JP4835258B2 - Electronic component packaging - Google Patents

Description

  The present invention relates to an electronic component stored in a bag-shaped container, and more specifically, a bag-shaped storage portion that stores an electronic component partitioned by a joint portion formed by overlapping and joining predetermined portions of the sheet-like material. Further, the present invention relates to an electronic component packaging series having a structure in which a plurality of them are continuously arranged.

As a storage form of chip-type electronic components,
(a) A method of forming storage holes at equal intervals in a resin or paper tape, storing chip-type electronic components in this, and then sealing with a cover tape;
(b) A storage form such as a system in which chip-type electronic components are collectively contained in a hollow case and sequentially taken out from the take-out port is known.

However, as the size of the chip-type electronic component is reduced, the above-described conventional storage configuration has problems as described below.
That is, in the case of the method (a), since the usable tape width is determined, the volume of the tape is larger than the volume of the chip-type electronic component, which not only wastes resources but also winds the tape. There is a problem that the number of members that must be discarded after use of the chip-type electronic component, such as a reel, is increased.
Furthermore, when the chip-type electronic component is stored, it is necessary to perform positioning and to align the directionality, so that the process becomes complicated and the production efficiency is poor.

  In the case of the method (b), the case can be used repeatedly and does not need to be discarded. However, due to the limitation of the assembly accuracy, the length is 0.4 mm, the width is 0.2 mm, and the height is 0. There is a problem that it is difficult to apply to a minute chip type electronic component such as 2 mm.

  In addition, as a packaging container that solves these problems of the prior art, a storage container that stores electronic components in a bag-like container has been proposed (see Patent Document 1). This storage container is a bag-shaped storage container that stores a large number of electronic components mounted using a mounting machine, and as shown in FIG. 9, a storage area 52 in which a large number of electronic components 51 are stored. And a lead portion 54 having a taper (guide angle) that is narrower than the storage region 52 and that becomes narrower as it approaches the terminal portion that becomes the discharge port 53.

  When the electronic component 51 is supplied to the electronic component insertion port (not shown) of the mounting machine, the discharge port 53 is opened (opened) along the perforation 56 from the cut portion 55, thereby storing the storage area. The electronic component is supplied from the electronic component input port of the mounting machine to the mounting machine through the lead portion 54 and the discharge port 53 from 52.

  That is, when the electronic container is taken out and supplied to the feeder, the storage container tears the bag-like container so that the cut end passes through the discharge opening 53, and the contents of the storage container are formed from the discharge opening 53 formed thereby. Since the product (electronic component) is configured to be supplied to the feeder, the orientation of the electronic component does not become a problem at the time of accommodation, and it can be applied to a small electronic component and is discarded. There is an advantage that the only member is a bag-like container.

  However, the packaging container of Patent Document 1 is usually used to store small electronic components, and the size of the bag-like container itself is small, so that it can be produced one by one or handled individually. Then, productivity and handleability are lowered.

  Therefore, in order to reduce the manufacturing cost and improve the handleability, it is desirable that the electronic component packaging series has a structure in which a plurality of storage regions for storing electronic components are continuously arranged.

  By the way, when it is set as the above electronic component packaging series, when taking out the electronic component which is a packaged object and using it, after separating the storage area (storage container) formed continuously, it is opened. It is necessary to use it. For this purpose, it is desirable to perform a separation processing for easily separating each packaging container and an opening processing for opening each individual packaging container.

  However, when the processing for separation to make it easy to separate each packaging container and the processing for opening to open individual packaging containers are performed by, for example, making perforations or providing notches When separating each packaging container, it is not always separated at the position where the processing for separation is performed, but is cut and opened at the position where the processing for opening is accidentally performed, There is a problem that parts may be scattered and reliability is low.

On the other hand, it is possible to use a jig such as a cutter or scissors for cutting or opening without using processing for separation or processing for opening. Each time it is necessary to use a jig, the productivity is low, and there is a possibility that an operator may be injured by the jig, which is not preferable.
JP 2000-43977 A

  The invention of the present application solves the above-described problems, and does not require a jig, does not open the storage part by mistake, can separate individual storage parts, and thereafter It is an object of the present invention to provide an electronic component packaging series capable of easily and surely opening the storage portion and taking out an electronic component as a packaged item.

In order to solve the above problems, the electronic component packaging series of the present invention (Claim 1) is:
A second joining portion for joining the predetermined portion of the sheet-like material into a cylindrical shape, and
By partitioning the sheet-like material formed in a cylindrical shape at a predetermined interval in the axial direction of the cylindrical portion, a plurality of bag-like storage portions for storing electronic components are continuously arranged. It is the 1st junction part for making it a structure, Comprising: It provided in the both ends of the said continuous direction of each accommodating part so that it might reach from the other end to the other end of the direction orthogonal to the said continuous direction of the said accommodating part An electronic component packaging series having a first joint portion ,
The said 2nd junction part is a junction part which joined the circumferential direction both ends of the sheet-like material made into a cylinder so that the inner peripheral surface side may mutually oppose, and the said sheet-like material formed in the cylinder shape In a state of projecting outward from a cylindrical portion composed of a portion other than the second joint portion, and being formed substantially parallel to the continuous direction, and a base end portion of each of the first joint portion and the storage portion. , Connected to a substantially central portion in a direction orthogonal to the continuous direction,
The first joint portion has an opening formed when the housing portion is cut in a direction substantially perpendicular to the continuous direction by a throttle portion forming portion projecting a part thereof toward the housing portion side. And having a diaphragm for making it smaller than the opening formed when the region is cut,
The first joint portion and the second joint portion are formed with a separation processing portion subjected to a separation preliminary process for facilitating separation of each bag-shaped storage portion, and an electronic device from the storage portion. An unsealing processing section is provided which has been subjected to an unsealing preprocessing for facilitating the unsealing of the storage section when taking out the parts,
The separation preliminary processing for forming the separation processing portion extends from one end side in the direction substantially orthogonal to the continuous direction to the other end side of each of the first joint portion and the second joint portion. Has been given,
The opening pre-processing for forming the opening processing portion is performed at a substantially central portion in a direction orthogonal to the continuous direction from one end portion of the first joint portion in a direction substantially orthogonal to the continuous direction. In the middle of the position from the base end of the second joint connected to the first joint to the end opposite to the base end up to a position beyond the position connected to the second joint From the position that is substantially perpendicular to the continuous direction of the first joint and beyond the position where it is connected to the second joint, the end opposite to the one of the ends A region extending from the base end of the second joint to the end opposite to the base end, and a region extending from the base end to the end opposite to the base end the opening with prefabricated is not subjected regions are left, the unsealing But the first junction and the second junction in the continuous direction is formed at a position corresponding to the position where the said when the housing portion has been opened by cutting openings are formed,
In the unsealing processing part, while leaving the region where the unsealing preliminary processing is not performed in the region from the one end side to the other end side of the first joining part and the second joining part, By separating and preliminarily cutting the entire area from the one end side to the other end side of the first joint portion and the second joint portion, before the opening processing portion is opened, the separation processing portion The storage units are configured to be separated from each other.

Moreover, the electronic component packaging chain of claim 2 is the configuration of the invention of claim 1 ,
The separation preliminary processing of the separation processing unit, and the opening preliminary processing of the opening processing unit,
(a) formation of a cut along the line to be cut off or the line to be opened;
(b) formation of a through hole along the line to be cut off or the line to be opened;
(c) It is characterized in that it is performed by at least one method of embossing that gives a predetermined embossing shape along the planned separation line or planned opening line.

Since the electronic component packaging series of the present invention (Claim 1) is configured as described above, it is possible to separate individual storage portions without opening a storage portion without needing a jig. It is possible, and after that, the individual storage portions can be easily and reliably opened to take out the electronic component .

In addition, the first joint portion formed so that the joint portion extends from one end to the other end in the direction orthogonal to the continuous direction of the storage portion, and the second joint formed so as to be substantially parallel to the continuous direction. Therefore , it is possible to efficiently manufacture an electronic component packaging series including a bag-shaped storage unit.

  In addition, since the opening is formed in the throttle portion when the storage portion is opened from the opening processing portion, the opening can be made smaller than the opening formed when the region of the storage portion is cut. Thus, it is possible to obtain an electronic component packaging series that can easily supply an electronic component that is a stored item to a feeder or the like.

Also, good urchin of packaging electronic components communicating according to claim 2, disconnect prefabricated cut away section, and the opening pre-processing of the unsealing portion, the formation of cuts (a), formation of (b) through-holes, (c ) Unsealing so that the force required to detach the separation processing portion is smaller than the force required to unseal the unsealing processing portion by performing at least one method of embossing to give a predetermined embossing shape Preliminary processing and separation preliminary processing can be reliably performed.

  In addition, the formation of the incision means that the sheet-like material is penetrated or not penetrated by inserting the tip of a thin, sharp blade-like jig along the planned separation line or planned opening line, for example. It is a concept that means forming a cut or the like to be formed, and may or may not penetrate the sheet-like material. By adjusting the shape of the cuts, or by making the formation pitch dense or rough, it is possible to control the force required for the separation of the separation processing unit and the opening of the opening processing unit.

  The formation of a through hole is a concept that means that a hole punched into a circle, an ellipse, a square, a rectangle, a triangle, or the like is formed along a planned separation line or a planned opening line. By adjusting the shape and size of the material, or by making the formation pitch dense or rough, it is possible to control the force required for separation of the separation processing unit and opening of the opening processing unit. The through hole can be easily formed by a known method such as laser processing or punching using a punch.

  Note that the present invention will be described by taking the process of perforating as an example, and it can be made difficult to open by increasing the formation pitch of the perforation, and can be easily opened by reducing the formation pitch of the perforation. In addition, it is necessary for the separation of the separation processing section and the opening of the opening processing section easily by adjusting the perforation specifications, for example, the perforation length, the perforation depth, and the perforation shape. The power can be controlled. Incidentally, the process of perforating is applicable to both the formation of the cut and the formation of the through hole, but it goes without saying that the process is included within the scope of the present invention in any case.

In addition, the embossing that gives a predetermined embossing shape is, for example, forming a V-shaped cross-section groove in a planned cutting or opening line by pressing, or cutting or opening a non-through hole. It is a concept that means to form continuously.
In the case of this embossing, by adjusting the shape and depth, it is possible to control the force necessary for separating the separation processing unit and opening the opening processing unit. The embossing can be performed simultaneously with the thermocompression bonding in the thermocompression bonding step.

  Furthermore, the sheet-like structure that forms the electronic component wrapping series by forming a notch or a notch that is a trigger for tearing at least one of the end portions of the notch and the through-hole formed along the planned line of separation or opening. The force required to tear the material can be reduced.

  The features of the present invention will be described in more detail below with reference to examples of the present invention.

FIG. 1A is a plan view showing an essential part of an electronic component packaging series according to an embodiment of the invention to which the present invention relates, FIG. 1B is a side view, FIG. 1C is a front view, and FIG. FIG. 3 is a diagram schematically showing a state in which the storage unit is opened by the opening processing unit after the individual storage units are separated.

  As shown in FIGS. 1 (a), (b), (c) and FIG. 2, the electronic component packaging series of the first embodiment is partitioned by a joining portion 10 in which predetermined portions of a sheet-like material 20 are overlapped and joined. A plurality of the bag-like storage portions 3 for storing the electronic components (objects to be packaged) 21 are continuously arranged.

  The joining portion 10 includes a separation processing portion 11 that has been subjected to separation preliminary processing for facilitating separation of the respective storage portions 3, and opening of the storage portion 3 when the electronic component 21 is taken out from the storage portion 3. The opening processing unit 12 that has been subjected to the opening preliminary processing for facilitating the opening is disposed, and the force required to separate the separation processing unit 11 is greater than the force required to open the opening processing unit 12 The opening preliminary processing and the separation preliminary processing are performed so as to be small.

More specifically, the electronic component wrapping string is connected to the boundary portion of a plurality of bag-shaped storage portions 3 continuous in a predetermined direction as the joint portion 10 (see FIG. 1 (a)). ), (C) (the direction indicated by the symbol A) in the direction orthogonal to the first joint 1 formed so as to extend from one end to the other end, and the second joint formed so as to be substantially parallel to the continuous direction. The joint part 2 is provided.
That is, the 1st junction part 1 is arrange | positioned at the both ends of the continuous direction of each accommodating part 3. As shown in FIG. The first joint 1 is provided with a separation processing unit 11. Further, the first joint portion 1 is formed so as to protrude toward the storage portion 3 side, and a throttle portion forming portion 1a for forming a throttle portion 5 described below (FIG. 1 (a), FIG. 2).

  Moreover, the 2nd junction part 2 is formed by joining the edge parts 20a of the direction orthogonal to a continuous direction of the sheet-like material 20 which comprises an electronic component packaging continuous, and the base end part 2a is the 1st. 1 connected to the substantially central portion of the joint portion 1 and the storage portion 3 in the direction orthogonal to the continuous direction, and other regions are configured not to be joined to the sheet-like material 20 constituting the electronic component packaging series. Yes.

  An opening processing portion 12 for opening the storage portion is disposed at a position adjacent to the throttle portion 5 described below in the second joint portion 2, and the storage portion 3 is removed from the opening processing portion 12. It is configured so that it can be opened.

  In the first embodiment, the first joint portion 1 and the second joint portion 2 are formed by thermocompression bonding the two sheet-like materials 20 that are overlapped, and the first joint portion 1 and the second joint portion 2 are formed. The joining part 2 has the same thickness.

  In addition, an opening formed when the storage portion 3 is cut in a direction substantially orthogonal to the continuous direction (the direction of the arrow A) at one end in the continuous direction of the storage portion 3 cuts another region. The aperture 5 is provided so as to be smaller than the opening formed in the case, and the aperture 6 is formed in the aperture 5 when the storage unit 3 is opened from the opening processing unit 12. (Figure 3). As described above, the narrowed portion 5 is formed by the narrowed portion forming portion 1a formed so that a part of the first joint portion 1 protrudes toward the storage portion side.

  In the first embodiment, as the preliminary separation processing of the separation processing unit 11 and the preliminary opening processing of the opening processing unit 12, the process of forming the perforations 11a and 12a is performed. The perforations (11a) are formed so that the installation pitch is dense. In the opening processing unit 12, the arrangement pitch becomes coarser than the arrangement pitch of the perforations (11a) of the separation processing unit 11. The perforation (12 a) is formed in the upper portion of the piercing portion, and the force required to detach the separation processing unit 11 is smaller than the force necessary to open the opening processing unit 12.

  In addition, the perforation is not limited to the method based on the formation pitch, and for example, by easily adjusting the perforation length, perforation depth, perforation shape, etc., the separation processing unit can be easily separated or opened. The force required for opening the processing unit can be controlled.

Next, a method for manufacturing the electronic component packaging series of Example 1 will be briefly described below with reference to FIGS. 1 and 2.
(1) First, a sheet-like material (resin sheet in this embodiment) 20 is formed into a cylindrical shape.
(2) Next, both ends of the resin sheet 20 are sandwiched by seal bars that are thermocompression bonding means along the longitudinal direction, and the end portion 20a of the resin sheet 20 is thermocompression bonded, thereby forming the second joint 2. .
(3) Then, the resin sheet 20 is sandwiched between seal bars (thermocompression bonding means) orthogonal to the longitudinal direction of the resin sheet 20, and one of the pair of first joining portions 1 is formed by thermocompression bonding. The order of the steps (2) and (3) is not limited, and the steps (2) and (3) may be performed simultaneously.
(4) Next, a predetermined amount of the electronic component 21 is supplied inside the bag-shaped storage unit 3 to store the electronic component 21 in the storage unit 3.
(5) After that, the resin sheet 20 is sandwiched between seal bars orthogonal to the longitudinal direction of the resin sheet 20 and sealed by thermocompression bonding, whereby the first joint 1 on the other side of the pair of first joints 1. And the electronic component 21 is sealed in the storage portion 3.
(6) Then, the separation processing unit 11 and the opening processing unit 12 are formed at predetermined positions of the first bonding unit 1 and the second bonding unit 2.

The separation processing unit 11 and the opening processing unit 12 may be formed at any timing as long as the thermocompression bonding process of the resin sheet 20 at the formation position of the separation processing unit 11 and the opening processing unit 12 is completed. .
Further, immediately after thermocompression bonding, the separation processing unit 11 and the opening processing unit 12 may be formed using the same thermocompression bonding mechanism, or may be formed using another mechanism.

  In the case of the electronic component wrapping series configured as described above, for example, only by applying a force so as to separate the adjacent storage portions 3 by holding them by hand so that the storage portions 3 are separated at the boundary portions. It is possible to separate the storage units 3 by the separation processing unit 11 without using a jig such as a cutter or a scissors. At this time, since the force required for separating the separation processing unit 11 is configured to be smaller than the force necessary for opening the opening processing unit 12, the storage unit 3 may be opened. Without any problem, the storage units 3 can be reliably separated by the separation processing unit 11.

  And after that, as shown in FIG. 3, the storage part 3 is opened from the opening process part 12, and the electronic component 21 which is a thing to be stored is made into the feeder etc. from the opening 6 restrict | squeezed by the aperture | diaphragm | squeeze part 5. It becomes possible to supply easily.

  In addition, in this Example 1, although it was made to perform the process which forms the perforations 11a and 12a as the separation preliminary processing of the separation processing unit 11 and the opening preliminary processing of the opening processing unit 12, it is not limited to the perforation, The force required to separate the separation processing unit 11 can also be increased by adopting a method such as formation of a through-hole along a planned separation line or a planned opening line, or a stamping process that gives a predetermined stamping shape. It is possible to perform preparatory processing that is separated from unsealing preliminary processing so as to be smaller than the force required to open the processing unit 12.

  In addition, the cutting is performed in various manners such that the sheet material is penetrated or not penetrated by inserting the tip of a thin, sharp blade-like jig along the scheduled separation line or planned opening line, for example. Can be formed.

  Further, the through hole can be formed by a method such as laser processing or punching with a punch. Examples of the shape of the through hole include various shapes such as a circle, an ellipse, a square, a rectangle, and a triangle. Necessary for separation of the separation processing part and opening of the opening treatment part by forming the through hole along the planned separation line or the planned opening line and making the formation pitch dense or rough. Power can be controlled.

Further, as the embossing, for example, by pressing, a groove having a V-shaped cross section is formed in a line to be cut or opened, or a non-through hole is continuously formed in a line to be cut or opened. Cases are exemplified. For example, by adjusting the depth of the embossing shape, the planar shape, and the like, it is possible to control the force necessary for separating the separation processing unit and opening the opening processing unit.
The embossing can be performed simultaneously with the thermocompression bonding in the thermocompression bonding process for joining the sheet-like materials.

  In addition, the example of the shape of the through-hole and notch | incision which form the isolation | separation process part 11 and the opening process part 12 is shown in FIG.4, FIG.5, FIG.6. 4, FIG. 5 and FIG. 6 are all plan views.

  As shown in FIG. 4 (a), when the through hole 31 having a rectangular planar shape is formed along a predetermined line such as a separation processing unit or an opening processing unit, FIGS. 4 (b), (c), (d ), (E), by extending a slit (cut) 32 from a part of the rectangular through-hole 31, it becomes possible to improve the ease of separation and ease of opening. A through-hole as shown in FIG. 4 (a) without 32 is formed in the opening processing section, and a slit 32 is formed in the separation processing section as shown in FIGS. 4 (b), (c), (d), (e). By forming the rectangular through hole 31 provided, it is possible to make the force required for separating the separation processing unit smaller than the force necessary for opening the opening processing unit.

  Further, as shown in FIG. 5 (a), in the case where the linear slit 33 is formed along a predetermined line such as a separation processing portion or an opening processing portion, FIGS. 5 (b), (c), (d) , (E), by forming the opening 34 at the end of the slit 33 so as to avoid stress concentration, the force required for separation and opening can be adjusted.

  In addition, as shown in FIG. 6A, when the linear slit 35 is formed along a planned line such as a separation processing portion or an opening processing portion, as shown in FIGS. 6B and 6C. By forming the slit 36 at the end of the slit 35 so as to be further branched into two, it is possible to adjust the force required for separation and opening.

  In addition, for example, a large number of micropores are formed in the opening processing part so that it can be opened from any position (however, the force required to open the separation processing part is larger than the force required to separate the separation processing part) It is also possible to require

In addition, by making the overlapping thickness of the sheet-like material in the separation processing part and the opening processing part different, by making the overlapping thickness of the sheet-like material in the separation processing part smaller than the overlapping thickness of the sheet-like material in the opening processing part, Even when the separation processing unit and the opening processing unit are separated and opened under the same conditions, the force required to separate the separation processing unit is smaller than the force required to open the opening processing unit. Opening preparatory processing and separation preparatory processing can be reliably performed.
Moreover, the magnitude | size of the force required for isolation | separation and opening can also be adjusted by controlling the hardness of an isolation | separation process part and an opening process part.

  FIG. 7A is a plan view showing the main part of the electronic component packaging series according to one embodiment of the present invention, FIG. 7B is a side view, and FIG. It is a figure which shows typically the state which opened the accommodating part.

As shown in FIGS. 7 (a), (b), and FIG. 8, the electronic component packaging series of Example 2 has the first joint portion 1 in the continuous direction of the storage portion 3 (arrow in FIG. 7 (a)) . A throttle portion forming portion 1a for forming the throttle portion 5 protrudes toward the storage portion 3 side at one end of the first joint portion 1 in the direction indicated by A). It is formed to do.

  Moreover, the 2nd junction part 2 is formed by joining the edge part of the direction orthogonal to the said continuous direction of the sheet-like material 20 which comprises an electronic component packaging series, and the base end part 2a is the 1st. It connects with the substantially center part of the direction orthogonal to the continuous direction of 1 junction part 1 and the accommodating part 3, and it is comprised so that other area | regions may not join with the sheet-like material which comprises an electronic component packaging series.

  In addition, a separation processing unit 11 for separating each storage unit 3 at the boundary portion is provided in the first bonding unit 1 and the second bonding unit 2, and the opening processing unit 12 is a squeezing of the first bonding unit. It is arrange | positioned in the position adjacent to the part 5, and after each storage part 3 is cut | disconnected by the boundary part in the separation | separation process part 11, by opening the storage part 3 from the opening process part 12, it is except throttle part 5 In this area, an opening smaller than the opening formed when the storage unit 3 is opened is formed.

  In addition, in the electronic component packaging series of Example 2, in consideration of the ease of opening at the time of the opening process, the opening processing unit 12 is not only the first bonding unit 1 but also a part of the second bonding unit 2. It is also formed on the (base end portion 2a).

  Then, the separation preliminary processing and the opening preliminary processing are performed so that the force required for separating the separation processing unit 11 is smaller than the force necessary for unsealing the opening processing unit 12. In the second embodiment as well, the separation preliminary processing and the opening preliminary processing are performed by a method of forming a perforation, and the separation processing unit 11 is more perforated than the opening processing unit 12. The installation pitch is made small.

Since other configurations are the same as those in the first embodiment, the description thereof is omitted here to avoid duplication.
7A, 7 </ b> B, and 8, the same reference numerals as those in FIGS. 1 to 3 indicate the same or corresponding parts.

  Also in the electronic component packaging series of Example 2, the cutters can be separated by simply applying a force so as to separate the adjacent storage units 3 by holding them by hand so that each storage unit 3 is separated at the boundary. Each storage unit 3 can be pulled apart by the separation processing unit 11 without the need for a jig such as a bag or a basket. At this time, since the force required for separating the separation processing unit 11 is configured to be smaller than the force necessary for unsealing the opening processing unit 12, it is ensured that the storage unit 3 is not opened. In the separation processing unit 11, the storage units 3 can be separated. Then, as shown in FIG. 8, by opening the storage unit 3 from the opening processing unit 12, the electronic component 21, which is an object to be stored, is transferred from the opening 6 squeezed by the throttle unit 5 to a feeder or the like. Can be supplied.

  In addition, the present invention is not limited to the above embodiment in other respects, but the type of electronic component to be stored, the specific shape of the storage portion, and the type of sheet-like material constituting the electronic component packaging series Various applications and modifications can be made within the scope of the invention with respect to the formation mode and arrangement position of the first bonding portion and the second bonding portion, the arrangement position of the separation processing portion and the opening processing portion, and the like. .

As described above, the electronic component packaging series of the present invention can be easily and surely separated without unnecessarily opening each storage section without requiring a jig, and thereafter individually. The packaging container can be easily and surely opened at the opening, and the electronic component as the package can be taken out.
Therefore, the present invention can be widely used in a field related to a small chip-type electronic component mounted using a feeder or the like or a packaging technology thereof.

(a) is a top view which shows the principal part of the electronic component packaging series concerning one Example (Example 1) with which this invention relates, (b) is a side view, (c) is a front view. It is a perspective view which shows the principal part of the electronic component packaging series concerning Example 1. FIG. It is a figure which shows typically the state which opened the accommodating part in the opening process part, after cut | disconnecting each accommodating part which comprises the electronic component packaging series concerning Example 1. FIG. (a), (b), (c), (d), (e) is a figure which shows the example of the shape of the through-hole which forms a cutting-off process part and an opening process part. (a), (b), (c), (d), (e) is a figure which shows the example of the shape of the notch which forms a cutting- off process part and an opening process part. (a), (b), (c) is a figure which shows the example of the shape of the notch which forms a cutting- off process part and an opening process part. (a) is a top view which shows the principal part of the electronic component packaging series concerning the Example (Example 2) of this invention , (b) is a side view. It is a figure which shows typically the state which opened the accommodating part in the opening process part, after cut | disconnecting each accommodating part which comprises the electronic component packaging series of Example 2 of this invention. It is a figure which shows the packaging container of the conventional electronic component.

DESCRIPTION OF SYMBOLS 1 1st junction part 1a Restriction part formation part 2 2nd junction part 2a Base end part 3 Storage part 5 Restriction part 6 Opening 10 Joint part 11 Detachment process part 11a Perforation 12 Unsealing process part 12a Perforation 20 Sheet-like material (resin Sheet)
20a End 21 Electronic component (packaged item)
31 Through hole 32 Slit (cut)
33 Slit 34 Opening 35 Linear slit 36 Slit A Continuous direction

Claims (2)

A second joining portion for joining the predetermined portion of the sheet-like material into a cylindrical shape, and
By partitioning the sheet-like material formed in a cylindrical shape at a predetermined interval in the axial direction of the cylindrical portion, a plurality of bag-like storage portions for storing electronic components are continuously arranged. It is the 1st junction part for making it a structure, Comprising: It provided in the both ends of the said continuous direction of each accommodating part so that it might reach from the other end to the other end of the direction orthogonal to the said continuous direction of the said accommodating part An electronic component packaging series having a first joint portion ,
The said 2nd junction part is a junction part which joined the circumferential direction both ends of the sheet-like material made into a cylinder so that the inner peripheral surface side may mutually oppose, and the said sheet-like material formed in the cylinder shape In a state of projecting outward from a cylindrical portion composed of a portion other than the second joint portion, and being formed substantially parallel to the continuous direction, and a base end portion of each of the first joint portion and the storage portion. , Connected to a substantially central portion in a direction orthogonal to the continuous direction,
The first joint portion has an opening formed when the housing portion is cut in a direction substantially perpendicular to the continuous direction by a throttle portion forming portion projecting a part thereof toward the housing portion side. And having a diaphragm for making it smaller than the opening formed when the region is cut,
The first joint portion and the second joint portion are formed with a separation processing portion subjected to a separation preliminary process for facilitating separation of each bag-shaped storage portion, and an electronic device from the storage portion. An unsealing processing section is provided which has been subjected to an unsealing preprocessing for facilitating the unsealing of the storage section when taking out the parts,
The separation preliminary processing for forming the separation processing portion extends from one end side in the direction substantially orthogonal to the continuous direction to the other end side of each of the first joint portion and the second joint portion. Has been given,
The opening pre-processing for forming the opening processing portion is performed at a substantially central portion in a direction orthogonal to the continuous direction from one end portion of the first joint portion in a direction substantially orthogonal to the continuous direction. In the middle of the position from the base end of the second joint connected to the first joint to the end opposite to the base end up to a position beyond the position connected to the second joint From the position that is substantially perpendicular to the continuous direction of the first joint and beyond the position where it is connected to the second joint, the end opposite to the one of the ends A region extending from the base end of the second joint to the end opposite to the base end, and a region extending from the base end to the end opposite to the base end The unopened pre-processed area remains and the opening process But the first junction and the second junction in the continuous direction is formed at a position corresponding to the position where the said when the housing portion has been opened by cutting openings are formed,
In the unsealing processing part, while leaving the region where the unsealing preliminary processing is not performed in the region from the one end side to the other end side of the first joining part and the second joining part, By separating and preliminarily cutting the entire area from the one end side to the other end side of the first joint portion and the second joint portion, before the opening processing portion is opened, the separation processing portion An electronic component packaging series, wherein each of the storage portions is configured to be separated . The separation preliminary processing of the separation processing unit, and the opening preliminary processing of the opening processing unit,
(a) formation of a cut along the line to be cut off or the line to be opened;
(b) formation of a through hole along the line to be cut off or the line to be opened;
The electronic component packaging series according to claim 1 , wherein the electronic component packaging is performed by at least one method of (c) embossing that gives a predetermined embossing shape along a planned separation line or a planned opening line.

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