coated with PET resin or the like, and this coated resin layer separates the IC tag 20 from the container side in the same manner as the resin layer 11 and the distance layer 12 of the plastic material 10. Since it fulfills its function, it is preferable as a can container that ensures the communication characteristics of the IC tag 20 by packaging with a plastic material 10 (see FIG. 8).

Also in the case of a can container, a second distance layer can be provided as in the case of the PET bottle container shown in FIG.
As the can container, there is an embossed can in which the surface of the can is subjected to arbitrary unevenness processing, and as shown in FIG. 5, the plastic material 10 is placed in the can container 30D so that the IC tag 20 is positioned in the uneven portion of the embossed can. As shown in FIG. 5B, the second distance layer 32 can be interposed between the main body of the can container 30D and the plastic material 10, and the IC tag 20 is further removed from the can container 30D. Can be separated.
As a result, the communication characteristics of the IC tag 20 can be maintained better (see FIG. 11).

FIG. 6 is an example when the pouch container 30E is packaged with the plastic material 10 of the present embodiment.
In the example shown in FIG. 6, the plastic material 10 is wound around a part of the trunk of the pouch container 30E. For example, the pouch container 30E is formed of the plastic material 10 so that the pouch container 30E is formed. May be packaged with the plastic material 10.
As described above, the container packaged using the plastic material 10 according to the present embodiment can be any metal container or resin container, and the plastic material 10 includes at least a portion where the IC tag 20 is mounted. The entire container may be wrapped with the plastic material 10, but only a part of the container (IC tag mounting portion) is formed with the plastic material 10 according to the present embodiment, and other parts are For example, an electromagnetic shielding paint or a non-woven fabric can be omitted.

[Communication characteristics]
Next, communication characteristics of the IC tag mounted on the container 30 via the plastic material 10 according to the present embodiment will be described with reference to FIGS.
FIG. 7 shows the resonance frequency of the IC tag when the IC tag 20 having the resonance frequency of 13.56 MHz is mounted on the metal container 30 via the plastic material 10 of the present embodiment including the distance layer 12 and the electromagnetic wave shielding layer 13. It is a graph which shows the intensity | strength relationship of a radio signal. This figure shows the result of using an existing general-purpose tag that is designed without considering the influence of the surrounding environment.
First, the solid line shows the case where the IC tag is attached to the can through the plastic material 10 in which the thickness of the air layer 12 is set to about 0.5 mm, and the IC tag outputs 30 dB or more in the resonance frequency 13.56 MHz band. It is driven by.
An alternate long and two short dashes line is a case where an existing general-purpose tag is directly attached to an existing aluminum can without using the plastic material 10, and the output is greatly reduced to about 15 dB, and the resonance frequency of the tag is also shifted.

The alternate long and short dash line is a case where an existing general-purpose tag is attached to a metal can through a plastic material 10 with the thickness of the distance layer 12 set to 0.1 mm, and the output is secured about 25 dB, but the resonance of the tag The frequency shifts to the 13.4 MHz band.
The broken line is the case where the tag is attached to the metal can through the existing general-purpose electromagnetic shielding material provided with a magnetic body (high permeability body) such as a ferrite sheet, and the output is secured about 25 dB, The resonance frequency of the tag is greatly shifted to the 13.3 MHz band.
As mentioned above, even if it is an existing general purpose tag by using the plastic material 10 of this embodiment provided with the distance layer 12 and the electromagnetic wave shielding layer 13, the thickness of the distance layer 12 is set to an optimum value. It can be seen that it can be used for a metal container or the like while ensuring good communication characteristics.

FIG. 8 shows the relationship between the thickness of the electromagnetic wave shielding layer 13 and the communication distance of the IC tag when the IC tag 20 having a resonance frequency of 13.56 MHz is mounted on the metal container 30 via the plastic material 10 of the present embodiment. It is a graph to show.
As shown in the figure, it can be seen that the IC tag 20 mounted on the metal container via the plastic material 10 has a longer communication distance in proportion to the thickness of the electromagnetic wave shielding layer 13 of the plastic material 10.
In addition, it can be seen that the resin-coated can has a longer communication distance than a normal aluminum can or steel can.

FIG. 9 shows changes in the presence or absence of container contents and the communication distance of the IC tag when the IC tag 20 having a resonance frequency of 13.56 MHz is mounted on the container 30 made of PET resin via the plastic material 10 of the present embodiment. It is a graph which shows a relationship.
As shown in the figure, the IC tag 20 mounted on the PET resin container through the plastic material 10 provided with the nonwoven fabric (distance layer 12) has the contents (water) in the container and the case without the contents, There is almost no change in the communication distance. This is because even if the film thickness of the electromagnetic wave shielding layer 13 of the plastic material 10 is increased, the communication distance is hardly affected and good communication characteristics are obtained.

On the other hand, when it is directly attached to the PET resin container without the plastic material 10 provided with the nonwoven fabric (distance layer 12), the communication distance is shortened particularly when there is contents, and the presence or absence of contents. The disparity in communication distance due to is increasing. Moreover, when the film thickness of the electromagnetic wave shielding layer 13 of the plastic material 10 that does not include the distance layer 12 is increased, the communication characteristics are also deteriorated in proportion thereto.
From the graphs of FIGS. 8 and 9 described above, the plastic material 10 includes the distance layer 12 that separates the IC tag 20 from the container side, and the electromagnetic wave shielding layer 13 having an appropriate film pressure that shields the electromagnetic waves of the IC tag 20. It can be seen that the communication characteristics of the IC tag 20 can be satisfactorily maintained in both the metal container and the resin container.

10 shows a case where the IC tag 20 having the resonance frequency of 13.56 MHz shown in FIG. 9 is mounted on the PET resin container 30 through the plastic material 10, and further the concave portion of the bead portion of the PET resin container 30. It is a graph which shows the fluctuation | variation of the communication distance of an IC tag at the time of interposing the 2nd distance layer 31 (refer FIG. 4) using FIG.
As shown in the figure, by forming the second distance layer 31 using the concave portion of the bead portion of the PET bottle, the communication characteristics of the IC tag 20 are further improved and the communication distance is increased. Recognize.

The IC tag 20 attached via the plastic material 10 including the distance layer 12 hardly changes the communication distance regardless of the presence or absence of the contents of the PET bottle, and the film thickness of the electromagnetic wave shielding layer 13 is hardly changed. Not affected.
On the other hand, when it is directly attached to the PET resin container without the plastic material 10 provided with the nonwoven fabric (distance layer 12), the communication distance is shortened particularly when there is contents, and the presence or absence of contents. The disparity in communication distance due to is increasing. Moreover, when the film thickness of the electromagnetic wave shielding layer 13 of the plastic material 10 that does not include the distance layer 12 is increased, the communication characteristics are also deteriorated in proportion thereto.

11, when the IC tag 20 having the resonance frequency of 13.56 MHz shown in FIG. 8 is mounted on the metal container 30 via the plastic material 10, an emboss can is further adopted as the metal container 30. It is a graph which shows the relationship between the thickness of the electromagnetic wave shielding layer 13, and the communication distance of an IC tag at the time of providing the 2nd distance layer 32 (refer FIG. 5).
As shown in the figure, the second distance layer 32 is formed by using the uneven portion of the embossed can, whereby the communication characteristics of the IC tag 20 are further improved and the communication distance is increased. And the communication characteristic is improving, so that the depth of the recessed part of an emboss is large, ie, the distance of the 2nd distance layer 32 is large.
From the graphs of FIGS. 10 and 11 above, it is possible to further improve the communication characteristics of the IC tag 20 by providing a second distance layer between the plastic material 10 and the container for both the resin container and the metal container. It turns out that it becomes.

As described above, according to the plastic material corresponding to the IC tag according to the present embodiment, the IC tag 20 is separated from the container 30 as the plastic material 10 for packaging the container 30 such as a resin container or a metal container to be packaged. By forming the distance layer 12 and the electromagnetic wave shielding layer 13 that shields the electromagnetic waves of the IC tag 20 from the container 30 side, the communication characteristics deteriorate due to the influence of the contents of the resin container, and the presence or absence of the accompanying contents As a result, it is possible to prevent communication gain heat loss and resonance frequency shift due to the influence of the metal container.
As a result, any existing IC tag can be attached to a metal container or a resin container via the plastic material 10 of the present embodiment, so that accurate wireless communication within the proper proper communication range of the tag can be achieved. You can do it.

That is, by providing the distance layer 12 that separates the IC tag 20 from the container 30, the IC tag 20 can be separated from the container 30 by a predetermined distance, so that the influence of the dielectric constant of the contents of the resin container is sufficiently suppressed. Therefore, fluctuations in the communication characteristics of the IC tag 20 due to the presence or absence of the contents of the resin container 30 can be effectively prevented.
Further, by providing the electromagnetic wave shielding layer 13 made of electromagnetic wave shielding paint or the like, when the tag is attached to the metal container, the electromagnetic wave shielding layer 13 suppresses the generation of eddy currents generated on the metal container side by the electromagnetic wave of the IC tag 20. In addition, by providing the distance layer 12 made of a nonwoven fabric or the like for separating the IC tag 20 from the container, the IC tag 20 can be sufficiently separated from the metal container 30 so that the inductance of the IC tag 20 due to the influence of metal The change of the resonance frequency of the antenna of the IC tag 20 can be effectively prevented.

  Thus, no matter what IC tag 20 is attached to any container via the plastic material 10 according to this embodiment, and whether or not the contents are in the container 30, the IC tag 20 The communication gain can always be kept in a good state, accurate wireless communication is possible, and even an existing general-purpose tag can be used as it is, and the IC tag 20 excellent in versatility and reliability is realized. can do.

[Example]
An embodiment of the plastic material for IC tags according to the present invention will be described below.
[Example 1]
Toyo Aluminum Co., Ltd. silicon steel paste RFS54CM (90.5Fe-5.5Si-4Cr, shape: flakes, flake major axis: 20 μm to 30 μm) was mixed in an oil paint to make an electromagnetic shielding coating. This paint was applied to the surface of a polyethylene terephthalate (PET) resin film having a thickness of 50 μm. On the back side, a PET nonwoven fabric having a thickness of 100 μm was laminated by thermocompression bonding. The coating thickness was changed between 50 μm and 300 μm.
In addition, an IC tag (manufactured by Texas Instruments, operating frequency: 13.56 MHz) was adhered onto a PET non-woven fabric (thickness: about 100 μm).
The IC tag label was attached so that the paint surface was in contact with a polyethylene terephthalate (PET) resin container having a thickness of 300 μm to 400 μm to produce a packaging container with an IC tag.
As a result of conducting a communication test between the reader and the writer in a state where water is put in the packaging container with an IC tag, as shown in FIG. 9, the communication distance is larger than that in the case of the packaging container with an IC tag without an electromagnetic shielding paint and non-woven fabric. It became long.

[Example 2]
The electromagnetic wave shielding paint used in Example 1 was applied to the surface of a PET resin film having a thickness of 50 μm with a paint thickness of 75, 150, 250 μm, and a PET nonwoven fabric having a thickness of 100 μm was laminated on the back side by thermocompression bonding. In addition, an IC tag (manufactured by Texas Instruments, operating frequency: 13.56 MHz) was bonded onto the non-woven fabric made of PET.
This IC tag label is bonded so that the IC chip and the antenna part come to the concave part (second distance layer) with a coating surface of a PET resin container having a thickness of 300 μm to 400 μm and a depth of 1 mm. It was created.
As a result of conducting a communication test between the reader / writer in the state where water is put in the packaging container with an IC tag, as shown in FIG. 10, the communication distance is larger than that in the case of the packaging container with an IC tag without electromagnetic shielding paint and non-woven fabric. Became longer.

[Example 3]
The same IC tag label as in Example 1 can be made of a resin-coated metal plate (thickness: 0.3 mm) coated with tin-free steel (TFS) with a PET resin with a thickness of 20 μm on the front side and a PET resin with a thickness of 30 μm on the back side. Further, a packaging container with an IC tag was prepared by pasting together a deep-drawn molded container having an inner volume of 350 ml so that the coated surface was touched.
As a result of conducting a communication test between the reader and the writer using the packaging container with the IC tag, communication was possible as shown in FIG.

[Comparative Example 1]
The electromagnetic wave shielding coating material used in Example 1 was applied to the surface of a PET resin film having a thickness of 50 μm while changing the thickness between 50 μm and 300 μm. Created tag labels.
This IC tag label was bonded so that the coating surface was in contact with a PET resin container having a thickness of 300 μm to 400 μm to produce a packaging container with an IC tag.
When a communication test between the reader and the writer was performed in a state where water was put in the container with the IC tag, as shown in FIG. The communication distance was shorter than the case.

[Comparative Example 2]
An IC tag label without a non-woven fabric is prepared by making the thickness of the electromagnetic wave shielding paint the same as in Example 2, and an IC chip and an antenna are formed in a recessed portion (second distance layer) having a depth of 1 mm of a PET resin container having a thickness of 300 μm to 400 μm. The coating surface side and the resin container were bonded together so that the part came, and the packaging container with an IC tag was created.
As a result of conducting a communication test between the reader / writer in a state where water is put in the IC tag-equipped packaging container, as shown in FIG. 10, the IC tag packaging container having an electromagnetic wave shielding paint and a non-woven fabric at any paint thickness. Compared to the case, the communication distance was short.

[Comparative Example 3]
An IC tag label was prepared by sandwiching the IC tag used in Example 1 with a PET film (film thickness: 45 μm), and this was made of 0.295 mm thick TFS not coated with resin. A container with an IC tag was prepared by sticking to a deep-drawn container.
As a result of conducting a communication test between the reader / writer using this container with an IC tag, the communication distance was greatly reduced (see FIG. 8).

As described above, the IC tag-compatible plastic material of the present invention, the IC tag including the plastic material, and the IC tag-compatible container have been described with reference to the preferred embodiments. Needless to say, the tag-compatible container is not limited to the above-described embodiment, and various modifications can be made within the scope of the present invention.
For example, in the above-described embodiment, the PET bottle, can container, and pouch container used as containers for beverages and foods have been described as examples of containers packaged and formed with the plastic material of the present invention. There are no particular limitations on the use of the container, the contents to be stored, the components of the container, and the like. That is, as long as the container is made of resin or metal, any size, shape, material, etc. may be used, and any contents stored in the container may be used. .

  The plastic material corresponding to the IC tag of the present invention described above is suitable as, for example, a PET bottle container, a metal can (label can) such as an aluminum can and a steel can, an arbitrary resin container such as a pouch container, and a package for a metal container. Available.

BRIEF DESCRIPTION OF THE DRAWINGS It is a principal part perspective view which shows typically the IC tag corresponding plastic material and IC tag which concern on one Embodiment of this invention, (a) is the state before mounting an IC tag, (b) is mounting an IC tag. Shows the state. It is explanatory drawing which shows typically the state of the communication characteristic at the time of mounting an IC tag in a container via the plastic material shown in FIG. 1, (a) is the state of the IC tag mounted in the container via a plastic material (B) shows the state of magnetic flux generated by the IC tag shown in (a). It is a principal part perspective view which shows typically the state which attaches the plastic material corresponding to IC tag which concerns on one Embodiment of this invention to a PET bottle container, (a) is the state before attaching a plastic material to a container, (b) Shows a state in which a plastic material is attached to the container. It is a figure which shows the state which has attached the plastic material corresponding to IC tag which concerns on one Embodiment of this invention to PET bottle container, (a) is a front view of the state which attached the plastic material to the square PET bottle container, (b) is a front view of a state in which a plastic material is attached to a round PET bottle container, and (c) is a sectional view taken along line AA shown in (a). It is a figure which shows the state which has attached the plastic material corresponding to IC tag which concerns on one Embodiment of this invention to the embossed can container, (a) is a perspective view of the state which attached the plastic material to the can container, (b) is It is a BB line expanded sectional view shown in (a). It is a front view which shows the state which attached the plastic material for IC tags which concerns on one Embodiment of this invention to the pouch container. It is a graph which shows the relationship between the resonant frequency of the IC tag mounted in the plastic material corresponding to IC tag which concerns on one Embodiment of this invention, and the intensity | strength of a radio signal. It is a graph which shows the relationship between the thickness of an electromagnetic wave shielding layer, and the communication distance of an IC tag at the time of attaching the plastic material for IC tag which concerns on one Embodiment of this invention to the metal container. It is a graph which shows the relationship between the presence or absence of the contents of a container, and the communication distance of an IC tag at the time of attaching the plastic material corresponding to IC tag which concerns on one Embodiment of this invention to the resin container. It is a graph which shows the relationship between the presence or absence of the contents of a container, and the communication distance of an IC tag at the time of attaching the plastic material corresponding to IC tag which concerns on one Embodiment of this invention to a square-shaped PET bottle container. It is a graph which shows the relationship between the thickness of an electromagnetic wave shielding layer, and the communication distance of an IC tag at the time of attaching the plastic material corresponding to IC tag which concerns on one Embodiment of this invention to an embossed can container. It is explanatory drawing which shows typically the state of the communication characteristic at the time of mounting an IC tag in the conventional general metal container, (a) is the state of the IC tag mounted in the metal container, (b) is ( The state of the magnetic flux which the IC tag shown to a) emits is shown. It is explanatory drawing which shows typically the state of the communication characteristic at the time of mounting the conventional metal exclusive IC tag in a metal container, (a) is the state of the metal exclusive IC tag mounted in the metal container, (b) is The state of the magnetic flux which the metal exclusive use IC tag shown to (a) emits is shown.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Plastic material 11 Resin layer 12 Distance layer 13 Electromagnetic wave shielding layer 14 Cover film layer 20 IC tag 30 Container

Claims (11)

A plastic material that is a base material constituting a package to which an IC tag that performs wireless communication with a reader / writer is attached,
A distance layer for separating the IC tag from the package body;
An electromagnetic wave shielding layer for shielding the electromagnetic wave of the IC tag from the packaged body side,
An IC tag-compatible plastic material, wherein the electromagnetic wave shielding layer is formed of a magnetic powder made of Fe-Si-Cr. A plastic material that is a base material constituting a package to which an IC tag that performs wireless communication with a reader / writer is attached,
A distance layer for separating the IC tag from the package body;
An electromagnetic wave shielding layer for shielding the electromagnetic wave of the IC tag from the packaged body side,
The plastic material for IC tags, wherein the distance layer is made of nonwoven fabric or foamed resin.   The plastic material for IC tags according to claim 1 or 2, wherein the electromagnetic wave shielding layer is laminated on the surface of the distance layer by coating.   The IC tag-compatible plastic material according to claim 1, wherein the electromagnetic wave shielding layer is made of a metal oxide material.   The IC tag-compatible plastic material according to claim 4, wherein the metal oxide material is made of Mn-Zn, Ni-Zn, or Mg-Zn-based soft ferrite.   5. The plastic material for IC tags according to claim 4, wherein the metal oxide material is made of a magnetic material containing flakes or particles of Al, C, Cu, Ag, Nb, Co, Cr, Pd, Ni, Mn, W, or Si.   The plastic material for an IC tag according to any one of claims 1 to 6, wherein the distance layer is made of a nonwoven fabric or a foamed resin.   The plastic material for an IC tag according to any one of claims 1 to 7, wherein the distance layer is made of a thermoplastic resin layer. An IC chip, an antenna, and a plastic material as a base material on which the IC chip and the antenna are mounted. The plastic material constitutes a package body of the package body, and is attached to the package body to be a reader / writer An IC tag that performs wireless communication with a writer,
9. The IC tag, wherein the plastic material is made of a plastic material corresponding to the IC tag according to claim 1. A container body capable of storing contents therein;
A plastic material for packaging all or part of the container body,
The said plastic material consists of a plastic material corresponding to an IC tag in any one of Claims 1 thru | or 8, The IC tag corresponding container characterized by the above-mentioned. The IC tag corresponding | compatible container of Claim 10 provided with the 2nd distance layer which spaces apart an IC tag from a to-be-packaged body between the said container main body and a package.

Images