JP4837320B2 - 加工対象物切断方法 - Google Patents
加工対象物切断方法 Download PDFInfo
- Publication number
- JP4837320B2 JP4837320B2 JP2005207559A JP2005207559A JP4837320B2 JP 4837320 B2 JP4837320 B2 JP 4837320B2 JP 2005207559 A JP2005207559 A JP 2005207559A JP 2005207559 A JP2005207559 A JP 2005207559A JP 4837320 B2 JP4837320 B2 JP 4837320B2
- Authority
- JP
- Japan
- Prior art keywords
- workpiece
- along
- cutting line
- laser light
- region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Dicing (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005207559A JP4837320B2 (ja) | 2000-09-13 | 2005-07-15 | 加工対象物切断方法 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000278306 | 2000-09-13 | ||
JP2000278306 | 2000-09-13 | ||
JP2005207559A JP4837320B2 (ja) | 2000-09-13 | 2005-07-15 | 加工対象物切断方法 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2001278752A Division JP3722731B2 (ja) | 2000-09-13 | 2001-09-13 | レーザ加工方法 |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006056690A Division JP3867109B2 (ja) | 2000-09-13 | 2006-03-02 | レーザ加工方法 |
JP2006069993A Division JP3867110B2 (ja) | 2000-09-13 | 2006-03-14 | レーザ加工方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2005313237A JP2005313237A (ja) | 2005-11-10 |
JP2005313237A5 JP2005313237A5 (zh) | 2009-02-19 |
JP4837320B2 true JP4837320B2 (ja) | 2011-12-14 |
Family
ID=35441201
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005207559A Expired - Lifetime JP4837320B2 (ja) | 2000-09-13 | 2005-07-15 | 加工対象物切断方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4837320B2 (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10562130B1 (en) | 2018-12-29 | 2020-02-18 | Cree, Inc. | Laser-assisted method for parting crystalline material |
US10576585B1 (en) | 2018-12-29 | 2020-03-03 | Cree, Inc. | Laser-assisted method for parting crystalline material |
US10611052B1 (en) | 2019-05-17 | 2020-04-07 | Cree, Inc. | Silicon carbide wafers with relaxed positive bow and related methods |
US11024501B2 (en) | 2018-12-29 | 2021-06-01 | Cree, Inc. | Carrier-assisted method for parting crystalline material along laser damage region |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4659300B2 (ja) | 2000-09-13 | 2011-03-30 | 浜松ホトニクス株式会社 | レーザ加工方法及び半導体チップの製造方法 |
EP3664131A3 (en) | 2002-03-12 | 2020-08-19 | Hamamatsu Photonics K. K. | Substrate dividing method |
TWI326626B (en) | 2002-03-12 | 2010-07-01 | Hamamatsu Photonics Kk | Laser processing method |
EP2216128B1 (en) | 2002-03-12 | 2016-01-27 | Hamamatsu Photonics K.K. | Method of cutting object to be processed |
TWI520269B (zh) | 2002-12-03 | 2016-02-01 | Hamamatsu Photonics Kk | Cutting method of semiconductor substrate |
FR2852250B1 (fr) | 2003-03-11 | 2009-07-24 | Jean Luc Jouvin | Fourreau de protection pour canule, un ensemble d'injection comportant un tel fourreau et aiguille equipee d'un tel fourreau |
US8685838B2 (en) | 2003-03-12 | 2014-04-01 | Hamamatsu Photonics K.K. | Laser beam machining method |
JP4563097B2 (ja) | 2003-09-10 | 2010-10-13 | 浜松ホトニクス株式会社 | 半導体基板の切断方法 |
JP5328209B2 (ja) * | 2007-06-15 | 2013-10-30 | 三菱電機株式会社 | 基板加工方法 |
WO2012014724A1 (ja) * | 2010-07-26 | 2012-02-02 | 浜松ホトニクス株式会社 | 基板加工方法 |
US8828260B2 (en) * | 2010-07-26 | 2014-09-09 | Hamamatsu Photonics K.K. | Substrate processing method |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59150691A (ja) * | 1983-02-15 | 1984-08-28 | Matsushita Electric Ind Co Ltd | レ−ザ加工機 |
JP2810151B2 (ja) * | 1989-10-07 | 1998-10-15 | ホーヤ株式会社 | レーザマーキング方法 |
JP3024990B2 (ja) * | 1990-08-31 | 2000-03-27 | 日本石英硝子株式会社 | 石英ガラス材料の切断加工方法 |
JPH04339586A (ja) * | 1991-05-13 | 1992-11-26 | Mitsubishi Electric Corp | レーザ加工装置 |
JP3352934B2 (ja) * | 1998-01-21 | 2002-12-03 | 理化学研究所 | 高強度超短パルスレーザー加工方法およびその装置 |
JP4132172B2 (ja) * | 1998-02-06 | 2008-08-13 | 浜松ホトニクス株式会社 | パルスレーザ加工装置 |
-
2005
- 2005-07-15 JP JP2005207559A patent/JP4837320B2/ja not_active Expired - Lifetime
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10562130B1 (en) | 2018-12-29 | 2020-02-18 | Cree, Inc. | Laser-assisted method for parting crystalline material |
US10576585B1 (en) | 2018-12-29 | 2020-03-03 | Cree, Inc. | Laser-assisted method for parting crystalline material |
US11024501B2 (en) | 2018-12-29 | 2021-06-01 | Cree, Inc. | Carrier-assisted method for parting crystalline material along laser damage region |
US11219966B1 (en) | 2018-12-29 | 2022-01-11 | Wolfspeed, Inc. | Laser-assisted method for parting crystalline material |
US11826846B2 (en) | 2018-12-29 | 2023-11-28 | Wolfspeed, Inc. | Laser-assisted method for parting crystalline material |
US11901181B2 (en) | 2018-12-29 | 2024-02-13 | Wolfspeed, Inc. | Carrier-assisted method for parting crystalline material along laser damage region |
US11911842B2 (en) | 2018-12-29 | 2024-02-27 | Wolfspeed, Inc. | Laser-assisted method for parting crystalline material |
US10611052B1 (en) | 2019-05-17 | 2020-04-07 | Cree, Inc. | Silicon carbide wafers with relaxed positive bow and related methods |
US11034056B2 (en) | 2019-05-17 | 2021-06-15 | Cree, Inc. | Silicon carbide wafers with relaxed positive bow and related methods |
US11654596B2 (en) | 2019-05-17 | 2023-05-23 | Wolfspeed, Inc. | Silicon carbide wafers with relaxed positive bow and related methods |
Also Published As
Publication number | Publication date |
---|---|
JP2005313237A (ja) | 2005-11-10 |
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