JP4807303B2 - Electronic component unit - Google Patents

Electronic component unit Download PDF

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JP4807303B2
JP4807303B2 JP2007102429A JP2007102429A JP4807303B2 JP 4807303 B2 JP4807303 B2 JP 4807303B2 JP 2007102429 A JP2007102429 A JP 2007102429A JP 2007102429 A JP2007102429 A JP 2007102429A JP 4807303 B2 JP4807303 B2 JP 4807303B2
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metal plate
electronic component
coupling member
substrate
base
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JP2008262948A (en
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徹 大西
俊之 中田
辰一 山之内
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Panasonic Corp
Panasonic Holdings Corp
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Panasonic Corp
Matsushita Electric Industrial Co Ltd
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Description

本発明は、基体に基板を取り付けた電子部品ユニットに関する。   The present invention relates to an electronic component unit in which a substrate is attached to a base.

図８に示すように、従来の電子部品ユニット１は、基体２と、この基体２上に取り付けられた金属板３と、この金属板３上に形成された絶縁層４と、この絶縁層４上に形成された導体パターン５と、この導体パターン５上に実装された電子部品６とを備えている。   As shown in FIG. 8, the conventional electronic component unit 1 includes a base 2, a metal plate 3 attached on the base 2, an insulating layer 4 formed on the metal plate 3, and the insulating layer 4. A conductor pattern 5 formed thereon and an electronic component 6 mounted on the conductor pattern 5 are provided.

このように金属板３を基体２に取り付けることで、電子部品６からの熱を、金属板３を介して基体２へ放出することができるのである。   By attaching the metal plate 3 to the base 2 in this way, heat from the electronic component 6 can be released to the base 2 through the metal plate 3.

そして従来、基体２と金属板３とはビス留めされており、ビス７は金属板３上面から突出するように貫通している。そしてこの突出した部分にナット８等をはめ、金属板３と基体２とを上下で挟み込むようにして接合しているのである。したがって、ビス留めは、ビス孔に絶縁層４用の樹脂が流れ込まないよう、絶縁層４の形成されていない部分で行う必要があり、さらに電子部品６とビス７との電気的絶縁距離を確保するため、金属板３の端部で行われるのが一般的であった。
特開平７−２９７５７２号公報 Conventionally, the base 2 and the metal plate 3 are screwed, and the screw 7 penetrates so as to protrude from the upper surface of the metal plate 3. Then, a nut 8 or the like is fitted to the protruding portion, and the metal plate 3 and the base 2 are joined so as to be sandwiched vertically. Therefore, it is necessary to perform screwing at a portion where the insulating layer 4 is not formed so that the resin for the insulating layer 4 does not flow into the screw hole, and further secure an electrical insulation distance between the electronic component 6 and the screw 7. For this reason, it has been generally performed at the end of the metal plate 3.
JP-A-7-297572

上記の従来の電子部品ユニット１では、金属板３と基体２との間に隙間ができ、放熱性が低下することがあった。   In the above-described conventional electronic component unit 1, a gap is formed between the metal plate 3 and the base 2, and the heat dissipation may be deteriorated.

それは、ビス７は金属板３の端部など、絶縁層４の形成されていない限られた場所でしか用いることができなかったためである。   This is because the screw 7 can be used only in a limited place where the insulating layer 4 is not formed, such as an end portion of the metal plate 3.

したがって、金属板３と基体２との間の密着性が低下し、結果として熱抵抗が増大し、放熱性が低下してしまうのであった。   Therefore, the adhesion between the metal plate 3 and the substrate 2 is lowered, resulting in an increase in thermal resistance and a decrease in heat dissipation.

また電子部品６が発熱すると、絶縁層４と金属板３との熱膨張率の差により、金属板３の中央部分が凸状に反ってしまうため、この問題は特に顕著となっていた。   Further, when the electronic component 6 generates heat, the central portion of the metal plate 3 is warped in a convex shape due to the difference in thermal expansion coefficient between the insulating layer 4 and the metal plate 3, and this problem is particularly remarkable.

そこで本発明は、金属板と基体との密着性を高め、放熱性を向上させることを目的とする。   Therefore, an object of the present invention is to improve the adhesion between the metal plate and the substrate and improve the heat dissipation.

この目的を達成するため本発明は、基体と、この基体上に取り付けられた金属板と、この金属板上に形成された絶縁層と、この絶縁層上方に配置された電子部品とを備え、金属板は、基体との対向面に凹部を有し、この凹部および基体の内部には、金属板と基体とを接合する結合部材が圧入され、前記結合部材は、前記基体および前記金属板よりも弾性率の大きいものとした。 In order to achieve this object, the present invention includes a base, a metal plate attached on the base, an insulating layer formed on the metal plate, and an electronic component disposed above the insulating layer. The metal plate has a concave portion on the surface facing the base, and a coupling member for joining the metal plate and the base is press-fitted into the concave portion and the base. The coupling member is formed by the base and the metal plate. Also had a large elastic modulus .

これにより本発明は、金属板と基体との密着性を高め、放熱性を向上させることができる。   Thereby, this invention can improve the adhesiveness of a metal plate and a base | substrate, and can improve heat dissipation.

それは、金属板の凹部および基体の内部に結合部材を圧入することにより、凹部や基体の内壁を弾性変形させることで結合部材と密着させ、金属板と基体とを接合したためである。 This is because the coupling member is press-fitted into the concave portion of the metal plate and the inside of the base body, and the concave wall and the inner wall of the base body are elastically deformed to be brought into close contact with the coupling member , thereby joining the metal plate and the base body.

すなわち本発明は、金属板および基体の内部で発生した抗力および摩擦力によって金属板と基体とを接合できるため、絶縁層や電子部品の下方など、所望の位置に結合部材を配置することができる。   That is, according to the present invention, since the metal plate and the base can be joined by the drag and friction generated inside the metal plate and the base, the coupling member can be disposed at a desired position such as below the insulating layer or the electronic component. .

そしてその結果、金属板と基体との密着性を高め、放熱性を向上させることができるのである。   As a result, the adhesion between the metal plate and the substrate can be improved, and the heat dissipation can be improved.

（実施の形態１）
図１（ａ）（ｂ）に示すように、本実施の形態の電子部品ユニット９は、基体１０と、この基体１０上に接合された金属板１１と、この金属板１１上に形成された絶縁層１２と、この絶縁層１２上に表面が露出するように埋め込まれた導体パターン１３と、この導体パターン１３に実装された複数の電子部品１４とを備えている。そして図１（ｂ）に示すように金属板１１および基体１０の内部には、これらの金属板１１と基体１０とを接合する結合部材１５が複数個圧入されている。 (Embodiment 1)
As shown in FIGS. 1A and 1B, the electronic component unit 9 according to the present embodiment is formed on a base 10, a metal plate 11 bonded on the base 10, and the metal plate 11. An insulating layer 12, a conductor pattern 13 embedded on the insulating layer 12 so that the surface is exposed, and a plurality of electronic components 14 mounted on the conductor pattern 13 are provided. As shown in FIG. 1B, a plurality of coupling members 15 for joining the metal plate 11 and the base body 10 are press-fitted inside the metal plate 11 and the base body 10.

なお、これらの結合部材１５は、金属板１１に形成された複数の凹部１６と、これらの凹部１６に対向するように基体１０に形成された孔１７に圧入されたものである。本実施の形態では、結合部材１５は角柱形のものを用い、凹部１６および孔１７は円柱形とし、角柱形の結合部材１５を凹部１６および孔１７に圧入することにより、凹部１６および孔１７の内壁が弾性変形し、結合部材１５の表面と面接触するように密着している。   These coupling members 15 are press-fitted into a plurality of recesses 16 formed in the metal plate 11 and holes 17 formed in the base 10 so as to face the recesses 16. In the present embodiment, the coupling member 15 is a prismatic shape, the recesses 16 and the holes 17 are cylindrical, and the depressions 16 and the holes 17 are formed by press-fitting the prismatic coupling members 15 into the recesses 16 and 17. The inner wall is elastically deformed and is in close contact with the surface of the coupling member 15.

また本実施の形態では、図２の金属板１１の下面図のように、金属板１１の四隅（端部）に圧入されている結合部材１５ａと、金属板１１の端部であって長辺の略中点近傍に圧入されている結合部材１５ｂと、その内側であり、金属板１１の略中心およびその近傍に圧入されている結合部材１５ｃとがあり、内側の結合部材１５ｃは絶縁層１２の下方に相当する部分に配置されている。なお、以下結合部材１５ａ〜１５ｃを特に区別しない場合は、結合部材１５と表記する。   Further, in the present embodiment, as shown in the bottom view of the metal plate 11 in FIG. 2, the coupling member 15 a press-fitted into the four corners (end portions) of the metal plate 11, and the end portion of the metal plate 11 and the long side There are a coupling member 15b that is press-fitted in the vicinity of the middle point of the metal plate 11 and a coupling member 15c that is press-fitted in the approximate center of the metal plate 11 and in the vicinity thereof, and the inner coupling member 15c is the insulating layer 12. It is arrange | positioned in the part corresponded below. In the following description, the connecting members 15a to 15c will be referred to as connecting members 15 unless otherwise distinguished.

また本実施の形態では、図１（ｂ）に示すように、端部の結合部材１５ｂ（図２の１５ａも含む）は内側の結合部材１５ｃよりも長く、基体１０を貫通し、この基体１０から外方へ突出している。   Further, in the present embodiment, as shown in FIG. 1B, the coupling member 15b at the end (including 15a in FIG. 2) is longer than the coupling member 15c on the inner side and penetrates the base body 10, and this base body 10 Projecting outwards.

また本実施の形態では、結合部材１５の弾性率は、基体１０および金属板１１より大きく（硬く）、さらに結合部材１５の熱膨張率は基体１０および金属板１１より大きいものを用いた。   In the present embodiment, the elastic modulus of the coupling member 15 is larger (harder) than that of the base body 10 and the metal plate 11, and the thermal expansion coefficient of the coupling member 15 is larger than that of the base body 10 and the metal plate 11.

以下に本実施の形態における部材の材料等について説明する。   The material of the member in this Embodiment is demonstrated below.

本実施の形態では、結合部材１５として、銅または鉄を、断面が１．５ｍｍ×１．５ｍｍの正方形、高さが０．５ｍｍ〜３．０ｍｍ程度の角柱形に加工した物を用いた。   In the present embodiment, as the coupling member 15, a material obtained by processing copper or iron into a square column having a cross section of 1.5 mm × 1.5 mm and a height of about 0.5 mm to 3.0 mm is used.

基体１０は厚み０．５ｍｍ〜３．０ｍｍ程度のアルミ板を用いた。このアルミ板の代わりにアルミ等で出来たヒートシンクや箱体を用いてもよく、また基体１０とヒートシンクとを接着したものを用いてもよい。   As the substrate 10, an aluminum plate having a thickness of about 0.5 mm to 3.0 mm was used. Instead of this aluminum plate, a heat sink or box made of aluminum or the like may be used, or a substrate 10 and a heat sink bonded together may be used.

また金属板１１としては０．５ｍｍ〜３．０ｍｍ程度のアルミ板または銅板などの熱伝導性に優れた金属板１１を用いた。   As the metal plate 11, a metal plate 11 having excellent thermal conductivity such as an aluminum plate or a copper plate of about 0.5 mm to 3.0 mm was used.

絶縁層１２としては、エポキシ樹脂あるいはフェノール樹脂などの熱硬化性樹脂に、平均粒径１μｍ〜５０μｍのアルミナあるいは窒化アルミなどの無機フィラを７０重量％〜９５重量％程度含有させた熱伝導性の良い（熱伝導率が１Ｗ／ｍ・Ｋ以上）複合材料を用いた。   The insulating layer 12 is a heat conductive resin in which an inorganic filler such as alumina or aluminum nitride having an average particle diameter of 1 μm to 50 μm is contained in a thermosetting resin such as epoxy resin or phenol resin in an amount of about 70 wt% to 95 wt%. A good composite material (having a thermal conductivity of 1 W / m · K or more) was used.

また本実施形態では、このフィラ入りエポキシ樹脂に予め熱可塑性樹脂粉末からなるプレゲル材を添加した。このプレゲル材は、未硬化の熱硬化性樹脂の液状成分を吸収して膨張し、素早くゲル化させるため、樹脂が硬化する前に金型から取り出すことが出来る。   Moreover, in this embodiment, the pregel material which consists of thermoplastic resin powder was previously added to this epoxy resin with a filler. This pregel material absorbs the liquid component of the uncured thermosetting resin, expands, and quickly gels, so that it can be taken out from the mold before the resin is cured.

なお、本実施の形態では、絶縁層１２の基材として熱硬化性樹脂を用いたが、液晶ポリマーやＰＰＳなどの高熱伝導性熱可塑性樹脂を用いてもよい。   In this embodiment, a thermosetting resin is used as the base material of the insulating layer 12, but a high thermal conductive thermoplastic resin such as a liquid crystal polymer or PPS may be used.

また導体パターン１３としては、厚み０．１ｍｍ〜２．０ｍｍ程度の銅板を用いた。   As the conductor pattern 13, a copper plate having a thickness of about 0.1 mm to 2.0 mm was used.

以下に、本実施の形態の放熱基板７の製造工程を説明する。   Below, the manufacturing process of the thermal radiation board | substrate 7 of this Embodiment is demonstrated.

まず、図３に示す金属板１１の下面に直径約２φの複数の凹部１６を形成し、これらの凹部１６に結合部材１５を圧入する。このとき、結合部材１５の端面と凹部１６の底面とがピッタリ密着するまで圧入する。このように圧力をかけても、本実施の形態では、凹部１６に結合部材１５を圧入するため、結合部材１５が金属板１１上面に突出することがなく、金属板１１内部で後述の基体との接合が可能となるのである。   First, a plurality of recesses 16 having a diameter of about 2φ are formed on the lower surface of the metal plate 11 shown in FIG. 3, and the coupling member 15 is press-fitted into these recesses 16. At this time, press-fitting is performed until the end surface of the coupling member 15 and the bottom surface of the recess 16 are in close contact with each other. Even if pressure is applied in this manner, in this embodiment, since the coupling member 15 is press-fitted into the recess 16, the coupling member 15 does not protrude on the upper surface of the metal plate 11, so It becomes possible to join.

また本実施の形態では、結合部材１５としては端部側には長いものを圧入し、内側には短いものを圧入した。   Moreover, in this Embodiment, as the coupling member 15, the long thing was press-fit in the edge part side, and the short thing was press-fitted inside.

次に銅板に回路をパターニングし導体パターン１３を形成する。このパターニングは、プレス打ち抜きあるいはレーザなどで加工すればよい。   Next, a circuit is patterned on the copper plate to form a conductor pattern 13. This patterning may be processed by press punching or laser.

その後、導体パターン１３上であって、電子部品１４を実装する部分の反対面側に、無機フィラ入りの樹脂の塊を、中央が凸になるように丸型（あるいは蒲鉾型、台形、円柱、球状）にまとめて置く。   Thereafter, on the conductor pattern 13, on the opposite side of the portion where the electronic component 14 is mounted, a lump of resin containing an inorganic filler is rounded (or saddle-shaped, trapezoidal, cylindrical, Put them together in a spherical shape.

そしてこの無機フィラ入り樹脂を加熱プレス、あるいは真空加熱プレス等によってシート状となるように延伸し、絶縁層１２を形成する。その後この絶縁層１２上に金属板１１を乗せ、さらにプレスする。このとき、導体パターン１３の上面が絶縁層１２の上面で露出するように埋め込む。このように埋め込むと、導体パターン１３の側面および下面が熱伝導樹脂で被覆され、かつ金属板１１との距離が短くなって熱伝導性が向上する。   Then, this inorganic filler-containing resin is stretched into a sheet shape by a heat press or a vacuum heat press to form the insulating layer 12. Thereafter, the metal plate 11 is placed on the insulating layer 12 and further pressed. At this time, the conductive pattern 13 is embedded so that the upper surface of the conductive pattern 13 is exposed on the upper surface of the insulating layer 12. When embedded in this way, the side surface and the lower surface of the conductor pattern 13 are covered with the heat conductive resin, and the distance from the metal plate 11 is shortened to improve the heat conductivity.

次にこの絶縁層１２を２００℃で１〜２分間加熱し、形状が維持できる程度に固まった後金型から取り外し、さらに２００℃の炉に８〜１０分程度入れ、本硬化させる。   Next, the insulating layer 12 is heated at 200 ° C. for 1 to 2 minutes, solidified to such an extent that the shape can be maintained, then removed from the mold, and further placed in a 200 ° C. furnace for about 8 to 10 minutes to be fully cured.

なお、導体パターン１３には本実施形態のように回路をパターニングしているものだけでなく、単なる熱拡散用あるいは部品半田付け用の銅板も含むものとする。また絶縁層１２に埋め込まなくとも、熱伝導性の高い接着剤などで貼り付けてもよい。   The conductor pattern 13 includes not only a circuit pattern patterned as in this embodiment but also a copper plate for simple heat diffusion or component soldering. Further, it may be attached with an adhesive having high thermal conductivity without being embedded in the insulating layer 12.

その後、導体パターン１３上に電子部品１４を半田付けして実装する。回路パターンが不要な電子部品１４は導体パターン１３を介さず絶縁層１２上に実装してもよく、さらに絶縁体で被覆されている電子部品１４は、絶縁層１２を介さず、直接金属板１１上に実装してもよい。   Thereafter, the electronic component 14 is soldered and mounted on the conductor pattern 13. The electronic component 14 that does not require a circuit pattern may be mounted on the insulating layer 12 without the conductor pattern 13, and the electronic component 14 covered with an insulator is directly connected to the metal plate 11 without the insulating layer 12. You may implement it above.

その後、基体１０に直径約２φの孔１７を形成する。この孔１７は、金属板１１の凹部１６と対向する位置に設ける。そしてまず長い結合部材１５ｂ（図１（ｂ）の１５ａも含む）を端部の孔１７に圧入し、その後短い結合部材１５ｃを内側の孔１７に圧入し、金属板１１と基体１０とを接合させる。このように形成すると、図１（ａ）（ｂ）に示すような電子部品ユニット９となる。   Thereafter, a hole 17 having a diameter of about 2φ is formed in the base 10. The hole 17 is provided at a position facing the concave portion 16 of the metal plate 11. First, the long coupling member 15b (including 15a in FIG. 1B) is press-fitted into the hole 17 at the end, and then the short coupling member 15c is press-fitted into the inner hole 17, so that the metal plate 11 and the substrate 10 are joined. Let When formed in this way, an electronic component unit 9 as shown in FIGS. 1A and 1B is obtained.

なお、本実施の形態では、結合部材１５のみを用いて金属板１１を基体１０に取り付けたが、絶縁層の形成されていない端部はネジ留め等の他の取り付け機構と併用してもよい。   In the present embodiment, the metal plate 11 is attached to the base body 10 using only the coupling member 15, but the end portion where the insulating layer is not formed may be used in combination with other attachment mechanisms such as screwing. .

本実施の形態の効果を以下に説明する。   The effect of this embodiment will be described below.

本実施の形態では、金属板１１と基体１０との密着性を高め、放熱性を向上させることができる。   In this Embodiment, the adhesiveness of the metal plate 11 and the base | substrate 10 can be improved, and heat dissipation can be improved.

それは、金属板１１および基体１０の内部に結合部材１５を圧入することにより、金属板１１と基体１０とを接合したためである。   This is because the metal plate 11 and the base body 10 are joined by press-fitting the coupling member 15 into the metal plate 11 and the base body 10.

すなわち図８に示すような従来の電子部品ユニット１では、金属板３と基体２とを、ビス７などによって上下に挟み込むようにして接合させていたため、ビス孔に絶縁層４用の樹脂が流れ込まないよう、金属板３の端部など、絶縁層４の形成されていない限られた場所しかビス留めすることができなかった。また電子部品６や導体パターン５との電気的絶縁距離を確保しようとすると、金属板３の端部でビス留めするのが一般的であった。   That is, in the conventional electronic component unit 1 as shown in FIG. 8, since the metal plate 3 and the base 2 are joined so as to be sandwiched between the screws 7 or the like, the resin for the insulating layer 4 flows into the screw holes. As a result, only a limited place where the insulating layer 4 is not formed, such as an end portion of the metal plate 3, could be screwed. Further, in order to secure an electrical insulation distance from the electronic component 6 and the conductor pattern 5, it is general to screw with the end portion of the metal plate 3.

このように従来は任意の位置にビス留めすることができないため、隣接するビス７の間隔が長くなり、金属板３と基体２との間の密着性が低下し、結果として熱抵抗が増大し、放熱性が低下してしまうのであった。   Thus, conventionally, since it cannot be screwed at an arbitrary position, the interval between the adjacent screws 7 becomes long, the adhesion between the metal plate 3 and the base 2 is lowered, and as a result, the thermal resistance is increased. The heat dissipation is reduced.

それに対して本実施の形態では、図１(ｂ)に示すように、金属板１１および基体１０の内部に結合部材１５を圧入することにより、金属板１１と基体１０とを接合させている。つまり、金属板１１および基体１０の内部で発生した抗力および摩擦力によって金属板１１と基体１０とを接合させていることになる。   In contrast, in the present embodiment, as shown in FIG. 1B, the metal plate 11 and the base body 10 are joined by press-fitting the coupling member 15 into the metal plate 11 and the base body 10. That is, the metal plate 11 and the base body 10 are joined by the drag and friction force generated inside the metal plate 11 and the base body 10.

したがって、結合部材１５を金属板１１上面から突出させることなく、金属板１１および基体１０の内部で両者を接合することができる。また金属板１１形成したのは凹部１６であるから、絶縁層１２との接合面までは貫通しておらず、絶縁層１２用の樹脂が流れ込むこともない。よって、絶縁層１２や電子部品１４の下方など、所望の位置に結合部材１５を配置することができる。   Therefore, both can be joined inside the metal plate 11 and the base body 10 without causing the coupling member 15 to protrude from the upper surface of the metal plate 11. In addition, since the metal plate 11 is formed in the recess 16, the metal plate 11 does not penetrate to the joint surface with the insulating layer 12, and the resin for the insulating layer 12 does not flow. Therefore, the coupling member 15 can be disposed at a desired position such as below the insulating layer 12 or the electronic component 14.

そしてその結果、金属板１１と基体１０との密着性を高め、放熱性を向上させることができるのである。   As a result, the adhesion between the metal plate 11 and the substrate 10 can be improved, and the heat dissipation can be improved.

なお、本実施の形態のように結合部材１５を圧入する場合、金属板１１および基体１０内部で発生する圧力によって両者を接合することができるため、金属板１１が１．０ｍｍ以下と薄い場合でも強固に接合することができる。   Note that when the coupling member 15 is press-fitted as in the present embodiment, both can be joined by the pressure generated in the metal plate 11 and the base 10, so even if the metal plate 11 is as thin as 1.0 mm or less. It can be firmly joined.

さらにビス留めの場合と比較し、結合部材１５と電子部品１５との絶縁距離を考慮しなくてよいため、小型化が可能になる。   Further, as compared with the case of screwing, it is not necessary to consider the insulation distance between the coupling member 15 and the electronic component 15, so that the size can be reduced.

また電子部品１４が発熱すると、絶縁層１２と金属板１１との熱膨張率の差により、金属板１１の中央部分、すなわち絶縁層１２の下方に相当する部分が凸状に反ってしまうことがあるが、本実施の形態のように、絶縁層１２の下方相当部分に結合部材１５ｃを圧入しておくことによって金属板１１の反りを低減することができ、結果として金属板１１と基体１０との密着性を高め、放熱性を向上させることができる。また本実施の形態のように、熱源である電子部品１４の下方に相当する部分に結合部材１５ｃを圧入することによって、熱源に近い部分の金属板１１と基体１０との隙間を低減することができ、より放熱性を向上させることができる。   Further, when the electronic component 14 generates heat, the central portion of the metal plate 11, that is, the portion corresponding to the lower portion of the insulating layer 12 may be warped in a convex shape due to the difference in thermal expansion coefficient between the insulating layer 12 and the metal plate 11. However, as in the present embodiment, warping of the metal plate 11 can be reduced by press-fitting the coupling member 15c into the lower portion of the insulating layer 12, and as a result, the metal plate 11 and the substrate 10 can be reduced. It is possible to improve the adhesion and improve heat dissipation. Further, as in the present embodiment, the gap between the metal plate 11 and the base 10 in the portion near the heat source can be reduced by press-fitting the coupling member 15c into the portion corresponding to the lower portion of the electronic component 14 that is the heat source. It is possible to improve heat dissipation.

また本実施の形態では、結合部材１５の弾性率は、基体１０および金属板１１よりも大きい（硬い）ものとし、結合部材１５の断面は正方形であり、金属板１１の凹部１６および基体１０の孔１７の断面は円形とした。またこの円の直径は、結合部材１５断面の正方形における対角線長さより２％から１０％ほど小さくしている。   In the present embodiment, the elastic modulus of the coupling member 15 is larger (harder) than that of the base body 10 and the metal plate 11, and the cross section of the coupling member 15 is a square. The cross section of the hole 17 was circular. The diameter of this circle is 2% to 10% smaller than the diagonal length of the square of the cross section of the coupling member 15.

したがって、結合部材１５を凹部１６および孔１７に圧入すると、これらの凹部１６および孔１７がわずかに弾性変形して結合部材１５により密着させることができ、放熱性を向上させることができる。   Therefore, when the coupling member 15 is press-fitted into the concave portion 16 and the hole 17, the concave portion 16 and the hole 17 can be slightly elastically deformed to be brought into close contact with the coupling member 15, and heat dissipation can be improved.

さらに本実施の形態における結合部材１５の熱膨張率は、基体１０および金属板１１よりも大きいため、電子部品１４の発熱時に金属板１１および基体１０が熱膨張しても、微小な結合部材１５が押しつぶされるのを抑制することができる。   Furthermore, since the coefficient of thermal expansion of the coupling member 15 in the present embodiment is greater than that of the base 10 and the metal plate 11, even if the metal plate 11 and the base 10 are thermally expanded during the heat generation of the electronic component 14, the minute coupling member 15. Can be suppressed from being crushed.

また本実施の形態では、複数の結合部材１５のうち、端部に配置された結合部材１５ａ、１５ｂは、基体１０を貫通し、この基体１０から外方へとより大きく突出している。したがって、金属板１１の凹部１６に圧入した結合部材１５ａ〜１５ｃを基体１０の孔１７に圧入する時、端部の長い結合部材１５ａ、１５ｂを先に孔１７へ圧入することができ、複数の結合部材１５ａ〜１５ｃの位置決めを容易に行うことができる。   Further, in the present embodiment, among the plurality of coupling members 15, the coupling members 15 a and 15 b arranged at the end portions penetrate the base body 10 and protrude more outward from the base body 10. Therefore, when the coupling members 15a to 15c press-fitted into the recess 16 of the metal plate 11 are press-fitted into the hole 17 of the base body 10, the long-end coupling members 15a and 15b can be first press-fitted into the hole 17, The coupling members 15a to 15c can be easily positioned.

なお本実施の形態では、基体１０より先に金属板１１に結合部材１５を圧入したため、より熱源（電子部品１４）に近い方を密着・圧入しやすくなる。また本実施の形態では、導体パターン１３として０．１ｍｍ以上の厚さの銅板を用いたこと、および絶縁層１２を、無機フィラを高濃度に充填し、熱伝導率を１Ｗ／ｍ・Ｋ以上にまで向上させたことにより、電子部品１４から基体１０への熱伝導がよりスムーズになり、放熱性向上に寄与する。   In the present embodiment, since the coupling member 15 is press-fitted into the metal plate 11 prior to the base body 10, it becomes easier to closely contact and press-fit the one closer to the heat source (electronic component 14). Further, in the present embodiment, a copper plate having a thickness of 0.1 mm or more is used as the conductor pattern 13, and the insulating layer 12 is filled with an inorganic filler at a high concentration, and the thermal conductivity is 1 W / m · K or more. As a result, the heat conduction from the electronic component 14 to the base 10 becomes smoother, which contributes to the improvement of heat dissipation.

（実施の形態２）
本実施の形態と実施の形態１との違いは、図４に示すようにパワー半導体素子あるいはトランスなど、発熱性の非常に高い発熱性電子部品１８を実装した点である。 (Embodiment 2)
The difference between the present embodiment and the first embodiment is that an exothermic electronic component 18 having a very high exothermic property such as a power semiconductor element or a transformer is mounted as shown in FIG.

そして本実施の形態では、発熱性電子部品１８下方に相当する部分と、金属板１１の内側とに圧入された結合部材１５ｃは、金属板１１の端部の結合部材１５ｂ（図２に示す四隅の結合部材１５ａも含む。以下本実施の形態において同じ。）や金属板１１よりも熱伝導率のよい銅（熱伝導率0.923 cal/cm2/sec/℃/cm）を用いて形成した。なお、本実施の形態では、端部の結合部材１５ｂは熱伝導率約0.145 cal/cm2/sec/℃/cmの鉄製であり、金属板１１は熱伝導率約0.487 cal/cm2/sec/℃/cmのアルミ製である。また金属板１１の端部には内側の結合部材１５ｃ（銅の弾性率約1300×103/cm2）よりも弾性率の大きい（硬い）鉄（弾性率約2100×103/cm2）からなる結合部材１５ｂを圧入した。 In this embodiment, the coupling member 15c press-fitted into the portion corresponding to the lower part of the heat-generating electronic component 18 and the inside of the metal plate 11 is coupled to the coupling member 15b (four corners shown in FIG. 2) at the end of the metal plate 11. The same is applied in the present embodiment, and copper having a thermal conductivity higher than that of the metal plate 11 (thermal conductivity 0.923 cal / cm 2 / sec / ° C./cm) is used. In the present embodiment, the end connecting member 15b is made of iron having a thermal conductivity of about 0.145 cal / cm 2 / sec / ° C./cm, and the metal plate 11 has a thermal conductivity of about 0.487 cal / cm 2 / sec. It is made of aluminum at / ℃ / cm. Also at the end of the metal plate 11 inside the coupling member 15c of the elastic modulus than (copper modulus of about 1300 × 10 3 / cm 2) of larger (harder) iron (about 2100 × 10 3 / cm 2 modulus of elasticity) The connecting member 15b made of was press-fitted.

また本実施の形態では、導体パターン１３は回路が形成されていない単なる銅板であり、この銅板は絶縁層１２上に熱伝導性接着剤などで貼り付けられている。また電子部品１４および発熱性電子部品１８はこれらの導体パターン１３上に実装されている。   Further, in the present embodiment, the conductor pattern 13 is a simple copper plate on which no circuit is formed, and this copper plate is affixed on the insulating layer 12 with a heat conductive adhesive or the like. The electronic component 14 and the heat-generating electronic component 18 are mounted on the conductor pattern 13.

本実施の形態における効果を以下に説明する。   The effect in this Embodiment is demonstrated below.

本実施の形態では、金属板１１より熱伝導率の大きい銅からなる結合部材１５ｃを発熱性電子部品１８の下方に圧入したため、この結合部材１５ｃが発熱性電子部品１８下方における金属板１１と基体１０との隙間を低減できるとともに、結合部材１５ｃ自体がヒートパイプの機能も果たし、放熱性を向上させることができる。   In the present embodiment, since the coupling member 15c made of copper having a higher thermal conductivity than the metal plate 11 is press-fitted below the heat generating electronic component 18, the coupling member 15c is connected to the metal plate 11 and the base below the heat generating electronic component 18. 10 can be reduced, and the coupling member 15c itself can also function as a heat pipe, thereby improving heat dissipation.

また本実施の形態では、端部の結合部材１５ｂは内側の結合部材１５ｃよりも弾性率が大きい（硬い）ため、金属板１１端部における基体１０との接合がより強固となり、接合の機械的強度を向上させることができる。   Further, in the present embodiment, the coupling member 15b at the end portion has a larger elastic modulus (hard) than the coupling member 15c at the inner side, so that the bonding with the base 10 at the end portion of the metal plate 11 becomes stronger, and the bonding mechanical Strength can be improved.

そして端部の接合強度を向上させておけば、内側の結合部材１５ｃは、機械的強度より熱伝導性を優先して材料を選定することができ、結合部材１５ａ〜１５ｃを用いて接合強度向上と熱伝導性向上との両立を図ることができる。   If the bonding strength of the end portion is improved, the inner coupling member 15c can select a material by giving priority to thermal conductivity over mechanical strength, and the bonding strength can be improved by using the coupling members 15a to 15c. And improvement in thermal conductivity can be achieved.

また銅は比較的高価な材料であるが、限られた場所にのみ銅製の結合部材１５ｃを用いればよいため、製品のコストダウンにつながる。   Although copper is a relatively expensive material, it is only necessary to use the copper coupling member 15c only in a limited place, which leads to a reduction in the cost of the product.

なお、本実施の形態では、実施の形態１と同様に、予め結合部材１５を金属板１１に圧入してから、最後に基体１０の孔１７に圧入したが、図５に示すように、基体１０に予め結合部材１５を圧入し、最後に金属板１１の凹部１６に圧入してもよい。   In the present embodiment, as in the first embodiment, the coupling member 15 is press-fitted into the metal plate 11 in advance, and finally is press-fitted into the hole 17 of the base 10. However, as shown in FIG. Alternatively, the coupling member 15 may be press-fitted in advance into 10 and finally pressed into the recess 16 of the metal plate 11.

また端部に配置した位置決め用の結合部材１５ｂは、先端を細くしておけば、孔１７や凹部１６に圧入しやすくなる。   Further, the positioning coupling member 15b arranged at the end portion can be easily press-fitted into the hole 17 or the concave portion 16 if the tip is made thin.

その他の構成、効果は実施の形態１と同様であるため説明を省略する。   Since other configurations and effects are the same as those of the first embodiment, description thereof is omitted.

（実施の形態３）
本実施の形態と実施の形態１との違いは、図６に示すように、結合部材１５の側面に突起１９を設けた点である。この突起１９によって凹部１６や孔１７内壁における摩擦力が大きくなり、金属板１１と基体１０との接合強度を向上させることが出来る。 (Embodiment 3)
The difference between the present embodiment and the first embodiment is that a projection 19 is provided on the side surface of the coupling member 15 as shown in FIG. The protrusion 19 increases the frictional force in the recess 16 and the inner wall of the hole 17, thereby improving the bonding strength between the metal plate 11 and the substrate 10.

なお本実施の形態では、実施の形態１と同様に、加工の容易性から金属板１１の凹部１６および基体１０の孔１７は円柱形とし、接合強度向上のため結合部材１５は角柱形としたが、凹部１６および孔１７から摩擦力および抗力を受け、結合部材１５と凹部１６及び孔１７内壁とが面接触するならば、結合部材１５は円柱形でもよい。またこの場合は、凹部１６および孔１７を角柱形としておけば、金属板１１および基体１０との接合をより強固に行うことができる。   In the present embodiment, as in the first embodiment, the recess 16 of the metal plate 11 and the hole 17 of the base 10 are formed in a column shape for ease of processing, and the coupling member 15 is formed in a prismatic shape for improving the bonding strength. However, if the coupling member 15 and the inner wall of the recess 16 and the hole 17 are in surface contact with each other, the coupling member 15 may be cylindrical. Further, in this case, if the concave portion 16 and the hole 17 are formed in a prismatic shape, the metal plate 11 and the base body 10 can be joined more firmly.

その他の構成、効果は実施の形態１と同様であるため説明を省略する。   Since other configurations and effects are the same as those of the first embodiment, description thereof is omitted.

なお、上記実施の形態では、基体１０には孔１７を形成し、結合部材１５を圧入させたが、図７に示すように、基体１０に凹部２０を設け、この凹部２０に結合部材１５を圧入してもよい。   In the above embodiment, the hole 10 is formed in the base 10 and the coupling member 15 is press-fitted. However, as shown in FIG. 7, the base 10 is provided with a recess 20, and the coupling member 15 is provided in the recess 20. You may press fit.

以上のように本発明は、反りやすい金属板も基体に密着させて取り付けることができ、放熱性を向上させることができるため、高性能化にともない発熱量が増大する電子部品ユニットに大いに利用することができる。   As described above, the present invention can also attach a metal plate which is easily warped to a base, and can improve heat dissipation. Therefore, the present invention is greatly used for an electronic component unit in which the amount of heat generated increases as performance increases. be able to.

（ａ）本発明の一実施の形態における電子部品ユニットの上面図、（ｂ）同電子部品ユニットの断面図（図１（ａ）におけるＸＸ断面）(A) Top view of electronic component unit in one embodiment of the present invention, (b) Cross-sectional view of the electronic component unit (XX cross section in FIG. 1 (a)) 本発明の一実施の形態における金属板の下面図The bottom view of the metal plate in one embodiment of the present invention 本発明の一実施の形態における製造工程を示す電子部品ユニットの断面図Sectional drawing of the electronic component unit which shows the manufacturing process in one embodiment of this invention 本発明の一実施の形態における電子部品ユニットの断面図Sectional drawing of the electronic component unit in one embodiment of this invention 本発明の一実施の形態における製造工程を示す電子部品ユニットの断面図Sectional drawing of the electronic component unit which shows the manufacturing process in one embodiment of this invention 本発明の一実施の形態における電子部品ユニットの断面図Sectional drawing of the electronic component unit in one embodiment of this invention 本発明の一実施の形態における電子部品ユニットの断面図Sectional drawing of the electronic component unit in one embodiment of this invention 従来の電子部品ユニットの断面図Sectional view of a conventional electronic component unit

符号の説明Explanation of symbols

９ 電子部品ユニット
１０ 基体
１１ 金属板
１２ 絶縁層
１３ 導体パターン
１４ 電子部品
１５ 結合部材
１５ａ、１５ｂ、１５ｃ 結合部材
１６ 凹部
１７ 孔
１８ 発熱性電子部品
１９ 突起
２０ 凹部 DESCRIPTION OF SYMBOLS 9 Electronic component unit 10 Base | substrate 11 Metal plate 12 Insulating layer 13 Conductor pattern 14 Electronic component 15 Coupling member 15a, 15b, 15c Coupling member 16 Concave part 17 Hole 18 Exothermic electronic component 19 Protrusion 20 Concave part

Claims (6)

基体と、
この基体上に取り付けられた金属板と、
この金属板上に形成された絶縁層と、
この絶縁層上方に配置された電子部品とを備え、
前記金属板は、
前記基体との対向面に凹部を有し、
この凹部および前記基体の内部には、
前記金属板と前記基体とを接合する結合部材が圧入され、
前記結合部材は、前記基体および前記金属板よりも弾性率の大きいものとした電子部品ユニット。 A substrate;
A metal plate mounted on the substrate;
An insulating layer formed on the metal plate;
An electronic component disposed above the insulating layer,
The metal plate is
Having a recess on the surface facing the substrate;
In the recess and the inside of the base,
A coupling member for joining the metal plate and the base body is press-fitted ,
The electronic component unit , wherein the coupling member has a larger elastic modulus than the base and the metal plate . 基体と、A substrate;
この基体上に取り付けられた金属板と、A metal plate mounted on the substrate;
この金属板上に形成された絶縁層と、An insulating layer formed on the metal plate;
この絶縁層上方に配置された電子部品とを備え、An electronic component disposed above the insulating layer,
前記金属板は、The metal plate is
前記基体との対向面に凹部を有し、Having a recess on the surface facing the substrate;
この凹部および前記基体の内部には、In the recess and the inside of the base,
前記金属板と前記基体とを接合する結合部材が圧入され、A coupling member for joining the metal plate and the base body is press-fitted,
前記結合部材は、The coupling member is
前記基体および前記金属板よりも熱膨張率が大きいものとした電子部品ユニット。An electronic component unit having a larger coefficient of thermal expansion than the base and the metal plate. 基体と、A substrate;
この基体上に取り付けられた金属板と、A metal plate mounted on the substrate;
この金属板上に形成された絶縁層と、An insulating layer formed on the metal plate;
この絶縁層上方に配置された電子部品とを備え、An electronic component disposed above the insulating layer,
前記金属板は、The metal plate is
前記基体との対向面に凹部を有し、Having a recess on the surface facing the substrate;
この凹部および前記基体の内部には、In the recess and the inside of the base,
前記金属板と前記基体とを接合する複数の結合部材が圧入され、A plurality of coupling members for joining the metal plate and the base body are press-fitted,
端部に配置された結合部材の少なくとも何れか一つは、At least one of the coupling members arranged at the end is
前記基体を貫通し、Penetrates the substrate,
この基体から外方へ突出している請求項１から２の何れか一つに記載の電子部品ユニット。The electronic component unit according to claim 1, wherein the electronic component unit protrudes outward from the base body. 基体と、A substrate;
この基体上に取り付けられた金属板と、A metal plate mounted on the substrate;
この金属板上に形成された絶縁層と、An insulating layer formed on the metal plate;
この絶縁層上方に配置された電子部品とを備え、An electronic component disposed above the insulating layer,
前記金属板は、The metal plate is
前記基体との対向面に凹部を有し、Having a recess on the surface facing the substrate;
この凹部および前記基体の内部には、In the recess and the inside of the base,
前記金属板と前記基体とを接合する複数の結合部材が圧入され、A plurality of coupling members for joining the metal plate and the base body are press-fitted,
端部に配置された結合部材は、The coupling member arranged at the end is
内側に配置された結合部材よりも弾性率が大きいものとした電子部品ユニット。An electronic component unit having an elastic modulus greater than that of a coupling member disposed on the inside. 基体と、A substrate;
この基体上に取り付けられた金属板と、A metal plate mounted on the substrate;
この金属板上に形成された絶縁層と、An insulating layer formed on the metal plate;
この絶縁層上方に配置された電子部品とを備え、An electronic component disposed above the insulating layer,
前記金属板は、The metal plate is
前記基体との対向面に凹部を有し、Having a recess on the surface facing the substrate;
この凹部および前記基体の内部には、In the recess and the inside of the base,
前記金属板と前記基体とを接合する複数の結合部材が圧入され、A plurality of coupling members for joining the metal plate and the base body are press-fitted,
内側に配置された結合部材は、The coupling member arranged inside is
端部に配置された結合部材よりも熱伝導率が大きいものとした電子部品ユニット。An electronic component unit having a thermal conductivity greater than that of a coupling member disposed at an end. 基体と、A substrate;
この基体上に取り付けられた金属板と、A metal plate mounted on the substrate;
この金属板上に形成された絶縁層と、An insulating layer formed on the metal plate;
この絶縁層上方に配置された発熱性電子部品とを備え、A heat-generating electronic component disposed above the insulating layer;
前記金属板は、The metal plate is
発熱性電子部品の下方に相当する部分であって、かつ、前記基体との対向面に凹部を有し、A portion corresponding to the lower part of the heat-generating electronic component, and having a recess on the surface facing the base,
この凹部および前記基体の内部には、In the recess and the inside of the base,
前記金属板と前記基体とを接合する結合部材が圧入され、A coupling member for joining the metal plate and the base body is press-fitted,
前記結合部材は前記金属板よりも熱伝導率の大きいものとした電子部品ユニット。The electronic component unit, wherein the coupling member has a higher thermal conductivity than the metal plate.
JP2007102429A 2007-04-10 2007-04-10 Electronic component unit Expired - Fee Related JP4807303B2 (en)

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