JP4889687B2 - Adapter for card - Google Patents

Description

  The present invention relates to a card adapter.

  Conventionally, in electronic devices such as personal computers, mobile phones, PDAs (Personal Digital Assistants), digital cameras, video cameras, music players, game consoles, vehicle navigation devices, SIM (Subscriber Identity Module) cards, MMC (R) (Multi Media Card), SD (R) (Secure Digital) card, miniSD (R) card, xD Picture Card (R) (xD-Picture card), Memory Stick (R), Memory Stick Duo (R), SmartMedia In order to use various memory cards such as (R), T-Flash (Trans-Flash) memory card, Micro SD (R) card, etc. Kuta is provided.

  In recent years, with the diversification of electronic devices, memory cards tend to be diversified. Therefore, a card connector that can be loaded with not only one type of memory card but also a plurality of types of memory cards has been proposed. However, since such a card connector is relatively large, It is difficult to attach to a small electronic device. Therefore, a card adapter has been proposed that allows a memory card to be loaded into a card connector for other types of memory cards (see, for example, Patent Document 1).

  FIG. 15 shows a conventional card adapter.

  In the figure, reference numeral 910 denotes a lower case of the card adapter, and includes a bottom plate 911. Reference numeral 920 denotes an upper case of the card adapter, and includes an upper plate 921. The card adapter has an insert molding member 930 that is integrally formed with a terminal member 950 that contacts one end of a memory card contact pad (not shown) and the other end contacts a card connector terminal (not shown). The insert molding member 930 is fixed while being sandwiched between the lower case 910 and the upper case 920. Reference numeral 940 denotes an opening / closing cover that is rotatably attached to the insert molding member 930.

Then, with the memory card loaded in the space between the lower case 910 and the upper case 920 and the open / close cover 940 closed, the card adapter is loaded into the card connector. Thereby, the contact pad of the memory card is electrically connected to the terminal of the card connector via the terminal member 950.
JP 2006-32097 A

  However, since the conventional card adapter is configured such that the insert molding member 930 is sandwiched between the lower case 910 and the upper case 920, the overall thickness is increased, and a small memory with a small thickness is obtained. It is impossible to adapt the card to the card connector. Since the insert molding member 930 is a member in which a contact pad of a memory card and a terminal member 950 that conducts a terminal of the card connector are formed integrally, the periphery of the terminal member 950 made of a metal plate is covered. Yes. For this reason, the insert molding member 930 is considerably thick, and as a result, the conventional card adapter is thick.

  The present invention solves the problems of the conventional card adapter and arranges a thin wiring board in which a thin film-like conductive trace is formed in the case, and connects the insertion portion of the connection terminal to the through of the wiring board. By inserting and connecting to the hole, the overall thickness is thin, and it can be adapted to a card connector for small cards, and the electrical connection state between the connection terminal and the wiring board is reliably maintained. Accordingly, an object of the present invention is to provide a highly reliable card adapter that can reliably maintain an electrical connection state between the card and the card connector.

  Therefore, in the card adapter of the present invention, the first card is accommodated in the housing formed by joining the first plate member and the second plate member, and is loaded into the card connector into which the second card is loaded. A possible card adapter, a connection terminal provided in the housing, the contact terminal being in contact with a contact pad of the first card, and an insertion portion extending in a thickness direction of the housing; A wiring board disposed in the housing such that the first surface faces the first plate member and the second surface faces the second plate member, and is formed on the second surface and is used for the card An adapter-side contact pad that contacts a connector terminal, a through-hole penetrating in the plate thickness direction, and formed on the first surface and / or the second surface to connect the through-hole and the adapter-side contact pad. And a wiring substrate and a radiation, wherein the insertion portion is connected from the first surface side is inserted into the through hole.

  In the other card adapter of the present invention, the connection terminal further includes a base portion held by the terminal holding member, an arm portion having one end fixed to the base portion and the contact portion connected to the free end, The base is connected to the side opposite to the arm part, and includes a board connection part including the insertion part, and the base part is disposed outside the wiring board.

  In still another card adapter of the present invention, the board connection portion further includes a horizontal portion connected to the insertion portion at one end and extending substantially parallel to the first surface. The arm portion is disposed at a position near the inner surface of the first plate member or the second plate member, and the arm portion extends obliquely from the base portion so that a free end approaches the second plate member or the first plate member. .

  In still another card adapter according to the present invention, the board connection portion further includes a rising portion having both ends connected to the base portion and the horizontal portion and extending in the thickness direction of the housing, and is U-shaped. The base is disposed at a position near the inner surface of the second plate member, and the arm extends obliquely from the base so that a free end approaches the first plate member.

  In still another card adapter of the present invention, the first plate member further includes a board receiving portion that receives at least a part of the wiring board, and the wiring board has a second surface on the board receiving section. Is positioned in the thickness direction of the housing.

  In still another card adapter of the present invention, the terminal holding member is accommodated between the first plate member and the second plate member outside the wiring board, and the first plate member and the second plate member are accommodated. The plate member includes a protruding stopper member formed between the terminal holding member and the wiring board.

  According to the present invention, in the card adapter, a thin wiring board on which a thin film-like conductive trace is formed is disposed in the case, and the insertion portion of the connection terminal is inserted into the through hole of the wiring board for connection. . As a result, the overall thickness is small, and the card connector can be adapted to a small card, and the electrical connection state between the connection terminal and the wiring board can be reliably maintained. Therefore, the electrical connection state between the card and the card connector can be reliably maintained, and the reliability can be improved.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  FIG. 1 is a perspective view of a card adapter according to an embodiment of the present invention as viewed from above, FIG. 2 is a perspective view of the card adapter according to an embodiment of the present invention as viewed from below, and FIG. FIG. 4 is a top view showing a card adapter in the embodiment, FIG. 4 is a three-side view showing a card mounted on the card adapter in the embodiment of the present invention, and FIG. 5 is a card in the card adapter in the embodiment of the present invention. FIG. 6 is a top view showing a state in which a card is attached to the card adapter in the embodiment of the present invention, and FIG. 7 is a card adapter in the embodiment of the present invention. FIG. 8 is a perspective view showing the main components of the card adapter according to the embodiment of the present invention. 4, (a) shows the upper surface, (b) shows the lower surface, and (c) shows the side surface. In FIG. 8, (a) shows the upper surface of the internal substrate, (b) shows the lower surface of the internal substrate, (c ) Is the outer surface of the upper plate, (d) is the inner surface of the upper plate, (e) is the inner surface of the lower plate, (f) is the card lock fitting, (g) is the disassembled internal terminal unit, (h) is the internal The terminal unit is assembled.

  In the figure, reference numeral 101 denotes a card adapter according to the present embodiment, which can be loaded into the card connector 1 according to the present embodiment, which will be described later, with the first card 201 loaded. The card connector 1 is originally a connector into which a second card (not shown) is loaded, and is attached to an electronic device (not shown). When the second card is loaded into the card connector 1, the second card is loaded into the electronic device via the card connector 1. When the card adapter 101 loaded with the first card 201 is loaded into the card connector 1, the first card 201 is loaded into the electronic device via the card connector 1 and the card adapter 101. The

  The electronic device is, for example, a personal computer, a mobile phone, a PDA, a digital camera, a video camera, a music player, a game machine, a vehicle navigation device, or the like, but may be any type of device.

  The first card 201 and the second card are, for example, a SIM card, an MMC (R), an SD (R) card, a miniSD (R) card, an xD picture card (R), a memory stick (R), and a memory stick. IC cards such as Duo (R), SmartMedia (R), T-Flash memory card, and micro SD (R) card, which may be any type of card, but the first card 201 is the second one. It is assumed that the type of card is smaller than that of the card. Here, a case where the first card 201 is a micro SD (R) card and the second card is an xD picture card (R) will be described as an example.

  In the present embodiment, the expressions indicating directions such as upper, lower, left, right, front, rear, etc. used for explaining the configuration and operation of each part of the card adapter 101 and the card connector 1 are as follows. The card adapter 101 and the card connector 1 and the card connector 1 are suitable not when they are absolute but relative, and are suitable when the card adapter 101 and the card connector 1 or their components are in the posture shown in the figure. Alternatively, when the postures of these parts change, they should be interpreted according to the change in the posture.

  Here, the card adapter 101 includes an upper plate 120 as a first plate member which is a plate-like member integrally formed of an insulating material such as a synthetic resin, and similarly an insulating material such as a synthetic resin. A lower plate 110 as a second plate member, which is a plate-shaped member formed integrally with the material, and the upper plate 120 and the lower plate 110 are overlapped and joined to form the card adapter 101. A housing 109 is formed.

  Since the card adapter 101 is to be loaded into the card connector 1 into which the second card is loaded, the card adapter 101 has an outer shape and dimensions similar to the outer shape and dimensions of the second card. As described above, in the present embodiment, since the second card is an xD picture card (R), the length is 20 [mm], the width is 25 [mm], and the thickness is 1. 7 [mm]. Accordingly, as shown in FIGS. 1 to 3, the card adapter 101 has a plate shape similar to that of the second card, and each dimension is a length, that is, a distance between the front end 101a and the rear end 101b. 20 [mm], the width, that is, the distance between the right end 101c and the left end 101d is 25 [mm], and the thickness, that is, the distance between the outer surface of the upper plate 120 and the outer surface of the lower plate 110 is 1.7 [. mm].

  A display unit 104 is formed on the outer surface of the upper plate 120 in the vicinity of the front end 101a. The display unit 104 is a rectangular flat part, and is used to display various types of information such as product names, manufacturer names, and notes, or various types of graphics such as simple patterns and symbols. The display of the information or the graphic may be directly printed on the display unit 104 or may be performed by sticking the printed information on the sheet-like seal member to the display unit 104. Good. The display unit 104 can be omitted.

  A recess 108 is formed in the left end 101 d of the card adapter 101. The concave portion 108 engages with an engaging convex portion provided in the slide member of the card connector 1. In addition, in the part of the said recessed part 108, since the upper board 120 protrudes on the left side rather than the lower board 110, the said recessed part 108 is formed only in the upper board 120. FIG.

  A card accommodation space 102 is opened at the right end 101c of the card adapter 101, and the first card 201 is inserted into the card accommodation space 102 from the right end 101c. Therefore, a first insertion instruction mark 105 a indicating the insertion direction of the first card 201 is formed in the vicinity of the right end 101 c on the outer surface of the upper plate 120.

  Between the upper plate 120 and the lower plate 110, as shown in FIG. 8, an internal substrate 130 as a wiring substrate, an internal terminal unit 140, and a card lock fitting 161 are disposed. Further, the first card 201 is inserted and accommodated in the card accommodation space 102 formed between the upper plate 120 and the lower plate 110.

  As described above, in the present embodiment, the first card 201 is a micro SD® card, and has a substantially rectangular plate shape as shown in FIG. That is, the distance between the front end 201a and the rear end 201b is 15 [mm], the width, that is, the distance between the right end 201c and the left end 201d is 11 [mm], the thickness, that is, the first surface 217 and the second end. The distance from the surface 218 is 0.7 [mm]. A plurality of (eight in the example shown in the figure) card-side contact pads 251 are arranged along the front end 201a at the lower surface, that is, at a position near the front end 201a on the second surface 218. Yes.

  A recess 212 is formed at the right end 201c of the first card 201, and a front notch 213 is formed near the front end 201a. The concave portion 212 engages with the engaging convex portion 161 a of the card lock fitting 161. The front notch 213 is formed by missing the corners of the front end 201a and the right end 201c of the first card 201 over a predetermined range, and has a substantially trapezoidal shape. As a result, a narrow portion narrower than the portion near the rear end is formed in the portion near the front end 201a of the first card 201, and the width dimension is 9.7 [mm].

  As shown in FIG. 8E, the lower plate 110 of the card adapter 101 is a substrate that receives at least a part of the card receiving portion 111, the pad corresponding opening 112, the terminal receiving portion 114, and the inner substrate 130. A receiving portion 115 is provided on the inner surface. Further, as shown in FIG. 8D, the upper plate 120 of the card adapter 101 receives at least a part of the card receiving portion 121, the pad corresponding portion 122, the terminal receiving portion 124, and the internal substrate 130. A substrate receiving portion 125 is provided on the inner surface.

  Further, the card receiving portion 111 of the lower plate 110 includes a card receiving floor plate 111a facing the second surface 218 of the first card 201, card holding portions 111b disposed on both sides of the card receiving floor plate 111a, A metal fitting receiving recess 111c formed in a portion facing the right end 201c of the first card 201 is provided. Further, the card receiving portion 121 of the upper plate 120 includes a card receiving top plate 121 a that faces the first surface 217 of the first card 201. When the upper plate 120 and the lower plate 110 are overlapped and joined, the space between the card receiving floor plate 111a and the card receiving top plate 121a becomes the main part of the card receiving space 102.

  The card pressing portion 111b is formed so as to be substantially perpendicular to the card receiving floor plate 111a, and the upper end portion thereof is formed in a hook shape substantially parallel to the card receiving floor plate 111a, and the card receiving floor plate 111a. Projects inward from both sides. As shown in FIG. 5, the lower surface of the bowl-shaped portion faces the first surface 217 in the vicinity of the right end 201c and the left end 201d of the first card 201 inserted into the card accommodation space 102. . That is, the movement of the first card 201 inserted into the card accommodation space 102 in the thickness direction is restricted by the card pressing portion 111b. In the state where the upper plate 120 and the lower plate 110 are overlapped and joined, the upper end surface of the card pressing portion 111b is substantially flush with the outer surface of the upper plate 120.

  A card lock fitting 161 is received in the fitting receiving recess 111c. The card lock fitting 161 is a member formed by bending a metal plate and can be elastically deformed. And the engagement convex part 161a of the card | curd metal fitting 161 protrudes toward the inner side of the card | curd receiving floor board 111a from the opening formed in the side wall of the metal fitting recessed part 111c, and the 1st card accommodated in the card | curd accommodation space 102 The first card 201 is locked by engaging with the recess 212 of the 201. That is, the first card 201 accommodated in the card accommodation space 102 is prevented from being extracted from the card accommodation space 102.

  The terminal receiving portion 114 of the lower plate 110 includes a terminal receiving groove 114a, a mold stopper 114b as a protruding stopper member, and a terminal tip receiving recess 114c. Further, the terminal receiving portion 124 of the upper plate 110 includes a mold portion receiving recess 124a and a mold portion stopper 124b. When the upper plate 120 and the lower plate 110 are overlapped and joined, a space is formed between the terminal receiving portions 114 and 124, and the internal terminal unit 140 is accommodated in the space.

  Here, as shown in FIGS. 8G and 8H, the internal terminal unit 140 includes an in-adapter card connection terminal 150 and a mold portion as a terminal holding member for holding the in-adapter card connection terminal 150. 141. The in-adapter card connection terminal 150 is a connection terminal that contacts the contact pad of the first card 201, that is, the card side contact pad 251, and is integrally formed from a conductive plate material having a spring property such as a metal plate. It is a member. The in-adapter card connection terminal 150 is press-fitted into a holding groove (not shown) of the mold part 141 and held by the mold part 141, and one end is connected to the base part 151 and fixed. That is, a cantilever-like arm portion 152 whose free end can be elastically displaced in the vertical direction, and the card side of the first card 201 connected to the free end of the arm portion 152 and accommodated in the card accommodating space 102. A contact portion 153 that is in contact with and in contact with the contact pad 251;

  Further, the adapter card connection terminal 150 includes a board connection part 154 that is connected to the base 151, extends to the opposite side of the arm 152, and is connected to the internal board 130. The board connection portion 154 is a rod-like portion bent so that the side surface has an inverted U-shape. The board connecting portion 154 has a lower end connected to the base 151, a rising portion 154a extending from the base 151 in the thickness direction of the housing 109 and upward, and an upper end of the rising portion 154a. And a horizontal portion 154b extending substantially parallel to the base 151, that is, substantially parallel to the first surface 130a and the second surface 130b of the internal substrate 130, and an upper end at the tip of the horizontal portion 154b. And an insertion portion 154 c that is connected and extends in the thickness direction of the housing 109. That is, the insertion portion 154 c extends downward substantially perpendicularly to the base portion 151, is inserted into the through hole 135 that penetrates the internal substrate 130 in the thickness direction, and is electrically connected to the wiring 133.

  The mold part 141 is a member integrally formed of an insulating material such as a synthetic resin, and includes a plurality of holding grooves (not shown) formed on the lower surface of the main body part 141a. The base 151 of the connection terminal 150 is inserted. The adapter card connection terminals 150 are held by the main body portion 141a of the mold portion 141 in a state where a plurality (8 in the example shown in the figure) are arranged side by side, and as shown in FIG. 8 (h). An internal terminal unit 140 is formed. Note that the number and pitch of the card connection terminals 150 in the adapter can be appropriately changed so as to correspond to the number and pitch of the card side contact pads 251 of the first card 201.

  When the internal terminal unit 140 is accommodated in the space formed between the terminal receiving portions 114 and 124, the upper end portion 141b of the mold portion 141 is accommodated in the mold portion accommodating recess 124a of the upper plate 120. Further, the base portion 151 of each adapter card connection terminal 150 is located near the inner surface of the lower plate 110 outside the internal substrate 130, and the arm portion 152 and the contact portion 153 are accommodated in each of the plurality of terminal accommodating groove portions 114a. Is done. The arm portion 152 extends obliquely upward from the base portion 151, that is, so as to approach the upper plate 120. The terminal tip receiving recess 114c is a portion formed to be recessed deeper than the terminal receiving groove 114a at the tip of the terminal receiving groove 114a, and the tip of the contact portion 153 is received. In the example shown in the figure, the bottom of the terminal tip receiving recess 114c is formed so as to penetrate the lower plate 110, and the tip of the contact portion 153 can be seen from the lower surface of the card adapter 101 as shown in FIG. However, the bottom of the terminal tip accommodating recess 114c is not necessarily formed so as to penetrate the lower plate 110, and may be closed.

  In the example shown in the figure, the internal substrate 130 has a substantially L-shape, and is used for connection between the first part 131 which is a part used for connection with the card connector 1 and the first card 201. It consists of the second part 132 which is the part used. Then, when the upper plate 120 and the lower plate 110 are overlapped and joined, a substrate receiving space is formed between the substrate receiving portion 125 of the upper plate 120 and the substrate receiving portion 115 of the lower plate 110, and the substrate receiving space within the substrate receiving space is formed. The second part 132 is accommodated in the container. Further, the first portion 131 is accommodated between the pad corresponding portion 122 of the upper plate 120 and the pad corresponding opening 112 of the lower plate 110.

  The internal substrate 130 is formed by laminating one or a plurality of plate materials made of a composite material such as a prepreg in which a base material such as glass fiber or carbon fiber is impregnated with a resin such as epoxy resin, or a plate material made of an inorganic material such as ceramics. A thin-film conductive trace made of a conductive metal or the like is formed on the surface of the insulating plate member formed by a technique such as etching, vapor deposition, welding, coating, or printing. In addition, when the said insulating board member is provided with a some layer, the said conductive trace can also be formed between the adjacent layers in the inside of the said insulating board member. In the example shown in the figure, a plurality of wirings 133 and lands 134 formed around the through holes 135 are formed as conductive traces on the upper surface of the internal substrate 130, that is, the first surface 130 a. . In addition, a plurality of wirings 133 and a plurality of adapter-side contact pads 136 as adapter-side connection terminals are formed as conductive traces on the lower surface of the internal substrate 130, that is, the second surface 130b. When the internal board 130 is mounted in the card adapter 101, the first surface 130a faces the inner surface of the upper plate 120, and the second surface 130b faces the inner surface of the lower plate 110.

  The through hole 135 has a conductive film formed on the inner surface thereof, and is connected to the land 134 in the same manner as a general through hole. Then, as shown in FIG. 7, the board connection portions 154 of the card connection terminals 150 in each adapter have their insertion portions 154c inserted into the corresponding through holes 135 from the first surface 130a side, and solder, conductive adhesive They are connected using a conductive fixing agent such as an agent. In this case, it is desirable that the conductive fixing agent enters the through hole 135 so that the space between the peripheral surface of the insertion portion 154c and the inner surface of the through hole 135 is filled with the conductive fixing agent.

  The number and pitch of the through holes 135 can be changed as appropriate so as to correspond to the number and pitch of the card connection terminals 150 in the adapter. Since each wiring 133 is connected to the conductive film of the through hole 135 via the land 134 or directly, the insertion portion 154 c connected to the through hole 135 is connected to the corresponding wiring 133. Each wiring 133 is connected to a corresponding adapter-side contact pad 136 via a via (not shown), that is, a via-hole. Therefore, the board connection portion 154 of each adapter card connection terminal 150 is connected to the corresponding adapter-side contact pad 136 via the through hole 135 and the wiring 133. The number and pitch of the adapter side contact pads 136 are set to be the same as the number and pitch of the card side contact pads (not shown) of the second card.

  In the example shown in the figure, the number of adapter-side contact pads 136 is 18. The number and pitch of the adapter-side contact pads 136 correspond to the number and pitch of terminals 51 described later of the card connector 1, And it can change suitably so that it may respond | correspond with the number and pitch of the card | curd side contact pad of a 2nd card | curd. Further, it is not always necessary that all the adapter side contact pads 136 and all the in-adapter card connection terminals 150 are connected to each other. Further, the adapter side contact pads 136 and the in-adapter card connection terminals 150 are in a one-to-one relationship. They do not need to be connected to each other. Which adapter-side contact pad 136 and which adapter card connection terminal 150 are to be connected can be appropriately set as necessary. For example, when the number of adapter-side contact pads 136 is larger than the number of in-adapter card connection terminals 150 as in the example shown in the figure, the adapter-side card connection terminals 150 are not necessarily included in all the adapter-side contact pads 136. Need not be connected, and some of the adapter-side contact pads 136 may be not connected to the adapter card connection terminal 150. And the number and the wiring of the wiring 133 are also arbitrarily set according to the connection mode between the adapter side contact pad 136 and the adapter internal card connection terminal 150.

  Further, in a state where the internal board 130 is mounted in the card adapter 101, the adapter-side contact pad 136 is located outside the card adapter 101 from the pad corresponding opening 112 of the lower plate 110 as shown in FIG. Exposed. Thus, when the card adapter 101 is loaded into the card connector 1, the terminal 51 of the card connector 1 comes into contact with the adapter-side contact pad 136 and is electrically connected. From the viewpoint of reliably maintaining the contact state between the terminal 51 and the adapter-side contact pad 136, the position of the adapter-side contact pad 136 with respect to the thickness direction of the card adapter 101 (the direction perpendicular to the drawing in FIG. 3) is It becomes important.

  Therefore, in the card adapter 101, the positioning of the internal board 130 in the thickness direction of the card adapter 101 is performed using the second surface 130b on which the adapter-side contact pad 136 is formed as a reference surface. In this case, the surface of the substrate receiving portion 115 of the lower plate 110 is set as a reference surface on the card adapter 101 side. Then, the second surface 130b is brought into contact with the surface of the substrate receiving portion 115, and the inner substrate 130 is pressed against the lower plate 110 by the upper plate 120, whereby the thickness direction of the card adapter 101 of the inner substrate 130 is related. Perform positioning.

  The substrate receiving portion 125 of the upper plate 120 is formed with substrate pressing protrusions 127 as a plurality of protrusions that protrude toward the lower plate 110. The substrate pressing protrusion 127 can be deformed at least at a portion in contact with the first surface 130 a of the internal substrate 130. The substrate pressing protrusion 127 has a pointed tip, and the lower end, that is, the tip is easily deformed. Therefore, when the thickness of the internal substrate 130 varies and the second surface 130b of the internal substrate 130 is brought into contact with the surface of the substrate receiving portion 115 of the lower plate 110, the first substrate 130a and the upper surface of the internal substrate 130 are in contact with each other. Even if the gap between the surface of the plate 120 and the substrate receiving portion 125 varies, the variation is absorbed by the deformation of the tip of the substrate pressing protrusion 127, so that the inner substrate 130 is lowered by the upper plate 120. It can be pressed against the plate 110. Similarly, a plurality of substrate pressing protrusions 127 are also formed on the pad corresponding portion 122 of the upper plate 120. Accordingly, the first portion 131 and the second portion 132 of the internal substrate 130 are both pressed against the lower plate 110 by the upper plate 120 through the substrate pressing protrusion 127, whereby the thickness of the card adapter 101 is increased. Positioned with respect to the vertical direction.

  In addition, positioning posts 117 extending toward the upper plate 120 are formed on both side ends of the pad corresponding opening 112 of the lower plate 110. On the other hand, positioning recesses 137 that engage with the positioning posts 117 are formed on both side ends of the first portion 131 of the internal substrate 130. By positioning the positioning recess 137 with the positioning post 117, positioning of the internal board 130 in the length and width directions of the card adapter 101 is performed.

  A plurality of coupling protrusions 116 projecting toward the lower plate 110 are formed on the peripheral edge of the lower plate 110 except for portions corresponding to the openings of the card accommodation space 102. On the other hand, a plurality of coupling recesses 126 are formed on the peripheral edge of the upper plate 120 at positions corresponding to the coupling protrusions 116 except for portions corresponding to the openings of the card accommodation space 102.

  When the upper plate 120 and the lower plate 110 are overlapped and connected to form the housing 109 of the card adapter 101, each connecting protrusion 116 is fitted into the corresponding connecting recess 126. Let Thereby, alignment with the upper board 120 and the lower board 110 is performed. Then, the upper plate 120 and the lower plate 110 are fixed by, for example, ultrasonic welding. In this case, by applying ultrasonic vibration to the upper plate 120 and the lower plate 110, the tip of the coupling protrusion 116 is mainly melted and welded to the coupling recess 126. Note that the method of fixing the upper plate 120 and the lower plate 110 is not limited to ultrasonic welding, and for example, heating welding for heating the upper plate 120 and the lower plate 110 may be used. It may be a chemical welding that applies a chemical such as an adhesive to the mating surface of 120 and the lower plate 110.

  Next, a connection structure between the adapter card connection terminal 150 and the internal substrate 130 will be described in detail.

  FIG. 9 is a diagram showing a connection state between the connection terminal and the internal substrate when the internal substrate is thick in the embodiment of the present invention, and FIG. 10 is a case where the internal substrate is thin in the embodiment of the present invention. FIG. 11 is a diagram showing a connection state between the connection terminal and the internal substrate when the first card is loaded in the embodiment of the present invention. 9A is a cross-sectional view taken along line XX in FIG. 3, FIG. 9B is an enlarged view of a portion A in FIG. 10, and FIG. 10A is a cross-sectional view along line XX in FIG. An arrow sectional view, (b) is the B section enlarged view of (a), and in Drawing 11, (a) is a YY arrow sectional view of Drawing 6, and (b) is the C section enlarged of (a). FIG.

  As described above, the insulating plate member of the internal substrate 130 is a composite such as a prepreg in which a base material such as glass fiber or carbon fiber is impregnated with a resin such as an epoxy resin, as in the case of a general printed circuit board. It is difficult to control the thickness because it is formed by laminating one or more plates made of inorganic materials such as ceramics, ceramics, etc., and the thickness is the same as in general printed circuit boards. The variation of the will become large. The thickness dimension of an insulating plate member of a general printed circuit board varies within a range of about ± 25% of a reference value. However, it is theoretically possible to narrow the allowable range of the thickness dimension of the insulating plate member, but in that case, the cost of the insulating plate member increases and the cost of the internal substrate 130 increases. From an economic point of view, it is no longer realistic. Therefore, the internal substrate 130 has a variation in thickness, and some of the internal substrates 130 are thick and some are thin. Therefore, when connecting the card connection terminal 150 in the adapter to the internal substrate 130, adopting a surface mounting method that is a method of soldering the flat back of the tail part of the terminal to a flat pad on the substrate, The position of the board connection portion 154 of the in-adapter card connection terminal 150 in the thickness direction of the card adapter 101 greatly varies according to the change in the thickness of the internal board 130.

  Therefore, in the present embodiment, as described above, the insertion portion 154 c of the adapter card connection terminal 150 extending in the thickness direction of the card adapter 101, that is, the vertical direction, is inserted into the through hole 135 of the internal substrate 130. It is inserted and connected using a conductive adhesive such as solder or conductive adhesive. In this case, even if the thickness of the internal board 130 varies, the position of the board connection portion 154 of the adapter card connection terminal 150 in the thickness direction does not vary.

  The positioning of the internal substrate 130 in the vertical direction is performed with the second surface 130b as a reference surface, and the second surface 130b is in contact with the surface of the substrate receiving portion 115 of the lower plate 110. The variation in height is expressed as a variation in the position of the first surface 130a in the vertical direction. When the thickness of the internal substrate 130 is thick, as shown in FIG. 9B, the position of the first surface 130a becomes high. Further, when the thickness of the internal substrate 130 is thin, the position of the first surface 130a is lowered as shown in FIG.

  If the board connection part 154 is formed so that the position of the horizontal part 154b is sufficiently high and the length of the insertion part 154c is sufficiently long, even when the thickness of the internal board 130 is thick, The position of the connecting portion 154 is not raised, and the insertion portion 154 c is not pulled out from the through hole 135 even when the internal substrate 130 is thin. Therefore, regardless of the thickness of the internal substrate 130, the position and posture of the adapter card connection terminal 150 can be kept constant, and the connection between the insertion portion 154c and the through hole 135 can be maintained.

  Since the position and orientation of the card connection terminal 150 in the adapter are constant regardless of the thickness of the internal substrate 130, the gap between the arm 152 and the bottom surface of the terminal receiving groove 114a, that is, the size of the gap is small. It becomes constant. Therefore, the connection between the adapter card connection terminal 150 and the card-side contact pad 251 of the first card 201 can be reliably maintained.

  The arm portion 152 of the in-adapter card connection terminal 150 is a cantilever-like member whose free end can be elastically displaced in the vertical direction. When the first card 201 is loaded in the card adapter 101, FIG. As shown in (b), the contact portion 153 connected to the free end of the arm portion 152 is displaced downward by the card side contact pad 251 formed on the second surface 218 of the first card 201, so that the arm The part 152 is elastically displaced downward, thereby exerting a spring force. The contact portion 153 is biased against the card side contact pad 251 by the spring force, and the contact between the contact portion 153 and the card side contact pad 251 is reliably maintained. The connection with the side contact pad 251 is reliably maintained.

  In this case, the spring force is substantially proportional to the amount of displacement of the arm portion 152. Therefore, if the gap between the arm portion 152 and the bottom surface of the terminal receiving groove portion 114a is reduced, that is, when the arm portion 152 is positioned on the card receiving floor plate 111a side, the card side contact pad 251 of the first card 201 is contacted. Since the displacement amount of the arm portion 152 of the card is small, the spring force is small, and the contact between the contact portion 153 and the card side contact pad 251 becomes unstable. The connection with will be uncertain. However, in the present embodiment, the insertion portion 154c of the card connection terminal 150 in the adapter is inserted and connected to the through hole 135 of the internal substrate 130, so that the arm portion 152 and the bottom surface of the terminal receiving groove portion 114a are connected. Therefore, the connection between the adapter card connection terminal 150 and the card-side contact pad 251 can be reliably maintained.

  In the state where the first card 201 is loaded in the card adapter 101, the card lock fitting 161 engages and locks with the recess 212 of the first card 201, so that the first card 201 is connected to the internal terminal unit 140. Positioning is performed so as not to contact the mold part 141. That is, as shown in FIG. 11B, a gap is formed between the front end 201a of the first card 201 and the card side end 141c of the main body portion 141a of the mold portion 141. Therefore, the position of the internal terminal unit 140 in the card adapter 101 does not change before and after the first card 201 is loaded.

  However, the force with which the card lock fitting 161 locks the first card 201 is not so large. For example, as in the case where the user forcibly pushes the first card 201 into the card accommodation space 102 with a finger or the like, When one card 201 receives a large external force in the back direction (left direction in FIG. 11B), the first card 201 may be moved further in the back direction in the card accommodation space 102. possible. In such a case, if the amount of movement of the first card 201 in the back direction is large, the front end 201a of the first card 201 comes into contact with the card side end 141c of the main body portion 141a, and the main body portion 141a also moves in the back direction. It may be moved.

  However, in the present embodiment, the mold part stopper 114b is formed on the lower plate 110, and the mold part stopper 124b is also formed on the upper plate 120. Therefore, when the main body 141a receives an external force in the back direction via the first card 201, the substrate side end 141d of the main body 141a abuts against the mold stoppers 114b and 124b, so the main body 141a is in the back. It is not moved in the direction. That is, the movement of the main body portion 141a in the depth direction is blocked by the mold portion stoppers 114b and 124b.

  Therefore, even if the first card 201 receives a large external force in the back direction and comes into contact with the mold part 141, the internal terminal unit 140 is not moved in the back direction. There is no transmission to the internal board 130 via the board connection portion 154. Thereby, the internal terminal unit 140 and the internal substrate 130 are not damaged by the external force.

  In the state where the external force is not received by the main body portion 141a, a slight gap is generated between the substrate side end 141d of the main body portion 141a and the mold portion stoppers 114b and 124b, as shown in FIG. 11B. It is desirable that

  Further, when the thickness of the internal substrate 130 is large, as shown in FIG. 9B, the position of the first surface 130a becomes high, so that the gap between the first surface 130a and the inner surface of the upper plate 120 is increased. It becomes narrower and the deformation amount of the substrate pressing protrusion 127 becomes larger. On the other hand, when the thickness of the internal substrate 130 is thin, as shown in FIG. 10B, the position of the first surface 130a is lowered, so that the gap between the first surface 130a and the inner surface of the upper plate 120 is small. It becomes wider and the deformation amount of the substrate pressing projection 127 becomes smaller. However, whether the internal substrate 130 is thick or thin, the internal substrate 130 is pressed against the lower plate 110 by the upper plate 120 via the substrate pressing protrusion 127. Therefore, regardless of the thickness of the internal substrate 130, the internal substrate 130 can be positioned in the vertical direction, and the position of the second surface 130b in the vertical direction can be maintained constant.

  Next, the configuration of the substrate pressing protrusion 127 will be described in detail.

  FIG. 12 is a diagram showing the configuration of the substrate pressing protrusion in the embodiment of the present invention, and FIG. 13 is a diagram for explaining the deformation state of the substrate pressing protrusion in the embodiment of the present invention. 12A is a perspective view showing the inner surface of the upper plate, FIG. 12B is an enlarged view of the D part of FIG. 13A, and FIG. 13A is a state before pressing the internal substrate. , (B) to (f) respectively show deformation states of the substrate pressing protrusions.

  As described above, each of the plurality of substrate pressing protrusions 127 has a sharp tip. In the example shown in FIGS. 12 and 13, the substrate pressing protrusion 127 has a triangular prism shape having a cross section of a right triangle and extending parallel to the surface of the pad corresponding portion 122 of the upper plate 120. The first side surface is a vertical surface 127a perpendicular to the surface of the pad corresponding portion 122, the second side surface of the triangular prism is an inclined surface 127b inclined with respect to the surface of the pad corresponding portion 122, and the triangular prism The third side surface is a bottom surface integrated with the surface of the pad corresponding part 122. Further, the boundary line between the vertical surface 127 a and the inclined surface 127 b is a ridge line 127 c that is the tip of the substrate pressing protrusion 127.

  As described above, the tip of the substrate pressing protrusion 127 has a sharp shape, and thus is easily deformed. Therefore, when the inner substrate 130 is pressed against the lower plate 110 by the upper plate 120, even if the inner substrate 130 has a thickness variation, the variation is absorbed by the deformation of the tip of the substrate pressing protrusion 127. be able to. For example, when the thickness of the internal substrate 130 is thick, as shown in FIG. 13E, the deformation amount of the substrate pressing protrusion 127 is large, and for example, when the thickness of the internal substrate 130 is thin. As shown in FIG. 13F, the deformation amount of the substrate pressing protrusion 127 is reduced. As a result, even if the thickness of the internal substrate 130 varies, the second surface 130b, which is the reference surface of the internal substrate 130, is maintained while keeping the distance between the inner surface of the upper plate 120 and the inner surface of the lower plate 110 constant. By pressing against the inner surface of the lower plate 110, the position of the second surface 130b in the vertical direction can be kept constant.

  In addition, when the thickness of each part of the internal substrate 130 varies, the first surface 130a is not flat and is distorted (distorted), or when the internal substrate 130 is wavy and the first surface 130a is not flat and is distorted. Even in this case, the distortion of the first surface 130a can be absorbed by the deformation of the tip of the substrate pressing protrusion 127. For example, when the internal substrate 130 has undulations and the first surface 130a is not flat and distorted, the deformation amount of each substrate pressing protrusion 127 is as shown in FIG. 13A and FIG. 13B. Is different. Thus, even if the first surface 130a of the internal substrate 130 is distorted, the second surface 130b is made the inner surface of the lower plate 110 while maintaining a constant distance between the inner surface of the upper plate 120 and the inner surface of the lower plate 110. Can be pressed.

  Further, the central axis of the substrate pressing protrusion 127 is inclined in the direction of the vertical surface 127a. That is, the substrate pressing protrusion 127 has a right-angled triangle cross section, and a center line drawn from the tip to the bottom surface is inclined in the direction of the vertical surface 127a. Therefore, when the tip comes into contact with the first surface 130a of the internal substrate 130 and receives an upward force, the tip is easily deformed so as to be inclined in the direction of the vertical surface 127a. The vertical surfaces 127a, the inclined surfaces 127b, and the ridge lines 127c of all the substrate pressing protrusions 127 are parallel to each other. That is, the central axes of all the substrate pressing protrusions 127 are inclined in the same direction. Therefore, as shown in FIGS. 13C and 13D, all the substrate pressing protrusions 127 are easily deformed so that the tips thereof are inclined in the same direction.

  Therefore, the force generated by the deformation of the tip and applied to the internal substrate 130 is in the same direction in all the substrate pressing protrusions 127, and is pressed against the inner surface of the lower plate 110 through the substrate pressing protrusions 127. The internal substrate 130 is stabilized. However, a force can be applied to the internal substrate 130 even if the direction in which the tip is inclined is different for each substrate pressing protrusion 127. However, as described above, if the direction is the same direction, the substrate pressing protrusion 127 is interposed. The internal substrate 130 pressed against the inner surface of the lower plate 110 is further stabilized.

  In addition, when the upper plate 120 and the lower plate 110 are fixed by ultrasonic welding, the applied ultrasonic vibration is also transmitted to the substrate pressing protrusion 127. Usually, in ultrasonic welding, since ultrasonic vibration concentrates on the tip of the pointed portion of the member, the tip of the pointed portion generates heat and becomes soft easily. Therefore, when the upper plate 120 and the lower plate 110 are fixed by ultrasonic welding, the tip of the substrate pressing protrusion 127 is also heated and softened by ultrasonic vibration. As a result, the tip of the substrate pressing protrusion 127 is easily deformed, so that variations in the thickness of the internal substrate 130, distortion of the first surface 130a, waviness of the internal substrate 130, etc. can be easily absorbed. The inner substrate 130 is not excessively pressed by the tip of the projection 127. Therefore, the internal substrate 130 is not damaged by the tip of the substrate pressing protrusion 127.

  Next, an outline of the card connector 1 in which the card adapter 101 is loaded will be described.

  FIG. 14 is a perspective view showing the card connector according to the embodiment of the present invention.

  Here, the card connector 1 is integrally formed of an insulating material such as a synthetic resin, and is formed of a housing 11 that houses the card adapter 101 or the second card, and a plate made of a conductive material such as metal. A shell 61 is formed as a case formed by performing processing such as punching and bending and attached to the upper side of the housing 11. As shown in FIG. 14, the card connector 1 has a substantially flat rectangular parallelepiped shape, is attached to an electronic device, and is attached to the card adapter 101 or the second from the front (lower left in FIG. 14). A card is inserted. Here, the card adapter 101 is oriented so that the surface from which the adapter-side contact pad 136 serving as the adapter-side connection terminal is exposed, that is, the lower plate 110 is down and the upper plate 120 is up. It demonstrates as what is inserted in the connector 1 for cards in such an orientation. Also, the second card will be described as being inserted into the card connector 1 in such a direction that the surface on which the card side contact pad is exposed faces down.

  A terminal 51 as a connector side terminal is attached to the upper surface of the bottom wall portion of the housing 11. The base of the terminal 51 is attached to the bottom wall, and a tip (not shown) formed at the tip extends obliquely upward toward the back and protrudes above the upper surface of the bottom wall. Yes. The front end portion of the terminal 51 functions as a contact portion and comes into contact with the adapter side contact pad 136 exposed from the pad corresponding opening 112 of the lower plate 110 of the card adapter 101 or the card side contact pad of the second card. Connected. Further, a solder tail portion extending from the base portion of the terminal 51 protrudes forward from an edge on the near side of the bottom wall portion, and conductive lines, contact pads, terminals, etc. formed on a wiring board or the like in the electronic device That is, it is electrically connected to the mating terminal member by soldering or the like. A ground plate 65 made of a metal plate is disposed on the front edge side of the housing 11.

  A card guide mechanism slide member for guiding the card adapter 101 or the second card inserted into the card connector 1 is attached to one side wall of the housing 11 so as to be slidable in the front-rear direction. Yes.

  Here, the slide member includes an engaging convex portion, and the engaging convex portion engages with the concave portion 108 of the card adapter 101 or the concave portion of the second card. The slide member holds the card adapter 101 or the second card and moves in the front-rear direction together with the card adapter 101 or the second card. The sliding member is moved in the direction opposite to the insertion direction of the card adapter 101 or the second card, that is, in the discharging direction of the card adapter 101 or the second card by an urging member such as a coil spring that functions as a compression spring. Be energized.

  The card connector 1 is used when the card adapter 101 or the second card is inserted into the card connector 1 or when the card adapter 101 or the second card is taken out from the card connector 1. This is a so-called push-in push-out type or push / push type that requires an operation of pushing the card adapter 101 or the second card. That is, when the card adapter 101 or the second card moves in the insertion direction and reaches the terminal point by a push operation of pushing the card adapter 101 or the second card in the insertion direction, the urging member With the urging force, the card adapter 101 or the second card can be moved from the terminal point in the direction opposite to the insertion direction and discharged.

  Thus, in the present embodiment, the card adapter 101 accommodates the first card 201 in the housing 109 formed by joining the upper plate 120 and the lower plate 110, and the card into which the second card is loaded. The connector 1 can be loaded. Further, the card adapter 101 is disposed in the housing 109, and includes a contact portion 153 that contacts the card side contact pad 251 of the first card 201 and an insertion portion 154c that extends in the thickness direction of the housing 109. An internal card 130 provided in the housing 109 with an in-adapter card connection terminal 150 and a first surface 130a facing the upper plate 120 and a second surface 130b facing the lower plate 110; Formed on the two surfaces 130b, formed on the adapter-side contact pads 136 that come into contact with the terminals 51 of the card connector 1, the through holes 135 penetrating in the plate thickness direction, the first surface 130a and / or the second surface 130b, An internal substrate 130 having a wiring 133 that connects the through hole 135 and the adapter-side contact pad 136.The insertion portion 154c is inserted and connected to the through hole 135 from the first surface 130a side.

  As a result, the card adapter 101 has a small overall thickness and can be adapted to the card connector 1 for a small second card. Further, even if the thickness of the internal substrate 130 is not constant, the electrical connection between the adapter card connection terminal 150 and the internal substrate 130 can be reliably maintained. Therefore, the electrical connection state between the first card 201 and the card connector 1 can be reliably maintained, and the reliability can be improved.

  Further, the adapter card connection terminal 150 includes a base portion 151 held by the mold portion 141, an arm portion 152 having one end fixed to the base portion 151 and a contact portion 153 connected to the free end, and an arm portion in the base portion 151. And a board connection portion 154 including an insertion portion 154c. The base portion 151 is disposed outside the internal substrate 130. Thereby, the thickness of the card adapter 101 can be reduced.

  Furthermore, the board connection portion 154 further includes a rising portion 154a that is connected to the base portion 151 and the horizontal portion 154b at both ends and extends in the thickness direction of the housing 109, and has a U-shape. Arranged at a position closer to the inner surface of the plate 110, the arm portion 152 extends obliquely from the base portion 151 so that the free end approaches the upper plate 120. Accordingly, when the thickness of the internal substrate 130 varies and the second surface 130 b of the internal substrate 130 is brought into contact with the surface of the substrate receiving portion 115 of the lower plate 110, the first surface 130 a of the internal substrate 130. And the board receiving portion 125 of the upper plate 120, even if there are variations in the distance, the connection between the board connection portion 154 and the through hole 135, and the adapter card connection terminal 150 and the card side contact pad 251. The connection with is reliably maintained.

  Further, the inner substrate 130 is positioned in the thickness direction of the housing 109 by the second surface 130 b abutting against the surface of the substrate receiving portion 115 of the lower plate 110. Thereby, the position of the adapter side contact pad 136 formed in the 2nd surface 130b becomes fixed, and it can contact with the terminal 51 of the connector 1 for cards reliably.

  Further, the mold part 141 is accommodated between the upper plate 120 and the lower plate 110 outside the internal substrate 130, and the upper plate 120 and the lower plate 110 are formed between the mold part 141 and the internal substrate 130. Protruding mold part stoppers 114b and 124b are provided. As a result, even if the first card 201 receives a large external force in the back direction and abuts against the mold part 141, the internal terminal unit 140 is not moved in the back direction. Is not transmitted to the internal board 130 via the board connecting portion 154.

  In the present embodiment, the first card 201 is attached to the card adapter 101 in such a posture that the first surface 217 faces the upper plate 120 and the second surface 218 faces the lower plate 110. The case of loading has been described. This is because the surface of the first card 201 where the card-side contact pad 251 is present and the surface of the card adapter 101 where the adapter-side contact pad 136 is present face the same direction. This is because user convenience is improved.

  However, if necessary, the card adapter is turned upside down, that is, in a posture in which the second surface 218 faces the upper plate 120 and the first surface 217 faces the lower plate 110. 101 may be loaded. In this case, the terminal receiving groove 114a and the terminal tip receiving recess 114c are formed in the terminal receiving portion 124 of the upper plate 120, the base portion 151 of the card connection terminal 150 in the adapter is positioned closer to the inner surface of the upper plate 120, and the arm portion 152 is The base portion 151 is extended obliquely downward, that is, so as to approach the lower plate 110. In addition, the board connecting portion 154 has the rising portion 154a omitted so that the side surface is L-shaped, and the upper end is connected to the horizontal portion 154b extending in parallel from the base portion 151 and the tip of the horizontal portion 154b. The base 151 is provided with an insertion portion 154c extending substantially perpendicularly downward. The insertion portion 154 c is inserted into the through hole 135 of the internal substrate 130 from the upper plate 120 side, and is electrically connected to the wiring 133. Note that the card lock fitting 161 is also moved to a position corresponding to the recess 212 of the first card 201.

  In addition, this invention is not limited to the said embodiment, It can change variously based on the meaning of this invention, and does not exclude them from the scope of the present invention.

It is the perspective view seen from the upper side which shows the adapter for cards in embodiment of this invention. It is the perspective view seen from the lower part which shows the adapter for cards in embodiment of this invention. It is a top view which shows the adapter for cards in embodiment of this invention. It is a three-plane figure which shows the card | curd with which the adapter for cards in embodiment of this invention is mounted | worn, (a) shows an upper surface, (b) shows a lower surface, (c) shows a side surface. It is the perspective view seen from the upper part which shows the state which mounted | wore the card | curd adapter in embodiment of this invention with the card | curd. It is a top view which shows the state which mounted | wore the card | curd adapter in embodiment of this invention with the card | curd. It is a perspective view which shows the state which removed the upper board of the adapter for cards in embodiment of this invention. It is a perspective view which shows the main structural members of the adapter for cards in embodiment of this invention, (a) is the upper surface of an internal substrate, (b) is the lower surface of an internal substrate, (c) is the outer surface of an upper board, (d ) Is the inner surface of the upper plate, (e) is the inner surface of the lower plate, (f) is the card lock fitting, (g) is the disassembled state of the internal terminal unit, and (h) is the assembled state of the internal terminal unit. Yes. It is a figure which shows the connection state of the connection terminal and internal substrate in case the thickness of the internal substrate in embodiment of this invention is thick, (a) is XX arrow sectional drawing of FIG. 3, (b) is It is the A section enlarged view of (a). It is a figure which shows the connection state of the connection terminal and internal substrate when the thickness of the internal substrate in embodiment of this invention is thin, (a) is XX arrow sectional drawing of FIG. 3, (b) is It is the B section enlarged view of (a). It is a figure which shows the connection state of the connecting terminal and internal board | substrate when the 1st card | curd in embodiment of this invention is loaded, (a) is a YY arrow sectional drawing of FIG. 6, (b) is. It is the C section enlarged view of (a). It is a figure which shows the structure of the processus | protrusion for board | substrate pressing in embodiment of this invention, (a) is a perspective view which shows the inner surface of an upper board, (b) is the D section enlarged view of (a). It is a figure explaining the deformation | transformation state of the board | substrate pressing protrusion in embodiment of this invention, (a) is the state before pressing an internal substrate, (b)-(f) is the deformation | transformation state of a board | substrate pressing protrusion. Respectively. It is a perspective view which shows the connector for cards in embodiment of this invention. It is a figure which shows the conventional adapter for cards.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Card connector 11, 109 Housing 51 Terminal 61 Shell 65 Ground plate 101 Card adapter 101a, 201a Front end 101b, 201b Rear end 101c, 201c Right end 101d, 201d Left end 102 Card accommodation space 104 Display part 105a 1st insertion instruction Mark 108, 212 Recess 110 Lower plate 111, 121 Card receiving portion 111a Card receiving floor plate 111b Card holding portion 111c Metal receiving recess 112 Pad corresponding opening 114, 124 Terminal receiving portion 114a Terminal receiving groove 114b, 124b Mold portion stopper 114c Terminal tip Housing recesses 115, 125 Substrate receiving portion 116 Coupling protrusion 117 Positioning posts 120, 921 Upper plate 121a Card receiving top plate 122 Pad corresponding portion 124a Mold portion receiving recess 126 Recessed portion 127 Substrate pressing protrusion 127a Vertical surface 127b Inclined surface 127c Ridge line 130 Internal substrate 130a, 217 First surface 130b, 218 Second surface 131 First portion 132 Second portion 133 Wiring 134 Land 135 Through hole 136 Adapter side contact pad 137 Positioning recess 140 Internal terminal unit 141 Mold part 141a Main body part 141b Upper end part 141c Card side end 141d Board side end 150 Adapter internal card connection terminal 151 Base 152 Arm part 153 Contact part 154 Board connection part 154a Rising part 154b Horizontal part 154c Insertion part 161 Card lock metal fitting 161a Engaging convex part 201 1st card 213 Front notch part 251 Card side contact pad 910 Lower case 911 Bottom plate 920 Upper case 930 Insert molding member 940 950 terminal member

Claims (6)

(A) For a card in which a first card (201) is accommodated in a housing (109) formed by coupling a first plate member (120) and a second plate member (110) and the second card is loaded. A card adapter (101) that can be loaded into the connector (1);
(B) A contact portion (153) disposed in the housing (109) and in contact with the contact pad (251) of the first card (201), and extending in the thickness direction of the housing (109). A connection terminal (150) comprising an insertion portion (154c);
(C) Arranged in the housing (109) such that the first surface (130a) faces the first plate member (120) and the second surface (130b) faces the second plate member (110). A wiring board (130) that is formed on the second surface (130b), and that contacts the terminal (51) of the card connector (1), and is penetrated in the thickness direction Through-hole (135) to be formed and wiring (133) formed in the first surface (130a) and / or the second surface (130b) and connecting the through-hole (135) and the adapter-side contact pad (136) A wiring board (130) comprising:
(D) The card adapter (101), wherein the insertion portion (154c) is inserted and connected to the through hole (135) from the first surface (130a) side. The connection terminal (150) includes a base portion (151) held by a terminal holding member (141) and an arm portion having one end fixed to the base portion (151) and the contact portion (153) connected to a free end. (152) and a board connection part (154) including the insertion part (154c) connected to the opposite side of the base part (151) to the arm part (152),
The card adapter (101) according to claim 1, wherein the base (151) is disposed outside the wiring board (130). The board connection portion (154) includes a horizontal portion (154b) connected to the insertion portion (154c) at one end and extending substantially parallel to the first surface (130a),
The base (151) is disposed near the inner surface of the first plate member (120) or the second plate member (110),
The card according to claim 2, wherein the arm portion (152) extends obliquely from the base portion (151) so that a free end approaches the second plate member (110) or the first plate member (120). Adapter (101). The board connection part (154) further includes a rising part (154a) which is connected to the base part (151) and the horizontal part (154b) at both ends and extends in the thickness direction of the housing (109), and U It has a shape of a letter,
The base (151) is disposed near the inner surface of the second plate member (110),
The card adapter (101) according to claim 3, wherein the arm portion (152) extends obliquely from the base portion (151) such that a free end approaches the first plate member (120). The first plate member (110) includes a substrate receiving portion (115) that receives at least a part of the wiring substrate (130), and the second surface (130b) of the wiring substrate (130) receives the substrate. The card adapter (101) according to any one of claims 1 to 4, wherein the card adapter (101) is positioned in the thickness direction of the housing (109) by contacting the surface of the portion (115). The terminal holding member (141) is accommodated between the first plate member (120) and the second plate member (110) outside the wiring board (130).
The first plate member (120) and the second plate member (110) include protruding stopper members (114b, 124b) formed between the terminal holding member (141) and the wiring board (130). The card adapter (101) according to claim 2.

Images