JP4811655B2 - Different diameter ball mounting jig and different diameter ball mounting method - Google Patents

Description

  The present invention relates to a jig and a mounting method for mounting different-diameter balls on a predetermined portion of a mounted body, and more particularly to a jig and a mounting method suitable for a small solder ball used for bump formation of an electronic component. .

  In recent years, electronic devices such as portable terminal devices and notebook computers have been increased in speed, functionality, and weight, and have been reduced in size and thickness. With respect to semiconductor components incorporated therein and substrates on which semiconductor components are mounted, Are required to have the contradictory performance of miniaturization and thinning and an increase in the number of connection terminals. In order to meet this requirement, BGA (Ball Grid Array) type or FC (Flip Chip) type semiconductor components or semiconductor component mountings in which solder balls are mounted on electrodes to form connection terminals (hereinafter also referred to as solder bumps) There is a substrate. Generally, the solder bump includes a printing process for printing solder paste or flux on the electrode, a solder ball mounting process for mounting solder balls on the electrode on which the solder paste or flux is printed, and a reflow process for heating and melting the solder balls. It is formed through.

  BGA type or FC type semiconductor parts are often provided after being cut out after being processed in a state where a large number of BGA type or FC type semiconductor parts are formed on the wafer, and are generally called chips. In order to increase productivity, the size of a wafer is increasing year by year, and the number of chips obtained from one wafer may reach tens of thousands. However, there are various types of chips, and it may be more efficient in manufacturing a chip to manufacture a predetermined number of chips having different specifications than to manufacture a large number of chips having the same specifications from a single wafer. . In some cases, it is required to form solder bumps of different sizes on the same chip. For this purpose, it is desirable to mount two or more kinds of solder balls having different sizes on a single wafer so as to have a predetermined arrangement.

As a technique related to this, the technique disclosed in Patent Document 1 is disclosed. This is a method of supplying two or more kinds of solder balls having different sizes to a printed board, and has a large pad hole and a small pad hole for positioning the large solder ball and the small solder ball, respectively. Using a mask with a collar or step that prevents small solder balls from entering the hole for large solder balls around the hole for mounting, place this mask on a predetermined position on the printed board, and place the small solder balls on the small solder After supplying to the hole for the ball, the mask is covered with a mask cover having a gas vent hole provided at a position corresponding to the hole for the small pad and a vent hole provided to avoid the flange or step, and a large solder The ball is supplied to the large pad hole through the hole.
Japanese Patent Laid-Open No. 2-286393 (Claims)

  The technique of Patent Document 1 has an effect that the reflow process is only required once and the thermal history of the printed board can be reduced. By the way, an adsorption method and a transfer method are known as methods for supplying solder balls to electrodes. Although the supply method is not specified in Patent Document 1, it is understood that the transfer method is used because a mask is used. The transfer method is a method in which the solder balls supplied on the mask are moved by moving the squeegee or tilting the mask and dropped into the through holes formed on the mask surface. Is not held by the suction force, so there is no missing trouble related to suction, and a complicated equipment configuration such as a suction circuit is unnecessary, which is an excellent method for supplying a large number of minute balls at high density. However, the method of Patent Document 1 is described as a collar or step (about 0.4 mm) around the large pad hole when moving on the mask to supply the small solder ball to the small pad hole. However, the large pad hole remains open, and there is a high possibility that the small solder ball gets over the stepped portion, and there is a problem in the reliability of the solder ball supply.

  In addition, the mask and mask cover have a vent hole, and the pad is not coated with flux. Therefore, it can be seen that the mask and mask cover remain attached during reflow, and they are deformed or damaged by heat load. easy. In particular, when the solder ball is as small as, for example, a diameter of 100 μm or less, the thickness of the mask or mask cover is extremely thin, such as several tens of μm, and it is difficult to avoid thermal deformation. For this reason, the position of the pad hole is displaced or cannot be in close contact with the printed board or the like, and the solder balls cannot be supplied with high positional accuracy.

  The present invention provides a jig and a mounting method in which microballs having different sizes are mounted on a mounted portion such as an electrode of a mounted body such as a wafer or a substrate with high reliability and accuracy and are not subjected to a thermal load. The purpose is that.

The present inventor has conducted research and development for many years on the supply of microballs by a transfer method using a mask, has obtained knowledge about the relationship between the diameter of the target ball, the thickness of the mask, and the through hole, and has also filed a patent application. . The present invention has been made based on this knowledge.
Different diameter ball mounting jig of the present invention, collectively the large ball and small ball a different diameter ball mounting jig for mounting a predetermined position of the mounting member, and the large-diameter ball and the jig body and the bottomed recess for the large-diameter balls and the recesses for the small-diameter balls for holding the small-diameter ball is formed, in contact with the jig body and the large-diameter ball and small ball through a through hole the a mask transfer money to said recess for large diameter concave portions and small-diameter ball for a ball, the large-diameter ball recesses and the recesses for the small diameter ball, move the array and the diameter of the large-diameter balls and the small-diameter ball to be collectively mounted And the depth of the large diameter ball and the small diameter ball are adjusted to the same height so that the tops of the held large diameter ball and the small diameter ball have the same height. . The jig for mounting different-diameter balls of the present invention transfers and mounts the held large-diameter balls and small-diameter balls in contact with the mounted body, and the large-diameter ball and small-diameter ball recesses and through-holes are compatible. It is formed so that the pattern of the mounted portion to be reversed and the back and front patterns are reversed.

In the present invention, the large-diameter ball recesses and the recesses for the small diameter ball, as wherein the held top portion of the large-diameter balls and the small-diameter balls are formed to a depth to protrude from the jig body surface Yes.
Further, in the above present invention, the thickness of the mask, projection dimension substantially the same dimension from the jig body surface of said large-diameter balls and the small-diameter ball held in the large-diameter recessed portion and the concave portion for small diameter ball for a ball It is desirable that In the large-diameter ball recess and the small-diameter ball recess, when the small-diameter ball recess for holding the ball with the smallest diameter is shallowly formed so that the upper hemisphere or more of the held smallest ball protrudes, the mask thickness is increased accordingly. Can be increased.
Further, in the present invention, the mask corresponds to the arrangement pattern of the large-diameter ball recess, and the arrangement pattern of the large-diameter ball mask formed with a through-hole through which the large-diameter ball can be inserted and the small-diameter ball depression The small-diameter ball mask is formed with a through-hole through which the small-diameter ball can be inserted, and the large-diameter ball mask has a concave portion for the small-diameter ball when abutted against the jig body. It is possible to adopt a configuration in which an escape hole corresponding to the arrangement pattern is formed in which the small-diameter ball does not contact.

Further, in the above invention, further, the disposed above the large-diameter mask balls, it may be provided with a thin plate-like lid for closing the relief hole.
Further, in the present invention, wherein the jig main body, a large ball and the small-diameter balls held when mounting the mountable member, means pressing push the large-diameter balls and the small-diameter ball mountable member disposed You may be made to do. As a result, the large-diameter ball can be reliably brought into contact with the mounted portion. A magnetic force can be used as the pressing force, and it is preferable that the magnetic member be fixed to the surface of the jig body that is opposite to the concave portion and that the magnet is disposed with the mounted body interposed between the balls when transferring the ball. In this case, the jig body is made of a nonmagnetic material.

Also, different diameter ball mounting method of the present invention, collectively the large ball and the small-diameter ball Lumpur a different diameter ball mounting method for mounting a predetermined position of the mounting member, the small-diameter ball Lumpur after elaborate vibration concave portion for small ball of the jig body by using a mask for small-sized ball, a step narrowing vibration transfer money into the recess for the large-diameter ball jig body large-diameter balls by using a mask for a large diameter ball, Osamu and a small diameter ball and large ball held in the concave portion and the recess for the large ball diameter balls fixings body and step corresponding to the mountable portion in contact with the mountable member, the jig body and mountable isomer separation It is characterized by having a step of collectively transferred mountable body a small diameter ball and large ball that is held in the jig body and.
Also, different diameter ball mounting method of the present invention, prior to the transfer step, it is preferable to have a step of applying the temporary fixing agent in the recess and the recess for the small ball diameter balls jig body. Thereby, it is possible to prevent the transferred large-diameter ball and small-diameter ball from separating.

  According to the present invention, two or more kinds of balls having different sizes can be mounted on a mounted body in a short time with high reliability.

(Embodiment 1)
Hereinafter, a case where a small solder ball (hereinafter collectively referred to as a ball) is mounted on a wafer as a mounted body will be described as an example. This wafer 9 is for cutting out and forming two types of chips having different solder bump sizes from one wafer, and it is assumed that a small-diameter ball 31 and a large-diameter ball 32 are mounted on a predetermined electrode. FIG. 5 illustrates an arrangement of small diameter balls 31 and large diameter balls 32 mounted on the wafer 9. The mounting jig of the present invention is for mounting the small-diameter balls 31 and the large-diameter balls 32 on the wafer 9 at once, and a jig main body for holding the small-diameter balls 31 and the large-diameter balls 32 in a predetermined arrangement. 1, and a mask 2 for transferring the small-diameter ball 31 and the large-diameter ball 32 to the jig body 1. FIG. 1 is a longitudinal sectional view showing a state in which the mask 2 is mounted on the jig main body 1. FIG. 1A shows a case where a small-diameter ball 31 is transferred, and FIG. 1B shows a case where a large-diameter ball 32 is transferred. Shows the case.

  The jig main body 1 is a flat plate member having substantially the same shape as the wafer 9, and an electroformed plate such as glass, silicon, nickel alloy, or copper alloy can be used. The arrangement pattern of the small-diameter balls 31 and the large-diameter balls 32 to be mounted on the wafer 9 is substantially cylindrical or spherical in order to hold the predetermined small-diameter balls 31 and large-diameter balls 32 in a reverse pattern. A bottomed recess 4 having this combined shape is formed. The depth G of the recess 4 is formed so that the top heights of the held small-diameter ball 31 and large-diameter ball 32 substantially coincide. Naturally, the depth G1 of the small-diameter ball recess 41 is shallower than the depth G2 of the large-diameter ball recess 42. Each recess 4 may be formed by etching, and the diameter of the surface opening can be set according to the depth G based on the diameter of the ball. For example, when the recess depth G dimension is equal to or larger than the radius of the ball 3, the diameter of the opening is set to be larger than the diameter of the ball, but may be about (1.1 to 1.3) times the diameter. .

  The mask 2 is a flat plate member made of a nickel alloy or a copper alloy formed by an electroforming method having substantially the same shape as the wafer 9, and a through hole 5 for transferring the ball 3 into the recess 4 formed in the jig body 1 is formed. For small diameter balls and large diameter balls are prepared. The mask 2 is mounted so as to contact the surface of the jig body 1 where the recess 4 is formed. The thickness T of the mask 2 is (T + G) = (0.9 to 1.. 2) It is formed to a value that satisfies d. That is, the surface of the mask 2 at the time of mounting is made to substantially coincide with the top of the ball 3 transferred into the recess 4. The diameter of the through hole 5 is (1.1 to 1.3) d. With such a dimensional relationship, only one target ball 3 can be transferred to the recess 4 with high reliability.

  As described above, the thickness T of the mask 2 and the depth G of the recess 4 can be set to appropriate values as long as the total value satisfies a predetermined value based on the ball diameter d. Since the thicker one is easier to handle and the smaller concave portion is easier to process, the shallowest concave portion, that is, the depth G1 of the small-diameter ball concave portion 41 is determined. It is good to determine the thickness T. The depth G1 of the small-diameter ball recess 41 is preferably about (0.2 to 0.5) d1 with respect to the small-diameter ball diameter d1. This is because when G1 becomes shallower than 0.2d1, there is a risk that the small-diameter ball 31 jumps out due to some contact or impact. At this time, the depth G2 of the large-diameter ball recess 42 is a dimension that satisfies the relationship of G2-G1 = d2-d1. Here, d2 is the diameter of the large-diameter ball 32.

  The small-diameter ball mask 21 is formed in such a manner that the small-diameter ball through hole 51 has a diameter of (1.1 to 1.3) d1 at a position facing the small-diameter ball recess 41. Further, the thickness T1 is set to a value satisfying (0.9 to 1.2) d1-G1. The large-diameter ball mask 22 is formed such that the diameter of the large-diameter ball through hole 52 is (1.1 to 1.3) d2 at a position facing the large-diameter ball recess 42. Further, the escape hole 6 is formed so as not to contact the small-diameter ball 31 already held in the small-diameter ball recess 41. This is because the large-diameter ball 32 is transferred after the small-diameter ball 31 is transferred, as will be described later. The escape hole 6 may be a hole having the same specifications as the small-diameter ball through hole 51, but may be larger as long as the large-diameter ball 32 is not caught or the small-diameter ball 31 is not jumped out. The thickness T2 is set to a value that satisfies (0.9 to 1.2) d2-G2. The thickness T2 does not need to be the same as the thickness T1, but it is more efficient in terms of production if it is the same.

Next, a method for mounting different diameter balls using the mounting jig will be described with reference to FIGS.
As shown in FIG. 2 (a), a small-diameter ball mask 21 is brought into contact with the surface of the jig body 1 to be positioned and mounted. As a result, the small-diameter ball recess 41 and the small-diameter ball through hole 51 substantially coincide. Next, as shown in FIG. 2B, the small-diameter ball 31 is supplied onto the small-diameter ball mask 21 and moved by sweeping with a brush, and the small-diameter ball is moved through the small-diameter ball through hole 51. Swing into the recess 41 for use. Next, as shown in FIG. 2C, the remaining small-diameter balls 31 are removed from the small-diameter ball mask 1 by sweeping with a brush or the like, and the small-diameter ball mask 21 is removed. As a result, the small-diameter ball 31 is held in the jig body 1 only in the small-diameter ball recess 41.

  Next, as shown in FIG. 2 (d), the large-diameter ball mask 22 is brought into contact with the surface of the jig body 1 to be positioned and mounted. As a result, the large-diameter ball recess 42 and the large-diameter ball through hole 52 substantially coincide with each other, and the small-diameter ball 31 held in the small-diameter ball recess 41 comes into contact with the large-diameter ball mask 22 through the escape hole 6. There is nothing. Next, as shown in FIG. 2E, the large diameter ball 32 is supplied onto the large diameter ball mask 22, and the large diameter ball 32 is moved by sweeping with a brush. To the large-diameter ball recess 42. At this time, the moving large-diameter ball 32 may come into contact with the already-held small-diameter ball 31, but the small-diameter ball 31 is contained in the small-diameter ball recess 41, and further, the escape hole of the large-diameter ball mask 22. 6, the small-diameter ball 31 hardly jumps out. Next, as shown in FIG. 2F, the remaining large-diameter balls 32 are removed from the large-diameter ball mask 22 by sweeping with a brush or the like, and the large-diameter ball mask 22 is removed. As a result, the jig body 1 holds the small-diameter ball 31 in the small-diameter ball recess 41 and the large-diameter ball 32 in the large-diameter ball recess 42, and the held small-diameter ball 31 and the top of the large-diameter ball 32 are almost the same. It is the same level L.

  Next, as shown in FIG. 3A, the wafer 9 in which the flux 92 is applied to the electrode 91 is made to face the jig body 1 holding the small-diameter ball 31 and the large-diameter ball 32, and the electrode 91 is attached. Align to match the corresponding ball, move in the direction of the arrow and contact. At this time, since the tops of the small-diameter balls 31 and the large-diameter balls 32 held by the jig body 1 are substantially at the same level L, the tops of all the balls come into contact with the flux 92. Next, as shown in FIG. 3B, after the jig body 1 and the wafer 9 are in contact with each other and inverted 180 degrees up and down, the jig body 1 is relatively raised as shown by the arrows, The balls 3 housed in the jig body 1 are transferred onto the electrodes of the wafer 9 at once. The ball 3 is reliably separated from the concave portion 4 by its own weight and the adhesive force of the flux 92. Thereafter, the small diameter balls 31 and the large diameter balls 32 are simultaneously heated by reflow to form solder bumps. Thereafter, the wafer 9 is cut as shown by broken lines in FIG. 5 to separate chips into a predetermined size, and a predetermined number of two types of chips are obtained from one wafer.

  In the above description of the mounting method, the small diameter ball 31 is transferred to the jig main body 1 and then the large diameter ball 32 is transferred to the jig main body 1. However, the difference in diameter between the small diameter ball 31 and the large diameter ball 32 is described. In the case where there is not so much, contrary to the above description, the small diameter ball 31 may be transferred to the jig body 1 after the large diameter ball 32 is transferred to the jig body 1. When performing in this order, the escape hole 6 for the large-diameter ball 32 is formed in the small-diameter ball mask 21 to be transferred later. The large-diameter ball escape hole 6 has the same diameter as the large-diameter bowl through-hole 52 or a slightly larger diameter so that the small-diameter ball 31 does not enter or get caught so as not to be removed with a brush.

  In addition, prior to the above-described transfer operation, it is preferable to apply a temporary fixing agent that temporarily fixes the ball transferred to the recess 4 of the jig body 1. By applying the temporary fixing agent, the transferred ball 3 can be prevented from being detached from the recess 4. In other words, even if the transferred ball comes into contact with the transferred ball when the mask 2 is removed or the ball transferred earlier receives an impact with the ball transferred later, the transferred ball jumps from the recess 41. Can be prevented. However, this temporary fixing agent does not interfere with the transfer when the balls 3 in the recesses 4 are collectively mounted on the electrode of the wafer 9, and has a lower adhesive force than the flux 92, preferably by the time of transfer. A liquid that disappears, for example, a volatile and low-viscosity liquid such as alcohol, may be used.

  As described above, in the present invention, the number of steps is increased as compared with the technique of directly mounting the different-diameter balls on the wafer as in Patent Document 1, but the mounting time on the mounted body is much shorter. This means that the ball is transferred almost simultaneously to all the fluxes applied to the electrodes, and there is no time difference until the ball is mounted depending on the location. It can be reliably transferred and fixed. That is, at the time of reflow, since the ball is firmly fixed to the mounted body with the flux, it is not necessary to hold the ball with the mounting jig. Therefore, the mounting jig is not subject to deformation or breakage due to heat, maintains accuracy for a long time, and has a long life. In addition, since the transfer method using a mask is used to temporarily hold the different-diameter balls in a predetermined arrangement, there is no problem of ball removal or extra ball adhesion regardless of the size or quantity of the balls. It can be held with high reliability.

(Embodiment 2)
In the mounting jig of the second embodiment, the mounting jig of the first embodiment uses two types of masks, that is, a small-diameter ball mask 21 and a large-diameter ball mask 22, whereas one type of mask 25. Is different in that it uses That is, the size, thickness, and material of the mask 25 are the same as those of the small-diameter ball mask 21 or the large-diameter ball mask 22 described above, but the small-diameter ball through hole 51 and the large-diameter ball through hole are in the same plane. A hole 52 is formed and has a shape similar to that of the mask 22 shown in FIG. In the case of using the mounting jig in the second embodiment, after the mask 25 is mounted on the jig body 1, the order is such that the large-diameter ball 22 is first transferred and the small-diameter ball 21 is subsequently transferred. Here, if there is a large difference between the diameters of the small-diameter ball 31 and the large-diameter ball 32, even if the large-diameter ball 22 is held in the large-diameter ball through hole 52, the small-diameter ball 21 enters the gap. There is a possibility that it cannot be removed by sweeping with a brush or the like. On the contrary, if the diameters of the small diameter ball 21 and the large diameter ball 22 are not so different, the lower hemisphere of the large diameter ball 22 may enter the through hole 51 for the small diameter ball. Therefore, the second embodiment can be applied to a case where the number of masks can be reduced, but the size of the small-diameter ball 21 and the large-diameter ball 22 is an appropriate combination.

(Embodiment 3)
The mounting jig according to the third embodiment includes the thin plate-like lid that closes the through holes other than the through holes to be transferred in the mounting jig according to the first or second embodiment. That is, in the case of the mounting jig of the first embodiment, as shown in FIG. 6, a thin plate-like lid 29 is prepared so as to cover the escape hole 6 of the large-diameter ball mask 22. At the time of transferring the large-diameter ball, the large-diameter ball mask 22 is mounted on the jig body 1, and then a lid 29 is set on the large-diameter ball mask 22 to transfer the large-diameter ball 32. Thereby, the small-diameter ball 31 already held in the concave portion 41 does not come into contact with the large-diameter ball 31 or the brush and does not jump out of the concave portion 41. The lid 29 may be attached to the large-diameter ball mask 22 with screws or an adhesive in advance.

  In the case of the mounting jig of the second embodiment, a thin plate-like lid that covers the small-diameter ball through hole 51 of the mask 25 and a thin plate-like lid that covers the large-diameter ball through hole 52 are prepared. The That is, when the large diameter ball 32 is transferred, a cover that covers the through hole 51 for the small diameter ball is mounted on the mask 25 to transfer the large diameter ball 32, and when the small diameter ball 32 is transferred, the cover is removed. Thereafter, a cover that covers the large-diameter ball through hole 52 is attached to the mask 25, and the small-diameter ball 32 is transferred. Thus, since only the through hole corresponding to the ball to be transferred is opened on the mask, the transfer can be reliably performed without worrying about the difference in diameter between the small diameter ball 31 and the large diameter ball 32 as described above. Yes, the transfer order is also free. Depending on the diameter difference between the small-diameter ball 31 and the large-diameter ball 32, only one of the lids may be used. When using a cover that covers the ball already held in the recess, the mask thickness and the recess depth should be larger than the ball diameter so that the held ball and the cover do not come into contact with each other. Stipulate.

(Embodiment 4)
In the first to third embodiments described above, a configuration example in which the mounting jig of the present invention is composed of the jig body 1 and the mask 2 is described, but the fourth embodiment is housed in the jig body 1. In order to transfer the ball 3 on the electrode of the wafer 9 with higher reliability, a means for pressing the jig body 1 against the wafer 9 is provided in addition to the above configuration. As described above, the jig body 1 according to the present invention defines the depth of the recess so that the tops of all the held balls 3 are aligned at substantially the same level L, and the tops of all the balls 3 are fluxed during transfer. 92, the top height of the ball 3 held by the jig body 1 may vary depending on the depth error of the recess 4 and the diameter error of the ball 3 or the like. In FIG. 3A, there is no particular problem as long as this variation is within the thickness range of the flux 92, and even if there is a ball 3 that does not contact the flux 92 beyond the thickness range, FIG. When the jig body 1 and the wafer 9 are in contact with each other and are turned up and down 180 degrees and the jig body 1 is relatively raised, the ball 3 falls on the flux 92 by its own weight. So there is often no problem.

  However, when the ball 3 becomes smaller, the adhesion force to the recess 4 may be superior to its own weight, and the transfer is not necessarily reversed as shown in FIG. The jig body 1 and the wafer 9 may be separated from the state, and there may be a case where the self-weight action cannot be expected. The mounting jig according to the fourth embodiment can cope with such a case, and the jig main body 1 is pressed against the wafer 9 and the ball stored in the jig main body 1 is pressed against the flux 92. It is. In this case, the jig body 1 is made of a material having a small longitudinal elastic modulus or thinned so as to have a predetermined flexibility, and the pressing force f acts on almost the entire surface of the jig body 1. It is important to make it. For example, as shown in FIG. 4, a magnet 8 is mounted on a wafer mounting portion (not shown), and a flat magnetic member 7 is fixed to almost the entire surface of the jig body 1 on the side opposite to the mask mounting surface. Can be configured. Thereby, even if there is a ball having a low height at the top of the ball, the jig main body 1 at that portion can be bent, and the ball 3 can also be pressed against the flux 92 for more reliable transfer. Further, instead of the magnetic force as the pressing force, the back surface of the jig body 1 may be supported by a number of cylinders and pressed by air pressure. Also, the back surface of the jig body 1 may be a sealed air chamber, and air pressure may be applied thereto, or the back surface of the jig body 1 may be supported by a number of springs.

  As described above, the mounting jig of the present invention has been described with an example in which two types of solder balls having different diameters are mounted on one wafer. However, it goes without saying that the mounting jig can be applied even when mounting three or more types of solder balls having different diameters. Yes. Even when only one type of chip is formed from one wafer, it can be applied when solder bumps of different sizes are formed in the chip. Further, the present invention can be applied not only to mounting on a wafer but also to mounting solder balls having different sizes on a substrate on which a semiconductor component is mounted. Further, the balls are not limited to solder balls, and may be soldered copper balls or silver balls.

The longitudinal cross-sectional view which shows the example of 1 structure of the jig for different diameter ball mounting of this invention. The figure for demonstrating the ball | bowl transfer operation | movement to the said jig for different diameter ball | bowl mounting. The figure explaining the operation | movement which mounts a ball | bowl from the said jig for different diameter ball | bowl mounting to a to-be-mounted body. FIG. 10 is a diagram illustrating a configuration example of a different-diameter ball mounting jig according to a fourth embodiment. 1 is a schematic external view showing a wafer in which microballs having a large diameter and a small diameter are arranged. FIG. 10 is a diagram illustrating a configuration example of a different-diameter ball mounting jig provided with a lid in a third embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Jig body, 2 (21, 22, 25) ... Mask, 3 (31, 32) ... Ball,
4 (41, 42) ... concave portion, 5 (51, 52) ... through hole, 6 ... escape hole,
7 ... Magnetic member, 29 ... Lid, 9 ... Wafer, G ... Depth of recess, T ... Mask thickness,
d: Ball diameter.

Claims (8)

Collectively the large ball and small ball a different diameter ball mounting jig for mounting a predetermined position of the mounting member,
Wherein the jig body and having a bottom diameter ball recess and the recess for small balls to hold the large-diameter balls and the small-diameter ball is formed, the large diameter through the through hole in contact with the jig body and a mask transfer money a ball and a small diameter ball and the recess for large diameter concave portions and small-diameter ball for a ball,
The large-diameter ball recesses and the small-diameter ball recesses are formed in accordance with the arrangement and diameter of the large-diameter balls and small-diameter balls to be mounted together, and the tops of the held large-diameter balls and small-diameter balls are the same. A jig for mounting different-diameter balls, characterized in that the jig is formed to a depth matching the diameters of the large-diameter ball and the small-diameter ball so as to have a height. The large-diameter ball recesses and the recesses for the small diameter ball, different diameters ball mounting according to claim 1 wherein said retained the top of the large-diameter balls and the small-diameter balls are formed to a depth to protrude from the jig body surface Jig. The thickness of the mask, of claim 2, wherein said retained in the large diameter recessed portion and the concave portion for small diameter ball for a ball which is substantially the same size as the projecting distance from the jig body surface of the large-diameter balls and the small-diameter ball Jig for mounting different diameter balls. The mask corresponds to the arrangement pattern of the recesses for large-diameter balls , the mask for large-diameter balls in which a through-hole through which the large-diameter ball can be inserted is formed, and the small-diameter balls corresponding to the arrangement pattern of the recesses for small-diameter balls A small-diameter ball mask formed with a through-hole that can be inserted, and the large-diameter ball mask corresponds to the arrangement pattern of the concave portions for the small-diameter ball when abutted against the jig body. The jig for mounting different-diameter balls according to any one of claims 1 to 3, wherein an escape hole is formed in which the small-diameter ball does not contact. A different diameter ball mounting jig according to claim 4, further comprising wherein is disposed on the large diameter mask ball, and a thin plate-like lid for closing the relief hole Jig for mounting different diameter balls. Wherein the jig main body, a large ball and the small-diameter balls held when mounting the mountable member, 1 to claim means pressing push the large-diameter balls and the small-diameter ball mountable member is disposed The jig for mounting a different-diameter ball according to any one of 5. Collectively the large ball and the small-diameter ball Lumpur a different diameter ball mounting method for mounting a predetermined position of the mounting member,
After elaborate vibration concave portion for small diameter ball jig body small diameter ball Lumpur using a mask for small-sized ball, transfer money to the large-diameter ball recess of jig body large-diameter balls by using a mask for large diameter ball vibration and write process, the step and the corresponding mountable portion of the small-diameter ball and large ball and the mounting body that is held in the recess concave portion and the large ball diameter balls jig body abuts, and the jig body and transferring collectively the small ball and large ball that is held in the jig body by separating the mounting member to be mounted member,
A method for mounting different-diameter balls, comprising: The transfer before the step, different diameter ball mounting method according to claim 7, further comprising a step of applying the temporary fixing agent in the recess and the recess for the small ball diameter balls jig body.

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