JP4881894B2 - Electronic substrate holding structure and electronic substrate sealing method - Google Patents

Description

  The present invention relates to an electronic substrate holding structure and an electronic substrate sealing method.

For example, when an electronic board for control is installed in a vehicle such as a motorcycle or an automobile, the electronic board on which electronic parts such as a connector member are mounted is connected to a bag-structured electronic board housing case with a connector member. In some cases, the electronic circuit board housing case is installed and held so that is exposed.
And when such an electronic board storage case is installed in a motorcycle or the like with a large vibration, in order to prevent the electronic components mounted on the electronic board from falling off and to be waterproofed inside the electronic board storage case. The inside of the electronic substrate housing case is filled with resin, and the electronic substrate is sealed with a resin layer.

For example, Patent Document 1 describes a method of sealing an electronic substrate by filling a resin inside an electronic substrate housing case.
Specifically, the electronic substrate is sealed by filling the inside of the electronic substrate housing case with the electronic substrate stored in the electronic substrate housing case.
JP 11-324705 A

By the way, when an electronic board is installed in a four-wheeled vehicle or the like that is relatively low in vibration and less likely to be exposed to moisture, the electronic board is generally not sealed with resin.
In such a case, in order to prevent dew condensation on the electronic board, a through hole for connecting the case and the outside to ventilate the connector housing of the connector member may be formed. is there.

  From the viewpoint of manufacturing cost, it is desired to divert not a waterproof connector but a general-purpose connector member in which a through hole is formed in a connector housing to an electronic board sealed with a resin layer as described above. However, when such a connector member is used, the resin filled in the electronic substrate housing case flows from the through hole formed in the connector housing into the connection terminal installation region and is cured, so that the electronic substrate There is a possibility of causing a poor fitting between the connector member mounted on the external harness and the external harness.

  The present invention has been made in view of the above-described problems, and is a case where an electronic board on which a connector member having a through hole is formed in a connector housing is sealed with a resin layer inside the electronic board housing case. However, it is an object to be able to ensure a good fitting state between the connector member and the external harness.

  In order to achieve the above object, an electronic board holding structure according to the present invention is provided with an electronic board on which a connector member having a connection terminal and a connector housing that supports the connection terminal and is formed with a through hole is mounted. Holding and holding the electronic substrate housing case with the connection terminal exposed at the opening of the electronic substrate housing case having a structure, and further holding the electronic substrate filled with resin inside the electronic substrate housing case In the structure, the resin layer made of the resin is characterized in that the exposed surface on the opening side is inclined so that the electronic substrate is embedded and the through hole of the connector housing is not embedded.

  The electronic substrate sealing method according to the present invention includes an electronic substrate on which a connector member having a connection terminal and a connector housing that supports the connection terminal and includes a through hole is mounted. A method for sealing an electronic substrate, wherein the connection terminal is exposed and held in the electronic substrate housing case in an opening portion, and the electronic substrate is sealed with a resin layer. In this state, the through hole of the connector housing is located above the end of the electronic board on the opening side, and the end of the electronic board on the opening side is located below the opening. In the state where the electronic substrate housing case is inclined and the electronic substrate housing case is inclined, the resin softened to the position where the electronic substrate is buried and the through hole is not buried is used as the electronic substrate. It was charged into the plate accommodating case, characterized in that to seal the electronic board with the resin layer by the above-mentioned resin layer by curing the softened resin.

According to the electronic substrate holding structure of the present invention, the exposed surface of the resin layer located on the opening side of the electronic substrate housing case is embedded in the resin layer and the through hole of the connector housing is embedded in the resin layer. Inclined so as not to be. That is, the resin layer does not reach the through hole of the connector housing.
Further, according to the electronic substrate sealing method of the present invention, the resin softened by inclining the electronic substrate housing case is filled to a position where the electronic substrate is filled and the through hole is not filled, and the resin is cured. Thus, a resin layer is formed. That is, a resin layer that does not reach the through hole of the connector housing is formed.
Thus, according to the electronic substrate holding structure and the electronic substrate sealing method of the present invention, the resin layer that seals the electronic substrate does not reach the through hole of the connector housing, and thus the resin leaks from the through hole. There is nothing.
Accordingly, the cured resin does not exist in the connection terminal installation area, so that the connector member and the harness can be fitted well.
Therefore, according to the present invention, even when the electronic board on which the connector member with the through hole formed in the connector housing is mounted is sealed with the resin layer inside the electronic board housing case, the connector member and the external It is possible to ensure a good fitting state with the harness. Further, by using a general-purpose connector member, it is possible to keep the manufacturing cost low.

  Hereinafter, an embodiment of an electronic substrate holding structure according to the present invention will be described with reference to the drawings. In the following drawings, the scale of each member is appropriately changed in order to make each member a recognizable size.

FIG. 1 is a perspective view of an electronic board holding structure 10 according to the present embodiment. FIG. 2 is a vertical sectional view of the electronic substrate holding structure 10 of the present embodiment. FIG. 3 is a front view of the electronic substrate holding structure 10 as viewed from the direction in which the electronic substrate P is inserted.
1 to 3 illustrate the electronic substrate P together with the electronic substrate holding structure 10, and FIG. 1 illustrates a state in which the electronic substrate P is pulled out from the electronic substrate housing case 1 and the resin layer 3. The illustration is omitted.
In the description of the present embodiment, for the sake of convenience, the direction along the front and back surfaces of the electronic substrate P accommodated in a regular position of the electronic substrate housing case 1 described later is defined as the horizontal direction and the direction orthogonal to the front and back surfaces of the electronic substrate P Is described as a vertical direction. However, the posture of the electronic substrate housing case 1 when it is actually attached is free according to the installation location.

  As shown in FIGS. 1 to 3, the electronic substrate holding structure 10 of this embodiment includes an electronic substrate housing case 1, a rail pair 2, and a resin layer 3.

The electronic substrate housing case 1 of the present embodiment is a bag-like structure that houses the electronic substrate P while being held inside, and has an opening 11 for inserting and removing the electronic substrate P. . The electronic substrate housing case 1 is made of, for example, plastic.
The electronic board P is a printed board on which wiring is formed and a plurality of electronic components are mounted, and a connector member C, which is one of the electronic components, is mounted on the surface side of the one end P1. The connector member C supports a plurality of connection terminals C2 arranged on the side portion C1 of the electronic substrate P away from the one end portion P1, and supports the connection terminals C2 and a plurality of through holes C31 (see FIG. 3). The connector housing C3 is formed. When the electronic board P is housed inside the electronic board housing case 1, only the side part C1 of the connector member C is exposed to the opening 11 (see FIG. 3) of the electronic board housing case 1, Thus, the connector member C and the external harness can be fitted. That is, the electronic substrate P is accommodated and held in the electronic substrate accommodation case 1, and at this time, the connection terminal C <b> 2 is exposed at the opening 11 of the electronic substrate accommodation case 1.

  The electronic substrate housing case 1 includes an upper wall portion 1a and a lower wall portion 1b that are arranged to face each other in the horizontal direction, side wall portions 1c and 1d that are arranged to face each other in the vertical direction, and an upper wall portion 1a that is arranged in the vertical direction. The bottom wall portion 1b and the back wall portion 1e connected perpendicularly to the side wall portions 1c and 1d have a bag structure, and the shape viewed from the insertion direction of the electronic substrate P is substantially rectangular. ing.

In the electronic substrate housing case 1 of the present embodiment, a rail pair 2 composed of two rails is installed on the inner side of each side wall 1c, 1d.
These rail pairs 2 are constituted by an upper rail 2a and a lower rail 2b arranged in the vertical direction.
The upper rail 2a is a rail that is disposed on the surface side of the electronic substrate P and extends in the insertion / extraction direction of the electronic substrate P when the electronic substrate P is accommodated. On the other hand, the lower rail 2b is a rail that is arranged on the back side of the electronic substrate P and extends in the insertion / extraction direction of the electronic substrate P when the electronic substrate P is accommodated.

The upper rail 2a and the lower rail 2b constituting the rail pair 2 function as a guide when the electronic board P is inserted into and removed from the electronic board housing case 1, and when the electronic board P is inserted. It functions to support the electronic substrate P inside the electronic substrate housing case 1.
More specifically, the electronic substrate P is held by being fitted into a groove between the upper rail 2a and the lower rail 2b whose both ends are arranged vertically, and slides along the groove. By doing so, it is guided at the time of insertion.

  The resin layer 3 is formed of a resin filled in the electronic substrate housing case 1. In the electronic substrate holding structure 10 of the present embodiment, as shown in FIG. 2, the exposed surface 3a on the opening 11 side is embedded in the resin layer 3 and the through hole of the connector housing C3 is provided. C31 is inclined so as not to be embedded in the resin layer 3.

According to the electronic substrate holding structure 10 of this embodiment configured as described above, the exposed surface 3a of the resin layer 3 is inclined, the electronic substrate P is embedded in the resin layer 3, and the through hole C31 of the connector housing C3 is provided. Is not embedded in the resin layer 3. That is, the electronic board holding structure 10 of the present embodiment has the resin layer 3 that does not reach the through hole C31 of the connector housing C3. For this reason, the entire electronic substrate P can be sealed and the resin does not leak from the through hole C31.
Therefore, the cured resin does not exist in the installation area of the connection terminal, so that the connector member C and the external harness can be satisfactorily fitted.
Therefore, according to the electronic substrate holding structure 10 of the present embodiment, the electronic substrate P on which the connector member C in which the through hole C31 is formed in the connector housing C3 is mounted on the resin layer 3 inside the electronic substrate housing case 1 is provided. Even in the case of sealing, it is possible to ensure a good fitting state between the connector member C and the external harness. Further, by using a general-purpose connector member, it is possible to keep the manufacturing cost low.

  Next, a method for forming the electronic substrate holding structure 10 of the present embodiment (an electronic substrate sealing method) will be described.

  First, the electronic substrate P is inserted and accommodated in the electronic substrate accommodation case 1 that is not filled with resin. At this time, the electronic board P is guided to a regular position of the electronic board housing case 1 by the rail pair 2 installed inside the electronic board housing case 1.

  Subsequently, as shown in FIG. 4, in a state where the electronic substrate P is accommodated, the through hole C31 of the connector housing C3 is positioned above the end P2 on the opening 11 side of the electronic substrate P, and the electronic substrate The electronic substrate housing case 1 is inclined so that the end P2 on the opening side of P is positioned below the opening 11. In the present embodiment, the electronic substrate housing case 1 is inclined 45 ° with respect to the horizontal plane.

  Subsequently, in the state where the electronic substrate housing case 1 is inclined as described above, the softened resin 31 is filled into the electronic substrate housing case 1 until the position where the electronic substrate P is filled and the through hole C31 is not filled. As shown in FIG. 4, the softened resin 31 is filled into the electronic substrate housing case 1 from between the connector member C and the lower wall portion 1 b of the electronic substrate housing case 1.

  Finally, by heat-treating the electronic substrate housing case 1 filled with the resin 31, the resin 31 is cured to form the resin layer 3 described above, whereby the electronic substrate P is sealed.

According to the method for forming the electronic substrate holding structure 10 of this embodiment, the through hole C31 of the connector housing C3 is located above the end P2 on the opening 11 side of the electronic substrate P, and the electronic substrate P The resin board 31 is filled with the resin 31 in a state where the electronic board housing case 1 is inclined so that the end P2 on the opening side is positioned below the opening 11.
For this reason, by appropriately adjusting the filling amount of the resin 31, the entire electronic substrate P is buried in the resin 31, the resin 31 does not leak from the opening 11 of the electronic substrate housing case 1, and the resin 31 is a connector. The resin 31 can be filled so as not to reach the through hole C31 of the housing C3.
The resin layer 3 is formed by curing the resin 31 thus filled. For this reason, all the electronic substrates P are buried in the resin 31, the resin 31 does not leak from the opening 11 of the electronic substrate housing case 1, and the resin layer 3 (the resin 31 does not reach the through hole C31 of the connector housing C3). That is, the exposed surface 3a on the opening 11 side forms a resin layer 3) that is inclined so that the electronic substrate P is embedded in the resin layer 3 and the through hole C31 of the connector housing C3 is not embedded in the resin layer 3. Can do.

  In other words, according to the method for forming the electronic substrate holding structure 10 (electronic substrate sealing method) of the present embodiment, the resin does not leak into the installation region of the connection terminal C2, and the electronic substrate P is covered with the resin layer 3. It can be sealed. Therefore, even when the electronic board P on which the connector member C having the through hole C31 formed in the connector housing C3 is mounted is sealed with the resin layer 3 inside the electronic board housing case 1, the connector member C and the outside It is possible to ensure a good fitting state with the harness.

In addition, according to the method for forming the electronic substrate holding structure 10 of this embodiment, the resin layer 3 can be formed by a single heat treatment.
Therefore, the electronic substrate P can be sealed with the resin layer 3 in a short time without causing the resin to leak into the installation region of the connection terminal C2.

  The preferred embodiments of the electronic substrate holding structure and the electronic substrate sealing method according to the present invention have been described above with reference to the accompanying drawings. Needless to say, the present invention is not limited to the above embodiments. Various shapes, combinations, and the like of the constituent members shown in the above-described embodiments are examples, and various modifications can be made based on design requirements and the like without departing from the gist of the present invention.

For example, in the above-described embodiment, the configuration in which the electronic substrate housing case 1 is inclined by 45 ° with respect to the horizontal plane when the softened resin 31 is filled in the electronic substrate housing case 1 has been described.
However, the present invention is not limited to this, and the angle at which the electronic substrate housing case 1 is inclined changes according to the shape and position of the through hole C31, the opening 11 and the electronic substrate P of the connector housing C3.

It is a perspective view of the holding structure of the electronic substrate in one Embodiment of this invention. It is a vertical sectional view of the holding structure of the electronic substrate in one embodiment of the present invention. It is the front view which looked at the holding structure of the electronic substrate in one Embodiment of this invention from the insertion direction of the electronic substrate. It is sectional drawing for demonstrating the formation method of the holding structure of the electronic substrate in one Embodiment of this invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Electronic substrate accommodation case, 11 ... Opening part, 3 ... Resin layer, 3a ... Exposed surface, 31 ... Resin, 10 ... Holding structure of an electronic substrate, P ... Electronic substrate, P2 ... End , C: Connector member, C2: Connection terminal, C3: Connector housing, C31: Through hole

Claims (2)

An electronic board on which a connector member having a connection terminal and a connector housing supporting the connection terminal and having a through hole is mounted is placed in a state where the connection terminal is exposed at the opening of the bag-type electronic board housing case. The electronic substrate holding case is held and held, and the electronic substrate holding case is filled with a resin, and the holding structure of the electronic substrate,
The resin substrate made of the resin is characterized in that the electronic substrate is embedded and the exposed surface on the opening side is inclined so that the through hole of the connector housing is not embedded. An electronic board on which a connector member having a connection terminal and a connector housing that supports the connection terminal and has a through hole is mounted, in a state where the connection terminal is exposed in an opening of an electronic board housing case having a bag structure. An electronic substrate sealing method for storing and holding in an electronic substrate storage case and sealing the electronic substrate with a resin layer,
In the state where the electronic board is accommodated, the through hole of the connector housing is located above the opening side end of the electronic board, and the opening side end of the electronic board is from the opening part. Also tilt the electronic substrate housing case so that it is located below,
In a state where the electronic substrate housing case is inclined, the electronic substrate housing case is filled with a softened resin up to a position where the electronic substrate is buried and the through hole is not buried,
The electronic substrate is sealed with a resin layer by curing the softened resin to form the resin layer. A method for sealing an electronic substrate.

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