JP4832137B2 - Thermoelectric conversion module - Google Patents

Description

  The present invention includes, for example, an LD (laser diode) light source for optical communication, a semiconductor manufacturing apparatus, a medical bio-related apparatus, a cooler in a board mounted with high density, a thermoelectric conversion module used for cooling an industrial laser, Seebeck, etc. The present invention relates to a thermoelectric conversion module that generates power using the effect.

  Thermoelectric conversion modules such as Peltier modules are used in various fields such as the optical communication field, and various configurations of thermoelectric conversion modules have been proposed. Peltier modules can be cooled and heated, and have significant advantages such as precise temperature control, high-speed cooling and heating, miniaturization, and the absence of chlorofluorocarbon.

FIG. 6 shows an example of the structure of a typical thermoelectric conversion module. The thermoelectric conversion module is a Peltier module, FIG. 5, as shown in FIG. 6, the element fitting hole 3 of the plurality insulating substrate having an element fitting hole 3 of the (insulating support plates) 30, the thermoelectric conversion element 5 (5a, 5b) is formed by penetrating and fitting (for example, see Patent Documents 1 and 2).

A thermoelectric conversion element 5 (5a, 5b) of a Peltier module as shown in FIG. 6 is generally known as a Peltier element, and a P-type thermoelectric conversion element 5a formed of a P-type semiconductor and an N-type semiconductor. And an N-type thermoelectric conversion element 5b. The P-type and N-type thermoelectric conversion elements 5 (5a, 5b) are made of a semiconductor single crystal such as bismuth tellurium having a length of about 0.5 to 3.0 mm, for example. For example, the P-type thermoelectric conversion element 5a is doped with antimony, and the N-type thermoelectric conversion element 5b is doped with selenium.

  The insulating substrate 30 is made of, for example, an electrically insulating plate having a thickness of about 0.2 to 1.0 mm, for example, a glass epoxy plate. Thermoelectric conversion elements are respectively provided on the upper and lower sides of the insulating substrate 30. 5 (5a, 5b) protrudes about 0.1 to 1.6 mm, for example, so that the P-type thermoelectric conversion element 5a and the N-type thermoelectric conversion element 5b penetrate the corresponding element fitting holes 3, respectively. They are fitted and arranged alternately.

  Electrodes 2 are respectively provided at one end side (upper side here) and the other end side (lower side here) of the P-type and N-type thermoelectric conversion elements 5 (5a, 5b) in the penetrating direction to the element fitting hole 3. These electrodes 2 are joined to thermoelectric conversion elements 5 (5a, 5b) via solder 4.

  The electrode 2 extends in the same direction as the end face of the corresponding P-type thermoelectric conversion element 5a and the end face of the N-type thermoelectric conversion element 5b, and spans between the end faces of the thermoelectric conversion elements 5 (5a, 5b). The P-type and N-type thermoelectric conversion elements 5 (5a, 5b) are connected in series, and the thermoelectric conversion elements 5 (5a, 5b) are connected by the thermoelectric conversion elements 5 (5a, 5b) and the electrode 2. ) Circuit (PN element pair).

  Metal leads formed by crimping terminals or the like on the electrode 2 (2a) arranged on the start end side of the circuit of the thermoelectric conversion element 5 (5a, 5b) and the electrode 2 (2b) arranged on the end side, respectively. One end side of the terminal 7 is connected by the solder 4, and the other end side of the lead terminal 7 is fixed to the insulating substrate 30. One end side of a lead wire 28 connecting the circuit of the thermoelectric conversion element 5 (5a, 5b) and an external power supply circuit or the like is fixed to the fixing portion by solder 10.

  In this thermoelectric conversion module, when a current is passed from the power supply circuit to the circuit of the thermoelectric conversion element 5 (5a, 5b) via the lead wire 28 and the lead terminal 7, the P-type thermoelectric conversion element 5a and the N-type thermoelectric conversion are performed. A current flows through the element 5b via the electrode 2, and a cooling / heating effect is produced at the junction (interface) between the thermoelectric conversion element 5 (5a, 5b) and the electrode 2. That is, a so-called Peltier effect is generated in which one end portion of the thermoelectric conversion element 5 (5a, 5b) is heated while the other end portion is cooled depending on the direction of the current flowing through the junction.

  When one end, for example, the upper end, of the thermoelectric conversion element 5 (5a, 5b) is caused to generate heat by the Peltier effect, this heat is transmitted to a member provided on the upper side of the Peltier module, and this member is heated. Is called. On the contrary, when the upper end portion of the thermoelectric conversion element 5 (5a, 5b) is cooled by the Peltier effect, the member provided on the upper side of the Peltier module is cooled (heat absorption).

Further, as another example of the Peltier module, as shown in FIG. 7 , a plurality of electrodes 2 are arranged on the opposing surfaces of two insulating substrates 16 and 17 that are opposed to each other with a gap therebetween. One end side and the other end side of the plurality of thermoelectric conversion elements 5 (5a, 5b) which are formed or fixed and are arranged upright between the insulating substrates 16 and 17 are respectively soldered to the corresponding electrodes 2. There is a fixed type module. Also in this type of Peltier module, the same heating and cooling operations as those of the type of Peltier module shown in FIG. 6 are performed.

JP-A-9-181362 JP-A-10-178216

Incidentally, as shown in FIG. 7 , the electrode / substrate fixing type Peltier module in which the insulating substrates 16 and 17, the electrode 2, and the thermoelectric conversion element 5 (5 a, 5 b) are fixed increases the module size. As a result, there has been a problem that the reliability is remarkably lowered.

  This is because when the Peltier module increases the temperature of the one end surface of the thermoelectric conversion element 5 (5a, 5b) and decreases the temperature of the other end surface by the Peltier effect, the thermoelectric conversion element 5 (5a, 5b). Since the thermal expansion and contraction of the electrode 2 and the electrode 2 occur, if the insulating substrates 16 and 17, the electrode 2, and the thermoelectric conversion element 5 (5 a, 5 b) are fixed, the thermoelectric conversion element 5 (5 a, 5 b) and the electrode This is because the connection portion with 2 cannot absorb the thermal strain and sometimes causes a connection failure.

On the other hand, in the Peltier module called the so-called skeleton type as shown in FIG. 6 , since the electrodes 2 are independent from each other, the connection part between the thermoelectric conversion elements 5 (5 a, 5 b) and the electrode 2. The thermal strain is dispersed and the connection portion is extremely less subject to thermal stress. Therefore, as shown in FIG. 7, compared to the electrode-substrate fixed type Peltier module, the type of the Peltier module as illustrated in Figure 6, there is a merit that much can ensure long-term reliability.

In addition, the inventor conducted a durability test against thermal strain as shown below in a skeleton type Peltier module, and investigated the durability of the conventional Peltier module at the use temperature. The durability test is conducted using an experimental system as shown in the sectional view of FIG. 3 (a), in the figure, the Peltier module are denoted by the reference numeral 1.

As shown in the figure, in the durability test, the Peltier module 1 is sandwiched between a heat sink 20 and an aluminum block 21 via a heat conductive sheet (not shown), and a thermistor 19 is provided in the aluminum block 21 to form aluminum. measuring the temperature of the block 21, by reversing the current applied to the lead wire 28 alternately, the temperature of the temperature measuring points of the aluminum block 21, 25 ° C. ~ in a cycle of temperature change as shown in FIG. 3 (b) The aluminum block 21 is repeatedly heated and cooled by the Peltier module 1 so that the temperature becomes 80 ° C. The temperature rise is performed by applying a negative DC current to the Peltier module 1 and the temperature decrease by applying a positive DC current to the Peltier module.

The obtained experimentally, show data indicating typical durability against thermal cycle of the Peltier module 1 in Figure 4 (a). In this figure, the horizontal axis represents the number of cycles, and the vertical axis represents the conductor resistance of the Peltier module 1 (the conductor resistance of the circuit of the thermoelectric conversion elements 5 (5a, 5b)). It was confirmed that the conductor resistance was stable even when the number of thermal cycles increased, and that it had long-term durability against thermal cycles. When there is a problem in durability, the conductor resistance increases, and eventually the circuit of the thermoelectric conversion element 5 (5a, 5b) is broken.

  However, in recent years, more severe conditions in the temperature range are required in the semiconductor field and the like. For example, in a handler apparatus for inspecting a semiconductor chip, a temperature range of about −40 to + 120 ° C. is required. .

Therefore, the inventor conducted a more severe thermal cycle test on the Peltier module 1 against thermal distortion. This experiment using the experimental system shown in FIG. 3 (a), so that the temperature of the temperature measuring points of the aluminum block 21, becomes -40 ℃ ~ + 120 ℃ in the same cycle as that shown in FIG. 3 (b) In addition, the aluminum block 21 is repeatedly heated and cooled by the Peltier module 1.

The results are shown in Figure 4 (b). As a result of this test, the conductor resistance of the circuit of the thermoelectric conversion element 5 (5a, 5b) increased from about 6200 cycles, and the circuit of the thermoelectric conversion element 5 (5a, 5b) was broken in about 6700 cycles.

  And when the fracture | rupture location was investigated, a fracture location is the connection of the electrodes 2a and 2b connected to the lead terminal 7, and the thermoelectric conversion element 5 (5a and 5b) connected to the electrodes 2a and 2b with the solder 4. Was part. This is because the metal lead terminal 7 repeatedly expands and contracts in accordance with the thermal cycle, and the distortion causes excessive stress to be applied to the connection portion between the electrodes 2a and 2b and the thermoelectric conversion element 5 via the electrodes 2a and 2b. It has been broken.

  That is, in this type of Peltier module 1, the electrodes 2 are only fixed to the thermoelectric conversion elements 5 only by soldering, and the start side and the end side of the circuit of the thermoelectric conversion elements 5 (5a, 5b). Since the electrodes 2a and 2b are soldered directly to the lead terminals 7 which are poor in flexibility and have a high rate of thermal expansion and contraction, the thermal expansion of the thermoelectric conversion elements 5 (5a and 5b) and the insulating substrate 30 is performed. Due to the difference between the shrinkage ratio and the thermal expansion / shrinkage ratio of the lead terminal 7, the electrodes 2a, 2b connected to the lead terminal 7 and the thermoelectric conversion element 5 (connected to the electrodes 2a, 2b) It is considered that a large stress is applied to the connection portion with 5a, 5b), and disconnection is likely to occur at this connection portion.

  Further, in the skeleton type Peltier module, for example, when mechanical stress is applied to the lead terminal 7 when the Peltier module is carried or attached, the electrodes 2a and 2b connected to the lead terminal 7 and the electrode 2a , 2b, a large stress may be applied to the connection portion with the thermoelectric conversion element 5 (5a, 5b). Therefore, in order to increase the reliability of the Peltier module, the present inventor It was considered that a structure strong against the applied mechanical stress and the above-described thermal fluctuation was necessary.

  The present invention has been made to solve the above-described problems, and its purpose is to apply some mechanical stress to the lead terminals even when a wide range of temperature changes, for example, −40 ° C. to + 120 ° C. occurs. In other words, it is possible to prevent the connection portion between the electrode connected to the lead terminal and the thermoelectric conversion element connected to the electrode from being broken, and to provide a thermoelectric conversion module with high long-term reliability. .

In order to achieve the above object, the present invention has the following configuration as means for solving the problems. That is, the first invention has an insulating substrate in which a plurality of element fitting holes are formed, and P-type and N-type thermoelectric conversion elements are respectively fitted through the corresponding element fitting holes of the insulating substrate. One end side and the other end side in the penetrating direction protrude from the insulating substrate , respectively, and one end side and the other end side in the penetrating direction to the element fitting hole of the thermoelectric conversion element respectively correspond to the corresponding P type A plurality of electrodes are formed between the end face of the thermoelectric conversion element and the end face of the N-type thermoelectric conversion element to connect the P-type and N-type thermoelectric conversion elements in series. The circuit of the thermoelectric conversion element is formed by the P-type thermoelectric conversion element and the N-type thermoelectric conversion element, and the electrodes of the thermoelectric conversion elements arranged on the start end side and the end end side of the circuit of the thermoelectric conversion element are the electrodes. The end face of the thermoelectric conversion element is connected and fixed to one end side of the face. The other end of the pole surface is connected to one end of the lead terminals each constituting the external lead wire to the other end of the other end of said lead terminal is fixed to the insulating substrate said lead terminals are connected The lead terminal penetrating hole through which the lead terminal penetrates with a gap is formed in a portion of the insulating substrate that is in the middle from the one end side to the other end side of the lead terminal. The lead terminal extends from one end side of the connection position with the electrode surface to which the end face of the thermoelectric conversion element is connected and fixed toward the insulating substrate and penetrates the lead terminal penetration hole in an unfixed state. Then, after protruding and extending from the insulating substrate, the other end side that is turned to the insulating substrate through at least one of the bent portion and the bent portion and becomes the folded end portion is fixed to the insulating substrate. , Of the lead terminal, Section extending from the end side to the other end of the lead terminal is folded over at least one of the flexures as the bent portion of the holes for through-lead terminal, expansion and contraction of the thermoelectric conversion element due to thermal fluctuations in the thermoelectric conversion module The lead terminal itself is deformed according to the displacement and the expansion / contraction displacement of the insulating substrate, and further according to the load when mechanical stress is applied to the lead terminal, so that the lead terminal is connected to the lead terminal. A configuration in which a stress relaxation configuration is formed to relieve stress generated at a connection portion between the electrode and the thermoelectric conversion element connected to the electrode is a means for solving the problem.

  The present invention provides a P-type and an N-type on one end side and the other end side in the penetrating direction to the element fitting hole of the thermoelectric conversion element respectively fitted and fitted to the corresponding element fitting hole of the insulating substrate. A plurality of electrodes for connecting the thermoelectric conversion elements in series are formed, and a circuit of the thermoelectric conversion element is formed by these electrodes, the P-type thermoelectric conversion element, and the N-type thermoelectric conversion element. The lead terminal connected to the electrode arranged on the start side and the electrode arranged on the end side of the circuit of the conversion element respectively includes an electrode connected to the lead terminal and the thermoelectric conversion element connected to the electrode A stress relaxation structure is formed to relieve stress generated in the connection portion.

  This stress relaxation configuration is applied to the load when mechanical stress is applied to the lead terminal according to the expansion / contraction displacement of the thermoelectric conversion element and the insulating substrate accompanying the thermal fluctuation of the thermoelectric conversion module applied to the lead terminal. Accordingly, the lead terminal itself is deformed to relieve stress generated in the connection portion between the electrode connected to the lead terminal and the thermoelectric conversion element connected to the electrode, and is connected to the lead terminal. The stress generated in the connection portion between the electrode and the thermoelectric conversion element connected to the electrode is relieved.

  By providing this stress relaxation configuration, the thermoelectric conversion module according to the present invention is capable of expanding and contracting the thermoelectric conversion element and the insulating substrate accompanying the temperature change and the insulating substrate in the lead terminal even if a wide range of temperature changes occur. The difference in displacement in the height direction and length direction between the fixed part and the electrode connection part can be reduced, and even if mechanical stress is applied to the lead terminal, the lead terminal itself is deformed at that time. The stress generated in the connection portion between the electrode connected to the lead terminal and the thermoelectric conversion element connected to the electrode can be relaxed accurately, and the connection portion can be prevented from breaking.

  In other words, in a conventional thermoelectric conversion module, when a large temperature change occurs in the thermoelectric conversion module, it is caused by a difference in the rate of thermal expansion and contraction of the thermoelectric conversion element and the insulating substrate and the rate of thermal expansion and contraction of the lead terminal. When a large stress is applied to the connection portion between the electrode connected to the lead terminal and the thermoelectric conversion element connected to the electrode, and when mechanical stress is applied to the lead terminal, It is considered that a large stress was applied to the connection portion between the connected electrode and the thermoelectric conversion element connected to the electrode, and the connection portion was easily broken.

  On the other hand, in the thermoelectric conversion module of the present invention, as the lead terminal itself is deformed, as described above, a large stress is applied to the connection portion between the electrode connected to the lead terminal and the thermoelectric conversion element connected to the electrode. Therefore, it is possible to suppress breakage of the circuit of the thermoelectric conversion element due to temperature fluctuation, and to realize a thermoelectric conversion module with high long-term reliability.

Also, the stress relaxation structure, since the bending portion in the longitudinal direction of the lead terminal and at least one of formed by forming one or more configuration of the bent portion, the lead terminal expands and contracts by heat, accordingly, deflection lead terminal The stress relieving effect can be obtained by deforming at the bent portion or the bent portion.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the description of the present embodiment, the same reference numerals are assigned to the same names as those in the conventional example, and the duplicate description is omitted or simplified.

FIG. 1 is a schematic sectional view showing a first embodiment of a thermoelectric conversion module according to the present invention. The thermoelectric conversion module of the embodiment is a Peltier module, the present embodiment also, similarly to the Peltier module skeleton type as shown in FIG. 6, a plurality of elements fitting hole 3 through a distance from each other forming The insulating substrate 30 is made of glass epoxy having a thickness of 6 mm.

  Also in the present embodiment example, similarly to the conventional example, the corresponding thermoelectric conversion elements 5 (5a, 5b) are fitted and fixed to the respective element fitting holes 3, and each thermoelectric conversion element 5 ( 5a, 5b) is a square shape with a cross section in the substrate surface direction of 2 mm × 2 mm, and its height is 2.3 mm.

  The characteristic feature of the present embodiment is that the lead terminal 7 is further mechanically moved according to the expansion / contraction displacement of the thermoelectric conversion element 5 (5a, 5b) and the expansion / contraction displacement of the insulating substrate 30 due to the thermal fluctuation of the Peltier module 1. The lead terminal 7 itself is deformed in accordance with the load to which the mechanical stress is applied, and the electrodes 2a and 2b connected to the lead terminal 7 and the thermoelectric conversion elements 5 (5a and 5b) connected to the electrodes 2a and 2b That is, the stress relaxation structure 8 is formed on the lead terminal 7 to relieve the stress generated in the connection portion.

  In this embodiment, the lead terminal 7 is made of brass, and the stress relaxation structure 8 includes a plurality of (here, two) bent portions (folded back) formed at intervals in the longitudinal direction of each lead terminal 7. Part) 9. The lead terminal 7 has a plate shape with a width of 4 mm and a thickness of 0.3 mm, and the folding height by the bent portion 9 (the length in the height direction of the thermoelectric conversion element 5) is 2 mm.

  Each of the two lead terminals 7 has a structure in which the stress relaxation structure 8 is provided in the longitudinal direction, and one end side thereof is connected to the electrodes 2a and 2b disposed below the insulating substrate 30, respectively. After the stress relaxation structure 8 including the two bent portions 9 protrudes to the upper side of the insulating substrate 30 through the element fitting hole 3, the other end side is fixed to the lower side of the insulating substrate 30 via the solder 10, and the lead wire 28. Connected with. The lead terminal 7 is inserted in the element fitting hole 3 without being fixed.

This embodiment is constructed as described above, the present embodiment also as in the conventional thermoelectric conversion module shown in FIG. 6, performs the heating and cooling operation, in the present embodiment, the lead terminal 7 is formed with a stress relaxation structure 8 having two bent portions 9. When the lead terminal 7 expands due to heat, the lead terminal 7 is bent, for example, as shown in FIG. When the lead terminal 7 is deformed at 9 and contracts due to heat, the lead terminal 7 is deformed at the bent portion 9 as shown in FIG.

  Thus, the present embodiment can absorb the difference between the displacement amount of the thermoelectric conversion element 5 (5a, 5b) and the insulating substrate 30 and the displacement amount of the lead terminal 7, and is specially applied to the solder 4 and the solder 10 at the junction point. The lead terminal 7 is always made to have a height H substantially equal to the height of the thermoelectric conversion element 5 (5a, 5b) protruding downward from the insulating substrate 30. The length L between the connection portion of the electrodes 2a and 2b and the fixed portion of the insulating substrate 30 can always be set to a value substantially equal to the length of the insulating substrate 30 therebetween.

  That is, in this embodiment, the lead terminal 7 is deformed at the bent portion 9 in accordance with the expansion / contraction displacement of the thermoelectric conversion element 5 (5a, 5b) and the insulating substrate 30 due to the thermal fluctuation of the Peltier module, so that the lead Since the distance between the fixed portion of the insulating substrate 30 and the electrode connecting portion in the terminal 7 and the distance in the length direction can be displaced, the electrodes 2a, 2b connected to the lead terminal 7 and the electrodes 2a, 2a, The stress generated in the connection portion with the thermoelectric conversion element 5 (5a, 5b) connected to 2b can be relaxed, and the connection portion can be prevented from breaking.

  Further, when a mechanical stress is applied to the lead terminal 7 in the vertical direction, for example, when carrying the Peltier module, the bent portion 9 is bent, and the displacement amount of the lead terminal 7 in the height direction of the thermoelectric conversion element is reduced. The height H of the lead terminal 7 can always be a value close to the height of the thermoelectric conversion element 5 (5a, 5b) protruding downward from the insulating substrate 30.

  Further, for example, when the Peltier module is incorporated in a device or the like, when the lead wire 28 is pulled and mechanical stress is applied in the longitudinal direction of the lead terminal 7, the bent portion 9 is bent and is generated in the solder 4 and the solder 10. To relieve stress.

  Therefore, the thermoelectric conversion module of the present embodiment can suppress breakage of the circuit of the thermoelectric conversion element 5 (5a, 5b) due to thermal fluctuation, and is resistant to applying some mechanical stress, and has high long-term reliability. A conversion module can be realized.

In addition, this invention is not limited to the said embodiment example, Various aspects can be taken. For example, in the first implementation embodiment has formed the respective lead terminals 7 to the two bent portions 9, formed the number of the bent portion 9 is intended to be appropriately set not particularly limited, for example, Only one bent portion 9 may be formed, or three or more bent portions 9 may be formed. Further, instead of the bent portion 9, one or more bent portions may be formed in the longitudinal direction of the lead terminal 7 with a space therebetween, or one or more of the bent portion 9 and the bent portion may be formed. .

  Further, in each of the above embodiments, the planar shape of the insulating substrate 30 is formed in a rectangular shape. However, the shape of the insulating substrate 30 is not particularly limited and is appropriately set. The shape may be a substantially circular shape. Further, the material for forming the insulating substrate 30 is not particularly limited, and is appropriately set.

  Furthermore, in the above embodiment, the thermoelectric conversion element 5 (5a, 5b) is an element having a rectangular cross-sectional shape, but the shape of the thermoelectric conversion element 5 (5a, 5b) is not particularly limited, and may be appropriately selected. For example, the cross-sectional shape may be an element having a circular shape, or an element having another shape, and the formation material thereof may be appropriately set, for example, a silicon-based material. is there.

  Furthermore, although the above description has been given by taking an example of the structure of the Peltier module as the thermoelectric conversion module, the structure of the thermoelectric conversion module of the present invention is also applicable to the structure of a thermoelectric conversion module that generates power using the Seebeck effect. it can.

It is explanatory drawing which shows typically the 1st Example of the thermoelectric conversion module which concerns on this invention. It is explanatory drawing which shows the deformation | transformation operation | movement of the lead terminal accompanying the thermal fluctuation of the thermoelectric conversion module of the said embodiment example, exaggeratingly showing the deformation amount greatly. It is explanatory drawing (a) which shows the experimental system of the endurance test by the temperature fluctuation of a Peltier module, and the graph (b) which shows the temperature change changed with this experimental system. It is a graph which shows the example of a result of the endurance test by the temperature fluctuation of a Peltier module. It is explanatory drawing which shows the plane structural example of the insulating board | substrate applied to a thermoelectric conversion module. It is explanatory drawing which shows an example of the conventional skeleton type | mold Peltier module with a side view. It is explanatory drawing which shows the other example of the conventional Peltier module with a side view.

Explanation of symbols

2 Electrode 3 Element fitting hole 5, 5a, 5b Thermoelectric conversion element 6 Notch part 7 Lead terminal 8 Stress relaxation structure 9 Bending part 28 Lead wire 30 Insulating substrate

Claims (1)

An insulating substrate having a plurality of element fitting holes is formed, and P-type and N-type thermoelectric conversion elements are respectively fitted through the corresponding element fitting holes of the insulating substrate, and one end side in the penetrating direction is provided. The other end side protrudes from the insulating substrate, and the end face of the P-type thermoelectric conversion element corresponding to the one end side and the other end side in the penetration direction to the element fitting hole of the thermoelectric conversion element respectively A plurality of electrodes are formed between the end faces of the N-type thermoelectric conversion elements so as to connect the P-type and N-type thermoelectric conversion elements in series. These electrodes, the P-type thermoelectric conversion element, and the N-type thermoelectric conversion element The thermoelectric conversion element circuit is formed by the thermoelectric conversion element of the type, and the electrodes of the thermoelectric conversion elements arranged on the start end side and the end end side of the circuit of the thermoelectric conversion element are on one end side of the electrode surface. it the end of the other end face is connected fixed in the electrode surface of the One end is connected the other end of the lead terminals of the lead terminals are forms a structure in which an external lead wire to the other end of the lead terminals are fixed to the insulating substrate is connected, the lead terminals A hole for penetrating the lead terminal through which the lead terminal penetrates with a gap is formed in a portion of the insulating substrate that is in the middle from one end side to the other end side, and the lead terminal is the thermoelectric conversion element The end surface of the lead wire extends from one end side of the connection position with the electrode surface to which the connection is fixed to the insulating substrate, extends through the lead terminal penetration hole in an unfixed state, and protrudes from the insulating substrate. After that, the other end side which is folded back toward the insulating substrate through at least one of the bent portion and the bent portion and becomes an end portion of the folded portion is fixed to the insulating substrate, and from the one end side of the lead terminal Lead terminal penetration The hole of the flexures as the bent portion section leading to the other end of the lead terminal is folded over at least one is of the thermoelectric conversion element due to thermal fluctuations in the thermoelectric conversion module expansion displacement and the insulating substrate The lead terminal itself is deformed according to the expansion / contraction displacement and further according to the load when mechanical stress is applied to the lead terminal, so that the electrode connected to the lead terminal is connected to the electrode. A thermoelectric conversion module characterized in that a stress relaxation structure is formed to relieve stress generated at a connection portion with the thermoelectric conversion element.

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