JP4904732B2 - Thermally conductive molded body and method for producing the same - Google Patents

Description

The present invention relates to a molded body in which a first member made of a resin composition reinforced with a continuous reinforcing fiber group and a second member are integrated, a reinforcing fiber used for the first member, Since both members 2 have high thermal conductivity, the present invention relates to an integrated molded body excellent not only in light weight and dynamic characteristics but also in thermal conductivity and heat dissipation. More specifically, the present invention relates to a thermally conductive molded body in which both members are firmly integrated to achieve both complex formability and productivity, and a manufacturing method thereof.

  In recent years, in the fields of electrical / electronic equipment parts, OA equipment, communication equipment, and the like, the processing performance of the CPU has been dramatically improved, and an increase in power consumption and an increase in heat generation have become problems. At the same time, in the semiconductor industry, in addition to high integration, miniaturization, and large capacity of semiconductors, devices are becoming increasingly mobile, lighter, and thinner. Thermal conductivity and heat dissipation of components and housings are accelerating. Sex has come to be strongly demanded.

  Furthermore, in the automobile industry, demands for heat conductivity are increasing more and more, such as measures for heat dissipation of cabins, heat dissipation measures for inverters between batteries and motors in hybrid vehicles, and separators for fuel cells.

  Here, a general metal material that is a heat dissipation material, an alloy thereof, alumina, copper-molybdenum, and the like have a large specific gravity and are not necessarily satisfactory in terms of weight reduction. In contrast, various materials such as ceramics, aluminum nitride, carbon-based metal composites, carbon / carbon composite materials, graphite sheets, and silicone materials have been proposed. It is difficult to manufacture with good performance, and there is a problem that the manufacturing cost increases.

Therefore, although the development of thermally conductive resins using injection molding materials has been proposed mainly for fuel cell separator applications, it is necessary to add a large amount of fillers that impart thermal conductivity such as carbon fibers, graphite, and metals. Therefore, it is difficult to ensure mechanical properties such as strength and impact resistance of the molded body. Further, the addition of a large amount of filler leads to deterioration of fluidity, resulting in a problem that the moldability of complex shapes is impaired. Patent Document 1 discloses a technique for adding a large amount of artificial graphite powder to a thermoplastic resin. However, a molded body obtained from such a composition is very brittle and has poor moldability, so that it can be applied. Are very limited.
JP 2004-152589 A

An object of the present invention, the prior art view of a first member made of a resin composition reinforced with continuous reinforcing fiber group, the molded body and the second member is one embodied, lightweight and Mechanics ensuring characteristics, and the reinforcing fibers used in the first member, that the second member both have high thermal conductivity, while also maintaining characteristics as thermal conductivity SeiNaru forms a first member An object of the present invention is to provide a thermally conductive molded body that is firmly integrated with the second member so as to have excellent bonding strength . Another object of the present invention is to provide a joining method that can achieve both the moldability and productivity of a complex shape in such a thermally conductive molded body .

In order to solve the above problems, a thermally conductive molded body according to the present invention is a molded body formed by integrating at least two members of a first member and a second member, and the first of the members. The member is made of a resin composition mainly composed of a thermosetting resin reinforced with a group of continuous reinforcing fibers, and has a thermoplastic resin layer at a joint portion between the first member and the second member. The thermoplastic resin layer includes a group of reinforcing fibers of the reinforcing fiber group, and the thermoplastic resin layer includes a thermosetting resin layer reinforced with a continuous reinforcing fiber group and an uneven surface at the interface thereof. Having a shape and being integrated, the maximum thickness of the region including the reinforcing fibers is 10 to 1000 μm, and the thermal conductivity of the reinforcing fibers is 3 W / m · K or more, and When the thermal conductivity of the second member is 1 W / m · K or more And it is characterized in Rukoto.

  Moreover, the manufacturing method of the heat conductive molded object which concerns on this invention WHEREIN: The said 1st member and the 2nd member are heat-welded, vibration welding, ultrasonic welding, laser welding, insert injection molding, outsert injection molding. It integrates by at least one method selected from.

The thermally conductive molded body according to the present invention is not only excellent in thermal conductivity and heat dissipation by joining two members, but also can be provided with light weight and mechanical properties, and between two members. There is an effect that the joint strength is excellent . Moreover, even if this heat conductive molded object is a complicated shape , it can manufacture with a low cost method with high productivity. Therefore, these heat conductive molded bodies are suitable for uses such as casings and internal members of electric / electronic devices, automobiles, building material parts, members or panels, and fuel cell separators.

  Below, the heat conductive molded object of this invention and its manufacturing method are demonstrated in detail with desirable embodiment.

  The heat conductive molded object which concerns on this invention is a molded object formed by integrating at least 2 member of a 1st member and a 2nd member. That is, a molded body corresponding to a complicated shape can be obtained by integrating the second member with the first member having excellent lightness and mechanical properties.

  Here, the first member is made of a resin composition reinforced with a group of continuous reinforcing fibers, and the thermal conductivity of the reinforcing fibers is 3 W / m · K or more, preferably 5 W / m · K. More preferably, it is 7 W / m · K. If the thermal conductivity is less than 3 W / m · K, the thermal conductivity of the integrally molded body may not be sufficient. The thermal conductivity can be measured by a general laser flash method or the like. When the thermal conductivity has anisotropy, the maximum value of the measured value is a representative value of the thermal conductivity of the material. In the first member, the thermal conductivity is anisotropy. For example, when a case or member for an electric / electronic device is used, heat can be selectively transmitted, which is useful in heat dissipation design of the case.

_Deriving the ratio (λ _{s1 / b1} ) between the maximum value (λ _b1 ) of the thermal conductivity and the minimum value (λ _s1 ) of the thermal conductivity in the plane direction of the first member, the plane direction of the thermal conductivity The anisotropy in can be known. Further, the ratio (λ _{t / s} ) of the thermal conductivity (λ _s ) in the surface direction and the thermal conductivity (λ _t ) in the thickness direction of the first member is derived, and the surface direction and the thickness direction of the test piece are derived. By obtaining the ratio of the thermal conductivity, the anisotropy between the surface direction and the thickness direction of the thermal conductivity can be known.

  Examples of reinforcing fibers having such thermal conductivity include metal fibers such as aluminum, iron, magnesium, titanium and alloys thereof, polyacrylonitrile-based, rayon-based, lignin-based, pitch-based carbon fibers, nickel and copper. Examples thereof include metal-coated fibers obtained by coating the surface of glass fibers, carbon fibers and the like. These are used alone or in combination of two or more. These fiber materials may be subjected to surface treatment. Examples of the surface treatment include a treatment with a coupling agent, a treatment with a sizing agent, and an additive adhesion treatment. Among these fiber materials, conductive fiber materials are also included. As the fiber material, carbon fiber having a small specific gravity, high strength and high elastic modulus is preferably used. Furthermore, from the viewpoint of enhancing the thermal conductivity and heat dissipation of the thermally conductive molded body of the present invention, the reinforcing fiber group used is preferably a carbon fiber of 10 W / m · K or more, and 30 W / m. -If it is more than K, it is still more preferable.

  The proportion of the reinforcing fibers used for the first member in the thermally conductive molded body of the present invention is preferably 5 to 85% by volume from the viewpoint of thermal conductivity and mechanical properties of the obtained member, and moldability. 40 to 70% by volume is more preferable. Here, the reinforcing fiber group is composed of a large number of reinforcing fibers continuous in a length of 10 mm or more in at least one direction. The reinforcing fiber group does not need to be continuous over the entire length in the length direction of the first member or over the entire width in the width direction of the first member, and may be divided in the middle.

  The reinforcing fiber group includes a reinforcing fiber bundle composed of a large number of reinforcing fibers, a cloth formed from the fiber bundle, a reinforcing fiber bundle in which a large number of reinforcing fibers are arranged in one direction (unidirectional fiber bundle), A unidirectional cloth composed of a unidirectional fiber bundle. Among these, from the viewpoint of prepreg and member productivity, a cloth and a unidirectional fiber bundle are preferable. As the cloth, plain weave, satin weave, twill weave and the like can be preferably used. The reinforcing fiber group may be composed of a plurality of fiber bundles having the same form, or may be composed of a plurality of fiber bundles having different forms. The number of reinforcing fibers constituting one reinforcing fiber group is usually 300 to 48,000, but in consideration of the production of prepreg and the production of cloth, it is preferably 300 to 24,000, more preferably 1,000 to 12,000.

  Moreover, as a preferable aspect of a 1st member, it is the laminated body by which the fiber bundle was laminated | stacked in layers. By changing the orientation direction of the reinforcing fiber group and laminating, the mechanical properties of the entire member can be controlled.

As the resin used for the resin composition reinforced with the reinforcing fiber group, a thermosetting resin is used from the viewpoint of thermal stability and mechanical properties .

Examples of thermosetting resins include unsaturated polyesters, vinyl esters, epoxies, phenols (resol type), urea, melamine, polyimides, copolymers, modified products thereof, and resins blended in two or more types. Can be used. Furthermore, an elastomer or a rubber component may be added to the thermosetting resin in order to improve impact resistance. Among these, an epoxy resin is particularly preferable from the viewpoint of the rigidity and strength of the molded body .

Furthermore, the above-mentioned thermally conductive molded body has a thermoplastic resin layer at least at the joint portion between the first member and the second member from the viewpoint of the adhesive strength between the first member and the second member. It is essential that the thermoplastic resin layer includes a group of reinforcing fibers of the reinforcing fiber group.

  The thermoplastic resin is not particularly limited, and specific examples include polyethylene terephthalate (PET), polybutylene terephthalate (PBT), polytrimethylene terephthalate (PTT), polyethylene naphthalate (PEN), polyester such as liquid crystal polyester, Polyolefins such as polyethylene (PE), polypropylene (PP), polybutylene, styrene resins, polyoxymethylene (POM), polyamide (PA), polycarbonate (PC), polymethylene methacrylate (PMMA), polyvinyl chloride (PVC), polyphenylene sulfide (PPS), polyphenylene ether (PPE), modified PPE, polyimide (PI), polyamideimide (PAI), polyetherimide (PEI), polysulfone (PSU) , Modified PSU, polyethersulfone (PES), polyketone (PK), polyetherketone (PEK), polyetheretherketone (PEEK), polyetherketoneketone (PEKK), polyarylate (PAR), polyethernitrile (PEN) ), Fluororesins such as phenolic resins, phenoxy resins, polytetrafluoroethylene, and thermoplastic elastomers such as polystyrenes, polyolefins, polyurethanes, polyesters, polyamides, polybutadienes, polyisoprenes, fluorines, etc. Alternatively, these copolymers, modified products, and two or more types of blended resins may be used.

In the thermally conductive molded article of the present invention, the thermoplastic resin layer is integrated with a thermosetting resin reinforced with a group of reinforcing fibers composed of continuous reinforcing fibers and having an uneven shape at the interface.
The uneven shape is effective for an excellent integration method with the second member. When the resin of the thermosetting resin and the resin of the thermoplastic resin layer are substantially linear at the interface, adhesion after bonding is achieved. In some cases, sufficient strength cannot be secured. Further, if the reinforcing fiber of the reinforcing fiber is not in contact with the resin of the thermoplastic resin layer, the adhesive strength may be insufficient, such as peeling after integration. Further, in the first member before integration, when the thermoplastic resin layer is not located on the surface of the member, it is not preferable because easy integration such as thermal bonding cannot be applied.

  In FIG. 1, the example of the junction part of the body 1st member 3 and the 2nd member 4 in the heat conductive shaping | molding of this invention is shown as a figure which expanded the cross section. FIG. 1 is a diagram created based on a photograph obtained by using a scanning electron micrograph. In FIG. 1, the first member 3 includes a large number of continuous reinforcing fibers 5 a and 5 b and a thermosetting resin 6 as main components. And it has the thermoplastic resin layer 7 in the junction part with the 2nd member 4, and this thermoplastic resin layer 7 contains the group (part) reinforcing fiber 5b. Here, it is preferable that the thermoplastic resin layer 7 has an uneven shape at the interface with the thermosetting resin 6 and is integrated.

  The structure of the first member 3 is such that a prepreg or prepreg laminate in which a reinforcing fiber group 8 composed of a large number of continuous reinforcing fibers 5a and 5b is impregnated with a thermosetting resin before curing. The base material formed by processing the thermoplastic resin is disposed, and the reinforcing fiber group 8 is impregnated with the thermoplastic resin of the base material during the curing reaction of the thermosetting resin or during preheating before the curing reaction. Can be formed. Further, the thermosetting resin 6 forms a thermosetting resin layer 6, and the thermoplastic resin forms a thermoplastic resin layer 7. The thermosetting resin 6 and the thermoplastic resin layer are impregnated into the reinforcing fiber group 8 of the thermoplastic resin, that is, by penetration of the thermoplastic resin between the multiple reinforcing fibers 5b forming the reinforcing fiber group 8. 7 is formed.

  As the prepreg, a prepreg composed of a plurality of reinforcing fiber groups 8 as necessary and arranged in the width direction of the prepreg or laminated in the thickness direction of the prepreg is used. In FIG. 1, the reinforcing fiber group 8 that is located in the outermost layer in the prepreg and is closest to the joint surface with the second member 4 is shown.

  The said structure in the 1st member in the heat conductive molded object of this invention can be verified with the following method, for example.

  First, the first test method is based on observation of a partial cross section of a surface layer of a member joint by a scanning electron microscope (SEM) or a transmission electron microscope (TEM). The observation of the cross section may be performed based on the taken cross-sectional photograph, if necessary. The test piece to be observed is a thin slice created using the surface layer portion cut out from the member. In making this, some of the reinforcing fibers of the reinforcing fiber group may fall off, but there is no problem as long as the observation is not affected. The test piece may be stained as necessary to adjust the contrast of observation. The reinforcing fibers constituting the reinforcing fiber group are usually observed as a circular cross section. When the reinforcing fiber is dropped, it is usually observed as a circular drop mark. In the portion other than the portion where the reinforcing fibers constituting the reinforcing fiber group are located, the thermosetting resin layer and the thermoplastic resin layer are observed as two regions having different contrasts.

  An example of the observation result by the first method is shown in FIG. FIG. 2 is an enlarged view of the cross section of the joint surface of the thermally conductive molded body in which the first member 11 and the second member 12 are integrated. The state in which the resin of the thermoplastic resin layer 13 has entered into the gap between the multiple reinforcing fibers 15a and 15b constituting the reinforcing fiber group 14 is shown. The state where the interface 17 with the plastic resin layer 13 has an uneven shape is shown.

  The second test method is based on observation with a scanning electron microscope (SEM) or a transmission electron microscope (TEM) of a cross section in which the thermoplastic resin in the surface layer portion of the member joint is extracted and removed with a solvent. The observation of the cross section may be performed based on a cross-sectional photograph as necessary. The member is cut to a length of about 10 mm and a width of about 10 mm to obtain a test piece. In this test piece, the thermoplastic resin layer is sufficiently washed with a good solvent for the resin constituting the test piece, and the thermoplastic resin is removed to prepare a test piece for observation. The cross section of the prepared test piece is observed using SEM (or TEM).

  An example of the observation result by the second method is shown in FIG. FIG. 3 is an enlarged cross-sectional view of the joint surface in a state where the second member and the thermoplastic resin layer are removed from the thermally conductive molded body in which the first member 18 and the second member 19 are integrated. It is shown. In FIG. 3, the thermosetting resin 20 exists with the reinforcing fibers 22 a constituting the reinforcing fiber group 21, but the thermoplastic that has existed with the thermosetting resin 20 and the uneven interface 23. The resin layer does not exist because it is removed by the solvent when the test piece is prepared. While the uneven shape of the interface 23 is observed, the reinforcing fiber 22b constituting the reinforcing fiber group 21 is observed at the position where the thermoplastic resin layer was present, and the void 24 is observed between these reinforcing fibers. The This proves that the reinforcing fiber 22b constituting the reinforcing fiber group 21 was included in the thermoplastic resin layer.

  In the first method and the second method, when the member joint portion is observed from the integrated heat conductive molded body, the joint portion is peeled by heating to a temperature at which the resin of the thermoplastic resin layer is plasticized. Or you may process by the method of removing a 2nd member mechanically.

The third test method is based on observation of a state obtained when one side is forcibly peeled from the other in an integrated molded body . This test method is performed by forcibly peeling the integrated molded body at room temperature so as to break between the first member and the second member. A part of the surface layer of the first member may adhere as a residue to the peeled second member. This residue can be observed with a microscope.

  An example of the state of the test piece obtained by implementing the third test method is shown in FIG. In FIG. 4, a joining portion 26 where the surface of the first member is joined is shown in the second member 25, and a part of the first member surface layer portion remains in the joining portion 26 as a residue 27. As observed. In this residue 27, it is observed that there are a plurality of reinforcing fibers dropped from the reinforcing fiber group located on the surface layer of the first member.

  The structural characteristics of the thermally conductive molded body of the present invention can be verified by the at least one test method described above.

  In the thermally conductive molded body of the present invention, the first member has a continuous reinforcing fiber 5b in the thermoplastic resin layer 7 shown in FIG. 1 for the purpose of increasing the adhesive strength with the second member. The maximum thickness Tpf-max of the region is preferably 10 μm or more, more preferably 20 μm or more, and even more preferably 40 μm or more. This maximum thickness Tpf-max is the outermost (bonding side) reinforcing fiber 5b-out in contact with the resin of the thermoplastic resin layer 7 in the thickness direction of the thermoplastic resin layer 7, and the thermoplastic resin layer 7 Is defined as the distance (Tpf-max) between the innermost reinforcing fiber 5b-in-max in contact with the resin of the thermoplastic resin layer 7 at the portion where the penetration depth from the surface of the resin is the largest. The The maximum thickness Tpf-max can be measured in the SEM or TEM photograph obtained by the first test method or the second test method. If the maximum thickness Tpf-max is 1,000 μm at the maximum, the effect of the present invention is sufficiently achieved.

  The minimum thickness Tpf-min is the outermost (surface side) reinforcing fiber 5a-out in contact with the resin of the thermoplastic resin layer 7 in the thickness direction of the thermoplastic resin layer 7, and the thermoplastic resin layer 7 It is defined as the distance (Tpf-min) between the innermost reinforcing fiber 5b-in-min in contact with the resin of the thermoplastic resin layer 7 at the portion where the penetration depth from the resin surface is the smallest. .

  In the first member, the interface 9 between the thermosetting resin 6 and the thermoplastic resin layer 7 is, as shown in FIG. 1, a reinforcing fiber composed of a large number of reinforcing fibers 5a and 5b aligned in one direction. It is preferably present in group 13. In the first member, in the case where a plurality of reinforcing fiber groups 13 are laminated in the thickness direction, it is more preferable that the interface 9 exists only in the outermost reinforcing fiber group.

In the thermally conductive molded article of the present invention, the thermoplastic provided on the surface of the first member in order to obtain an excellent adhesion effect when bonded to the second member to form an integrally molded article . It is necessary to be joined to the second member via the resin layer. The area S of the thermoplastic resin layer provided on the surface of the first member is determined according to the area in which the bonding force with the second member to be bonded can be secured.

That is, the thermally conductive molded article of the present invention is formed with the first member through a film (surface layer portion corresponding to the thickness Tp in FIG. 1) made of the thermoplastic resin composition constituting the thermoplastic resin layer. It is preferable that the second member is bonded. The average thickness of the coating film formed on the first member is a 0.01～1,000Myuemu, if 0.1~200μm good preferred, more preferred if 1 to 50 [mu] m. The average thickness Tp of the coating is the outermost (bonding side) reinforcing fiber 5b-out in contact with the resin of the thermoplastic resin layer 7 shown in FIG. 1, the first member 3 and the second member 4. It is defined by the distance to the bonding interface 10 of When the thickness of the film is not constant, measurement is performed at an arbitrary number of points, and the average value of the obtained measured values is defined as the thickness of the film. When the average thickness is in the above preferable range, the first member and the second member are more reliably joined.

  Examples of the thermoplastic resin that can achieve the solubility parameter δ include amide bonds, ester bonds, urethane bonds, ether bonds, amino groups, hydroxyl groups, carboxyl groups, acid anhydride groups, sulfonic acid groups, aromatic rings, imide rings, and the like. And those having a bond, functional group or structure having a polarity higher than that of the hydrocarbon skeleton.

  Moreover, as a weight average molecular weight of a thermoplastic resin, 2,000-200,000 are preferable, 5,000-150,000 are more preferable, 10,000-100,000 are still more preferable. By making it within the above range, intermolecular forces and entanglement of molecular chains increase, and the strength of the thermoplastic resin itself increases, making it difficult for the thermoplastic resin itself to be easily broken, and further strengthening the thermoplastic resin. Impregnation into the fiber group, it becomes easy to include the fiber group, and a strong adhesive force can be expressed.

Further, in the thermally conductive molded body of the present invention, the thermoplastic resin forming the thermoplastic resin layer used for the first member is selected from a carboxyl group, an acid anhydride group, an amino group, an epoxy group, and a hydroxyl group. By containing at least one kind of functional group, the reactivity of the thermoplastic resin is increased, which is effective in increasing the adhesive strength, which is one of the objects of the present invention. Among these, an acid anhydride group, an amino group, and an epoxy group are more preferably selected. Here, the functional group amount of the thermoplastic resin is preferably 1 × 10 ⁻⁵ mol / g or more, more preferably 1 × 10 ⁻⁴ mol / g or more, and further preferably 1 × 10 ⁻³ mol / g or more. The amount of the functional group is not particularly limited and can be measured by a general chemical analysis method. For example, the components are identified by IR (infrared absorption spectrum measurement), the molecular structure is identified by NMR (nuclear magnetic resonance spectrum measurement), and the molecular weight is identified by GPC (gel permeation chromatography). From the obtained result, the number of moles of the functional group per unit weight of the polymer chain can be calculated.

From the above, in the thermally conductive molded article of the present invention, as the thermoplastic resin composition used for the first member, for example, polyethylene terephthalate (PET), polybutylene terephthalate (PBT), polytrimethylene terephthalate (PTT), Polyesters such as polyethylene naphthalate (PEN) and liquid crystal polyester, modified polyolefins such as modified polyethylene (PE), modified polypropylene (PP) and polybutylene, styrenic resins, polyoxymethylene (POM), polyamide (PA ), Polycarbonate (PC), polymethyl methacrylate (PMMA), polyvinyl chloride (PVC), polyphenylene sulfide (PPS), polyphenylene ether (PPE), modified PPE, polyimide (PI), polyamideimide (PA) ), Polyetherimide (PEI), polysulfone (PSU), modified PSU, polyethersulfone (PES), polyketone (PK), polyetherketone (PEK), polyetheretherketone (PEEK), polyetherketoneketone (PEKK) ), Polyarylate (PAR), polyether nitrile (PEN), phenolic resin, phenoxy resin, polytetrafluoroethylene, and other fluorine resins, as well as polystyrene, polyolefin, polyurethane, polyester, polyamide, polybutadiene Polyisoprene-based, fluorine-based thermoplastic elastomers, etc., copolymers, modified products, and resins obtained by blending at least two of them can be used. Among these, polyester resins, polyamide resins, and modified polyolefin resins are preferably used from the viewpoints of productivity and economy.

  An elastomer or a rubber component may be added to the thermoplastic resin in order to improve impact resistance, and a filler or an additive may be added from the viewpoint of improving functionality. For example, flame retardants, conductivity imparting agents, crystal nucleating agents, ultraviolet absorbers, antioxidants, vibration damping agents, antibacterial agents, insect repellents, deodorants, coloring inhibitors, heat stabilizers, mold release agents, antistatic agents Plasticizers, lubricants, colorants, pigments, dyes, foaming agents, antifoaming agents, and coupling agents. In particular, when an inorganic substance is added, a smaller dispersion size is more preferable from the viewpoint of impregnation into the reinforcing fiber group. In particular, those having a nano-order dispersion size are more preferable from the viewpoint that the effect can be exhibited by addition of a small amount.

  The second member in the thermally conductive molded body of the present invention preferably has a thermal conductivity of 3 W / m · K, more preferably 5 W / m · K. If the thermal conductivity is less than 1 W / m · K, the thermal conductivity of the integrated molded body may be insufficient. The thermal conductivity is measured by the laser flash method as described above.

  In the thermally conductive molded body of the present invention, the second member is not particularly limited as long as it is made of a material having thermal adhesiveness at the joint portion with the first member. Furthermore, there is no restriction | limiting in particular also in the form, Any of injection molded goods, a film form, a sheet form, a laminated board, a decorative board, a textile fabric, cloth, a nonwoven fabric, and leather may be sufficient.

  For example, it is preferable that the second member is a member having substantially the same configuration as the first member from the viewpoint of manufacturing a heat conductive molded body having excellent mechanical properties. Furthermore, the resin composition has substantially the same configuration as that of the first member shown in the desirable one embodiment, in which a thermosetting resin is a main component and a thermoplastic resin layer is disposed at the joint. A member is more preferable.

  Moreover, if the 2nd member is a member comprised from the thermoplastic resin composition, it is preferable from a viewpoint which can shape | mold a more complicated shape. There is no restriction | limiting in particular as a thermoplastic resin to be used. Examples of the thermoplastic resin include polyethylene terephthalate (PET), polybutylene terephthalate (PBT), polytrimethylene terephthalate (PTT), polyethylene naphthalate (PEN), polyester such as liquid crystal polyester, polyethylene (PE), polypropylene ( PP), polyolefins such as polybutylene, styrene resins, polyoxymethylene (POM), polyamide (PA), polycarbonate (PC), polymethyl methacrylate (PMMA), polyvinyl chloride (PVC), polyphenylene sulfide ( PPS), polyphenylene ether (PPE), modified PPE, polyimide (PI), polyamideimide (PAI), polyetherimide (PEI), polysulfone (PSU), modified PSU, polyether Sulfone, polyketone (PK), polyetherketone (PEK), polyetheretherketone (PEEK), polyetherketoneketone (PEKK), polyarylate (PAR), polyethernitrile (PEN), phenolic resin, phenoxy resin, Fluororesin such as polytetrafluoroethylene, polystyrene, polyolefin, polyurethane, polyester, polyamide, polybutadiene, polyisoprene, fluorine and other thermoplastic elastomers, their copolymers and modifications The body and a resin obtained by blending at least two of these can be used.

  To these thermoplastic resins, it is preferable to add a heat conductive material for the purpose of ensuring heat conductivity. The thermal conductivity of the thermally conductive material is preferably 3 W / m · K or more, more preferably 5 W / m · K or more. The addition amount of the heat conductive material is preferably 30 to 90% by volume and more preferably 50 to 85% by volume with respect to 100% by volume of the thermoplastic resin composition from the viewpoint of achieving both heat conductivity and moldability.

Specific examples of the heat conductive material include, for example, Al ₂ O ₃ (alumina), MgO, BN, AlN, Al (OH) ₃ , Mg (OH) ₃ , SiC, SiO ₂ , graphite, pitch, and PAN-based carbon. Examples thereof include fiber, pitch-based carbon fiber, carbon black, carbon nanotube, metal fiber, and metal powder. These may be used alone or in combination of two or more.

  In addition, as a metal powder, for example, a metal corresponding to the 4th to 6th periods of the 4th to 6th groups of the periodic table, a metal corresponding to the 4th to 6th periods of the 10th to 12th groups, a metal corresponding to the 2nd to 3rd periods of the 13th to 14th groups (1989) (Year IUPAC classification), Mg, Fe, and Pb, and one metal selected from the group consisting of Pb or alloys of two or more alloys selected from these metals. Preferably, Au, Ag, Pt, Ta, Cr, Al, Zn, Ni, Pb, W, Zr, B, Mg, Si, Mo, Cu, Ti, Fe or other metals or two or more selected from these metals The powder which consists of these alloys can be mentioned.

  When using a granular thing as said heat conductive material, 0.1-300 micrometers is preferable from the viewpoint of heat conductivity and a handleability, and the thing of 1-30 micrometers is more preferable.

  Further, it is more preferable to add reinforcing fibers to the thermoplastic resin from the viewpoint of further improving the mechanical properties. As such reinforcing fibers, carbon fibers and graphite fibers are particularly preferably used in consideration of thermal conductivity. Moreover, the filler and the additive may be added to the thermoplastic resin from a viewpoint of improving functionality. For example, flame retardants, conductivity imparting agents, crystal nucleating agents, ultraviolet absorbers, antioxidants, vibration damping agents, antibacterial agents, insect repellents, deodorants, coloring inhibitors, heat stabilizers, mold release agents, antistatic agents Plasticizers, lubricants, colorants, pigments, dyes, foaming agents, antifoaming agents, and coupling agents.

  Furthermore, if the 2nd member is a carbon material, it is preferable from the point which can provide thermal conductivity by a comparatively small amount. For example, a carbon fiber reinforced carbon composite material, a graphite sheet, graphite and the like can be preferably exemplified.

  Furthermore, if the second member is a metal member, it is preferable from the viewpoint of enhancing the thermal conductivity although the lightness is impaired. As a metal material used for such a member, a metal material obtained by subjecting aluminum, iron, magnesium, titanium, an alloy thereof, or the like to a heat-adhesive surface treatment is preferable.

  Furthermore, the proportion of the material is preferably 30 to 90% by volume with respect to the thermoplastic resin composition, from the viewpoint of the balance between thermal conductivity and mechanical properties expressed by the thermally conductive molded body, more preferably 40 to 90% by volume.

In the first member of the thermally conductive molded body of the present invention, it is preferable that at least a part of the cross section and / or the surface portion of the reinforcing fiber is exposed. This is preferable from the viewpoint of efficiently utilizing the thermal conductivity of the reinforcing fibers disposed inside the thermally conductive molded body, and more preferably 20% or more of the substantially flat surface of the thermally conductive molded body .

  Furthermore, in the first member, it is preferable that at least a part of a cross section and / or a surface portion of the reinforcing fiber is in contact with the second member. This is preferable from the viewpoint of efficiently utilizing the thermal conductivity of both the first member and the second member. More preferably, the contact area between the first member and the second member is 20% or more.

  In the first member, it is preferable that a third member having a thermal conductivity of 10 W / m · K or more is in contact with at least a part of the cross section and / or the surface portion of the reinforcing fiber. This is preferable from the viewpoint of controlling heat transfer to the thermally conductive molded body more selectively and efficiently in practical use of the thermally conductive molded body.

  Moreover, it is preferable that the third member includes a metal material because the thermal conductivity of the heat conductive molded body of the present invention is improved.

  The metal material that is the third member is, for example, a metal that corresponds to the 4th to 6th periods of the 4th to 6th groups of the periodic table, a metal that corresponds to the 4th to 6th periods of the 10th to 12th groups, and the 13th to 14th groups. A metal corresponding to the period (1989 IUPAC classification), one metal selected from the group of Mg, Fe, and Pb, or two or more alloys selected from these metals can be given. Preferably, for example, a metal such as Au, Ag, Pt, Ta, Cr, Al, Zn, Ni, Pb, W, Zr, B, Mg, Si, Mo, Cu, Ti, or Fe, or two kinds selected from these metals The above alloys can be mentioned.

  Moreover, it is preferable from a viewpoint of improving the heat dissipation of the heat conductive member of this invention that the said 3rd member is a heat radiating member chosen from a heat sink, a heat pipe, a cooling fan, and a heat conductive sheet at least.

  The first member and the third member are well-known such as bonding with an adhesive, fitting bonding, screwing, thermal welding, vibration welding, ultrasonic welding, laser welding, insert injection molding, outsert injection molding, and the like. It can be integrated by a method.

In the first member used in the thermally conductive molded article of the present invention, the ratio (λ _{s1 / b1} ) of the maximum value (λ _b1 ) of the thermal conductivity and the minimum value (λ _s1 ) of the thermal conductivity is 0. 1 or less, because of the anisotropic thermal conductivity of the first member, for example, when it is used as a housing or member for an electric / electronic device, it selectively transmits heat. Therefore, it is preferable because it is useful in the heat dissipation design of the housing. In order to exhibit the above effect, 0.05 or less is more preferable, and particularly preferably 0.01 or less.

Furthermore, in the first member used in the thermally conductive molded body of the present invention, the ratio between the thermal conductivity (λ _s ) in the surface direction and the thermal conductivity (λ _t ) in the thickness direction of the first member. When (λ _{t / s} ) is 0.1 or less, due to the anisotropy of the thermal conductivity in the thickness direction of the first member, for example, a case or member for an electric / electronic device Furthermore, since heat can be selectively transmitted, it is preferable because it is useful in the heat radiation design of the housing. In order to exhibit the above effect, 0.05 or less is more preferable, and particularly preferably 0.01 or less.

  As a use of the thermally conductive molded body of the present invention, it can be preferably used as a housing for electric and electronic equipment from the viewpoint of having heat dissipation characteristics due to its thermal conductivity, and furthermore, a semiconductor element with high heat generation Especially suitable for sealing resin such as resistors or parts that generate high frictional heat such as bearings, fuel cell separators, automotive heat dissipation members, generators, motors, transformers, current transformers, voltage regulation Especially suitable for electrical equipment parts applications such as transformers, rectifiers, inverters, relays, power contacts, switches, circuit breakers, knife switches, other pole rods, electrical parts cabinets, sockets, relay cases, sensors, LED lamps , Connector, small switch, coil bobbin, condenser, variable capacitor case, optical pickup, oscillator, various terminal boards, transformer, plug, pre Board, tuner, speaker, microphone, headphones, small motor, magnetic head base, power module, liquid crystal, FDD carriage, FDD chassis, hard disk drive components (hard disk drive hub, actuator, hard disk substrate, etc.), DVD components (optical pickup, etc.) ), Electronic parts represented by motor brush holders, parabolic antennas, computer-related parts; VTR parts, TV parts, irons, hair dryers, rice cooker parts, microwave oven parts, acoustic parts, lighting parts, refrigerator parts, air conditioner parts , Homes such as typewriter parts, word processor parts, office electrical product parts; office computer related parts, telephone equipment related parts, facsimile related parts, copying machines Machine-related parts such as continuous parts, cleaning jigs, motor parts, lighters, typewriters, etc .; optical equipment such as microscopes, binoculars, cameras, watches, precision machine-related parts; alternator terminals, alternator connectors, IC regulator, light meter potentiometer base, various valves such as exhaust gas valve, various pipes related to fuel, exhaust system, intake system, air intake nozzle snorkel, intake manifold, fuel pump, engine coolant joint, carburetor main body, Carburetor spacer, exhaust gas sensor, cooling water sensor, oil temperature sensor, brake pad wear sensor, throttle position sensor, crankshaft position sensor, air flow meter, brake Pad wear sensor, thermostat base for air conditioner, heating hot air flow control valve, brush holder for radiator motor, water pump impeller, turbine vane, wiper motor related parts, distributor, starter switch, starter relay, transmission wire harness, window Washer nozzle, air conditioner panel switch board, coil for fuel related electromagnetic valve, fuse connector, horn terminal, electrical component insulation plate, step motor rotor, lamp socket, lamp reflector, lamp housing, brake piston, solenoid bobbin, engine oil filter, It can also be applied to various uses such as automobile / vehicle-related parts such as ignition device cases.

  The average thickness of the first member in the thermally conductive molded body of the present invention is not particularly limited. For example, in applications such as a housing for electric / electronic devices, rigidity and heat required for the housing are required. From the balance of conductivity, it is preferably 5 mm or less, more preferably 4 mm or less, and further preferably 1.5 mm or less. In applications such as a fuel cell separator, the balance between thinness and thermal conductivity required for the fuel cell separator is preferably 0.5 mm or less, more preferably 0.4 mm or less, and 0.3 mm or less. Is more preferable. Since the first member reinforced with the continuous reinforcing fiber group is excellent in mechanical properties, it can be suitably used even if the average thickness is reduced. The method for integrating the thermally conductive molded body of the present invention is not particularly limited. For example, the manufacturing method includes joining, attaching, and then cooling the second member at a temperature equal to or higher than the melting point or softening point of the thermoplastic resin layer constituting the first member.

  The procedure in the joining is not particularly limited. For example, (i) a method in which the first member is molded in advance and the second member is molded at the same time as the second member is joined and integrated; (ii) the second member is molded in advance; A method of joining and integrating the two at the same time as forming the one member, or (iii) forming the first member and the second member separately in advance, and joining and integrating the two. Can be applied.

  As a method of integration, a method of mechanically fitting and integrating the first member and the second member, a method of integrating both using mechanical coupling means such as bolts and screws, both There is also a technique of integrating the materials using chemical bonding means such as an adhesive. These methods for integrating may be used in combination as necessary.

  As a specific example of the integration method (i), the first member is press-molded, processed or post-processed into a predetermined size as necessary, then inserted into an injection mold, and then the second member. There is a technique of injection molding a material for forming a mold into a mold.

  As a specific example of the integration method (ii), the second member is press-molded or injection-molded, processed or post-processed into a predetermined size as necessary, and then inserted into a press mold, and then the press mold Laying up a base material with a thermoplastic resin layer formed on the surface of a prepreg consisting of an uncured thermosetting resin forming a first member and a group of continuous reinforcing fibers, with a mold as a predetermined process temperature Then, there is a method of molding at a temperature equal to or higher than the melting point of the thermoplastic resin.

  As a specific example of the integration method (iii), the first member is press-molded, prepared by processing or post-processing to a predetermined size as necessary, and the second member is separately molded in advance. There is a method of integrating each by heat welding, vibration welding, ultrasonic welding and the like in the same manner as the integration method (ii). Further, if any member has laser permeability, it can be integrated by laser welding.

  Among the integration methods described above, insert injection molding and outsert injection molding in the integration method (i) are preferably used from the viewpoint of mass productivity of the thermally conductive molded body. From the viewpoint of shape stability and precision of the bonded portion, the above-mentioned integration method (iii) is preferably used, and heat welding, vibration welding, ultrasonic welding, and laser welding can be preferably used.

  The heat conductive molded object of this invention may have a curved surface, a rib, a hinge, a boss | hub, and a heat conductive part. The molded body may be subjected to surface decoration treatment by plating, painting, vapor deposition, insert, stamping, laser irradiation, or the like.

[Evaluation / Measurement Method]
(1) Thermal conductivity of the heat conductive fiber of the first member The first member has a disk shape with a diameter of 10 mm and a thickness of 3 to 6 mm, and is manufactured by Vacuum Riko Co., Ltd. Laser Flash Method Thermal Constant Measuring Device TC- The specific heat and thermal diffusivity of the member are measured by 3000 and calculated by the following formula.

K = Cp · α · ρ / Vf
Here, K is the thermal conductivity of the thermally conductive fiber, Cp is the specific heat of the member, α is the thermal diffusivity of the member, ρ is the density of the member, and Vf is the volume fraction of the fiber contained in the member. The thickness of the member was changed in accordance with the thermal conductivity of the fiber, and the sample having a large thermal conductivity was thick and the sample having a small thermal conductivity was thin. Specifically, after laser irradiation, the temperature on the back surface of the sample rises, and it takes several tens of milliseconds to reach the maximum temperature. The time t until the temperature rises by 1/2 of the temperature rise width ΔTm at that time t. The thickness of the member was adjusted so that _½ was 10 msec or more (maximum 15 msec).
The specific heat was determined by pasting glassy carbon as a light receiving plate on the front surface of the sample and measuring the temperature rise after laser irradiation with an R thermocouple bonded to the center of the back surface of the sample. The measured values were calibrated using sapphire as a standard sample. The thermal diffusivity was obtained by measuring the temperature change on the back of the sample after laser irradiation with an infrared detector using a carbon spray on both sides of the sample until the surface was just invisible. When the thermal conductivity shows anisotropy, the maximum value of the measured value is a representative value. In the first member, the maximum value of the thermal conductivity (λ _b1 ) and the minimum value of the thermal conductivity (λ By deriving the ratio (λ _{s1 / b1} ) of _s1 ), the anisotropy of the thermal conductivity in the plane direction can be known. Furthermore, the ratio (λ _{t / s} ) of the thermal conductivity (λ _s ) in the plane direction and the thermal conductivity (λ _t ) in the thickness direction of the first member of the first member is derived. Thus, the anisotropy in the surface direction and the thickness direction of the thermal conductivity can be known.
(2) Thermal conductivity of second member The second member has a disk shape with a diameter of 10 mm and a thickness of 3 to 6 mm, and this member is measured by a laser flash method thermal constant measuring device TC-3000 manufactured by Vacuum Riko Co., Ltd. The specific heat and thermal diffusivity are measured and calculated by the following formula.

K = Cp ・ α ・ ρ
Here, K is the thermal conductivity of the member, Cp is the specific heat of the member, α is the thermal diffusivity of the member, and ρ is the density of the member. The thickness of the member was changed according to the thermal conductivity of the member, and the sample having a large thermal conductivity was thick and the small sample was thin. Specifically, after laser irradiation, the temperature on the back surface of the sample rises, and it takes several tens of milliseconds to reach the maximum temperature. The time t until the temperature rises by 1/2 of the temperature rise width ΔTm at that time t. The thickness of the member was adjusted so that _½ was 10 msec or more (maximum 15 msec).

The specific heat was determined by pasting glassy carbon as a light receiving plate on the front surface of the sample and measuring the temperature rise after laser irradiation with an R thermocouple bonded to the center of the back surface of the sample. The measured values were calibrated using sapphire as a standard sample. The thermal diffusivity was obtained by measuring the temperature change on the back of the sample after laser irradiation with an infrared detector using a carbon spray on both sides of the sample until the surface was just invisible. When the thermal conductivity shows anisotropy, the maximum value of the measured values is taken as a representative value.
(3) Thermal conductivity of the thermally conductive filler in the second member The thermal conductivity K of the second member (II) obtained in (2) is the volume fraction Vf of the thermally conductive filler contained in the member. It is calculated by dividing by. When the thermal conductivity shows anisotropy, the maximum value of the measured value is a representative value.

Examples are shown below.
[Adhesive layer]
Toray Industries, Ltd. ternary copolymer polyamide resin CM4000 (nylon 6/66/610, melting point 150 ° C., solubility parameter δ (SP value) 13.3) was processed into a nonwoven fabric to form an adhesive layer. The basis weight of the thermoplastic resin for heat bonding is 30 g / m ² and the single fiber fineness is 0.2 tex.
Example 1
By explaining using FIG. 5, the present embodiment can be explained more clearly.

As a prepreg constituting the first member, carbon fiber manufactured by Toray Industries, Inc. ("Treka (registered trademark)" M40J (thermal conductivity is 85 W / m · K, tensile elastic modulus 377 GPa) as a reinforcing fiber, and 130 as a matrix resin. A prepreg with a carbon fiber basis weight of 116 g / m ² and a resin content (Wr) of 30% (UD) prepreg (“TORAYCA (registered trademark)” prepreg P9053 manufactured by Toray Industries, Inc.) -12) is used.
This is cut into a predetermined size, and two prepregs are laminated so that the longitudinal direction of the reinforcing fiber group is 0 ° and 0 ° and 0 ° from above. On the top and bottom of the one prepreg, the adhesive layer cut to the same size as the molded body was placed in an overlapping manner. The laminate was set in a mold and preheated at 160 ° C. for 5 minutes in a press molding machine to melt the thermoplastic resin layer, and then cured by heating at 150 ° C. for 30 minutes while applying a pressure of 6 MPa. . After the completion of curing, it was cooled at room temperature and demolded to obtain a first member having an average thickness of 0.3 mm. The maximum thickness Tpf of the thermoplastic resin layer of the obtained first member was 25 μm, and the coating thickness Tp was 5 μm. The thermal conductivity of the carbon fiber is 85 W / m · K, and the maximum thermal conductivity of the first member is 24 W / m · K. Further, λ _{s1 / b1} and λ _{t / s} , which are ratios of thermal conductivity of the first member, are both 0.04.
(Thermal conductive molding)
The first member is inserted into an injection mold, and the liquid crystal polymer CoolPoly D2 (thermal conductivity 15 W / m) is used as the second member with respect to the surface having the thermoplastic resin layer provided on the first member. -Injection molding so that a convex part may be shape | molded by K, Chip Coolers Inc.), and an integrated molded object is obtained.
Example 2
Using the first member prepared in Example 1, a member consisting of a die pad, an element, a metal wire, and a lead is heated on a thermoplastic resin layer at 160 ° C. for 3 minutes and mounted by thermocompression bonding. Further, as a second member, a liquid crystal polymer CoolPoly D2 (thermal conductivity 15 W / m · K, Chip Coolers Inc.) processed into a sheet shape with a thickness of 3 mm (34) is disposed, and heated at 300 ° C. for 3 minutes. Then, press molding is performed to obtain an integrated molded body having the shape shown in FIG.
Example 3
For the surface of the first member having the thermoplastic resin layer prepared in Example 1, as a second member, a graphite sheet (Panasonic graphite manufactured by Matsushita Electric Works Co., Ltd., thermal conductivity 800 W / m · K) is used. Place and heat press with a hot plate at 180 ° C. for 5 minutes to fully adjust the resin of the thermoplastic resin layer to the graphite sheet, and then cool and demold. The obtained sheet can be applied not only as a thin-walled and lightweight heat radiating plate having excellent mechanical properties, but also has thermal adhesiveness to other members.
Example 4
A prepreg similar to that used in Example 1 was used as the first member. This is cut into a predetermined size, and 10 prepregs are laminated so that the longitudinal direction of the reinforcing fiber group is 0 ° and all are 0 ° from above. On the top and bottom of the one prepreg, the adhesive layer cut to the same size as the molded body was placed in an overlapping manner. The laminate was set in a mold and preheated at 160 ° C. for 5 minutes in a press molding machine to melt the thermoplastic resin layer, and then cured by heating at 150 ° C. for 30 minutes while applying a pressure of 6 MPa. . After the curing, the product was cooled at room temperature and demolded to obtain a first member having an average thickness of 1.2 mm. The maximum thickness Tpf of the thermoplastic resin layer of the obtained first member was 25 μm, and the coating thickness Tp was 5 μm. The maximum thermal conductivity of the first member was 24 W / m · K. Further, λ _{s1 / b1} and λ _{t / s} , which are ratios of thermal conductivity of the first member, are both 0.04.

A hole having a diameter of 10 mm was formed by cutting in the thickness direction of the first member on the surface of the first member prepared as described above so as to have a depth of 0.6 mm. The cross section of the hole is in a state where the fiber cross section of the carbon fiber which is a reinforcing fiber is exposed. The exposed state of the fibers can be confirmed by observation with an optical microscope, a scanning electron microscope (SEM) or a transmission electron microscope (TEM). Next, as a second member, a liquid crystal polymer CoolPoly D2 (thermal conductivity 15 W / m · K, Chip Coolers Inc.) processed into a sheet shape having a thickness of 3 mm is disposed, heated at 300 ° C. for 3 minutes, and pressed. Molding is performed to obtain an integrated molded body having the shape shown in FIG.
Example 5
Using the first member prepared in Example 4, holes were formed on the surface in the same manner as in Example 4. The cross section of this hole was in the state where the cross section of the reinforcing fiber group was exposed in the same manner as the first member created in Example 4.

  Furthermore, as a second member, a liquid crystal polymer CoolPoly D2 (thermal conductivity 15 W / m · K, Chip Coolers Inc.) processed into a sheet shape having a thickness of 3 mm is disposed, heated at 300 ° C. for 3 minutes, and press-molded. Further, a heat dissipating member (heat sink) made of aluminum (thermal conductivity 220 W / m · K) and having a side of 12 mm and a height of 6 mm is disposed as the third member from above, It joins with the member of 2 and the integrated molded object of the shape of FIG. 9 is obtained.

The integrated molded body consisting of the first member and the second member of Examples 1 to 5 is not only excellent in thermal conductivity, but each member is firmly bonded, and is excellent in light weight and mechanical properties. Furthermore, in the first member, the anisotropy of the thermal conductivity is within the scope of the present invention, and can be suitably used for, for example, a housing of an electronic / electrical device or an internal heat dissipation member.

It is an expanded sectional view of the joined part in the heat conductive fabrication object of the present invention. It is sectional drawing which shows the result of having observed the heat conductive molded object of this invention by the 1st test method. It is sectional drawing which shows the result of having observed the heat conductive molded object of this invention by the 2nd test method. It is a perspective view which shows the result of having observed the heat conductive molded object of this invention by the 3rd test method. It is a perspective view which shows the heat conductive molded object of Example 1 of this invention. It is a perspective view which shows the heat conductive molded object of Example 2 of this invention. It is a perspective view which shows the heat conductive molded object of Example 4 of this invention. It is sectional drawing which shows the heat conductive molded object of Example 4 of this invention. It is a perspective view which shows the heat conductive molded object of Example 5 of this invention. It is sectional drawing which shows the heat conductive molded object of Example 5 of this invention.

Explanation of symbols

3 First member 4 Second member 5a, 5b Reinforcing fiber 6 Thermosetting resin 7 Thermoplastic resin layer 8 Reinforcing fiber group 9 Interface 10 between thermosetting resin and thermoplastic resin layer First member and second Interface 11 with member 11 First member 12 Second member 13 Thermoplastic resin layer 14 Reinforcing fiber groups 15a, 15b Reinforcing fiber 16 Thermosetting resin 17 Interface 18 between thermosetting resin and thermoplastic resin layer First Member 19 second member 20 thermosetting resin 21 reinforcing fiber group 22a, 22b reinforcing fiber 23 interface 24 between thermosetting resin and thermoplastic resin layer void 25 where thermoplastic resin layer was present second member 26 Joint portion 27 with first member 27 Residue 28 First member 29 Second member 30 Metal wire 31 Element 32 Die pad 33 Lead 34 First member 35 Second member 36 Hole 37 Third member ( Heat conduction member)
38 Second member

Claims (16)

A molded body obtained by integrating at least two members of a first member and a second member, and the first member of the members is composed mainly of a thermosetting resin reinforced with a continuous reinforcing fiber group. And a thermoplastic resin layer at a joint portion between the first member and the second member, and the thermoplastic resin layer includes a group of reinforcing fibers of the reinforcing fiber group. The thermoplastic resin layer is integrated with a thermosetting resin layer reinforced with a group of continuous reinforcing fibers and has an uneven shape at the interface thereof, and includes the reinforcing fibers. The maximum thickness of the region is 10 to 1000 μm, the thermal conductivity of the reinforcing fiber is 3 W / m · K or more, and the thermal conductivity of the second member is 1 W / m · K or more. A heat conductive molded product characterized. The heat conductive molded object according to claim 1, wherein the reinforcing fiber group includes at least one fiber selected from metal fibers, carbon fibers, and metal-coated fibers. The heat conductive molded object according to claim 1 or 2, wherein the reinforcing fiber group is a carbon fiber having a thermal conductivity of 10 W / m · K or more. The heat conductive molded object according to any one of claims 1 to 3, wherein the resin of the thermoplastic resin layer is interposed in a film shape at a joint portion with the second member. The heat conductive molded object of Claim 4 whose average thickness of the said film is 0.01-1000 micrometers. The heat conductive molded object in any one of Claims 1-5 whose solubility parameter (delta) (SP value) of the said thermoplastic resin exists in the range of 9-16. The thermally conductive molded body according to any one of claims 1 to 6, wherein the first member is a laminate. The second member is substantially at least one member selected from the group consisting of a member made of a thermoplastic resin composition, a member made of a carbon material, and a member made of a metal material, or substantially the first member. The heat conductive molded object in any one of Claims 1-7 which is a member of the same structure in general. The thermally conductive molded body according to any one of claims 1 to 8, wherein in the first member, at least a part of a cross section and / or a surface portion of the reinforcing fiber in the member is exposed. The thermally conductive molded article according to claim 9, wherein in the first member, at least a part of a cross section and / or a surface portion of the reinforcing fiber in the member is in contact with the second member. The heat conductive molded object according to any one of claims 1 to 10, wherein a third member having a heat conductivity of 10 W / m · K or more is in contact with the first member. The heat conductive molded object according to claim 11, wherein the third member is a heat radiating member selected from the group consisting of a heat sink, a heat pipe, a cooling fan, and a heat conductive sheet. In the first member, a ratio (λs1 / b1) between a maximum value (λb1) of thermal conductivity and a minimum value (λs1) of thermal conductivity is 0.1 or less. The heat conductive molded object of description. The ratio (λt / s) of the thermal conductivity (λs) in the surface direction of the first member to the thermal conductivity (λt) in the thickness direction of the first member is 0.1 or less. The heat conductive molded object in any one of -13. The said heat conductive molded object is a battery separator, the housing | casing and internal member of an electric / electronic device, a heat radiating component, member, or panel for a motor vehicle, a two-wheeled vehicle, an aircraft, and a building material use, The any one of Claims 1-14. Thermally conductive molded body. The first member and the second member are integrated by a method selected from the group consisting of heat welding, vibration welding, ultrasonic welding, laser welding, insert injection molding, outsert injection molding, and hot press molding. The manufacturing method of the heat conductive molded object in any one of Claims 1-15.

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