JP4924055B2 - Manufacturing method of multilayer ceramic substrate - Google Patents

Manufacturing method of multilayer ceramic substrate Download PDF

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JP4924055B2
JP4924055B2 JP2007013322A JP2007013322A JP4924055B2 JP 4924055 B2 JP4924055 B2 JP 4924055B2 JP 2007013322 A JP2007013322 A JP 2007013322A JP 2007013322 A JP2007013322 A JP 2007013322A JP 4924055 B2 JP4924055 B2 JP 4924055B2
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green sheet
multilayer ceramic
hole
ceramic substrate
manufacturing
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JP2008182000A5 (en
JP2008182000A (en
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一郎 亀山
賢一 松島
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Panasonic Corp
Panasonic Holdings Corp
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Panasonic Corp
Matsushita Electric Industrial Co Ltd
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Description

本発明は、積層型セラミックフィルタ等に用いられる多層セラミック基板の製造方法に関する。   The present invention relates to a method for manufacturing a multilayer ceramic substrate used for a multilayer ceramic filter or the like.

一般にこの種の多層セラミック基板の製造方法としては、グリーンシートにビアホールや内部電極を適宜印刷し、それらを所定の順序で積み重ねて積層体を形成し、この積層体の両主面を先のグリーンシートの焼成温度では焼結しない未焼結誘電体層で挟み込み、これらを密着させた状態で前記グリーンシートの焼結条件で焼成した後に、この焼結体から前記未焼結誘電体層を除去させて平坦度の高い多層セラミック基板を作成する方法が知られている。   In general, as a method of manufacturing this type of multilayer ceramic substrate, via holes and internal electrodes are appropriately printed on a green sheet, and they are stacked in a predetermined order to form a laminated body. The green dielectric sheet is sandwiched between non-sintered dielectric layers that are not sintered at the firing temperature of the sheet, and after firing under the green sheet sintering conditions, the green dielectric sheets are removed from the sintered body. A method for producing a multilayer ceramic substrate with high flatness is known.

そして、グリーンシートにビアホールを形成するにあたっては、ビアホールを形成する貫通孔を有するグリーンシートを吸引台上に和紙などの多孔質シートを介して配置し、貫通孔内を多孔質シート越しに吸引しながら電極ペーストを充填させていた。   Then, when forming a via hole in the green sheet, a green sheet having a through hole for forming the via hole is arranged on a suction table via a porous sheet such as Japanese paper, and the inside of the through hole is sucked through the porous sheet. However, the electrode paste was filled.

なお、この出願の発明に関する先行技術文献情報としては、例えば、特許文献１が知られている。
特開平３−６４０９４号公報 As prior art document information relating to the invention of this application, for example, Patent Document 1 is known.
Japanese Patent Laid-Open No. 3-64094

そして、電子部品の小型化が進むなか積層型セラミックフィルタなどにおいても、積層体の表面に露出したビアホールの端面に直接ハンダバンプを接続するＢＧＡ（ボールグリッドアレイ）実装形態が検討されている。   With the progress of miniaturization of electronic components, a BGA (ball grid array) mounting form in which solder bumps are directly connected to the end faces of via holes exposed on the surface of the multilayer body is also being studied in multilayer ceramic filters and the like.

しかしながら、先に述べたように、電極ペーストを多孔質シート越しに吸引しながら貫通孔内に充填させた場合、多孔質シートとグリーンシートの境界面すなわち、ビアホールの端面周辺に電極ペーストが滲んでしまい、ハンダバンプが接続される接続面積が変動してしまうため、ハンダバンプの高さなどが不安定なものとなってしまうため、多層セラミック基板を用いた電子部品の実装性を安定させることが困難なものとなっていた。   However, as described above, when the electrode paste is filled into the through-hole while sucking through the porous sheet, the electrode paste spreads around the boundary surface between the porous sheet and the green sheet, that is, around the end surface of the via hole. Therefore, since the connection area to which the solder bump is connected varies, the height of the solder bump becomes unstable, and it is difficult to stabilize the mountability of the electronic component using the multilayer ceramic substrate. It was a thing.

そこで、本発明はこのような問題を解決し実装性の高い多層セラミック基板の製造方法を提供するものである。   Accordingly, the present invention provides a method for manufacturing a multilayer ceramic substrate that solves such problems and has high mountability.

この目的を達成するために本発明は、積層体の表面に露出するビアホールを形成するにあたり、ビアホールを形成する貫通孔を有するグリーンシートに未焼結誘電体層を密着させ、この未焼結誘電体層側から貫通孔内を吸引しながら電極ペーストを充填させてビアホールを形成し、この未焼結誘電体層と一体となったグリーンシートを積層体に積み重ね焼成した後に積層体から未焼結誘電体層を除去させたのである。   In order to achieve this object, in the present invention, when forming a via hole exposed on the surface of a laminate, an unsintered dielectric layer is brought into close contact with a green sheet having a through hole for forming a via hole. Via holes are formed by filling the electrode paste while sucking through the through-holes from the body layer side, and the green sheets integrated with the unsintered dielectric layers are stacked and fired on the laminate, and then unsintered from the laminate The dielectric layer was removed.

本発明の多層セラミック基板の製造方法によれば、実装性の高い多層セラミック基板の製造方法を提供することが出来るのである。   According to the method for producing a multilayer ceramic substrate of the present invention, it is possible to provide a method for producing a multilayer ceramic substrate with high mountability.

以下、本発明の一実施の形態について図を用いて説明する。   Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

図１は多層セラミック基板を用いた積層型セラミックフィルタ１を示したものであり、その構成は誘電体セラミックからなる積層体２の内層にストリップラインやコンデンサなどの高周波回路を形成する内部電極３およびビアホール４を有している。また、積層体２の実装面においては図２に示されるごとく積層体２の表面に露出したビアホール４に外部接続用のハンダバンプ５が接続された構成となっている。   FIG. 1 shows a multilayer ceramic filter 1 using a multilayer ceramic substrate, and the structure thereof is an internal electrode 3 for forming a high-frequency circuit such as a strip line or a capacitor on the inner layer of a multilayer body 2 made of dielectric ceramics. A via hole 4 is provided. Further, as shown in FIG. 2, the mounting surface of the laminated body 2 has a configuration in which solder bumps 5 for external connection are connected to the via holes 4 exposed on the surface of the laminated body 2.

なお、内部電極３やビアホール４はＡｇ系の電極で形成されており、積層体２を形成するセラミック材料はこのＡｇ系の電極と同時焼成できるように、セラミック材料にガラス材料を添加し８００℃〜１０００℃で焼結可能な低温焼結セラミック（ＬＴＣＣ）材料を用いている。また、積層体２の表面に露出してハンダバンプ５が接続されるビアホール４の端面にはハンダバンプ５を接続するためＮｉ、Ａｕのメッキ層（特に図示せず）が設けられている。   The internal electrodes 3 and the via holes 4 are formed of Ag-based electrodes, and a glass material is added to the ceramic material at 800 ° C. so that the ceramic material forming the laminated body 2 can be fired simultaneously with the Ag-based electrodes. A low temperature sintered ceramic (LTCC) material that can be sintered at ˜1000 ° C. is used. Further, Ni and Au plating layers (not shown) are provided on the end faces of the via holes 4 exposed on the surface of the laminate 2 and connected to the solder bumps 5 in order to connect the solder bumps 5.

そして、このような積層型セラミックフィルタを成形するにおいては、図３に示すように、先ず、未焼結状態にあるグリーンシート６に内部電極３やビアホール４を適宜形成したものを所定の順序で積み重ね積層体２を形成し、この積層体２の上下両主面をグリーンシート６の焼成条件では焼結しない未焼結誘電体層８で挟み込み、この状態で焼成することにより高い平坦度を有する多層セラミック基板を形成し、その後積層体２の表面に配置された未焼結誘電体層８をウェットブラスト等で除去し、この露出したビアホール４の端面にＮＩ、Ａｕのメッキ処理を施し、その表面にハンダペーストを印刷しリフロー処理によりハンダバンプ５を形成するのである。   In forming such a multilayer ceramic filter, as shown in FIG. 3, first, a green sheet 6 in an unsintered state, in which internal electrodes 3 and via holes 4 are appropriately formed, is formed in a predetermined order. A stacked laminate 2 is formed, and both upper and lower main surfaces of the laminate 2 are sandwiched between unsintered dielectric layers 8 that are not sintered under the firing conditions of the green sheet 6, and are fired in this state to have high flatness. A multilayer ceramic substrate is formed, and then the unsintered dielectric layer 8 disposed on the surface of the multilayer body 2 is removed by wet blasting or the like, and the exposed end surfaces of the via holes 4 are plated with NI and Au. Solder paste is printed on the surface and solder bumps 5 are formed by a reflow process.

ここで、この一実施形態においては、端面が露出したビアホール４を有する積層体２の最外層を形成するグリーンシート６を形成するにあたり、図４に示すようにグリーンシート６にビアホール４を形成するための貫通孔７を形成し、この貫通孔７を有するグリーンシート６に先に述べた未焼結誘電体層８を密着させ、この状態で印刷用の吸引台９に載置し、矢印で示すごとくグリーンシート６を吸引しながら印刷マスク１０上からスキージでもってＡｇ系の電極ペースト１１を印刷している。   Here, in this embodiment, when forming the green sheet 6 that forms the outermost layer of the laminate 2 having the via hole 4 with the end face exposed, the via hole 4 is formed in the green sheet 6 as shown in FIG. Through-hole 7 is formed, green sheet 6 having this through-hole 7 is brought into intimate contact with unsintered dielectric layer 8 described above, placed in this state on suction table 9 for printing, As shown, the Ag-based electrode paste 11 is printed with a squeegee from the print mask 10 while sucking the green sheet 6.

すなわち、グリーンシート６はセラミック材料に焼結温度を下げるためのガラスを添加したものであるのに対して、未焼結誘電体層８の材料はグリーンシート６とほぼ同様の材料からガラス成分を排除し焼結温度を高めたものであるため、未焼結誘電体層８は電極ペースト１１の吸引に用いていた和紙などに比べグリーンシート６と同系材料であり、グリーンシート６との密着性が高く空気透過性も併せ持つので、印刷用の吸引台９からグリーンシート６を吸引することにより、ビアホール４を形成する貫通孔７内も吸引された状態となり、そこに電極ペースト１１が印刷されることで、貫通孔７内に十分に電極ペースト１１が充填されるとともに、未焼結誘電体層８とグリーンシート６との密着性が高いことからその周辺への滲みが抑制されるのである。   That is, the green sheet 6 is made by adding glass for lowering the sintering temperature to a ceramic material, whereas the material of the unsintered dielectric layer 8 is made of a material similar to that of the green sheet 6 from a glass component. Since it is eliminated and the sintering temperature is increased, the unsintered dielectric layer 8 is the same material as the green sheet 6 compared to the Japanese paper used for suction of the electrode paste 11, and the adhesion with the green sheet 6 Since the green sheet 6 is sucked from the printing suction stand 9, the inside of the through hole 7 forming the via hole 4 is also sucked, and the electrode paste 11 is printed there. As a result, the electrode paste 11 is sufficiently filled in the through-hole 7 and the adhesion between the unsintered dielectric layer 8 and the green sheet 6 is high, so that bleeding to the periphery thereof is suppressed. It's that.

その結果として、ハンダバンプ５を接続する部分となるビアホール４の露出面の滲みが抑制され、その接続面積が安定するので、ハンダバンプ５を形成するための定量の電極ペースト１１を付与した場合のハンダバンプ５の高さを一定なものとでき、多層セラミック基板の実装性を高めることが出来るのである。   As a result, bleeding of the exposed surface of the via hole 4 which is a portion to which the solder bump 5 is connected is suppressed and the connection area is stabilized. Therefore, the solder bump 5 when the fixed amount of electrode paste 11 for forming the solder bump 5 is applied. Therefore, the mounting property of the multilayer ceramic substrate can be improved.

なお、この一実施形態においては多層セラミック基板を用いた電子部品の一例として積層型セラミックフィルタを挙げて説明したが、本発明はこの実施形態に限定されるものではなく、表面にビアホール４が露出した多層セラミック基板において同様の作用効果を奏するものである。   In this embodiment, a multilayer ceramic filter has been described as an example of an electronic component using a multilayer ceramic substrate. However, the present invention is not limited to this embodiment, and the via hole 4 is exposed on the surface. The multi-layer ceramic substrate exhibits the same function and effect.

本発明に係る多層セラミック基板の製造方法は、実装性の高い多層セラミック基板を提供できるという効果を有し、実装精度が要求される多層セラミック基板に有用となるものである。   The method for producing a multilayer ceramic substrate according to the present invention has an effect of providing a multilayer ceramic substrate with high mountability, and is useful for a multilayer ceramic substrate that requires mounting accuracy.

本発明の一実施の形態の積層型セラミックフィルタの分解斜視図1 is an exploded perspective view of a multilayer ceramic filter according to an embodiment of the present invention. 同積層型セラミックフィルタの断面図Cross-sectional view of the same multilayer ceramic filter 同積層型セラミックフィルタの製造工程を示す模式図Schematic showing the manufacturing process of the same multilayer ceramic filter 同製造方法のビアホール形成工程を示す模式図Schematic diagram showing the via hole formation process of the manufacturing method

符号の説明Explanation of symbols

２ 積層体
３ 内部電極
４ ビアホール
６ グリーンシート
７ 貫通孔
８ 未焼結誘電体層
１１ 電極ペースト 2 Laminated body 3 Internal electrode 4 Via hole 6 Green sheet 7 Through hole 8 Unsintered dielectric layer 11 Electrode paste

Claims (1)

所定の内部電極やビアホールを有するグリーンシートを適宜積み重ねた積層体を焼成して得られる多層セラミック基板の製造方法であって、前記積層体の上下両主面の少なくとも一方のグリーンシートには前記ビアホールを形成するための貫通孔を有し、前記貫通孔に前記ビアホールを形成する電極ペーストを充填させるにあたり、前記貫通孔を有するグリーンシートに、前記貫通孔を有するグリーンシートよりも空気透過性がある貫通孔を有さない第２のグリーンシートを密着させ、前記第２のグリーンシート側から前記貫通孔内を吸引しながら前記電極ペーストを充填させた後、前記第２のグリーンシートを剥離し、このビアホールを形成した前記グリーンシートと他のグリーンシートを積み重ねたことを特徴とする多層セラミック基板の製造方法。 A method of manufacturing a multilayer ceramic substrate obtained by firing a laminate in which green sheets having predetermined internal electrodes and via holes are appropriately stacked, wherein the via holes are provided on at least one of the upper and lower main surfaces of the laminate. When the electrode paste for forming the via hole is filled in the through hole, the green sheet having the through hole is more air permeable than the green sheet having the through hole. Adhering a second green sheet having no through-hole, filling the electrode paste while sucking the inside of the through-hole from the second green sheet side, and then peeling the second green sheet, A multilayer ceramic substrate characterized by stacking the green sheet on which the via hole is formed and another green sheet. Manufacturing method.
JP2007013322A 2007-01-24 2007-01-24 Manufacturing method of multilayer ceramic substrate Expired - Fee Related JP4924055B2 (en)

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JPH05191051A (en) * 1992-01-17 1993-07-30 Murata Mfg Co Ltd Manufacture of ceramic multilayer electronic component
JPH10242324A (en) * 1997-02-25 1998-09-11 Sumitomo Metal Mining Co Ltd Electrode-built-in ceramic substrate and manufacture thereof
JP4029408B2 (en) * 2004-12-17 2008-01-09 日立金属株式会社 Method for producing hard-to-sinter restraint green sheet and multilayer ceramic substrate

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