JP2008036870A - Liquid jet device and method for manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To enhance electric reliability at low cost in high density mounting. <P>SOLUTION: A top plate 26 is placed on a partition wall layer 25 forming a partition wall at a periphery of an acting section 58 of a piezoelectric element 24. A through-hole 261 for supplying a liquid to a pressurizing chamber 52 from a common liquid chamber 55, a through-hole 262 for connecting a wire to an upper electrode 57 of the piezoelectric element 24 from the top face of the top plate 26, a filling connection section 31 connected to the upper electrode 57 of the piezoelectric element 24, the filling connection section 31 constituted such that the through-hole 262 is filled with a conductive material, and an upper connection electrode 32 connected to the filling connection section 31 are formed on the top plate 26. The plurality of acting sections 58 of the piezoelectric elements 24 are two-dimensionally arranged in the line and column directions. A lower electrode 56 of the piezoelectric elements 24 is formed to be common to the plurality of acting sections 58 in the line direction, and the upper connection electrode 32 is provided to be common to the plurality of acting sections 58 in the column direction. The filling connection section 31 and the upper connection electrode 32 of the top plate 26 are integrally formed of an identical conductive material. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a liquid ejecting apparatus and a method for manufacturing the same, and more particularly to a liquid ejecting apparatus suitable for high-density mounting and capable of increasing electrical reliability at a low cost and a method for manufacturing the same.

  2. Description of the Related Art Conventionally, various liquid ejection devices that eject liquid have been provided. For example, there is known one provided with a nozzle (liquid ejection port) for ejecting ink, a pressure chamber communicating with the nozzle, and an actuator for ejecting ink from the nozzle by changing the volume of the pressure chamber.

  In such a liquid ejecting apparatus, in recent years, it is required to arrange nozzles at high density.

  Japanese Patent Application Laid-Open No. H10-228667 describes a case where a piezoelectric element drive wiring is formed on a vibration plate on which a piezoelectric element is arranged when a piezoelectric element is used as an actuator. The diaphragm is provided with an ink supply port that passes through a region outside the pressure chamber of the diaphragm and communicates with the pressure chamber, and the back of the pressure chamber (on the opposite side of the pressure chamber from the side where the nozzle is formed). In some cases, an ink supply tank is provided via a diaphragm, a piezoelectric element, and a recess. That is, it has a back channel structure for supplying ink from the back of the pressure chamber to the pressure chamber.

Japanese Patent Application Laid-Open No. H10-228561 describes a heater element drive wiring formed in a matrix for the purpose of increasing the mounting density of components when a heater element is used as an actuator.
JP 2001-179773 A JP-A-4-4152

  As described in Patent Document 1, when the piezoelectric element is arranged on the diaphragm and the rear flow path structure is used, drive wiring is avoided by avoiding the piezoelectric element so as not to hinder the operation of the piezoelectric element on the diaphragm. In addition, it is necessary to provide drive wiring while avoiding the ink supply port on the diaphragm. Therefore, when the drive wiring is arranged on the diaphragm at a high density, the piezoelectric element drive wiring must be formed very thin so as to avoid the piezoelectric element and the ink supply port on the diaphragm. There exists a subject that the electrical reliability of the drive wiring of an element will fall.

  In addition, the temperature adjustment of the liquid to be discharged is required for the purpose of preventing the influence of the external environment and canceling the viscosity variation. However, if a temperature control element is further arranged on the diaphragm, the temperature control In order to secure the element arrangement space, the drive wiring of the piezoelectric element must be made thinner.

  Furthermore, while aiming at high-density mounting, reduction of manufacturing cost is also demanded.

  The present invention has been made in view of such circumstances, and an object of the present invention is to provide a liquid discharge apparatus suitable for high-density mounting, low cost, and high electrical reliability, and a method for manufacturing the same.

  In order to achieve the object, the invention according to claim 1 includes a pressure chamber plate in which a pressure chamber communicating with a liquid discharge port is formed, a vibration plate disposed on the pressure chamber plate, A piezoelectric element in which a lower electrode, an active portion made of a piezoelectric material, and an upper electrode are sequentially stacked on a diaphragm, and a partition wall disposed around the diaphragm and around the active portion of the piezoelectric element A partition wall layer, a top plate disposed on the partition layer, and a common liquid chamber that is disposed on the top plate and supplies a liquid to the pressure chamber. Are a through-hole for supplying liquid from the common liquid chamber to the pressure chamber, a through-hole for wiring connection from the top surface of the top plate to the upper electrode of the piezoelectric element, and a through-hole for wiring connection Is filled with a conductive material and is connected to the upper electrode of the piezoelectric element. A connection portion and an upper connection electrode on the top surface of the top plate coupled to the filling connection portion and connected to the upper electrode of the piezoelectric element through the filling connection portion, and the activity of the piezoelectric element is formed. The plurality of portions are two-dimensionally arranged in the row direction and the column direction, and the lower electrode of the piezoelectric element is arranged in the row direction among the active portions of the plurality of piezoelectric elements arranged two-dimensionally. A plurality of the active portions are formed in common, and the upper connection electrode is provided in common in the plurality of active portions in the column direction among the active portions of the plurality of piezoelectric elements arranged two-dimensionally. A liquid ejection device, wherein the filling connection portion of the top plate and the upper connection electrode connected to the filling connection portion are integrally formed of the same conductive material. provide.

  Note that “row direction” and “column direction” mean two different directions, and the directions formed by the directions and the two directions are not particularly limited. For example, the “row direction” may be a direction perpendicular to or parallel to the relative movement direction of the liquid ejection port and the medium to be ejected. For example, the angle formed by the “row direction” and the “column direction” may be smaller than 90 degrees.

  In this liquid ejection device, a top plate is disposed on a vibration plate via a partition layer that forms a partition around the active portion of the piezoelectric element, and the back surface of the pressure chamber is provided through a liquid supply through-hole on the top plate. Since the backside flow channel structure is used to supply liquid from the pressure chamber to the pressure chamber, the pressure chamber and liquid outlets are made more dense compared to the case where the flow channel leading to the pressure chamber is provided on the side of the pressure chamber. Can be achieved. In addition, due to the back channel structure, the flow path from the common liquid chamber to the pressure chamber can be shortened and the curvature can be reduced, so that the liquid refilling from the common liquid chamber to the pressure chamber is improved and high viscosity liquid can be discharged. As well as the advantage of improving the elimination of bubbles in the pressure chamber.

  In such a back channel structure, the lower electrode of each piezoelectric element is formed on the diaphragm in common with the active portions of the plurality of piezoelectric elements in the row direction, and the upper electrode of the piezoelectric element is An upper connection electrode on the top surface of the top plate is connected via a filling connection portion in which a conductive material is filled in a through hole for wiring connection of the plate, and the upper connection electrode is connected to a plurality of piezoelectric elements in the column direction on the top plate. The active portions of the elements are provided in common. That is, a matrix wiring structure in which the row direction wiring constituted by the lower electrode of the piezoelectric element and the column direction wiring constituted by the upper connection electrode are divided on the diaphragm and the top plate across the partition wall layer. Yes. Therefore, even if the piezoelectric elements are arranged on the diaphragm at a high density and a space for restraining the displacement of the piezoelectric elements is provided on the piezoelectric elements, the lower electrodes of the piezoelectric elements as the row wiring and the column wirings Both upper connection electrodes can secure a sufficient wiring width regardless of the space on the piezoelectric element, so it was necessary to wire the high-density wiring to avoid the piezoelectric element on the diaphragm. The electrical reliability is higher than that. Specifically, in the case of an M × N arrangement in which M active portions of the piezoelectric element are arranged in the row direction and N pieces are arranged in the column direction, the lower electrode of the piezoelectric element is placed on the diaphragm on the space above the piezoelectric element. Regardless of the arrangement, M lines are arranged in the row direction, and N upper connection electrodes are arranged on the top plate in the column direction regardless of the space on the piezoelectric element, and the wiring density becomes extremely low. In addition, the electrical resistance is reduced, the electrical reliability is improved, and the yield in the manufacturing process can be improved. In addition, since the total number of wirings can be reduced to M + N, there is an advantage that the number of connection points is reduced and connection reliability is improved, and the number of SWICs (switch integrated circuits) can be reduced, thereby reducing costs. There are also benefits.

  In addition, the filling connection part of the top plate and the upper connection electrode connected to the filling connection part can be formed in a single process using the same conductive material, thus reducing the manufacturing cost due to the process reduction. it can.

  As mentioned above, due to the low wiring density, the top plate is made thin by using an inexpensive and difficult-to-break material such as resin instead of an expensive and easy-to-break material such as silicon or glass used in the semiconductor process. It is possible to reduce the aspect of the through hole for wiring connection (ratio of the length to the width of the through hole), so that the upper connection electrode on the top surface of the top plate and the wiring connection of the top plate can be used. Low cost methods such as screen printing and plating can be adopted as a single process that simultaneously fills the through hole with conductive material, and the degree of freedom of the material for the top plate is increased, making it possible to reduce the cost and increase the size of the substrate. Can be used. That is, mass production using an inexpensive manufacturing process and an inexpensive material is possible, and manufacturing cost can be reduced.

  Moreover, in this liquid discharge apparatus, since sufficient space is made on a top plate, it becomes possible to arrange | position electric elements other than an electrode on a top plate.

  The invention according to claim 2 is the invention according to claim 1, wherein a plurality of temperature control elements for adjusting the temperature of the liquid supplied to the pressure chamber are arranged on the top plate. A liquid ejection apparatus is provided.

  For example, by arranging heater elements on the top plate as temperature control elements, the temperature of the liquid in the immediate vicinity of each pressure chamber can be raised, thereby adjusting the viscosity of the liquid in each pressure chamber. Further, by arranging the Peltier elements as temperature control elements on the top plate, the temperature of the liquid in the immediate vicinity of each pressure chamber can be lowered, thereby eliminating bubbles in each pressure chamber. Heating and cooling may be selectively performed by a Peltier element. You may arrange | position both a heater element and a Peltier element on a top plate.

  The temperature adjustment element may be driven on the entire surface of the top plate to adjust the temperature of the entire common liquid chamber and the temperature of all the pressure chambers. On the other hand, the temperature control element may be partially driven on the top plate to reduce the temperature gradient in the common liquid chamber and the temperature gradient between all pressure chambers.

  According to a third aspect of the invention, in the invention of the second aspect, the temperature control element is formed so as to surround the liquid supply through hole of the top plate. Providing the device.

  In addition to the temperature control element, a temperature sensor such as a thermistor may be disposed on the top plate.

  According to a fourth aspect of the present invention, there is provided a pressure chamber plate in which a pressure chamber communicating with a liquid discharge port is formed, a diaphragm disposed on the pressure chamber plate, a diaphragm disposed on the diaphragm, A piezoelectric element in which an electrode, an active portion made of a piezoelectric material, and an upper electrode are sequentially stacked; and a partition layer disposed on the diaphragm and constituting a partition around the active portion of the piezoelectric element; In the method of manufacturing a liquid ejection device including a common liquid chamber that stores liquid supplied to the pressure chamber, the top plate is disposed on the partition layer, and the top plate is disposed on the top plate. Forming a top plate having a through hole for supplying liquid from a common liquid chamber to the pressure chamber, and a through hole for wiring connection from the upper surface of the top plate to the upper electrode of the piezoelectric element; A plurality of the active portions of the piezoelectric element are arranged two-dimensionally in the row and column directions And forming the lower electrode of the piezoelectric element in common in the plurality of active parts in the row direction among the active parts of the plurality of piezoelectric elements arranged two-dimensionally, Filling the through hole for wiring connection with the same conductive material as that filled in the through hole for wiring connection on the top surface of the top plate at the same time as filling the conductive material into the through hole for wiring connection, The filling connection portion connected to the upper electrode of the piezoelectric element and the active portion of the plurality of piezoelectric elements arranged two-dimensionally are arranged in a column direction. An upper connection electrode on the top surface of the top plate that is provided in common for the plurality of active portions and is connected to the filling connection portion and connected to the upper electrode of the piezoelectric element via the filling connection portion is integrally formed. A liquid discharge characterized by comprising: To provide a method of manufacturing a device.

  According to the present invention, it is suitable for high-density mounting and can increase electrical reliability at low cost.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[Basic overall structure of the liquid discharge head]
FIG. 1 is a plan perspective view showing an example of a basic overall structure of a liquid discharge head 50 as a liquid discharge apparatus according to the present invention.

  A liquid discharge head 50 shown as an example in FIG. 1 is a so-called full-line type head, and is a direction (arrow L in the figure) orthogonal to the transport direction of the medium 16 (sub-scanning direction indicated by arrow S in the figure). A structure in which a large number of nozzles 51 (liquid ejection ports) that eject liquid toward the ejection medium 16 are two-dimensionally arranged over a length corresponding to the width Wm of the ejection medium 16 in the main scanning direction shown in FIG. have.

  The liquid ejection head 50 includes a nozzle 51, a pressure chamber 52 communicating with the nozzle 51, and a plurality of pressure chamber units 54 including a liquid supply port 53 with respect to the main scanning direction L and the main scanning direction L. They are arranged along two oblique directions C that form a predetermined acute angle θ (0 degree <θ <90 degrees). In FIG. 1, only a part of the pressure chamber units 54 is illustrated for convenience of illustration.

  Specifically, the nozzles 51 are arranged at a constant pitch d in an oblique direction C that forms a predetermined acute angle θ with respect to the main scanning direction L, so that the nozzles 51 are aligned on a straight line along the main scanning direction L. It can be handled equivalently to those arranged at intervals of “d × cos θ”.

  For convenience of explanation, hereinafter, the main scanning direction L is described as a “row direction”, and an oblique direction C that forms a predetermined acute angle θ with respect to the main scanning direction L is described as a “column direction”. In the present invention, “row direction” and “column direction” mean two different directions, and are not particularly limited to the main scanning direction L and the oblique direction C shown in FIG.

  Hereinafter, the liquid discharge head will be described in detail for each embodiment.

[First Embodiment]
2A and 2B are cross-sectional views showing a vertical cross section of the liquid ejection head 50a according to the first embodiment. 2A shows a vertical cross section along the line AA in FIG. 1, and FIG. 2B shows a vertical cross section along the line BB in FIG. For convenience of illustration, the three nozzles 51 and the pressure chambers 52 are drawn in the row direction L, but the number of these is not particularly limited.

  2A and 2B, the liquid discharge head 50a is arranged on the nozzle plate 21 on which a plurality of nozzles 51 (liquid discharge ports) are formed, and the plurality of pressure chambers 52. The formed pressure chamber plate 22, the vibration plate 23 disposed on the pressure chamber plate 22 and constituting the upper wall of each pressure chamber 52, and a plurality of piezoelectric elements 24 disposed on the vibration plate 23. A partition layer 25 disposed on the diaphragm 23 and constituting the partition 250 around each piezoelectric element 24; a top plate 26 disposed on the partition layer 25; and a protective layer on the top plate 26. 27, including a common liquid chamber 55 arranged via

  The nozzles 51 are two-dimensionally arranged along the two directions of the row direction L and the column direction C as shown in FIG. The pressure chambers 52 communicating with the nozzles 51 are also two-dimensionally arranged along the two directions of the row direction L and the column direction C, similarly to the nozzles 51.

  The piezoelectric element 24 includes a lower electrode 56 made of a conductive material, an active portion 58 (piezoelectric body) made of a piezoelectric material such as PZT (lead zirconate titanate), and an upper portion made of a conductive material. The electrode 57 is formed by being sequentially laminated.

  FIG. 3 shows the upper surface of the diaphragm 23 on which the piezoelectric element 24 is disposed. The active portions 58 of the piezoelectric elements 24 correspond to the pressure chambers 52 on a one-to-one basis, and a plurality of the active portions 58 are two-dimensionally arranged along the two directions of the row direction L and the column direction C, similarly to the pressure chambers 52. The plurality of lower electrodes 56 of the piezoelectric element 24 are formed in common by the plurality of active portions 58 in the row direction L among the plurality of active portions 58 arranged two-dimensionally along the two directions of the row direction L and the column direction C. Has been. The upper electrodes 57 of the piezoelectric element 24 are formed on the active portion 58 on a one-to-one basis, and a plurality of the upper electrodes 57 are two-dimensionally arranged along two directions of the row direction L and the column direction C.

  2A and 2B, the common liquid chamber 55 stores liquid and supplies the liquid to the plurality of pressure chambers 52. In this example, a downwardly concave IC substrate 28 is bonded onto the top plate 26, and a common liquid chamber 55 is configured by the IC substrate 28. On the IC substrate 28, electronic components (not shown) such as SWIC (switch integrated circuit) that switches the driving piezoelectric element 24 and the temperature control element 35 to be driven are mounted.

  On the top surface of the top plate 26, there is an upper connection electrode 32 (first top plate top surface electrode) connected to the upper electrode 57 of the piezoelectric element 24 and a lower connection electrode connected to the lower electrode 56 of the piezoelectric element 24. 34 (second top plate upper surface electrode) is formed. In this example, the lower connection electrode 34 is formed on the top plate 26. However, the present invention is not limited to such a case. For example, the lower connection electrode 34 may be formed on the side surface of the liquid ejection head 50a. Good.

  In order to supply liquid from the common liquid chamber 55 to the pressure chamber 52, the top plate 26, the partition wall layer 25, and the vibration plate 23 are provided with through holes 261 and 251 for supplying liquid, respectively, as shown in FIG. 231 penetrates. An individual flow path 530 extending from the common liquid chamber 55 to the liquid supply port 53 of each pressure chamber 52 is configured including these liquid supply through holes 261, 251, and 231. The individual flow path 530 and the common liquid chamber 55 constitute a back flow path for supplying liquid from the side opposite to the pressure chamber 52 where the nozzle 51 is disposed (discharge surface 510 side). .

  Further, for wiring connection from the upper surface of the top plate 26 to the upper electrode 57 of the piezoelectric element 24, as shown in FIG. 2A in particular, the top plate 26 has a through hole 262 for wiring connection. . The wiring connection through hole 262 is filled with a conductive material to form a filling connection portion 31 connected from the upper surface of the top plate 26 to the upper electrode 57 of the piezoelectric element 24. Specifically, the wiring connection recess 252 on the upper electrode 57 of the piezoelectric element 24 as well as the wiring connection through hole 262 of the top plate 26 (a plan view of the recess 252 is shown in FIG. 8A). The conductive material is filled, and the filling connection portion 31 extends downward from the lower surface of the top plate 26 and reaches the upper electrode 57 of the piezoelectric element 24. The upper connection electrode 32 on the top plate 26 is connected to the filling connection portion 31 for the upper electrode 57, and is connected to the upper electrode 57 of the piezoelectric element 24 through the filling connection portion 31. The upper connection electrode 32 and the filling connection portion 31 for the upper electrode 57 are integrally formed of the same conductive material.

  Further, in this example, the lower connection electrode 34 is disposed on the upper surface of the top plate 26 for wiring connection to the lower electrode 56 of the piezoelectric element 24, and therefore, the lower electrode 56 of the piezoelectric element 24 from the upper surface of the top plate 26. In particular, as shown in FIG. 2A, the top plate 26 and the partition wall layer 25 have through-holes 263 and 253 for wiring connection, respectively. These wiring connection through holes 263 and 253 are also filled with a conductive material to form a filling connection portion 33 connected to the lower electrode 56 of the piezoelectric element 24. The lower connection electrode 34 on the top plate 26 is connected to the filling connection portion 33 for the lower electrode 56, and is connected to the lower electrode 56 of the piezoelectric element 24 through the filling connection portion 33. The lower connection electrode 34 and the filling connection portion 33 for the lower electrode 56 are integrally formed of the same conductive material.

  In addition, on the top surface of the top plate 26, temperature control elements 35 that can be individually driven for adjusting the temperature of the liquid supplied to each pressure chamber 52 are arranged.

  Examples of the temperature control element 35 include a heater element and a Peltier element. When a heater element is used as the temperature control element 35, the amount of heat generated is changed according to the amount of current flowing through the heater element, and the liquid is heated. When a Peltier element is used as the temperature control element 35, there are a mode in which only the liquid is cooled and a mode in which the liquid is heated and cooled selectively. It is possible to provide both the heater element and the Peltier element as the temperature control element 35.

  The upper surface of the top plate 26 is shown in FIG. The upper connection electrode 32 is provided in common by the plurality of active portions 58 in the column direction C among the plurality of active portions 58 in FIG. 3 that are two-dimensionally arranged in the row direction L and the column direction C. .

  The temperature control element 35 is provided in common among the plurality of pressure chambers 52 in the column direction C among the plurality of pressure chambers 52 in FIG. 1 that are two-dimensionally arranged in the two directions of the row direction L and the column direction C. . In other words, the temperature control element 35 is arranged on the top plate 26 in parallel with the upper connection electrode 32, one in each row, and alternately with the upper connection electrode 32. As described above, the temperature adjustment element 35 is disposed on the top plate 26 so that the area other than the electrodes on the top plate 26 can be effectively used and the temperature gradient of the liquid in the common liquid chamber 55 can be corrected efficiently. Has been. Further, since the temperature adjustment element 35 is disposed in the vicinity of the liquid supply through-hole 261 of the top plate 26, the temperature of the liquid in the pressure chamber 52 can be adjusted efficiently.

  Although illustration is omitted, a temperature sensor may be further arranged on the top plate 26.

  2A and 2B, on the top plate 26, the upper connection electrode 32 and the temperature control element 35 are arranged at least on the top plate 26 of the common liquid chamber 55 (shown by dotted lines in FIG. 4). 550) is covered with an insulating protective film 27 so as to cover it. This protective film 27 prevents the upper connection electrode 32 and the temperature control element 35 on the top plate 26 from coming into contact with the liquid in the common liquid chamber 55, and also causes a wiring short due to condensation or adhesion of dust due to environmental changes. Prevent such as.

  The manufacturing process of the liquid ejection head 50a in the first embodiment will be described in detail mainly using the manufacturing flow of FIGS. 5, 6, and 7, a vertical cross section along the row direction L (a vertical cross section along the line AA in FIG. 1) is drawn.

  First, as shown in FIG. 5A, the pressure chamber plate 22 and the diaphragm 23 separately manufactured by etching or machining are joined by diffusion bonding or the like.

  A pressure chamber 52 and a liquid supply port 53 are formed in the pressure chamber plate 22, and a through-hole 231 for supplying a liquid from the common liquid chamber 55 to the pressure chamber 52 is formed in the vibration plate 23. . The pressure chambers 52 are two-dimensionally arranged along the two directions of the row direction L and the column direction C as shown in FIG. The liquid supply through-holes 231 of the diaphragm 23 are also two-dimensionally arranged along the two directions of the row direction L and the column direction C as shown in FIG.

  Next, as shown in FIG. 5B, a protective film made of a thin film is formed on the exposed surfaces of the joined pressure chamber plate 22 and diaphragm 23 for the purpose of insulation, prevention of diffusion, and ensuring liquid resistance. . This protective film is not shown.

  Next, as shown in FIG. 5C, the lower electrode 56 made of a conductive material is formed on the diaphragm 23 protected by the protective film by sputtering, screen printing, plating, or the like. The lower electrodes 56 are arranged along the row direction L as shown in FIG.

  Next, as shown in FIG. 5D, the lower electrode 56 is made of a piezoelectric material such as PZT (lead zirconate titanate) by sputtering, AD (aerosol deposition) method, or screen printing. The active part 58 is formed. The active portions 58 are two-dimensionally arranged along the two directions of the row direction L and the column direction C as shown in FIG.

  Next, as shown in FIG. 5E, an upper electrode 57 made of a conductive material is formed on the active portion 58 by sputtering, vapor deposition, screen printing, or plating. The upper electrodes 58 are two-dimensionally arranged along the two directions of the row direction L and the column direction C as shown in FIG.

  The lower electrode 56, the piezoelectric body 58 and the upper electrode 57 constitute the piezoelectric element 24. As shown in FIG. 3, the lower electrode 56 is provided in common to the plurality of active portions 58 in the row direction L, while the upper electrode 57 is provided one-to-one with respect to the active portion 58.

  Next, as shown in FIG. 5F, a partition layer 25 constituting a partition around the active portion 58 of the piezoelectric element 24 is formed of resin.

  A liquid supply through-hole 251 for supplying liquid from the common liquid chamber 55 to the pressure chamber 52 is formed in the partition wall layer 25. The through hole 251 is aligned with the liquid supply through hole 231 of the diaphragm 23. Further, on the upper electrode 57 of the piezoelectric element 24, a concave portion 252 for wiring connection from the upper surface of the top plate 26 to the upper electrode 57 of the piezoelectric element 24, and piezoelectric element protection for securing a space on the piezoelectric element 24. And a recess 254 for forming. Further, a through hole 253 for wiring connection from the upper surface of the top plate 26 to the lower electrode 56 of the piezoelectric element 24 is formed in the partition wall layer 25.

  In addition, as shown in FIG. 5G, the top plate 26 is separately manufactured by resin molding or machining. The top plate 26 includes a through hole 261 for supplying liquid from the common liquid chamber 55 to the pressure chamber 52, a through hole 262 for wiring connection from the upper surface of the top plate 26 to the upper electrode 57 of the piezoelectric element 24, A through-hole 263 for wiring connection from the upper surface of the plate 26 to the lower electrode 56 of the piezoelectric element 24 is formed.

  Next, as shown in FIG. 5H, the top plate 26 is bonded onto the partition wall layer 25 by adhesion or fusion. Here, the liquid supply through-hole 261 of the top plate 26 is aligned with the liquid supply through-hole 251 of the partition wall layer 25. Further, the through holes 262 and 263 for wiring connection of the top plate 26 are aligned with the concave portions 252 and the through holes 253 for wiring connection of the partition wall layer 25, respectively.

  Next, as shown in FIG. 6A, the conductive material is filled in the through holes 262 and the recesses 252 for wiring connection on the upper electrode 57 of the piezoelectric element 24 by vacuum printing, and at the same time, the same conductive material. Is also attached to the upper surface of the top plate 26. Thus, the filling connection portion 31 and the upper connection electrode 32 connected to the upper electrode 57 of the piezoelectric element 24 are integrally formed of the same conductive material.

  Here, in vacuum printing, the structure 20H shown in FIG. 5 (H) is placed in a chamber, and the inside of the chamber is subjected to screen printing so that bubbles are generated in the filling connection portions 31 and 33. The wiring connection is performed without causing the connection.

  Specifically, as shown in FIG. 8B, a screen 91 is formed on a region other than the region where the top plate upper surface electrode 32 is formed, and is in a substantially vacuum state, as shown in FIG. As described above, the conductive paste 93 is filled into the through-hole 262 for wiring connection using the squeegee 92 and attached to the formation region of the upper connection electrode 32. The conductive paste filled in the through hole 262 for wiring connection also fills the wiring connection recess 252 of the partition wall layer 25 and reaches the upper electrode 57 of the piezoelectric element 24 without generating bubbles. . Thereafter, the screen 91 is removed on the top plate 26.

  Further, the filling connection portion 33 and the lower connection electrode 34 connected to the lower electrode 56 of the piezoelectric element 24 are also integrally formed of the same conductive material.

  Next, as shown in FIG. 6B, the temperature adjustment element 35 is formed on the top plate 26. The temperature control element 35 is formed by a well-known method in semiconductor manufacturing. A separately manufactured temperature control element 35 may be bonded onto the top plate 26 with an adhesive.

  Next, as shown in FIG. 6C, a protective film 27 made of an insulating material is formed on the top plate 26 by photolithography, screen printing, or the like.

  Further, as shown in FIG. 6D, a nozzle plate 21 having nozzles 51 is separately manufactured by etching, electroforming, pressing, laser processing, or the like.

  Next, as shown in FIG. 6E, the nozzle plate 21 is joined to the structure 20K in FIG. 6C by adhesion, diffusion bonding, or the like.

  Next, as shown in FIG. 7A, a downwardly concave IC substrate 28 is separately manufactured. This IC substrate 28 is mounted with electronic components such as SWIC for switching the piezoelectric element 24 and the temperature control element 33 and constitutes the upper wall and the side wall of the common liquid chamber 55.

  Next, as illustrated in FIG. 7B, the IC substrate 28 is bonded to the structure 20 </ b> M in FIG. 6E by bonding or the like to form the common liquid chamber 55.

  Next, as shown in FIG. 7C, an electronic component such as SWIC 29 is mounted on the IC substrate 28, and the SWIC 29 on the IC substrate 28 and the electrode on the top plate 26 are connected by wire bonding. In FIG. 7C, for convenience of illustration, the state of wire bonding connection between the lower connection electrode 34 and the SWIC 29 is depicted, but actually, between the upper connection electrode 32 and the SWIC 29, and Wire bonding connection is similarly performed between the temperature control element 35 and the SWIC 29.

  In the liquid ejection head 50 a according to the present embodiment, the top plate 26 is disposed on the vibration plate 23 via the partition layer 25 that forms the partition 250 around the active portion 58 of the piezoelectric element 24. Since the back surface flow path structure in which the liquid is supplied from the back surface of the pressure chamber 52 to the pressure chamber 52 through the through-hole 261, a flow path to the pressure chamber 52 is provided on the side of the pressure chamber 52. Compared to the case, the density of the pressure chamber 52 and the nozzle 51 can be increased. Further, due to the back surface flow path structure, the flow path from the common liquid chamber 55 to the pressure chamber 52 can be shortened and the bend can be reduced, so that the refill property of the liquid from the common liquid chamber 55 to the pressure chamber 52 is improved and the high viscosity liquid is obtained. The advantage that the discharge of the air in the pressure chamber 52 is improved and the advantage that the bubbles in the pressure chamber 52 are eliminated are also obtained.

  In such a back surface flow path structure, the lower electrode 56 of each piezoelectric element 24 is formed on the diaphragm 23 in common by the active portions 58 of the plurality of piezoelectric elements 24 in the row direction. An upper connection electrode 32 is connected to the upper electrode 57 through a filling connection portion 31 in which a conductive material is filled in a through hole 261 for wiring connection of the top plate 26, and the upper connection is provided on the top plate 26. The electrode 32 is provided in common by the active portions 58 of the plurality of piezoelectric elements 24 in the column direction. That is, a matrix in which the lower electrode 56 of the piezoelectric element 24 as the row direction wiring and the upper connection electrode 32 as the column direction wiring are wired separately on the diaphragm 23 and the top plate 26 with the partition wall layer 25 interposed therebetween. It has a wiring structure. Therefore, even if the piezoelectric elements 24 are arranged at a high density on the diaphragm 23 in order to increase the density of the nozzles 51 and a space for not restricting the displacement of the piezoelectric elements 24 is provided on the piezoelectric elements 24, the row direction wiring Since both the lower electrode 56 of the piezoelectric element 24 and the upper connection electrode 32 as the column-direction wiring can sufficiently secure a width regardless of the space on the piezoelectric element 24, the piezoelectric element 24 is avoided. Compared with a conventional device that has to be wired on the diaphragm 23 at a high density, the electrical reliability is increased. Specifically, in the case of M × N arrangement in which M active portions 58 of the piezoelectric element 24 are arranged in the row direction and N pieces are arranged in the column direction, the lower electrode 56 of the piezoelectric element 24 is formed on the diaphragm 23. It is only necessary to arrange M in the row direction and N upper connection electrodes 32 in the column direction on the top plate 26. Since the wiring density becomes extremely low, the wiring can be made thicker and the electrical resistance can be reduced. In addition, the reliability in the manufacturing process can be improved. Further, since the number of wirings is reduced, there can be obtained an advantage that the connection reliability is improved by reducing the number of connection points, and an advantage that the number of SWICs 29 can be reduced and the cost can be reduced.

  Moreover, since the filling connection part 31 of the top plate 26 and the upper connection electrode 32 connected to the filling connection part 31 can be formed in a single process using the same conductive material, it is manufactured by reducing the number of processes. Cost can be reduced.

  Due to the low wiring density as described above, the top plate 26 is not made of an expensive and fragile material such as silicon or glass used in the semiconductor process but an inexpensive and difficult to break material such as a resin. Since the thickness of the through hole 262 for wiring connection can be reduced (the ratio of the length to the width of the through hole), the upper connection electrode 32 can be formed and the top plate 26 can be connected to the wiring. A low cost method such as screen printing or plating can be adopted as a single process for simultaneously filling the through hole 262 with the conductive material, and the degree of freedom of the material of the top plate 26 is increased, so that the large substrate can be obtained. It is possible to adopt a material that can be converted into a material. That is, mass production using an inexpensive manufacturing process and an inexpensive material is possible, and manufacturing cost can be reduced.

  Further, in the present liquid discharge head 50a, since a sufficient space is formed on the top plate 26, the temperature adjustment element 35 and the like can be disposed on the top plate 26 as electric elements other than the electrodes.

  Plate portions other than the piezoelectric element 24 (nozzle plate 21, pressure chamber plate 22, diaphragm 23, partition layer 25, top plate 26, IC substrate 28) can be made of the same material. When the plate parts are made of the same material, it is possible to reduce the occurrence of warpage due to the difference in linear expansion. Further, if the number of members is reduced by molding or the like, the cost can be reduced.

  The forming member of the common liquid chamber 55 can be manufactured in large quantities at low cost by resin molding.

  The partition wall layer 25 that protects the active portion 58 of the piezoelectric element 24 can be formed on the back side of the top plate 26 by molding. In this case, patterning is not necessary, and a simple process such as adhesive transfer bonding can be employed, thereby further reducing the cost.

[Second Embodiment]
9A and 9B are cross-sectional views illustrating a vertical cross section of an example of the liquid ejection head 50b in the second embodiment. 9A shows a vertical cross section along the line AA in FIG. 1, and FIG. 9B shows a vertical cross section along the line BB in FIG. For convenience of illustration, the three nozzles 51 and the pressure chambers 52 are drawn in the row direction L, but the number of these is not particularly limited. The same components as those of the liquid ejection head 50a according to the first embodiment shown in FIGS. 2A and 2B are denoted by the same reference numerals, and the description of the contents already described is omitted.

  The top surface of the top plate 26 is shown in FIG. The temperature control element 35 is formed on the top plate 26 so as to surround the liquid supply through-hole 261 of the top plate 26. The temperature control element 35 corresponds to each pressure chamber 52 on a one-to-one basis, and is arranged on the same number of top plates 26 as the pressure chambers 52. In other words, a plurality of temperature control elements 35 are two-dimensionally arranged along the two directions of the row direction L and the column direction C, similarly to the pressure chamber 52 shown in FIG.

  The temperature control element 35 is configured by, for example, a Peltier element. Each temperature control element 35 can be driven individually, and by cooling the liquid supplied from the common liquid chamber 55 to the specific pressure chamber 52, bubbles mixed in the specific pressure chamber 52 can be dissolved. Further, by heating the liquid supplied from the common liquid chamber 55 to the specific pressure chamber 52, the viscosity of the liquid in the specific pressure chamber 52 can be reduced, and the discharge variation between the nozzles 51 can be reduced. Further, by heating the liquid in each through hole 261 for supplying liquid, the refill characteristic of the liquid into the pressure chamber 52 can be improved, which is advantageous for discharging a high viscosity liquid.

  The upper connection electrode 32 on the top plate 26 connected to the upper electrode 57 of the piezoelectric element 24 extends from the position where the filling connection portion 31 is formed to the position where the liquid supply through hole 261 is formed on the top plate 26. The lower electrode of the temperature control element 35 is configured. That is, the upper connection electrode 32 is shared by the piezoelectric element 24 and the temperature adjustment element 35. By sharing in this way, each temperature control element 35 can be driven individually by adding the upper electrode 36 for the temperature control element 35 and without adding the lower electrode of the temperature control element 35.

  9A and 9B show the case where the upper electrode 36 of the temperature adjustment element 35 is provided apart from the lower connection electrode 34, but as shown in the sectional view of FIG. The upper electrode 36 of the adjustment element 35 may be short-circuited to the lower connection electrode 34.

  FIG. 11 is a cross-sectional view showing a liquid discharge head 50c having a configuration in which the upper electrode 36 of the temperature control element 35 is short-circuited to the lower connection electrode 34, and shows a vertical cross section along the line BB in FIG. The configuration other than the electrode short circuit is the same as that of the liquid discharge head 50b shown in FIG. In the case of such an electrode short circuit, the temperature of the liquid supply through-hole 261 corresponding to the nozzle 51 to be discharged can be adjusted simultaneously with the driving of the piezoelectric element 24.

  By thus short-circuiting the upper electrode 36 and the lower connection electrode 34 of the temperature control element 35, the temperature control element 35 can be simultaneously driven using the drive signal of the piezoelectric element 24. The temperature adjustment element 35 is driven simultaneously with the liquid discharge, and the temperature of the liquid supplied to the pressure chambers 52 through the liquid supply through holes 261 is adjusted. For example, various uses such as improvement of refill property, dissolution of bubbles, and adjustment of viscosity are possible.

  Hereinafter, the manufacturing process of the liquid discharge head 50c shown in FIG. 11 will be described in detail.

  First, as described in the first embodiment with reference to FIGS. 5A to 5H, the pressure chamber plate 22, the vibration plate 23, the piezoelectric element 24, the partition wall layer 25, and the top plate 26 shown in FIG. ) Structure 20H. The manufacturing process so far is substantially the same as the manufacturing process of the liquid ejection head 50a in the first embodiment.

  Next, as shown in FIG. 12A, the through hole 262 and the recess 252 on the upper electrode 57 of the piezoelectric element 24 are filled with the conductive material by vacuum printing, and at the same time, the same conductive material is applied to the top plate 26. Also attach to the top surface of the. Thus, the filling connection portion 31 and the upper connection electrode 32 connected to the upper electrode 57 of the piezoelectric element 24 are integrally formed of the same conductive material. In the second embodiment, the upper connection electrode 32 extends from the position where the filling connection portion 31 is formed to the position where the liquid supply through hole 261 is formed.

  Further, the filling connection portion 33 and the lower connection electrode 34 connected to the lower electrode 56 of the piezoelectric element 24 are also integrally formed of the same conductive material.

  Next, as shown in FIG. 12B, the temperature adjustment element 35 is formed on the top plate 26. In the second embodiment, the temperature control element 35 is formed on the upper connection electrode 32 extending to the position where the liquid supply through hole 261 is formed so as to surround the liquid supply through hole 261. The temperature control element 35 is formed by a well-known method in semiconductor manufacturing.

  Next, as shown in FIG. 12C, a protective film 27 is formed on the top plate 26 by photolithography, screen printing, or the like. Here, the protective film 27 is formed in a region on the top plate 26 excluding a region where the lower electrode connection portion 34 exists and a region where the temperature control element 35 exists.

  Next, as shown in FIG. 12D, the upper electrode 36 of the temperature control element 35 is formed by screen printing, plating, or the like. Here, the upper electrode 36 and the lower connection electrode 34 of the temperature control element 35 are short-circuited.

  Next, as shown in FIG. 12E, an insulating protective film 38 is formed so as to cover the upper electrode 36 of the temperature control element 35 by photolithography, screen printing, or the like.

  The subsequent manufacturing process is the same as the manufacturing process in the first embodiment described with reference to FIGS. 6D and 7E and FIGS. 7A to 7C, and detailed description thereof is omitted here. .

  4 (a top view of the top plate 26 of the liquid discharge head 50a of the first embodiment) and FIG. 10 (a top view of the top plate 26 of the liquid discharge head 50b of the second embodiment). As shown in FIG. 13, the upper connection electrode 32 that is the wiring in the column direction C is not divided in the column direction C. However, as shown in FIG. May be. As a result, the number of nozzles that can be driven simultaneously can be increased by several times, and the printing speed can be increased.

  Further, as shown in FIG. 14, a long liquid discharge head 500 can be manufactured by separately manufacturing a structure composed of a nozzle plate 21 and the like, and then bonding the structure. Thereby, the accumulated error of the nozzle plate 21 that requires the highest accuracy can be reduced.

[Image forming apparatus]
FIG. 15 is a block diagram illustrating an outline of the overall configuration of an image forming apparatus 80 including the liquid ejection head 50 of FIG.

  In FIG. 15, an image forming apparatus 80 mainly includes a liquid ejection head 50, a communication interface 81, a system controller 82, memories 83a and 83b, a conveyance motor 84, a conveyance driver 840, a print control unit 85, a liquid supply unit 86, and a supply unit. The liquid control unit 860 and the head driver 87 are included.

  The image forming apparatus 80 includes a total of four liquid ejection heads 50 for each color of K (black), C (cyan), M (magenta), and Y (yellow).

  The communication interface 81 is image data input means for receiving image data transmitted from the host computer 89. A wired or wireless interface can be applied to the communication interface 81. The image data taken into the image forming apparatus 80 by the communication interface 81 is temporarily stored in the first memory 83a for storing the image data.

  The system controller 82 includes a central processing unit (CPU) and its peripheral circuits, and is main control means for controlling the entire image forming apparatus 80 according to a predetermined program. That is, the system controller 82 controls each unit such as the communication interface 81, the conveyance driver 840, the print control unit 85, and the like.

  The conveyance motor 84 applies power to a roller, a belt, or the like for conveying an ejection medium such as paper. By the conveyance motor 84, the medium to be ejected and the liquid ejection head 50 are relatively moved.

  The transport driver 840 is a circuit that drives the transport motor 84 in accordance with an instruction from the system controller 82.

  The liquid supply unit 86 includes a conduit and a pump for flowing ink from an ink tank (not shown) as ink storage means for storing ink to the liquid ejection head 50.

  The liquid supply control unit 86 performs control to supply ink to the liquid ejection head 50 using the liquid supply unit 86.

  The print control unit 85 causes the liquid discharge head 50 to discharge (drop droplets) toward the discharge medium based on the image data input to the image forming apparatus 80 to form dots on the discharge medium. Necessary data (dot data) is generated. That is, the print control unit 85 performs image processing such as various processes and corrections for generating dot ejection dot data from the image data in the first memory 83a in accordance with the control of the system controller 82. And the generated dot data is supplied to the head driver 87.

  The print controller 85 is accompanied by a second memory 83b, and dot data and the like are temporarily stored in the second memory 83b during image processing in the print controller 85.

  In FIG. 15, the second memory 83b is shown as being attached to the print control unit 85, but can also be used as the first memory 83b. Also possible is an aspect in which the print controller 85 and the system controller 82 are integrated and configured with one processor.

  The head driver 87 ejects a drive signal for ejection to the piezoelectric element 24 of the liquid ejection head 50 based on the dot data provided from the print control unit 85 (actually, the dot data is stored in the second memory 83b). Is output. By supplying the ejection drive signal output from the head driver 87 to the piezoelectric element 24 of the liquid ejection head 50, the liquid (droplet) is ejected from the nozzle 51 of the liquid ejection head 50 toward the ejection medium. .

  The nozzles 51 are two-dimensionally arranged as shown in FIG. That is, M pieces are arranged along the row direction L and N pieces are arranged along the column direction C. Similarly, M pressure chambers 52 and piezoelectric elements 24 are arranged in the row direction L and N in the column direction C. Here, when the position of the specific nozzle 51 is represented as (i, j), where 1 <i ≦ M and 1 <j ≦ N, the liquid is ejected from the nozzle 51 at the position (i, j). Applies a predetermined voltage for liquid ejection between the i-th upper connection electrode 32 in the row direction L and the lower electrode 56 of the j-th piezoelectric element 24 in the column direction C. That is, when a predetermined voltage for liquid ejection is applied between the upper electrode 57 and the lower electrode 56 of the piezoelectric element 24 located at the position (i, j), the pressure chamber 52 located at the position (i, j) The volume changes and the liquid is ejected from the nozzle 51 located at the position (i, j).

  The head driver 87 outputs a temperature adjustment drive signal to the temperature element 35 of the liquid ejection head 50. The temperature adjustment drive signal output from the head driver 87 is supplied to the temperature adjustment element 35 of the liquid discharge head 50, whereby the liquid supplied to the pressure chamber 52 of the liquid discharge head 50 (that is, the liquid discharged from the nozzle 51). ) Temperature is adjusted.

  In the liquid discharge head 50b shown in FIG. 9, as shown in FIG. 10, the number of temperature control elements 35 is M along the row direction L and N along the column direction C, like the nozzles 51 and the pressure chambers 52. In order to adjust the temperature of the liquid ejected from the nozzle 51 located at the position (i, j), the i-th upper connection electrode 32 (corresponding to the lower electrode of the temperature control element 35) in the row direction. And a predetermined voltage for temperature adjustment is applied between the upper electrode 36 of the j-th temperature adjustment element 35 in the column direction.

  In the liquid discharge head 50 c shown in FIG. 11, the temperature adjustment element 35 is driven using the drive signal of the piezoelectric element 24, so the head driver 87 only gives the drive signal of the piezoelectric element 24 to the liquid discharge head 50. It's okay.

  The present invention is not limited to the examples described in the present specification and the examples illustrated in the drawings, and various design changes and improvements may be made without departing from the spirit of the present invention.

FIG. 3 is a perspective plan view showing an example of a basic overall structure of a liquid discharge head. FIG. 3 is a cross-sectional view illustrating a vertical cross section of an example of a liquid discharge head according to the first embodiment. FIG. 3 is a plan view showing an upper surface of a diaphragm on which a piezoelectric element is formed in the liquid ejection head according to the first embodiment. It is a top view which shows the upper surface of the top plate in which the electrode and temperature control element in the liquid discharge head which concern on 1st Embodiment were formed. 6 is a first process diagram illustrating a manufacturing process of the liquid ejection head according to the first embodiment. FIG. FIG. 10 is a second process diagram illustrating the manufacturing process of the liquid ejection head according to the first embodiment. FIG. 10 is a third process diagram illustrating the manufacturing process of the liquid ejection head according to the first embodiment. It is explanatory drawing used for description of the manufacturing process of the liquid discharge head which concerns on 1st Embodiment. It is sectional drawing which shows the vertical cross section of an example of the liquid discharge head which concerns on 2nd Embodiment. It is a top view which shows the upper surface of the top plate in which the electrode and temperature control element in the liquid discharge head which concern on 2nd Embodiment were formed. It is sectional drawing which shows the vertical cross section of the other example of the liquid discharge head which concerns on 2nd Embodiment. FIG. 10 is a process diagram illustrating a manufacturing process of a liquid ejection head according to a second embodiment. It is explanatory drawing used for description of the electrode divided | segmented into the column direction. It is explanatory drawing used for description of a elongate liquid discharge head. 1 is an overall configuration diagram of an example of an image forming apparatus including a liquid discharge head.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 21 ... Nozzle plate, 22 ... Pressure chamber plate, 23 ... Vibration plate, 24 ... Piezoelectric element, 25 ... Partition wall layer, 26 ... Top plate, 27 ... Insulating layer, 28 ... IC substrate, 31 ... Filling connection part, 32 ... Upper part Connection electrode (top plate upper surface electrode), 34 ... lower connection electrode, 35 ... temperature control element, 50 (50a, 50b, 50c) ..., 51 ... nozzle, 52 ... pressure chamber, 53 ... liquid supply port of pressure chamber, 55 ... Common liquid chamber, 56 ... Lower electrode of piezoelectric element, 57 ... Upper electrode of piezoelectric element, 58 ... Active part of piezoelectric element, 250 ... Partition wall, 231, 251, 261 ... Through hole for supplying liquid, 252 ... Wiring connection 262... Through hole for wiring connection, 510... Discharge surface, 530.

Claims (4)

A pressure chamber plate in which a pressure chamber communicating with the liquid discharge port is formed;
A diaphragm disposed on the pressure chamber plate;
A piezoelectric element that is disposed on the diaphragm and in which a lower electrode, an active portion made of a piezoelectric material, and an upper electrode are sequentially laminated;
A partition layer disposed on the diaphragm and constituting a partition around the active portion of the piezoelectric element;
A top plate disposed on the partition layer;
A common liquid chamber disposed on the top plate for supplying liquid to the pressure chamber;
With
The top plate includes a through-hole for supplying liquid from the common liquid chamber to the pressure chamber, a through-hole for wiring connection from the top surface of the top plate to the upper electrode of the piezoelectric element, and the wiring connection A through hole for filling a conductive material filled with a conductive material and connected to the upper electrode of the piezoelectric element; and the upper part of the piezoelectric element connected to the filled connection part via the filled connection part An upper connection electrode on the top surface of the top plate connected to the electrode, and
The active portion of the piezoelectric element is two-dimensionally arranged in a row direction and a column direction,
The lower electrode of the piezoelectric element is formed in common in the plurality of active portions in the row direction among the active portions of the plurality of piezoelectric elements arranged two-dimensionally,
The upper connection electrode is provided in common in the plurality of active portions in the column direction among the active portions of the plurality of piezoelectric elements arranged two-dimensionally,
The liquid discharge apparatus according to claim 1, wherein the filling connection portion of the top plate and the upper connection electrode connected to the filling connection portion are integrally formed of the same conductive material.   The liquid ejection apparatus according to claim 1, wherein a plurality of temperature control elements that adjust the temperature of the liquid supplied to the pressure chamber are arranged on the top plate.   The liquid ejecting apparatus according to claim 2, wherein the temperature control element is formed so as to surround the liquid supply through hole of the top plate. A pressure chamber plate in which a pressure chamber communicating with the liquid discharge port is formed, a vibration plate disposed on the pressure chamber plate, a lower electrode disposed on the vibration plate, an active portion made of a piezoelectric material, And a piezoelectric element in which upper electrodes are sequentially laminated, a partition layer disposed on the diaphragm and constituting a partition around the active portion of the piezoelectric element, and supplying a liquid to the pressure chamber In a manufacturing method of a liquid ejection device provided with a common liquid chamber,
A top plate disposed on the partition layer, the through hole for supplying the liquid from the common liquid chamber to the pressure chamber disposed on the top plate, and the piezoelectric element from the top surface of the top plate Forming a top plate having a through hole for wiring connection to the upper electrode;
A plurality of the active portions of the piezoelectric elements are arranged two-dimensionally in a row direction and a column direction, and the lower electrodes of the piezoelectric elements are among the active portions of the plurality of piezoelectric elements arranged two-dimensionally. Forming in common in the plurality of active portions in the row direction;
Filling the through hole for wiring connection of the top plate with a conductive material, and simultaneously attaching the same conductive material to the top surface of the top plate to fill the through hole for wiring connection, thereby connecting the wiring A filling connection portion configured to be filled with a conductive material and connected to the upper electrode of the piezoelectric element, and the active portion of the plurality of piezoelectric elements arranged two-dimensionally An upper connection electrode on the top surface of the top plate, which is connected in common to the plurality of active portions in the column direction, and is connected to the upper electrode of the piezoelectric element via the filling connection portion. A process of integrally forming;
A method for manufacturing a liquid ejection apparatus, comprising:

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