JP4815192B2 - Electrical connection device - Google Patents

Description

  INDUSTRIAL APPLICABILITY The present invention is used for electrical connection between an electrical circuit such as an integrated circuit formed on a semiconductor wafer to be inspected and a tester performing the electrical inspection for electrical inspection of the electrical circuit. The present invention relates to an electrical connection device such as a probe card.

An electrical connection device such as a probe card is used for electrical inspection of an electrical circuit such as an integrated circuit formed on a semiconductor wafer.
Such an electrical connection device generally includes a probe substrate provided with a large number of electrical connection portions connected to a tester, and a large number of probes that abut the base ends on the substrate. When the tip of each probe is brought into contact with the electrode pad of the electric circuit of the device under test, the device under test and the tester are connected, and a predetermined electrical test is performed.

  By the way, this type of inspection includes a burn-in test accompanied by a high temperature environment. In such an inspection, the object to be inspected is placed under a high temperature, so that the coefficient of thermal expansion between the object to be inspected and the electrical connection device is low. Due to the difference, the tip of the probe may be detached from the electrode pad of the device under test.

  In order to prevent the probe tip from being displaced due to this difference in thermal expansion coefficient, it has been proposed that the support mechanism for supporting the tip of each probe is made of the same material as the thermal expansion coefficient of the device under test (patent) Reference 1). According to this, the vicinity of the tips of a large number of probes is supported by a ring-shaped member made of substantially the same material as the thermal expansion coefficient of the device under test on the one surface side of the substrate. The ring-shaped members are respectively coupled to a crosspiece coupled to the substrate on the other surface of the substrate at positions spaced in the circumferential direction of the ring-shaped member, Supported by the substrate.

Although this crosspiece is made of the same material as the ring-shaped member, it is disposed on the opposite side of the substrate where the ring-shaped member is disposed or on the back side of the ring-shaped member as viewed from the heat source. Therefore, a relatively large temperature difference occurs with the ring-shaped member, and therefore a relatively large expansion / contraction difference occurs between the crosspiece and the ring-shaped member. As a result, due to the difference in thermal shrinkage with this crosspiece, free expansion and contraction of the ring-shaped member coupled to the crosspiece at a circumferential interval with the temperature change corresponding to the object to be inspected is prevented. Therefore, the displacement of the probe tip cannot be reliably prevented.
Further, in order to securely hold the ring-shaped member, it is necessary to arrange a large number of fastening parts 510 for connecting the ring-shaped member to the crosspiece in the circumferential direction of the ring-shaped member. To be complicated.

  In addition, as a probe unit that can be applied when the arrangement pitch of the contacted parts of the object to be inspected is different, it has been proposed to incorporate a coil spring in the probe (see Patent Document 2). However, simply using such a probe cannot reliably prevent the displacement of the probe tip due to a temperature change of the object to be inspected.

Japanese Patent Laid-Open No. 11-83901 JP-A-6-201725

  Therefore, an object of the present invention is an electrical connection device that has a relatively simple structure and can reliably prevent the tip of each probe from being displaced from a predetermined position even by thermal expansion and contraction due to a temperature change of the object to be inspected. Is to provide.

An electrical connection device according to the present invention is provided with a wiring path to be connected to a tester, and a base plate having a plurality of electrical connection portions connected to the tester via the wiring path formed on one surface, and a base end Are arranged on the one surface of the substrate, and a plurality of probes, the tips of which are electrically connected to the corresponding electrical connection portions and whose tips are in contact with the electrode pads of the device under test, A holding plate for holding the substrate, and the holding plate is disposed along the substrate so that one surface thereof faces the one surface of the substrate, and the base end of the probe corresponds to the one surface. A base plate member formed with a through hole for positioning in the electrical connecting portion; and a through hole for positioning the tip of the probe to the corresponding electrode pad of the object to be inspected and aligned with the through hole; Along the other side of the member It has a placed guide plate member, a laminated structure and a deployed intermediate plate member between the guide plate member and said base plate member Te, said guide plate member is made of a ceramic plate, the central The portion is connected to the base plate member at a portion, and heat expansion and contraction along the base plate member in a portion excluding the central portion is freely possible. In the intermediate plate member, a plurality of long grooves penetrating in the plate thickness direction so as to receive a plurality of probes and extending substantially perpendicular to the penetration direction on the surface of the intermediate plate member are formed in parallel to each other , According to the guide action of the through hole of the guide plate member, the probe penetrating through the through hole can be flexibly deformed with the thermal expansion and contraction of the guide plate member .

  In the electrical connection device according to the present invention, the proximal end of the probe is securely held in the corresponding electrical connection portion by the through hole of the base member, while the distal end of the probe is the guide plate member Through the through holes, the corresponding electrode pads are surely positioned. The guide plate member exhibits a thermal expansion / contraction amount substantially equal to the thermal expansion / contraction amount of the object to be inspected regardless of a temperature difference with the object to be inspected, and both the guide plate member and the base member have a central portion thereof. In other words, the portions other than the central portion of the guide plate member exhibiting a thermal expansion / contraction amount substantially equal to the thermal expansion / contraction amount of the object to be inspected are not restricted by the coupling with the base member. Therefore, the thermal expansion and contraction associated with the thermal expansion and contraction of the inspection object can be freely performed.

  Since the region excluding the central portion of the guide plate can freely expand and contract in accordance with the thermal expansion and contraction of the object to be inspected, by forming a through hole that performs the guiding action of each probe described above in the region excluding the central portion. Regardless of the presence or absence of a temperature difference between the guide plate member and the object to be inspected, it is possible to reliably prevent the tip end of each probe from the electrode pad due to the influence of heat. In addition, since the base member and the guide plate member can be coupled to each other at the central portion using a single fastening means without using multiple fastening means, the coupling structure can be simplified. Thus, a reliable electrical connection between the corresponding electrode pad and the tester can be obtained with a relatively simple configuration.

  When the object to be inspected is a semiconductor wafer, the guide plate member can be formed of a ceramic plate having a thermal expansion coefficient that approximates the thermal expansion coefficient of the semiconductor wafer.

The base plate member, the intermediate plate member, and the guide plate member may be ceramic plates, and at least the guide plate member may be a ceramic plate having a thermal expansion coefficient that approximates the thermal expansion coefficient of the semiconductor wafer. By making the holding plate into a multilayer structure of such ceramic plates, by reducing the thickness of each ceramic plate, by facilitating the drilling of the through hole for the prober provided in each, The processing cost can be reduced. Further, by making the holding plate a multi-layer structure, it is possible to suppress the overall warpage of the holding plate itself due to a temperature difference between both sides of the holding plate.

The long groove of the intermediate plate member facilitates the processing of the intermediate plate member as compared with the case where a through hole for receiving each probe is formed for each probe. It is advantageous.

  A support plate can be disposed on the other surface of the substrate along the surface. In this case, the guide plate member is formed by a screw member that penetrates the central portion of the guide plate member and the base plate member. , And can be held on the support plate together with the base plate member. By providing the mounting reference surface to the substrate, the support plate suppresses deformation such as warpage of the substrate, and prevents variations in the tip of the probe due to deformation of the substrate.

As for the probe, a sleeve member, a needle member slidably received in the sleeve member so as to protrude from one end of the sleeve member, and a biasing force in the protrusion direction received in the sleeve member. Each probe can be configured with a spring member that provides the needle member, and the needle member can be swingably fitted to the sleeve member. By constituting each probe with such an assembly, it becomes easier for the probe to relatively flexibly deform in response to a temperature change of the guide plate member, and the electrical connection portion that receives the base end of each probe is provided. Regardless of the processing tolerances of the formed substrate and each probe, the base end of each probe is surely brought into contact with the electrical connection portion, and the tip is reliably brought into contact with the electrode pad of the object to be inspected. Can do.
A single needle member that can be flexibly deformed can be used as the probe. However, in order to enable more reliable electrical connection between each probe and the electrical connection portion of the substrate, the spring member is used as described above. It is desirable to have an integrated probe assembly.

  In the probe comprising the assembly, the sleeve member abuts the other end of the base plate member through the through hole of the base plate member and the electrical connection portion of the substrate, and the needle member passes through the through hole of the guide plate member. Then, the tip can be incorporated in the holding plate so as to abut the electrode pad of the device under test. The needle member can be formed with a locking portion that engages with an edge portion of the through hole of the guide plate member to prevent the guide plate member from falling off the holding plate. The falling off from the holding plate can be reliably prevented.

  According to the present invention, as described above, the guide plate member connected to the base member at the center and exhibiting thermal expansion / contraction approximately equal to the thermal expansion / contraction of the object to be inspected causes the effect of heat from the electrode pad. Since each probe tip can be reliably prevented from shifting, a reliable electrical connection between the corresponding electrode pad and the tester can be obtained with a relatively simple configuration.

    As shown in FIG. 1, an electrical connection device 10 according to the present invention includes, for example, a wafer support 13 for electrical inspection of a large number of IC circuits (not shown) formed on a semiconductor wafer 12. It is used to connect each electrode pad 14 which is a connection terminal of each IC circuit of the semiconductor wafer 12 placed thereon to the tester 16.

The electrical connection device 10 includes a flat plate-like support member 18 whose lower surface 18a is a flat attachment reference surface, a circular flat plate-like wiring board 20 held on the attachment surface 18a of the support member, and a large number of the wiring boards. And a circular holding plate 24 for holding the probe 22.
The wiring board 20 is a conventionally well-known circuit board made of a circular polyimide resin on the entire surface on which a wiring path (not shown) connected to the tester 16 is formed. The electrical connection portions 26 (see FIG. 6) to be connected are arranged in a matrix corresponding to the electrode pads 14 of the semiconductor wafer 12.

  The support member 18 is formed of a plate-like frame member made of, for example, a stainless steel plate, which is disposed with its mounting surface 18a in contact with the upper surface 20b of the wiring board 20. In the example shown in FIG. 2, the support member 18 includes a central boss portion 28a, a circular annular portion 28b concentrically surrounding the boss portion, and a plurality of radial portions 28c that connect the boss portion 28a and the annular portion 28b. A central female screw hole 30a is formed at the central position of the boss portion 28a, and a plurality of female screw holes 30b and 30c arranged around the central female screw hole are formed through the support member 18 in the plate thickness direction. Has been.

  As shown in FIG. 1, the wiring board 20 is tightened with a bolt 32 c that is a male screw member that penetrates the wiring board in the thickness direction and is screwed into a female screw hole 30 c formed in the radial portion 28 c of the support member 18. Thus, as is well known in the art, the support member 18 is supported at the edge by the lower surface 18a.

  In the illustrated example, the holding plate 24 that holds each probe 22 in correspondence with the electrical connection portion 26 formed on the lower surface 20a of the wiring board 20 has a laminated structure including plate-like circular members 24a, 24b, and 24c. Have. Each circular member 24a, 24b, 24c is, for example, a ceramic plate having a diameter that is substantially equal to that of the semiconductor wafer 12 that is a device under test.

  The base plate member 24a, which is a circular member disposed to face the lower surface 20a of the wiring board 20, has a diameter slightly larger than the base end of each probe 22, and the base end of the probe 22 corresponds to the corresponding electric terminal. A plurality of through-holes 34 for positioning in the connecting portions 26 coincide with each electric connecting portion 26 at room temperature, as shown in FIG. 3 showing an enlarged circular area indicated by an arrow A in FIG. It is formed corresponding to this. The base plate member 24a is formed with through holes 36a and 36b aligned with the center female screw hole 30a and the female screw holes 30b.

  A guide plate member 24c, which is a circular plate member, is superimposed on the base plate member 24a via an intermediate plate member 24b, which is an intermediate circular plate member. In the guide plate member 24c, through holes 38 that allow the probe 22 to be inserted are formed at room temperature so that the axes coincide with the through holes 34 of the base plate member 24a, that is, match the electrode pads 14 of the semiconductor wafer 12. Has been. Further, the guide plate member 24c is formed with a through hole 40a aligned with the central female screw hole 30a and a through hole 40b having a diameter larger than that of the female screw hole with the axis aligned with each female screw hole 30b.

  The intermediate plate member 24b disposed between the two plate members 24a and 24c penetrates in the thickness direction of the intermediate plate member 24b and receives a plurality of probes 22 with play as shown in FIG. A plurality of long grooves 42 extending in parallel with each other are formed on the surface of the member 24c. Therefore, a plurality of through holes 34 linearly arranged in the base plate member 24 a are opened at the upper end of each long groove 42, and a plurality of through holes 38 corresponding to each through hole 34 are formed at the lower end of the long groove 42. Open. Instead of the long grooves 42, connecting holes having circular cross sections corresponding to the corresponding through holes 34 and through holes 38 can be individually formed. As shown in the figure, the long grooves 42 are made of a ceramic plate. This is desirable from the viewpoint of reducing the drilling cost for the intermediate plate member 24b.

  Further, as shown in FIG. 3, the intermediate plate member 24b is formed with a through hole 44a aligned with the central female screw hole 30a of the support member 18, and one end is aligned with the female screw hole 30b of the support member 18 and the other end. A through hole 44b having a large diameter portion 46 aligned with the through hole 40b of the guide plate member 24c is formed.

  In the illustrated example, a shallow groove 48 corresponding to the long groove 42 is formed on the surface of the guide plate member 24c facing the intermediate plate member 24b, and the through holes 38 are opened in the shallow groove. A through hole is disposed. A locking portion 22 a protruding outward in the radial direction of the probe 22 is formed at the opening edge of the through hole 38 in the shallow groove 48.

  Therefore, in the holding plate 24, the locking portions 22a of the probes 22 are locked to the opening edge portions of the through holes 38 of the guide plate member 24c, and the base ends of the probes 22 pass through the through holes 34 of the base plate member 24a. In addition, the male screws that are screwed into the female screw holes 30a, 30b of the support member 18 so that the members 24a, 24b, 24c can be stacked so that the tip of the probe 22 penetrates the through hole 38 of the guide plate member 24c. It is attached to the support member 18 by the bolts 50a and 50b which are members.

  That is, as shown in FIG. 3, the central bolt 50a screwed into the central female screw hole 30a of the support member 18 has a head 50ab formed at one end of the shaft portion 50aa as an opening of the through hole 40a on the lower surface of the guide plate member 24c. Arranged so that the shaft portion 50aa penetrates the through hole 40a of the guide plate member 24c, the through hole 44a of the intermediate plate member 24b, the through hole 36a of the base plate member 24a, and the wiring board 20 in a state of being in contact with the edge portion. Then, the shaft portion 50aa is screwed into the central female screw hole 30a of the support member 18. By tightening the central bolt 50a, the guide plate member 24c is integrally coupled to the other intermediate plate member 24b and the base plate member 24a constituting the holding plate 24, and is coupled to the support member 18 integrally therewith. Is done.

  On the other hand, the peripheral bolt 50b screwed into the female screw hole 30b of the support member 18 has a head portion 50bb formed at one end of the shaft portion 50ba passing through the through hole 40b of the guide plate member 24c, and the head portion is an intermediate plate member. The shaft portion 50ba penetrates the through hole 44b of the intermediate plate member 24b, the through hole 36b of the base plate member 24a, and the wiring board 20 so as to contact the bottom 46a of the large diameter portion 46 formed in the through hole 44b of 24b. The shaft portion 50ba is screwed into the female screw hole 30b of the support member 18. By tightening the peripheral bolt 50b, the head 50bb of the peripheral bolt 50b passes through the through hole 40b of the guide plate member 24c. Therefore, the guide plate member 24c is not restrained by the peripheral bolt 50b. The base plate member 24 a and the intermediate plate member 24 b excluding the plate member are coupled to the support member 18 together with the wiring board 20.

  Further, by tightening both the bolts 50a and 50b, at the room temperature, the base ends of the probes 22 held by the holding plate 24 are reliably brought into contact with the corresponding electrical connecting portions 26 of the wiring board 20, thereby Each probe 22 is connected to the tester 16 through the wiring path of the wiring board 20. As shown in FIG. 1, the tip of each probe 22 protruding from the through hole 38 of the guide plate member 24 c, that is, protruding from the holding plate 24, guides the through hole 38 of the guide plate member 24 c of the holding plate 24. Thus, at room temperature, the corresponding electrode pads 14 of the semiconductor wafer 12 can be reliably brought into contact with each other, whereby the tester 16 and each electrode pad 14 are connected for inspection.

  Since the lower surface 18a of the support member 18 acts as a mounting reference surface for the wiring board 20 that receives the proximal end of the probe 22, the wiring board 20 is regulated by restricting deformation due to heat of the wiring board 20 or other causes. Variations in the height and position of the tip of the probe 22 due to the 20 deflection deformation are suppressed.

  In order to prevent the tip of the probe 22 from detaching from the corresponding electrode pad 14 due to thermal expansion and contraction of the semiconductor wafer 12 by, for example, a burn-in test, a guide plate member 24c coupled to the base plate member 24a and the support member 18 at the center. For this, a ceramic plate having a thermal expansion / contraction amount substantially equal to the thermal expansion / contraction amount of the semiconductor wafer 12 is selected.

For example, the semiconductor wafer 12 has a diameter of 12 inches (radius of about 150 mm), a thermal expansion coefficient of 2.8 × 10 ⁻⁶ / ° C., and the temperature of the semiconductor wafer 12 serves as a heat source. When a temperature change from room temperature (25 ° C.) to 85 ° C. is caused by the rise, the guide plate member 24c located away from the heat source 13 or far from the semiconductor wafer 12 is considered to generate a temperature change from room temperature to about 60 ° C. To do.
Assuming that δ is the maximum radial elongation at the periphery of the semiconductor wafer 12 when the semiconductor wafer 12 changes from room temperature to 85 ° C., δ can be obtained by the following equation.

Thermal expansion coefficient of the guide plate member 24c resulting in equal deformation amount [delta] ₁ in the deformation amount [delta] alpha is given by the following equation.

  From both equations (1) and (2), the thermal expansion coefficient α of the guide plate member 24c is obtained.

Therefore, for example, a ceramic plate having a thermal expansion coefficient α of 4.8 × 10 ⁻⁶ / ° C. is selected as the guide plate member 24c under the above-described conditions. The thermal expansion coefficient α of the guide plate member 24c is similar to the thermal expansion coefficient of the semiconductor wafer 12 (2.8 × 10 ⁻⁶ / ° C.) because it shows the same number of digits.

  The same ceramic material as the guide plate member 24c can be selected for the base plate members 24a and 24b. In this case, even if the guide plate member 24c reaches 60 ° C., the rise in temperature of the base plate member 24a is suppressed by the intermediate plate member 24b and the guide plate member 24c located on the heating source side with respect to the base member. In addition, since the thermal expansion coefficient of the ceramic plate itself is relatively small, the base end of each probe 22 positioned by the through hole 34 is connected to the base plate member 24a as long as it is within the above-described design temperature range. Since the thermal expansion / contraction difference that causes the displacement of the substrate 20 from the electrical connection portion 26 does not occur between the substrate 20 and the wiring substrate 20, the base end of the probe 22 is detached from the corresponding electrical connection portion 26. There is nothing.

  In order to prevent the base end portion of the probe 22 from the corresponding electrical connection portion 26 more reliably, a material having a thermal expansion coefficient equal to the thermal expansion coefficient of the wiring board 20 is used as the base plate member 24a. Is desirable.

  The distal end of each probe 22 whose proximal end is positioned at the electrical connection portion 26 of the wiring board 20 by the through hole 34 of the base plate member 24a is guided by the through hole 38 of the guide plate member 24c. As described above, the guide plate member 24c that guides the tip of the probe 22 has a linear expansion coefficient that approximates the thermal expansion coefficient of the semiconductor wafer 12 that is the object to be inspected, and a temperature difference from the semiconductor wafer 12. Regardless of whether or not there is, thermal expansion and contraction approximately equal to the thermal expansion and contraction of the semiconductor wafer 12 is exhibited. Further, since the central portion of the guide plate member 24c is coupled to the base plate member 24a and the support member 18, the guide plate member 24c is restrained from expanding and contracting at the central portion, but the through hole 38 excluding the central portion. In the peripheral portion where is formed, the guide plate member 24 c can be expanded and contracted in the radial direction and the circumferential direction in accordance with the thermal expansion and contraction of the semiconductor wafer 12.

For this reason, when the semiconductor wafer 12 undergoes a burn-in test in a heated atmosphere, for example, even if the position of the electrode pad 14 is shifted on the surface of the semiconductor wafer 12 along with the temperature change, the semiconductor wafer 12 moves along the semiconductor wafer 12. Due to the probe guide action of the guide plate member accompanied by deformation in the radial direction and the circumferential direction of the guide plate member 24c exhibiting a thermal expansion / contraction amount substantially equal to the thermal expansion / contraction amount of the semiconductor wafer, the probe 22 is accompanied by its deflection deformation. The tip follows the displacement of the position of the electrode pad 14. As a result, the displacement of the probe 22 from the electrode pad 14 is reliably prevented.
In addition, since both the base plate member 24a and the guide plate member 24c can be coupled at the central portion by using the central bolt 50a constituting a single fastening means without using a large number of fastening means. Since the coupling structure is simplified, a reliable electrical connection between the corresponding electrode pad 14 and the tester 16 can be obtained with a relatively simple configuration.

  As the above-described probe 22, a metal wire such as a tungsten wire that can be flexibly deformed can be used. Further, a probe assembly 122 as shown in FIGS. 5 and 6 can be used in place of the probe 22 made of such a single metal wire.

  As shown in FIG. 5, the probe assembly 122 according to the present invention includes a sleeve member 60 made of a metal cylinder open at both ends, a conductive head member 62 that closes one end of the sleeve member, and a head member at one end. A metallic compression coil spring 64 received in contact with 62 and housed in the sleeve member 60, and one end abutted on the other end of the coil spring so as to receive the spring force of the coil spring, And a conductive needle member 66 slidably accommodated. In the illustrated example, a plunger member 66 is used as the needle member.

  The sleeve member 60 is formed with a reduced diameter portion 60 a that engages with a head portion 66 a formed at one end of a plunger member 66 that is a needle member and prevents the plunger member 66 from falling off the sleeve member 60. Yes. The plunger member 66 is disposed with the other end protruding from the other end of the sleeve member 60, and the protruding region can be locked to the opening edge of the through hole 38 of the guide plate member 24c. A similar locking portion 22a is formed. Further, a contact terminal 68 that is pressed against the electrode pad 14 by the spring force of the compression coil spring 64 is provided at the tip of the plunger member 66. In the illustrated example, the contact terminal 68 is formed with teeth 68 a in order to obtain a reliable electrical connection with the electrode pad 14.

  The plunger member 66 is fitted to the sleeve member 60 so that its axis is swingable within an angle θ with respect to the axis of the sleeve member 60, and the swing angle θ is set to 0.1 degrees, for example. Further, even if the swing angle θ is 1 degree, the smooth sliding between the sleeve member 60 and the plunger member 66 is compensated.

  As shown in FIG. 6A, the probe assembly 122 penetrates the base plate member 24a of the holding plate 24 so that the tip of the head member 62 abuts on the electrical connection portion 26 of the wiring board 20. The hole 34 is inserted into the holding plate 24. When the probe assembly 122 is incorporated in the holding plate 24, the locking portion 22a of the plunger member 66 contacts the opening edge of the through hole 38 in the shallow groove 48 of the guide plate member 24c. The plunger member 66 penetrates the through hole 38 so that the contact terminal 68 provided at the tip can be pressed against the electrode pad 14 of the semiconductor wafer 12.

  FIG. 6A shows the assembled state of the probe assembly 122 at room temperature. In this assembled state at room temperature, the swing angle θ is set so that both axes of the sleeve member 60 and the plunger member 66 coincide. Thus, the electrical connection portion 26 with which the head member 62 of each probe assembly 122 abuts and the electrode pad 14 with which the contact terminal 68 abuts are securely connected.

  For the burn-in test, as shown in FIG. 6B, when the temperature of the wafer support 13 on which the semiconductor wafer 12 is placed rises from room temperature to, for example, 85 ° C., the semiconductor on the wafer support 13 The wafer 12 rises to 85 ° C. As the temperature of the semiconductor wafer 12 rises, the semiconductor wafer 12 is deformed by the expansion of the semiconductor wafer 12 as indicated by an arrow A in the figure. At this time, in the electrical connection device 10 according to the present invention, the guide plate member 24c that receives the probe 22, that is, the guide plate member 24c that receives the plunger member 66 of the probe assembly 122 is heated to 60 ° C. As indicated by the middle arrow B, the deformation almost identical to the deformation of the semiconductor wafer 12 occurs. Due to the guide action of the guide plate member 24c, the probe assembly 122 passing through the guide hole of the guide plate member, that is, the through hole 38, is deformed with the swing of the angle θ and formed at the tip of the plunger member 66. The contact terminals 68 are displaced substantially integrally with the corresponding electrode pads 14.

  Therefore, according to the electrical connecting device 10 according to the present invention, the guide plate member 24c coupled to the base member 24a at the center and exhibiting thermal expansion / contraction substantially equal to the thermal expansion / contraction of the object 12 to be inspected, Since the displacement of the tips of the probes 22 and the probe assemblies 122 from the electrode pads 14 due to the influence can be surely prevented, reliable electrical connection between the corresponding electrode pads 14 and the tester 16 can be achieved with a relatively simple configuration. Connection can be obtained.

  Further, by using the probe assembly 122 as the probe 22, the contact terminal 68, which is the tip of the probe, can be reliably connected to the electrode pad 14 by the spring force of the compression coil spring 64. Further, by setting the swing angle θ, it is easy to appropriately displace the contact terminal 68 in accordance with the displacement of the electrode pad 14, and the followability to the displacement of the electrode pad 14 at the tip of the probe can be improved.

As described above, the case where the object to be inspected changes in temperature between room temperature and 85 ° C. has been described, but this temperature range can be changed as necessary, and the temperature difference within the temperature range can be changed. In consideration, the guide plate member 24c can be appropriately selected.
Further, although the holding plate 24 having a three-layer structure is shown as the holding plate, the intermediate plate member 24b can be omitted if necessary, and a multilayer structure having four or more layers can be formed.

  The present invention is not limited to the above embodiments, and various modifications can be made without departing from the spirit of the present invention.

It is sectional drawing which shows partially the electrical connection apparatus which concerns on this invention. It is a top view which shows the whole electrical connection apparatus which concerns on this invention. It is sectional drawing which expands and shows the part enclosed by the wavy circle in FIG. It is a partial bottom view of the electrical connection apparatus shown in FIG. It is sectional drawing which fractures | ruptures and shows the probe assembly used for the electrical connection apparatus which concerns on this invention. 6 (a) and 6 (b) are explanatory diagrams showing changes in the shape of the probe assembly at room temperature and high temperature, respectively.

Explanation of symbols

10 Electrical connection device 12 Semiconductor wafer (inspected object)
14 Electrode pad 16 Tester 20 Wiring board 22, 122 Probe (probe assembly)
24 holding plate 24a base plate member 24b intermediate plate member 24c guide plate member 26 electrical connecting portion 34, 38 through hole 42 long groove

Claims (6)

An electrical connection device for connecting an electrode pad and a tester provided on the test object for electrical inspection of the test object,
A wiring path connected to the tester is provided, and a plurality of electrical connection parts connected to the tester via the wiring path are formed on one surface;
A plurality of probes whose proximal ends are electrically connected to the corresponding electrical connection portions and whose distal ends are in contact with the electrode pads of the device under test;
A holding plate that is disposed on the one surface of the substrate and holds the probe on the substrate;
The holding plate is disposed along the substrate so that one surface thereof faces the one surface of the substrate, and a through hole is formed to position the base end of the probe in the corresponding electrical connection portion. A base plate member and a guide hole that is aligned with the through hole and that positions the tip of the probe in the corresponding electrode pad of the object to be inspected are disposed along the other surface of the base member. A laminated structure comprising a plate member and an intermediate plate member disposed between the base plate member and the guide plate member;
The guide plate member is made of a ceramic plate, and is connected to the base plate member at a central portion thereof, and is capable of thermal expansion and contraction along the base plate member except for the central portion.
In the intermediate plate member, a plurality of long grooves penetrating in the plate thickness direction so as to receive a plurality of probes and extending substantially perpendicular to the penetration direction on the surface of the intermediate plate member are formed in parallel to each other,
The electrical connection device according to claim 1, wherein the probe penetrating through the through hole can be deformed by thermal expansion and contraction of the guide plate member by the guiding action of the through hole of the guide plate member.   The electrical connection device according to claim 1, wherein the device under test is a semiconductor wafer.   The electrical connection device according to claim 1, wherein the base plate member, the intermediate plate member, and the guide plate member are made of a ceramic plate.   A support plate is disposed on the other surface of the substrate along the surface, and the guide plate member is formed by the screw member penetrating the central portion of the guide plate member and the base plate member. The electrical connection device according to claim 1, wherein the electrical connection device is held on the support plate together with a plate member.   The probe includes a sleeve member, a needle member that is slidably received in the sleeve member so as to protrude from one end of the sleeve member, and a biasing force that is received in the sleeve member in the protruding direction. The electrical connection device according to claim 1, further comprising: a spring member that provides the needle member, wherein the needle member is swingably fitted to the sleeve member.   In the probe, the sleeve member abuts the other end of the base plate member through the through hole of the base plate member and the electrical connection portion of the substrate, and the needle member has a tip of the guide plate member through the through hole of the tip. It is incorporated in the holding plate so as to contact the electrode pad of the object to be inspected, and the needle member is engaged with the edge of the through hole of the guide plate member to prevent the holding plate from falling off. The electrical connection device according to claim 5, wherein a locking portion is formed.

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