JP4806570B2 - Transparent card - Google Patents
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- JP4806570B2 JP4806570B2 JP2006027349A JP2006027349A JP4806570B2 JP 4806570 B2 JP4806570 B2 JP 4806570B2 JP 2006027349 A JP2006027349 A JP 2006027349A JP 2006027349 A JP2006027349 A JP 2006027349A JP 4806570 B2 JP4806570 B2 JP 4806570B2
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- 239000010408 film Substances 0.000 claims description 69
- 239000012788 optical film Substances 0.000 claims description 53
- 229910052751 metal Inorganic materials 0.000 claims description 43
- 239000002184 metal Substances 0.000 claims description 43
- 239000010931 gold Substances 0.000 claims description 14
- 239000000758 substrate Substances 0.000 claims description 10
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 9
- 229910052737 gold Inorganic materials 0.000 claims description 9
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims description 6
- 229910045601 alloy Inorganic materials 0.000 claims description 4
- 239000000956 alloy Substances 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 238000004544 sputter deposition Methods 0.000 description 28
- 229920005989 resin Polymers 0.000 description 23
- 239000011347 resin Substances 0.000 description 23
- 230000007246 mechanism Effects 0.000 description 20
- 238000004519 manufacturing process Methods 0.000 description 10
- 238000004804 winding Methods 0.000 description 9
- 230000015572 biosynthetic process Effects 0.000 description 7
- 230000000903 blocking effect Effects 0.000 description 7
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 6
- 230000002093 peripheral effect Effects 0.000 description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 6
- 238000002834 transmittance Methods 0.000 description 6
- 230000003287 optical effect Effects 0.000 description 5
- 239000010949 copper Substances 0.000 description 4
- 229910001316 Ag alloy Inorganic materials 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000001747 exhibiting effect Effects 0.000 description 2
- 238000001755 magnetron sputter deposition Methods 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910000484 niobium oxide Inorganic materials 0.000 description 1
- URLJKFSTXLNXLG-UHFFFAOYSA-N niobium(5+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Nb+5].[Nb+5] URLJKFSTXLNXLG-UHFFFAOYSA-N 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 229920005644 polyethylene terephthalate glycol copolymer Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Magnetic Record Carriers (AREA)
- Credit Cards Or The Like (AREA)
Description
本発明は、透明性を有するカード基材の表面又は内部に、赤外線領域の光を遮断し可視光線領域の光を透過する光学膜を備えた透明カードに関する。 The present invention relates to a transparent card including an optical film that blocks light in an infrared region and transmits light in a visible light region on the surface or inside of a card substrate having transparency.
近年、キャッシュカードやクレジットカード、学生証、会員証、社員証等として用いられる各種プラスチックカードの分野においては、カード自体に透明性をもたせてデザイン性を高めたものがある。 In recent years, in the field of various plastic cards used as cash cards, credit cards, student cards, membership cards, employee cards, etc., some cards have been improved in design by providing transparency.
一方で、キャッシュカードやクレジットカード等のプラスチックカードにおいては、特にＡＴＭ（現金自動預け払い機）がカードを赤外線で検知する機構を採用しているため、赤外線領域の光を透過する透明カードは検知不能となり使用不可能となる。 On the other hand, for plastic cards such as cash cards and credit cards, ATM (automated teller machine) uses a mechanism that detects the card with infrared rays, so transparent cards that transmit light in the infrared region are detected. It becomes impossible to use.
そこで、赤外線領域の光を遮断し可視光線領域の光を透過する光学特性をカードに付加することでＡＴＭでの使用を可能とする透明カードの開発が従来より行われている（例えば下記特許文献１，２参照）。これら従来の透明カードは、上記光学特性を発現させるため、赤外線領域の光を吸収する染料を含有した塗膜を、透明性を有するカード基材の表面に塗工した構成を有している。 Therefore, the development of a transparent card that can be used in ATM by adding an optical characteristic that blocks light in the infrared region and transmits light in the visible light region to the card has been conventionally performed (for example, the following patent document). 1 and 2). These conventional transparent cards have a configuration in which a coating film containing a dye that absorbs light in the infrared region is applied to the surface of a card substrate having transparency in order to develop the above optical characteristics.
しかしながら、赤外線吸収機能を有する塗膜をカード表面に塗工する従来の技術においては、塗膜の密着強度が低いため、膜の剥離による品質の劣化が懸念される。 However, in the conventional technique in which a coating film having an infrared absorption function is applied to the card surface, since the adhesion strength of the coating film is low, there is a concern about quality deterioration due to film peeling.
これに対して、例えばシリコン酸化膜とニオブ酸化膜のように屈折率の異なる２種の透明酸化膜を交互に積層した光学膜が赤外線遮断機能を有することは知られており、これをカードに適用して透明カード化することも考えられる。しかし、この種の光学積層膜は比較的膜厚が大きくなるため（約１．３μｍ）、カード作製後に反りや変形が生じやすくなる。 On the other hand, it is known that an optical film in which two types of transparent oxide films having different refractive indexes, such as a silicon oxide film and a niobium oxide film, are alternately laminated has an infrared shielding function. It is also possible to apply it to make a transparent card. However, since this type of optical laminated film has a relatively large thickness (about 1.3 μm), warping and deformation are likely to occur after the card is manufactured.
一方、例えば金色半透明等のようにカード表面の発色形態に対するニーズが高まっているが、このような透明カードを高品質で作製することは、上述した従来技術では非常に困難である。 On the other hand, there is an increasing need for a color development form on the card surface, such as gold translucent, but it is very difficult to produce such a transparent card with high quality by the above-described conventional technology.
本発明は上述の問題に鑑みてなされ、赤外線領域の遮断機能を有するとともに、カードの反りを抑制でき品質に優れた透明カードを提供することを課題とする。 This invention is made in view of the above-mentioned problem, and it aims at providing the transparent card | curd which was able to suppress the curvature of a card | curd and was excellent in quality while having the cutoff function of an infrared region.
以上の課題を解決するに当たり、本発明の透明カードは、透明性を有するカード基材の表面又は内部に、赤外線領域の光を遮断し可視光線領域の光を透過する光学膜を備えた透明カードであって、上記光学膜は、インジウム錫酸化物（ＩＴＯ）層と金属層とが交互に複数積層された積層膜であることを特徴とする。 In solving the above-mentioned problems, the transparent card of the present invention is a transparent card provided with an optical film that blocks light in the infrared region and transmits light in the visible light region on the surface or inside of the card substrate having transparency. The optical film is a laminated film in which a plurality of indium tin oxide (ITO) layers and metal layers are alternately laminated.
ＩＴＯ層と金属層との積層構造からなる光学膜は、赤外光を遮断し可視光を透過する機能を有する。このような構成の光学膜は、屈折率の異なる２種の酸化物膜からなる光学積層膜に比べて膜厚を約１／１０にまで小さくすることができ、カードに適用した際にカードの反りや変形を抑制することができる。 An optical film having a laminated structure of an ITO layer and a metal layer has a function of blocking infrared light and transmitting visible light. The optical film having such a configuration can reduce the film thickness to about 1/10 as compared with the optical laminated film made of two kinds of oxide films having different refractive indexes. Warpage and deformation can be suppressed.
また、本発明に係る光学膜はＩＴＯ層及び金属層ともにスパッタ法で形成される。従って、作製された光学膜は密着性に優れており、剥離等による品質の劣化を防ぐことができる。特に、薄厚の金属層で有効な赤外光遮断機能が得られるので、積層膜の総膜厚を薄く形成できるとともに、カードに適用した際のカードの反りや変形を効果的に抑えることができる。 Further, the optical film according to the present invention is formed by the sputtering method for both the ITO layer and the metal layer. Therefore, the produced optical film has excellent adhesion, and quality deterioration due to peeling or the like can be prevented. In particular, since an effective infrared light blocking function can be obtained with a thin metal layer, the total thickness of the laminated film can be reduced, and the warpage and deformation of the card when applied to the card can be effectively suppressed. .
金属層としては、銀（Ａｇ）又はその合金が好適であるが、これ以外にも、アルミニウム（Ａｌ）、白金（Ｐｔ）、パラジウム（Ｐｄ）、金（Ａｕ）、銅（Ｃｕ）、鉄（Ｆｅ）等を用いることができる。この金属層の膜厚は、１５０Å以上１０００Å以下、好ましくは、１５０Å以上６００Å以下である。１５０Å未満では赤外光の遮断機能の低下が顕著となり、１０００Åを超えると透過率のピーク値が低下してしまうからである。 As the metal layer, silver (Ag) or an alloy thereof is suitable, but besides this, aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), copper (Cu), iron ( Fe) or the like can be used. The thickness of this metal layer is 150 to 1000 mm, preferably 150 to 600 mm. This is because if the thickness is less than 150 mm, the infrared light blocking function is remarkably reduced, and if it exceeds 1000 mm, the peak value of the transmittance decreases.
透明カードの作製に際しては、長尺の透明フィルム上に上記光学膜を連続成膜し、成膜後カードサイズに裁断してカード基材と一体化することができる。これにより、透明カードを低コストかつ高い生産性をもって製造することができる。勿論、カード化された基材表面に直接、上記光学膜を成膜することも可能である。 In the production of a transparent card, the optical film can be continuously formed on a long transparent film, and can be cut into a card size after film formation to be integrated with a card substrate. Thereby, a transparent card can be manufactured with low cost and high productivity. Of course, it is also possible to form the optical film directly on the surface of the carded substrate.
本発明に係る光学膜は、金属層の層厚や、ＩＴＯ層と金属層との膜厚比、積層数等によって膜の発色性を変化させることができる。従って、光学膜の作製条件を調整することで透明性を維持しながらカード表面の反射光の色調を任意に調整することが可能となり、例えば金色半透明の透明カードを容易に作製することができる。 The optical film according to the present invention can change the color developability of the film depending on the layer thickness of the metal layer, the film thickness ratio between the ITO layer and the metal layer, the number of stacked layers, and the like. Therefore, it is possible to arbitrarily adjust the color tone of the reflected light on the card surface while maintaining the transparency by adjusting the production conditions of the optical film. For example, a golden translucent transparent card can be easily produced. .
金色半透明を実現する光学膜の構成例としては、ＩＴＯ層／金属層／ＩＴＯ層／金属層／ＩＴＯ層の総計５層とし、金属層の膜厚を１としたとき、ＩＴＯ層／金属層／ＩＴＯ層の膜厚比を（１／３：１：１／３）〜（６：１：６）とする。ＩＴＯ層の膜厚は、金属層の膜厚を基準として設定される。また、各金属層及び各ＩＴＯ層の膜厚は各層一定に限らず、層毎に異ならせてもよい。 As an example of the configuration of the optical film that realizes gold semi-transparency, when the total thickness of the ITO layer / metal layer / ITO layer / metal layer / ITO layer is 5 and the film thickness of the metal layer is 1, the ITO layer / metal layer The film thickness ratio of the ITO layer is (1/3: 1: 1/3) to (6: 1: 6). The thickness of the ITO layer is set based on the thickness of the metal layer. Moreover, the film thickness of each metal layer and each ITO layer is not limited to each layer, and may be different for each layer.
以上述べたように、本発明の透明カードによれば、赤外線領域を遮断し可視光線領域を透過する光学膜を、インジウム錫酸化物層と金属層とが交互に複数積層された積層膜で構成したので、カードの反りが抑えられ、品質の向上を図ることができる。 As described above, according to the transparent card of the present invention, the optical film that blocks the infrared region and transmits the visible light region is configured by a laminated film in which a plurality of indium tin oxide layers and metal layers are alternately laminated. Therefore, card warpage can be suppressed and quality can be improved.
以下、本発明の実施の形態について図面を参照して説明する。 Hereinafter, embodiments of the present invention will be described with reference to the drawings.
図１は本発明の実施の形態による透明カード１の構成を示す概略断面図である。透明カード１は、コアシート１０と、このコアシート１０の表面及び裏面に積層されたオーバーシート１１ａ，１１ｂと、本発明に係る光学膜１２とを備えている。 FIG. 1 is a schematic sectional view showing a configuration of a transparent card 1 according to an embodiment of the present invention. The transparent card 1 includes a core sheet 10, oversheets 11a and 11b laminated on the front and back surfaces of the core sheet 10, and an optical film 12 according to the present invention.
コアシート１０及びオーバーシート１１ａ，１１ｂは、透明カード１のカード基材を構成するもので、何れも透明性を有するプラスチックフィルム、例えばポリ塩化ビニル（ＰＶＣ）樹脂や塩化ビニル・酢酸ビニル共重合体、ポリエチレンテレフタレート・グリコール（ＰＥＴ−Ｇ）樹脂等で構成されている。これらコアシート１０及びオーバーシート１１ａ，１１ｂは、例えば熱プレス機による熱融着によって互いに一体化されている。 The core sheet 10 and the oversheets 11a and 11b constitute a card substrate of the transparent card 1, and both are transparent plastic films such as polyvinyl chloride (PVC) resin, vinyl chloride / vinyl acetate copolymer, and the like. And polyethylene terephthalate glycol (PET-G) resin. The core sheet 10 and the oversheets 11a and 11b are integrated with each other by, for example, heat fusion using a hot press.
オーバーシート１１ａ，１１ｂは、図示せずとも、例えばその内面側に絵柄や文字等の印刷層が形成されており、カードの外観模様を構成している。また、図示せずとも、例えばコアシート１０とオーバーシート１１ａ（１１ｂ）の間には磁気ストライプが埋設されており、当該磁気ストライプに対して所定のカード情報が読み書きできるように構成されている。勿論、当該透明カード１は、磁気カードに限らず、ＩＣチップを内蔵した非接触あるいは接触式ＩＣカードとして構成することも可能である。 Although not shown, the oversheets 11a and 11b have a printed layer such as a pattern or characters formed on the inner surface thereof, and constitute an external pattern of the card. Although not shown, for example, a magnetic stripe is embedded between the core sheet 10 and the oversheet 11a (11b), and predetermined card information can be read from and written to the magnetic stripe. Of course, the transparent card 1 is not limited to a magnetic card, but can be configured as a non-contact or contact IC card incorporating an IC chip.
光学膜１２は、表面側のオーバーシート１１ａ上に設けられている。光学膜１２は、赤外線領域の光を遮断し可視光線領域の光を透過する光学特性を有している。具体的に、赤外線領域では、波長８５０ｎｍ〜９５０ｎｍの光の透過率は５％以下で、波長９５０ｎｍ〜１０００ｎｍの光の透過率は７．９％以下となるように光学膜１２が構成されている。 The optical film 12 is provided on the oversheet 11a on the surface side. The optical film 12 has an optical characteristic that blocks light in the infrared region and transmits light in the visible light region. Specifically, in the infrared region, the optical film 12 is configured so that the transmittance of light with a wavelength of 850 nm to 950 nm is 5% or less and the transmittance of light with a wavelength of 950 nm to 1000 nm is 7.9% or less. .
図２は光学膜１２の構成を模式的に示す断面図である。光学膜１２は、インジウム錫酸化物（ＩＴＯ）層と金属層とが交互に複数積層された積層膜で構成されている。図示の例では、透明樹脂フィルム１３の上に、ＩＴＯ層１４と金属層１５が順に交互に積層された５層の積層膜で構成されている。透明樹脂フィルム１３には、ＰＥＴ、ポリ塩化ビニル、ポリエステル、ポリカーボネート等を用いることができる。ＩＴＯ層１４及び金属層１５は、透明樹脂フィルム１３の上にスパッタ法によって形成されたスパッタ膜からなる。上記構成の光学膜１２は、透明樹脂フィルム１３を介して、図１に示すようにオーバーシート１１ａの上に積層される。 FIG. 2 is a cross-sectional view schematically showing the configuration of the optical film 12. The optical film 12 is composed of a laminated film in which a plurality of indium tin oxide (ITO) layers and metal layers are alternately laminated. In the example shown in the drawing, the transparent resin film 13 is composed of a laminated film of five layers in which ITO layers 14 and metal layers 15 are alternately laminated in order. For the transparent resin film 13, PET, polyvinyl chloride, polyester, polycarbonate, or the like can be used. The ITO layer 14 and the metal layer 15 are made of a sputtered film formed on the transparent resin film 13 by a sputtering method. The optical film 12 having the above structure is laminated on the oversheet 11a through the transparent resin film 13 as shown in FIG.
金属層１５は、赤外線領域の光の透過を遮断する機能を有しており、一層当たりの膜厚は１５０Å以上１０００Å以下、好ましくは、１５０Å以上６００Å以下に形成されている。１５０Å未満では赤外光の遮断機能の低下が顕著となり、１０００Åを超えると透過率が顕著に低下してしまう。金属層１５の膜厚が６００Å以下の場合、透過率４０％以上を確保できる。また、本実施の形態では、金属層１５の構成金属として銀（Ａｇ）又はその合金が用いられている。なお、これ以外にもアルミニウム（Ａｌ）、白金（Ｐｔ）、パラジウム（Ｐｄ）、金（Ａｕ）、銅（Ｃｕ）、鉄（Ｆｅ）等の金属又はその合金を用いることができる。 The metal layer 15 has a function of blocking the transmission of light in the infrared region, and the film thickness per layer is 150 to 1000 mm, preferably 150 to 600 mm. If the thickness is less than 150 mm, the infrared light blocking function is remarkably lowered, and if it exceeds 1000 mm, the transmittance is significantly lowered. When the thickness of the metal layer 15 is 600 mm or less, a transmittance of 40% or more can be secured. In the present embodiment, silver (Ag) or an alloy thereof is used as a constituent metal of the metal layer 15. In addition, a metal such as aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), copper (Cu), iron (Fe), or an alloy thereof can be used.
本実施の形態の透明カード１においては、上記構成の光学膜１２をオーバーシート１１ａに積層することによって、赤外線領域の光を遮断できる透明性を備えたカードを構成することができる。これにより、ＡＴＭ等のように赤外線の投光経路を遮断することでカードの挿入を検知する装置に対して、当該透明カード１の使用が可能となる。 In the transparent card 1 of the present embodiment, the optical film 12 having the above configuration is laminated on the oversheet 11a, whereby a card having transparency capable of blocking light in the infrared region can be configured. Accordingly, the transparent card 1 can be used for a device that detects insertion of a card by blocking an infrared light projection path such as ATM.
また、本実施の形態の透明カード１においては、光学膜１２を構成する積層膜の各々の層がスパッタ膜で構成されているので、光学膜１２の総膜厚を薄厚化できる（例えば０．１μｍ〜０．３μｍ）とともに、層間の密着性を高めることができる。これにより、カード作製時におけるカードの反りや、層間の剥離による品質の劣化を抑制することができる。 In the transparent card 1 of the present embodiment, since each layer of the laminated film constituting the optical film 12 is formed of a sputtered film, the total film thickness of the optical film 12 can be reduced (for example, 0. In addition, the adhesion between the layers can be enhanced. Thereby, the curvature of the card | curd at the time of card manufacture and the deterioration of the quality by peeling between layers can be suppressed.
なお図２に示した例では、透明樹脂フィルム１３の上にＩＴＯ層１４と金属層１５との積層膜を形成した光学膜１２を、透明樹脂フィルム１３を介してカード表面に積層するようにしたが、これに限らず、カード表面（オーバーシート１１ａの表面）に直接上記積層膜を成膜するようにしてもよい。 In the example shown in FIG. 2, the optical film 12 in which the laminated film of the ITO layer 14 and the metal layer 15 is formed on the transparent resin film 13 is laminated on the card surface via the transparent resin film 13. However, the present invention is not limited to this, and the laminated film may be formed directly on the card surface (the surface of the oversheet 11a).
また、本発明に係る光学膜１２は図１に示したように、透明カード１のオーバーシート１１ａ表面に積層される例に限らない。例えば図３に示す透明カード２は、光学膜１２をコアシート１０と表面側のオーバーシート１１ａとの間に挟み込んだ構成を有している。また、図４に示す透明カード３は、コアシート１０を一対のコアシート１０ａ，１０ｂで構成し、これら一対のコアシート１０ａ，１０ｂの間に光学膜１２を挟み込んだ構成を有している。これら透明カード２，３においても、上述と同様の効果を得ることができる。 Further, the optical film 12 according to the present invention is not limited to the example of being laminated on the surface of the oversheet 11a of the transparent card 1 as shown in FIG. For example, the transparent card 2 shown in FIG. 3 has a configuration in which the optical film 12 is sandwiched between the core sheet 10 and the oversheet 11a on the surface side. The transparent card 3 shown in FIG. 4 has a configuration in which the core sheet 10 is composed of a pair of core sheets 10a and 10b, and the optical film 12 is sandwiched between the pair of core sheets 10a and 10b. Also in these transparent cards 2 and 3, the same effect as described above can be obtained.
一方、上述した構成の透明カード１〜３に適用される光学膜１２は、ＩＴＯ層１４及び金属層１５の成膜条件によって、金色半透明の表面色を発現させることができる。 On the other hand, the optical film 12 applied to the transparent cards 1 to 3 having the above-described configuration can exhibit a golden translucent surface color depending on the film forming conditions of the ITO layer 14 and the metal layer 15.
本発明者らは、上記構成の光学膜１２の反射光が金色になる膜構造をシミュレーションソフト（株式会社ヒューリンクス製「ＴＦＣａｌｃ Version3.5）を用いて検討した。その結果、光学膜１２の膜構造を、ＩＴＯ層／金属（Ａｇ）層／ＩＴＯ層／金属（Ａｇ）層／ＩＴＯ層の総計５層とし、金属層１５の膜厚を１としたとき、ＩＴＯ層／金属層／ＩＴＯ層の膜厚比が（１／３：１：１／３）〜（６：１：６）となるように各層を構成する。この場合における反射光の反射率は、波長４５０ｎｍにおいて２０〜３０％、波長５００ｎｍにおいて１０〜５０％、波長５５０ｎｍにおいて２０〜７０％、波長６００ｎｍにおいて５５〜８０％であった。ＩＴＯ層の膜厚は、金属層の膜厚を基準として設定することができる。また、各金属層及び各ＩＴＯ層の膜厚は各層一定に限らず、層毎に異ならせてもよい。 The present inventors examined the film structure in which the reflected light of the optical film 12 having the above-described structure becomes golden using simulation software (“TFCalc Version 3.5” manufactured by FULINKS Co., Ltd.) As a result, the film structure of the optical film 12 Is a total of 5 layers of ITO layer / metal (Ag) layer / ITO layer / metal (Ag) layer / ITO layer, and when the thickness of the metal layer 15 is 1, the film of ITO layer / metal layer / ITO layer Each layer is configured so that the thickness ratio is (1/3: 1: 1/3) to (6: 1: 6), where the reflectance of reflected light is 20-30% at a wavelength of 450 nm, and the wavelength The thickness was 10 to 50% at 500 nm, 20 to 70% at a wavelength of 550 nm, and 55 to 80% at a wavelength of 600 nm The thickness of the ITO layer can be set based on the thickness of the metal layer. Metal layer and each I Thickness of the O layer is not limited to each constant may be different for each layer.
以上のように光学膜１２を構成することで、金色半透明に発色する透明カードを作製することが可能となり、カードのデザイン性を高めてニーズに沿った透明カードを容易に提供することができるようになる。 By configuring the optical film 12 as described above, it becomes possible to produce a transparent card that develops a gold semi-transparent color, and it is possible to easily provide a transparent card that meets the needs by improving the design of the card. It becomes like this.
続いて、以上のように構成される光学フィルム１２の製造方法について説明する。図５は、光学フィルム１２の製造方法を説明するスパッタ装置の概略構成を示す側断面図である。 Then, the manufacturing method of the optical film 12 comprised as mentioned above is demonstrated. FIG. 5 is a side sectional view showing a schematic configuration of a sputtering apparatus for explaining a method for manufacturing the optical film 12.
図５に示すスパッタ装置２０は、真空槽２１の内部に、筒体２２と、第１の供給／巻取りローラ２３ａと、第２の供給／巻取りローラ２３ｂと、ガイドローラ２４ａ，２４ｂとを備えている。筒体２２の外周面は、第１スパッタ機構２５ａと第２スパッタ機構２５ｂに対向している。第１，第２の供給／巻取りローラ２３ａ，２３ｂは、筒体２２の内部に配設されており、一方のローラ２３ａが供給ローラとして動作する場合には他方のローラ２３ｂは巻取りローラとして動作し、他方のローラ２３ｂが供給ローラとして動作する場合には一方のローラ２３ａは巻取りローラとして動作する。 A sputtering apparatus 20 shown in FIG. 5 includes a cylindrical body 22, a first supply / winding roller 23a, a second supply / winding roller 23b, and guide rollers 24a and 24b in a vacuum chamber 21. I have. The outer peripheral surface of the cylindrical body 22 faces the first sputtering mechanism 25a and the second sputtering mechanism 25b. The first and second supply / winding rollers 23a and 23b are disposed inside the cylindrical body 22, and when one roller 23a operates as a supply roller, the other roller 23b serves as a winding roller. When the other roller 23b operates as a supply roller, one roller 23a operates as a take-up roller.
第１スパッタ機構２５ａと第２スパッタ機構２５ｂは、マグネトロンスパッタ機構で構成され、筒体２２の外周面の周りに１８０°間隔で配置されている。あるいは、一点鎖線で示すように、第１スパッタ機構２５ａと第２スパッタ機構２５ｂとを互いに隣接して配置してもよい。第１スパッタ機構２５ａにはＩＴＯからなるターゲットが設置され、対向する筒体２２上の透明樹脂フィルム１３に対してＩＴＯ層を成膜する。一方、第２スパッタ機構２５ｂにはＡｇ（Ａｕ１％・Ｓｎ０．３％を添加したＡｇ合金）からなるターゲットが設置され、対向する筒体２２上の透明樹脂フィルム１３に対してＡｇ層（金属層）を成膜する。 The first sputtering mechanism 25 a and the second sputtering mechanism 25 b are configured by a magnetron sputtering mechanism, and are arranged around the outer peripheral surface of the cylindrical body 22 at an interval of 180 °. Alternatively, as indicated by a one-dot chain line, the first sputtering mechanism 25a and the second sputtering mechanism 25b may be disposed adjacent to each other. A target made of ITO is installed in the first sputtering mechanism 25a, and an ITO layer is formed on the transparent resin film 13 on the opposing cylinder 22. On the other hand, a target made of Ag (Ag alloy added with Au 1% and Sn 0.3%) is installed in the second sputtering mechanism 25b, and an Ag layer (metal layer) is formed on the transparent resin film 13 on the opposing cylindrical body 22. ).
筒体２２の内部に第１，第２の供給／巻取りローラ２３ａ，２３ｂが配置される。透明樹脂フィルム１３は、筒体２２の外表面に沿って、第１，第２の供給／巻取りローラ２３ａ，２３ｂに巻出し／巻取り可能に配置される。 First and second supply / winding rollers 23 a and 23 b are arranged inside the cylinder 22. The transparent resin film 13 is disposed along the outer surface of the cylindrical body 22 so as to be able to be unwound / wound on the first and second supply / winding rollers 23a, 23b.
筒体２２は回転可能であり、筒体２２を回転させながら第１スパッタ機構２５ａを稼働させて、透明樹脂フィルム１３にＩＴＯ膜１４を形成する。ＩＴＯ層１４形成後に、第１スパッタ機構２５ａの稼働を停止し、第２スパッタ機構２５ｂを稼働し、筒体２２を回転させながらＡｇ層（金属層）１５を形成する。ＩＴＯ層１４の形成とＡｇ層（金属層）１５の形成を繰り返すことにより、積層膜を形成する。 The cylindrical body 22 is rotatable, and the first sputtering mechanism 25 a is operated while rotating the cylindrical body 22 to form the ITO film 14 on the transparent resin film 13. After the ITO layer 14 is formed, the operation of the first sputtering mechanism 25 a is stopped, the second sputtering mechanism 25 b is operated, and the Ag layer (metal layer) 15 is formed while rotating the cylindrical body 22. A multilayer film is formed by repeating the formation of the ITO layer 14 and the formation of the Ag layer (metal layer) 15.
筒体２２の外表面に露出した部分の透明樹脂フィルム１３に積層膜の形成が完了した後、第１，第２の供給／巻取りローラ２３ａ，２３ｂで、成膜された透明樹脂フィルム１３を巻き取り、新たな透明樹脂フィルム１３を筒体２２の外表面に巻き出す。この新たな透明樹脂フィルム１３に上記の方法でＩＴＯ層と金属層とを積層する。
以上のように説明した透明樹脂フィルム１３の巻取り／巻出しと、ＩＴＯ層と金属層の積層を繰り返すことで、透明樹脂フィルム１３全体に積層膜を形成する。
After the formation of the laminated film on the transparent resin film 13 exposed on the outer surface of the cylindrical body 22 is completed, the formed transparent resin film 13 is removed by the first and second supply / winding rollers 23a and 23b. Winding up and unwinding the new transparent resin film 13 on the outer surface of the cylindrical body 22. The ITO layer and the metal layer are laminated on the new transparent resin film 13 by the above method.
By repeating the winding / unwinding of the transparent resin film 13 described above and the lamination of the ITO layer and the metal layer, a laminated film is formed on the entire transparent resin film 13.
図６は、光学膜１２の製造方法を説明する他のスパッタ装置３０の概略構成を示す斜視図である。このスパッタ装置３０は、カード表面に直接、光学膜１２を成膜する場合に好適に用いられる。 FIG. 6 is a perspective view showing a schematic configuration of another sputtering apparatus 30 for explaining a method for manufacturing the optical film 12. The sputtering apparatus 30 is preferably used when the optical film 12 is formed directly on the card surface.
図６に示すスパッタ装置３０は、真空槽３１の内部に、円柱状の回転体３２と、この回転体３２の周面に対向配置された第１，第２の一対のスパッタ機構３３ａ，３３ｂとを備えている。回転体３２は、回転軸３４の周りに図中矢印方向に一定の回転速度で回転可能に構成されている。回転体３２の周面には、透明カードを構成するカード基材３５が複数取り付けられている。カード基材３５は、コアシート及びオーバーシートが熱融着されたカード構成体であってもよいし、カードサイズに裁断する前の個々のカード基材であってもよい。 A sputtering apparatus 30 shown in FIG. 6 includes a columnar rotating body 32 inside a vacuum chamber 31, and a first and second pair of sputtering mechanisms 33 a and 33 b disposed to face the peripheral surface of the rotating body 32. It has. The rotating body 32 is configured to be rotatable around the rotation shaft 34 at a constant rotation speed in the direction of the arrow in the figure. A plurality of card base materials 35 constituting a transparent card are attached to the peripheral surface of the rotating body 32. The card base 35 may be a card structure in which the core sheet and the oversheet are heat-sealed, or may be an individual card base before being cut into a card size.
第１スパッタ機構３３ａと第２スパッタ機構３３ｂは、マグネトロンスパッタ機構で構成され、筒体３２の外周面の周りに１８０°間隔で配置されている。第１スパッタ機構３３ａにはＩＴＯからなるターゲットが設置され、対向する筒体３２上のカード基材３５に対してＩＴＯ層を成膜する。一方、第２スパッタ機構２５ｂにはＡｇからなるターゲットが設置され、対向する筒体３２上のカード基材３５に対してＡｇ（Ａｕ１％・Ｓｎ０．３％を添加したＡｇ合金）層を成膜する。 The first sputtering mechanism 33 a and the second sputtering mechanism 33 b are configured by a magnetron sputtering mechanism, and are arranged around the outer peripheral surface of the cylindrical body 32 at intervals of 180 °. A target made of ITO is installed in the first sputtering mechanism 33a, and an ITO layer is formed on the card base 35 on the opposing cylinder 32. On the other hand, a target made of Ag is installed in the second sputtering mechanism 25b, and an Ag (Ag alloy added with Au 1% / Sn 0.3%) layer is formed on the card base 35 on the opposing cylinder 32. To do.
カード基材３５は、回転する筒体３２の周面上において、第１，第２のスパッタ機構３３ａ，３３ｂと対向する領域でＩＴＯ層１４及びＡｇ層１５が順次成膜される。これにより、カード基材３５の表面に、ＩＴＯ層１４とＡｇ層の積層膜からなる光学膜１２が作製される。 In the card substrate 35, the ITO layer 14 and the Ag layer 15 are sequentially formed on the peripheral surface of the rotating cylinder 32 in a region facing the first and second sputtering mechanisms 33a and 33b. As a result, the optical film 12 made of a laminated film of the ITO layer 14 and the Ag layer is produced on the surface of the card substrate 35.
図５を参照して説明したスパッタ装置を用いて、透明樹脂フィルム上にＩＴＯ層／Ａｇ層／ＩＴＯ層／Ａｇ層／ＩＴＯ層の５層構造からなる積層膜を下記条件で成膜し、金色半透明な反射光色を呈する光学膜を作製した。Ａｇ層の成膜には、Ａｕ１％・Ｓｎ０．３％を添加したＡｇ合金のターゲットを用いた。 Using the sputtering apparatus described with reference to FIG. 5, a laminated film having a five-layer structure of ITO layer / Ag layer / ITO layer / Ag layer / ITO layer is formed on the transparent resin film under the following conditions. An optical film exhibiting a translucent reflected light color was produced. For the formation of the Ag layer, an Ag alloy target to which Au 1% and Sn 0.3% were added was used.
真空槽の雰囲気圧力を５×１０-4Ｐａ以下とし、ＩＴＯ層及びＡｇ層を下記の電力・ガス量条件で成膜を行った。
（ＩＴＯ層）
・電力：３．５ｋＷ
・Ａｒ：５００ｓｃｃｍ
・Ｏ２：１０ｓｃｃｍ
・成膜圧力：０．３１Ｐａ
（Ａｇ層）
・電力：１．５ｋＷ
・Ａｒ：５００ｓｃｃｍ
・Ｏ２：なし
・成膜圧力：０．２５Ｐａ
The atmosphere pressure of the vacuum chamber was set to 5 × 10 −4 Pa or less, and the ITO layer and the Ag layer were formed under the following power / gas amount conditions.
(ITO layer)
・ Power: 3.5kW
Ar: 500 sccm
・ O2: 10sccm
-Film formation pressure: 0.31 Pa
(Ag layer)
・ Power: 1.5kW
Ar: 500 sccm
・ O2: None ・ Deposition pressure: 0.25 Pa
ＩＴＯ層及びＡｇ層をそれぞれ１０００ｓｅｃ（秒）成膜し成膜レート（Å／ｓｅｃ）の計測を行ったところ、以下の結果が得られた。
・ＩＴＯ：５８１Å／１０００ｓｅｃ → ０．５８Å／ｓｅｃ
・Ａｇ ：６００Å／１０００ｓｅｃ → ０．６０Å／ｓｅｃ
When the ITO layer and the Ag layer were each formed for 1000 seconds (seconds) and the film formation rate (Å / sec) was measured, the following results were obtained.
ITO: 581cm / 1000sec → 0.58cm / sec
・ Ag: 600Å / 1000sec → 0.60Å / sec
各層のＩＴＯ層及びＡｇ層の膜厚は表１に示すとおりである。表１において「層数」は積層順番を意味する。 The thicknesses of the ITO layer and the Ag layer of each layer are as shown in Table 1. In Table 1, “number of layers” means the stacking order.
上記条件でＩＴＯ層及びＡｇ層の５層積層膜を作製した結果、フィルム表面が半透明な金色を呈する光学膜を得ることができた。図７に、作製されたサンプルの写真を示す。
また、当該サンプルの赤外線透過率を分光波形グラフから読み取ったところ、波長８５０ｎｍ〜９５０ｎｍで４．５％以下、波長９５０〜１０００ｎｍで４％以下であった。
As a result of producing a five-layer laminated film of an ITO layer and an Ag layer under the above conditions, an optical film having a translucent gold color on the film surface could be obtained. FIG. 7 shows a photograph of the produced sample.
Moreover, when the infrared transmittance of the sample was read from the spectral waveform graph, it was 4.5% or less at a wavelength of 850 nm to 950 nm and 4% or less at a wavelength of 950 to 1000 nm.
以上、本発明の実施の形態について説明したが、勿論、本発明はこれに限定されることなく、本発明の技術的思想に基づいて種々の変形が可能である。 The embodiment of the present invention has been described above. Of course, the present invention is not limited to this, and various modifications can be made based on the technical idea of the present invention.
例えば以上の実施の形態では、本発明に係る光学膜１２を透明樹脂フィルム１３の上に作製した後、この透明樹脂フィルムを介してカード基材上に当該光学膜１２を積層する例について説明したが、これに代えて、上記透明樹脂フィルムをカード基材の一部（例えばオーバーシート１１ａ）で構成し、当該光学膜が形成されたカード基材を他のカード基材（例えばコアシート）に積層一体化して透明カードを作製することも勿論可能である。 For example, in the above embodiment, an example in which the optical film 12 according to the present invention is produced on the transparent resin film 13 and then the optical film 12 is laminated on the card substrate through the transparent resin film has been described. However, instead of this, the transparent resin film is constituted by a part of the card base (for example, the oversheet 11a), and the card base on which the optical film is formed is used as another card base (for example, a core sheet). It is of course possible to produce a transparent card by integrating the layers.
また、以上の実施の形態では、光学膜１２の作製例として半透明な金色を呈する積層膜構造を例に挙げて説明したが、積層膜を構成するＩＴＯ層と金属層の積層厚や積層数を変更することで、金色以外の色で反射光を視認できる光学膜を製造することも可能である。 Further, in the above embodiment, the laminated film structure exhibiting a semi-transparent gold color is described as an example of the production of the optical film 12, but the laminated thickness and the number of laminated layers of the ITO layer and the metal layer constituting the laminated film are described. It is also possible to manufacture an optical film that can visually recognize reflected light in a color other than gold.
１，２，３ 透明カード
１０ コアシート
１１ａ，１１ｂ オーバーシート
１２ 光学膜
１３ 透明樹脂フィルム
１４ ＩＴＯ層
１５ 金属層（Ａｇ層）
２０，３０ スパッタ装置
1, 2, 3 Transparent card 10 Core sheet 11a, 11b Oversheet 12 Optical film 13 Transparent resin film 14 ITO layer 15 Metal layer (Ag layer)
20, 30 Sputtering device
Claims (5)
前記光学膜は、インジウム錫酸化物層と金属層とが交互に複数積層された積層膜であり、前記光学膜は、半透明な金色を呈することを特徴とする透明カード。 A transparent card provided with an optical film that blocks the light in the infrared region and transmits the light in the visible light region on the surface or inside of the card substrate having transparency,
Wherein the optical film, laminated film der the indium tin oxide layer and the metal layer are alternately stacked is, the optical film, transparent card, characterized in that exhibits semi-transparent gold.
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| JP2006027349A JP4806570B2 (en) | 2006-02-03 | 2006-02-03 | Transparent card |
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| JP2006027349A JP4806570B2 (en) | 2006-02-03 | 2006-02-03 | Transparent card |
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| JP4806570B2 true JP4806570B2 (en) | 2011-11-02 |
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| US7837116B2 (en) | 1999-09-07 | 2010-11-23 | American Express Travel Related Services Company, Inc. | Transaction card |
| JP6267641B2 (en) * | 2012-08-31 | 2018-01-24 | 株式会社カネカ | Manufacturing method of substrate with transparent electrode, and substrate with transparent electrode |
| CN104309218A (en) * | 2014-10-30 | 2015-01-28 | 中山市亨立达机械有限公司 | Three-silver-layer LOW-E (Low-emissivity) glass with simple structure |
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| JP2002254866A (en) * | 2001-03-01 | 2002-09-11 | Dainippon Ink & Chem Inc | Card base and magnetic card |
| JP2003237266A (en) * | 2002-02-22 | 2003-08-27 | Dainippon Printing Co Ltd | Card |
| JP2005007677A (en) * | 2003-06-18 | 2005-01-13 | Dainippon Printing Co Ltd | Transparent card |
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