JP4827439B2 - Inkjet recording head substrate and inkjet recording head using the substrate - Google Patents

Description

  The present invention relates to an ink jet recording head substrate and an ink jet recording head using the substrate.

  As the ink jet recording head used in the ink jet recording apparatus, one that forms and discharges ink droplets by various methods is known. Among them, as an energy for forming droplets used for ejecting ink, an ink jet recording head that uses heat can easily realize high-density multi-nozzles with high resolution and high image quality. In addition, high-speed recording is possible.

  This method uses thermal energy generated by providing a recording element in each ink path in the vicinity of each ink discharge port in the ink jet recording head and selectively applying electric energy or power corresponding to the recording signal to these. Thus, the ink on the heat acting surface is rapidly heated to cause film boiling, and the ink can be discharged from the ink discharge port by the pressure of bubbles generated at that time.

  As one of the methods for ejecting ink using this thermal energy, ink droplets are ejected vertically upward with respect to the surface of the substrate on which heating resistors that generate thermal energy (hereinafter also simply referred to as heaters) are arranged. A so-called side shooter type ink jet recording head is known.

  Incidentally, the electrical energy or power input to the heater for ink ejection is one of the important factors that influence the ink ejection state. That is, if the electric energy input changes, the foaming phenomenon changes accordingly, and good ejection may not be performed.

  For example, when the drive energy input is small, the ink film boiling phenomenon tends to become unstable due to insufficient energy, and preferable film boiling does not occur, so that the ink droplet discharge speed, discharge direction, and discharge amount In some cases, the image quality of the recorded image is deteriorated.

  On the other hand, when the driving energy input is high, excessive heat energy causes mechanical stress to the heating resistor or changes in the film quality, which also cause the above-mentioned ejection failure. If it happens, it may damage the recording head.

  For this reason, it is desirable that the energy input to each heater is always substantially uniform.

  On the other hand, it is known that the number of heaters that are simultaneously driven by one recording head is a variation factor of energy input to each heater. That is, if the number of heaters that are driven simultaneously changes according to the recording data or the like, the resulting voltage drop differs, and as a result, the drive energy of each heater changes.

  Patent Document 1 has been proposed to solve the above problems.

  Examples thereof are shown in FIGS. In this configuration, the wiring between the heater 802 and the electrode pad arranged on the substrate of Si or the like and between the driving element and the electrode pad is divided into a plurality of pieces, and each common electrode wiring 902a, 902b, 904a is divided. , 904b have substantially the same wiring resistance value.

  According to this configuration, it is possible to reduce the difference in voltage drop between when all the heaters are driven and the one heater is driven with respect to the common wiring for each unit. Furthermore, the heaters connected to each common wiring are simultaneously driven to one heater, thereby eliminating the voltage drop difference between driving all heaters and driving one heater. Thus, a constant driving energy can be always supplied to each heater.

  However, in this configuration, among the voltage drops that occur when the heaters are driven, the voltage due to the difference in the length of the common wiring for each heater varies depending on the position of the heater, particularly when all the heaters are collectively connected. It is premised on reducing the descent. For this reason, in the configuration of Patent Document 1, the width of the common wiring is increased as much as possible to reduce the wiring resistance, and then the length of the wiring to each unit as in the width A and B of the common wiring shown in FIG. By varying the width of the wiring according to the thickness, the wiring resistance between the electrode wirings is made equal.

  Recently, the number of colors in one liquid jet recording head has been increasing, and products that eject recording liquids of six colors such as yellow, magenta, cyan, black, light cyan, and light magenta have been commercialized.

  As the number of heaters used in the liquid jet recording head increases as the number of recording heads increases, the number of wires used to supply electrical energy or power to the heater also increases. In order to always supply constant driving energy to each heater, wiring other than the wiring between the heater and the electrode pad and between the driving element and the electrode pad, that is, the wiring resistance on the flexible wiring board is also used. It is desirable to make it uniform.

  In Patent Document 2 and Patent Document 3, proposals relating to a type in which recording liquids of a plurality of colors are respectively ejected by a plurality of recording element substrates respectively mounted on one wiring substrate are made.

  FIG. 14 shows a proposal in Patent Document 3. Since the wiring becomes longer toward the outer periphery of the flexible wiring board, the wiring resistance is made equal by widening the wiring pattern width.

Japanese Patent Laid-Open No. 10-44416 JP 2002-331667 A JP 2003-72042 A

  The problem to be solved is that the number of wires on the flexible wiring board increases as the inkjet recording head becomes smaller and multi-colored, and the wiring resistance increases when the wiring is routed in a limited plane. It is a point to accompany. In addition, there is a limit in the conventional method of changing the pattern width of the wiring on the flexible wiring board, and it cannot cope with the increase in the number of wirings in a small space, and as a result, the power supplied between the recording elements is greatly different. It is.

  For example, in the case of flexible wiring as shown in FIG. 14, when wiring with higher density is performed, the width of each wiring must be reduced, resulting in an increase in wiring resistance. In particular, the influence is large in the wiring region through which the wiring group (group A) from the upper side of the device hole 1401 in the drawing passes, and becomes larger than the wiring resistance of the wiring group (group B) from the lower side of the device hole 1401 in the drawing.

  As a result, the recording element (upper half recording element 802 in FIG. 13) supplied with power from the A group wiring and the recording element (lower recording in FIG. 13) supplied with power from the B group wiring. The voltage actually applied differs between the elements 802), and as a result, the power supplied to each recording element differs.

  Further, from the viewpoint of migration resistance, the distance between the VH wiring having a high potential, the ground wiring, and other wiring whose potential can be equivalent to the ground wiring is as wide as possible. For example, about 100 μm is preferable. Further, restrictions on the wiring are added, and it is difficult to make the wiring resistance uniform between the wirings.

  The above problem will be described with a specific example with reference to FIG. Here, the recording element substrate 1100 has a width of 14 mm × a length of 15 mm, and has 60 electrode pads in total of 60 in the upper and lower directions in the figure. It is assumed that a total of 48 are provided for each of the 24 units, and a total of 24 units for supplying the VH power supply are 12 units each. The flexible wiring board 1400 has a wiring pattern patterned with a copper foil having a thickness of 0.035 mm, has a device hole 1401 having a width of 17 mm × a length of 16 mm, and the outer shape has a width of 27 mm at the upper part in the figure and a lower part in the figure. The external input signal terminal 1403 is provided at the lower part of the figure.

  From the upper side of the device hole 1401 in the drawing, a total of 60 wires are routed to 30 each on the left and right, and the width of the wiring area on the left and right of the device hole 1401 is about 3.3 mm, respectively. The wiring length to the position of the lower side in the figure is about 36 mm at the outer periphery and about 18 mm at the inner periphery.

  In each of the left and right sides, each wiring width is 12 power supply wirings (VH wiring or GND wiring) to the common electrode wiring. .035 mm, the one located at the outermost periphery is 0.07 mm in most parts on the wiring, and the one located between them is a larger value as the one located on the outer periphery in the range of 0.035 mm to 0.07 mm. . In the other 18 wires, the most width on the wire is suppressed to 0.035 mm, which is the minimum width in the manufacturing method. Further, the wiring interval is 0.1 mm on both sides of the six VH wirings among the power supply wirings, and the spacing between the other wirings is 0.05 mm which is the minimum in the manufacturing method.

  From the position of the lower side of the device hole 1401 in the figure to the external input signal terminal 1403, all the power supply wirings are approximately 0.07 mm in width and approximately 17 mm in length. As a result, the wiring resistance of the power supply wiring from the upper side of the device hole 1401 in the drawing is almost the same and is about 0.37Ω. Of the power supply wirings, two for the VH wiring and the ground wiring are used to supply power to the recording elements on the recording element substrate 1100. Therefore, the wiring resistance of the flexible wiring board on the power supply circuit is as described above. This is twice the wiring resistance value of the power supply wiring, which is about 0.74Ω.

  On the other hand, the power supply wiring from the lower side of the device hole 1401 in the drawing reduces the wiring resistance difference from the power supply wiring from the upper side of the device hole 1401, so the width of the wiring is almost the same in the manufacturing method. The minimum width is 0.035 mm. With this minimum width, the wiring resistance of the power supply wiring from the lower side of the device hole 1401 in the drawing is about 0.24Ω, and the wiring resistance of the flexible wiring board on the power supply circuit is The double value is about 0.48Ω, but it is still only about 2/3 of the wiring resistance value of the power supply wiring from the upper side of the device hole 1401.

  As described above, the power supplied to the recording element is different due to the difference between the wiring resistance value on the power supply circuit from the upper side of the device hole 1401 and the wiring resistance value on the power supply circuit from the lower side. As a result, good ink ejection cannot be obtained at all of the ejection ports.

  Accordingly, the present invention has been made in view of the above-described problems of the prior art, and an object of the present invention is to provide an ink jet recording head capable of discharging good ink at all the discharge ports.

  A plurality of arrays of recording elements, a plurality of power supply wirings provided for each of the arrays for driving the recording elements, and a plurality of power supply wiring connection portions arranged to connect the power supply wirings to the outside, A plurality of ground wirings provided for each of the arrays for driving the recording elements, and a plurality of ground wiring connection portions arranged to connect the ground wirings to the outside, The ground wiring is wired so that the total length of the wiring length from the power supply connection portion to the recording element and the wiring length from the recording element to the ground connection portion is equal for each recording element. Thus, the plurality of power supply wiring connection portions and the plurality of ground wiring connection portions are arranged along different sides of the substrate, respectively.

  The ink jet recording head of the present invention is characterized by using the ink jet recording head substrate and a wiring substrate for electrical connection between the substrate and the outside.

Furthermore, the present invention resides in a wiring board for making an electrical connection between the ink jet recording head substrate and the outside.
According to another aspect of the invention, there is provided an ink jet recording element substrate including a substrate having a first side and a second side facing the first side, the plurality of recording elements being provided on the substrate. A recording element array arranged from the side of the substrate toward the side of the second side, and a power source provided on the first side of the substrate, which is used to supply a power supply potential. An electrode terminal, used to supply a ground potential, and extended from the power electrode terminal along the recording element array, and a ground electrode terminal provided on the second side of the substrate. A power supply line for supplying a power supply potential for driving the plurality of recording elements, and extending from the ground electrode terminal along the recording element array. Each of the plurality of recording elements includes the plurality of recording elements. Characterized in that and a ground line for supplying a ground potential for driving the recording element.

  The inkjet recording head of the present invention can be reduced in size and number of colors, and even if the number of wirings connected to the flexible wiring board is increased, even in the case of a flexible wiring board composed of a single wiring layer, in a limited plane. In the routing of the wiring, it is possible to minimize the increase in the wiring resistance, and it is possible to further suppress the increase in the wiring resistance by collecting adjacent wirings. Since the wiring resistance difference between the recording element arrays can be reduced, good ink can be discharged from all the discharge ports.

  Hereinafter, embodiments of an ink jet recording head according to the present invention will be described with reference to the drawings.

(First embodiment)
FIG. 1 is a perspective view showing an ink tank mounting state of the ink jet recording head according to the present invention, and FIG. 2 is a perspective view showing a state where the ink tank of FIG. 1 is removed. FIG. 3 is an exploded perspective view of the ink jet recording head of this embodiment, and is a view as seen from the lower back surface of FIG.

  A recording head 1001 in the form shown in FIGS. 1 and 2 is a constituent element of a recording head cartridge 1000. The recording head cartridge 1000 includes an ink tank that is detachably provided on the recording head 1001 and the recording head 1001. 1900 (1901, 1902, 1903, 1904, 1905, 1906).

  The recording head cartridge 1000 is fixedly supported by positioning means and electrical contacts of a carriage (not shown) provided in the ink jet recording apparatus main body, and is detachable from the carriage. Further, the carriage is movable in a direction intersecting with the supply and conveyance direction of a recording medium such as paper facing the ink ejection portion of the recording head 1001.

  Ink tank 1901 is for black ink, ink tank 1902 is for light cyan ink, ink tank 1903 is for light magenta ink, ink tank 1904 is for cyan ink, ink tank 1905 is for magenta ink, ink tank 1906 is For yellow ink. In this way, each of the ink tanks 1901, 1902, 1903, 1904, 1905, and 1906 is detachable from the recording head 1001, and each ink tank can be replaced, so that printing running in the ink jet recording apparatus can be performed. Cost is reduced.

  The ink ejection means of the recording head 1001 is one of the systems that perform recording using a recording element that generates thermal energy for causing film boiling of ink in response to an electrical signal from the main body of the inkjet recording apparatus. This is a so-called side shooter type liquid ejecting means for ejecting ink droplets vertically upward with respect to the surface of the substrate on which the heat generating resistors for generating thermal energy are arranged.

The configuration of the ink jet recording head will be described below with reference to the drawings.
In the ink jet recording head shown in FIG. 3, a flexible wiring substrate 1400 on which a recording element substrate 1100 is mounted is bonded and fixed to the ink supply holding member 4.

  In addition, the input terminal of the flexible wiring board 1400 has a plurality of external input pads 7 for supplying electrical signals such as recording information to the ink jet recording head (recording element substrate 1100) from the recording apparatus main body side. Are electrically connected.

  In addition, six ink supply ports 1102 for supplying six colors of ink to the recording element substrate 1100 are hidden in the first plate 1200 which is a component constituting the main part of the recording head (not visible in FIG. 3). The six ink supply ports 1102 of the recording element substrate 1100 correspond to the six ink supply ports 1102 of the first plate 1200, respectively, and the recording element substrate 1100 is connected to the first plate 1200. Bonded and fixed with high positional accuracy.

  A first adhesive (not shown) used for the bonding is applied on the first plate 1200 so as to have substantially the same shape as the recording element substrate, and so that no air path is generated between adjacent ink supply ports. . The first adhesive is preferably, for example, a material having a low viscosity, a thin adhesive layer formed on the contact surface, a relatively high hardness after curing, and ink resistance. For example, it is a thermosetting adhesive mainly composed of an epoxy resin, and the thickness of the adhesive layer is about 50 μm.

The first plate 1200 is made of, for example, an alumina (Al ₂ O ₃ ) material. The material of the plate is not limited to alumina, and is made of a material having a linear expansion coefficient equivalent to that of the recording element substrate 1100 and having a thermal conductivity equivalent to or higher than the thermal conductivity thereof. May be.

  The flexible film wiring board 1400 that is electrically connected in plan with the recording element substrate 1100 is bonded to the first plate 1200 with a second adhesive (not shown), and at the same time, The bent portion A is bent along the side surface and bonded to the side surface of the first plate 1200 with a third adhesive.

  FIG. 4 is a perspective view illustrating a configuration of the recording element substrate 1100 with a part thereof omitted. The recording element substrate 1100 is configured by disposing a thin-film orifice plate formed by forming an ejection port array on a Si substrate 1101 having a width of 14 mm, a length of 15 mm, and a thickness of 0.625 mm.

  In addition, six rows of ink supply ports 1102 composed of long groove-like through holes are formed as six color ink flow paths, and recording elements 1103 are arranged in a staggered manner on both sides of each ink supply port 1102. The recording element 1103 and the electric wiring such as Al for supplying electric power to the recording element 1103 are formed by a film forming technique.

  In addition, a plurality of electrode pads 1105 for supplying electric power and other electric signals to the electric wirings are arranged on the first and second electrode pad rows arranged at the substrate side end in the direction orthogonal to the recording element 1103. A total of 96 of each 48 are arranged, and each electrode pad 1105 is provided with bumps such as Au.

  Next, the ink supply port 1102 is formed by anisotropic etching using the crystal orientation of the Si substrate 1101. When the crystal orientation is <100> in the wafer surface and <111> in the thickness direction, the etching proceeds at an angle of about 54.7 degrees due to anisotropic etching (KOH, TMAH, humanradine, etc.). To do. Using this method, etching is performed to a desired depth.

  On the Si substrate 1101, an orifice plate 1110 in which an ink channel wall 1109 and an ejection port 1108 for forming an ink channel corresponding to the recording element 1103 are formed by a photolithography technique is disposed. Here, a recording element 1103 is provided so as to face the ejection port 1108, and bubbles are generated in the ink supplied from the ink flow path 1102 by the heat of the recording element 1103, so that the ink is ejected from the ejection port 1108. Discharged.

FIG. 5 shows electrical wiring such as Al for supplying power to the recording element 1103.
The printing elements 1103 are arranged along the long side of each ink supply port 1102 (the range of the printing element arrangement is schematically shown in FIG. 5). A ground common wiring 1107 further extends parallel to the arrangement direction of the recording elements. In the present embodiment, there are a total of 12 recording element arrays. One end of the recording element 1103 is connected to the power common wiring 1106 and the other end is connected to the ground common wiring 1107 via a driving element (not shown). Yes.

  The power common wiring 1106 is on the power electrode pad 1105P on the first electrode pad row, and the ground common wiring 1107 is on the second electrode pad row arranged along the side of the substrate facing the first electrode pad row. To the ground electrode pad 1105G. For simplification, only 24 electrode pads are shown in each of the first and second electrode pad rows, but in actuality, each including 48 for supplying drive signals to the drive elements. Assume that there are one electrode pad.

  In the recording element substrate 1100 of the present embodiment, the ground common wiring 1107 is substantially shortened in the recording element 1103 provided at a position where the power common wiring 1106 is substantially long (close to the second pad row). Further, in the recording element 1103 disposed at a position where the power supply common wiring 1106 is substantially shortened (close to the first pad row), the ground common wiring 1107 is substantially lengthened. Therefore, between the recording elements on the row. There is almost no difference in wiring resistance.

  Similarly in the other columns, the wiring resistance is almost equal on the substrate in any recording element. Further, since power is supplied to one printing element array by one VH common wiring and one ground common wiring, compared to the recording element substrate of the conventional example, two pieces are provided for one printing element series. The total of 24 electrode pads is reduced, and the substrate size can be reduced by the amount of the conventional electrode pads.

  FIG. 6 is a view showing the flexible wiring board 1400. The flexible wiring board 1400 uses a polyimide film as a base material, and a 0.035 mm thick copper foil wiring pattern for transmitting an electrical signal for ejecting ink to the recording element board 1100 is formed on the base material. ing. At the same time, an opening (device hole) 1401 having a width of 17 mm and a length of 16 mm for incorporating the recording element substrate 1100 and an electrode terminal 1402 corresponding to each electrode pad 1105 of the recording element substrate 1100 are used as electrical terminals. 96 wirings having the other end of the external signal input terminal 1403 for receiving signals. In the figure, only 48 wires are drawn for the sake of simplicity.

  In the flexible wiring substrate 1400 and the recording element substrate 1100, for example, the electrode pads 1105 of the recording element substrate 1100 and the electrode terminals 1402 of the flexible wiring substrate 1400 are electrically connected by an ultrasonic thermocompression bonding method or the like. This connection method is not limited to the ultrasonic thermocompression bonding method, and other methods may be used.

  The electrical connection portion between the recording element substrate 1100 and the flexible wiring substrate 1400 connected as described above is sealed with a first sealant (not shown) and the second sealant 1308, and the electrical connection portion is ink-filled. Protected from corrosion and external impacts.

  In FIG. 6, the wiring 1405 is connected to the first electrode pad row of the recording element substrate 1100 in FIG. 5, and the wirings 1406 and 1406 ′ are connected to the second electrode pad row of the recording element substrate 1100.

  Each of the wirings 1405 is about 17 mm having the same length, and the VH wiring 1405P which is a power supply wiring connected to the power electrode pad 1105P is about 0.25 mm having almost the same width in most parts of the wiring. Each wiring resistance is about 0.03Ω. The interval between the wirings is 0.1 mm or more on both sides of the VH wiring 1405P, and 0.05 mm or more in other places.

  The wirings 1406 and 1406 ′ are longer as they are arranged closer to the periphery of the flexible wiring board 1400, and each wiring is routed from the upper side of the device hole 1401 to the left and right. The wiring length to the position of the lower side portion 1401 in the drawing is about 36 mm that is wired to the peripheral portion (hereinafter referred to as the outermost peripheral portion) of the flexible wiring board, and the device hole peripheral portion (hereinafter referred to as the innermost peripheral portion). Is about 18 mm.

  Among the wirings 1406 and 1406 ′, ground wirings 1406G and 1406′G, which are power supply wirings connected to the ground electrode pad 1105G of the recording element substrate 1100, are connected from the upper side of the device hole 1401 to the lower side of the device hole 1401. Up to the position of the portion, the wiring width is increased as the wiring is routed to the outermost peripheral portion. The specific wiring width is 0.17 mm at most parts of the wiring located at the innermost peripheral part, and 0.34 mm at most parts of the wiring located at the outermost peripheral part. In the most part of the wiring, the wiring width is increased as it approaches the periphery at a value between 0.17 mm and 0.34 mm.

  Similarly, in the ground wirings 1406G and 1406′G, from the position of the lower side of the device hole 1401 in the drawing to the external signal input terminal 1403, the most part of the wiring has the same length and is about 17 mm. Is composed of about 0.23 mm to 0.34 mm.

  As a result, the wirings of 1406G and 1406'G are approximately 0.09Ω with almost the same wiring resistance.

  Accordingly, since the VH wiring and the ground wiring are used for power supply to the recording element 1103 on the recording element substrate 1100, the wiring resistance of the flexible wiring board portion on the power supply circuit is determined by which recording element array. In FIG. 5, the value is about 0.12Ω with substantially the same wiring resistance.

  Compared with the conventional example, the number of power supply wirings is reduced from one to two for each recording element array in the conventional example, and is halved. Therefore, the load on the power supply circuit is 2 Although it is doubled, the wiring resistance is less than half.

  As described above, in the ink jet recording head of the present embodiment, the wiring resistance value of the flexible wiring board on the power supply circuit is almost the same depending on the location of the recording element in any recording element array, and is different from the conventional technique. In comparison, the wiring resistance value can be reduced in the same component size.

(Second Embodiment)
Although the configuration is almost the same as that of the first embodiment, the electrical wiring method such as Al on the recording element substrate 1100 and the wiring method of the flexible wiring substrate 1400 are different.

  FIG. 7 shows electrical wiring such as Al for supplying power to the recording element 1103 on the recording element substrate 1100. The twelve power electrode pads 1105P on the first electrode pad row and the twelve ground electrode pads 1105G on the second electrode pad row are arranged adjacent to each other at the center in each row. . As in FIG. 5, for the sake of simplicity, only 24 electrode pads are drawn in the first and second electrode pad rows in the drawing, but there are actually 48 electrode pads. To do. In this case, each power common wiring 1106 and each ground common wiring 1107 have different lengths at the central portion and at the end portion, so that the wiring resistance value is the same by adjusting the wiring width. Value.

  Further, FIG. 8 shows wiring of the flexible wiring board 1400. Most of them are the same as those of the first embodiment, except that the VH wiring 1405P is adjacent.

  Also in the ink jet recording head of this embodiment, there is no difference in the wiring resistance value of the flexible wiring board portion on the power supply circuit for any recording element array. By wiring the VH wirings 1405P adjacent to each other as in the present embodiment, there is no fear of migration between the VH wirings, and the interval can be made smaller than 0.1 mm, so that the wiring width can be increased accordingly. Wiring resistance can be reduced.

(Third embodiment)
The configuration is almost the same as that of the second embodiment, and the wiring method of the electric wiring such as Al on the recording element substrate 1100 and the flexible wiring substrate 1400 is different.

  FIG. 9 shows electrical wiring such as Al for supplying power to the recording element 1103 on the recording element substrate 1100. The twelve power supply electrode pads 1105P on the first electrode pad row are arranged adjacent to the central portion in the same manner as in the second embodiment, but twelve on the second electrode pad row. The ground electrode pads 1105G are divided into six halves on the left and right sides, and are different from each other in that they are adjacently arranged on the left and right sides of the substrate side end portion. Also in this case, the wiring resistance is adjusted to be uniform by adjusting the wiring width in the difference in length between each power common wiring 1106 and each ground common wiring 1107.

  FIG. 10 shows wiring of the flexible wiring board 1400. The difference from the second embodiment is that the ground wirings 1406G and 1406'G are routed around the periphery of the device hole 1401.

  In the ink jet recording head of this embodiment, there is no difference in the wiring resistance value of the flexible wiring board portion on the power supply circuit for any recording element 1103.

  In addition, since the ground wirings 1406G and 1406′G are routed around the periphery of the device hole 1401, the wiring length is shorter than the routing around the outer peripheral portion, and as a result, the overall wiring resistance is further reduced. be able to.

  In the present embodiment, the power electrode pad 1105P may be divided into six parts on the left and right sides, or the power electrode pad 1105P is divided into two parts, while the entire ground electrode pad 1105G is disposed adjacently. It may be made to do. Of course, the number of pads can be determined as appropriate.

(Fourth embodiment)
FIG. 11 shows a third embodiment in which a common wiring is formed by filling a space between adjacent VH wiring and ground wiring in the flexible wiring board 1400.

  In the ink jet recording head of this embodiment, there is no difference in the wiring resistance value of the flexible wiring board portion on the power supply circuit for any recording element array, and the wiring width can be widened. can do.

(Other)
In each of the above embodiments, the recording element substrate and other recording element unit components have a configuration corresponding to six colors, but the number of colors is not limited thereto.

  In each of the above embodiments, Al is used as the electric wiring for supplying power to the recording element. However, other materials may be used.

Furthermore, in each of the above-described embodiments, a case where the present invention is applied to a so-called side shooter type ink jet recording head that discharges ink in a direction orthogonal to the substrate plane and the head substrate has been described. However, the present invention does not exclude application to a so-called edge shooter type ink jet recording head that discharges ink in a direction parallel to the substrate and the head substrate, and can be effectively applied to this. is there.
According to the ink jet recording head of each of the embodiments, even if the number of wirings connected to the flexible wiring board is increased in size and number of colors, even in the case of a flexible wiring board made of a single wiring layer. In the routing of wiring in a limited plane, it is possible to suppress the increase in wiring resistance to a minimum, and furthermore, it is possible to further suppress the increase in wiring resistance by combining adjacent wirings. Since the wiring resistance difference between the plurality of ejection port arrays (recording element arrays) can also be reduced, good ink ejection can be performed at all the ejection ports.

FIG. 3 is a perspective view showing an ink tank mounting state of the ink jet recording head according to the embodiment of the present invention. It is a perspective view which shows the state which removed the ink tank of FIG. FIG. 2 is an exploded perspective view of the ink jet recording head of the embodiment. FIG. 3 is a perspective view showing a recording element substrate provided in the ink jet recording head, with a part thereof omitted for explaining the configuration of the recording element substrate. FIG. 6 is a schematic plan view for explaining an embodiment of the electrical wiring on the recording element substrate. FIG. 6 is a schematic plan view illustrating a configuration of a flexible wiring substrate with respect to the recording element substrate of FIG. 5. FIG. 6 is a schematic plan view for explaining another embodiment of the electric wiring on the recording element substrate. FIG. 8 is a schematic plan view illustrating a configuration of a flexible wiring board with respect to the recording element substrate of FIG. 7. FIG. 10 is a schematic plan view for explaining still another embodiment of the electrical wiring on the recording element substrate. FIG. 10 is a schematic plan view illustrating a configuration of a flexible wiring substrate with respect to the recording element substrate of FIG. 9. FIG. 10 is a schematic plan view illustrating another configuration of the flexible wiring substrate with respect to the recording element substrate of FIG. 9. FIG. 2 is a schematic perspective view illustrating a general configuration of a main part of a recording head. It is a typical top view which shows the prior art example of the electrical wiring on the recording element board | substrate provided in an inkjet recording head. FIG. 14 is a schematic plan view illustrating a configuration of a flexible wiring substrate with respect to the recording element substrate of FIG. 13.

Explanation of symbols

1000 Recording Head Cartridge 1001 Recording Head 1100 Recording Element Substrate 1101 Si Substrate 1102 Ink Supply Port 1103 Recording Element 1105 Electrode Pad 1106 Electric Common Wiring 1107 Ground Common Wiring 1108 Ejection Port 1109 Ink Channel Wall 1200 Plate 1400 Flexible Wiring Substrate 1401 Device Hole 1402 Electrode terminal 1403 External signal input device 1405 Wiring 1405P VH wiring 1406 Wiring 1406G Ground wiring 1900 Ink tank

Claims (4)

A substrate comprising a first side and a second side opposite the first side;
Provided on the substrate, a plurality of recording element arrays formed by arranging a plurality of recording elements in the direction connecting the side of the side and said second side of said first side,
Corresponding to each of the plurality of said recording element arrays, used for supplying a power supply potential, and a plurality of power supply electrode terminal provided on the side of the first side of the substrate,
Corresponding to each of the plurality of said recording element arrays, used for supplying the ground potential, a plurality of electrode terminals for a ground that is provided on a side of the second side of the substrate,
Corresponding to each of the plurality of said recording element row, provided along a corresponding said recording element array extends from the power supply electrode terminals, to each of the plurality of recording elements of the corresponding recording element array, wherein a plurality of power supply lines for supplying a power supply potential for driving a plurality of recording elements,
Corresponding to each of the plurality of said recording element row, provided along a corresponding said recording element array extends from the ground electrode terminals, to each of the plurality of recording elements of the corresponding recording element array, wherein a plurality of ground wires for supplying a ground potential for driving a plurality of recording elements,
A recording element substrate comprising:
Corresponding to each of the plurality of power supply electrode terminals, corresponding to each of the plurality of first wirings connected to the corresponding power supply connection terminal, and corresponding to each of the plurality of ground electrode terminals, the corresponding ground electrode A plurality of second wirings connected to the terminals, a flexible wiring board comprising:
A recording head comprising: The recording head according to claim 1, wherein the plurality of recording element arrays are provided in parallel to each other. The flexible wiring board is further provided with a terminal part used for electrical connection with the outside so as to be located on one side ,
Each of the plurality of first wirings is used to connect the terminal portion and the power supply electrode terminal, and the plurality of first wirings are arranged between the adjacent first wirings. Provided as one group where the second wiring is not located,
Each of the plurality of second wirings is used to connect the terminal portion and the ground electrode terminal, and the plurality of second wirings are arranged between the adjacent second wirings. The recording head according to claim 1, wherein the recording heads are arranged so as to form two groups in which one wiring is not located . Said recording element substrate is provided in a rectangular shape, the flexible wiring board, according to any one of claims 1 to 3, characterized in that provided surrounding the periphery of the recording element substrate Recording head.

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