JP4900622B2 - Polishing brush - Google Patents

Description

The present invention relates to a polishing brush configured by binding a plurality of brush bristle materials.

Conventionally, a polishing brush using a monofilament made of a synthetic resin containing abrasive grains as a brush bristle material has been used in polishing a metal surface such as a steel plate and an end face. As such an abrasive brush, an abrasive brush made of a bristle material in which abrasive grains made of silicon carbide, alumina oxide or the like are incorporated into a polyamide resin such as nylon has been widely used. For example, Patent Document 1 discloses a bristle material for a polishing brush in which silicon carbide abrasive particles are added to a polyamide resin.
JP 2002-283242 A

In recent years, hard materials such as silicon blocks and ceramic materials are increasing as objects to be polished, and in particular, the demand for removing microcracks on the surface of hard materials is increasing. However, the conventional polishing brush has a problem that the polishing power is insufficient and sufficient polishing processing that satisfies the requirements cannot be performed.

Therefore, an object of the present invention is to realize a polishing brush having a large polishing power and suitable for polishing hard materials.

This invention is a polishing brush for achieving the above object, and in the invention according to claim 1, a plurality of brush bristle materials and the plurality of brush bristle materials are bundled and the outer peripheral surface thereof is covered. In the polishing brush comprising: a binding member for binding; and a brush holder for gripping a base portion of the bundled plurality of brush bristle materials and detachably fixing to a brush driving unit of a brush polishing apparatus. The material is a monofilament made of a polyester resin containing abrasive grains formed by coating nickel or an alloy containing nickel as a main component on the surface of diamond particles, and the polyester resin of the brush bristle material is ethylene-2, 6-Naphthalate unit is contained 60 mol% or more, the wire diameter is φ0.4 mm to φ1.0 mm, the amount of abrasive grains to be contained in the brush bristle material, The technical means that it is 10 to 40 parts by weight with respect to 100 parts by weight of the polyester resin of the brush bristle material and is used to remove microcracks on the surface of the silicon block .

According to invention of Claim 1, since the polyester resin which comprises a brush bristle material is hard compared with the resin material conventionally used for the monofilament, and its bristle is strong, it can make polishing power large. it can. Further, since polishing can be performed by exposing diamond having extremely high hardness from the surface of the monofilament, polishing power can be increased. In addition, by coating the surface of the diamond particles with nickel or an alloy containing nickel as a main component, irregularities larger than the diamond particle surface are formed on the surface of the abrasive grains, and an anchoring effect on the resin material is generated. It can be made difficult to miss. Thereby, a high polishing power can be maintained for a long time.
As the polyester resin, a polymer containing 60 mol% or more of ethylene-2,6-naphthalate units, for example, a polyethylene naphthalate resin can be suitably used. A monofilament made of a polyester resin containing 60 mol% or more of ethylene-2,6-naphthalate units is preferable because it has high rigidity and can increase polishing power. The wire diameter of the brush bristle material is preferably in the range of 0.4 to 1.0 mm. When the wire diameter is less than 0.4 mm, the rigidity of the brush bristle material becomes low, so that a sufficient polishing force cannot be obtained. Further, when the wire diameter exceeds 1.0 mm, the material of the brush bristle material employed in the present invention is harder than that of the prior art, so that the rigidity becomes too high, and it becomes brittle and easily broken.
The abrasive grains contained in the brush bristle material are preferably 10 to 40 parts by weight with respect to 100 parts by weight of the polyester resin. When the amount is less than 10 parts by weight, a sufficient amount of abrasive grains are not exposed from the filament surface, so that a sufficient polishing force cannot be obtained. When the amount exceeds 40 parts by weight, the strength of the monofilament is lowered and easily broken. .
According to the polishing using the polishing brush of the present invention, the polishing force can be efficiently polished with a large polishing force, and an excessive force is not applied to the object to be polished unlike polishing using a grindstone. Thus, there is no fear of introducing new cracks, and it can be particularly suitably used for removing microcracks on the surface of the silicon block.

According to a second aspect of the present invention, in the polishing brush according to the first aspect , a technical means is used in which an average particle diameter of the diamond particles is 5 μm to 150 μm .

As in the second aspect of the present invention, the average particle diameter of the diamond particles is preferably 5 to 150 μm. When the average particle size is less than 5 μm, a sufficient polishing force cannot be obtained, and when the average particle size exceeds 150 μm, the strength of the monofilament is lowered and easily broken.

According to a fourth aspect of the present invention, in the polishing brush according to any one of the first to third aspects, the brush holder is an insertion hole into which the bases of a plurality of bundled brush hair materials are inserted. And a technical means that a brush driving unit provided in the brush polishing apparatus is provided with a detachable gripping part .

As in the third aspect of the present invention, the amount of nickel or nickel-based alloy coated on the surface of the diamond particles is preferably 45 to 65% by weight of the entire abrasive grains. When the amount is less than 45% by weight, unevenness on the surface of the abrasive grains is not sufficiently formed, so that the bonding force with the brush bristle material is small, and as a result, the abrasive grains fall off during polishing and the polishing efficiency decreases. . On the other hand, when the amount exceeds 65% by weight, the exposure rate of the surface of the abrasive grains decreases, so that the polishing efficiency decreases.

According to a fourth aspect of the present invention, in the polishing brush according to any one of the first to third aspects, the amount of abrasive grains to be contained in the brush bristle material is 100 weight of the polyester resin of the brush bristle material. The technical means of 10 to 40 parts by weight per part is used.

According to the fourth aspect of the present invention , it is possible to manufacture the polishing brush by simply binding the bristle material and inserting and fixing the base portion into the insertion hole of the brush holder. In addition, since the brush drive unit provided in the brush polishing apparatus is provided with a detachable gripping part, and the polishing brush can be easily attached and detached, the efficiency of the polishing work can be improved.

It is a partial cross section explanatory view of the polishing brush of this embodiment. It is explanatory drawing which shows the state which attached the grinding | polishing brush of this embodiment to the brush attachment jig | tool of a brush grinding | polishing apparatus, Comprising: FIG. 2 (A) is a partially notched front view, FIG.2 (B) is FIG. It is a bottom view of (A). It is a cross-sectional explanatory view of the silicon block before and after polishing in the example. 3A is a cross-sectional explanatory view of the silicon block before polishing and FIG. 3B is a cross-sectional explanatory view of the silicon block after polishing.

The polishing brush of this invention is demonstrated with reference to figures.

As shown in FIG. 1, the polishing brush 10 is formed by bundling a plurality of brush bristle materials 11 containing diamond particles as abrasive grains, covering the outer peripheral portion 11 a with a bundling member 12, bundling them, and bundling them. A base 11b of the brush bristle material 11 is held by a brush holder 13 and configured. In this embodiment, the brush holder 13 is detachably attached to an insertion hole 13a into which the base 11b of the brush bristle material 11 is inserted and a brush driving unit (corresponding to the attachment member 21 in FIG. 2) provided in the brush polishing apparatus. The base portion 11b of the brush bristle material 11 is fixed to the insertion hole 13a with an adhesive or the like.

The brush bristle material 11 is a monofilament made of a polyester resin having a circular cross section in which abrasive grains coated with nickel or an alloy containing nickel as a main component are contained on the surface of diamond particles. This monofilament is produced by mixing a predetermined amount of abrasive grains with a polyester resin, melt spinning, and then stretching as necessary.

In the polishing brush 10 using the brush bristle material 11 formed in this way, the polyester resin is harder than nylon resin or the like conventionally used for monofilaments, and the bristle is strong, so that the polishing power can be increased. . Further, since polishing can be performed by exposing diamond particles having extremely high hardness from the surface of the monofilament, the polishing power can be increased.

The polyester resin used in the present invention includes polyethylene naphthalate, polyethylene terephthalate, polymethylene terephthalate, polytetramethylene terephthalate, polypropylene terephthalate, polymethylene naphthalate, polytetramethylene naphthalate, polypropylene naphthalate, and the main components thereof. Copolyester etc. can be used.

The polyester resin used in the present embodiment is a polymer containing 60 mol% or more of ethylene-2,6-naphthalate units, and a polyethylene naphthalate resin can be suitably used. A monofilament made of a polyester resin containing 60 mol% or more of ethylene-2,6-naphthalate units is preferable because it has high rigidity and can increase polishing power. If this polyethylene naphthalate resin is less than 40 mol%, it can contain dicarboxylic acid components such as terephthalic acid, isophthalic acid and phthalic acid, and diol components such as ethylene glycol, propylene glycol and tetramethylene glycol.

The abrasive grains of the brush bristle material 11 are formed by coating the surface of diamond particles with nickel or an alloy containing nickel as a main component. In this embodiment, abrasive grains in which the surface of diamond particles is coated with nickel by electroless plating are used.

Diamond particles used for abrasive grains are generally irregular in shape, but their surface irregularities (roughness) are small, so when incorporated in a resin material in that state, the bonding force with the resin material is small, and brushing is performed during polishing. Easily missing from hair material. By coating the surface of the diamond particles with nickel or a nickel-based alloy, irregularities larger than the irregularities of the diamond particle surface are formed, resulting in an anchor effect on the resin material. can do. Thereby, it is possible to continue polishing while maintaining a high polishing force for a long time.

As the coating method, various methods such as electroplating after sputtering and physical adhesion by mechanical alloying can be adopted in addition to electroless plating.

Here, the amount of nickel or nickel-based alloy to be coated is preferably 45 to 65% by weight of the entire abrasive grains. When the amount is less than 45% by weight, unevenness on the surface of the abrasive grains is not sufficiently formed, so that the bonding force with the brush bristle material is small, and as a result, the abrasive grains fall off during polishing and the polishing efficiency decreases. . On the other hand, when the amount exceeds 65% by weight, the exposure rate of the surface of the abrasive grains decreases, so that the polishing efficiency decreases.

Further, when the particle diameter of diamond particles used for the abrasive grains is increased, the polishing power is increased and the polishing efficiency can be improved. On the other hand, when the diamond particle size is reduced, a large polishing force cannot be obtained, but the surface roughness of the object to be polished can be reduced. Here, the average particle diameter of the diamond particles is preferably 5 to 150 μm. When the average particle size is less than 5 μm, a sufficient polishing force cannot be obtained, and when the average particle size exceeds 150 μm, the strength of the monofilament of the brush bristle material 11 is lowered and is easily broken.

The amount of abrasive grains contained in the brush bristle material 11 is preferably 10 to 40 parts by weight with respect to 100 parts by weight of the brush bristle material 11 (polyester resin). When the amount is less than 10 parts by weight, a sufficient amount of abrasive grains are not exposed from the surface of the brush bristle material 11, so that sufficient polishing power cannot be obtained. The strength is reduced and it becomes easy to break.

The wire diameter of the brush bristle material 11 (monofilament) is preferably in the range of 0.4 to 1.0 mm. When the wire diameter is less than 0.4 mm, the bristle material 11 has a low rigidity, so that a sufficient polishing force cannot be obtained. On the other hand, when the wire diameter exceeds 1.0 mm, the rigidity becomes too high, and it is fragile and easily broken.

The binding member 12 is made of a resin material such as rubber, silicon rubber, or polyvinyl chloride, and covers the outer peripheral portion 11 a of the brush bristle material 11 to bind the brush bristle material 11. In addition, the front-end | tip part of the brush bristle material 11 shown in FIG. 1 of this embodiment is in the state exposed slightly, The bundling of the front-end | tip part of the brush bristle material 11 in the process of coat | covering the said resin material. For this purpose, the binding member 12 covered (applied) on the outer peripheral portion 11a of the brush bristle material 11 is dried and solidified. After that, the material to be removed can be a string or a rubber band.

The binding member 12 formed in this manner binds the brush bristle material 11 and restrains deformation in the polishing direction. Therefore, even if the brush bristle material 11 is lengthened, sufficient rigidity can be obtained on the hair end side. it can. Thereby, the polishing brush 10 can obtain a high polishing force. Further, since the binding member 12 is made of a resin material, the binding member 12 gradually breaks in accordance with the consumption due to the polishing of the tip of the brush bristle material 11, and maintains the desired rigidity, while the brush bristle material is maintained. Polishing can be performed with the tip of 11 exposed.

Here, the binding member 12 is not limited to the application of the resin material, but can be formed by closely attaching a tape or a tube by heating or the like. Moreover, if the rigidity of the brush bristle material 11 is sufficiently obtained, it is not necessary to cover the entire outer peripheral portion 11a, and the length of the binding member 12 and the formation position on the outer peripheral portion 11a can be arbitrarily set.

A state in which the polishing brush 10 of this embodiment is attached to the brush attachment jig 20 of a brush polishing apparatus (not shown) will be described with reference to FIGS. 2 (A) and 2 (B).

As shown in FIGS. 2A and 2B, the brush mounting jig 20 includes a cylindrical rotating member 22 with an upper lid to which a rotating shaft 30 of a brush polishing apparatus is connected to an upper lid, and an inside of the rotating member 22. In addition, a plurality of polishing brushes 10 are attached by tightening the mounting screw 25 for the polishing brush, and the positioning screw 26 is fixed in the vertical direction by tightening the fixing screw 26 for the mounting member, but the fixing screw 26 is loosened. The mounting member 21 of the polishing brush whose vertical position can be adjusted by means of the above, and the mounting member 21 is moved vertically so as to be on the extension line of the rotating shaft 30 at the center position inside the rotating member 22. A brush shaft 1 that is slidable when adjusting, and a brush bristle material 1 of the polishing brush 10 that is detachably attached to a lower end opening of the rotating member 22. A support member 23 for positioning of the tip portion, and is composed of.

The attachment member 21 of the present embodiment is formed with fifteen attachment holes 21a configured so that the polishing brush 10 can be attached and detached at predetermined intervals. A magnet 21b is provided on the mounting surface of the mounting hole 21a. When the brush holder 13 is inserted into the mounting hole 21a, the magnet 21b holds the brush holder 13 by suction. The polishing brush 10 is fixed to the mounting member 21 by tightening the brush holder 13 with the mounting screw 25. Thus, since the polishing brush 10 can be easily attached and detached, the efficiency of the polishing operation can be improved.

Further, a bush 21c is provided at the center of the mounting member 21 so that the vertical movement can be smoothly performed by sliding on the sliding shaft 24 that is passed therethrough.

Further, the support member 23 is formed with an insertion hole 23a into which a bush 23b through which the brush bristle material 11 is inserted, and the tip of the brush bristle material 11 is polished by a predetermined amount from the outer surface of the support member 23. After projecting to the object side, the projecting positioning of the tip of the brush bristle material 11 is performed by tightening the fixing screw 26.

Next, when the rotating shaft 30 of the brush polishing apparatus is driven to rotate, the rotating member 22 and the attaching member 21 are rotated integrally with the brush attaching jig 20. As a result, a plurality of polishing brushes 10 attached to the attachment member 21 can be rotated about the rotation shaft 30 as a rotation center. Polishing can be performed by pressing the polishing brush 10 of the brush mounting jig 20 against the object to be polished by a moving mechanism of a brush polishing apparatus (not shown) and relatively moving the object to be polished and the polishing brush.

When the tip of the brush bristle material 11 is worn by polishing and the brush bristle material 11 exposed from the insertion hole 23a of the support member 23 is shortened, the attachment member 21 is moved to the support member 23 side, and a predetermined amount of brush Polishing can be continued by exposing the bristle material 11 to the object to be polished. Thereby, the brush bristle material 11 can be used up without waste, and the frequency | count of replacement | exchange of the polishing brush 10 accompanying abrasion of the brush bristle material 11 can be decreased.

The polishing brush 10 of the present invention can be suitably used for polishing hard materials such as silicon blocks and ceramic materials. In these hard materials, if there are micro cracks on the surface, it will cause a significant decrease in strength and cause damage at the time of subsequent processes and use. Therefore, it is important to remove these micro cracks in the polishing process. . According to the polishing using the polishing brush 10 of the present invention, since the polishing power is large, these hard materials can be efficiently polished, and an excessive force is applied to the object to be polished like polishing using a grindstone. Therefore, there is no possibility that new cracks are introduced in the polishing process. Thus, the polishing brush 10 can be particularly suitably used for removing microcracks on the surface of the hard material.

(Example of change)
The cross-sectional shape of the brush bristle material 11 can be an ellipse, a triangle, a rectangle, and other irregular shapes in addition to a circle. The brush holder 13 can be formed of various structural materials. For example, the base 11a may be formed by casting a resin material. Moreover, although the cylindrical brush holder 13 was shown in FIG. 1, it is not limited to this, It can select suitably according to the shape of the attachment hole 21a of the attachment member 21. FIG.

(Example)
Examples relating to polishing using the polishing brush of the present invention will be described. As the object to be polished, a single crystal silicon block formed on a square column was used. In addition, this invention is not limited to the following embodiment.

The polishing brushes A to D used in this example are constituted by using monofilaments shown in Table 1 as brush bristle materials and planting them to an outer diameter of 22.6 mm and a hair length of 125 mm. Polyethylene naphthalate (PEN) was used as the resin material of the brush bristle material, and the diamond particles were coated with a nickel coating of 56% by weight of the abrasive grains on the surface of the diamond grains. The amount of abrasive grains was 20 parts by weight with respect to 100 parts by weight of polyethylene naphthalate as a brush bristle material. The particle size of the diamond particles was set to 4 levels, and the particle sizes were increased from small to small in the order of brushes A, B, C, and D.

Using the polishing brushes A to D, polishing (hereinafter referred to as F surface processing) of the longitudinal side surface portion (hereinafter referred to as F surface) of the single crystal silicon block and the corner portion (hereinafter referred to as R portion) where the F surface intersects. ) (Hereinafter referred to as R section machining). In the F-face processing, using the support member 21 shown in FIG. 2 (B), 15 polishing brushes and a rotation diameter of 180 mm were arranged in the brush holder. In the R portion processing, five polishing brushes and a rotation diameter of 60 mm were arranged in the brush holder.

The polishing conditions were as follows: the rotation speed of the polishing brush was 1,720 min ⁻¹ , the depth of cut was 1.0 mm, the processing time was 60 seconds per time, and the feed rate of the object to be polished was 10 mm per second. In the F surface processing, the polishing brush was pressed perpendicularly to the F surface, and in the R portion processing, polishing was performed by pressing the polishing brush against the R portion at an angle of 45 degrees.

Table 2 shows the amount of grinding by polishing and the surface roughness (Ry) of the F surface and R part after polishing. Since the polishing power increases in the order of the polishing brushes A, B, C, and D, the grinding amount increases in the order of the polishing brushes A, B, C, and D in the F surface and the R portion. In particular, when the F surface processing was performed with the polishing brush A, it was possible to grind 100 μm or more by one polishing, and polishing with a high polishing force was possible. The surface roughness is large to small in the order of the polishing brushes D, C, B, and A. When the F surface processing was performed with the polishing brushes C and D, a smooth polished surface having a surface roughness of 1 μm or less could be obtained.

In the silicon block, the initial microcrack existing on the surface is about 100 μm, so that a grinding amount of 100 μm or more is necessary to remove the microcrack by polishing. In order to increase the polishing efficiency, remove microcracks, and reduce the surface roughness, for example, after polishing using the polishing brush A, polishing may be performed using the polishing brush D. Further, the polishing brush C may be used for polishing three times. A plurality of brush polishing apparatuses (not shown) are arranged on a straight line, a plurality of brush mounting jigs 20 shown in FIGS. 2A and 2B are arranged, and an abrasive (diamond particle diameter) is placed on the brush mounting jig 20. Polishing brushes can be arranged in the order of particle size from large to small, and polishing can be performed in this order. Thus, the combination of polishing brushes and the polishing method can be appropriately selected according to the state of the target polished surface.

A cross section of the silicon block before and after polishing is shown in FIG. 3A is a cross-sectional explanatory view of the silicon block before polishing and FIG. 3B is a cross-sectional explanatory view of the silicon block after polishing. The polishing process uses polishing brushes A⇒B⇒D, the rotation speed of the polishing brush is 1,420 min ⁻¹ , the cutting amount of each polishing brush is 0.5 mm, the processing time of each polishing brush is 60 seconds, and the object to be polished The feed rate was 10 mm per second. Before the polishing process, a crack having a length of 100 μm was present on the surface of the silicon block, but it was removed after the polishing process.

As described above, according to the polishing brush of the present invention, it is possible to efficiently polish a silicon block, which is a hard material, to obtain a desired surface roughness and to be suitably used for removing microcracks on the surface. Was confirmed.

[Effects of embodiments for carrying out the invention]
According to the polishing brush 10 of the present invention, the polyester resin constituting the brush bristle material 11 is harder than the resin material conventionally used for monofilaments and has a strong bristle, so that the polishing power can be increased. it can. Further, since the diamond having extremely high hardness can be polished by exposing it from the surface of the brush bristle material 11, the polishing power can be increased. In addition, by coating the surface of the diamond particles with nickel or an alloy containing nickel as a main component, irregularities larger than the diamond particle surface are formed on the surface of the abrasive grains, and an anchoring effect on the resin material is generated. It can be made difficult to miss. Thereby, a high polishing power can be maintained for a long time. In the brush polishing, an excessive force is not applied to the object to be polished as compared with polishing with a grindstone or the like, and therefore the polishing brush of the present invention can be suitably used particularly for removing microcracks on the surface of a hard material. Even better by setting the polyester resin, the amount of nickel or nickel-based alloy coated on the surface of the diamond particles, the amount of abrasive particles contained in the brush bristle material, and the average particle size of the diamond particles as favorable conditions Effects can be obtained.

DESCRIPTION OF SYMBOLS 10 Polishing brush 11 Brush bristle material 12 Binding member 13 Brush holder 13a Insertion hole 13b Gripping part 20 Brush mounting jig

Claims (4)

A plurality of brush bristles, a bundling member that bundles the plurality of brush bristles, covers and binds the outer peripheral surface thereof, and grips a base of the plurality of bristled brush bristles. In a polishing brush composed of a brush holder that is detachably fixed to the brush drive unit,
The brush bristle material is a monofilament made of a polyester resin containing abrasive grains formed by coating nickel or an alloy containing nickel as a main component on the surface of diamond particles,
The brush bristle polyester resin contains 60 mol% or more of ethylene-2,6-naphthalate units,
The wire diameter is φ0.4 mm to φ1.0 mm,
The amount of abrasive grains contained in the brush bristle material is 10 to 40 parts by weight with respect to 100 parts by weight of the polyester resin of the brush bristle material ,
A polishing brush used for removing microcracks on the surface of a silicon block . The polishing brush according to claim 1, wherein an average particle diameter of the diamond particles is 5 μm to 150 μm. The polishing brush according to claim 1 or 2, wherein the amount of nickel or a nickel-based alloy coated on the surface of the diamond particles is 45 to 65% by weight of the abrasive grains. The brush holder includes an insertion hole into which a base portion of a plurality of bundled brush bristle materials is inserted, and a grip portion that is detachable from a brush driving unit provided in the brush polishing apparatus. The polishing brush according to any one of claims 1 to 3.

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