JP4920473B2 - Optical component mounting method and apparatus - Google Patents

Description

  The present invention relates to a method and an apparatus for assembling and mounting an optical component (for example, an optical connector) for efficiently coupling light emitted from a light emitting element such as a semiconductor laser to an optical fiber, and in particular, connecting a lead wire of the light emitting element to a driving power source. The present invention relates to a mounting method and apparatus for adjusting the position of a light-emitting element by causing the light-emitting element to emit light without being emitted.

As shown in FIG. 1, the conventional assembly of optical components is performed by connecting the lead wire 2 of the light-emitting element 1 to the drive power supply 4 through the electrical connection means 3 (for example, a connector) and emitting light by the current from the drive power supply 4. Element 1 emits light.
The outgoing light emitted from the light emitting point 1A (for example, a semiconductor laser) is condensed at the condensing point 5 by the condensing lens 1B integrated with the light emitting element 1. A ferrule 7 is provided at the tip of the optical fiber 6 to be optically coupled, and is inserted into a housing (also referred to as a receptacle) 8. The housing 8 is held by housing fixing means 9. The laser light that has entered the optical fiber 6 from the tip of the ferrule 7 enters the photodetector 10, and the light intensity is monitored by the light intensity measuring means 11.
The position adjusting unit 12 has a function of moving the position of the light emitting element 1 in two dimensions of XY (horizontal axis) or three dimensions of XYZ, and is controlled manually or electrically. Japanese Patent Application Laid-Open No. H10-228688 discloses a device that automatically controls the position adjusting unit based on the output of the light intensity measuring unit 11.

FIG. 2 is a diagram showing a conventional procedure for assembling and mounting optical components, which will be described with reference to the drawings.
Procedure 1) The lead wire 2 of the light emitting element 1 is inserted into the connector of the electrical connection means 3.
Procedure 2) A UV adhesive 13 is applied around the light emitting element 1.
Procedure 3) The housing 8 in which the ferrule 7 is inserted is fixed to the housing fixing means 9.
Procedure 4) A current is passed from the driving power source 4 to the light emitting element 1 to cause the light emitting element 1 to emit light, and the light intensity measuring means 11 monitors the light intensity incident on the optical fiber. At this time, the position of the light-emitting element 1 collected by the condenser lens 1B and the position of the tip (core center position) of the optical fiber 6 are usually greatly shifted due to the mechanical processing accuracy of each member, and the incident light is extremely It is weak.
Procedure 5) The position of the light emitting element 1 is adjusted by the position adjusting means 12, and the position where the monitored light intensity is maximized (the light condensing point 5 of the light from the light emitting element 1 and the position of the tip of the fiber completely match). Point).
Procedure 6) The UV adhesive 13 is irradiated with UV light from a UV lamp to cure the light emitting element 1 and the housing 8.
Procedure 7) The ferrule 7 is removed from the housing 8, and the light emitting device 1 fixed to the housing 8 is removed from the housing fixing means 9. Thus, one optical component is completed.

However, the mounting method as described above has the following problems. That is, first, since a light emitting element such as a semiconductor laser is usually extremely sensitive to static electricity, when inserting a lead wire of the light emitting element into a connector, a portion (human body, holder, etc.) holding the light emitting element It is a problem that it may break down due to static electricity or potential difference between electrical contact parts. Although this destruction sometimes occurs on the spot, it does not lead to destruction on the spot and often remains in the form of damage to the inside of the semiconductor. In this case, since it gradually deteriorates and becomes defective in the actual use state after the product is shipped, it becomes a big problem. Secondly, since the lead wire of the light emitting element is a thin brass wire of about 0.5 mmφ, the position fixing accuracy when inserting it into the connector is extremely poor, and there is a problem that it takes time to insert it manually. Therefore, there is a problem that it is difficult to automate the mounting and assembly.
On the other hand, semiconductor surface-emitting lasers (VCSELs) used as light-emitting elements also vary in the position of the light emitting point due to their characteristics, and the appearance is based on the electrode and chip outline when die-bonding the semiconductor laser (chip) to the stem. Even if the above centering is performed, the light emitting point is not always the center of the electrode or the outer shape of the chip. In addition, conventionally, since the light emitting element is caused to emit light by current driving to perform alignment, it is necessary to wire bond the lead wire to the chip, and alignment cannot be performed at the time of die bonding of the chip. This is a cause that the position adjustment range when the light emitting element is fixed to the housing cannot be narrowed, and is an impediment to shortening the optical axis adjustment (alignment) time.
JP 2003-329896 A

The present invention has been made in view of the problems of the prior art, and in the process of assembling and mounting the optical component by fixing the light emitting element to the housing, without connecting the lead wire of the light emitting element to the driving power source. An optical component mounting method and apparatus that solves the problems of static electricity destruction when inserting a lead wire as described above into the connector and reduction in work efficiency during insertion by enabling light emission and mounting assembly can be automated. It is intended to provide.
Also, in order to shorten the alignment time of the optical component, there is also a method and apparatus for performing die bonding after positioning the light emitting point of the semiconductor laser to be located at the center of the light emitting element when the light emitting element itself is assembled. It is intended to be provided together.

  In order to solve the above problems, the present invention fixes the light emitting element to the light emitting element holding means in an alignment method in an assembly process of an optical component comprising a light emitting element including a condensing lens, a semiconductor laser, and a housing. A step of loosely inserting the light emitting element into the housing, a step of fixing the housing to the housing fixing means, and an excitation light having a wavelength that is not longer than the laser light emitted from the semiconductor laser via an optical fiber. The step of irradiating the semiconductor laser through a condenser lens, and taking in the fluorescence or laser light generated by optical excitation by the excitation light through the optical fiber, the light intensity of the generated fluorescence or laser light as the light intensity The step of monitoring with a measuring means, and the light emission so as to maximize the light intensity. The step of adjusting the position by moving the position of the child holding means in two dimensions or three dimensions, and the step of performing a process of fixing the light emitting element to the housing after completion of the position adjustment are provided. .

  According to another aspect of the present invention for solving the above problem, in the alignment method in the assembly mounting process of an optical component including a light emitting element including a condenser lens, a semiconductor laser, and a housing, the light emitting element is a light emitting element. A step of fixing to the holding means, a step of loosely inserting the light emitting element into the housing, a step of fixing the housing to the housing fixing means, and an excitation light having a wavelength not longer than the laser light emitted from the semiconductor laser. A step of irradiating the semiconductor laser through a condensing lens, and capturing fluorescence or laser light generated by optical excitation by the excitation light, and monitoring the light intensity of the generated fluorescence or laser light with a light intensity measuring means. And the position of the light emitting element holding means is two-dimensionally young so as to maximize the light intensity. A step of adjusting the position by moving in three dimensions, and a step of performing a process of fixing the light emitting element to the housing after completion of the position adjustment, and an emission optical path of the excitation light and the generated light An optical system in which an incident optical path of fluorescence or laser light forms a confocal point is provided. That is, it is a method performed without using an optical fiber.

  Furthermore, the present invention is a method for performing die bonding after positioning the light emitting point of the semiconductor laser to be a predetermined position of the stem when the light emitting element itself is assembled in order to shorten the alignment time of the optical component. For this purpose, in the alignment method in the assembly and mounting process of the light emitting element in which the semiconductor laser chip is die-bonded to the stem, the stem of the light emitting element is fixed to the light emitting element holding means. A step of detecting a reference position of the stem from a position marker provided on the stem or a structural feature point of the stem by a position detection means; and referring to the reference position, the center of the stem is set to a predetermined position. A step of moving the chip, and the chip is gripped by a chip gripping means. A step of irradiating the chip with excitation light, and taking in the fluorescence or laser light generated by the light excitation by the excitation light, and monitoring the light intensity of the generated fluorescence or laser light with a light intensity measuring means A step of detecting the light emitting point of the chip by moving the position of the chip by the chip gripping means so that the light intensity is maximized; and a predetermined light emitting point of the detected chip and a predetermined of the stem And a step of fixing the chip to the stem to complete die bonding, and the exit light path of the excitation light and the incident light path of the generated fluorescence or laser light are confocal. An optical system is provided.

  In order to solve the above problems, the present invention provides an alignment apparatus in an assembly mounting process of an optical component including a light-emitting element including a condenser lens, a semiconductor laser, and a housing, and the alignment apparatus holds the light-emitting element. A light emitting element holding means, a housing fixing means for fixing the housing in which the light emitting element is loosely inserted, and an excitation light having a wavelength not longer than that of the laser light emitted from the semiconductor laser through the condenser lens to the semiconductor laser. An excitation light source device for irradiating; an optical fiber that introduces the excitation light into the semiconductor laser; and fluorescence or laser light generated by optical excitation by the excitation light when the excitation light and the fluorescence are taken in via the optical fiber Or a light separating means for separating the laser light, and light for measuring the light intensity of the captured fluorescence or laser light A degree measuring means, the light intensity is characterized by comprising a position adjusting means for adjusting is moved in two-dimensional or three-dimensional position of the light emitting element holder so that the maximum.

  Another aspect of the apparatus according to the present invention for solving the above-described problem is an alignment apparatus in an alignment mounting process of an optical component including a condensing lens, a light emitting element including a semiconductor laser, and a housing. The apparatus includes: a light emitting element holding unit that holds the light emitting element; a housing fixing unit that fixes the housing in which the light emitting element is loosely inserted; and an excitation light having a wavelength that is not longer than a laser beam emitted from the semiconductor laser. An excitation light source device that irradiates the semiconductor laser through a condenser lens, an emission optical path of the excitation light, and an incident optical path of fluorescence or laser light generated by the semiconductor laser by being optically excited by the excitation light are confocal. And separating the excitation light and the fluorescence or laser light when capturing the generated fluorescence or laser light through the optical system. A light separating means, a light intensity measuring means for measuring the light intensity of the captured fluorescence or laser light, and a position of the light emitting element holding means is moved in two dimensions or three dimensions so that the light intensity becomes maximum. And a position adjusting means for adjusting the position.

  Furthermore, in order to shorten the alignment time of the optical component, the present invention performs die bonding after positioning the light emitting point of the semiconductor laser at a predetermined position of the stem when assembling the light emitting element itself. The alignment device in the assembly and mounting process of the light-emitting element in which the semiconductor laser chip is die-bonded to the stem is provided. The alignment apparatus includes a stem of the light-emitting element. A light emitting element holding means for holding; position detecting means for detecting a reference position of the stem from a position marker provided on the stem or a structural feature point of the stem; and the light emission at the center of the stem based on the reference position Position adjusting means for moving the element to a predetermined position; and pumping light having a wavelength not longer than that of the laser beam emitted from the semiconductor laser. An excitation light source device that irradiates the laser, an emission optical path of the excitation light, and an optical system in which an incident optical path of fluorescence or laser light generated in the semiconductor laser by being optically excited by the excitation light is confocal, A light separation means for separating the excitation light and the fluorescence or laser light when the generated fluorescence or laser light is captured via the optical system; and a light intensity for measuring the light intensity of the captured fluorescence or laser light. It is characterized by comprising measuring means and chip gripping means for detecting the chip light emission point by gripping the chip and moving the position of the chip so as to maximize the light intensity.

According to the method and the apparatus of the present invention, since it is not necessary to electrically connect the lead wire of the light emitting element, it is not affected by static electricity or a potential difference at the time of electrical connection, and the reliability of the light emitting element is improved. Improve dramatically. In addition, since it is not necessary to insert the lead wire into the connector, fixing to the light emitting element holding means can be performed in a short time, and automatic mounting by a robot or the like can be easily realized.
Furthermore, according to the alignment method and apparatus for die bonding of a semiconductor chip according to the present invention, the position adjustment range when assembling and mounting optical components can be narrowed, and the optical axis adjustment time can be greatly shortened. Furthermore, since the exit light path of the excitation light and the incident light path from the light emitting element constitute a confocal optical system, the focus position adjustment accuracy is dramatically improved (about 1.4 times).

The present invention utilizes the fact that a semiconductor laser is not oscillated by a conventional current drive and laser light is extracted, but the semiconductor is irradiated with light such as laser light, and the semiconductor is optically pumped to cause laser oscillation. It is what. For this reason, it is not necessary to connect the light emitting element to the driving power source, and alignment can be performed without inserting the lead wire into the connector.
Hereinafter, it will be described in detail with reference to the drawings.

(Optical component mounting method)
This relates to a mounting method for manufacturing an optical component (such as an optical connector) by fixing a light emitting element (for example, a surface emitting laser: VCSEL) to a housing. This will be described in detail with reference to FIG.
(Step 1) The light emitting element 1 is mounted and fixed on the light emitting element holding means 14 (electrical connection is not performed, and the flange portion of the stem of the light emitting element 1 is held and held). Preferably, the lead wire 2 is inserted into a conductive sponge or the like to be protected from static electricity.
(Step 2) A UV adhesive 13 is applied to the periphery of the light-emitting element 1, and the housing 8 is placed over and fitted.
(Step 3) The housing 8 is fixed to the housing fixing means 9, and the ferrule 7 with the optical fiber 6 inserted through the central axis thereof is inserted into the housing.
(Step 4) The excitation light source device 15 that emits laser light is operated, and the laser light is emitted from the fiber end toward the light emitting element 1 through the optical fiber 6.
The emission wavelength of the excitation light source device 15 is the same as or shorter than the oscillation wavelength of the light emitting element 1. In this example, the wavelength of the light emitting element was 850 nm, and the wavelength of the excitation light was 630 nm.
(Step 5) When excitation light is incident on the light emitting element 1, the active layer of the light emitting element 1 is excited to emit fluorescence. If the excitation intensity is sufficiently high, the light-emitting element 1 enters the optically excited laser oscillation state without passing an electric current, and emits laser light. The laser light emitted from the light emitting element 1 is collected at a condensing point by the condensing lens 1B, passes through the optical fiber 6, and further separated from the excitation light by the light separating means 16, and is monitored by the photodetector 10. For example, a translucent mirror or a dichroic mirror can be used as the light separating means 16. Note that a wavelength selection filter 17 may be disposed in front of the photodetector 10 so that only the laser light generated by the light emitting element 1 is allowed to pass therethrough. The light intensity of the light detected by the photodetector 10 is measured by the light intensity measuring means 11.
(Step 6) The position adjusting means 12 adjusts the position (horizontal direction and vertical direction) of the light emitting element, and the position where the monitored light intensity becomes maximum (that is, the light condensing point 5 of the light from the light emitting element 1) The point where the tip position of the optical fiber 6 is completely matched is obtained. The position adjusting means 12 may be operated manually by a human while monitoring the output of the light intensity measuring means 11, or the output of the light intensity measuring means 11 is input to a control means (for example, a personal computer or the like) not shown and controlled. The position adjusting means 12 may be automatically controlled by the means. As a specific example of the position adjusting unit 12, for example, a piezo actuator can be used.
(Step 7) The UV adhesive 13 is irradiated with ultraviolet light from an ultraviolet irradiation means (UV lamp) (not shown) to cure the adhesive, and the light emitting element 1 is fixed to the housing 8.
(Step 8) The ferrule 7 is removed from the housing 8 and the housing 8 (actually completed optical component) is removed from the housing fixing means 9.

(Another embodiment of optical component mounting method)
In this method, excitation light is made incident on the light emitting element by an optical system such as a lens without using a fiber / ferrule, and the position of the fluorescence and light emission is detected from above by an image capturing means such as a CCD camera, and assembly mounting is performed. That is, in the first embodiment, the laser light propagating in the fiber is propagated in the space, and the basic principle is the same as in the first embodiment. In this case, since it is not necessary to insert the ferrule into the housing, variations in inserting the ferrule can be eliminated, and the insertion work can be omitted, which facilitates automation.
FIG. 4 shows a second embodiment of the present invention. First, the apparatus will be described.
The illumination light source 18 emits illumination light inside the housing, and irradiates the illumination light inside the housing via a translucent mirror 19. Note that this illumination is not required once the focus position detection described later is completed, and may be turned off at that time.
The focal position detection optical system 20 is used to make the focal point of the optical system coincide with the focal point 5 (the center of the ferrule tip position), and is composed of a lens and a lens holding / moving means (not shown). The light separation means 16 reflects the excitation light emitted from the excitation light source device 15 and sends it to the light emitting element 1, and passes the laser light emitted from the light emitting element 1 and sends it to the photodetector 10. A dichroic mirror can be used as the light separation means 16. A dichroic mirror refers to a mirror that reflects light of a specific wavelength and transmits light of other wavelengths. In this embodiment, a 630 nm excitation light source is used, so only light of a wavelength of 630 nm is reflected. A mirror was used.

An alignment method using this apparatus will be described with reference to FIG.
(Step 1) The light emitting element 1 is mounted and fixed on the light emitting element holding means 14 (electrical connection is not performed, and the flange portion of the stem of the light emitting element 1 is held and held). Preferably, the lead wire 2 is inserted into a conductive sponge or the like to be protected from static electricity.
(Step 2) A UV adhesive 13 is applied to the periphery of the light-emitting element 1, and the housing 8 is placed over and fitted.
(Step 3) The housing 8 is fixed to the housing fixing means 9.
(Step 4) Adjust the focal position of the optical system. Specifically, the front end position of the ferrule inserted into the housing while illuminating the interior of the housing with the illumination light source 18 and monitoring the imaging means (photodetector) 10 (the surface on which the ferrule hits the housing, see FIG. 4) The lens position of the focal position detection optical system 20 is moved and adjusted in the height direction (Z-axis direction) so that the focal position of the optical system is aligned. Next, the lens position of the focal position detection optical system 20 is moved in the horizontal direction so that the focal position comes to the bottom corner circle of the ferrule insertion hole or the center of the light passage hole circle. As a result, the focal point 5 and the focal position of the optical system coincide.
(Step 5) The excitation light source device 15 that emits the excitation laser light is operated to emit the excitation light toward the light emitting element 1 side. The emission wavelength of the excitation light source device 15 is the same as or shorter than the oscillation wavelength of the light emitting element 1. In this example, the wavelength of the light emitting element 1 was 850 nm, and the wavelength of the excitation light was 630 nm.
(Step 6) When excitation light enters the light emitting element 1, the active layer of the light emitting element 1 is excited to emit fluorescence. If the excitation intensity is sufficiently high, the light-emitting element 1 enters the optically excited laser oscillation state without passing an electric current, and emits laser light. The laser light emitted from the light emitting element 1 is collected at the condensing point by the condensing lens 1B, passes through the optical system, further separated from the excitation light by the light separating means 16, and is monitored by the photodetector 10. The light intensity of the light detected by the photodetector 10 is measured by the light intensity measuring means 11.
(Step 7) The position (horizontal direction and vertical direction) of the light emitting element is adjusted by the position adjusting means 12, and the position where the shape of the monitored light beam is minimized or the light intensity is maximized (that is, the light emitting element). 1) where the light condensing point 5 of light from 1 and the focal position of the optical system completely match. The position adjusting means 12 may be operated manually by a human while monitoring the output of the light intensity measuring means 11, or the output of the light intensity measuring means 11 is input to a control means (for example, a personal computer or the like) not shown and controlled. The position adjusting means 12 may be automatically controlled by the means.
(Step 8) The UV adhesive 13 is irradiated with ultraviolet light from a UV lamp to cure the adhesive, and the light emitting element 1 is fixed to the housing 8.
(Step 9) The housing 8 (actually completed optical component) is removed from the housing fixing means 9.

(Alignment method when die bonding)
In this embodiment, the method of Embodiment 2 is applied, and when the light emitting element itself is assembled, the light emitting point of the semiconductor laser (chip) 1A is positioned at a predetermined position (for example, the center) of the light emitting element. The present invention relates to a method of performing die bonding after positioning.
FIG. 5 shows a method of arranging the light emitting point of the chip at the center of the stem when the light emitting element is assembled, and will be described in detail with reference to the drawings.

(Step 1) The stem of the light emitting element is mounted on the light emitting element holding means 14 and fixed. At this stage, the chip is not mounted on the stem.
(Step 2) The focal position of the optical system is adjusted. Specifically, the focal position of the optical system is detected so that the focal position of the optical system is aligned with the surface of the stem while illuminating the upper surface of the stem with the illumination light source 18 and monitoring the imaging means (photodetector) 10 as the position detection means. The lens position of the optical system 20 is moved and adjusted in the height direction (Z-axis direction).
(Step 3) Next, a reference position such as a cross line provided on the stem is detected by the imaging means 10, and this is used as a position coordinate reference.
(Step 4) Referring to the reference position obtained in Step 3, the center of the stem is moved to the center position of the entire light emitting element (adjusted by the position adjusting means 12).
(Step 5) Next, the chip is gripped by a chip gripping means (manipulator).
(Step 6) The excitation light source device 15 that emits the excitation laser light is operated to emit the excitation light to the chip. The emission wavelength of the excitation light source device 15 is the same as or shorter than the oscillation wavelength of the light emitting element 1. In this example, the wavelength of the light emitting element 1 was 850 nm, and the wavelength of the excitation light was 630 nm.
(Step 7) When excitation light enters the chip, the active layer of the chip is excited to emit fluorescence. If the excitation intensity is sufficiently strong, the chip enters a laser-excited laser oscillation state and emits laser light without passing an electric current. The light emitted from the chip passes through the optical system, is further separated from the excitation light by the light separation means 16, and is monitored by the photodetector 10. The light intensity of the light detected by the photodetector 10 is measured by the light intensity measuring means 11.
(Step 8) The position (horizontal direction) of the chip is adjusted by the chip gripping means (manipulator), and the position where the shape of the monitored light beam is minimized or the position where the light intensity is maximized (that is, the laser from the chip) The point where the light condensing point 5 and the focal position of the optical system completely match). Thereby, the light emitting point of the chip is detected. The chip gripping means may be manually operated by a human while monitoring the output of the light intensity measuring means 11, or the output of the light intensity measuring means 11 is input to a control means (for example, a personal computer or the like) not shown, and the control means The chip gripping means may be automatically controlled by.
(Step 9) The detected light emitting point of the chip is aligned with a predetermined position of the stem, and die bonding is performed to fix the chip to the stem with an adhesive or the like. If the die bonding adhesive is UV curable, the adhesive is cured by irradiating UV light from a UV lamp to complete the die bonding.

  The chip on which the die bonding has been completed is covered with a lid with a condenser lens 1B in the next step, and the light emitting element 1 is completed. Since the position of the light emitting point of the VCSEL manufactured in this way is almost at the center, when assembling and mounting the optical component fixed to the housing, there is a high possibility that adjustment only in the Z-axis direction is required. The position adjustment range during assembly and mounting can be narrowed, and the alignment time can be greatly shortened.

The method or means for fixing the light emitting element and the housing is not limited to the UV adhesive, and other methods such as resin (hot melt, dry type, two-component reaction type, UV curing, anaerobic type, UV anaerobic type) Type, UV heating type), low temperature soldering method, laser welding method and the like.
The description of the apparatus is omitted since it is substantially the same as the description of the method.

It is a figure which shows the apparatus of the assembly mounting of the conventional optical component. It is a figure for demonstrating the process of the assembly mounting of the conventional optical component. It is a figure for demonstrating Example 1 of the method based on this invention. It is a figure for demonstrating Example 2 of the method which concerns on this invention. It is a figure for demonstrating Example 3 of the method which concerns on this invention.

Explanation of symbols

1 Light-Emitting Element 1A Light-Emitting Point (Semiconductor Chip)
1B Condensing lens 2 Lead wire 3 Electrical connection means (connector)
4 Drive power supply 5 Condensing point 6 Optical fiber 7 Ferrule 8 Housing (receptacle)
9 Housing fixing means 10 Photodetector (imaging device)
DESCRIPTION OF SYMBOLS 11 Light intensity measurement means 12 Position adjustment means 13 UV adhesive 14 Light emitting element holding means 15 Excitation light source device 16 Light separation means 17 Wavelength selection filter 18 Illumination light source 19 Translucent mirror 20 Focus position detection optical system

Claims (12)

In the alignment method in the assembly mounting process of an optical component comprising a light emitting element including a condenser lens and a semiconductor laser and a housing,
Fixing the light emitting element to a light emitting element holding means;
Loosely inserting the light emitting element into the housing;
Fixing the housing to a housing fixing means;
Irradiating the semiconductor laser through the condenser lens with excitation light having a wavelength that is not longer than the laser light emitted from the semiconductor laser via an optical fiber;
Capturing fluorescence or laser light generated by being optically excited by the excitation light through the optical fiber, and monitoring the light intensity of the generated fluorescence or laser light with a light intensity measuring means;
Adjusting the position by moving the position of the light emitting element holding means in two dimensions or three dimensions so that the light intensity is maximized;
Performing a process of fixing the light emitting element to the housing after completion of the position adjustment;
An alignment method in an assembly mounting process of an optical component, comprising:   2. The alignment method in an assembly process of optical components according to claim 1, wherein the optical fiber is inserted into a ferrule, and is inserted into and released from the housing. In the alignment method in the assembly mounting process of an optical component comprising a light emitting element including a condenser lens and a semiconductor laser and a housing,
Fixing the light emitting element to a light emitting element holding means;
Loosely inserting the light emitting element into the housing;
Fixing the housing to a housing fixing means;
Irradiating the semiconductor laser with excitation light having a wavelength not longer than that of the laser light emitted from the semiconductor laser through the condenser lens;
Capturing fluorescence or laser light generated by being optically excited by the excitation light, and monitoring the light intensity of the generated fluorescence or laser light with a light intensity measuring means;
Adjusting the position by moving the position of the light emitting element holding means in two dimensions or three dimensions so that the light intensity is maximized;
Performing a process of fixing the light emitting element to the housing after completion of the position adjustment;
With
An alignment method in an assembling and mounting process of an optical component, comprising: an optical system in which an exit optical path of the excitation light and an incident optical path of the generated fluorescence or laser light form a confocal point.   4. The alignment method in the assembly and mounting process of an optical component according to claim 1, wherein the position adjustment is automatically adjusted based on an output of the light intensity measuring means. In the alignment method in the assembly and mounting process of the light emitting element that die-bonds the semiconductor laser chip to the stem,
Fixing the stem of the light emitting element to the light emitting element holding means;
Detecting a reference position of the stem from a position marker provided on the stem or a structural feature point of the stem by position detecting means;
Moving the center of the stem to a predetermined position of the light emitting element with reference to the reference position;
Holding the chip with a chip holding means, and irradiating the chip with excitation light having a wavelength not longer than the laser light emitted by the semiconductor laser; and
Capturing fluorescence or laser light generated by being optically excited by the excitation light, and monitoring the light intensity of the generated fluorescence or laser light with a light intensity measuring means;
Detecting the light emitting point of the chip by moving the position of the chip by the chip gripping means so that the light intensity becomes maximum;
Aligning the detected light emitting point of the chip with a predetermined position of the stem;
Fixing the chip to the stem and completing die bonding;
With
A process for assembling and mounting a light emitting element for die bonding a semiconductor laser chip to a stem, comprising an optical system in which the exit optical path of the excitation light and the incident optical path of the generated fluorescence or laser light form a confocal point Alignment method.   6. The process of assembling and mounting a light emitting element for die bonding a semiconductor laser chip to a stem according to claim 5, wherein the detection of the chip emission point is automatically performed based on the output of the light intensity measuring means. Alignment method. In the aligning device in the assembly mounting process of the optical component comprising a light emitting element including a condenser lens and a semiconductor laser and a housing, the aligning device includes:
A light emitting element holding means for holding the light emitting element;
Housing fixing means for fixing the housing in which the light emitting element is loosely inserted;
An excitation light source device that irradiates the semiconductor laser through the condenser lens with excitation light having a wavelength that is not longer than the laser light emitted by the semiconductor laser;
An optical fiber for introducing the excitation light into the semiconductor laser;
A light separating means for separating the excitation light and the fluorescence or laser light when capturing the fluorescence or laser light generated by being optically excited by the excitation light through the optical fiber;
A light intensity measuring means for measuring the light intensity of the captured fluorescence or laser light;
Position adjusting means for adjusting the position of the light emitting element holding means in two or three dimensions so as to maximize the light intensity;
An alignment device in an assembly mounting process of an optical component, comprising:   8. The alignment device in an assembly process of optical components according to claim 7, wherein the optical fiber is inserted into a ferrule, and is inserted into and released from the housing. In the aligning device in the assembly mounting process of the optical component comprising a light emitting element including a condenser lens and a semiconductor laser and a housing, the aligning device includes:
A light emitting element holding means for holding the light emitting element;
Housing fixing means for fixing the housing in which the light emitting element is loosely inserted;
An excitation light source device that irradiates the semiconductor laser through the condenser lens with excitation light having a wavelength that is not longer than the laser light emitted by the semiconductor laser;
An optical path in which an emission optical path of the excitation light and an incident optical path of fluorescence or laser light generated by the semiconductor laser by being optically excited by the excitation light are confocal;
A light separation means for separating the excitation light and the fluorescence or laser light when taking in the generated fluorescence or laser light through the optical system;
A light intensity measuring means for measuring the light intensity of the captured fluorescence or laser light;
Position adjusting means for adjusting the position of the light emitting element holding means in two or three dimensions so as to maximize the light intensity;
An alignment device in an assembly mounting process of an optical component, comprising:   10. The alignment in the assembly and mounting process of an optical component according to claim 7, wherein the position adjustment means includes a control means for automatically adjusting based on an output of the light intensity measurement means. apparatus. In the alignment apparatus in the assembly mounting process of the light emitting element that die-bonds the semiconductor laser chip to the stem, the alignment apparatus includes:
A light emitting element holding means for holding a stem of the light emitting element;
A position detection means for detecting a reference position of the stem from a position marker provided on the stem or a structural feature point of the stem;
Position adjusting means for moving the center of the stem to a predetermined position of the light emitting element based on the reference position;
An excitation light source device that irradiates the semiconductor laser with excitation light having a wavelength that is not longer than the laser light emitted by the semiconductor laser;
An optical path in which an emission optical path of the excitation light and an incident optical path of fluorescence or laser light generated by the semiconductor laser by being optically excited by the excitation light are confocal;
A light separation means for separating the excitation light and the fluorescence or laser light when taking in the generated fluorescence or laser light through the optical system;
A light intensity measuring means for measuring the light intensity of the captured fluorescence or laser light;
A chip gripping means for detecting the chip emission point by gripping the chip and moving the position of the chip so that the light intensity is maximized;
An alignment device in a process for assembling and mounting a light emitting element in which a semiconductor laser chip is die-bonded to a stem.   12. The semiconductor laser chip according to claim 11, wherein the chip gripping means includes control means for automatically detecting the light emitting point based on an output of the light intensity measuring means. A centering device in an assembly mounting process of light emitting elements to be bonded.

Images