JP4931880B2 - Cold storage panel and freezer / refrigerator equipped with the same - Google Patents

Description

  The present invention relates to a cold storage panel and a freezing / refrigeration apparatus provided with the same.

In a general refrigerator, a compartment for cooling food from a high temperature to a low temperature and a compartment for maintaining and maintaining the cooled state are not separated. For this reason, the situation which puts the food (heat load body) which is uncooled at high temperature newly near the food already cooled occurs.
In this case, the heat of the uncooled food material (heat load body) moves to the internal air or the member in contact with the uncooled food material. For this reason, air is heated rapidly, and heat transfer through the member occurs. As a result, the temperature of the cooled foodstuff placed in the vicinity rises, and there is a concern about the quality deterioration of the foodstuff.

  In the prior art, for example, “a tray body is composed of a synthetic resin tray-like container and a synthetic resin thin plate that is thermally welded to the upper surface of the container and closes the opening of the upper surface. A rapid tray for a freezer characterized in that a regenerator material is enclosed in the main body and a metal tray is detachably attached in close contact with the thin plate shape ”(see, for example, Patent Document 1). .

  Further, for example, “in the refrigerator storage chamber, formed of a vacuum heat insulating material, a cold storage agent provided adjacent to the vacuum heat insulating material, and a material having good thermal conductivity provided adjacent to the cold storage agent. "A refrigerator provided with a cooling member made of a plate" has been proposed (see, for example, Patent Document 2).

  Further, for example, “a heat source that generates heat and a vacuum heat insulating material adjacent to the heat source, wherein the surface layer of the outer jacket material in contact with the heat source in the vacuum heat insulating material is a metal foil. Has been proposed (for example, see Patent Document 3).

Japanese Utility Model Publication No. 59-49888 (Scope of Claim for Utility Model Registration) JP 2005-226984 A (Claim 1) JP 2006-90494 A (Claim 1)

  However, in the above-described conventional configuration, although the heat of the heat source placed on the panel (tray) can be suppressed from moving to the back surface of the panel, it has been cooled on a metal tray having high thermal conductivity, for example, When an object to be cooled such as food and a heat load such as uncooled food are placed together, from the heat load to the cooled object to be cooled through the highly heat-conductive tray. Heat transfer occurs. Thereby, there exists a subject that the temperature of the cooled to-be-cooled object will rise.

  Further, when one side of the panel (plate) is a vacuum heat insulating material, the heat stored in the cold storage agent is cooled to the cooled object side. Thereby, there exists a subject that the temperature of the cooled to-be-cooled object will rise.

  In addition, if a low-temperature object as a heat load and an already-heated object to be warmed coexist in a device with a high space temperature such as a heat storage, the temperature of the object to be warmed will decrease. There is a problem of end.

  This invention was made in order to solve said subject, and it aims at obtaining the cool storage panel which can suppress the temperature change of a to-be-cooled object, etc., and a freezing / refrigeration apparatus provided with the same.

The cold storage panel according to the present invention is disposed on at least one of the inside and the inner wall of the device having a mechanism for controlling the space inside the device to a predetermined temperature, and a thermal load body having a temperature different from the space temperature inside the device is disposed. And a laminated structure in which at least three layers having different heat transfer speeds are laminated, and the laminated structure includes an outer surface layer on which the thermal load is disposed on one side, and a laminated structure on one side. A heat storage layer having a heat transfer layer on the opposite side, and a heat resistance in a direction in which the heat resistance in a direction perpendicular to the stacking direction in the surface outer layer is transmitted from the surface outer layer to the cool storage agent layer. The thermal resistance in the direction orthogonal to the stacking direction in the cool storage agent layer is larger than the thermal resistance in the stacking direction transmitted from the cool storage agent layer to the heat transfer layer .

  The present invention has a laminated structure in which at least three layers having different heat transfer speeds are laminated, and heat transfer in the laminated structure from the position where the thermal load is disposed is performed by laminating the laminated structure. Since the direction perpendicular to the stacking direction is slower than the direction, the temperature change of the object to be cooled can be suppressed.

Embodiment 1 FIG.
1 is a cross-sectional view schematically showing a cold storage panel according to Embodiment 1 of the present invention.
As shown in FIG. 1, the cold storage panel 101 according to the first embodiment includes a cold storage agent layer 1, a heat conductive layer 2, and an outer surface layer 3.
The cold storage panel 101 is disposed on at least one of the inside and the inner wall of a device having a mechanism for controlling the space inside the device to a predetermined temperature, such as a refrigerator or a heat storage. And the heat load body (foodstuff etc.) of the temperature different from internal space temperature is arrange | positioned in the space inside the said apparatus.
Hereinafter, in the first embodiment, the cold storage panel 101 is mounted on a refrigeration / refrigeration device that cools an object to be cooled such as a refrigerator, for example, an object to be cooled such as a cooled food, and an uncooled food, for example. An example will be described in which the thermal load body is placed on the cold storage panel 101 together.
In FIG. 1, uncooled food (hereinafter referred to as “heat source 102”) is added to a place where another food 103 such as cooled food is placed on the cold storage panel 101. Indicates the state.

  The cold storage panel 101 is formed so that food is placed on top thereof, so that the horizontal direction in FIG. 1 is longer than the vertical direction, and the vertical length is formed to be as thin as possible. Therefore, the cool storage agent layer 1 and the heat conductive layer 2 are formed longer in the horizontal direction than in the vertical direction of the cool storage panel.

The outer surface layer 3 contains the regenerator layer 1. The heat conductive layer 2 is disposed inside the cool storage agent layer 1. That is, the outer surface layer 3 and the cool storage agent layer 1 are adjacent to each other, and the heat conductive layer 2 and the cool storage agent layer 1 are adjacent to each other.
Thereby, from the upper surface side of the cool storage panel 101, the surface of the outer surface layer 3 (hereinafter also referred to as “A layer”), the surface of the cool storage agent layer 1 (hereinafter also referred to as “B layer”), and the heat conduction layer 2 (hereinafter referred to as “layer A”). “C layer”), the back surface of the regenerator layer 1 (hereinafter also referred to as “D layer”), and the back surface of the outer surface layer 3 (hereinafter also referred to as “E layer”).

  In FIG. 1, the heat conductive layer 2 is completely covered with the regenerator layer 1, but the heat conductive layer 2 is disposed long to the end face of the regenerator panel or is offset to one side of the regenerator panel 101. May be.

FIG. 2 is a schematic diagram of heat transfer according to Embodiment 1 of the present invention.
Next, the amount of heat transferred from the heat source 102 in FIG. 1 onto the outer surface layer 3 on the same side as the heat source 102 and already cooled, will be described with reference to FIG.
In FIG. 2, the amount of heat Q to move is indicated by an arrow.

The heat of the heat source 102 moves to a contact object having a temperature difference, that is, the ambient air (Q _XY ) and the contact portion (Q _XA ) of the outer surface layer 3.
The heat (Q _XA ) transferred to the contact portion of the outer surface layer 3 moves in the lateral direction (Q _AA ) and the lower regenerator layer 1 (Q _AB ).
The heat (Q _AB ) transferred to the cool storage agent layer 1 moves to the lateral direction (Q _BB ) of the cool storage agent layer 1 and to the heat conduction layer 2 (Q _BC ).
The heat (Q _BC ) transferred to the heat conductive layer 2 moves in the lateral direction (Q _CC ) of the heat conductive layer 2. In order to conduct heat quickly in the lateral direction of the heat conductive layer 2, it then moves to the entire vicinity of the heat conductive layer 2 of the regenerator layer 1 (D layer) (Q _CD ).
The heat (Q _CD ) transferred to the cool storage agent layer 1 (D layer) moves to the outer surface layer 3 (E layer) (Q _DE ).
Furthermore, the heat (Q _DE ) that has moved to the outer surface layer 3 (E layer) moves to the air in the cabinet (Q _EY ).
Here, if it is assumed that the heat conduction layer 2 has a uniform temperature, it can be considered that there is no temperature difference in the lateral direction inside the layers of the D layer and the E layer, and heat transfer does not occur.

On the other hand, the heat transfer to the other food 103 is considered as follows.
When the inside air rises and becomes hotter than the other ingredients 103, the heat of the inside air moves to the other ingredients 103 (Q _YZ ).
Moreover, it flows into the other foodstuff 103 from the outer surface layer 3 (Q _AZ ).
The cold storage agent layer 1 flows into the outer surface layer 3 (Q _BA ).
The cool storage agent layer 1 flows from the heat conduction layer 2 (Q _CB ).

These values are represented by the following equation from the law of conservation of energy.
Here, the heat capacity of each part is not considered, and only the amount of movement until the temperature finally becomes constant is considered.
Note that the initial heat quantity is (Q _X ), and the heat quantity received by the other ingredients 103 is (Q _Z ).

(Q _X ) = (Q _XY ) + (Q _XA ) 1
(Q _XA ) = (Q _AB ) + (Q _AA ) 2
(Q _AB ) = (Q _BC ) + (Q _BB ) 3
(Q _BC ) = (Q _CD ) + (Q _CC ) 4
(Q _CD ) = (Q _DE ) 5
(Q _DE ) = (Q _EY ) 6

(Q _Z ) = (Q _YZ ) + (Q _AZ ) 7
(Q _AZ ) = (Q _AA ) + (Q _BA ) 8
(Q _BA ) = (Q _BB ) + (Q _CB ) 9
(Q _CB ) = (Q _CC ) ・ ・ ・ 10

Here, it is considered to reduce the amount of heat (Q _Z ) received by the other ingredients 103.
When the above formulas 7 and 8 are added, (Q _Z ) = (Q _YZ ) + (Q _AA ) + (Q _BA ).

In the initial state, it can be considered that there is no temperature difference between the internal temperature and the other ingredients 103, so (Q _YZ ) is small, and (Q _BA ) is in the initial state where the regenerator layer 1 is sufficiently cooled. Is small because of latent heat accumulation.
Therefore, in order to reduce the amount of heat (Q _Z ) received by the other food material 103, it is sufficient if the lateral movement heat amount (Q _AA ) of the outer surface layer 3 is small, that is, the thermal conductivity of the outer surface layer 3 is small. .

  In addition, since the outer surface layer 3 is formed sufficiently thin, the heat transfer to the cool storage agent layer 1 side is faster than the heat transfer in the horizontal direction of the outer surface layer 3.

Next, it is considered to reduce the heat transfer (Q _XY ) + (Q _EY ) from the heat source 102 to the internal air.
Addition of Equations 1 to 6 results in the following.
(Q _X ) = (Q _XY ) + (Q _AA ) + (Q _BB ) + (Q _CC ) + (Q _EY )

That is, the heat transfer from the heat source 102 to the internal air is as follows.
(Q _XY ) + (Q _EY ) = (Q _X ) − ((Q _AA ) + (Q _BB ) + (Q _CC ))
From Equation 10, the following is obtained.
(Q _XY ) + (Q _EY ) = (Q _X ) − ((Q _AA ) + (Q _BB ) + (Q _CB ))

From this, it is understood that (Q _AA ) + (Q _BB ) + (Q _CB ) should be increased in order to reduce the heat transfer (Q _XY ) + (Q _EY ) from the heat source 102 to the inside air. .
As described above, since the material having a small (Q _AA ) is selected for the outer surface layer 3, (Q _BB ) + (Q _CB ) may be increased.
Since the amount of heat transferred in the lateral direction (Q _BB ) of the cool storage agent layer 1 is a constant value depending on the thermal conductivity of the cool storage agent layer 1, it can be seen that (Q _CB ) may be increased.
That is, if the amount of heat (Q _CC ) in the lateral direction of the heat conduction layer 2 is increased, the heat transfer (Q _XY ) + (Q _EY ) from the heat source 102 to the internal air can be reduced.

From the above, in order to reduce the amount of heat transferred from the heat source 102 to the other food material 103, (Q _AA ) should be reduced and (Q _CC ) should be increased.
As a result, a relationship of (Q _AA ) <(Q _BB ) <(Q _CC ) is derived. Therefore, the outer surface layer 3, the cool storage agent layer 1, and the heat conductive layer 2 in Embodiment 1 are configured to satisfy the above relationship.
That is, since the amount of heat transfer depends on the thermal resistance, the thermal resistance in the direction (lateral direction) orthogonal to the laminating direction of the outer surface layer 3 is the thermal resistance in the direction (lateral direction) orthogonal to the laminating direction of the cool storage agent layer 1. The thermal resistance in the direction (lateral direction) that is larger and orthogonal to the stacking direction of the heat conductive layer 2 is smaller than the thermal resistance in the direction (transverse direction) orthogonal to the stacking direction of the cool storage agent layer 1.

  The regenerator layer 1 is a latent heat composed of at least one substance selected from water, water-soluble inorganic substances such as phosphates and carbonates, organic substances such as paraffin, and gelling agents such as polysaccharides and polyvinyl alcohol. Use a material containing a cool storage agent.

For example, when the cold storage panel 101 is applied to a refrigerator or a freezer, a space (internal temperature) in which the cold storage panel 101 is installed in order to accumulate latent heat between water or paraffin solid and liquid. Those having a melting point at a temperature higher than the set temperature are desirable.
For example, the melting point of the material used for the regenerator layer 1 is higher than the average temperature or the maximum temperature of the set temperature in the warehouse.

  In addition, for example, when the cold storage panel 101 is applied to a device having a high space temperature such as a heat storage, and a low temperature object is assumed as the heat load body, the temperature is lower than the set temperature of the space where the cold storage panel 101 is installed. Those having a melting point are desirable.

Moreover, it is desirable that the components of the regenerator do not change in quality by reacting with the outer surface layer 3 or the heat conductive layer 2 or change them.
That is, it is desirable that the pH is in the neutral range of 5 to 9, and that there is little volume change or gas generation due to temperature.
Moreover, from the design property of the cool storage panel 101, it is desirable that it is transparent.
Further, it is desirable that the regenerator panel 101 has a high viscosity and is solid or gel-like at room temperature so that there is no liquid leakage when the cold storage panel 101 is damaged.
Further, it is desirable that the product is composed of polylactic acid which does not contain chlorine and has high biodegradability so that harmful substances are not easily generated as a combustion product at the time of disposal.

For example, metal, carbon, silicon carbide, or the like is used for the heat conductive layer 2. As for any material, a fiber, a thin film, a powder or the like, or a material in which such a material is dispersed in a resin can be used.
As the metal, copper, aluminum, iron or the like can be used, and it is desirable to use a material in which the surface is passivated or other components are mixed in order to improve the corrosion resistance.
The carbon desirably has a highly conductive structure such as graphene or graphite having a regular two-dimensional structure, or a carbon nanotube having a regular three-dimensional structure.
Although the heat conduction is faster as the cross-sectional area in the conduction direction is larger, it is desirable to make the entire panel thin in order to increase the space utilization efficiency. For this reason, it is desirable that the above-described fibers and thin films are aligned with directivity so that the heat conduction in the horizontal direction of the cold storage panel 101 (direction perpendicular to the stacking direction) is fast.

As the outer surface layer 3, for example, a material obtained by strongly molding organic fibers such as metal, metal oxide, resin, paper, or the like can be used. However, as described above, when the heat conduction of the outer surface layer 3 is fast, the other food 103 that has been cooled is heated, so that the thermal resistance is large in the lateral direction (direction perpendicular to the stacking direction) It is desirable to have a shape with low thermal resistance in the vertical direction (stacking direction).
That is, when using a metal, any type such as aluminum, iron, copper, etc. may be used. By using a coating or a thin film, the thermal resistance in the lateral direction is increased and combined with a resin film to obtain strength. It is desirable to use it.
In the case of using a resin, any kind such as polypropylene, ABS, and polycarbonate may be used, and in order to increase the thermal resistance in the lateral direction, a minute hollow balloon may be contained inside the resin, or a foamed resin may be used. .
In any material, a structure such as a rib shape may be formed on the surface so as to be thin, light and high in strength.
Moreover, you may perform the coating or surface treatment which surface tension falls so that dirt can be wash | cleaned easily.

  In addition, in this Embodiment 1, although the case where the heat transfer layer 2 was included in the cool storage agent layer 1 was demonstrated, this invention is not restricted to this, The layer from which the speed of heat transfer differs, respectively. Any structure may be used as long as it has a structure in which at least three layers are stacked and the heat transfer speed of a far layer is faster than the layer near the position where the thermal load is disposed.

As described above, in the present embodiment, the outer surface layer 3 includes the cool storage agent layer 1, the heat conductive layer 2 is disposed inside the cool storage agent layer 1, and the heat transfer amount (Q _AA ) of the outer surface layer 3 is small. , heat transfer amount of the cold storage agent layer 1 (Q _BB) smaller than, heat transfer amount of the thermal conductive layer 2 (Q _CC) is, heat transfer amount of the cold storage agent layer 1 (Q _BB) is larger than structure.
For this reason, the heat transmitted to the cool storage agent layer 1 below the heat source 102 can be conducted to the entire cool storage agent layer 1 through the heat conduction layer 2 disposed inside the cool storage agent layer 1, and the heat of the heat source 102 is stored in the cool storage. The amount of heat transfer from the heat source 102 to the other food 103 can be reduced by converting into the latent heat of the agent layer 1.
Therefore, even if the heat source 102 and the other food 103 are placed together on or near the cold storage panel 101 arranged in the refrigerator, the heat transfer from the heat source 102 to the other food 103 is performed. It can suppress and the temperature change of the other foodstuff 103 can be suppressed. Thereby, the quality fall of the other foodstuff 103 can be suppressed.

Further, since the heat transfer amount (Q _CC ) of the heat conductive layer 2 is large, the heat from the heat source 102 is quickly dispersed in the lateral direction of the heat conductive layer 2, and the rate at which the cool storage agent layer 1 absorbs heat is increased. can do.

  In addition, when the cold storage panel 101 is applied to a device having a high space temperature such as a heat storage, and a low-temperature object is assumed as the heat load body, the heat load is placed on or near the cold storage panel 101 arranged in the heat storage. Even when a low-temperature object as a body and a warmed object that has already been warmed are placed together, the heat transfer from the heat load body to the warmed object is suppressed, and the temperature change of the warmed object Can be suppressed.

Embodiment 2. FIG.
FIG. 3 is a cross-sectional view schematically showing a cold storage panel according to Embodiment 2 of the present invention.
As shown in FIG. 3, in the cold storage panel 101 according to the second embodiment, the heat conductive layer 2 is disposed below the cold storage agent layer 1. The heat conductive layer 2 was disposed between the cold storage agent layer 1 and the outer surface layer 3.
In the second embodiment, it is desirable that the heat conduction of the outer surface layer 3 is sufficiently small.
Other configurations and heat transfer amounts of the respective layers are the same as those in the first embodiment.

With such a configuration, the same effects as those of the first embodiment can be obtained.
Further, in the second embodiment, the panel lower surface side of the outer surface layer 3 is omitted, and the heat conductive layer 2 constitutes the lower surface of the panel, thereby reducing the amount of material used for the outer surface layer 3 and the heat conductive layer. 2 can be used for the purpose of maintaining the panel strength.

  The heat conduction layer 2 is arranged inside the cool storage agent layer 1 as in the first embodiment, and the heat conduction layer 2 is arranged between the cool storage agent layer 1 and the outer surface layer 3. May be. A similar effect can be obtained by such a configuration.

Embodiment 3 FIG.
FIG. 4 is a cross-sectional view schematically showing a cold storage panel according to Embodiment 3 of the present invention.
As shown in FIG. 4, the cold storage panel 101 according to the third embodiment includes a cold storage agent layer 1, a heat conductive layer 2, an outer surface layer 3, and a heat insulating material layer 4.
The outer surface layer 3 includes the cool storage agent layer 1. The heat conductive layer 2 is disposed inside the cool storage agent layer 1.
The heat insulating material layer 4 is disposed at least partially between the cool storage agent layer 1 and the outer surface layer 3. For example, as shown in FIG. 4, the cool storage agent layer 1 is disposed on the lower surface side.
Other configurations and heat transfer amounts of the respective layers are the same as those in the first embodiment.

The heat insulating material layer 4 may be a vacuum, a gas such as air, a liquid such as oil, a fiber or a powder, or a solid such as one in which these are fixed so as to be integrated.
When the heat insulating material layer 4 is used as a solid, it is desirable that the solid has a continuous or discontinuous void, and the void is filled with the vacuum, gas, liquid, or the like.
As the fiber and powder, ceramics such as silica and alumina, and organic substances such as pulp and polypropylene can be used.
The fibers are preferably laid so as to have directionality in the lateral direction of the panel.

As described above, in the present embodiment, in addition to the effects of the first embodiment, the heat release from the lower surface of the cold storage panel 101 can be suppressed by providing the heat insulating material layer 4.
When the upper and lower spaces of the cold storage panel 101 are set to different temperature zones, or when configuring the wall portion of the device, the heat loss is reduced by adopting a form in which the heat insulating material layer 4 is combined in this way. Can be reduced.

  In addition, in this Embodiment, although the case where the heat conductive layer 2 was arrange | positioned inside the cool storage agent layer 1 similarly to the said Embodiment 1 was demonstrated, it is not restricted to this, It is the same as that of the said Embodiment 2. You may make it arrange | position between the lower surface of the cool storage agent layer 1, ie, the cool storage agent layer 1, and the heat insulating material layer 4. FIG. Further, the heat conductive layer 2 may be disposed inside the cool storage agent layer 1 and between the cool storage agent layer 1 and the heat insulating material layer 4. A similar effect can be obtained by such a configuration.

Embodiment 4 FIG.
FIG. 5 is a cross-sectional view schematically showing a cold storage panel according to Embodiment 4 of the present invention.
As shown in FIG. 5, the cold storage panel 101 according to the fourth embodiment includes a cold storage agent layer 1, a heat conductive layer 2, an outer surface layer 3, and a hygroscopic agent layer 5.
The outer surface layer 3 includes the cool storage agent layer 1. The heat conductive layer 2 is disposed inside the cool storage agent layer 1.
The hygroscopic agent layer 5 is disposed at least partially between the cool storage agent layer 1 and the outer surface layer 3. For example, as shown in FIG. 5, the cool storage agent layer 1 is disposed on the lower surface side.
Further, the outer surface layer 3 has a ventilation hole 31 through which at least part of the portion where the outer surface layer 3 and the hygroscopic layer 5 are adjacent to each other allows the outside of the outer surface layer 3 and the hygroscopic layer 5 to vent. For example, as shown in FIG. 5, a vent hole 31 is formed in a part of the lower surface of the outer surface layer 3.
Other configurations and heat transfer amounts of the respective layers are the same as those in the first embodiment.

Examples of the hygroscopic agent used in the hygroscopic layer 5 include crystalline regular porous materials such as zeolite, amorphous regular porous materials such as mesoporous silica, and granules of activated carbon and oxide ultrafine particles. An irregular porous material, a polymer material having high hydrophilicity or polarity such as polyvinyl alcohol or ion exchange resin can be used.
In order to impregnate these materials with carbonates to provide water absorption, to mix antibacterial silver ions and organic antibacterial agents, and to prevent fine powder from falling off. An adhesive coating may be applied.

With such a configuration, in the space where the cold storage panel 101 is arranged, the hygroscopic layer 5 is assumed to be in an initial state where moisture in the space is adsorbed, by the heat from the cold storage agent layer 1 transmitted to the hygroscopic layer 5, The adsorbed moisture of the moisture absorbent layer 5 absorbs the heat of adsorption and evaporates, and is released from the vent hole 31 to the outside of the cold storage panel 101.
For example, when the space in which the cold storage panel 101 is arranged is in a refrigerator, the released moisture is condensed by an air cooling heat exchanger (not shown) and removed from the air.
Further, the moisture necessary for this operation is supplied from the outside air when the refrigerator is opened or closed, or from the ingredients contained in the refrigerator.

As described above, in the present embodiment, in addition to the effect of the first embodiment, by providing the hygroscopic agent layer 5, the heat transferred to the lower surface side of the cool storage agent layer 1 is transferred to the moisture of the hygroscopic agent layer 5. It can be converted into latent heat for evaporation, and the amount of heat (Q _EY ) released from the lower surface of the outer surface layer 3 can be reduced.

  In addition, in this Embodiment, although the case where the heat conductive layer 2 was arrange | positioned inside the cool storage agent layer 1 similarly to the said Embodiment 1 was demonstrated, it is not restricted to this, It is the same as that of the said Embodiment 2. You may make it arrange | position between the lower surface of the cool storage agent layer 1, ie, the cool storage agent layer 1, and the hygroscopic agent layer 5. FIG. Further, the heat conductive layer 2 may be disposed inside the cool storage agent layer 1 and between the cool storage agent layer 1 and the hygroscopic agent layer 5. A similar effect can be obtained by such a configuration.

Embodiment 5 FIG.
FIG. 6 is a cross-sectional view schematically showing a cold storage panel according to Embodiment 5 of the present invention.
As shown in FIG. 6, the cold storage panel 101 according to the fifth embodiment includes a cold storage agent layer 1, a heat conduction layer 2, a surface outer layer 3, and a heat conduction plate 6.
The outer surface layer 3 contains the regenerator layer 1. The heat conductive layer 2 is disposed inside the cool storage agent layer 1.
Furthermore, the outer surface layer 3 has a heat conductive plate 6 which is a heat conductive portion having a lower thermal resistance than the outer surface layer 3. The heat conductive plate 6 is thermally connected to the heat conductive layer 2.
The heat conductive plate 6 is disposed on the surface of the outer surface layer 3. For example, as shown in FIG. 6, it is provided on the upper surface side of the outer surface layer 3 on which the heat source 102 is disposed. Thereby, the said heat conductive board 6 and the heat source 102 contact directly or indirectly.
Other configurations and heat transfer amounts of the respective layers are the same as those in the first embodiment.

  In addition, it is preferable that the area of the part exposed to the surface of the heat conductive board 6 and the outer surface layer 3 is smaller than the projected area with respect to the lamination direction of the cool storage agent layer 1. This is to obtain a space for placing another cooled food 103 or the like.

With such a configuration, the heat of the heat source 102 is quickly transmitted to the heat conduction layer 2 thermally connected via the heat conduction plate 6. Therefore, the heat of the heat source 102 can quickly move to the cool storage agent layer 1, and the heat can move not only directly below the heat source 102 but also to a wider range of the cool storage agent layer 1. That is, by increasing (Q _XA ) and (Q _AB ), the heat transfer (Q _XY ) from the heat source 102 to the inside air is reduced, and as a result, the heat to the other food 103 via the inside air is increased. The movement (Q _YZ ) can be reduced.

Embodiment 6 FIG.
FIG. 7 is a cross-sectional view schematically showing a cold storage panel according to Embodiment 6 of the present invention.
As shown in FIG. 7, the cold storage panel 101 according to the sixth embodiment includes a cold storage agent layer 1, a heat conduction layer 2, an outer surface layer 3, a heat insulating material layer 4, and a heat conduction plate 6. .
The outer surface layer 3 contains the regenerator layer 1. The heat conductive layer 2 is disposed inside the cool storage agent layer 1.
The outer surface layer 3 has a heat conductive plate 6, and the heat conductive plate 6 is thermally connected to the heat conductive layer 2.
The heat insulating material layer 4 is disposed directly below the outer surface layer 3 where the heat conduction plate 6 is not disposed on the upper surface side of the outer surface layer 3. As the heat insulating material layer 4, the same material as that of the first embodiment can be used.
Note that the outer surface layer 3 where the heat insulating material layer 4 is disposed may be omitted, and the upper surface of the cold storage panel 101 may be configured by the heat insulating material layer 4 itself.

Furthermore, the heat conductive layer 2 of the present embodiment has one or a plurality of branch portions extending to the lamination surface. That is, the heat conductive layer 2 has a structure that branches off inside the regenerator layer 1 and has a larger surface area. For example, the surface area of the heat conductive layer 2 is larger than the projected area with respect to the stacking direction of the cool storage agent layer 1.
Other configurations and heat transfer amounts of the respective layers are the same as those in the first embodiment.

With such a configuration, by placing another cooled food 103 on the heat insulating material layer 4, heat transfer from the cold storage panel 101 to the other food 103 can be reduced.
Moreover, by providing the branch part in the heat conductive layer 2, the heat transfer from the heat conductive layer 2 to the cool storage agent layer 1 becomes quick, and the heat source 102 can be cooled quickly.

Embodiment 7 FIG.
FIG. 8 is a cross-sectional view schematically showing a cold storage panel according to Embodiment 7 of the present invention.
As shown in FIG. 8, the cold storage panel 101 according to the seventh embodiment includes a cold storage agent layer 1, a heat conductive layer 2, an outer surface layer 3, and a heat conductive plate 6.
The heat conducting plate 6 is the same as that in the fifth embodiment. Other configurations and heat transfer amounts of the respective layers are the same as those in the first embodiment.

  In the seventh embodiment, one or more heat conductive plates 6 are provided. The cool storage agent layer 1 is separated into one or more. Further, the outer surface layer 3 has a structure projecting from the lower surface of the cold storage panel 101 together with the cold storage agent layer 1 and the heat conduction layer 2.

With such a configuration, the latent heat once stored in the cool storage agent layer 1 can be easily released to the lower surface of the cool storage panel 101.
Moreover, even if the cool storage agent layer 1 is an opaque material, the cool storage panel 101 can be provided with light transmittance by intermittently forming the cool storage agent layer 1 as shown in FIG. Since the lighting in the space where the panel 101 is installed is not blocked, the heat source 102 provided on the cold storage panel 101 can be easily confirmed.

Embodiment 8 FIG.
FIG. 9 is a cross-sectional view schematically showing a cold storage panel according to Embodiment 8 of the present invention.
As shown in FIG. 9, the cold storage panel 101 according to the eighth embodiment includes a cold storage agent layer 1, a heat conductive layer 2, an outer surface layer 3, and a heat insulating portion 7.
The outer surface layer 3 contains the regenerator layer 1. The heat conductive layer 2 is disposed inside the cool storage agent layer 1.
Furthermore, the outer surface layer 3 has a heat insulating portion 7 having a larger thermal resistance than the outer surface layer 3. For example, as shown in FIG. 9, the heat insulating portion 7 is provided on a part of the upper surface side of the outer surface layer 3. The heat insulating portion 7 divides the outer surface layer 3 into two or more portions that are thermally separated.
As a material of the heat insulating part 7, a material composed of solid among the materials mentioned in the heat insulating material layer 4 can be used.
Further, as the material of the heat insulating portion 7, the same material as that of the outer surface layer 3 may be used to form a fine shape and increase the creepage distance, thereby improving the heat insulating property.
Other configurations and heat transfer amounts of the respective layers are the same as those in the first embodiment.

As described above, in order to suppress the heat of the heat source 102 from moving to the other food material 103, it is desirable that the outer surface layer 3 is made of a material having a small heat transfer coefficient.
Thus, by providing the heat insulation part 7 in the surface outer layer 3, the heat transfer through the surface of the surface outer layer 3 can be suppressed more.

FIG. 10 is a perspective view of a cold storage panel according to Embodiment 8 of the present invention. In FIG. 10 (A)-(B), the example of the cool storage panel 101 which provided the heat insulation part 7 mentioned above is shown.
As shown in FIG. 10, the upper surface of the cold storage panel 101 (the upper surface side of the outer surface layer 3) is thermally divided into two or more by the heat insulating portion 7, and all or part of the portion surrounded by the heat insulating portion 7 is heated. A conductive plate 6 is disposed. That is, the heat conductive plate 6 that is a heat conductive portion is disposed on at least one of two or more portions of the surface of the outer surface layer 3 that are thermally separated.
It is desirable that the heat conduction plate 6, the heat insulating portion 7, and the other upper surface portions of the outer surface layer 3 have appearances that are different in color tone and touch so that the user of the cold storage panel 101 can easily discriminate. .

  With this configuration, a user who uses the cold storage panel 101 can place a heat source 102 (heat load body) such as a food or object having a temperature different from the temperature of the space where the cold storage panel 101 is installed on the cold storage panel 101. Therefore, it can be easily determined that the heat source 102 should be placed on the heat conductive plate 6 and the usability is improved.

Embodiment 9 FIG.
FIG. 11 is a schematic view of the inside of a refrigerator according to Embodiment 9 of the present invention.
In the ninth embodiment, a refrigerator equipped with a cold storage panel 101 will be described.
As shown in FIG. 11, the refrigerator has an interior for storing an object to be cooled (hereinafter referred to as “storage space 201”), a cooler 203 for cooling air in the storage space 201, a storage space 201, and a cooler 203. And a cold air passage 202 for connecting the two.
With such a configuration, the refrigerator interior air is cooled by the cooler 203 and circulates from the storage space 201 through the cold air duct 202.
Moreover, the cool storage panel 101 is arrange | positioned in the storage space 201 as a panel which mounts foodstuffs.

As shown in FIG. 11, the cold storage panel 101 according to the ninth embodiment includes a heat conductive layer B22 in addition to the configuration of the fifth embodiment (FIG. 6).
The heat conductive layer B <b> 22 is disposed between the cool storage agent layer 1 and the outer surface layer 3 and on the lower surface side of the cool storage agent layer 1. That is, in addition to the heat conductive layer 2 (heat conductive layer A21) arrange | positioned inside the cool storage agent layer 1 mentioned above, heat conductive layer B22 is further provided.
The heat conductive layer B <b> 22 has one or a plurality of protrusions protruding to the outside of the outer surface layer 3. Via this protrusion part, between the cool storage agent layer 1 and the air in the storage space 201 is thermally connected.
Other configurations and heat transfer amounts of the respective layers are the same as those in the fifth embodiment.
In order to secure a ventilation space on the lower surface side of the cold storage panel 101, a partition plate may be provided below the heat conductive layer B22.

With such a configuration, when the heat stored in the cool storage agent layer 1 moves to the heat conduction layer B22, heat is quickly exhausted from the lower surface of the cool storage panel 101 to the air passing through the lower surface side of the cool storage panel 101, and the cooler 203 Led to.
Therefore, using the time lag between the cold storage in the cool storage agent layer 1 and the heat transfer to the heat conduction layer B22, the heat transfer ( _QEY ) to the internal air is delayed to suppress the fluctuation range of the internal air temperature. can do.

  As described above, in the present embodiment, once the heat is absorbed and latent heat is stored, fluctuations in the ambient temperature are suppressed by controlling the rate at which this heat is re-released to the back side of the cold storage panel 101. be able to.

Embodiment 10 FIG.
FIG. 12 is a schematic view of the interior of the refrigerator according to Embodiment 10 of the present invention.
As shown in FIG. 12, in the cold storage panel 101 according to the tenth embodiment, at least a part of the heat conductive layer B <b> 22 is arranged in the cold air passage 202.
The heat conductive layer B <b> 22 is extended to the cold air path 202, and the heat exhaust part 23 is formed inside the cold air path 202.
Other configurations and heat transfer amounts of the respective layers are the same as those in the ninth embodiment.
In addition, in FIG. 12, although the exhaust heat part 23 is arrange | positioned on the windward side of the cooler 203, you may arrange | position on the leeward side.

With such a configuration, in addition to the effects of the ninth embodiment, it is possible to avoid the heat from the cold storage panel 101 being exhausted to the storage space 201. Therefore, the heat transfer (Q _EY ) to the internal air can be reduced, and the temperature change of the other ingredients 103 can be suppressed.

  In the ninth and tenth embodiments, the cold storage panel 101 uses a configuration in which the heat conductive layer B22 is added to the configuration of the fifth embodiment. However, the present invention is not limited to this, and the first embodiment described above. Any one of ˜8 cold storage panels 101 may be used. Moreover, it is good also as a structure which adds heat conductive layer B22 to the structure of the cool storage panel 101 in any one of the said Embodiment 1-8.

  In the ninth and tenth embodiments, the case where the cold storage panel 101 is used as a panel for placing foods or the like has been described. However, the present invention is not limited to this, and the inner wall or door that forms the storage space 201 is used. It may be used. Even if it is such a structure, there can exist the same effect.

Embodiment 11 FIG.
FIG. 13 is a cross-sectional view schematically showing a cold storage panel according to Embodiment 11 of the present invention.
As shown in FIG. 13, in addition to the configuration of the fifth embodiment (FIG. 6), the cool storage panel 101 in the eleventh embodiment has a cool storage agent layer A11 and a cool storage agent layer B12. is doing.
The regenerator layer A <b> 11 includes the heat conductive layer 2. The cool storage agent layer B12 includes the cool storage agent layer A11.
Moreover, the cool storage agent used for cool storage agent layer A11 and the cool storage agent layer B12 uses the cool storage agent from which melting | fusing point, a heat capacity, and at least 1 differ.
That is, the kind of the cool storage agent in the layer adjacent to the heat conductive layer 2 is different from the kind of the cool storage agent in the layer not adjacent to the heat conductive layer 2.
Other configurations and heat transfer amounts of the respective layers are the same as those in the fifth embodiment.

  In this embodiment, a case where a two-layer structure is formed using two types of cold storage agents is described. However, the present invention is not limited to this, and an arbitrary type of cold storage material may be used as a structure of two or more layers.

For example, by using a cold storage agent having different thermal conductivity between the cold storage agent layer A11 and the cold storage agent layer B12, the heat transfer rate is set as the cold storage agent layer A11> the cold storage agent layer B12.
By setting it as such a structure, the heat transfer from the cool storage agent layer B12 to the other foodstuff 103 can be suppressed.

  The characteristics of the cool storage agent layer A11 and the cool storage agent layer B12 are not limited to the above, and may be arbitrarily selected according to the use conditions of the cool storage panel 101.

Embodiment 12 FIG.
FIG. 14 is a cross-sectional view schematically showing a cold storage panel according to Embodiment 12 of the present invention.
As shown in FIG. 14, the regenerator panel 101 according to the twelfth embodiment includes the regenerator layer 1 and the regenerator layer A11 in addition to the configuration of the regenerator panel 101 described in the ninth embodiment (FIG. 11). Agent layer B12.
The cool storage agent layer A11 is disposed on the upper surface side of the cool storage panel 101 and includes the heat conductive layer A21. The cool storage agent layer B12 is disposed on the lower surface side of the cool storage panel 101 and includes the heat conductive layer B22.
The cool storage agent used for the cool storage agent layer A11 and the cool storage agent layer B12 uses a cool storage agent having at least one of a melting point, a heat capacity, and a thermal conductivity.
That is, the kind of the cool storage agent in the layer adjacent to the heat conductive layer A21 is different from the kind of the cool storage agent in the layer adjacent to the heat conductive layer B22.
Other configurations and heat transfer amounts of the respective layers are the same as those in the ninth embodiment.

As described in the first embodiment, the heat from the heat source 102 is stored as latent heat of the cool storage agent layer 1. That is, in the twelfth embodiment, heat is stored in the cool storage agent layer A11 and the cool storage agent layer B12.
For example, when the cool storage panel 101 is mounted in a refrigerator, the heat stored in the cool storage agent layer A11 and the cool storage agent layer B12 is exhausted, and the cool storage panel 101 is re-cooled by the cooler 203 or the like.
When the heat stored in the cold storage panel 101 is exhausted and recooled, the temperature difference between the air temperature and the heat conduction layer B22, that is, the difference between the air temperature and the temperature of the cold storage agent layer B12 is larger. The amount of heat transfer to the air increases, and the load on the cooler 203 increases.

Therefore, in the present embodiment, by using cold storage agents having different melting points in the cold storage agent layer A11 and the cold storage agent layer B12, the melting point is set as the cold storage agent layer A11 <the cold storage agent layer B12.
By adopting such a configuration, the regenerator layer B12 stays at a high melting point, and phase transition occurs while maintaining a small temperature difference with air.
Therefore, the heat transfer from the cool storage agent layer 1 to the air becomes constant, and the heat load of the cooler 203 is reduced. Therefore, energy required for operation of the cooler 203 can be reduced, and energy-saving operation is possible.

  In addition, the characteristics of the regenerator layer A11 and the regenerator layer B12 are not limited to the above, and components having different heat capacities or heat transfer rates can be arbitrarily selected according to the use conditions of the regenerator panel 101. Also good.

Embodiment 13 FIG.
FIG. 15 is a schematic view of the inside of a refrigerator according to Embodiment 13 of the present invention.
In the thirteenth embodiment, the cold storage panel 101 described in any of the first to twelfth embodiments described above is mounted on a refrigerator. And the cool storage panel 101 is arrange | positioned between the compartments from which a preset temperature range differs.
As shown in FIG. 15, for example, the doors are different between the freezing room and the refrigerating room and are installed between the compartments having different set temperature zones.

  With such a configuration, when a high-temperature food (heat source 102) is placed in the freezer compartment, it is possible to suppress the temperature rise and thermal load fluctuations of other foodstuffs 103 and the like in the freezer compartment. In addition, heat transfer from the freezer compartment to the refrigerator compartment can be reduced. Therefore, it is possible to suppress thermal load fluctuations due to the heat source 102 in the freezer compartment and temperature rises of other ingredients.

Embodiment 14 FIG.
FIG. 16 is a schematic view of the inside of a refrigerator according to Embodiment 14 of the present invention.
Also in the fourteenth embodiment, the cold storage panel 101 described in any of the first to twelfth embodiments described above is mounted on a refrigerator. The cold storage panel 101 is used as at least one of a partition plate and an inner wall that partition the refrigerator into a plurality of compartments, and a panel on which a heat load is placed.
As shown in FIG. 16, the cool storage panel 101 is disposed as a partition plate inside a compartment having the same door.

  With such a configuration, it is possible to suppress thermal load fluctuations due to the heat source 102 placed on the cold storage panel 101 and temperature rises of other foods 103.

In addition, although the said Embodiment 1-14 demonstrated the case where the cool storage panel 101 was mounted, for example in a refrigerator, a heat retention box, etc., this invention is not limited to this, The space inside an apparatus is controlled to predetermined temperature. The cold storage panel 101 can be disposed on at least one of the inside and the inner wall of the refrigeration / refrigeration apparatus having the mechanism.
When a thermal load body having a temperature different from the internal space temperature is arranged in the space inside the device, the temperature of the coexisting substance arranged inside the device or the temperature of the air inside the device by the thermal load body. Can be suppressed.

  In addition, by using it in a system for controlling the temperature of the space where the cool storage panel 101 is arranged (for example, a warehouse for storing food in a frozen or refrigerated state), heat transfer to the bottom surface of the cool storage panel 101 or the air around the cool storage panel 101 is suppressed. It is possible to make the load more constant and contribute to energy saving of the system.

  In this way, heat transfer from the local heat load placed on the cold storage panel 101 to other objects to be cooled (including the heated object) placed on the cold storage panel 101 is minimized. Can do. Further, the heat load can be efficiently transmitted to the cool storage agent, and the cooling (or heating) speed of the heat load can be improved.

It is sectional drawing which shows typically the cool storage panel which concerns on Embodiment 1 of this invention. It is the schematic of the heat transfer which concerns on Embodiment 1 of this invention. It is sectional drawing which shows typically the cool storage panel which concerns on Embodiment 2 of this invention. It is sectional drawing which shows typically the cool storage panel which concerns on Embodiment 3 of this invention. It is sectional drawing which shows typically the cool storage panel which concerns on Embodiment 4 of this invention. It is sectional drawing which shows typically the cool storage panel which concerns on Embodiment 5 of this invention. It is sectional drawing which shows typically the cool storage panel which concerns on Embodiment 6 of this invention. It is sectional drawing which shows typically the cool storage panel which concerns on Embodiment 7 of this invention. It is sectional drawing which shows typically the cool storage panel which concerns on Embodiment 8 of this invention. It is a perspective view of the cool storage panel which concerns on Embodiment 8 of this invention. It is the schematic inside the refrigerator which concerns on Embodiment 9 of this invention. It is the schematic inside the refrigerator which concerns on Embodiment 10 of this invention. It is sectional drawing which shows typically the cool storage panel which concerns on Embodiment 11 of this invention. It is sectional drawing which shows typically the cool storage panel which concerns on Embodiment 12 of this invention. It is the schematic inside the refrigerator which concerns on Embodiment 13 of this invention. It is the schematic inside the refrigerator which concerns on Embodiment 14 of this invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 Cold storage agent layer, 2 Thermal conductive layer, 3 Outer surface layer, 4 Thermal insulation material layer, 5 Hygroscopic agent layer, 6 Thermal conduction plate, 7 Thermal insulation part, 11 Cold storage agent layer A, 12 Cold storage agent layer B, 21 Thermal conductive layer A , 22 heat conduction layer B, 23 exhaust heat part, 31 vent hole, 101 cold storage panel, 102 heat source, 103 other foodstuffs, 201 storage space, 202 cold air path, 203 cooler.

Claims (21)

A cold storage panel disposed in at least one of an interior and an inner wall of a device having a mechanism for controlling a space inside the device to a predetermined temperature, and a thermal load body having a temperature different from the space temperature inside the device is disposed,
It has a laminated structure in which at least three layers having different heat transfer rates are laminated,
The laminated structure is
An outer surface layer in which the thermal load is disposed on one side;
A cold storage agent layer having the outer surface layer on one side and a heat transfer layer on the opposite side;
The thermal resistance in the direction perpendicular to the laminating direction in the outer surface layer is larger than the thermal resistance in the laminating direction transmitted from the outer surface layer to the cool storage agent layer,
A cold storage panel , wherein a thermal resistance in a direction orthogonal to a stacking direction in the cool storage agent layer is larger than a thermal resistance in a stacking direction transmitted from the cool storage agent layer to the heat transfer layer . Thermal resistance in the direction perpendicular to the stacking direction before Symbol surface layer is greater than the direction of the thermal resistance perpendicular to the stacking direction of the refrigerant 13A layer,
2. The cold storage panel according to claim 1, wherein a thermal resistance in a direction orthogonal to the stacking direction of the heat conductive layers is smaller than a thermal resistance in a direction orthogonal to the stacking direction of the cool storage agent layer. The laminated structure is
An outer surface layer on which a thermal load is placed on one side;
A regenerator layer contained in the outer surface layer;
A heat conductive layer,
2. The cold storage panel according to claim 1, wherein the heat conductive layer is arranged inside the cold storage agent layer and / or between the cold storage agent layer and the other surface of the outer surface layer. The laminated structure is
An outer surface layer on which a thermal load is placed on one side;
A regenerator layer contained in the outer surface layer;
A heat conductive layer;
A heat insulating material layer disposed at least in part between the cold storage agent layer and the outer surface layer;
The cold storage panel according to claim 1, wherein the heat conductive layer is disposed inside the cold storage agent layer or / and between the cold storage agent layer and the heat insulating material layer. The laminated structure is
An outer surface layer on which a thermal load is placed on one side;
A regenerator layer contained in the outer surface layer;
A heat conductive layer;
A moisture absorbent layer disposed at least in part between the cold storage agent layer and the outer surface layer;
The heat conductive layer is disposed inside the cold storage agent layer or / and between the cold storage agent layer and the hygroscopic agent layer,
The outer surface layer has a vent hole through which at least part of a portion where the outer surface layer and the hygroscopic layer adjoin each other can vent the outside of the outer surface layer and the hygroscopic layer. The cold storage panel according to 1. The thermal resistance in the direction perpendicular to the laminating direction of the outer surface layer is larger than the thermal resistance in the direction perpendicular to the laminating direction of the cool storage agent layer,
The cold storage panel according to any one of claims 3 to 5, wherein a thermal resistance in a direction orthogonal to the stacking direction of the heat conductive layers is smaller than a thermal resistance in a direction orthogonal to the stacking direction of the cool storage agent layer. . The outer surface layer has a heat conduction portion having a lower thermal resistance than the outer surface layer,
The cold storage panel according to claim 2, wherein the heat conducting portion is thermally connected to the heat conducting layer.   The heat conduction part is disposed on a surface of the outer surface layer, and an area of a portion exposed on the surface of the outer surface layer is smaller than a projected area with respect to a stacking direction of the cool storage agent layer. Cold storage panel as described.   The cold storage panel according to any one of claims 2 to 8, wherein the heat conductive layer has one or a plurality of branch portions extending to the laminated surface.   The cold storage panel according to any one of claims 2 to 9, wherein a surface area of the heat conductive layer is larger than a projected area with respect to a stacking direction of the cold storage agent layer. The outer surface layer has a heat insulating part having a larger thermal resistance than the outer surface layer,
The said heat insulation part divides | segments the said outer surface layer into two or more parts isolate | separated thermally, The cool storage panel in any one of Claims 2-10 characterized by the above-mentioned.   The cold storage panel according to claim 11, wherein the heat conducting portion is disposed on at least one of the two or more thermally separated portions of the surface of the outer surface layer.   The cold storage panel according to any one of claims 2 to 12, wherein the heat conductive layer has one or a plurality of protrusions protruding to the outside of the outer surface layer. The cold storage agent layer has two or more layers using cold storage agents having at least one of melting point, heat capacity, and thermal conductivity,
The cold storage panel according to any one of claims 2 to 13, wherein the kind of the cold storage agent in the layer adjacent to the thermal conduction layer is different from the kind of the cold storage agent in the layer not adjacent to the thermal conduction layer. The heat conductive layer is disposed inside the cool storage agent layer and between the cool storage agent layer and the outer surface layer,
The cold storage agent layer has two or more layers using cold storage agents having at least one of melting point, heat capacity, and thermal conductivity,
The type of the regenerator of the layer adjacent to the heat conduction layer disposed inside the regenerator layer,
The cold storage panel according to any one of claims 2 to 13, wherein the kind of the cold storage agent in the layer adjacent to the heat conductive layer disposed between the cold storage agent layer and the outer surface layer is different.   The cold storage panel according to any one of claims 2 to 15, wherein the cold storage agent layer uses a material containing at least a latent heat cold storage agent.   A freezing / refrigeration apparatus comprising the cold storage panel according to any one of claims 1 to 16.   18. The refrigeration / refrigeration apparatus according to claim 17, wherein a melting point of a material used for the cold storage agent layer is higher than an average temperature or a maximum temperature of a set temperature in a warehouse in which the cold storage panel is disposed.   19. The cold storage panel is used as at least one of a partition plate and an inner wall that partition the freezing / refrigeration apparatus into a plurality of compartments, and a panel on which a thermal load is placed. Freezer / refrigerator.   The said cool storage panel is arrange | positioned between the compartments from which a preset temperature range differs, The freezing / refrigeration apparatus in any one of Claims 17-19 characterized by the above-mentioned. Inside the warehouse for storing the object to be cooled;
A cooler for cooling the internal air;
A cold air path connecting the interior and the cooler,
The refrigeration / refrigeration apparatus according to any one of claims 17 to 20, wherein at least a part of the heat conductive layer of the cold storage panel is disposed in the cold air passage.

Images