JP2006289879A - Id card and method for manufacturing id card - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a transparent ID card being transparent in a visible light band and capable of shielding infrared band light at a prescribed rate without using a special ink containing an infrared absorption material. <P>SOLUTION: A reflecting layer, which selectively reflects light in a specific wavelength band, is formed on a part of or all of the regions on one face or both faces of a transparent or translucent plastic base body in a prescribed size. The reflecting layer is composed of a transparent or translucent optical film containing a prescribed oxide dielectric. The optical film is formed by alternately laminating a plurality of first/second refractive index layers different in refractive index. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an ID card used for authenticating an individual who owns a card such as a magnetic card, bar code card or IC card, and a method for manufacturing the same, and in particular, the card base is transparent or translucent. Various cards for personal authentication used in cash cards, credit cards, pass cards, membership cards, employee card cards, etc. (hereinafter referred to as “transparent” as appropriate in this application) , "ID card") and its manufacturing method.

  Various kinds of ID cards with various designs have been widely used to authenticate individuals. Many of such ID cards are equipped with a magnetic stripe storage means, a bar code or a non-contact or contact type IC chip or the like in order to store data for identifying a person who possesses the ID card. In recent years, there has been a demand for these ID cards to make all or a part of the cards transparent from the viewpoint of creating design diversity and uniqueness.

  However, for example, a card reader connected to a POS terminal device or the like that is installed in an ATM (automated teller machine), a retail store, a restaurant, or the like and can perform credit processing is often used as a detection device that detects an ID card. The card is inserted into the device by using the infrared sensor, and the detection sensor detects that the card has blocked or reflected the infrared band light emitted from the light emitting element arranged at a predetermined position in the device. Is to be detected.

  Therefore, if the ID card is transparent to the infrared band light, it cannot be detected that the card has been inserted. In view of such circumstances, JISX6301 that stipulates the technical specifications of an ID card, “with respect to the light transmittance of the card, has to have a light transmission density of 1.5 or more in a specified region”. It prescribes. Here, the “specified area” is an area facing the detection position of the optical sensor in the card.

  Also, JISX6305, which defines the test method for ID cards, stipulates that the minimum value is recorded by measuring at wavelengths of 20 nm over a wavelength of 400 nm to 1000 nm.

Incidentally, the “light transmission density” defined by JIS is defined by the expression “Log ₁₀ (incident illuminance) / (illuminated illuminance)”, so that 100% of the light incident on the card is completely transparent. In the case of “0”, “1” for transmission of 10%, “2” for transmission of 1%, and “light transmission density of 1.5 or more” are emitted from the light emitting sensor constituting the optical sensor. This stipulates that the card must absorb or reflect 97% or more of the amount of light.

  However, most of card readers use an infrared sensor and its detection margin is practically required to have a light transmission density of 1.0 or more in a wavelength region of 850 nm to 1000 nm. .

For this reason, in a conventional transparent or translucent card, in order to make the card transparent in the visible light band and satisfy the above condition in the infrared band, for example, a sheet kneaded with an infrared absorbing material is attached to the card. Alternatively, special ink containing an infrared absorbing material is printed on the card surface (see, for example, Patent Document 1).
Registered Utility Model No. 3102849

  As described above, in the conventional transparent card, a sheet kneaded with an infrared absorbing material is attached to the card, or special ink containing the infrared absorbing material is printed on the card surface. As a matter of course, the infrared absorbing material absorbs infrared rays and absorbs not only infrared band light but also red light belonging to the visible light band. There was a problem that the whole color of the card was changed to yellowish brown.

  Moreover, since it is necessary to divide the entire area of the ID card into a visible light transmission region and an infrared absorption or reflection band (including an ink portion), the manufacturing process is complicated and the manufacturing cost is increased. Had a problem.

  The present application has been made in view of the problems of such a conventional transparent or translucent card. For this reason, the ID card is a transparent or translucent ID card that transmits visible band light but transmits infrared band light. It is an object of the present invention to provide a low-cost ID card that can be absorbed or reflected at a readable level and a method for manufacturing the ID card.

  Another object of the present invention is to provide an ID card in which the chemical and physical characteristics of the card are stable even when used for a long time, and the color tone of the entire card does not appear to change. is there.

  For this reason, the present application does not use any ink containing an infrared absorbing material, and has a specific wavelength band on a part or all of one surface or both surfaces of a plastic substrate having a predetermined size that is transparent or translucent. An ID card characterized in that a reflective layer for selectively reflecting light is formed.

  Here, the reflection layer has a reflectance with respect to infrared band light having a wavelength of 850 [nm] to 1000 [nm] that is at least twice that of visible light band light. The reflection layer has a light transmission density of at least 1.5 with respect to visible light band light.

  The reflective layer is formed of a transparent or translucent optical film containing a predetermined oxide dielectric, and the optical film includes alternating first and second refractive index layers having different refractive indexes. It is characterized in that a plurality of layers are stacked. The optical film formed in this manner can obtain optical characteristics that are sharply cut with respect to the wavelength as compared with the infrared absorption characteristics of the organic material.

  Here, the optical film is formed by alternately laminating the first refractive index layer and the second refractive index layer in total (2n + 1: n = integer) layers on one surface of the plastic substrate. Further, a total (2n-1: n = integer) layers of the first refractive index layer and the second refractive index layer are alternately stacked on the other surface of the plastic substrate.

  By the way, the predetermined oxide dielectric contains one or more oxides of niobium, titanium, tantalum, zirconium, silicon, indium, tin, silver, zinc or aluminum. Then, a plurality of plastic substrates including the plastic substrate provided with the reflective layer are laminated with an adhesive containing any one of an epoxy resin, a polyester resin, and vinyl chloride.

  The present invention further includes a step of forming a reflective layer that selectively reflects light in a specific wavelength band on a part or all of one or both surfaces of a transparent or translucent plastic substrate, and the reflection A step of adhering and laminating a different transparent or translucent plastic substrate on one or both surfaces of the plastic substrate on which the layer is formed, and a step of cutting the laminate into a predetermined size. An ID card manufacturing method having a transparent or translucent region is provided.

  Here, when the present ID card is used as a magnetic card, it includes a step of forming a magnetic stripe recording layer on the plastic substrate or the reflective layer. Similarly, when the present ID card is used as a contact or non-contact type IC card, it includes a step of embedding a contact type or non-contact type IC chip in the plastic substrate. Here, the plastic substrate is made of vinyl chloride.

  By the way, the step of forming the reflection layer includes (1) a step of placing a plastic substrate having a predetermined thickness wound around the drum surface in an argon gas environment of a predetermined pressure, and (2) an argon discharge while rotating the drum. (3) oxidizing the sputtered first metal while rotating the drum; and (4) rotating the drum. And sputtering the second metal using argon discharge, and (5) oxidizing the sputtered second metal while rotating the drum. It is characterized by that. Then, the steps (2) to (5) are repeated a predetermined number of times.

  By such a manufacturing method, the first refractive index layer made of the first metal oxide and the second refractive index layer made of the second metal oxide are alternately formed on one surface of the plastic substrate. A reflective layer having a total of (2n + 1: n = integer) layers is adhered to the substrate. On the other surface of the plastic substrate, a first refractive index layer made of the first metal oxide and a second refractive index layer made of the second metal oxide are alternately added (2n− 1: n = integer) The reflective layers are laminated together.

  Meanwhile, the first metal and the second metal are selected from niobium, titanium, tantalum, zirconium, silicon, indium, tin, silver, zinc, or aluminum. The first metal is niobium, and the second metal is silicon.

  As a means for laminating a plurality of plastic substrates including the plastic substrate provided with the reflective layer, an adhesive containing any one of an epoxy resin, a polyester resin, or vinyl chloride is used.

  Thus, in the ID card according to the present invention, the ID card can be obtained by laminating two types of oxide dielectric layers having different refractive indexes without using any special ink containing an infrared absorbing material. The transparent ID card having the light transmission density of the above-described machine-readable level is realized in the infrared band while being transparent in the visible light band. Since this ID card does not use ink containing an infrared absorbing material, the chemical and physical characteristics of the card are stable even when used for a long time, and the color tone of the entire card appears to change color. There is no end to it.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

[First Embodiment]
FIG. 1 is a sectional view of an ID card according to the first embodiment of the present invention. As shown in FIG. 1, the ID card according to this embodiment includes transparent substrates 1a and 1b (“plastic substrate” described in claims), an adhesive 3, and an infrared reflecting layer (optical layer). The reflective layer 2 is laminated. The reflective layer 2 is formed on the transparent substrate 1a. As the material of the plastic substrate, vinyl chloride, polyethylene terephthalate (PET), amorphous polyester (PETG), polycarbonate, polyethylene naphthalate, and a mixture thereof can be used.

  The ID card according to the present embodiment includes the reflective layer 2 so that the reflectance in the infrared region having a wavelength of 850 [nm] or more and 1000 [nm] or less is twice or more that of the visible light region (preferably And has a light transmission property that is transparent in the visible light range. Here, it is necessary to make the light transmission density with respect to visible light band light smaller than 1.5. However, it is preferably 0.3 or less. Therefore, the configuration of the present ID card described below is formed so as to satisfy this light transmittance.

  The reflective layer 2 is formed on the transparent substrate 1a by sputtering, and is adhered to the back surface of the transparent substrate 1b with an adhesive. A transparent plastic film can be used for the transparent substrates 1a and 1b.

  The material constituting the reflective layer 2 has a thin film containing at least a transparent oxide dielectric. More specifically, the present ID card has a laminated structure in which the lamination of the high refractive index layer (first refractive index layer) and the low refractive index layer (second refractive index layer) is repeated a predetermined number of times. Shall.

(Production method)
FIG. 2 is a cross-sectional view showing a process for manufacturing the ID card according to the first embodiment of the present invention, in which FIG. 2 (a) is a transparent base material (film) serving as a base material of a reflective layer, FIG. FIG. 2B shows a reflective layer on which an infrared reflective layer is formed, and FIG. 2C shows the manufactured ID card.

  First, the high refractive index layer (first refractive index layer) and the low refractive index layer (first refractive index layer) and the like are used on the surface of the transparent substrate 1a shown in FIG. By alternately forming the second refractive index layer), the reflective layer 2 can be formed on the transparent substrate 1a as shown in FIG.

  Next, the surface of the reflective layer 2 shown in FIG. 2B is bonded (fixed) to the transparent substrate 1b with the adhesive 3 to obtain the ID card shown in FIG. The process of attaching a magnetic stripe or bar code to the front or back side of the ID card, printing as an IC card, or embedding an IC chip in the card base 1 is a known technique. Therefore, the description is omitted.

Here, although the formation process of the reflective layer 2 which is the especially main structure of this invention is demonstrated hereafter, the flow of the outline process is as follows.
(1) A plastic substrate wound around the drum surface, specifically a heat-resistant PET (polyethylene terephthalate) film containing a plasticizer, is placed in a vacuum environment and then placed in an argon gas environment at a predetermined pressure.
(2) Sputtering the first metal on the film using argon discharge while rotating the drum.
(3) The sputtered first metal is oxidized while rotating the drum.
(4) Sputtering the second metal using argon discharge while rotating the drum.
(5) The sputtered second metal is oxidized while rotating the drum. Then, the steps (2) to (5) are repeated a predetermined number of times.

  Next, the details of the process of forming the reflective layer 2, which is the particularly main configuration of the present invention, will be described. First, a 300 [micron] -thick transparent film (plastic substrate described in claims) made of heat-resistant PET (polyethylene terephthalate) containing a plasticizer is placed on the surface of a rotatable cylindrical drum (attached) Then, the whole is put in a vacuum container in a vacuum apparatus, and the vacuum container is evacuated by a vacuum pump of the vacuum apparatus.

  In this vacuum apparatus, a niobium metal target, a metal silicon target, and an oxidation plasma zone are installed in advance, and when the film is rotated by the rotation of the drum, the surface of the film becomes the above-mentioned niobium metal target, metal The silicon target and the oxidation plasma zone are sequentially passed. In order to select the two targets, a shutter is installed between each of the two targets and the film surface.

  Next, while evacuating the vacuum vessel with a vacuum pump of a vacuum device, argon gas is poured into the vacuum vessel so that the inside of the vacuum vessel has a predetermined pressure. First, a shutter on the niobium metal target side is opened. A voltage of about 500 [V] was applied to the niobium metal target so that the target had a negative potential. As a result, plasma discharge was caused to sputter a niobium metal target, and a niobium metal thin film was formed on the film surface. Thereafter, when the film was rotated by the rotation of the drum, when the formed niobium metal thin film reached the oxidation plasma zone, the formed thin film was oxidized and converted to a niobium metal oxide thin film. By repeating such a process for a predetermined time, a metal oxide thin film layer having a predetermined film thickness was obtained.

  Furthermore, a metal silicon oxide thin film having a predetermined thickness was formed on the surface of the film on which the niobium metal oxide thin film was formed by applying the same process as that described above to the metal silicon target. In this way, by selecting two types of metal to be selectively formed and repeating the step of alternately forming the metal oxide layer, and selecting the two types of metal to be used, a high refractive index is obtained. A metal oxide film and a low refractive index metal oxide film are alternately formed, and a desired thin film, that is, a thin film that is transparent to visible light and can reflect infrared rays at a predetermined ratio is formed. It is.

  The film on which the desired thin film is formed in this way is taken out from the vacuum container of the vacuum apparatus, and using a transparent hot melt adhesive sheet containing either epoxy resin, polyester resin, or vinyl chloride resin, a thickness of 50 [microns] The vinyl chloride plates were joined. This is further cut to a predetermined ID card size, and the reflectance in the infrared region of wavelength 850 [nm] or more and 1000 [nm] or less is more than twice the reflectance of the visible light region. In addition, an ID card having a light transmission density of less than 1.5 in the visible light region could be manufactured.

[Second Embodiment]
FIG. 3 is a sectional view of an ID card according to the second embodiment of the present invention. As shown in FIG. 3, the ID card according to the present embodiment has a configuration in which transparent base materials 1a, 1b, 1c, an adhesive 3 and a reflective layer 2 are laminated. The reflective layer 2 has a configuration formed on both the front surface and the back surface of the transparent substrate 1a.

  The ID card according to the present embodiment includes the reflective layer 2 so that the reflectance in the infrared region having a wavelength of 850 [nm] or more and 1000 [nm] or less is twice or more that of the visible light region (preferably And has a light transmission property that is transparent in the visible light range. Specifically, the transmission density for visible light band light is less than 1.5. Moreover, Preferably it is 0.3 or less. Therefore, the constituent elements described below are formed so as to satisfy this light transmittance.

  The reflective layer 2 is sandwiched between the transparent substrate 1c and the transparent substrate 1b, and the surface thereof (more specifically, the surface of the upper reflective layer 2) is bonded to the transparent substrate 1b by the adhesive 3. The back surface (more specifically, the back surface of the lower reflective layer 2) is bonded (fixed) to the transparent substrate 1 c with the adhesive 3.

  The material constituting the reflective layer 2 has a thin film containing at least a transparent oxide dielectric. More specifically, a laminated structure in which the lamination of the high refractive index layer and the low refractive index layer is repeated a predetermined number of times is assumed.

(Production method)
FIG. 4 is a cross-sectional view for each process showing the manufacturing process of the ID card according to the second embodiment of the present invention. FIG. 4 (a) is a transparent base material (film) serving as a base material for forming a reflective layer, FIG. 4B shows a transparent substrate having a reflective layer formed on the front and back sides, and FIG. 4C shows the manufactured ID card.

  First, a high refractive index layer and a low refractive index layer are alternately formed on the front and back surfaces of the transparent substrate 1a shown in FIG. 4A by using means for alternately sputtering and depositing two kinds of metals. Thus, the upper and lower reflective layers 2 shown in FIG. 4B are formed.

  Next, the surface of the upper reflective layer 2 shown in FIG. 4B is bonded (fixed) to the transparent substrate 1b with the adhesive 3, and the back surface of the lower reflective layer 2 is further bonded to the transparent substrate 1b with the adhesive 3. By joining (adhering) to the material 1c, an ID card shown in FIG. 4C is obtained.

  In the above-described means for alternately sputter depositing the two kinds of metals, the number of the high refractive index layer and the low refractive index layer to be formed is set. The total number of refractive index layers is (2n + 1) layers (n is an integer equal to or greater than 1). In this case, the number of high refractive index layers and low refractive index layers is set for the back surface of the transparent substrate 1a. The total can be (2n-1) layers.

Note that a means for forming a storage medium such as a magnetic stripe or an IC on the ID card is not a means according to the present invention, and a description thereof will be omitted.
Hereinafter, a manufacturing process as one example of the ID card according to the present embodiment will be described.

  First, a transparent film (substrate) with a thickness of 50 [micron] made of heat-resistant PET (polyethylene terephthalate) containing a plasticizer is placed (attached) on the surface of a rotatable cylindrical drum, and the whole is It put in the vacuum container in a vacuum device, and this vacuum vessel was evacuated (evacuated) with the vacuum pump of the vacuum device.

  In this vacuum apparatus, a niobium metal target, a metal silicon target, and an oxidation plasma zone are installed in advance, and when the film is rotated by the rotation of the drum, the surface of the film becomes the above-mentioned niobium metal target, metal The silicon target and the oxidation plasma zone were sequentially passed.

  Further, in order to select the two targets, a shutter is installed between each of the two targets and the film surface. While this vacuum vessel is evacuated (evacuated) by a vacuum pump of a vacuum device, argon gas is poured into the vacuum vessel so that the inside of the vacuum vessel has a predetermined pressure. First, a shutter on the niobium metal target side A voltage of about 500 [V] was applied to the niobium metal target so that the target had a negative potential.

  As a result, plasma discharge was caused to sputter a niobium metal target, and a niobium metal thin film was formed on the film surface. Thereafter, when the film was rotated by the rotation of the drum, when the formed niobium metal thin film reached the oxidation plasma zone, the formed thin film was oxidized and converted to a niobium metal oxide thin film. By repeating such a process for a predetermined time, a metal oxide thin film layer having a predetermined film thickness was obtained on the surface of the transparent film. Furthermore, a metal silicon oxide thin film having a predetermined thickness was formed on the surface of the film on which the niobium metal oxide thin film was formed by applying the same process as that described above to the metal silicon target.

  Next, a thin film layer similar to the front surface was formed on the back surface of the film by performing the same steps as those described above on the back surface of the film that had undergone the above steps. However, the number of layers of the metal oxide thin film to be formed was changed between the front surface and the back surface of the film (refer to FIG. 5 described later for details).

  The film on which the desired thin film is formed in this way is taken out from the vacuum container of the vacuum apparatus, and a transparent hot melt adhesive sheet having a thickness of 150 [microns] containing either epoxy resin, polyester resin or vinyl chloride resin on both sides thereof Was used to bond a transparent vinyl chloride plate having a thickness of 200 [microns].

  This is further cut to a predetermined ID card size, and the reflectance in the infrared region of wavelength 850 [nm] or more and 1000 [nm] or less is more than twice the reflectance of the visible light region. And an ID card having a light transmission density of less than 1.5 in the visible light region could be produced.

  FIG. 5 is an explanatory diagram showing the materials and film thicknesses of the plurality of high refractive index layers and low refractive index layers of the infrared reflective layer formed in Example 2 in the order of layers. As shown in the figure, on the transparent film surface of the substrate, as the first, third, fifth, seventh and ninth layers from the top, 95 (nm) thick niobia (niobium oxide), As the fourth, sixth, and eighth layers, 150 nm thick silica (silicon oxide) is formed.

  In addition, on the transparent film surface of the substrate, niobia with a thickness of 125 (nm) as the first layer from the top, silica with a thickness of 150 (nm) as the second layer from the top, third and seventh 120 nm thick niobia is formed as the first layer, 180 nm thick silica is formed as the fourth and sixth layers, and 110 nm thick niobia is formed as the fifth layer.

  6 is a graph showing the light transmission characteristics (wavelength / transmission density spectrum) of the infrared reflective layer formed in Example 2. FIG. As shown in the figure, the light transmission density in the visible region is suppressed to 1.5 or less (0.2 or less at the peak), and the light transmission density in the infrared region of 850 to 1000 [nm] is 1.0. Good light transmission characteristics reaching the above (at peak time of 1.4 or more) were obtained.

  As described above in detail, in the ID card according to the present invention, light in a specific wavelength band is selectively applied to a part or all of one surface or both surfaces of a transparent or translucent plastic substrate having a predetermined size. A reflective layer is formed to reflect the light. The reflective layer is formed of a transparent or translucent optical film containing a predetermined oxide dielectric, and the optical film has a plurality of first refractive index layers and second refractive index layers alternately stacked. Is formed.

  As a result, the present invention has realized a transparent ID card that is transparent in the visible light band and shields infrared band light at a predetermined ratio without using a special ink containing an infrared absorbing material. is there.

  The present invention relates to a transparent or translucent ID card that transmits visible band light but can absorb or reflect infrared band light with a light transmission density value of 1.0 or more, and a method for manufacturing the same. Has industrial applicability.

1 is a sectional view of an ID card according to a first embodiment of the present invention. It is sectional drawing according to process which shows the manufacturing process of ID card based on the 1st Embodiment of this invention, (a) is a transparent base material (film) used as the base material of a reflective layer, (b) is a reflective layer formed. The transparent substrate made, (c) shows the manufactured ID card. Sectional drawing of the ID card which concerns on the 2nd Embodiment of this invention is shown. It is sectional drawing according to process which shows the manufacturing process of the ID card which concerns on the 2nd Embodiment of this invention, (a) is the transparent base material (film) used as the base material of a reflective layer, (b) is a reflective layer front and back (C) shows the manufactured ID card. It is explanatory drawing which showed each material and film thickness of the some high refractive index layer of the infrared reflective layer formed in Example 2, and a low refractive index layer in order of a layer. 6 is a graph showing light transmission characteristics (wavelength / transmission density spectrum) of an infrared reflective layer formed in Example 2. FIG.

Explanation of symbols

1, 1a, 1b: Plastic substrate (transparent substrate)
2: Infrared reflective layer (optical layer)
3: Adhesive

Claims (20)

  An ID card, wherein a reflective layer that selectively reflects light in a specific wavelength band is formed on a part or all of one or both surfaces of a transparent or translucent plastic substrate of a predetermined size .   2. The ID card according to claim 1, wherein the reflective layer has a light transmission density with respect to visible light band light of at least less than 1.5. 3. The reflection layer according to claim 1, wherein the reflection layer has a reflectivity with respect to an infrared band light having a wavelength of 850 [nm] to 1000 [nm] at least twice as high as a reflectivity with respect to a visible light band light. ID card.   The reflective layer is formed of a transparent or translucent optical film containing a predetermined oxide dielectric, and the optical film includes a plurality of alternately stacked first and second refractive index layers having different refractive indexes. The ID card according to claim 2 or 3, wherein   5. The optical film is formed by alternately laminating the first refractive index layer and the second refractive index layer of a total of “2n + 1” layers on one surface of the plastic substrate. ID card according to.   6. The first refractive index layer and the second refractive index layer of a total of “2n−1” layers are alternately stacked on the other surface of the plastic substrate. ID card.   5. The predetermined oxide dielectric contains one or more oxides of niobium, titanium, tantalum, zirconium, silicon, indium, tin, silver, zinc or aluminum. ID card.   The plurality of plastic substrates including the plastic substrate provided with the reflective layer are laminated by an adhesive containing any one of an epoxy resin, a polyester resin, and vinyl chloride. ID card according to. Forming a reflective layer that selectively reflects light in a specific wavelength band on part or all of one or both surfaces of a transparent or translucent plastic substrate;
Adhering and laminating a different transparent or translucent plastic substrate on one or both surfaces of the plastic substrate on which the reflective layer is formed;
Cutting the laminate into a predetermined size;
A method for producing an ID card having a transparent or translucent region, comprising the steps of:   The ID card manufacturing method according to claim 9, further comprising a step of forming a magnetic stripe recording layer on the plastic substrate or the reflective layer.   The ID card manufacturing method according to claim 9, further comprising a step of embedding a contact type or non-contact type IC chip in the plastic substrate.   The ID card manufacturing method according to claim 9, wherein the plastic substrate is made of vinyl chloride. The step of forming the reflective layer includes
(1) placing a plastic substrate of a predetermined thickness wound around the drum surface in an argon gas environment of a predetermined pressure;
(2) sputtering the first metal on the plastic substrate using argon discharge while rotating the drum;
(3) oxidizing the sputtered first metal while rotating the drum;
(4) Sputtering the second metal using argon discharge while rotating the drum;
(5) oxidizing the sputtered second metal while rotating the drum;
The ID card manufacturing method according to claim 9, comprising:   The ID card manufacturing method according to claim 13, further comprising a step of repeating the steps (2) to (5) a predetermined number of times.   On one surface of the plastic substrate, a first refractive index layer made of the first metal oxide and a second refractive index layer made of the second metal oxide are alternately added in total (2n + 1: n = The ID card manufacturing method according to claim 14, wherein only (integer) layers are stacked.   On the other surface of the plastic substrate, a first refractive index layer made of the first metal oxide and a second refractive index layer made of the second metal oxide are alternately added in total (2n-1: The ID card manufacturing method according to claim 15, wherein only (n = integer) layers are stacked.   The first metal and the second metal are selected from niobium, titanium, tantalum, zirconium, silicon, indium, tin, silver, zinc, or aluminum, according to claim 15 or 16. The described ID card manufacturing method.   The ID card manufacturing method according to claim 17, wherein the first metal is niobium and the second metal is silicon.   The adhesive containing any one of an epoxy resin, a polyester resin, or vinyl chloride is used as a means for laminating a plurality of plastic substrates including the plastic substrate provided with the reflective layer. ID card manufacturing method.   The method for manufacturing an ID card according to claim 19, wherein a hot melt adhesive containing one or both of a polyester resin and an epoxy resin is used as the adhesive.

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