JP2015212024A - Liquid discharge head and recording device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a liquid discharge head capable of conducting positioning between an ink supply port of a support member and an ink supply port of a recording element substrate with high accuracy.SOLUTION: A liquid discharge head includes: a liquid discharge substrate having a discharge energy generating element for discharging a liquid from a discharge port; and a support member 400 in which a second supply port 401 for supplying a liquid to a first supply port 201 of a first member 200 is formed at an adhesion part. Further, the liquid discharge head includes: a first member in which the first supply port for supplying the liquid to the liquid discharge substrate is formed; and a second member in which an opening part for storing the first member is formed. A position of the first member stored in the opening part is adjusted to enable a position of the first supply port to be adjusted relative to the second supply port.

Description

  The present invention relates to a liquid discharge head capable of discharging liquid and a recording apparatus that performs recording by discharging liquid from the liquid discharge head.

  A recording apparatus that records an image or the like on a recording medium by discharging a liquid such as ink is provided with a liquid discharge head that can discharge the liquid. As this liquid discharge head, there is an ink jet recording head (hereinafter, simply referred to as a recording head) as disclosed in Patent Document 1. The recording head shown here includes a recording element substrate having an ejection port for ejecting ink and an energy generating element for generating energy for ejecting ink from the ejection port on a first plate as a support member. It is the structure directly bonded to. Note that Patent Document 1 shows a full-line type recording head in which ink ejection openings are arranged in a direction that intersects the conveyance direction of the recording medium over a range equal to or larger than the width of the recording medium.

Japanese Patent No. 4757011

  The recording head shown in Patent Document 1 is configured so that ink is supplied from an ink supply port formed in the support member to an ink supply port of the recording element substrate. It is necessary to align the ink supply port with high accuracy. That is, if the accuracy of the formation position of the ink supply port of the support member is low, when the recording element substrate is bonded to a predetermined position of the support member, the position is set between the ink supply port of the recording element substrate and the ink supply port of the support member. There is a possibility that a deviation occurs and an ink supply failure occurs, thereby degrading the image quality. In particular, in a full-line type recording head in which a plurality of recording element substrates are bonded to a support member, if the relative positional accuracy of each recording element substrate is low, the relative landing position of ink droplets ejected from each substrate Shifts, streaks, unevenness, and the like that degrade the quality of the image. Therefore, it is necessary to make the arrangement position of the recording element substrate highly accurate, and accordingly, it is necessary to form the ink supply port of the support member with high precision. That is, when the relative positional accuracy between the plurality of ink supply ports of the support member and the ink supply ports of the plurality of recording element substrates is low, the position is between the ink supply port of the support member and the supply port of the recording element substrate. This is because a deviation occurs, which causes an ink supply failure and an ejection failure. However, since the recording element substrate is fixed to the support member, it is desirable to use a member having a small linear expansion coefficient, and the dimensional accuracy of the ink supply port is made high with respect to such a member having a small linear expansion coefficient. This is often difficult. Further, an expensive processing method is required to form the ink supply port with high accuracy.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a liquid ejection head capable of highly accurately aligning an ink supply port of a support member and an ink supply port of a recording element substrate.

  In order to solve the above problems, the present invention provides a liquid discharge substrate having a discharge port capable of discharging a liquid and a discharge energy generating element that generates discharge energy for discharging the liquid from the discharge port, and a liquid discharge substrate Is supported and fixed, and a first member in which a first supply port for supplying a liquid to the liquid discharge substrate is formed, and a second member in which an opening for accommodating the first member is formed. And a second portion for supplying a liquid to the first supply port of the first member, and having a bonding portion bonded to one bonding surface of each of the first member and the second member. And a support member formed in the bonding portion, and the first supply port with respect to the second supply port by adjusting the position of the first member accommodated in the opening. It is characterized in that the position of can be adjusted.

  According to a second aspect of the present invention, there is provided a recording apparatus in which the liquid discharge head is mounted and an image is formed by landing the liquid discharged from the liquid discharge head on a recording medium.

  According to the present invention, the ink supply port of the support member and the ink supply port of the recording element substrate can be aligned with high accuracy, and a highly reliable liquid discharge head can be provided. Further, according to the recording apparatus using the liquid ejection head according to the present invention, it is possible to form a high quality image.

It is a perspective view which shows the structure of the liquid discharge head in embodiment to which this invention is applied. FIG. 2 is an exploded perspective view of the liquid ejection head illustrated in FIG. 1. It is a perspective view for explaining a recording element substrate. It is a cross-sectional schematic diagram for demonstrating the flow-path structure of the liquid discharge head in this embodiment. FIG. 4 is a perspective view illustrating a recording unit of a recording apparatus equipped with a liquid ejection head according to the present embodiment. FIG. 3 is a longitudinal side view of the liquid ejection head according to the first embodiment. It is a vertical side view which shows the modification of the liquid discharge head in 1st Embodiment. FIG. 6 is a plan view of a liquid ejection head in a second embodiment. It is a vertical side view of the liquid discharge head in 3rd Embodiment.

(First embodiment)
The configuration and operation of the liquid discharge head according to the first embodiment of the present invention will be described with reference to the drawings. In the first embodiment, the most typical ink jet recording head (hereinafter referred to as “recording head”) will be described as an example of a liquid ejecting head for ejecting liquid. In the following description, the short direction or short dimension of the recording head refers to the dimension in the X direction or X direction in FIG. 1, and the long direction or long dimension is the dimension in the Y direction or Y direction in FIG. Point to.

  1 to 5 are diagrams for explaining the configuration of a recording head and an ink jet recording apparatus (hereinafter referred to as “recording apparatus”) to which the recording head is mounted. 1 is a perspective view showing the configuration of the recording head, FIG. 2 is an exploded perspective view showing the configuration of each part of the recording head shown in FIG. 1, and FIG. 3 is a diagram for explaining the recording element substrate. 3 (a) is a perspective view of the recording element substrate, and FIG. 3 (b) is a cross-sectional view taken along the line CC of FIG. 3 (a). FIG. 4 is a schematic cross-sectional view for explaining the flow path structure in the recording head, and FIG. 5 is a perspective view showing a recording portion of the recording apparatus. The recording head 90 is formed with two ink circulations so as to be point-symmetric at the center of the head, and FIG. 4 shows only the ink circulation path on one side.

  The recording head 90 in this embodiment has a configuration as shown in FIGS. That is, as shown in FIG. 1, the eighteen recording element substrates 100 are arranged in a staggered pattern in the recording head 90 so as to overlap each other in the transport direction (Y direction) of a recording medium such as paper. Is arranged. In each recording element substrate 100, ejection openings capable of ejecting ink are arranged in a line over a range that is equal to or larger than the width of the recording medium along a direction intersecting the transport direction (a direction orthogonal in the present embodiment). A discharge port array is provided. The recording head 90 shown here has a recording width of about 13 inches as a whole, is held at a fixed position without moving during the recording operation, and is continuously conveyed in the Y direction. This is a full-line type recording head that performs recording.

  As shown in FIGS. 1 and 2, the recording head 90 includes a recording element substrate 100, a flow path connection member 200, a frame member 300, a support member 400, an electric wiring member 500, and an ink supply unit 600. The recording element substrate 100 functions as a liquid ejection substrate, the support member 400, the flow path connecting member 200, and the recording element substrate 100 function as a liquid ejection member, and the ink supply unit 600 functions as a liquid supply member.

The recording element substrate 100 is a device for ejecting ink, and includes a silicon (Si) substrate 101 and an ejection port plate 105.
The Si substrate 101 has a thickness of about 0.5 to 1 mm. As shown in FIG. 3B, the Si substrate 101 has a long groove-like ink supply port 102 extending in the longitudinal direction of the Si substrate 101. Has been. On both sides of the ink supply port 102, electrothermal conversion elements 103 such as heaters are arranged in a row as discharge energy generating elements that generate energy for discharging ink, and arranged in a staggered manner as a whole. ing. Further, electrodes 104 that are electrically connected to the electric wiring member 500 are provided at both ends in the longitudinal direction (X direction) of the recording element substrate 100.

  A discharge port plate 105 made of a resin material is provided on one surface of the Si substrate 101, and a discharge port 106 corresponding to the electrothermal conversion element 103 and an ink flow path 107 are provided on the discharge port plate 105 by photolithography technology. Is formed by. The ink flow path 107 and the ejection port 106 are filled with ink supplied from the ink supply port 102. By driving the electrothermal conversion element 103 in a state where the ejection port 106 is filled with ink, bubbles are generated in the ink, and ink is ejected from the ejection port 106 due to a change in pressure at that time.

  A recording element substrate 100 is fixed to the flow path connection member 200 and is a member for supplying ink to each recording element substrate 100. The flow path connection member 200 is divided and formed so as to correspond to each of the plurality of recording element substrates 100, and an ink supply port 201 through which ink flows is formed inside each flow path connection member 200. Yes. The frame member 300 is a member for supporting and fixing the electric wiring member 500 and the like. In this frame member 300, a plurality of openings 301 for accommodating the flow path connecting members 200 are formed corresponding to the plurality of flow path connecting members 200. Further, the gap between the flow path connecting member 200 and the frame member 300 is filled with a sealant, and functions as a frame of the sealant when filling the sealant.

  The support member 400 is a member for supporting and fixing the flow path connecting member 200 and the frame member 300 and for distributing ink to each recording element substrate 100. As shown in FIG. 4, an ink flow path 402 is formed inside the support member 400, and an ink supply port 401 corresponding to each recording element substrate 100 is formed on one surface (the lower surface in FIG. 4). ing. The ink supply port 401 communicates with the ink flow path 402. Further, flow path joint portions 403 and 404 of the ink flow path 402 are formed on the other surface (the upper surface in FIG. 4) of the support member 400.

  The electric wiring member 500 is a member for transmitting a driving signal for discharging ink and supplying driving power to the recording element substrate 100. In this embodiment, it is integrally formed using a flexible wiring board (FPC) having a polyimide film as a base material. The electrical wiring member 500 is provided with an opening 501 for incorporating the recording element substrate 100 and an electrode terminal 502 corresponding to the electrode 104 of the recording element substrate 100. Furthermore, the electrical wiring member 500 is provided with connectors 503 and 504 for receiving drive signals and drive power from the recording apparatus via the drive circuit board unit 590.

  The ink supply unit 600 is a member that supplies ink to the recording element substrate 100 via the support member 400 and the flow path connection member 200, and is fixed to both ends in the longitudinal direction of the support member 400 as shown in FIG. ing. As shown in FIG. 4, ink flow paths 601 and 602 are formed inside each ink supply unit 600. Ink joint portions 607 and 608 are formed at one end of each ink flow path 601 and 602, and these ink joint portions 607 and 608 are connected to an ink joint portion (not shown) connected to an ink supply source of the recording apparatus. ing. In addition, flow path joint portions 605 and 606 corresponding to the end portions of the ink flow paths 601 and 602 are formed on one surface (the lower surface in FIGS. 2 and 4) of the ink supply unit 600. The flow path joint portions 605 and 606 are connected to flow path joint portions 403 and 404 formed on the support member 400, respectively. The ink flow paths 601 and 602 formed in the ink supply unit 600 and the ink flow paths 401 and 402 formed in the support member 400 form a circulation path for circulating ink during the recording operation. Filters 603 and 604 for preventing dust from entering are accommodated in the middle of the ink flow paths 601 and 602 of the ink supply unit 600.

Next, a recording apparatus on which the recording head according to this embodiment is mounted will be described.
FIG. 5 is a perspective view illustrating a schematic configuration of the recording unit 30 in the recording apparatus in which the recording head 90 is mounted. FIG. 5 illustrates a state in which a recording operation is performed. In the recording unit 30, for example, four recording heads 90 corresponding to four color inks of black (Bk), cyan (C), magenta (M), and yellow (Ye) are transported in the recording medium (X direction). Will be installed sequentially. Note that the X direction, which is the longitudinal direction of the recording head 90 (the direction in which the ejection ports are arranged), is arranged along the direction intersecting the transport direction Y direction. In the present embodiment, the longitudinal direction (Y direction) of the recording head is orthogonal to the X direction. Further, a conveyance roller 31 is disposed between the recording heads 90 adjacent in the conveyance direction (X direction) of the recording medium 20, and the recording medium 20 is conveyed by the conveyance roller 31.

  The recording apparatus includes a control unit that performs driving control of each unit including driving of a transport motor (not illustrated) that rotates the transport roller 31, driving of the electrothermal conversion element 103 of the recording head 90, and various signal processing. Is provided. The control means includes, for example, a CPU, a ROM, a RAM, and the like, and the CPU performs control of each unit, data processing, and the like according to a control program in the ROM. During the recording operation, the electrothermal conversion element 103 is driven based on a drive signal sent from the CPU to the recording head 90, and ink is ejected from the ejection port from the recording head 90, thereby recording on the recording medium 20. Done.

  By the way, in the present embodiment, since the plurality of recording heads 90 are sequentially arranged in the transport direction (X direction), the dimension (short dimension) in the short direction perpendicular to the longitudinal direction of the recording head 90 can be reduced. desirable. That is, by reducing the short dimension of the recording head 90, the arrangement pitch of the recording heads can be reduced, and the recording apparatus can be downsized. Further, by reducing the short dimension of the recording head 90, the area for keeping the recording medium parallel to the recording head 90 can be narrowed, improving the recording medium conveyance accuracy and preventing the recording medium from jamming. Thus, the recording quality can be improved.

  Next, an embodiment of a joining configuration of the recording element substrate 100, the flow path connection member 200, the frame member 300, the support member 400, and the electric wiring member 500, which is one of the characteristic configurations of the present invention, is shown in FIG. This will be described with reference to FIG. 6A is a cross-sectional view taken along line AA in FIG. 1, and FIG. 6B is a cross-sectional view taken along line BB in FIG.

In this embodiment, the support member 400 is formed by laminating a plurality of green sheets of aluminum oxide (Al ₂ O ₃ ; hereinafter referred to as alumina) and firing them. Since alumina has a high elastic modulus, the rigidity of the recording element head 90 can be maintained, and since the linear expansion coefficient is small, even if the longitudinal dimension becomes a large size of about 400 mm, the dimensional change due to the thermal change does not occur. The recording head 90 is small and can perform stable recording. The flow path connecting member 200 is formed of a resin material, and an inorganic filler such as silica is added to make the linear expansion coefficient of the support member 400 equivalent. The linear expansion coefficient of alumina is about 7 ppm / ° C., and the linear expansion coefficient of the resin material is about 7 to 10 ppm / ° C.

  The frame member 300 was formed using alumina in the same manner as the support member 400. As described above, since alumina has a small coefficient of linear expansion and a high elastic modulus, the effect of suppressing thermal deformation of the electric wiring member 500 is great. Further, when alumina is used for the frame member 300, since alumina is a material having high thermal conductivity, when the recording element substrate 100 and the electric wiring member 500 are electrically connected by the wire 805, heating is performed from the back surface of the support member 400. It is possible to connect by raising the temperature of the electrical connection part. For this reason, highly reliable electrical connection can be easily performed.

  In addition, it is also possible to apply a resin material to the frame member 300 or to use alumina for the flow path connecting member. When a resin material is applied to the frame member 300, it is not always necessary to use the same type of material as the flow path connection member 200. That is, in order to form the ink flow path, the flow path connecting member 200 can use only an ink-resistant resin and a filler that hardly deteriorate even when in contact with ink. On the other hand, since the frame member 300 does not come into contact with ink, it is possible to select a material having no ink resistance.

  As shown in FIG. 6, the recording element substrate 100 is bonded to the flow path connecting member 200 with an adhesive 801, and the flow path connecting member 200 and the frame member 300 are bonded to the support member 400 with an adhesive 802, respectively. Bonded with an adhesive 803. Further, the plurality of recording element substrates 100 are determined so that the height of the surface (discharge port surface) on which the discharge ports 106 are formed is substantially the same. When the ejection port surfaces of the plurality of recording element substrates 100 are not aligned, the landing positions of the ink droplets ejected from the respective recording element substrates 100 are shifted, and the recorded image is disturbed. There is. However, since there are variations in the dimensions of the individual flow path connection members 200, the adhesive 802 is made of a material having a high thixotropy and is applied thickly, so that the flow path connection member 200 and the support member 400 The gap is absorbed by the adhesive 802. Preferably, the adhesive 802 is a material having a high elastic modulus, and the flow path connecting member 200 is firmly fixed, so that the positional accuracy of the recording element substrate 100 can be maintained.

  The electric wiring member 500 is bonded to the frame member 300 with an adhesive 804 and is bent at the end in the short direction. Since the linear expansion coefficient of the electric wiring member 500 is about 10 to 30 ppm / ° C. and there is a difference between the linear expansion coefficient of the frame member 300, bonding is performed in order to relieve the stress generated by the difference in the linear expansion coefficient. As the agent 804, an adhesive having a low elastic modulus is applied. The recording element substrate 100 and the electrical wiring member 500 are electrically connected by a wire 805. Further, a gap between the flow path connection member 200 and the frame member 300 is sealed with a sealant 806, and an electrical connection portion by the wire 805 is sealed with a sealant 807. As the sealant 806, a sealant having a low viscosity is applied so that the sealant 806 can easily enter a gap between components. Further, a sealant 807 having a high elastic modulus is applied, so that the surface of the recording element substrate 100 is cleaned with a wiper blade when the electrical connection is subjected to a physical impact or between recording operations. Even when the operation is performed, the electrical connection reliability can be maintained.

  The flow path connecting member 200 is individually formed corresponding to each recording element substrate 100, and an ink supply port 201 for supplying ink is formed. Therefore, even if the formation position of the ink supply port 401 of the support member is deviated, the flow path connection member 200 is accurately arranged with respect to the ink supply port 401, so that the ink supply port 102 of the recording element substrate and the flow path are connected. The positional deviation of the member from the ink supply port 201 can be reduced. For this reason, it is possible to stably supply ink to the recording element substrate 100 via the ink supply port 401 and the ink supply port 201. Note that the flow path connection is performed so that the ink supply performance due to the positional deviation between the ink supply port 401 of the support member 400 and the ink supply port 201 of the flow path connection member 200 does not affect the ink supply port 102 of the recording element substrate 100. The thickness of the member 200 is about 3 to 10 mm.

  Since the support member 400 is a part obtained by baking alumina, the positional deviation of the ink supply port 401 is about ± 0.2 to 1% of the dimension. For this reason, in the large recording head as shown in the present embodiment, the longitudinal dimension of the support member 400 is about 400 mm, and thus the position of the ink supply port 401 may be greatly shifted. Therefore, it is necessary to reserve a sufficient margin for bonding the flow path connecting member 200. When there is little adhesion margin, the adhesive strength may be insufficient. Further, as described above, the gap between the flow path connection member 200 and the support member 400 is adjusted so that the surfaces to which the recording element substrate 100 is bonded have the same height in the plurality of flow path connection members 200. There is a need to. However, when there is little adhesion margin as described above, it is difficult to apply the adhesive thickly on the narrow adhesion margin, and a portion where the gap between the flow path connecting member 200 and the support member 400 is large is removed from the gap with the adhesive 806. There is a possibility that it cannot be closed. In addition, when a low-viscosity sealant 806 is applied between the flow path connection member 200 and the frame member 300 in a state where the gap between the flow path connection member 200 and the support member 400 cannot be closed, sealing is performed from the remaining gap. In some cases, the agent 806 flows down to the ink supply port 401. In this case, the ink supply performance deteriorates, or a gap is formed between the flow path connecting member 200 and the frame member 300, and the ink or dust accumulated in the gap drops on the recording medium during the recording operation to form a defective image. There is also a possibility that. Further, when the sealing agent 806 flows down to the ink supply port 401, the sealing agent 806 to be supplied between the flow path connecting member 200 and the frame member 300 may be insufficient. In this case, an appropriate state (see FIG. 6B) in which the sealant 806 is supplied to the periphery of the recording element substrate 100 and the electric wiring member 500 cannot be obtained, and the recording element substrate 100 and the electric wiring member 500 are A recess or space may be formed around the periphery due to insufficient supply of the sealant. When the sealing agent 807 for the electrical connection portion is applied in such a state, the sealing agent 806 that serves as a base does not exist, and thus the sealing agent 807 falls into the above-described recesses and spaces, and the wire 805. May be exposed.

  In order to eliminate such inconvenience, in this embodiment, the bonding surface between the frame member 300 and the electric wiring member 500, the bonding surface between the frame member 300 and the support member 400, and the flow path connection member 200 and the support member 400 are combined. The relationship between the short dimensions of the bonding surfaces was determined as follows. Now, let the short dimension of the bonding surface between the frame member 300 and the electric wiring member 500 be X1 and X7, and let the short dimension of the bonding surface between the frame member 300 and the support member 400 be X2 and X8. Further, the short dimension of the adhesive surface between the flow path connecting member 200 and the recording element substrate 100 is X3 and X5, and the short dimension of the adhesive surface between the flow path connecting member 200 and the support member 400 is X4 and X6. Here, a taper of about 2 to 10 ° is provided on the facing surfaces of the flow path connecting member 200 and the frame member 300 so that the relation of X1> X2, X3 <X4, X5 <X6, X7> X8 is established.

  Similarly, in the longitudinal direction (Y direction), the relationship between the longitudinal dimensions of the bonding surfaces is set. That is, the longitudinal dimension of the adhesive surface between the electric wiring member 500 and the frame member 300 is Y1, and the longitudinal dimension of the electric wiring member 500, the support member 400, and the adhesive surface is Y2. In addition, the longitudinal dimension of the adhesive surface between the flow path connecting member 200 and the recording element substrate 100 is Y3 and Y5, and the longitudinal dimension of the adhesive surface between the flow path connecting member 200 and the support member 400 is Y4 and Y6. Here, the relationship between the longitudinal dimensions of the bonding surfaces is such that Y1> Y2, Y3 <Y4, Y5 <Y6, and the surface where the flow path forming member 200 and the frame member 300 face each other is about 2 to 10 °. A taper was provided.

  The short dimensions X1 and X7 and the long dimension Y1 are the minimum required dimensions, and if each dimension is further reduced, inconvenience may occur. For example, if the dimensions of X7 and Y1 located between the recording element substrates 100 are reduced, the wiring layout of the electric wiring member 500 may be difficult. Further, when the dimension of X1 is reduced, the area where the cap rubber contacts is reduced when performing the suction recovery operation of the recording head 90, and the suction recovery operation may not be performed properly due to poor contact of the cap rubber. End up. Moreover, if the dimension of X1 becomes small, the adhesion part of the electric wiring member 500 may peel off by the repulsive force of the electric wiring member 500 bent at both ends in the short direction.

  Further, when the width of the ink supply ports 201 and 401 is reduced in order to increase the bonding margin of the flow path connecting member 200, the ink supply amount (ink flow rate) is limited, and a large ink flow rate is required for high-speed recording. If this is required, ink supply failure may occur. Therefore, if the overall dimensions of the flow path connection member 200 are simply increased in order to ensure the adhesion reliability of the flow path connection member 200 with respect to the support member 400, the overall dimensions of the recording head will increase accordingly. However, with the configuration shown in the present embodiment, it is possible to increase only the bonding distance of the flow path connecting member 200 without increasing the overall dimensions (longitudinal dimension and short dimension) of the recording head 90. Adhesion reliability between the flow path connecting member 200 and the support member 200 can be improved.

  In addition, when the taper is not provided on the side surface of the flow path connecting member 200 and the dimensions of the bonding surfaces are set to satisfy X4≈X3, X6≈X5, and Y4≈Y3, X2 that becomes the bonding margin of the frame member 300 , X8, and Y2 are smaller than in this embodiment. However, in this embodiment, since both the frame member 300 and the support member 400 are made of alumina, there is almost no generation of stress due to the difference in linear expansion coefficient between the members, and the frame member 300 and the support member 400. Adhesion reliability with is not impaired. Here, X2≈X4≈X6≈X8, Y2≈Y4≈Y6, and the margin of adhesion between the support member 400 and the flow path connection member 200 is substantially the same as the margin of adhesion between the support member 400 and the frame member 300. As a result, the bonding reliability of each member is ensured.

(Second Embodiment)
Next, a second embodiment of the present invention will be described with reference to FIG. FIG. 7 shows a cross-sectional view taken along line AA in FIG.
Also in the second embodiment, the dimensions of the adhesion surface between the frame member 300 and the electric wiring member 500 are X1 and X7, and the dimensions of the adhesion surface between the frame member 300 and the support member 400 are X2 and X8. The dimensions of the adhesion surface between the flow path connecting member 200 and the recording element substrate 100 are X3 and X5, and the dimensions of the adhesion surface with the support member are X4 and X6. However, in the second embodiment, X1> X2, X3 <X4, X5 <X6, X7> X8, and X4> X2, X6> X8 are satisfied. Furthermore, it has a configuration in which the bonding margin of the flow path connecting member 200 is further increased. Although illustration is omitted, the gap between the flow path connection member 200 and the support member 400 is similarly increased in the longitudinal direction.

  In the flow path connecting member 200, an inorganic filler is added to the resin material to reduce the linear expansion coefficient. However, generally, if the amount of the inorganic filler is large, the fluidity of the material is lowered and the moldability is lowered. Therefore, depending on the size and shape of the flow path connecting member 200 and the ink supply port 201, molding may be difficult, and the degree of freedom in shape is reduced. Therefore, this embodiment is suitable when applying the resin material which reduced the quantity of the inorganic filler to fill a little, and made the linear expansion coefficient about 15-40 ppm / degreeC.

  Since the linear expansion coefficient of the support member 400 formed of alumina is about 7 ppm / ° C., the bonded portion between the support member 400 and the flow path connection member 200 having a larger linear expansion coefficient with the thermal change of the recording head 90. In some cases, stress may be generated due to a difference in linear expansion coefficient between the two members. Even in such a case, in the second embodiment, a sufficient bonding force between the flow path connecting member 200 and the support member 400 is provided to ensure a sufficient bonding reliability. be able to. In the second embodiment, the margin of adhesion between the frame member 300 and the support member 400 is smaller than that in the first embodiment. However, since both the frame member 300 and the support member 400 are made of alumina, stress due to the linear expansion coefficient does not occur between the two members, and the bonding reliability of the two members is not impaired.

(Third embodiment)
Next, a third embodiment of the present invention will be described with reference to FIG. FIG. 9 is a plan view showing the relationship between the flow path connecting member 200 and the frame member 300. In the first and second embodiments, the case where the flow path connecting member 200 and the recording element substrate 100 correspond one-to-one has been shown, but the present invention is not limited to this, and the single It is also possible to adopt a configuration in which a plurality of recording element substrates correspond to the flow path connecting member. For example, in the third embodiment, a case where two recording element substrates 100 correspond to one flow path connecting member 200 is shown. Thereby, the number of flow path connection members 200 can be reduced, and the manufacturing tact of the recording head 90 can be shortened. Furthermore, since the number of the flow path connection members 200 is reduced, there is an advantage that the surface to which the recording element substrate 100 is bonded can be easily aligned on the same plane.

  In FIG. 9, the configuration in which two recording element substrates 100 correspond to one flow path connection member 200 is taken as an example, but the number of recording element substrates 100 corresponding to one flow path connection member 200 is the number of flow paths. It can be determined according to the linear expansion coefficient of the connecting member, the dimensions of the ink supply port, and the like. That is, the recording element substrate 100 corresponding to one flow path connection member is in a range that does not cause inconveniences such as poor ink supply to the print element substrate and peeling of the adhesion portion of the flow path connection member due to the difference in linear expansion coefficient. The number of can be arbitrarily determined.

(Other embodiments)
In the first and second embodiments, the side surfaces of the flow path connecting member 200 and the frame member 300 are tapered, but the side surface shape of each member is not limited to the tapered shape. For example, as shown in FIG. 9, the side surfaces of the members 200 and 300 can be formed in a staircase shape. According to this, the same effect as that shown in FIG. 6 can be expected, and the facing area between the flow path connecting member 200 and the frame member 300 can be increased, so that the adhesion with the sealant 806 is increased. This is effective when trying to do so.

  Furthermore, in the said embodiment, the case where the flow-path connection member 200 and the frame member 300 provided the taper in the opposing surface in the transversal direction (X direction) and the longitudinal direction (Y direction) was shown. However, the present invention is not limited to this, and the taper is formed only on the facing surface in either the longitudinal direction or the short direction among the facing surfaces of the flow path connecting member 200 and the frame member 300. It may be. Further, no taper is provided on any part of the opposed surfaces of the flow path connecting member and the frame member, and the opposed surfaces of the flow path connecting member and the frame member are formed so as to form a uniform cross section. Is also possible. Also in this case, the gap between the frame member and the flow path connecting member can be adjusted, so that the alignment between the plurality of recording element substrates and the ink supply port of the flow path connecting member and the ink supply port of the support member Can be easily aligned. Therefore, according to this, it becomes possible to shorten a manufacturing tact.

  Although the case where the present invention is applied to a full-line type recording head in which the plurality of recording element substrates are arranged in a staggered manner is shown, the present invention is also applied to a full-line type recording head in which a plurality of recording element substrates are arranged in a row. The invention is applicable. Furthermore, the present invention may be applied to a recording head in a serial type recording apparatus (inkjet recording apparatus) that performs recording by moving the recording head in a direction intersecting the conveyance direction of the recording medium.

90 Recording head (liquid ejection head)
100 Recording element substrate (liquid ejection substrate)
103 Electrothermal conversion element (discharge energy generating element)
106 Discharge port 200 Flow path connecting member (first member)
201 Ink supply port (first supply port)
300 Frame member (second member)
400 Support member 401 Ink supply port (second supply port)
500 Electric wiring member (wiring member)

Claims (14)

A liquid discharge substrate having a discharge port capable of discharging liquid and a discharge energy generating element for generating discharge energy for discharging liquid from the discharge port;
A first member in which a liquid supply substrate is supported and fixed and a first supply port for supplying liquid to the liquid discharge substrate is formed;
A second member having an opening for accommodating the first member;
A second supply for supplying a liquid to the first supply port of the first member, having an adhesive portion bonded to one of the adhesive surfaces of the first member and the second member. A support member having a mouth formed in the adhesive portion;
The liquid discharge head according to claim 1, wherein the position of the first supply port with respect to the second supply port can be adjusted by adjusting the position of the first member accommodated in the opening.   The liquid discharge head according to claim 1, wherein the plurality of liquid discharge substrates are supported and fixed to the support member.   The first member has at least one location where one adhesive surface bonded to the bonding portion of the support member has a size larger than that of the other bonded surface bonded to the liquid discharge substrate. The liquid discharge head according to claim 1, wherein:   4. The liquid discharge head according to claim 1, wherein a wiring member connected to the liquid discharge substrate is bonded to the other bonding surface of the second member. 5.   In the second member, at least one location where the one adhesive surface bonded to the bonding portion of the support member has a size larger than the other bonded surface bonded to the wiring member is formed. The liquid discharge head according to claim 4.   5. The liquid discharge head according to claim 1, wherein the single liquid discharge substrate corresponds to the single first member. 6.   The liquid ejection head according to claim 2, wherein a plurality of the liquid ejection substrates correspond to a single first member. The side surface of the first member accommodated in the opening is opposed to the side surface of the opening.
The at least one of the side surface of the first member and the side surface of the second member facing the side surface has a tapered shape. Liquid discharge head. The side surface of the first member accommodated in the opening is opposed to the side surface of the opening.
8. The method according to claim 1, wherein at least one of a side surface of the first member and a side surface of the second member facing the side surface has a staircase shape. 9. Liquid discharge head. The linear expansion coefficients of the first member, the second member, and the support member are substantially the same,
10. The dimension of the one adhesive surface of the first member and the dimension of the one adhesive surface of the second member are substantially the same. The liquid discharge head described. The linear expansion coefficients of the second member and the support member are substantially the same,
The linear expansion coefficient of the first member is larger than the linear expansion coefficient of the support member,
10. The liquid according to claim 1, wherein a dimension of the one adhesive surface of the first member is larger than a dimension of the one adhesive surface of the second member. Discharge head.   12. The liquid ejection head according to claim 2, wherein the plurality of recording element substrates are arranged in a staggered pattern or in a line over a range equal to or larger than a width of the recording medium.   The space between the side surface of the opening formed in the first member and the side surface of the second member accommodated in the opening is sealed with a sealant. The liquid discharge head according to any one of 12.   14. A recording apparatus comprising the liquid discharge head according to claim 1 and forming an image by landing the liquid discharged from the liquid discharge head on a recording medium.

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