JP4837703B2 - 印刷回路基板の配線形成方法 - Google Patents
印刷回路基板の配線形成方法 Download PDFInfo
- Publication number
- JP4837703B2 JP4837703B2 JP2008120576A JP2008120576A JP4837703B2 JP 4837703 B2 JP4837703 B2 JP 4837703B2 JP 2008120576 A JP2008120576 A JP 2008120576A JP 2008120576 A JP2008120576 A JP 2008120576A JP 4837703 B2 JP4837703 B2 JP 4837703B2
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- film
- circuit board
- printed circuit
- base film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/0257—Nanoparticles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/101—Using electrical induction, e.g. for heating during soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1131—Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49163—Manufacturing circuit on or in base with sintering of base
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
誘導加熱がベースフィルムと配線との接着強度に与える影響と、接着強度試験後の銅配線と基板に用いたベースフィルムの形状とを見るために、下記のような試片を製作して接着強度を測定し、走査電子顕微鏡を用いてベースフィルムと金属配線との写真を撮影した。
図3に示すように、平均粒子サイズが5nmであるナノ銅粒子を含有するインクをインクジェットを用いて横×縦×厚さの値が1cm×10cm×10μmである銅配線パターン310をBT樹脂のベースフィルム300上に印刷した。
図3に示すように、平均粒子サイズが5nmであるナノ銅粒子を含有するインクをインクジェットを用いて横×縦×厚さの値が1cm×10cm×10μmである銅配線310のパターンをBT樹脂のベースフィルム300上に印刷した。
図5に示すように、従来技術の焼成炉を経た、配線310が形成されたベースフィルム300、または、本発明の誘導加熱工程を経た、配線310が形成されたベースフィルム300を万能引張試験機(UTM)の支持台500に固定させ、万能引張試験機を用いてIPCTM−6502.4.8の試験方法により接着強度を測定した結果を表1に示した。
図6a〜図7dに、本発明及び従来技術による印刷回路基板400に対して、ベースフィルム300と配線310との接着強度試験を行った試片の走査電子顕微鏡写真を、それぞれ示した。
310 配線
400 印刷回路基板
410 高周波発振器
420 コンベヤベルト
430 誘導加熱炉
440 加熱部
450 移送装置
460 ループ型
470 探針型
500 支持台
510 ベースフィルム表面
520 ベースフィルム界面
530 配線界面
540 配線表面
Claims (9)
- ベースフィルムとして、シリカ(SIO2)、ジルコニア(ZrO2)、チタニア(TiO2)、チタン酸バリウム(BaTiO3)、グラスウール、及びこれらの合金からなる群より選ばれる少なくとも一つを30〜70質量%含有する有機フィルムを準備する段階と、
金属ナノ粒子を含有するインクを前記ベースフィルムに印刷して配線パターンを形成する段階と、
前記配線パターンが形成されたベースフィルムを誘導加熱して配線を形成する段階と、
を含み、
前記配線パターンが形成されたベースフィルムを誘導加熱しながら焼成するか、または、誘導加熱する前または誘導加熱した後に焼成する段階を行い、前記焼成の温度は150℃〜350℃である、
印刷回路基板の配線形成方法。 - 前記有機フィルムは、ポリイミドフィルム、ポリエステルフィルム、ポリプロピレンオキサイド(PPO)フィルム、エポキシフィルム、フェノールフィルム、液晶高分子(LCP)フィルム、ビスマレイミドトリアジン(BT)フィルム、シアンエステル(CE)フィルム、ポリアラミドフィルム、フッ素樹脂フィルム、ノルボルネン樹脂フィルム、及びこれらの組み合せからなる群より選ばれる一つである請求項1に記載の印刷回路基板の配線形成方法。
- 前記金属ナノ粒子は、金、銀、銅、白金、鉛、インジウム、パラジウム、タングステン、ニッケル、タンタル、ビスマス、錫、亜鉛、アルミニウム、鉄、及びこれらの合金からなる群より選ばれる少なくとも一つである請求項1または2に記載の印刷回路基板の配線形成方法。
- 前記金属ナノ粒子の平均直径が、1〜500nmである請求項1から3のいずれか1項に記載の印刷回路基板の配線形成方法。
- 前記金属ナノ粒子が含まれたインクをベースフィルムに印刷する方式は、インクジェット印刷方式である請求項1から4のいずれか1項に記載の印刷回路基板の配線形成方法。
- 前記誘導加熱は、10〜900kHzの周波数で行われる請求項1から5のいずれか1項に記載の印刷回路基板の配線形成方法。
- 前記誘導加熱は、回路基板全体を誘導加熱することである請求項1から6のいずれか1項に記載の印刷回路基板の配線形成方法。
- 前記誘導加熱は、回路基板の配線部分のみを誘導加熱することである請求項1から6のいずれか1項に記載の印刷回路基板の配線形成方法。
- 前記形成された配線は、配線の幅が10μm〜10cmである請求項1から8のいずれか1項に記載の印刷回路基板の配線形成方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20070045582 | 2007-05-10 | ||
KR10-2007-0045582 | 2007-05-10 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008283181A JP2008283181A (ja) | 2008-11-20 |
JP4837703B2 true JP4837703B2 (ja) | 2011-12-14 |
Family
ID=40026059
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008120576A Expired - Fee Related JP4837703B2 (ja) | 2007-05-10 | 2008-05-02 | 印刷回路基板の配線形成方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20080282537A1 (ja) |
JP (1) | JP4837703B2 (ja) |
CN (1) | CN101304637B (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018157224A1 (en) * | 2017-03-02 | 2018-09-07 | Wilsun Xu | Reducing induced voltages and currents in pipelines |
US11141786B2 (en) | 2016-04-01 | 2021-10-12 | Lg Chem, Ltd. | Method for manufacturing metal foam |
US11298745B2 (en) | 2016-04-01 | 2022-04-12 | Lg Chem, Ltd. | Method for manufacturing metal foam |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ATE556572T1 (de) * | 2007-06-01 | 2012-05-15 | Bae Systems Plc | Direktschreib- und additive herstellungsprozesse und -vorrichtung |
JP5387034B2 (ja) * | 2009-02-20 | 2014-01-15 | 大日本印刷株式会社 | 導電性基板 |
WO2010109430A2 (en) | 2009-03-27 | 2010-09-30 | Koninklijke Philips Electronics N.V. | Apparatus and method for manufacturing an integrated circuit |
JP5576843B2 (ja) | 2010-12-15 | 2014-08-20 | 日本特殊陶業株式会社 | 導体パターン印刷用インク |
CN102700250A (zh) * | 2012-02-01 | 2012-10-03 | 南京点面光电有限公司 | 一种电容式触摸屏引线的制备方法 |
CN102883543B (zh) * | 2012-10-08 | 2016-04-13 | 复旦大学 | 一种采用加成工艺制备导电线路的方法 |
US20140197159A1 (en) * | 2013-01-15 | 2014-07-17 | Xenon Corporation | Magnetic field for sintering conductive material with nanoparticles |
NL1040336C2 (en) * | 2013-08-14 | 2015-02-19 | Stichting Dutch Polymer Inst | Method for preparing a conductive feature on a substrate and a product obtained by such process. |
KR102056100B1 (ko) * | 2016-04-01 | 2019-12-17 | 주식회사 엘지화학 | 3d 프린팅 방법 |
CN111548194A (zh) * | 2020-05-29 | 2020-08-18 | 南京凯泰化学科技有限公司 | 一种印制电路板的制备方法 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4278702A (en) * | 1979-09-25 | 1981-07-14 | Anthony J. Casella | Method of making printed circuit board by induction heating of the conductive metal particles on a plastic substrate |
JP2001156414A (ja) * | 1999-11-30 | 2001-06-08 | Yazaki Corp | 導電性ペースト及び回路形成方法 |
US20030146019A1 (en) * | 2001-11-22 | 2003-08-07 | Hiroyuki Hirai | Board and ink used for forming conductive pattern, and method using thereof |
JP4192554B2 (ja) * | 2002-10-25 | 2008-12-10 | 株式会社デンソー | 多層回路基板の製造方法 |
JP2004193411A (ja) * | 2002-12-12 | 2004-07-08 | Fujikura Ltd | 高誘電率電気・電子部品の製造方法と部品 |
JP4168984B2 (ja) * | 2004-06-28 | 2008-10-22 | セイコーエプソン株式会社 | 配線基板の形成方法 |
JP2006140376A (ja) * | 2004-11-15 | 2006-06-01 | Konica Minolta Holdings Inc | 導電性パターンの形成方法 |
KR100653251B1 (ko) * | 2005-03-18 | 2006-12-01 | 삼성전기주식회사 | Ag-Pd 합금 나노입자를 이용한 배선기판 제조방법 |
JP2006269557A (ja) * | 2005-03-22 | 2006-10-05 | Fuji Photo Film Co Ltd | 回路パターン形成方法並びに、それを用いて形成した回路パターン及び積層体 |
JP4712420B2 (ja) * | 2005-03-31 | 2011-06-29 | 富士フイルム株式会社 | 表面グラフト材料、導電性材料およびその製造方法 |
JP4701438B2 (ja) * | 2005-07-29 | 2011-06-15 | 独立行政法人産業技術総合研究所 | フレキシブルプリント基板 |
GB2430178A (en) * | 2005-09-20 | 2007-03-21 | Seiko Epson Corp | Method of producing a substrate having areas of different hydrophilicity and/or oleophilicity on the same surface |
-
2008
- 2008-05-02 JP JP2008120576A patent/JP4837703B2/ja not_active Expired - Fee Related
- 2008-05-08 CN CN200810097015.9A patent/CN101304637B/zh not_active Expired - Fee Related
- 2008-05-09 US US12/149,892 patent/US20080282537A1/en not_active Abandoned
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11141786B2 (en) | 2016-04-01 | 2021-10-12 | Lg Chem, Ltd. | Method for manufacturing metal foam |
US11298745B2 (en) | 2016-04-01 | 2022-04-12 | Lg Chem, Ltd. | Method for manufacturing metal foam |
WO2018157224A1 (en) * | 2017-03-02 | 2018-09-07 | Wilsun Xu | Reducing induced voltages and currents in pipelines |
Also Published As
Publication number | Publication date |
---|---|
CN101304637B (zh) | 2012-09-05 |
JP2008283181A (ja) | 2008-11-20 |
CN101304637A (zh) | 2008-11-12 |
US20080282537A1 (en) | 2008-11-20 |
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