JP4843171B2 - 支持体基板上の電気構造体のスクリーン印刷用ペースト - Google Patents

支持体基板上の電気構造体のスクリーン印刷用ペースト Download PDF

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Publication number
JP4843171B2
JP4843171B2 JP2001514266A JP2001514266A JP4843171B2 JP 4843171 B2 JP4843171 B2 JP 4843171B2 JP 2001514266 A JP2001514266 A JP 2001514266A JP 2001514266 A JP2001514266 A JP 2001514266A JP 4843171 B2 JP4843171 B2 JP 4843171B2
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JP
Japan
Prior art keywords
paste
support substrate
fibers
sintering temperature
glass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2001514266A
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English (en)
Japanese (ja)
Other versions
JP2003506820A5 (enExample
JP2003506820A (ja
Inventor
ベック ヴァルター
ヘニッヒ ヨアヒム
クリューガー クラウス
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of JP2003506820A publication Critical patent/JP2003506820A/ja
Publication of JP2003506820A5 publication Critical patent/JP2003506820A5/ja
Application granted granted Critical
Publication of JP4843171B2 publication Critical patent/JP4843171B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C13/00—Fibre or filament compositions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
    • H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits
    • H01C17/06593—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the temporary binder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
    • H01G4/1218—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
    • H01G4/1227—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates based on alkaline earth titanates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
    • H01G4/1236—Ceramic dielectrics characterised by the ceramic dielectric material based on zirconium oxides or zirconates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H01L23/49894—Materials of the insulating layers or coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
    • Y02T10/00—Road transport of goods or passengers
    • Y02T10/60—Other road transportation technologies with climate change mitigation effect
    • Y02T10/70—Energy storage systems for electromobility, e.g. batteries
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24926—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Non-Adjustable Resistors (AREA)
  • Conductive Materials (AREA)
JP2001514266A 1999-07-29 2000-07-01 支持体基板上の電気構造体のスクリーン印刷用ペースト Expired - Fee Related JP4843171B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19935677.7 1999-07-29
DE19935677A DE19935677B4 (de) 1999-07-29 1999-07-29 Paste für den Siebdruck von elektrischen Strukturen auf Trägersubstraten
PCT/DE2000/002151 WO2001009060A1 (de) 1999-07-29 2000-07-01 Paste für den siebdruck von elektrischen strukturen auf trägersubstraten

Publications (3)

Publication Number Publication Date
JP2003506820A JP2003506820A (ja) 2003-02-18
JP2003506820A5 JP2003506820A5 (enExample) 2007-08-30
JP4843171B2 true JP4843171B2 (ja) 2011-12-21

Family

ID=7916498

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001514266A Expired - Fee Related JP4843171B2 (ja) 1999-07-29 2000-07-01 支持体基板上の電気構造体のスクリーン印刷用ペースト

Country Status (5)

Country Link
US (1) US6667094B1 (enExample)
EP (1) EP1129050B1 (enExample)
JP (1) JP4843171B2 (enExample)
DE (2) DE19935677B4 (enExample)
WO (1) WO2001009060A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IL170320A (en) 2005-08-17 2010-04-29 Orad Hi Tec Systems Ltd System and method for managing the visual effects insertion in a video stream
DE102006008458A1 (de) * 2006-02-20 2007-08-23 E.G.O. Elektro-Gerätebau GmbH Elektrisches Widerstands-Bauelement und Verfahren zur Herstellung eines elektrischen Widerstands-Bauelements
EP2587771B1 (en) 2011-10-28 2014-11-12 Doro AB Improved handling and configuration of a mobile communications terminal
JP6237456B2 (ja) * 2014-05-13 2017-11-29 株式会社豊田中央研究所 感歪抵抗ペーストおよび力学量センサ素子
DE102020130988A1 (de) 2020-03-17 2021-09-23 Schaeffler Technologies AG & Co. KG Verfahren zur Herstellung einer Schichtanordnung aus Elektroblech, danach hergestellte Schichtanordnung, Rotor oder Stator sowie Elektromotor

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000067646A (ja) * 1998-06-12 2000-03-03 Matsushita Electric Ind Co Ltd 導電性ペ―スト

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3878443A (en) * 1973-07-27 1975-04-15 Gen Electric Capacitor with glass bonded ceramic dielectric
DE3061159D1 (en) * 1979-09-14 1982-12-30 Mitsubishi Metal Corp Electroconductive powder and process for production thereof
JPS5729185U (enExample) * 1980-07-28 1982-02-16
DE3638489A1 (de) * 1986-11-11 1988-05-19 Basf Ag Verfahren zur herstellung von vinylglyoxalderivaten, neue vinylglyoxalderivate und deren verwendung
JPH01257182A (ja) * 1988-04-07 1989-10-13 Matsushita Electric Ind Co Ltd 厚膜導体組成物
US5132104A (en) * 1989-07-21 1992-07-21 Lion Corporation Needle shaped monoamine complex of zinc carbonate and process for producing it
US5254191A (en) * 1990-10-04 1993-10-19 E. I. Du Pont De Nemours And Company Method for reducing shrinkage during firing of ceramic bodies
TW349984B (en) * 1993-09-13 1999-01-11 Starck H C Gmbh Co Kg Pastes for the coating of substrates, methods for manufacturing them and their use
DE4427931C1 (de) * 1994-08-06 1995-11-23 Goldschmidt Ag Th Pigmentkonzentrat und dessen Verwendung
US5569629A (en) * 1994-08-23 1996-10-29 Unifrax Corporation High temperature stable continuous filament glass ceramic fibers
JPH08268782A (ja) * 1995-03-29 1996-10-15 Toshiba Corp 配線用導体およびセラミックス配線基板
KR100345031B1 (ko) * 1997-10-06 2002-07-24 티디케이가부시기가이샤 전자장치 및 그 제조방법

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000067646A (ja) * 1998-06-12 2000-03-03 Matsushita Electric Ind Co Ltd 導電性ペ―スト

Also Published As

Publication number Publication date
DE50002256D1 (de) 2003-06-26
WO2001009060A1 (de) 2001-02-08
US6667094B1 (en) 2003-12-23
EP1129050A1 (de) 2001-09-05
DE19935677B4 (de) 2005-07-07
EP1129050B1 (de) 2003-05-21
DE19935677A1 (de) 2001-02-08
JP2003506820A (ja) 2003-02-18

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