JP4927070B2 - Transparent conductive sheet and manufacturing method thereof, decorative molded product - Google Patents

Description

  The present invention relates to a transparent conductive sheet having transparency and electromagnetic shielding properties and conductivity, a manufacturing method thereof, and a decorative molded product manufactured using the transparent conductive sheet.

  In communication devices such as mobile phones, electronic information devices, liquid crystal displays, solar cells, and the like, a transparent conductive sheet excellent in transparency and conductivity is required.

  As such a transparent conductive sheet, for example, there is one in which a metal thin film layer formed on a base sheet as in Patent Document 1 is patterned in a grid pattern.

In this method, a line width of 15 μm mainly composed of copper and an aperture ratio of 70 to 90 are formed on the transparent sheet (1) so that the total light transmittance as shown in Table 1 is 70 to 80%. % Square or rectangular grid copper pattern (P) and transparent conductive thin film layer (2) are provided, and copper oxide or sulfide is further formed on the mesh copper pattern (P). A colored layer (3) made of copper is provided.

  In the above method, for example, an anchor layer (hydrophilic resin) (for example, polyhydroxyethyl acrylate) for forming a plating nucleus for electroless plating is provided, and an electroless plating layer is provided. Then, a copper layer of 1 to 10 μm is provided on the entire surface, and a lattice-like copper pattern is formed by photoetching using a masking film.

JP-A-11-330772

  However, the performance required for actual products is, for example, that the total light transmittance is almost 85% or more, and in order to realize it, the line width must be several μm or 1 μm or less. In the method of performing exposure by photoetching using a film, very expensive equipment is required, and there is a problem that productivity is greatly reduced.

  Accordingly, the present invention provides a transparent conductive sheet that eliminates the above-described problems, has transparency, and has conductivity and stable electromagnetic wave shielding, a method for producing the same, and a transparent conductive decorative molded product. With the goal.

  In order to achieve the above object, the transparent conductive sheet, the production method thereof, and the decorative molded product of the present invention are configured as follows.

  That is, the transparent conductive sheet of the present invention is provided with a base sheet in which a large number of fine concave and fine convex portions are formed on a part or all of the surface, and the planar shape of the fine concave portions is a mesh shape. A metal thin film layer is formed at least on the fine recesses.

  Further, in the transparent conductive sheet according to the second aspect of the present invention, the coating layer formed on the base sheet has a large number of fine concave and fine convex portions on part or all of the surface, and the fine concave portions The planar shape was a mesh shape, and at least the metal thin film layer was formed on the fine recesses of the coating layer.

  In addition, as a third aspect of the present invention, the transparent conductive sheet according to the first and second aspects has a line width of a fine concave mesh pattern at intervals of 0.01 μm to 2 μm, and has fine convex parts. It can also be configured such that the aspect ratio is 0.01-5.

  Moreover, as the 4th aspect of this invention, the transparent conductive sheet of the 1st-3rd aspect is 5 times or more and less than 1000 times the line | wire distance of the mesh-shaped pattern which the fine recessed part adjoins the mesh-shaped pattern. It can also be configured.

  Moreover, as a 5th aspect of this invention, the transparent conductive sheet of the 1st-4th aspect can also be comprised so that a metal thin film layer may consist of either aluminum, copper, chromium, nickel, silver, and gold | metal | money.

  As the sixth aspect of the present invention, the transparent conductive sheets of the first to fifth aspects can be configured such that the thickness of the metal thin film layer is 0.01 μm to 1 μm.

  The manufacturing method of the transparent conductive sheet according to the seventh aspect of the present invention includes a first step of forming a large number of fine concave portions and fine convex portions on a part or all of the surface of the base sheet using the nanoimprint method, A second step of forming an alcoholic release layer on the fine protrusion, a third step of forming a metal thin film layer on the fine recess and the fine protrusion, and the fine protrusion. And the fourth step of detaching and removing the metal thin film layer by alcohol treatment so that the metal thin film layer forms a fine mesh shape.

  In the method for producing a transparent conductive sheet according to the eighth aspect of the present invention, the surface of the coating layer formed on the base sheet is subjected to nanoimprinting on a part or all thereof, and a large number of fine concave portions and fine convex portions are formed. A first step of forming a portion, a second step of forming an alcoholic release layer on the fine convex portion, and a first step of forming a metal thin film layer on the fine concave portion and the fine convex portion. 3 steps, and a fourth step of peeling and removing the alcoholic release layer formed on the fine protrusions and the metal thin film layer by alcohol treatment, whereby the metal thin film layer has a fine mesh shape. Was configured to form.

  The manufacturing method of the transparent conductive sheet according to the ninth aspect of the present invention includes a first step of forming a large number of fine concave portions and fine convex portions on a part or all of the surface of the base sheet using a nanoimprint method, A second step of forming a metal thin film layer on the fine concave portions and the fine convex portions, and a third step of forming a resist layer on the previous metal thin film layer formed on the fine concave portions; And a fourth step of removing the metal thin film layer formed on the fine protrusions by a wet etching method so that the metal thin film layer forms a fine mesh shape.

  In the method for producing a transparent conductive sheet according to the tenth aspect of the present invention, the surface of the coating layer formed on the substrate sheet is subjected to nanoimprinting on a part or all thereof, and a large number of fine concave portions and fine convex portions are formed. A first step of forming a portion, a second step of forming a metal thin film layer on the fine concave portion and the fine convex portion, and on the metal thin film layer formed on the fine concave portion. A third step of forming a resist layer and a fourth step of removing the metal thin film layer formed on the fine protrusions by a wet etching method, whereby the metal thin film layer has a fine mesh shape. Configured to form.

  The manufacturing method of the transparent conductive sheet according to the eleventh aspect of the present invention includes a first step of forming a number of fine concave portions and fine convex portions on a part or all of the surface of the base sheet using a nanoimprint method, A second step of forming a plating catalyst layer over the fine recesses and the fine projections; a third step of removing the plating catalyst layer formed on the fine projections; and the plating catalyst. And a fourth step of forming a metal thin film layer on the layer, so that the metal thin film layer forms a fine mesh shape.

  The method for producing a transparent conductive sheet according to the twelfth aspect of the present invention uses a nanoimprint method on the surface of a coating film layer formed on a substrate sheet to form a large number of fine concave portions and fine convex portions in part or all thereof. A first step of forming a portion, a second step of forming a plating catalyst layer entirely on the fine concave portion and the fine convex portion, and removing the plating catalyst layer formed on the fine convex portion. And a fourth step of forming a metal thin film layer on the plating catalyst layer, so that the metal thin film layer is configured to form a fine mesh shape.

  Further, as a twelfth aspect of the present invention, the transparent conductive sheet manufacturing method according to the seventh to eleventh aspects has a fine line width of the mesh pattern of the concave portions existing at intervals of 0.01 μm to 2 μm and is fine. It can also comprise so that the aspect-ratio of a convex part may be 0.01-5.

  Further, as a thirteenth aspect of the present invention, the transparent conductive sheet manufacturing method according to the seventh to twelfth aspects has a line-to-line distance between adjacent mesh patterns of fine recesses of not less than 5 times the line width of the mesh pattern. It can also be configured to be less than double.

  Moreover, as a fourteenth aspect of the present invention, the transparent conductive sheet manufacturing method according to the seventh to thirteenth aspects can be configured such that the thickness of the metal thin film layer is 0.01 μm to 1 μm.

  In addition, as a fifteenth aspect of the present invention, the transparent conductive sheet manufacturing method according to the seventh to fourteenth aspects can be configured such that the metal thin film layer is formed by a plating method.

  The transparent conductive sheet of the present invention has a substrate sheet having a large number of fine concave portions and fine convex portions on the surface, and the plane of the fine concave portions is mesh-like, and the fine concave portions of the base sheet. Since the metal thin film layer is formed at least, it has both transparency and conductivity at the same time. Moreover, since the metal thin film layer of the transparent conductive sheet of this invention is formed in mesh shape, the transparent conductive sheet of this invention also has the stable electromagnetic wave shielding.

  Embodiments according to the present invention will be described below in more detail with reference to the drawings. It should be noted that the dimensions, materials, shapes, relative positions, etc. of the members and parts described in the embodiments of the present invention are not intended to limit the scope of the present invention only to those unless otherwise specified. It is merely an illustrative example.

  First, the transparent conductive sheet in the first embodiment of the present invention will be described.

  FIG. 1 is a perspective view of the transparent conductive sheet 100 of the present invention, and FIG. 2 (a) is a cross-sectional view taken along the line II-II in FIG. FIG.2 (b) is sectional drawing of the modification of the transparent conductive sheet of this invention.

  Referring to FIG. 1, a transparent conductive sheet 100 according to a first embodiment of the present invention includes a base sheet 1 having fine convex portions 4 and continuous fine concave portions 5 formed on one surface, The fine recess 5 includes at least a metal thin film layer 2 formed so as to conduct from one end of the base sheet 1 to the other end. The transparent conductive sheet 100 according to the first embodiment of the present invention is a resist layer formed on the metal thin film layer 2 in a shape that matches the fine mesh shape of the metal thin film layer 2 as necessary. 3, a release layer, a release layer, a design layer, an anchor layer, and an adhesive layer.

  The base sheet 1 is a base material for fixing the metal thin film layer 2 and the like. This base sheet 1 may have releasability or adhesiveness. The material of the base sheet 1 is a resin sheet such as a polypropylene resin, a polyethylene resin, a polyamide resin, a polyester resin, an acrylic resin, a polyvinyl chloride resin, or a metal such as an aluminum foil or a copper foil. Foil, glassine paper, coated paper, cellulosic sheet such as cellophane, or a composite of each of the above sheets can be used.

  Referring to FIG. 2A, the metal thin film layer 2 is for obtaining conductivity and electromagnetic wave shielding properties, and is mainly formed on the fine recesses 5 of the base sheet 1 formed in a mesh pattern. Has been. As an aspect in which the metal thin film layer 2 is formed on the fine concave portion 5 of the base sheet 1, (1) one formed on the peripheral portion of the fine concave portion 5, and (2) only the bottom portion of the fine concave portion 5. And the like formed in the above.

  The metal thin film layer 2 may be formed not only on the fine mesh-shaped concave portion 5 of the base sheet 1 but also on the fine convex portion 4 as long as it is small. However, in order to ensure transparency and the like, it is preferable to reduce the metal thin film layer 2 formed on the fine protrusions 4 as much as possible.

  With reference to FIG.2 (b), the resist layer 3 may be formed on the metal thin film layer 2 as needed. The resist layer 3 is a layer that protects the metal thin film layer 2 from the outside. Amide resin, polyester resin, acrylic resin, polyurethane resin, polyvinyl acetal resin, polyester urethane resin, cellulose ester resin, alkyd resin, etc. An ink containing a colorant such as a dye may be used. The resist layer 3 may be formed by a normal printing method such as an offset printing method, a gravure printing method, a screen printing method, or a method such as wiping or dipping.

  The pattern layer may be formed on the metal thin film layer 2 or the metal thin film layer 2 and the resist layer 3 as necessary. The design layer is a layer for decorating various patterns and characters. As a material of the pattern layer, a resin such as polyvinyl resin, polyamide resin, polyester resin, acrylic resin, polyurethane resin, polyvinyl acetal resin, polyester urethane resin, cellulose ester resin, alkyd resin is used as a binder. A colored ink containing a pigment or dye of an appropriate color as a colorant may be used. As a method for forming the printing layer, a normal printing method such as a gravure printing method, a screen printing method, or an offset printing method may be used. In particular, the offset printing method and the gravure printing method are suitable for performing multicolor printing and gradation expression. In the case of a single color, a coating method such as a gravure coating method, a roll coating method, or a comma coating method may be employed. The pattern layer 11 may be provided in an arbitrary pattern depending on the pattern to be expressed.

  A release layer may be formed between the base sheet 1 and the metal thin film layer 2 as necessary. The release layer is released from the metal thin film layer 2 together with the base sheet 1 when the base sheet 1 is peeled off after the transfer. As the material of the release layer, melamine resin release agent, silicone resin release agent, fluororesin release agent, cellulose derivative release agent, urea resin release agent, polyolefin resin release agent, Paraffin-type release agents and composite release agents thereof can be used. As a method for forming the release layer, there are a coating method such as a roll coating method and a spray coating method, a printing method such as a gravure printing method and a screen printing method.

  If necessary, a release layer may be formed between the release layer and the metal thin film layer 2. The release layer is a layer that peels from the base sheet 1 or the release layer and becomes the outermost surface of the transfer object when the base sheet 1 is peeled after transfer or after simultaneous molding transfer. The release layer can be made of acrylic resin, polyester resin, polyvinyl chloride resin, cellulose resin, rubber resin, polyurethane resin, polyvinyl acetate resin, or vinyl chloride-vinyl acetate copolymer system. A copolymer such as a resin or an ethylene-vinyl acetate copolymer resin may be used. When the release layer requires hardness, a photo-curing resin such as an ultraviolet curable resin, a radiation curable resin such as an electron beam curable resin, or a thermosetting resin may be selected and used. The release layer may be colored or uncolored. As a method for forming the release layer, there are a coating method such as a gravure coating method, a roll coating method and a comma coating method, a printing method such as a gravure printing method and a screen printing method.

  If necessary, an anchor layer may be formed between the design layer and the release layer, or between the metal thin film layer 2 and the adhesive layer. An anchor layer is a layer which improves the adhesiveness between these layers. As the material of the anchor layer, two-component cured urethane resin, thermosetting urethane resin, melamine resin, cellulose ester resin, chlorine-containing rubber resin, chlorine-containing vinyl resin, acrylic resin, epoxy resin, vinyl resin A copolymer resin or the like may be used. Examples of the method for forming the anchor layer include a coating method such as a gravure coating method, a roll coating method, and a comma coating method, a printing method such as a gravure printing method, and a screen printing method.

  If necessary, the adhesive layer may be formed on the uppermost surface of the base sheet 1 on the side where the metal thin film layer 2 is formed. An adhesion layer adheres each above-mentioned layer to a surface to be decorated. Further, the adhesive layer is formed on a portion to be bonded. That is, when the part to be bonded is entirely, the adhesive layer is formed on the entire surface. If the part to be bonded is partial, an adhesive layer is partially formed. As the adhesive layer, a heat-sensitive or pressure-sensitive resin suitable for the material to be decorated is used as appropriate. For example, when the material to be decorated is an acrylic resin, an acrylic resin may be used. If the material to be decorated is polyphenylene oxide / polystyrene resin, polycarbonate resin, styrene copolymer resin, or polystyrene blend resin, acrylic resin, polystyrene resin, polyamide having affinity with these resins A series resin or the like may be used. Furthermore, when the material to be decorated is a polypropylene resin, chlorinated polyolefin resin, chlorinated ethylene-vinyl acetate copolymer resin, cyclized rubber, and coumarone indene resin can be used. Examples of the method for forming the adhesive layer 10 include a coating method such as a gravure coating method, a roll coating method, and a comma coating method, a printing method such as a gravure printing method, and a screen printing method.

  Next, the fine convex part 4 and the mesh-shaped fine recessed part 5 are demonstrated.

  Referring again to FIG. 2 (a), the fine convex portion 4 of the transparent conductive sheet of the present invention is basically composed of the top portion of the base sheet 1, and the mesh-like fine concave portion 5 is composed of the base sheet. 1 is formed of a portion below the top portion (side portion and bottom portion) and the metal thin film layer 2.

  It is preferable that the line width W of the mesh-shaped fine recessed part 5 is 0.01 micrometer-2 micrometers. It is technically difficult to make the line width W of the mesh pattern smaller than 0.01 μm, and when the line width W of the mesh pattern is 2 μm or more, the mesh pattern may be visible in some cases, and transparent conductive This is because the transparency of the conductive sheet 100 may be lowered. In the relationship between the fine concave portion 5 and the fine convex portion 4, the width L of the fine convex portion 4 is configured to be not less than 5 times and less than 1000 times the line width W of the fine concave portion 5. preferable. This is because if the width L of the fine protrusions 4 is less than 5 times the line width W of the fine mesh-like recesses 5, the color of the metal thin film layer 2 formed in the mesh pattern becomes strong and transparent. This is because the transparency of the conductive sheet 100 is lowered and becomes dark. On the other hand, if the width L of the fine protrusions 4 is 1000 times or more the line width W of the fine depressions, the surface resistance value per unit area is small, so that the conductivity becomes high and the metal thin film layer 2 This is because the electromagnetic wave shielding property of the is lowered.

  The aspect ratio Y of the fine projections 4 formed on the base sheet 1 (aspect ratio Y = depth H of the fine recesses 5 of the base sheet 1 / line width W of the fine recesses 5) is 0.01 to 5. It is preferable that it exists in the range. If the aspect ratio of the fine projections 4 is less than 0.01, it is difficult to selectively provide the metal thin film layer 2 on the fine depressions 5 of the base sheet 1. If the aspect ratio exceeds 5, then in the production process of the transparent conductive sheet, which will be described later, the peelability between the stamper and the base sheet 1 is deteriorated and the productivity is lowered.

  FIG. 3A and FIG. 3B are modified examples of the cross-sectional shape of the fine recess 5. FIG. 4A and FIG. 4B are modified examples of the planar shape of the fine protrusions 4.

  With reference to FIG. 3A and FIG. 3B, the cross-sectional shape of the minute recess 5 is formed of a U-shape, a V-shape, a U-shape, or the like. Referring to FIGS. 4A and 4B, the planar shape of the fine concave portion 5 is configured by a mesh shape, a honeycomb shape, or the like. You may be comprised from geometric shapes, such as a square and a circle.

  FIG. 5 is a cross-sectional view of the transparent conductive sheet 100 according to the second embodiment of the present invention, and corresponds to FIG. Since the basic configuration of the transparent conductive sheet according to this embodiment is the same as that according to the first embodiment, only the differences will be described here.

  Referring to FIG. 4, a transparent conductive sheet 100 according to the second embodiment of the present invention is formed on a transparent base sheet, a base sheet, and fine protrusions 4 on one side thereof. The coating film layer 6 in which the fine concave portion 5 is formed, and the metal thin film layer 2 formed so as to be electrically connected to the fine concave portion 5 from one end of the base sheet 1 to the other end. ing.

  The coating layer 6 is formed on the base sheet 1, and the surface thereof is composed of fine convex portions 4 and fine concave portions 5 that are continuously formed over the entire surface of the coating layer 6. The material of the coating layer 6 is polycarbonate resin, cycloolefin resin, chlorinated polypropylene resin, vinyl resin, amide resin, polyester resin, acrylic resin, polyurethane resin, acetal resin, melamine resin. Resin, cellulose resin, alkyd resin, curable resin such as cyanoacrylate resin, urethane acrylate resin, FOL (registered trademark) -12 FLOWABLE OLIDE, FOL (registered trademark)-manufactured by Toray Dow Corning Co., Ltd. Resins such as 14 FLOWABLE OLIDE, FOL (registered trademark) -15 FLOWABLE OLIDE, FOL (registered trademark) -16 FLOWABLE OLIDE, and mixtures thereof. Furthermore, it is good to use what added the coloring agent which consists of various additives and a pigment or dye of a suitable color as needed.

  FIG. 6 is a diagram showing a schematic process of the method for manufacturing the transparent conductive sheet 100 of the present invention. FIG. 6A is a sectional view when the base sheet 100 and the stamper S used in the first step of the manufacturing method according to the present invention are integrated. FIG. 6B is a cross-sectional view when the alcoholic release layer 7 is formed on the fine protrusions 4 of the base sheet 1 in the second step of the manufacturing method according to the present invention. FIG. 6C is a cross-sectional view when the metal thin film layer 2 is formed in the alcoholic release layer 7 and the fine concave portion 5 of the base sheet 1 in the third step of the manufacturing method according to the present invention. . FIG. 6 (d) is a cross-sectional view of the metal thin film sheet 100 when the alcoholic release layer 7 and the metal thin film layer 2 even formed thereon are removed in the fourth step of the manufacturing method according to the present invention. is there.

  With reference to Fig.6 (a), in the 1st process of this invention, the fine convex part 4 and the mesh-shaped fine recessed part 5 are formed in the one part or the whole surface of the base sheet 1 using the nanoimprint method. And after the fine convex part 4 and the mesh-shaped fine recessed part 5 are formed in the resist layer 3 of the metal thin film sheet 100, it transfers to the 2nd process of the manufacturing method which concerns on this invention.

  The nanoimprint method is a processing method in which a stamper S provided with a fine mesh-like concave portion is pressed against the base sheet 1 to form fine convex portions 4 and fine mesh-like concave portions 5 on the base sheet 1. Typical examples of the nanoimprint method include a thermal nanoimprint method, an optical nanoimprint method, and a room temperature nanoimprint method. Below, the method to form the fine convex part 4 and the mesh-shaped fine recessed part 5 in the base sheet 1 using a thermal nanoimprint method is demonstrated.

  In order to form the fine convex portions 4 and the mesh-like fine concave portions 5 on the base sheet 1 using the thermal nanoimprint method, first, a stamper S made of nickel electroforming is used from a mother die drawn with an electron beam or the like. Make it. Next, the stamper S is placed on the base sheet 1 and pressed under high temperature and high pressure, and then cooled, and the stamper S is removed from the base sheet 1 to remove the fine protrusions 4 and the fine mesh in the base sheet 1. A recess 5 is formed. The temperature of the stamper S at the time of pressing may be higher than the softening point of the base sheet 1 and lower than the thermal decomposition temperature. The pressure applied to the base sheet 1 at the time of pressing is usually preferably set in the range of several MPa to several tens of MPa. Under the above conditions, the stamper S is pressed against the base sheet 1 for several seconds to several minutes, rapidly cooled or naturally cooled, and left until the surface of the base sheet 1 is below the softening point, Fine convex portions 4 and fine mesh-like concave portions 5 can be formed on the base sheet 1.

  In addition, from the viewpoint of productivity of the transparent conductive sheet 100, it is preferable that the line width W of the fine mesh-shaped concave portion 5 pattern is 0.01 μm to 2 μm. Since it is technically difficult to make the line width W of the mesh pattern smaller than 0.01 μm, there is a problem that the productivity of the transparent conductive sheet 100 is lowered, and the line width W of the mesh pattern is reduced. This is because if it is 2 μm or more, there is a problem that a mesh-like pattern can be seen and transparency may be lowered.

  The aspect ratio Y of the fine concave portion 5 formed in the base sheet 1 (aspect ratio Y = depth H of the fine concave portion 5 of the base sheet 1 / line width W of the fine concave portion 5) is 0.01 to 5. It is preferable to be in the range. If the aspect ratio of the fine projections 4 is less than 0.01, it is difficult to selectively provide the metal thin film layer 2 on the fine depressions 5 of the base sheet 1. This is because if the aspect ratio exceeds 5, the productivity decreases in the transparent conductive sheet manufacturing process described later.

  Furthermore, the thickness of the base sheet 1 used in this step is preferably in the range of 0.02 to 5 mm. If the thickness is less than 0.02 mm, wrinkles are difficult to process, and if it exceeds 5 mm, there is too much rigidity and post-processing is difficult.

  With reference to FIG. 6 (b), in the second step of the present invention, after the alcoholic release layer 7 is formed on the fine convex portions 4 formed on the base sheet 1, the production according to the present invention is performed. Move on to the third step of the method.

  The alcoholic release layer 7 is a layer that is released from the base sheet 1 together with the metal thin film layer 2 formed on the alcoholic release layer 7 by the alcohol treatment in the fourth step of the manufacturing method according to the present invention. . With this layer, after the metal thin film layer 2 is formed, the metal thin film layer 2 can be formed only in a region where the alcoholic release layer 7 is not formed by performing an alcohol treatment.

  Examples of the material of the alcoholic release layer 7 include methyl alcohol, ethyl alcohol, isopropyl alcohol, and butyl alcohol. As the alcoholic release layer 78, ink using a water-soluble resin typified by acrylic resin, polyvinyl alcohol, starch, algide, epoxy, polyurethane, etc. as a binder, gravure printing method, flexographic printing method, screen printing method, etc. It may be formed by a printing method.

  Referring to FIG. 6C, in the third step of the present invention, the alcoholic release layer 7 formed on the fine protrusions 4 of the base sheet 1 and the mesh-like fine parts of the base sheet 1 are used. After the metal thin film layer 2 is formed on the recess 5, the process proceeds to the fourth step of the manufacturing method according to the present invention.

  Examples of the method for forming the metal thin film layer 2 include a vacuum deposition method, a sputtering method, an ion plating method, a plating method, and the like. More preferably, a plating method is used. The plating method is a surface treatment method for coating a metal thin film in a solution. In this invention, a metal film is deposited by electrons released by oxidation of a reducing agent contained in the solution. It is preferable to carry out the method by a so-called electroless plating method. Examples of the metal to be deposited include nickel, gold, and tin in addition to copper. When the plating method is used, as long as the base sheet 1 is in contact with the plating solution, the metal thin film layer 2 is formed almost uniformly, so that the metal thin film layer 2 is fine and difficult to form as described above. This is because even a portion (that is, a fine recess 5) can be easily formed.

  Also, depending on the conductivity and electromagnetic wave shielding properties, chemical resistance, etc., metals such as aluminum, tin, nickel, gold, platinum, chromium, iron, copper, indium, silver, titanium, lead, zinc, alloys thereof or A compound may be used. These metals usually have a metallic luster color and do not exhibit transparency, but are formed with a fine mesh pattern at the bottom of the fine recess 5 of the base sheet 1 of the present invention. Will come to present. In addition, it is preferable to form the thickness of the metal thin film layer 2 in the range of 0.01-1 micrometer. If the thickness is less than 0.01 μm, the electrical conductivity and electromagnetic wave shielding property of the metal thin film layer 2 are lowered. On the other hand, if the thickness exceeds 1 μm, the metal thin film layer 2 has a small aspect ratio Y. This is because the metal thin film layer 2 may not be a mesh pattern because the fine convex portions 4 are buried. In the range where the metal thin film layer 2 formed on the fine recess 5 of the base sheet 1 satisfies the above conditions, the transparent conductive sheet 100 is excellent by forming the metal thin film layer 2 from a highly conductive material. It exhibits excellent electrical conductivity or electromagnetic shielding properties.

  Referring to FIG. 6 (d), in the fourth step of the present invention, the alcoholic release layer 7 formed on the fine convex portion 4 of the base sheet 1 and the alcoholic release layer 7 are formed. The metal thin film layer 2 formed in the step is detached from the base sheet 1. And the manufacturing method of the transparent conductive sheet which concerns on this invention is completed.

  The alcohol treatment is a method of completely removing the alcoholic release layer 7 together with the metal thin film layer 2 formed on the release layer by immersing the sheet with the release layer formed in a tank filled with alcohol. is there. By completing this step, the metal thin film layer 2 can be formed only in the fine mesh-shaped concave portions 5 formed on the surface of the base sheet 1.

  FIG. 7 is a diagram showing a schematic process of the second embodiment in the method for manufacturing the transparent conductive sheet 100. Fig.7 (a) is sectional drawing when the coating-film layer 6 is formed on the base sheet 100 used at the 1st process of the manufacturing method concerning this invention. FIG.7 (b) is sectional drawing when the coating-film layer 6 and the stamper S are integrated in the 2nd process of the manufacturing method which concerns on this invention. FIG. 7C is a cross-sectional view when the alcoholic release layer 7 is formed on the fine protrusions 4 of the base sheet 1 in the third step of the manufacturing method according to the present invention. FIG. 7 (d) shows a cross section when the metal thin film layer 2 is formed in the alcoholic release layer 7 and the fine mesh-shaped recess 5 of the base sheet 1 in the third step of the manufacturing method according to the present invention. FIG. FIG. 7E is a cross-sectional view of the metal thin film sheet 100 when the alcoholic release layer 7 and the metal thin film layer 2 formed thereon are removed in the fourth step of the manufacturing method according to the present invention. is there.

  The basic configuration of the method for manufacturing a transparent conductive sheet according to this embodiment is the same as that according to the first embodiment, and therefore only the differences will be described here.

  With reference to Fig.7 (a), after the coating-film layer 6 is formed on the base sheet 1, in the 1st process of this invention, it transfers to the 2nd process of the manufacturing method which concerns on this invention.

  Since the material of the coating layer 6 depends on the method used when providing the fine convex portions 4 and the fine mesh-shaped concave portions 5 on the coating layer 6 in the second step of the manufacturing method according to the present invention, It will be described later. It is preferable that the thickness of the coating layer 6 be at least equal to or less than the depth of the fine recess 5 in the range of 0.2 to 100 μm. If the thickness is less than 0.2 mm, a part that cannot be applied to a part of the surface of the base sheet 1 is formed due to the aggregation of the material of the coating layer 6, so that pinholes are likely to occur, whereas if the thickness exceeds 100 mm This is because it takes time to form the coating layer 6 and the productivity is lowered.

  With reference to FIG.7 (b), in the 2nd process of this invention, the fine convex part and the mesh-shaped fine recessed part 5 are used for the coating-film layer 6 formed on the base sheet 1 using the nanoimprint method. After forming, the process proceeds to the third step of the manufacturing method according to the present invention.

  In the second step of the present invention, in order to form the fine convex portions 4 and the mesh-like fine concave portions 5 in the coating layer 6, the nanoimprint method is any one of a thermal nanoimprint method, a photo nanoimprint method, and a room temperature nanoimprint method. Can be used.

  When the thermal nanoimprint method is used to form the fine convex portions 4 and the mesh-like fine concave portions 5 in the coating layer 6, the material of the coating layer 6 is polycarbonate resin, cycloolefin resin, chlorination. Examples include polypropylene resins, vinyl resins, amide resins, polyester resins, acrylic resins, polyurethane resins, acetal resins, melamine resins, cellulose resins, alkyd resins, etc. It is good to use what added the coloring agent which consists of various additives and a pigment or dye of a suitable color.

  When the optical nanoimprint method is used, the coating layer 6 may be made of a photocurable resin such as a cyanoacrylate resin or a urethane acrylate resin.

  When the room temperature nanoprint method is used, the material of the coating layer 6 is FOL (registered trademark) -12 FLOWABLE OLIDE, FOL (registered trademark) -14 FLOWABLE OLIDE, FOL (registered trademark)-manufactured by Toray Dow Corning Co., Ltd. 15 FLOWABLE OLIDE, FOL (registered trademark) -16 FLOWABLE OLIDE, and mixtures thereof may be used.

  As a method for forming the coating layer 6, in addition to a normal printing method such as an offset printing method, a gravure printing method or a screen printing method, a coating method such as a gravure coating method, a roll coating method, a comma coating method or a lip coating method can be used. It can also be adopted.

  It is preferable that the line width W of the fine mesh-shaped concave portion 5 pattern formed in the coating layer 6 is 0.01 μm to 2 μm. It is technically difficult to make the line width W of the mesh pattern smaller than 0.01 μm. If the line width W of the mesh pattern is 2 μm or more, the mesh pattern may be visible depending on the case, and the transparency This is because there is a possibility of lowering. In the relationship between the fine concave portion 5 and the fine convex portion 4, the width L of the fine convex portion 4 is preferably configured to be not less than 5 times and less than 1000 times the width W of the fine concave portion 5. . When the width L of the fine protrusions 4 is less than 5 times the line width W of the mesh pattern, the color of the metal thin film layer 2 formed in the mesh pattern becomes strong, and the transparent conductive sheet 100 This is because the transparency of the film deteriorates so that it looks dark. On the other hand, if the width L of the fine mesh-shaped convex portion is 1000 times or more the line width W of the fine mesh-shaped concave portion, the surface resistance value per unit area is small, and thus the conductivity becomes high. This is because the electromagnetic wave shielding property of the metal thin film layer 2 is also lowered.

  Referring to FIG. 7 (c), in the third step of the present invention, the alcoholic release layer 7 is formed on the fine convex portion 4 formed on the base sheet 1, and then the production according to the present invention. Move on to the fourth step of the method.

  With reference to FIG. 7 (d), in the fourth step of the present invention, the alcoholic release layer 7 formed on the fine protrusions 4 of the base sheet 1 and the mesh-like fine parts of the base sheet 1 are used. After the metal thin film layer 2 is formed on the recess 5, the process proceeds to the fifth step of the manufacturing method according to the present invention.

  The material and forming method of the metal thin film layer 2 are the same as those in the first embodiment of the manufacturing method according to the present invention.

  Referring to FIG. 7 (e), in the fifth step of the present invention, the alcoholic release layer 7 formed on the fine convex portion 4 of the base sheet 1 and the alcoholic release layer 7 are formed. After the metal thin film layer 2 formed on the substrate sheet 1 is detached from the base sheet 1, the method for manufacturing the transparent conductive sheet 100 according to the present invention is completed.

  FIG. 8 is a diagram showing a schematic process of the third embodiment in the method for manufacturing the transparent conductive sheet 100. FIG. 8A is a cross-sectional view when the base sheet 100 and the stamper S used in the first step of the manufacturing method according to the present invention are integrated. FIG. 8B is a sectional view when the metal thin film layer 2 is formed on the base sheet 1 in the second step of the manufacturing method according to the present invention. FIG. 8C shows a third step of the manufacturing method according to the present invention, which is formed on the fine mesh-like concave portion 5 in the base sheet 1 among the metal thin film layer 2 formed on the base sheet 1. 4 is a cross-sectional view when a resist layer 3 is formed only on the formed metal thin film layer 2. FIG. FIG. 8D is a cross-sectional view after the wet etching process in the fourth step of the manufacturing method according to the present invention.

  The basic configuration of the method for manufacturing a transparent conductive sheet according to this embodiment is the same as that according to the first embodiment, and therefore only the differences will be described here.

  Referring to FIG. 8A, in the first step of the present invention, after the fine convex portions 4 and the fine mesh-shaped concave portions 5 are formed on the base sheet 1, the manufacturing method according to the present invention is performed. Shift to the second step.

  In this first step, instead of forming the fine convex portions 4 and the mesh-like fine concave portions 5 on the base sheet 1, a coating layer is formed on the base sheet, and the surface of the formed coating layer A fine convex portion and a mesh-shaped fine concave portion may be formed.

  With reference to FIG.8 (b), after the metal thin film layer 2 is formed on the base sheet 1, in the 2nd process of this invention, it transfers to the 3rd process of the manufacturing method which concerns on this invention.

  Referring to FIG. 8C, in the third step of the manufacturing method according to the present invention, the resist layer 3 is formed only on the metal thin film layer 2 formed on the fine mesh-shaped recess 5 of the base sheet 1. The process proceeds to the fourth step of the manufacturing method according to the present invention.

  As a method of forming the resist layer 3 only on the metal thin film layer 2 formed on the mesh-like fine recess 5 of the base sheet 1, the resist layer 3 is formed on the entire surface of the metal thin film layer 2. A method of forming and then scraping only the resist layer 3 formed on the fine protrusions 4 with the squeegee A can be mentioned.

  As the material of the resist layer 3, a resin such as an amide resin, a polyester resin, an acrylic resin, a polyurethane resin, a polyvinyl acetal resin, a polyester urethane resin, a cellulose ester resin, or an alkyd resin is used as a binder. An ink containing an additive such as a pigment or a colorant such as a pigment or a dye may be used. The resist layer 3 may be formed by a normal printing method such as an offset printing method, a gravure printing method, a screen printing method, or a method such as wiping or dipping.

 Furthermore, the thickness of the resist layer 3 is preferably 0.1 to 10 μm. That is, when the thickness of the resist layer 3 is less than 0.1 μm, the chemical resistance is insufficient. Therefore, in the third step of the present invention, the metal thin film layer formed in a portion other than the fine convex portion 4 of the metal thin film sheet 100. This is because the problem that the thickness of the resist layer 3 exceeds 10 [mu] m occurs that the productivity in producing the transparent conductive sheet 100 decreases.

  Referring to FIG. 8D, in the fourth step of the manufacturing method according to the present invention, the metal thin film layer 2 formed on the fine convex portions 4 of the base sheet 1 is removed by the wet etching method. The manufacturing method of the transparent conductive sheet 100 according to the present invention is completed.

  The wet etching method is a method of etching a metal with a solution having high reactivity with the metal. In the wet etching method, a metal thin film sheet 100 is immersed in a container filled with a metal etching solution, and a dip type that erodes the exposed metal thin film layer 2. There are a spray type sprayed on 100 and a spin type in which a metal thin film sheet 100 is attached to a turntable called a spinner and a metal etching solution is dropped, but any method is used to protect the metal thin film layer not protected by the resist layer 3 Two sites may be removed. Of these methods, the dip method is more preferable because it can be most easily performed. As the metal etching solution, a weakly acidic or weakly alkaline aqueous solution is used, and the concentration, immersion temperature, and immersion time of the metal etching solution may be appropriately selected depending on the material and thickness of the metal thin film layer 2.

  FIG. 9 is a view showing a schematic process of the fourth embodiment in the method for manufacturing the transparent conductive sheet 100. Fig.9 (a) is sectional drawing when the base sheet 100 and stamper S which are used at the 1st process of the manufacturing method concerning this invention are integrated. FIG. 9B is a cross-sectional view when the plating catalyst layer 8 is formed on the base sheet 1 in the second step of the manufacturing method according to the present invention. FIG. 9C shows a third step of the manufacturing method according to the present invention, wherein the plating catalyst layer 8 formed on the base sheet 1 is formed on the fine projections 4 of the base sheet 1. It is sectional drawing when removing only the plating catalyst layer 8. FIG. FIG. 9D is a cross-sectional view after performing metal plating in the fourth step of the manufacturing method according to the present invention.

  The basic configuration of the method for manufacturing a transparent conductive sheet according to this embodiment is the same as that according to the first embodiment, and therefore only the differences will be described here.

  With reference to FIG. 9A, in the first step of the present invention, after the fine convex portions 4 and the mesh-shaped fine concave portions 5 are formed on the base sheet 1, the manufacturing method according to the present invention is performed. Shift to the second step.

  In this 1st process, instead of forming the fine convex part 4 and the mesh-shaped fine recessed part 5 on the base sheet 1, a coating-film layer is formed on a base sheet, On the surface of the formed coating film You may form a fine convex part and a mesh-shaped fine recessed part.

  Referring to FIG. 9B, in the second step of the present invention, after the plating catalyst layer 8 is formed on the base sheet 1, the process proceeds to the third step of the manufacturing method according to the present invention.

  The plating catalyst layer 8 is a layer that plays a role like an adhesive that connects an object to be plated and a plated metal film. When the plating catalyst layer 8 is immersed in the plating solution, metal ions in the plating solution are reduced on the surface of the plating catalyst layer 8 so that a metal film can be deposited on the portion where the plating catalyst layer 8 is formed. .

  Examples of the material for the plating catalyst layer include a layer obtained by drying an aqueous solution made of a metal salt such as palladium.

  The plating catalyst layer is formed by immersing the substrate sheet 1 in which the plating catalyst layer 8 is formed in an aqueous solution to which an electroless plating catalyst made of a metal salt such as palladium is applied, and then the substrate sheet 1 aqueous solution. It is done by pulling up.

  With reference to FIG. 9C, in the third step of the manufacturing method according to the present invention, among the plating catalyst layers 8 formed on the base sheet 1, the fine protrusions 4 on the base sheet 1 are formed. Only the formed plating catalyst layer 8 is scraped off with the squeegee A and dried, and then the process proceeds to the fourth step of the manufacturing method according to the present invention.

  Referring to FIG. 9 (d), in the fourth step of the manufacturing method according to the present invention, the base sheet 1 obtained in the third step of the present invention is immersed in a plating solution of metal ions, thereby producing the present invention. The manufacturing method of the transparent conductive sheet 100 is completed.

  The metal ion plating solution to be used is composed of a metal salt as a raw material for plating and a reducing agent, and a stabilizer and a buffering agent are appropriately added. For example, in the case of copper ions, copper sulfate is used as the salt.

  Since the manufacturing method of the metal thin film sheet of this invention was comprised as mentioned above, the kind of metal which comprises the metal thin film layer 2 can be selected freely. Therefore, the transparent conductive sheet 100 can be formed even if the metal thin film layer 2 is made of a colored and non-transparent metal or a metal having a metallic luster color. Further, when the metal thin film layer 2 is formed by a plating method, the metal thin film layer 2 can be formed almost uniformly, and the metal thin film layer 2 can be formed in a mesh pattern of a desired shape and size, so that stable conductive performance / electromagnetic wave Shielding performance can also be obtained.

  Finally, the manufacturing method for decorating the resin 12 using the transparent conductive sheet 100 of the present invention and obtaining a decorative molded product will be described.

  FIG. 10 is a sectional view showing a schematic process in the manufacturing method of the present invention. FIG. 10A is a cross-sectional view when the transparent conductive sheet 100 is installed in the molding die 11. FIG. 10B is a cross-sectional view when the resin 12 is injected into the molding die 11 in which the transparent conductive sheet 100 is installed. FIG. 10C is a cross-sectional view when a decorative molded product in which the resin 12 and the transparent conductive sheet 100 are integrated is taken out from the mold.

  With reference to FIG. 10A, in the first step of the present invention, the transparent conductive sheet 100 is fed into a molding die 11 composed of a movable die 9 and a fixed die 10. At that time, the single transparent conductive sheet 100 may be fed one by one, or a necessary portion of the long transparent conductive sheet 100 may be intermittently fed. When using the long transparent electroconductive sheet 100, it is good to use the feeder which has a positioning mechanism so that the pattern of the pattern of the transparent electroconductive sheet 100 and the metal mold | die 11 may correspond. Further, when the transparent conductive sheet 100 is intermittently fed, if the transparent conductive sheet 100 is fixed by the movable mold 9 and the fixed mold 10 after the position of the transparent conductive sheet 100 is detected by a sensor, This is convenient because the transparent conductive sheet 100 can be fixed at the same position at all times, and no pattern displacement occurs.

  Referring to FIG. 10 (b), in the second step of the present invention, after the molding die 11 is closed, the resin 12 is injected and filled into the die from the gate to form the decoration. After the metal thin film sheet 100 is adhered to the surface, the process proceeds to the next step.

  With reference to FIG.10 (c), in the 3rd process in this invention, after cooling the decorative molded product which is to-be-decorated, the metal mold | die 11 for molding is opened, a decorative molded product is taken out, and decorative molding is carried out. All processes related to the manufacturing method of the product are completed.

  In addition, when creating a decorative molded product using the transparent conductive sheet 100 composed of the base sheet 1 having releasability, in the third step, the decorative molded product is taken out from the mold and added. After the base sheet 1 is peeled from the decorative molded product or the decorative molded product is taken out from the mold, the base molded sheet 1 is peeled from the decorative molded product to obtain a transfer molded product.

  In addition, a method for decorating the surface of the transfer object using the metal thin film sheet 100 using a method other than the above will be described.

  First, the adhesive layer 13 of the transparent conductive sheet 100 is adhered to the surface of the transfer object. Next, using a transfer machine such as a roll transfer machine or an up-down transfer machine equipped with a heat-resistant rubber-like elastic body such as silicon rubber, a heat-resistant rubber-like condition set at a temperature of about 80 to 260 ° C. and a pressure of about 490 to 1960 Pa. Heat and pressure are applied from the base sheet 1 side of the transparent conductive sheet 100 through the elastic body. By doing so, the adhesive layer 139 adheres to the surface of the transfer object. Finally, when the base sheet 1 is peeled off after cooling, peeling occurs at the boundary surface between the base sheet 1 and the release layer 5 and transfer is completed.

  As the material to be transferred, those made of various materials such as a resin molded product can be used. The transfer object may be transparent, translucent, or opaque. Further, the transfer object may be colored or not colored. Examples of the resin material include general-purpose resins such as polystyrene resin, polyolefin resin, ABS resin, AS resin, and AN resin. Also, general engineering resins such as polyphenylene oxide / polystyrene resins, polycarbonate resins, polyacetal resins, acrylic resins, polycarbonate-modified polyphenylene ether resins, polybutylene terephthalate resins, ultrahigh molecular weight polyethylene resins, polysulfone resins, polyphenylene sulfide resins Super engineering resins such as polyphenylene oxide resins, polyarylate resins, polyetherimide resins, polyimide resins, liquid crystal polyester resins, and polyallyl heat-resistant resins can also be used. Furthermore, composite resins to which reinforcing materials such as glass fibers and inorganic fillers are added can also be used.

  The present invention will be described more specifically with reference to the following examples and comparative examples, but the present invention is not limited to these examples.

Example 1
A polyester resin film with a thickness of 38 μm was used as a base sheet, and a melamine resin release layer, an acrylic resin release layer, and a urethane resin decoration layer with a thickness of 2 μm were sequentially formed on the base sheet by gravure printing. Thereafter, a nanoimprint mold made of nickel electroforming having a square lattice pattern groove with a width of 100 nm and a pitch of 1 μm formed at a depth of 200 nm is placed, and the surface of the decoration layer is heated to 100 ° C. and heated to 5 MPa. Pressed with pressure, cooled with water and left for 5 minutes, and when the mold was released, a fine convex part consisting of a square island pattern was formed on the surface of the decorative layer, and the fine concave part was formed in a mesh shape. It was.

  Next, the obtained substrate sheet with fine irregularities is immersed in an aqueous solution to which an electroless plating catalyst is applied, and the electroless plating catalyst formed on the fine convex portions is immediately scraped with the squeegee A. After removing and drying, when the above sheet was immersed in an electroless plating solution of copper ions, a metal thin film layer made of copper plating having a thickness of 500 nm was formed in the fine concave portion, but the copper was formed in the fine convex portion. A metal thin film layer made of plating was hardly formed. The obtained metal thin film layer was formed in a fine mesh pattern having a width of 100 nm. An acrylic resin-based adhesive layer is applied on the metal thin film layer by painting to obtain a metal thin film sheet, which is then used to transfer to the surface of the acrylic resin molded product by a simultaneous molding transfer method. Obtained.

  The obtained decorative molded product had conductivity and electromagnetic wave shielding because the metal thin film layer made of copper plating was formed in a mesh pattern. However, since the metal thin film layer is a fine mesh pattern having a width of 100 nm, the metal thin film layer is not visually recognized and has a design that is the same as a conventional molded product with a transparent conductive film. It was a thing. As a result, the obtained decorative molded product could be applied to a transparent antenna.

(Example 2)
From a nickel electroforming in which a polycarbonate resin film having a thickness of 100 μm is used as a base sheet, and grooves of a regular hexagonal honeycomb pattern having a width of 0.05 μm and a side of 0.4 μm are formed on the base sheet at a depth of 0.08 μm When the nanoimprint mold is placed, pressed at a pressure of 10 MPa under heating at 120 ° C., cooled with water and left for 10 minutes, the mold is released, and the fine projections of the honeycomb pattern are formed on the substrate sheet surface. The fine concave portions were formed in a mesh shape.

  Next, an aqueous solution to which an electroless plating catalyst has been applied after a release resist layer made of an acrylic resin having a thickness of 0.5 μm is formed on the fine convex portions of the obtained base sheet with fine irregularities by gravure printing After being immersed in and dried, the release resist layer is removed with an organic solvent together with the electroless plating catalyst attached thereto, and immersed in an electroless plating solution of silver ions. A metal thin film layer made of silver plating was formed, but a metal thin film layer made of silver plating was hardly formed on the fine protrusions. The obtained metal thin film layer was formed in a fine mesh pattern having a width of 0.05 μm. After applying an acrylic resin-based adhesive layer on this metal thin film layer by painting to obtain a metal thin film sheet, this is used to adhere to the surface of the acrylic resin molded product by the simultaneous molding insert method. Obtained.

  The obtained decorative molded product had conductivity and electromagnetic shielding properties. In addition, despite the fact that the metal thin film layer is formed of a silver plating film, the line width is very small, so the appearance is sufficiently transparent to be the same as a molded product with a transparent conductive film. It was equipped with. As a result, the conductive portion of the decorative molded product could function as a transparent capacitance switch. It was also applicable to designs that require an illumination function such as a display window.

(Example 3, Example 4)
Example 1 was the same as Example 1 except that the fine recesses were formed into a square lattice pattern having a depth of 0.5 μm, a width of 2 μm, and a pitch of 12 μm by cutting using a precision NC machine tool. Moreover, it carried out similarly to Example 2 except forming a fine recessed part by irradiation of an electron beam. In Example 3 and Example 4, the same results as in Example 1 and Example 2 were obtained, respectively.

  INDUSTRIAL APPLICABILITY The present invention can be suitably used in various molded products such as communication devices such as mobile phones, information devices inside automobiles, and home appliances and is industrially useful.

It is a perspective view which shows one Example of the transparent conductive sheet which concerns on this invention. It is sectional drawing which shows one Example of the transparent conductive sheet which concerns on this invention. It is sectional drawing which shows one Example of the transparent conductive sheet which concerns on this invention. It is a top view which shows one Example of the transparent conductive sheet which concerns on this invention. It is sectional drawing which shows one Example of the transparent conductive sheet which concerns on this invention. It is sectional drawing which shows one Example of the manufacturing method of the transparent conductive sheet which concerns on this invention. It is sectional drawing which shows one Example of the manufacturing method of the transparent conductive sheet which concerns on this invention. It is sectional drawing which shows one Example of the manufacturing method of the transparent conductive sheet which concerns on this invention. It is sectional drawing which shows one Example of the manufacturing method of the transparent conductive sheet which concerns on this invention. It is sectional drawing which shows one Example of the manufacturing method of the decorative molded product using the transparent conductive sheet which concerns on this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Base sheet 2 Metal thin film layer 3 Resist layer 4 Fine convex part 5 Fine concave part 6 Coating layer 7 Alcoholic detachment layer 8 Plating catalyst layer 9 Movable mold 10 Fixed mold 11 Molding mold 12 Resin 100 Transparent conductivity Sheet stamper 101 Decorative molded product A Squeegee H Depth of fine recess S Stamper L Fine protrusion width Y Aspect ratio W Fine recess line width

Claims (9)

A first step of forming a large number of fine concave portions and fine convex portions on a part or all of the surface of the base sheet using the nanoimprint method, and forming an alcoholic release layer on the fine convex portions A second step and a third step of forming a metal thin film layer on the fine concave portion and the fine convex portion.
And a fourth step of removing and removing the alcoholic release layer formed on the fine protrusions and the metal thin film layer by alcohol treatment, whereby the metal thin film layer has a fine mesh shape. A method for producing a transparent conductive sheet, characterized in that is formed.
A first step of forming a large number of fine concave portions and fine convex portions on a part or all of the surface of the coating layer formed on the substrate sheet using the nanoimprint method; A second step of forming an alcoholic release layer, a third step of forming a metal thin film layer on the fine recesses and the fine projections, and the above-described steps formed on the fine projections. A method for producing a transparent conductive sheet, comprising: an alcoholic release layer; and a fourth step of peeling and removing the metal thin film layer by alcohol treatment, whereby the metal thin film layer forms a fine mesh shape. A first step of forming a large number of fine concave portions and fine convex portions in a part or all of the surface of the base sheet using a nanoimprint method; and a metal thin film layer on the fine concave portions and the fine convex portions. A second step of forming a resist layer, a third step of forming a resist layer on the previous metal thin film layer formed on the fine concave portion, and the metal thin film layer formed on the fine convex portion. And a fourth step of removing the substrate by wet etching, whereby the metal thin film layer forms a fine mesh shape.
A first step of forming a large number of fine concave portions and fine convex portions in a part or all of the surface of the coating film layer formed on the substrate sheet by using a nanoimprint method; and the fine concave portions and the fine portions A second step of forming a metal thin film layer on the convex portion, a third step of forming a resist layer on the metal thin film layer formed on the fine concave portion, and a step of forming the fine convex portion. And a fourth step of removing the metal thin film layer formed thereon by a wet etching method, whereby the metal thin film layer forms a fine mesh shape. A first step of forming a large number of fine concave portions and fine convex portions in a part or all of the surface of the base sheet using a nanoimprint method; and the entire surface on the fine concave portions and the fine convex portions. A second step of forming a plating catalyst layer, a third step of removing the plating catalyst layer formed on the fine protrusions, and a fourth step of forming a metal thin film layer on the plating catalyst layer. A method for producing a transparent conductive sheet, characterized in that the metal thin film layer forms a fine mesh shape by being provided.
A first step of forming a large number of fine concave portions and fine convex portions on a part or all of the surface of the coating layer formed on the base sheet using the nanoimprint method; and the fine concave portions and the fine portions A second step of forming a plating catalyst layer on the entire convex portion, a third step of removing the plating catalyst layer formed on the fine convex portion, and a metal thin film layer on the plating catalyst layer Forming a fine mesh shape of the metal thin film layer by providing a fourth step of forming a transparent conductive sheet.
The transparent conductive sheet according to any one of claims 1 to 6, wherein the line width of the mesh pattern is present at intervals of 0.01 µm to 2 µm, and the aspect ratio of the fine protrusions is 0.01 to 5. Production method.
The method for producing a transparent conductive sheet according to any one of claims 1 to 7, wherein a distance between lines of the mesh pattern is 5 times or more and less than 1000 times the line width of the mesh pattern.
The method for producing a transparent conductive sheet according to claim 1, wherein the metal thin film layer is formed by a plating method.

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