JP2009200115A - Holding structure for electronic substrate - Google Patents

Holding structure for electronic substrate Download PDF

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JP2009200115A
JP2009200115A JP2008037746A JP2008037746A JP2009200115A JP 2009200115 A JP2009200115 A JP 2009200115A JP 2008037746 A JP2008037746 A JP 2008037746A JP 2008037746 A JP2008037746 A JP 2008037746A JP 2009200115 A JP2009200115 A JP 2009200115A
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electronic substrate
electronic
connector
housing case
holding
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JP5011157B2 (en
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Toru Takase
徹 高瀬
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Keihin Corp
株式会社ケーヒン
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Abstract

<P>PROBLEM TO BE SOLVED: To reduce an influence of external force operating on a connector member on the electronic substrate itself or an electronic component mounted on the electronic substrate by reducing a load on the electronic substrate due to the external force. <P>SOLUTION: Disclosed is the holding structure for the electronic substrate mounted with the connector member C, the holding structure including: a bag-like electronic substrate storage case 1 for storing the electronic substrate P in a state wherein the connector member C is exposed; a support means 2 of supporting the electronic substrate P in the electronic substrate storage case 1; and a transmission means 3 of transmitting the external force that the connector member C receives to the electronic substrate storage case 1. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、電子基板の保持構造に関するものである。   The present invention relates to an electronic substrate holding structure.
例えば、自動二輪車や自動四輪車等の車両に制御用の電子基板を設置する場合には、コネクタ部材等の電子部品が実装された上記電子基板を、袋構造の電子基板収容ケースにコネクタ部材が露出するように収容して保持し、当該電子基板収容ケースごと設置する場合がある。   For example, when an electronic board for control is installed in a vehicle such as a motorcycle or an automobile, the electronic board on which electronic parts such as a connector member are mounted is connected to a bag-structured electronic board housing case with a connector member. In some cases, the electronic circuit board housing case is installed and held so that is exposed.
このような袋構造の電子基板収容ケースにて電子基板を保持する場合には、電子基板の収容ケースの内部にて電子基板が直接支持された状態にて電子基板が保持される。
例えば、特許文献1には、電子基板収容ケースの内部においてガイド部材にて電子基板を狭持して支持することによって電子基板を保持する構造が開示されている。
特開平11−289178号公報
When holding an electronic substrate in such a bag-structured electronic substrate housing case, the electronic substrate is held in a state where the electronic substrate is directly supported inside the electronic substrate housing case.
For example, Patent Document 1 discloses a structure in which an electronic substrate is held by holding and supporting the electronic substrate with a guide member inside the electronic substrate housing case.
JP-A-11-289178
ところで、電子基板に実装されるコネクタ部材は、外部のハーネス等に接続される。そして、コネクタ部材には、ハーネスを接続する際やハーネスを介して外力が作用する。このようにコネクタ部材に作用した外力は、電子基板収容ケースに支持された電子基板に伝達し、電子基板に対する曲げ応力等となって電子基板に作用する。
つまり、従来の電子基板の保持構造では、コネクタ部材に作用する外力に起因して電子基板に大きな負荷が加わることとなる。したがって、電子基板自体あるいは電子基板に実装された電子部品に対して悪影響が出る虞がある。
特に、自動二輪車は振動が大きくコネクタ部材に作用する外力が大きいため、電子基板に特に大きな負荷が加わることになる。
By the way, the connector member mounted on the electronic board is connected to an external harness or the like. An external force acts on the connector member when the harness is connected or through the harness. The external force acting on the connector member in this way is transmitted to the electronic board supported by the electronic board housing case, and acts on the electronic board as bending stress on the electronic board.
That is, in the conventional electronic board holding structure, a large load is applied to the electronic board due to the external force acting on the connector member. Therefore, there is a possibility that the electronic substrate itself or an electronic component mounted on the electronic substrate may be adversely affected.
In particular, since a motorcycle has a large vibration and a large external force acting on the connector member, a particularly large load is applied to the electronic board.
本発明は、上述する問題点に鑑みてなされたもので、コネクタ部材に作用する外力に起因する電子基板への負荷を低減させ、上記外力に起因する電子基板自体あるいは電子基板に実装された電子部品に対しての影響を低減させることを目的とする。   The present invention has been made in view of the above-described problems, and reduces the load on the electronic board caused by the external force acting on the connector member, and the electronic board itself or the electronic board mounted on the electronic board caused by the external force. The purpose is to reduce the influence on parts.
上記目的を達成するために、本発明は、コネクタ部材が実装された電子基板の保持構造であって、上記コネクタ部材を露出した状態で上記電子基板を収容する袋構造の電子基板収容ケースと、上記電子基板収容ケースの内部において上記電子基板を支持する支持手段と、上記コネクタ部材の受けた外力を上記電子基板収容ケースに伝達する伝達手段とを備えることを特徴とする。   To achieve the above object, the present invention provides an electronic board holding structure on which a connector member is mounted, and an electronic board housing case having a bag structure for housing the electronic board in a state where the connector member is exposed, The electronic board housing case includes support means for supporting the electronic board and transmission means for transmitting an external force received by the connector member to the electronic board housing case.
また、本発明においては、上記伝達手段は、上記コネクタ部材と上記電子基板収容ケースとの間に介在される金属プレートであるという構成を採用する。   In the present invention, the transmission means is a metal plate interposed between the connector member and the electronic substrate housing case.
また、本発明においては、上記電子基板を上記電子基板収容ケースに挿入する際の挿入方向から見て、上記金属プレートの面積は、上記電子基板収容ケースの開口部の面積よりも小さく設定されているという構成を採用する。   In the present invention, the area of the metal plate is set smaller than the area of the opening of the electronic substrate housing case when viewed from the insertion direction when the electronic substrate is inserted into the electronic substrate housing case. Adopt a configuration that
また、本発明においては、上記電子基板収容ケースと上記電子基板との間に樹脂が充填されているという構成を採用する。   Moreover, in this invention, the structure that resin is filled between the said electronic substrate storage case and the said electronic substrate is employ | adopted.
本発明によれば、電子基板収容ケースの内部において電子基板を支持する支持手段の他に、コネクタ部材の受けた外力を電子基板収容ケースに伝達する伝達手段を備える。このため、伝達手段によってコネクタ部材の受けた外力の少なくとも一部が電子基板に伝達されることなく電子基板収容ケースに伝達される。
したがって、本発明によれば、コネクタ部材に作用する外力に起因する電子基板への負荷を低減させ、上記外力に起因する電子基板自体あるいは電子基板に実装された電子部品に対しての影響を低減させることが可能となる。
According to the present invention, in addition to the support means for supporting the electronic substrate inside the electronic substrate housing case, the transmitting device transmits the external force received by the connector member to the electronic substrate housing case. For this reason, at least a part of the external force received by the connector member by the transmission means is transmitted to the electronic substrate housing case without being transmitted to the electronic substrate.
Therefore, according to the present invention, the load on the electronic board caused by the external force acting on the connector member is reduced, and the influence on the electronic board itself or the electronic component mounted on the electronic board caused by the external force is reduced. It becomes possible to make it.
以下、図面を参照して、本発明に係る電子基板の保持構造の一実施形態について説明する。なお、以下の図面において、各部材を認識可能な大きさとするために、各部材の縮尺を適宜変更している。   Hereinafter, an embodiment of an electronic substrate holding structure according to the present invention will be described with reference to the drawings. In the following drawings, the scale of each member is appropriately changed in order to make each member a recognizable size.
図1は、本実施形態の電子基板の保持構造10の分解斜視図である。また、図2は、本実施形態の電子基板の保持構造10の分解鉛直断面図である。また、図3は、本実施形態の電子基板の保持構造10の組立鉛直断面図である。
なお、図1〜図3においては、電子基板の保持構造10と共に電子基板Pを図示している。
また、本実施形態の説明においては、便宜上、後述する電子基板収容ケース1の正規位置に収容された電子基板Pの表裏面に沿う方向を水平方向とし、電子基板Pの表裏面に直交する方向を鉛直方向として説明する。しかしながら、実際に取り付けられる際の電子基板収容ケース1の姿勢は、設置箇所に応じて自由である。
FIG. 1 is an exploded perspective view of an electronic substrate holding structure 10 according to the present embodiment. FIG. 2 is an exploded vertical sectional view of the electronic substrate holding structure 10 of the present embodiment. FIG. 3 is an assembled vertical cross-sectional view of the electronic board holding structure 10 of the present embodiment.
1 to 3 show the electronic substrate P together with the electronic substrate holding structure 10.
In the description of the present embodiment, for the sake of convenience, the direction along the front and back surfaces of the electronic substrate P accommodated in a regular position of the electronic substrate housing case 1 described later is defined as the horizontal direction and the direction orthogonal to the front and back surfaces of the electronic substrate P. Is described as a vertical direction. However, the posture of the electronic substrate housing case 1 when it is actually attached is free according to the installation location.
図1〜図3に示すように、本実施形態の電子基板の保持構造10は、電子基板収容ケース1と、レール対2(支持手段)、コネクタホルダ3(伝達手段)とを備えている。   As shown in FIGS. 1 to 3, the electronic board holding structure 10 of this embodiment includes an electronic board housing case 1, a rail pair 2 (support means), and a connector holder 3 (transmission means).
本実施形態の電子基板収容ケース1は、電子基板Pを内部にて保持した状態にて収容する袋状の構造体であり、電子基板Pを挿入出するための開口部11を有している。この電子基板収容ケース1は、例えばプラスチック等により形成されている。
なお、電子基板Pは、配線が形成されると共に複数の電子部品が実装されたプリント基板であり、電子部品の1つであるコネクタ部材Cが一端部P1の表面側に実装されている。このコネクタ部材Cは、電子基板Pの一端部P1から離れた側の側部C1に配列される複数の接続端子を備えている。そして、電子基板Pが電子基板収容ケース1の内部に収容されている場合には、コネクタ部材Cの側部C1のみが電子基板収容ケース1の開口部11(図3参照)に露出され、これによってコネクタ部材Cと外部のハーネスとが接続可能とされる。
The electronic substrate housing case 1 of the present embodiment is a bag-like structure that houses the electronic substrate P while being held inside, and has an opening 11 for inserting and removing the electronic substrate P. . The electronic substrate housing case 1 is made of, for example, plastic.
The electronic board P is a printed board on which wiring is formed and a plurality of electronic components are mounted, and a connector member C, which is one of the electronic components, is mounted on the surface side of the one end P1. The connector member C includes a plurality of connection terminals arranged on the side portion C1 on the side away from the one end portion P1 of the electronic substrate P. When the electronic board P is housed inside the electronic board housing case 1, only the side part C1 of the connector member C is exposed to the opening 11 (see FIG. 3) of the electronic board housing case 1, Thus, the connector member C and the external harness can be connected.
電子基板収容ケース1は、水平方向に対向配置された上壁部1a及び下壁部1bと、鉛直方向に対向配置される側壁部1c,1dと、鉛直方向に配置されると共に上壁部1a、下壁部1b、側壁部1c,1dとに垂直に接続される奥壁部1eとによって袋構造とされた構成を有しており、電子基板Pの挿入方向から見る形状が略矩形とされている。   The electronic substrate housing case 1 includes an upper wall portion 1a and a lower wall portion 1b that are arranged to face each other in the horizontal direction, side wall portions 1c and 1d that are arranged to face each other in the vertical direction, and an upper wall portion 1a that is arranged in the vertical direction. The bottom wall portion 1b and the back wall portion 1e connected perpendicularly to the side wall portions 1c and 1d have a bag structure, and the shape viewed from the insertion direction of the electronic substrate P is substantially rectangular. ing.
そして、本実施形態の電子基板収容ケース1は、各々の側壁部1c,1dの内部側に2本のレールからなるレール対2(支持部)が設置されている。
これらのレール対2は、鉛直方向に配列される上側レール2aと下側レール2bとによって構成されている。
上側レール2aは、電子基板Pが収容されている場合に、電子基板Pの表面側に配置されると共に電子基板Pの挿入出方向に延在するレールである。一方、下側レール2bは、電子基板Pが収容されている場合に、電子基板Pの裏面側に配置されると共に電子基板Pの挿入出方向に延在するレールである。
In the electronic substrate housing case 1 of the present embodiment, a rail pair 2 (supporting portion) composed of two rails is installed on the inner side of each of the side wall portions 1c and 1d.
These rail pairs 2 are constituted by an upper rail 2a and a lower rail 2b arranged in the vertical direction.
The upper rail 2a is a rail that is disposed on the surface side of the electronic substrate P and extends in the insertion / extraction direction of the electronic substrate P when the electronic substrate P is accommodated. On the other hand, the lower rail 2b is a rail that is arranged on the back side of the electronic substrate P and extends in the insertion / extraction direction of the electronic substrate P when the electronic substrate P is accommodated.
このようなレール対2を構成する上側レール2a及び下側レール2bは、電子基板Pを電子基板収容ケース1に対して挿入出する際のガイドとして機能すると共に電子基板Pが挿入された場合に電子基板Pを電子基板収容ケース1の内部にて支持するように機能する。
より詳細には、電子基板Pは、両側の端部が上下に配列された上側レール2aと下側レール2b間である溝に嵌合されることによって保持され、また当該溝に沿って摺動することによって挿入出の際に案内される。
The upper rail 2a and the lower rail 2b constituting the rail pair 2 function as a guide when the electronic board P is inserted into and removed from the electronic board housing case 1, and when the electronic board P is inserted. It functions to support the electronic substrate P inside the electronic substrate housing case 1.
More specifically, the electronic substrate P is held by being fitted into a groove between the upper rail 2a and the lower rail 2b whose both ends are arranged vertically, and slides along the groove. By doing so, it is guided at the time of insertion / extraction.
コネクタホルダ3は、図1に示すように、コネクタ部材Cの上部に対応して形状設定された金属プレートであり、例えばアルミニウムによって形成されている。
このコネクタホルダ3は、組み立てられた状態において、コネクタ部材Cに作用する外力の少なくとも一部を電子基板Pに伝達することなく、電子基板収容ケース1に伝達するものである。
As shown in FIG. 1, the connector holder 3 is a metal plate whose shape is set corresponding to the upper portion of the connector member C, and is formed of, for example, aluminum.
In the assembled state, the connector holder 3 transmits at least a part of the external force acting on the connector member C to the electronic substrate housing case 1 without transmitting it to the electronic substrate P.
そして、コネクタホルダ3は、図2及び図3に示すように、コネクタ部材Cの側面及び上面に形成された第1突設部C2と、該第1突設部C2に対して電子基板Pの挿入方向に離間して配置されると共にコネクタ部材Cの側面に形成された第2突設部C3との間に嵌め合わされることによってコネクタ部材Cに対して位置決めされる。
また、コネクタホルダ3は、図1及び図2に示すように、貫通孔3aを有しており、当該貫通孔3aを通るネジ4にて電子基板収容ケース1に固定されている。
このように本実施形態の電子基板の保持構造10においては、金属プレートであるコネクタホルダ3が、コネクタ部材Cと電子基板収容ケース1との間に介在されている。
As shown in FIGS. 2 and 3, the connector holder 3 includes a first projecting portion C2 formed on the side surface and upper surface of the connector member C, and the electronic substrate P with respect to the first projecting portion C2. It positions with respect to the connector member C by being spaced apart in the insertion direction and fitting between the second projecting portion C3 formed on the side surface of the connector member C.
As shown in FIGS. 1 and 2, the connector holder 3 has a through hole 3a, and is fixed to the electronic substrate housing case 1 with a screw 4 passing through the through hole 3a.
Thus, in the electronic board holding structure 10 of the present embodiment, the connector holder 3 that is a metal plate is interposed between the connector member C and the electronic board housing case 1.
また、図4に示すように、電子基板Pを電子基板収容ケース1に挿入する際の挿入方向から見て、コネクタホルダ3の面積は、電子基板収容ケース1の開口部11の面積よりも小さく設定されている。
より詳細には、本実施形態の電子基板の保持構造10においては、高さ(鉛直方向の距離)が開口部11の高さよりも低く設定されることによって、コネクタホルダ3の面積が開口部11の面積よりも小さくなるように構成されている。
Further, as shown in FIG. 4, the area of the connector holder 3 is smaller than the area of the opening 11 of the electronic substrate housing case 1 when viewed from the insertion direction when the electronic substrate P is inserted into the electronic substrate housing case 1. Is set.
More specifically, in the electronic substrate holding structure 10 of the present embodiment, the height (distance in the vertical direction) is set lower than the height of the opening 11, so that the area of the connector holder 3 is reduced to the opening 11. It is comprised so that it may become smaller than the area.
また、本実施形態の電子基板の保持構造10においては、図4に示すように、電子基板収容ケース1と電子基板Pとの間に樹脂5が充填され樹脂モールドが形成されている。
なお、図1〜図3においては、樹脂5の図示は省略している。
Further, in the electronic substrate holding structure 10 of the present embodiment, as shown in FIG. 4, a resin mold is formed by filling the resin 5 between the electronic substrate housing case 1 and the electronic substrate P.
Note that the resin 5 is not shown in FIGS.
このような構成を有する本実施形態の電子基板の保持構造10においては、組み立てられた状態(図3に示す状態)にて、コネクタ部材Cに外力が作用すると、当該外力の少なくとも一部が、コネクタホルダ3を介して電子基板収容ケース1に伝達される。つまり、コネクタホルダ3によって、コネクタ部材Cの受けた外力の少なくとも一部が電子基板Pに伝達されることなく電子基板収容ケース1に伝達される。
すなわち、本実施形態の電子基板の保持構造10においては、コネクタホルダ3を備えることにより、コネクタ部材Cの受けた外力の少なくとも一部が電子基板収容ケース1に受け止められる。
したがって、本実施形態の電子基板の保持構造10によれば、コネクタ部材Cに作用する外力に起因する電子基板Pへの負荷を低減させ、上記外力に起因する電子基板P自体あるいは電子基板Pに実装された電子部品に対しての影響を低減させることが可能となる。
In the electronic board holding structure 10 of this embodiment having such a configuration, when an external force acts on the connector member C in the assembled state (the state shown in FIG. 3), at least a part of the external force is It is transmitted to the electronic substrate housing case 1 via the connector holder 3. In other words, at least a part of the external force received by the connector member C is transmitted to the electronic substrate housing case 1 by the connector holder 3 without being transmitted to the electronic substrate P.
That is, in the electronic board holding structure 10 of the present embodiment, by providing the connector holder 3, at least a part of the external force received by the connector member C is received by the electronic board housing case 1.
Therefore, according to the electronic board holding structure 10 of this embodiment, the load on the electronic board P caused by the external force acting on the connector member C is reduced, and the electronic board P itself or the electronic board P caused by the external force is reduced. It is possible to reduce the influence on the mounted electronic component.
また、本実施形態の電子基板の保持構造10においては、コネクタ部材Cと電子基板収容ケース1との間に介在される金属プレートであるコネクタホルダ3にて、コネクタ部材Cに作用した外力の少なくとも一部を電子基板収容ケース1に伝達した。
このような電子基板収容ケース1よりも剛性の高いコネクタホルダ3を用いることにより、コネクタ部材Cに作用した外力のより多くを電子基板収容ケース1に伝達することができ、電子基板Pへの負荷をより低減させることができる。
また、剛性の高い部材によりコネクタ部材Cが電子基板収容ケース1に固定されることとなるため、コネクタ部材Cが強固に固定され、電子基板収容ケース1に対するコネクタ部材Cの位置を安定させることが可能となる。
Further, in the electronic board holding structure 10 of the present embodiment, at least an external force acting on the connector member C in the connector holder 3 which is a metal plate interposed between the connector member C and the electronic board housing case 1 is used. A part was transmitted to the electronic substrate housing case 1.
By using the connector holder 3 having higher rigidity than the electronic substrate housing case 1, more external force acting on the connector member C can be transmitted to the electronic substrate housing case 1, and the load on the electronic substrate P is increased. Can be further reduced.
Further, since the connector member C is fixed to the electronic substrate housing case 1 by a highly rigid member, the connector member C is firmly fixed, and the position of the connector member C relative to the electronic substrate housing case 1 can be stabilized. It becomes possible.
また、本実施形態の電子基板の保持構造10においては、コネクタホルダ3は、図4に示すように、電子基板Pを電子基板収容ケース1に挿入する際の挿入方向から見て、面積が電子基板収容ケース1の開口部11の面積よりも小さく設定されている。
このため、コネクタホルダ3をコネクタ部材Cに嵌め合わせ、さらに電子基板収容ケース1にネジ止めした場合であっても、図4に示すように、コネクタホルダ3と電子基板収容ケース1との間に、電子基板収容ケース1の内部に連通する領域Aを形成することができる。
したがって、領域Aから電子基板収容ケース1の内部に樹脂を注入することができ、電子基板収容ケース1と電子基板Pとの間に容易に樹脂5を充填することが可能となる。
Further, in the electronic substrate holding structure 10 of the present embodiment, the connector holder 3 has an area as viewed from the insertion direction when the electronic substrate P is inserted into the electronic substrate housing case 1 as shown in FIG. It is set smaller than the area of the opening 11 of the substrate housing case 1.
For this reason, even when the connector holder 3 is fitted to the connector member C and is further screwed to the electronic board housing case 1, as shown in FIG. A region A communicating with the inside of the electronic substrate housing case 1 can be formed.
Therefore, the resin can be injected from the region A into the electronic substrate housing case 1, and the resin 5 can be easily filled between the electronic substrate housing case 1 and the electronic substrate P.
また、本実施形態の電子基板の保持構造10においては、電子基板収容ケース1と電子基板Pとの間に樹脂5が充填されている。
このため、電子基板Pに作用する外力を分散することができると共に、電子基板Pに実装された電子部品の脱落を抑止することが可能となる。
Further, in the electronic substrate holding structure 10 of the present embodiment, the resin 5 is filled between the electronic substrate housing case 1 and the electronic substrate P.
For this reason, it is possible to disperse the external force acting on the electronic substrate P and to prevent the electronic components mounted on the electronic substrate P from falling off.
以上、添付図面を参照しながら本発明に係る電子基板の保持構造の好適な実施形態について説明したが、本発明は上記実施形態に限定されないことは言うまでもない。上述した実施形態において示した各構成部材の諸形状や組み合わせ等は一例であって、本発明の主旨から逸脱しない範囲において設計要求等に基づき種々変更可能である。   The preferred embodiment of the electronic substrate holding structure according to the present invention has been described above with reference to the accompanying drawings, but the present invention is not limited to the above-described embodiment. Various shapes, combinations, and the like of the constituent members shown in the above-described embodiments are examples, and various modifications can be made based on design requirements and the like without departing from the gist of the present invention.
例えば、上記実施形態においては、本発明における伝達手段として、コネクタ部材Cと電子基板収容ケース1との間に介在される金属プレートであるコネクタホルダ3を用いる構成について説明した。
しかしながら、本発明はこれに限定されるものではなく、伝達手段は、必ずしも金属プレートである必要はなく、コネクタ部材Cに作用する外力の少なくとも一部を電子基板収容ケースに伝達することができるものを用いることができる。例えば、伝達手段として、プラスチック部材、ゴム部材等を用いることもできる。
For example, in the above-described embodiment, the configuration using the connector holder 3 that is a metal plate interposed between the connector member C and the electronic substrate housing case 1 as the transmission means in the present invention has been described.
However, the present invention is not limited to this, and the transmission means does not necessarily need to be a metal plate, and can transmit at least part of the external force acting on the connector member C to the electronic board housing case. Can be used. For example, a plastic member, a rubber member, or the like can be used as the transmission means.
また、上記実施形態においては、電子基板Pを電子基板収容ケース1に挿入する際の挿入方向から見て、コネクタホルダ3の面積が電子基板収容ケース1の開口部11の面積よりも小さく設定されている構成について説明した。
しかしながら、本発明はこれに限定されるものではなく、樹脂5を充填しない場合や樹脂5を電子基板収容ケース1に別途設けた注入口から注入する場合には、コネクタホルダ3の面積が電子基板収容ケース1の開口部11の面積よりと同じもしくは大きく設定されていても良い。
In the above embodiment, the area of the connector holder 3 is set smaller than the area of the opening 11 of the electronic substrate housing case 1 when viewed from the insertion direction when the electronic substrate P is inserted into the electronic substrate housing case 1. Explained the configuration.
However, the present invention is not limited to this, and when the resin 5 is not filled or when the resin 5 is injected from an injection port separately provided in the electronic substrate housing case 1, the area of the connector holder 3 is the electronic substrate. It may be set equal to or larger than the area of the opening 11 of the housing case 1.
また、上記実施形態においては、電子基板収容ケース1と電子基板Pとの間に樹脂5が充填されている構成について説明した。
しかしながら、本発明はこれに限定されるものではなく、必ずしも電子基板収容ケース1と電子基板Pとの間が樹脂5にて充填されている必要はない。
Moreover, in the said embodiment, the structure with which the resin 5 was filled between the electronic substrate storage case 1 and the electronic substrate P was demonstrated.
However, the present invention is not limited to this, and the space between the electronic substrate housing case 1 and the electronic substrate P is not necessarily filled with the resin 5.
また、上記実施形態においては、本発明における支持手段として、レール対2を用いる構成について説明した。
しかしながら、本発明はこれに限定されるものではなく、電子基板収容ケース1の内部にて電子基板Pを直接支持することができる機構であれば指示手段として用いることができる。
Moreover, in the said embodiment, the structure which uses the rail pair 2 as a support means in this invention was demonstrated.
However, the present invention is not limited to this, and any mechanism that can directly support the electronic substrate P inside the electronic substrate housing case 1 can be used as the indicating means.
本発明の一実施形態における電子基板の保持構造の分解斜視図である。It is a disassembled perspective view of the holding structure of the electronic substrate in one Embodiment of this invention. 本発明の一実施形態における電子基板の保持構造の分解鉛直断面図である。It is a decomposition | disassembly vertical sectional view of the holding structure of the electronic substrate in one Embodiment of this invention. 本発明の一実施形態における電子基板の保持構造の組立鉛直断面図である。It is an assembly vertical sectional view of the holding structure of the electronic board in one embodiment of the present invention. 本発明の一実施形態における電子基板の保持構造を電子基板の挿入方向から見た図である。It is the figure which looked at the holding structure of the electronic substrate in one Embodiment of this invention from the insertion direction of the electronic substrate.
符号の説明Explanation of symbols
1……電子基板収容ケース、2……レール対(支持手段)、3……コネクタホルダ(伝達手段)、5……樹脂、10……電子基板の保持構造、P……電子基板、C……コネクタ部材   DESCRIPTION OF SYMBOLS 1 ... Electronic board accommodation case, 2 ... Rail pair (support means), 3 ... Connector holder (transmission means), 5 ... Resin, 10 ... Electronic board holding structure, P ... Electronic board, C ... ... Connector members

Claims (4)

  1. コネクタ部材が実装された電子基板の保持構造であって、
    前記コネクタ部材を露出した状態で前記電子基板を収容する袋構造の電子基板収容ケースと、
    前記電子基板収容ケースの内部において前記電子基板を支持する支持手段と、
    前記コネクタ部材の受けた外力を前記電子基板収容ケースに伝達する伝達手段と
    を備えることを特徴とする電子基板の保持構造。
    An electronic board holding structure on which a connector member is mounted,
    An electronic board housing case having a bag structure for housing the electronic board in a state where the connector member is exposed;
    A support means for supporting the electronic substrate inside the electronic substrate housing case;
    An electronic board holding structure comprising: a transmission means for transmitting an external force received by the connector member to the electronic board housing case.
  2. 前記伝達手段は、前記コネクタ部材と前記電子基板収容ケースとの間に介在される金属プレートであることを特徴とする請求項1記載の電子基板の保持構造。   The electronic board holding structure according to claim 1, wherein the transmission means is a metal plate interposed between the connector member and the electronic board housing case.
  3. 前記電子基板を前記電子基板収容ケースに挿入する際の挿入方向から見て、前記金属プレートの面積は、前記電子基板収容ケースの開口部の面積よりも小さく設定されていることを特徴とする請求項2記載の電子基板の保持構造。   The area of the metal plate is set smaller than the area of the opening of the electronic substrate housing case when viewed from the insertion direction when the electronic substrate is inserted into the electronic substrate housing case. Item 3. The holding structure for an electronic substrate according to Item 2.
  4. 前記電子基板収容ケースと前記電子基板との間に樹脂が充填されていることを特徴とする請求項1〜3いずれかに記載の電子基板の保持構造。


    The electronic substrate holding structure according to claim 1, wherein a resin is filled between the electronic substrate housing case and the electronic substrate.


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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015050275A (en) * 2013-08-30 2015-03-16 株式会社ケーヒン Substrate housing case
JP2015160482A (en) * 2014-02-26 2015-09-07 株式会社デンソー Actuator for brake fluid pressure control
JP2016015362A (en) * 2014-07-01 2016-01-28 三菱電機株式会社 Electronic control device
US9520930B2 (en) 2004-09-10 2016-12-13 Interdigital Technology Corporation Measurement support for a smart antenna in a wireless communication system

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016004618A (en) * 2014-06-13 2016-01-12 株式会社東芝 Card connector and electronic apparatus

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5332384A (en) * 1976-09-08 1978-03-27 Tokyo Shibaura Electric Co Controller
JPS5383067U (en) * 1976-12-10 1978-07-10
JP2003063325A (en) * 2001-08-22 2003-03-05 Omron Corp Case for electric power steering controller
JP2005101088A (en) * 2003-09-22 2005-04-14 Aisin Seiki Co Ltd Fixing member

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5332384A (en) * 1976-09-08 1978-03-27 Tokyo Shibaura Electric Co Controller
JPS5383067U (en) * 1976-12-10 1978-07-10
JP2003063325A (en) * 2001-08-22 2003-03-05 Omron Corp Case for electric power steering controller
JP2005101088A (en) * 2003-09-22 2005-04-14 Aisin Seiki Co Ltd Fixing member

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9520930B2 (en) 2004-09-10 2016-12-13 Interdigital Technology Corporation Measurement support for a smart antenna in a wireless communication system
US9967016B2 (en) 2004-09-10 2018-05-08 Interdigital Technology Corporation Measurement support for a smart antenna in a wireless communication system
JP2015050275A (en) * 2013-08-30 2015-03-16 株式会社ケーヒン Substrate housing case
JP2015160482A (en) * 2014-02-26 2015-09-07 株式会社デンソー Actuator for brake fluid pressure control
US9381898B2 (en) 2014-02-26 2016-07-05 Denso Corporation Actuator for brake fluid pressure control
JP2016015362A (en) * 2014-07-01 2016-01-28 三菱電機株式会社 Electronic control device

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