JP5307743B2 - IC connector - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an IC connector preventing false contact between a package-side connecting pad and a contacting part, with manufacturing cost restrained. <P>SOLUTION: The IC connector 1 includes a body member 10 with a package receptacle 10a formed, contacts 20 with contact parts exposed toward inside of the package receptacle 10a, and a retainer member 40 for retaining package-side connecting pads 32 and the contact parts in a contact state. The package-side connecting pads 32 are arranged right to left with a package-side reference face 33 of the IC package 30 as a reference, the contacts 20 are arranged right to left with a first body side reference face 12e (a second body side reference face 13e) as a reference, and a pressing protrusion 18 is provided for positioning and matching the package-side connecting pads 32 right to left corresponding to the contact parts by pressing the package-side reference face 33 to the first body side reference face 12e, when the package-side reference face 33 is made in contact with the first body side reference face 12e to have the IC package 30 received by the package receptacle 10a. <P>COPYRIGHT: (C)2011,JPO&amp;INPIT

Description

  The present invention relates to an IC connector (also referred to as an IC socket) for detachably mounting an IC package (integrated circuit) such as a memory such as ROM and RAM, a CPU, and a system LSI on a printed circuit board.

  The IC package includes a package body in which leads are provided to extend and a package body in which package side connection pads are exposed on the package body. IC connectors for connecting such IC packages are already widely used. As a form thereof, a so-called press insertion type in which an IC package is pushed in from above the connector main body, or an IC package is mounted on the connector main body. A so-called slide type is known that is connected by sliding and moving forward or backward (see, for example, Patent Document 1).

  As an example of an IC connector in which an IC package provided with exposed package side connection pads is pushed in from above and connected, a contact receiving portion of a contact is exposed in a package receiving portion capable of receiving the IC package. It has been known. The IC connector having this configuration is shipped in a state where it is housed in a packaging member such as an embossed carrier tape after the contacts are inserted into the connector body and assembled.

  The shipped connector body is transported by the flat suction area formed in the connector body being sucked and transported by the mounter provided in the assembly device, and the board side connection pad and the package side connection pad coated with cream solder. It is mounted on the printed circuit board so as to correspond. Then, by heating the printed board on which the connector main body is placed in a reflow furnace, the board-side connection pads formed on the printed board and the lead portions of the contacts are connected by solder and surface-mounted.

  After the surface mounting, the IC package is received from above with respect to the package receiving portion in a state where the contact portion of the contact and the package side connection pad of the IC package are brought into contact with each other. Then, a holding member is attached to the connector body and the IC package is pressed from above to hold the contact state between the contact portion and the package side connection pad.

Japanese Patent No. 4372395

  By the way, the package receiving portion is normally configured so as to have a so-called “play” that is slightly larger than the IC package so that the IC package can be easily received and removed. In recent years, IC packages have been configured to have multiple poles and narrow pitches based on demands for high functionality and downsizing, and the arrangement interval between adjacent package-side connection pads is narrow. Also in the IC connector for connecting the IC package, the arrangement interval between adjacent contact portions is made narrow so as to correspond to the arrangement configuration of the package side connection pads. For this reason, the arrangement interval between the package-side connection pads and the contact portions is becoming relatively smaller than the “play”. Therefore, depending on the receiving position of the IC package in the package receiving portion, there is a problem that a corresponding contact portion is not contacted with the package side connection pad, and erroneous contact occurs.

  In order to solve the above-described problem, a method is conceivable in which the IC package and the package receiving portion are configured to have substantially the same size so as to minimize the “play” of the IC package. However, when this method is adopted, it is necessary to perform strict dimensional management for the IC package and the connector main body, which causes a new problem that leads to an increase in manufacturing cost.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide an IC connector capable of preventing erroneous contact between a package side connection pad and a contact portion while suppressing manufacturing cost.

In order to achieve the above object, an IC connector according to the present invention is formed in a rectangular flat plate shape in which an IC chip or the like is molded, and one end side end is formed on the lower surface of the IC connector. An IC package formed by forming a plurality of package side terminal portions (for example, the package side connection pads 32 in the embodiment) arranged in a predetermined arrangement toward the opposite end as the package side reference surface 33) in the embodiment. An IC connector for detachably holding and connecting to a board side terminal part formed on a printed circuit board, having a lead part joined to and connected to the board side terminal part at one end, and on the package side A plurality of conductive contacts having contact portions at the other end that are in contact with and connected to the terminal portions, and an upper surface side for receiving and holding the IC package It has a package receiving portion formed of a rectangular space having an opening, and has an insulating property to expose the contact portion in the package receiving portion and to expose the lead portion on the lower surface side and hold the plurality of contacts side by side. A main body member, and a holding member that is attached to the main body member in a state where the IC package is received in the package receiving portion and holds the package side terminal portion and the contact portion in contact with each other. In the state where the plurality of contacts are held side by side on the main body member, one side end surface forming the package receiving portion is a main body side reference portion (for example, the first main body side reference surface in the embodiment). 12e, as the second main body side reference surface 13e), the contact portion is arranged in the same arrangement state as the predetermined arrangement state of the IC package from the main body side reference portion. It protrudes upward from the bottom surface of the package receiving portion side by side, and protrudes upward in a cantilevered manner on the side end surface of the main body member that faces the side end surface that forms the main body side reference portion in the package receiving portion. An elastically deformable main body side pressing portion (for example, the pressing protrusion 18 in the embodiment) is provided, and when the IC package is received in the package receiving portion, the package side reference end is the main body side reference. And the opposite end is pressed against the main body side pressing portion, and the IC package is sandwiched between the main body side reference portion and the main body side pressing portion and received and held in the package receiving portion. In a state where the IC package is received in the package receiving portion, the IC package receives a pressing force due to elastic deformation of the main body side pressing portion. The IC package is pressed toward the main body side reference portion, the package side reference end is brought into contact with the main body side reference portion, and the contact portion in the predetermined arrangement state is used as the package side terminal in the predetermined arrangement state. The contact portions corresponding to each other and the package side terminal portions are brought into contact with each other by being aligned with the portions .

  In addition, the holding member is placed on the IC package received in the package receiving portion, and the package side reference end is slid in a direction to be pressed against the body side reference portion to be moved to the body member. Preferably it is attached.

  An IC connector according to the present invention includes a body-side pressing portion that presses a package-side reference end against a body-side reference portion and aligns a corresponding package-side terminal portion with respect to the contact portion in the arrangement direction. . In this way, while the configuration is such that the main body side pressing portion is simply provided, the positions of the package side reference end portion and the main body side reference portion are aligned, and the contact portion and the package side terminal portion that are set based on these positions are arranged. It is possible to align each other. Therefore, erroneous contact between the package-side connection pad and the contact portion can be prevented while suppressing the manufacturing cost.

  In the above-described IC connector, the main body side reference portion protrudes upward from one end portion in the contact arrangement direction in the base portion, and the main body side pressing portion protrudes upward from the other end portion in the contact arrangement direction in the base portion. Preferably, it is formed facing the reference portion. Thus, it becomes possible to simplify the configuration of the main body member by forming the main body side reference portion and the main body side pressing portion so as to face each other with respect to the base portion of the main body member. .

  Further, it is preferable that the holding member is attached to the main body member by sliding in the direction in which the package side reference end is pressed against the main body side reference portion. In the case of this configuration, in addition to the IC package being pressed by the main body side pressing portion, the package side reference end is pressed against the main body side reference portion even when the holding member is attached to the main body member. The contact portion and the package side terminal portion can be well aligned with each other.

1 is an exploded perspective view of an IC connector according to the present invention. It is sectional drawing of a main-body member, Comprising: (a) shows II (a) -II (a) part in FIG. 1, (b) shows II (b) -II (b) part in FIG. 1, respectively. . It is a top view of an IC package. It is a perspective view in the state where an IC package was attached to a body member. It is sectional drawing of the VV part in FIG. The perspective view in the state where the IC package and the cover member were attached to the main body member is shown. It is sectional drawing which shows the VII-VII part in FIG. 6, Comprising: (a) shows the state before a lock | rock, (b) shows the locked state, respectively. (A) is a sectional view of a VIII (a) -VIII (a) portion in FIG. 6, and (b) is a sectional view of a VIII (b) -VIII (b) portion in FIG. (A) is the top view which showed the said main body member typically, (b)-(d) is the top view which showed the main body member which concerns on another embodiment typically. (A) is the top view which showed the main body member which concerns on another embodiment, (b) shows the right side view, (c) shows the side view after that, respectively. FIG. 11 is a plan view showing the main body member of FIG. 10, where (a) shows a state in which the IC package 30 is received, (b) shows a state in which the holding member is placed, and (c) shows a state in which the holding member is locked. Each state is shown.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. For convenience of explanation, the arrow directions shown in the drawings are defined as front and rear, left and right, and up and down. First, the basic configuration of the IC connector 1 according to the present invention will be described with reference to FIGS.

  As shown in FIGS. 1 and 3, the IC package 30 exemplified in the present embodiment includes a plurality of packages arranged in the left-right direction on the lower surface side of a rectangular flat plate-shaped package main body 31 in which a memory, an IC chip, or the like is molded. The side connection pad 32 is exposed and provided. As shown in FIG. 1, the IC package 30 is configured such that a package side reference surface 33 is formed at the left end and a package side pressing surface 34 is formed at the right end in a state where the package side connection pad 32 faces downward. Is done. The arrangement position (in the left-right direction) of each package-side connection pad 32 with respect to the package main body 31 is configured based on the distance from the package-side reference surface 33 with the package-side reference surface 33 as a reference origin. ing. In the present embodiment, a configuration in which four rows of package side connection pads 32 are provided in the front and rear is illustrated.

  As shown in FIG. 1, the IC connector 1 for detachably mounting and connecting the IC package 30 includes a body member 10 formed by opening a package receiving portion 10a capable of receiving the IC package 30 upward, A plurality of contacts 20 attached to the main body member 10 in an aligned state in the left-right direction corresponding to the package side connection pads 32, and a holding member 40 detachably attached to the main body member 10 and covering the upper portion of the package receiving portion 10a. Consists of

  The main body member 10 includes a substantially flat base portion 11, a right front wall portion 12 </ b> R, a left front wall portion 12 </ b> L, a right rear wall portion 13 </ b> R, and a left rear wall portion 13 </ b> L that are erected on the left and right ends of the base portion 11. It has a box shape with the upper surface opened as a whole, and a package receiving portion 10a surrounded by these wall portions is formed in the central portion.

  In the base portion 11, a plurality of contact slots 11 a that are aligned in the left-right direction and extend vertically are formed corresponding to the package-side connection pads 32. A flat suction region 19 that is sucked by a mounter is provided on the upper surface of the central portion of the base portion 11 (details will be described later). Further, between the right front wall portion 12R and the right rear wall portion 13R, there is formed a pressing protrusion 18 extending upward and connected to the right front wall portion 12R and the right rear wall portion 13R. Yes. On the left side of the upper end of the pressing protrusion 18, a tapered portion 18a for guiding is formed. Further, a protrusion-side pressing surface 18b connected to the lower end of the taper portion 18a is formed extending vertically.

  In the present embodiment, the pressing protrusion 18 connected to the right front wall portion 12R and the right rear wall portion 13R is illustrated, but for example, separated from the right front wall portion 12R and the right rear wall portion 13R. The pressing protrusion 18 may be formed. In this way, the pressing protrusion 18 can be configured to be elastically deformable in the left-right direction. Therefore, by bending the pressing protrusion 18, the IC package 30 can be smoothly received by the package receiving portion 10 a.

  The left front wall portion 12L has a first protrusion accommodating portion 12a extending vertically, a first protrusion engaging portion 12b covering the rear end portion of the first protrusion accommodating portion 12a from above, and protruding rightward at the front end portion. The first frame portion 12c is formed. Further, a main body side pole number display 12d indicating the pole number of the contact 20 is provided on the upper surface of the front end of the left front wall portion 12L, and on the right side surface of the left front wall portion 12L excluding the first frame portion 12c, (Two) first main body side reference surfaces 12e are formed. In FIG. 1, FIG. 2 (a), and FIG. 4, in order to illustrate the range of the 1st main body side reference surface 12e intelligibly, the applicable area | region is double-hatched. The right front wall portion 12R is formed symmetrically with respect to the left front wall portion 12L and basically has the same configuration, and thus the description thereof is omitted here.

  The left rear wall portion 13L has a second protrusion accommodating portion 13a extending vertically, a second protrusion engaging portion 13b covering the rear end portion of the second protrusion accommodating portion 13a from above, and a third protrusion engaging portion at the front end portion. The part 13c and a second frame part 13d protruding rightward at the rear end part are formed. Further, (two) second main body side reference surfaces 13e are formed on the right side surface of the left rear wall portion 13L excluding the second frame portion 13d. In FIG. 1, FIG. 2 (a), and FIG. 4, in order to illustrate the range of the 2nd main body side reference surface 13e clearly, the applicable area | region is double-hatched. And the 1st main body side reference surface 12e and the 2nd main body side reference surface 13e are formed so that the same plane may be constituted. Note that the right rear wall portion 13R is formed symmetrically with respect to the left rear wall portion 13L and basically has the same configuration, and therefore description thereof is omitted here.

  In the base portion 11, the position of each contact slot 11a in the left-right direction is a distance from the first main body side reference surface 12e with the first main body side reference surface 12e (second main body side reference surface 13e) as a reference origin. It is configured based on. Further, the pressing protrusion 18 is formed to protrude to the left with respect to a portion of the right front wall portion 12R (right rear wall portion 13R) excluding the first frame portion 12c (second frame portion 13d). (See FIG. 2 (b)). Furthermore, the left-right dimension of IC package 30 (the length from package-side reference surface 33 to package-side pressing surface 34) is slightly larger than the left-right distance between first main body-side reference surface 12e and pressing protrusion 18. It is configured. Therefore, when the IC package 30 is received in the package receiving portion 10a, the package side reference surface 33 comes into contact with the first main body side reference surface 12e and the second main body side reference surface 13e, and the package side pressing surface 34 is pressed against the pressing protrusion 18. The IC package 30 is pressed (held) in the left-right direction and held in contact with the (protrusion-side pressing surface 18b).

  As shown in FIG. 2 (a), the contact 20 has a fixed side portion 22 that is formed with a sawtooth-like locking portion (not shown) projecting and extending vertically, and the distal end side of the fixed side portion 22 is U-shaped. The arm portion 23 is folded back and extends obliquely upward, the contact portion 24 formed at the tip of the arm portion 23, and the lead portion 21 that is bent at the base end side of the fixed side portion 22 and extends forward and backward. The contact 20 is formed by, for example, forming a thin plate of a conductive elastic metal material such as phosphor bronze into a shape shown in the figure by pressing or the like, and then performing a required surface treatment such as gold plating or tin plating. The

  Each contact 20 is inserted into each contact slot 11 a from below the main body member 10, and a locking portion formed on the fixed side portion 22 is press-fitted and fixedly held on the main body member 10. In this embodiment, of the four front and rear rows of contact slots 11a, the lead portion 21 is directed forward with respect to the front two rows of contact slots 11a, and the lead portion 21 with respect to the rear two rows of contact slots 11a. The case where it inserts toward back is illustrated. In the mounting posture, the fixed side portion 22 extends vertically and the arm portion 23 extends obliquely upward, and the contact portion 24 formed at the tip thereof is exposed above the contact slot 11a, that is, the package receiving portion 10a. It is exposed from the bottom (see FIG. 2B).

  As described above, since the contact slot 11a is formed corresponding to the arrangement configuration of the package side connection pad 32, the contact portion 24 exposed above the contact slot 11a also has the arrangement configuration of the package side connection pad 32. Correspondingly exposed. Further, the arm portion 23 and the contact portion 24 can be swung up and down in the contact slot 11a with respect to the fixed side portion 22 press-fitted and fixed in the contact slot 11a. As shown in FIG. 2A, the lead portion 21 of the contact 20 in the foremost row protrudes forward from the front end portion of the base portion 11, and the lead portion 21 of the contact 20 in the last row contacts the rear portion of the base portion 11. Projects backward from the end. Body-side confirmation holes 11b penetrating vertically are respectively formed in portions of the base portion 11 that are vertically opposed to the lead portions 21 of the contacts 20 in the second and third rows from the front.

  The holding member 40 includes a main body frame 41 having an opening 42 at the center and formed in a substantially rectangular frame shape. A first base portion 43, a second base portion 44, and a third base portion 45 projecting left and right are formed on the left and right side surfaces of the main body frame 41. The lower ends of these base portions 43, 44, 45 A first holding projection 43a, a second holding projection 44a, and a third holding projection 45a extending in the direction are formed on both front and rear sides of each base. The main body member 10 and the holding member 40 are made of a molding means such as injection molding using a thermoplastic resin material having electrical insulation properties such as polyphenylene sulfide (PPS), polyamide (PA), and liquid crystal polymer (LCP). To form the shape shown in the figure.

  The basic configuration of the IC connector 1 has been described so far. Hereinafter, the assembly configuration of the IC connector 1 will be described.

  First, after the plurality of contacts 20 are inserted into the contact slots 11a of the main body member 10 and assembled, the main body member 10 is shipped in a state of being accommodated in, for example, an embossed carrier tape or the like.

  The shipped connector main body 10 is sucked and conveyed by a mounter provided in the assembly apparatus, and is placed on the printed circuit board 9 as shown in FIG. Here, for example, solder containing flux is applied in advance to a board-side connection pad (not shown) provided exposed on the surface of the printed circuit board 9. Are placed in a state of being aligned. Then, by heating the printed circuit board 9 and the main body member 10 to a predetermined temperature in the reflow furnace, the solder is melted and the board side connection pads and the lead portions 21 are connected, and the main body member 10 is surface-mounted on the printed circuit board 9. Is done.

  As shown in FIG. 2A, since the main body side confirmation hole 11b is formed in the main body member 10, for example, after the main body member 10 is surface-mounted on the printed circuit board 9, the lead portion 21 and the board side connection pad Can be inspected visually or by an automatic inspection device. In addition, since the lead part 21 of the contact 20 located in the foremost line and the last line protrudes forward or backward with respect to the base part 11, it can be inspected without the main body side confirmation hole 11b.

  Then, the IC package 30 is received by the package receiving portion 10a of the surface-mounted main body member 10 with the package side connection pads 32 facing downward (see FIGS. 4 and 5). More specifically, the IC package 30 is surrounded by the right front wall portion 12R, the left front wall portion 12L, the right rear wall portion 13R, the left rear wall portion 13L, the first frame portion 12c, and the second frame portion 13d. To accept. Thus, when the IC package 30 is received in the package receiving portion 10a, each package side connection pad 32 comes into contact with the corresponding contact portion 24 and is elastically supported by the contact 20.

  In this state, the holding member 40 is attached so as to cover the upper part of the IC package 30 (see FIG. 6). At this time, as shown in FIG. 7A, first, the first holding projection 43a is inserted into the first projection receiving portion 12a, and the second holding projection 44a is inserted into the second projection receiving portion 13a up and down. To do. Then, by sliding the holding member 40 rearward, the first holding protrusion 43a is formed on the first protrusion engaging part 12b, the second holding protrusion 44a is provided on the second protrusion engaging part 13b, and the third protrusion engaging part. The third holding projections 45a are respectively engaged with 13c and become locked (see FIG. 7B). In this locked state, the IC package 30 is pressed downward by the holding member 40 as a whole, and the lower surface of the IC package 30 and the bottom surface of the package receiving portion 10a (the surface where the contact portion 24 is exposed) are close to each other. It is held (see FIG. 8 (a) and FIG. 8 (b)). Therefore, by attaching the holding member 40, the contact state between the package side connection pad 32 and the contact portion 24 is reliably maintained.

  In this manner, by mounting the IC package 30 on the IC connector 1, it is possible to read information stored in the IC package 30 and write information into the IC package 30. In addition, since each of the base portions 43, 44, 45 of the holding member 40 has holding projections on both the front and rear sides, even when the holding member 40 is rotated 180 degrees from the state shown in FIG. Similarly, it can be slid rearward and attached to the main body member 10.

  The assembly configuration of the IC connector 1 has been described above. By the way, in the IC package 30 to be connected to the IC connector 1 according to the present invention, the package-side connection pads 32 are multipolarized and the pitch is reduced based on the demand for higher functionality and smaller size. Specifically, as shown in FIG. 3, a large number of package-side connection pads 32 are exposed in a state of being adjacent (densely) in the left-right direction. With this configuration, in the IC connector 1, the contact portions 24 that are in contact with the package side connection pads 32 are exposed adjacent to each other in the left-right direction, corresponding to the arrangement configuration of the package side connection pads 32.

  By the way, the package receiving part 10a is generally formed to have a slightly larger opening than the IC package 30 so that the IC package 30 can be received and removed, and has a structure having “play”. Therefore, conventionally, depending on the receiving position of the IC package 30 in the package receiving portion 10a, the corresponding contact portion 24 may not be in contact with the package-side connection pad 32, and erroneous contact may occur. In particular, when an IC package with a narrower package-side connection pad pitch, such as the IC package 30, is accommodated and connected, this erroneous contact is likely to occur. Here, a method of eliminating the “play” of the IC package 30 by configuring the IC package 30 and the package receiving portion 10a to be substantially the same size can be considered, but this method requires strict dimensional management and increases the manufacturing cost. Resulting in.

  Therefore, the IC connector 1 according to the present invention is configured to prevent erroneous contact between the package side connection pad 32 and the contact portion 24 while suppressing an increase in manufacturing cost. Hereinafter, the configuration will be described in detail.

  As shown in FIG. 1, when the IC package 30 is received from above with respect to the package receiving portion 10a of the main body member 10, the package-side reference plane is placed on the first main body-side reference plane 12e (second main body-side reference plane 13e). 33 is abutted, and the package side pressing surface 34 is accommodated while being in contact with the projection side pressing surface 18b of the pressing projection 18 (see FIG. 5). As described above, since the horizontal dimension of the IC package 30 is slightly larger than the left-right distance between the first main body side reference surface 12e and the pressing protrusion 18, the IC package 30 has the first main body by the pressing protrusion 18. It is accommodated while being pressed against the side reference surface 12e.

  Here, as described above, the arrangement position of each package-side connection pad 32 in the left-right direction is configured with the package-side reference surface 33 as a reference origin, and the formation position of each contact slot 11a in the left-right direction is the first main body. The side reference surface 12e is configured as a reference origin. Therefore, the IC package 30 can be received by the package receiving portion 10a in a state in which the package side connection pad 32 and the contact slot 11a (contact portion 24) have the same reference origin. In this way, since the reference origins coincide with each other, each corresponding contact portion 24 can be reliably brought into contact with each package-side connection pad 32 without shifting in the left-right direction, and erroneous contact can be prevented. Can be prevented.

  Further, in the IC connector 1 according to the present invention, the IC package 30 and the body member 10 need only be configured such that the IC package 30 is press-fitted between the first body-side reference surface 12e and the pressing protrusion 18. On the other hand, strict dimensional management is not necessary, and thus the manufacturing cost can be reduced.

  In order to prevent the package side reference surface 33 and the package side pressing surface 34 from being reversely received when the IC package 30 is received in the package receiving portion 10a, for example, the IC package 30 and the main body member. It is preferable to form an erroneous insertion preventing projection (not shown) on one side of 10 and an erroneous insertion preventing notch (not shown) corresponding to the erroneous insertion preventing projection on the other side. In addition, it is possible to prevent erroneous insertion by attaching a pole number display as a mark to the IC package 30 and the main body member 10.

  In the above-described embodiment, the first main body side reference surface 12e extends substantially over the entire left front wall portion 12L, and the second main body side reference surface 13e extends over the entire left rear wall portion 13L with the right front wall portion 12R and the right rear wall. Although the main body member 10 in which the pressing protrusions 18 are respectively formed between the wall portions 13R has been described, the configuration of the main body member 10 according to the present invention is not limited to this. That is, FIG. 9A shows a schematic plan view of the main body member 10, but not limited to this configuration. For example, as shown in the main body member 110 shown in FIG. The pressing protrusions 112 and 113 may be partially formed on each of the wall portion 12R and the right rear wall portion 13R.

  Further, as in a main body member 210 shown in FIG. 9C, a portion with respect to the left front wall portion 12L and the left rear wall portion 13L instead of the first main body side reference surface 12e and the second main body side reference surface 13e. Alternatively, the main body side reference surfaces 212 and 213 may be formed. Further, as in the main body member 310 shown in FIG. 9D, the main body side reference surfaces 311 and 312 are partially formed on the left front wall portion 12L and the left rear wall portion 13L, and the right front wall portion 12R. Alternatively, the pressing protrusions 313 and 314 may be partially formed on the right rear wall portion 13R.

  In the above-described embodiment, the configuration in which the holding member 40 is slid back and forth and attached to the main body member 10 is described as an example. However, the IC connector 1 according to the present invention is not limited to this configuration. For example, it can be configured as a main body member 410 shown in FIG. The main body member 410 has a right wall portion 420 and a left wall portion 430 erected on both left and right ends of the base portion 411, and a protrusion receiving groove 421 extending left and right with respect to the right wall portion 420 and a left wall portion 430. On the other hand, a protrusion receiving groove 431 extending left and right is formed (see FIG. 10B and FIG. 10C). A region surrounded by the right wall portion 420 and the left wall portion 430 is a package receiving portion 412.

  A method of attaching the IC package 30 to the main body member 410 will be described with reference to FIG. As shown in FIG. 11A, first, an IC package 30 in which a large number of package side connection pads 32 are adjacently exposed in the left-right direction is accommodated in the package receiving portion 412. Although not shown in FIG. 11A, the package side reference surface of the IC package 30 is pressed against the main body side reference surface formed on the left wall portion 430 by the pressing protrusion formed on the right wall portion 420. It is housed in a state where Next, as shown in FIG. 11B, the holding member 140 formed by projecting the holding projections 142 and 143 on the front and rear end faces of the main body frame 141 is placed on the IC package 30. After placing the holding member 140, the holding member 140 is slid to the left, and the holding projection 143 is received in the projection receiving groove 421 and the holding projection 142 is received in the projection receiving groove 431. Thereby, the holding member 140 is attached to the main body member 410, and the IC package 30 is held by the main body member 410 (see FIG. 11C).

  In the main body member 410, the holding member 140 is slid and locked to the left, so that when the holding member 140 is locked, the IC package 30 is pressed to the left. It will be. Therefore, the IC package 30 is pressed against the left wall portion 430 on which the main body side reference surface is formed by the pressing force, so that the corresponding contact portion 24 can be brought into contact with the package side connection pad 32 with higher accuracy. It becomes possible.

  In the above-described embodiment, the pressing protrusion 18 can be configured to be elastically deformable left and right by additionally forming a vertically extending slit in the pressing protrusion 18. According to this configuration, the IC package 30 can be smoothly received by bending the pressing protrusion 18 to the right.

DESCRIPTION OF SYMBOLS 1 IC connector 9 Printed circuit board 10 Main body member 10a Package receiving part 11 Base part 12e 1st main body side reference surface (main body side reference part)
13e Second main body side reference surface (main body side reference portion)
18 Pressing protrusion (main body side pressing part)
20 contact 21 lead part 24 contact part 30 IC package 32 package side connection pad (package side terminal part)
33 Package side reference surface (package side reference end)
40 Holding member

Claims (2)

A plurality of package side terminals are formed in a rectangular flat plate shape in which an IC chip or the like is molded, and are arranged in a predetermined arrangement toward the opposite end portion with the one end side end portion as a package side reference end portion on the lower surface thereof An IC connector for detachably holding an IC package formed with a portion and connecting it to a board-side terminal portion formed on a printed circuit board,
A plurality of conductive contacts having a lead portion joined to and connected to the substrate side terminal portion at one end and a contact portion abutting and connected to the package side terminal portion at the other end;
A package receiving portion having a rectangular space opened on the upper surface side for receiving and holding the IC package; and exposing the contact portion in the package receiving portion and exposing the lead portion on the lower surface side. A body member having an insulating property for holding a plurality of contacts side by side;
The IC package is attached to the main body member in a state where the IC package is received in the package receiving portion, and includes a holding member that holds the package side terminal portion and the contact portion in contact with each other. And
In a state where the plurality of contacts are held side by side on the main body member, one side end surface forming the package receiving portion is used as a main body side reference portion, and the contact portion extends from the main body side reference portion to the predetermined portion of the IC package. It protrudes upward from the bottom surface of the package receiving portion side by side in the same arrangement state as the arrangement state,
In the main body member, an elastically deformable main body side pressing portion projecting upward in a cantilever shape is provided on a side end surface facing the side end surface forming the main body side reference portion in the package receiving portion,
When the IC package is received in the package receiving portion, the package side reference end abuts the main body side reference portion and the opposite end presses and abuts the main body side pressing portion. Is sandwiched between the main body side reference portion and the main body side pressing portion and is configured to be received and held in the package receiving portion,
In a state where the IC package is received in the package receiving portion, the IC package is pressed toward the main body side reference portion by receiving a pressing force due to elastic deformation of the main body side pressing portion, and the package side reference end portion Is brought into contact with the main body side reference portion so that the contact portion in the predetermined arrangement state is aligned with the package side terminal portion in the predetermined arrangement state so that the contact portion and the package side terminal portion corresponding to each other are matched. An IC connector configured to come into contact with each other . The holding member is placed on the IC package received in the package receiving portion, and is slid and moved in a direction in which the package side reference end is pressed against the body side reference portion, and is attached to the body member. The IC connector according to claim 1 .

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