JP4802143B2 - Optical parts - Google Patents

Description

  The present invention relates to an optical component, and a substrate (optical bench) on which an optical element (chip) such as an optical fiber, a light emitting element, a light receiving element, a filter element, and a waveguide circuit element is mounted and the optical element are highly efficient and high. It relates to optical components that can be mounted reliably.

  In order to realize an advanced information society, high-speed and large-capacity optical communication systems are required. In order to construct an optical communication system, an optical fiber network is currently being laid. There, a high speed and large capacity of a system using a WDM (Wavelength Division Multiplexing) technique is performed.

  In WDM, coupling between a waveguide circuit element and an optical element such as a fiber or an LD-PD is important, and it is usually mounted by a method called active alignment that performs alignment by monitoring the optical coupling state. However, since the alignment process is costly, a technique called passive alignment in which mounting is performed with mechanical accuracy without monitoring the optical coupling efficiency of each optical component is promising for reducing the cost of the optical component.

  As an example of mounting by passive alignment, there is an alignment method using a fitting structure in which a protruding structure created on a chip is fitted into a hollow structure such as a V-groove created on a Si substrate (see, for example, Non-Patent Document 1). .

  In this passive alignment mounting, the chip is mounted on the optical bench, the position of the V-groove part of the optical bench and the protruding part of the chip are aligned, and the chip is moved to a stable position by applying a weight to the chip. Thus, optical coupling between chips is mechanically realized. In mounting by passive alignment, the optical bench and the chip are fixed with an adhesive or the like while a weight is applied to the chip. When mounting an optical component by such a passive alignment, an optical bench having a hollow structure and a chip having a protruding structure are generally used.

Jin Tae Kim, et al, “Passive Alignment Method of Polymer PLC Devices by Using a Hot Embossing Technique”, IEEE Photonics Technology Letters, Vol. 16, No. 7, p.1664, July 2004

  As described above, when a chip is mounted on an optical bench, a weight that does not cause material destruction must be applied in order to perform accurate alignment.

  However, for example, a chip on which a waveguide is formed has a warp, and the amount of warp of the chip may change due to its excessive weight. Further, the chip may be deformed by shrinkage when the adhesive for bonding the optical bench and the chip is cured, leading to deterioration of optical characteristics.

  In addition, if the chip is bonded and fixed in a deformed state, the restoring force that the chip tries to return to its original shape works, causing peeling of the bonding surface between the optical bench and the chip. There was a problem.

  FIG. 1 is a cross-sectional view of a fitting structure for aligning the optical bench 10 and the chip 20 in the conventional structure. The chip 20 can be fixed at a desired position of the optical bench 10 by fitting the protrusions (21, 22) of the chip 20 into the recesses (V grooves) (11, 12) of the optical bench 10. For example, the chip 20 is formed so that light from an optical fiber or other chip mounted on the optical bench adjacent to the end face of the chip 20 is incident on the chip 20 perpendicularly to the cross section shown in FIG. It fixes to the optical bench 10 so that it may inject horizontally with respect to a perpendicular | vertical surface.

  In order to accurately align the chip 20, it is necessary to apply a certain amount of weight to the chip 20. However, if the load is large, the chip 20 is deformed as shown in FIG. 2, and an axial shift occurs in the input / output part of the chip, that is, the optical coupling part between the optical fiber and another chip, or the chip warps. In some cases, the optical characteristics may change.

  The present invention has been made to solve such a problem, and even with an optical component in which a chip such as a waveguide circuit element is mounted on an optical bench and bonded and fixed by passive alignment, the optical characteristics of the chip are achieved. Another object is to provide an optical component in which the optical coupling characteristics between chips are not impaired.

In order to achieve the above object, the present invention provides an optical bench and a load mounted on a predetermined position of the mounting surface at a predetermined distance from the chip mounting surface of the optical bench. An optical component including a chip on which a Y- branch waveguide circuit including two fixed waveguides is fabricated, and a positioning protrusion or depression formed on the chip mounting surface of the optical bench And a fitting portion formed of a positioning depression or projection formed on the chip that fits with the projection or depression of the optical bench, and separately from the fitting portion, the weight One or more deformation preventions that contact the optical bench or the chip for the first time when the optical bench or the chip is deformed by It means, said on position corresponding to the center of the two branch waveguides, characterized in that formed in the optical bench or the chip.
According to a second aspect of the present invention, there is provided an optical bench and a multi- stage Y- branch waveguide circuit that is mounted at a predetermined position on the mounting surface apart from the chip mounting surface of the optical bench and is fixed by applying a load. An optical component including a chip on which a waveguide circuit pattern including a chip is formed, and a positioning protrusion or recess formed on the chip mounting surface of the optical bench, and the protrusion of the optical bench. Alternatively, a fitting portion composed of a positioning depression or protrusion formed on the chip to be fitted to the depression is formed, and separately from the fitting portion, the load is transformed into the optical bench or the chip. One or more means for preventing deformation that contact the optical bench or the chip for the first time when A position corresponding to a position having a symmetrical Y-branch waveguide circuit of the plurality of stages in the emissions, characterized in that the formed optical bench or the chip.

The invention according to claim 3 is characterized in that the means for preventing deformation is a spacer which is not materially continuous with the optical bench or the chip and is manufactured individually.

According to a fourth aspect of the present invention, the deformation preventing means includes: a deformation preventing recess or a deformation preventing projection formed on the chip mounting surface of the optical bench; and the deformation preventing recess of the optical bench. Or a deformation prevention protrusion or a deformation prevention depression formed on the chip corresponding to the protrusion or the deformation prevention protrusion.

The invention according to claim 5 is characterized in that a height of the deformation preventing projection is lower than a height of the positioning projection.

The invention described in claim 6 is characterized in that a width of the projection for preventing deformation is smaller than a width of the projection for positioning.

The invention described in claim 7 is characterized in that a width of the deformation preventing recess is larger than a width of the positioning recess.

The invention described in claim 8 is characterized in that a depth of the deformation preventing depression is deeper than a depth of the positioning depression.

The invention according to claim 9 is characterized in that the deformation preventing means is provided when the chip is mounted at a predetermined position on the mounting surface of the optical bench and is fixed in a state in which the optical bench or the chip is not deformed. The deformation preventing means and the chip or optical bench are formed so as to have an interval of 1 μm or less.

The invention according to claim 10 is characterized in that the deformation preventing means is formed on a straight line connecting two of the fitting portions.

The invention according to claim 11 is characterized in that the deformation preventing means is formed at a distance of 100 μm or more from a waveguide circuit pattern formed on the chip.

  As described above, according to the present invention, when the chip is fixed to the optical bench with high accuracy by passive alignment, the optical bench or the chip is prevented from being deformed more than a certain amount, and the optical characteristics of the chip or between the chips are prevented. It is possible to mount without significantly degrading the optical coupling characteristics.

  DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments of an optical component according to the present invention will be described in detail with reference to the drawings. In the drawings described below, components having the same function are denoted by the same reference numerals, and repeated description thereof is omitted.

  In the following example, when a waveguide circuit element as an optical element (also referred to as a chip in this specification) is mounted on a substrate such as silicon (also referred to as an optical bench in this specification), a chip is used. Description of optical components for which high-precision alignment is performed by fitting a rectangular or trapezoidal protrusion produced on the optical bench to a recess produced on the optical bench and pressing the substrate and the chip together To do. However, it is needless to say that the present invention can provide the same effect even if there is an optical component that realizes a fitting structure by the depression formed on the chip and the projection formed on the substrate.

(First embodiment)
With reference to FIG. 3, a first embodiment of an optical component in the case where a deformation preventing means for preventing deformation of the chip is provided on the chip side will be described. FIG. 3 is a cross-sectional view of a fitting portion for aligning the optical bench 10 and the chip 20 in the optical component of the present embodiment.

  The chip 20 includes two protrusions 21 and 22 on the surface facing the chip mounting surface of the optical bench 10. Further, the chip 20 includes a deformation preventing protrusion 23 having a rectangular shape or a trapezoidal shape as a deformation preventing means for preventing the deformation of the chip 20 between the protrusion 21 and the protrusion 22. The deformation preventing projection 23 is continuously integrated with the chip 20.

  The optical bench 10 has a chip mounting surface, and includes two recesses (V grooves) 11 and 12 corresponding to the protrusions 21 and 22 of the chip 20 on the chip mounting surface, respectively.

  As shown in FIG. 3, the chip 20 is mounted with a gap between it and the chip mounting surface of the optical bench 10. The recess 11 and the protrusion 21 and the recess 12 and the protrusion 22 come into contact with each other when the chip 20 is fixed to the optical bench 10, so that the chip 20 is accurately mounted at a predetermined position on the optical bench 10. The fitting part is configured.

  Further, the deformation preventing projection 23 contacts the optical bench 10 and prevents further deformation of the chip 20 when the chip 20 is deformed by a load applied when the chip 20 is fixed to the optical bench 10. It is configured to provide a deformation inhibiting function.

  FIG. 4 shows the weighting in the passive alignment process. The deformation preventing projection 23 formed between the projections 21 and 22 does not affect the alignment fitting portion and maintains the positioning accuracy and is deformed by applying a load to the chip. When it occurs, it is configured to immediately contact the chip mounting surface of the optical bench 10 to prevent excessive deformation of the chip.

  According to the present invention, excessive deformation of the chip is prevented by the deformation preventing projection 23, and an axial shift in the input / output section of the chip and a change in optical characteristics due to the deformation can be prevented.

  In the present embodiment described with reference to FIG. 3, the deformation preventing projection 23 is provided as the deformation preventing means on the chip 20 side. However, as shown in FIG. 5, the deformation preventing means is provided as the deformation preventing means on the optical bench 10 side. The projecting protrusion 15 may be provided.

  Further, in the present embodiment, the chip 20 side has the deformation preventing projection 23 continuous with the chip. However, as shown in FIG. 6, a rectangular or trapezoidal spacer 24 is formed by a member independent of the chip 20. It may be manufactured and fixed to the chip 20 as a deformation preventing means in a subsequent process, and then the chip 20 may be mounted on the optical bench 10.

  In the modification shown in FIG. 5, the optical bench 10 is provided with the deformation preventing projection 15 that is continuous with the optical bench. However, as shown in FIG. The spacer 14 having a shape or the like may be manufactured, and this may be fixed to the optical bench 10 as a deformation preventing means in a subsequent process, and then the chip 20 may be mounted.

  In the embodiment shown in FIGS. 6 and 7, the spacers (24, 14) can be manufactured in a process different from the process of manufacturing the chip 20 and the optical bench 10 (mainly a semiconductor process). Since positioning of the spacers (24, 14) requires a simple mechanical alignment accuracy (for example, 10 μm), a large number of spacers are manufactured at a lower cost, and the chip 20 or the optical bench 10 is formed in a later process. There are advantages that can be applied.

  The material of the spacers (24, 14) is not particularly limited to materials such as metal, semiconductor, glass, and hard plastic unless they are materials that are deformed with respect to weight, but if the material is the same as that of the chip 20 or the optical bench 10, This is advantageous in that it can maintain an adhesive strength and realize a more reliable optical component.

(Second embodiment)
Next, a second embodiment of the optical component according to the present invention will be described with reference to FIG. In addition to the alignment projections 21 and 22, a deformation prevention projection 23 is formed on the chip 20. On the side of the optical bench 10, alignment depressions 11 and 12 corresponding to the protrusions 21 and 22, respectively, are produced, and a deformation prevention depression corresponding to the deformation prevention protrusion 23 is provided separately from the depressions 11 and 12. Part 13 is produced.

  The deformation preventing projection 23 on the chip 20 side and the deformation preventing depression 13 on the optical bench side are not in contact with each other when the chip 20 is mounted on the optical bench 10 and is not weighted. Only when the bench 10 is deformed, the deformation preventing projection 23 comes into contact with the deformation preventing recess 13 to prevent excessive deformation of the chip 20.

  In order to prevent the deformation preventing projection 23 and the deformation preventing dent 13 from coming into contact with each other when the chip 20 is mounted on the optical bench 10 and not loaded, any one of the following conditions may be satisfied.

  1) The width W1 and the depth d1 of the alignment recesses 11 and 12 are equal to the width W2 and the depth d2 of the deformation prevention recess 13, and the width w1 of the alignment projections 21 and 22 prevents deformation. The height h1 of the projections 21 and 22 for alignment is equal to the width w2 of the projection 23 and higher than the height h2 of the deformation prevention projection 23 (W1 = W2, d1 = d2, w1 = w2). And h1> h2)

  2) The width W1 and the depth d1 of the alignment recesses 11 and 12 are equal to the width W2 and the depth d2 of the deformation prevention recess 13 and the height h1 of the alignment projections 21 and 22 is deformed. It is equal to the height h2 of the prevention projection 23 and the width w2 of the deformation prevention projection 23 is narrower than the width w1 of the alignment projections 21 and 22 (that is, W1 = W2, d1 = d2, h1). = H2 and w2 <w1)

  3) The width w1 and height h1 of the alignment projections 21 and 22 are equal to the width w2 and height h2 of the deformation prevention projection 23, and the width W1 of the alignment depressions 11 and 12 is deformation prevention. The depth d1 of the alignment recesses 11 and 12 is equal to the width W2 of the recess 13 and shallower than the depth d2 of the deformation prevention recess 13 (w1 = w2, h1 = h2, W1 = W2 and d2> d1)

  4) The width w1 and height h1 of the alignment projections 21 and 22 are equal to the width w2 and height h2 of the deformation prevention projection 23, and the depth d1 of the alignment recesses 11 and 12 is deformed. The width W1 of the alignment depressions 11 and 12 is equal to the depth d2 of the prevention depression 13 and smaller than the width W2 of the deformation prevention depression 13 (w1 = w2, h1 = h2, d1 = d2). And W2> W1)

  It is sufficient that at least one of the above four conditions is achieved. However, when the chip is manufactured by a semiconductor process, the protrusions 21 and 22 for alignment having different heights and the deformation prevention as in 1) are used. Since it is necessary to take a plurality of steps such as multi-stage etching to produce the protrusion 23, it is easier to produce the condition satisfying the condition 2) than the condition 1). Further, if silicon is used as the optical bench 10 and a V-groove by wet etching using a crystal plane is used as the depressions 11 to 13, 3) and 4) are synonymous.

  Although two embodiments have been described above, in any of the embodiments, the deformation prevention protrusion 23 of the chip 20 and the deformation depression of the optical bench when the chip 20 is mounted on the optical bench 10 and not loaded. The gap (distance) G with the portion 13 is preferably 1 μm or less. This is because a change in the warp of the chip by 1 μm leads to deterioration of the optical characteristics of the chip. For example, referring to FIG. 4, when light from an optical fiber mounted on the optical bench 10 enters the vicinity of the deformation preventing projection 23 of the chip 20 perpendicularly to the cross section shown in FIG. 4, At the waveguide core position in the center, the amount of deformation of the chip is directly used as the amount of optical axis deviation. In optical coupling between a single-mode fiber and a waveguide having a spot size suitable for the optical axis, a 1 μm optical axis shift causes a loss of 0.1 dB or more at a communication wavelength of 1.55 μm. Further, even when the light is incident from the end face on the protruding portion 21 side and guided to the end face on the protruding portion 21 side, the downward warping of the chip 10 leads to floating of the end face, thereby increasing the optical coupling loss. Will do. Therefore, it is desirable to prevent an increase in optical coupling loss between the optical fiber and the chip 10 by setting the deformation of the chip 10 to 1 μm or less.

  In the above two embodiments, the deformation preventing spacers (14, 24) and the deformation preventing projections (15, 23) are provided between the two fitting portions for alignment. When the portion (21, 22) is near the center of the chip 10, the deformation preventing spacer or the protrusion may be located closer to the outer periphery of the chip 20 than the alignment protrusion, particularly at that position. It is not intended to limit.

  However, in order to perform high-precision alignment between the optical bench 10 and the chip 20, it is advantageous that the alignment fitting portion is disposed near the outer periphery of the chip 20. Further, an intermediate point between the alignment projections is a portion where the amount of variation is greatest due to the deformation of the chip 20.

  Therefore, as shown in FIG. 9, the deformation preventing projections (A, B, C) are positioned on a straight line connecting any two of the alignment projections 21-1 to 21-3 and 22. It is desirable to arrange.

  In FIG. 9, the deformation prevention protrusion A is disposed between the alignment protrusions 21-1 and 22 formed on the long side of the chip 20, and the deformation prevention protrusion B is formed on the chip 20. The deformation preventing projection C is arranged between the alignment projections 21-2 and 21-2 formed on the opposite side of the chip 20, and is arranged between the alignment projections 21-3 and 22 produced on the short side. The example arrange | positioned between 22 is shown. In any case, the arrangement is more effective as it is closer to the midpoint on the straight line between the notches.

  Further, if the position of the deformation preventing projection is close to the waveguide pattern formed on the chip, there is a risk of affecting the waveguide characteristics, such as the generation of loss characteristics due to microventing. Therefore, as shown in FIG. 10, when the closest distance between the deformation preventing projection and the waveguide pattern is L, the deformation preventing projection should be disposed in a portion where L ≧ 100 μm.

  As described above, the configuration example of the deformation preventing protrusion as the deformation preventing means for preventing the deformation of the optical bench and the chip has been described, but more specific examples of these will be further described with reference to FIGS.

  FIG. 11 shows a 1 × 8 optical splitter (also referred to as a splitter chip in the present specification) as a chip 20 mounted on a silicon optical bench (also referred to as a silicon bench in the present specification) 10 by passive alignment. The case where it does is illustrated.

  The input-side single-core fiber and the output-side multi-core (8-core) fiber are fixed in alignment with the V groove formed in the silicon bench 10. Further, in the splitter chip 20, the alignment protrusions 21-1 to 3 and 22 formed on the splitter chip 20 are recessed portions (V grooves) 11-1 to 3 and 12 formed on the silicon bench 10, respectively. A weight is applied and fixed so as to be fitted to. The deformation preventing projection 23 (FIGS. 12 to 16) formed on the splitter chip 20 during this mounting prevents the splitter chip 20 from being deformed.

  In the case of a chip that is long in the waveguide direction, such as the splitter chip 20, deformation in the long side direction is likely to occur. Therefore, as shown in FIG. 12, the deformation preventing protrusions 23-2 and 23-2 are positioned at intermediate positions of the alignment protrusions 21-1 and 22 and 21-2 and 21-3, respectively, which are produced in the long side direction of the splitter chip 20. 23-1. As shown in FIG. 12, when the light guiding direction in the splitter chip 20 is the long side direction of the chip, as shown in FIG. 12, the alignment protrusion that is considered to be the largest in deformation of the splitter chip 20 If an anti-deformation protrusion is disposed at the intermediate point, the influence on the optical characteristics is small. However, depending on the configuration of the optical circuit fabricated on the chip 20, it is not always necessary to be at an intermediate point in a range where L ≧ 100 μm.

  For example, as shown in FIG. 13, it is also possible to arrange the deformation preventing protrusions 23 at positions close to the alignment protrusions 21 and 22, respectively. Further, as shown in FIG. 14, the deformation preventing projections 23 can be arranged closer to the edge of the chip 20 than the positions of the alignment projections 21 and 22.

FIG. 15 shows an example in which the deformation preventing projection 23 is arranged at a position corresponding to the space between the waveguides in the waveguide pattern of the splitter chip 20. As shown in FIG. 15, even when the portion of the chip 20 that may be greatly deformed includes a waveguide pattern, the deformation preventing projection 23 can be disposed in the range of L ≧ 100 μm. FIG. 15 shows an example in which one deformation preventing projection 23 is arranged at a position corresponding to the center of two waveguides that are guided after the light from the input side single-core fiber is first Y-branched. Yes. However, as shown in FIG. 16, in the case of a 1 × 8 optical splitter that branches light from the input-side single-core fiber into eight lights by a plurality of stages of Y branch circuits, the output side 2 in any stage of the Y branch circuit. It is possible to dispose the deformation preventing projections 23 at positions corresponding to the centers of the two waveguides, and the number thereof is not particularly limited. However, from the viewpoint of preventing the deterioration of the optical characteristics, it is desirable that all of them are arranged according to the symmetry of the optical circuit (waveguide pattern).

  As described above, the example of the optical component according to the present invention has been described more specifically by taking the 1 × 8 splitter as an example. However, the optical circuit manufactured on the chip mounted on the optical bench is not limited to the splitter, but is an AWG (arrayed waveguide). A diffraction grating), an MZ (Mach-Zehnder) circuit, or the like may be used, and its function is not limited. In the above, the mounted element is an optical waveguide circuit. However, if the element can be provided with the same alignment protrusion and deformation prevention protrusion, a bulk such as a lens, a diffraction grating, or a beam splitter can be used. An optical element may be used, and an active device such as an LD (semiconductor laser diode) or PD (light receiving element) may be used, and the type thereof is not limited.

Sectional drawing of the state in which the optical bench and chip | tip in the conventional structure are aligned by the fitting structure. Sectional drawing of the state in which the optical bench and the chip | tip are aligned in the conventional structure, and a load is applied to the chip | tip and the deformation | transformation has arisen. Sectional drawing of the state in which the optical bench and the chip | tip were aligned by the structure which has a projection part for a deformation | transformation prevention on the chip | tip side. Sectional drawing of the state which has the protrusion part for a deformation | transformation prevention on the chip | tip side, and was loaded in order to align an optical bench and a chip | tip. Sectional drawing of the state in which the optical bench and the chip | tip were aligned by the structure which has a projection part for a deformation | transformation prevention in the optical bench side. Sectional drawing of the state where the optical bench and the chip | tip were aligned by the structure where the spacer for deformation | transformation prevention was adhere | attached and fixed to the chip | tip side. Sectional drawing of a state in which the optical bench and the chip are aligned with a structure in which a spacer for preventing deformation is bonded and fixed to the optical bench side. Protrusion for deformation prevention is made on the chip side, and a recess (groove) for deformation prevention to be fitted to it is made on the optical bench side, and the optical bench and the chip are aligned. Sectional drawing of a state. The figure which shows the state by which the deformation | transformation prevention protrusion is arrange | positioned on the straight line which connects the protrusion part for two alignment. The figure which shows the positional relationship of the projection part for a deformation | transformation prevention, and the waveguide pattern on a chip | tip. The figure which shows the Example of the optical component which concerns on this invention. The figure which shows the Example which arranged the projection part for a deformation | transformation prevention symmetrically in the intermediate point of the long side direction of the projection part for alignment. The figure which shows the Example which arranged the projection part for a deformation | transformation symmetrically in the proximity | contact part of the projection part for alignment. The figure which shows the Example by which the protrusion part for alignment was arranged in the vicinity of waveguide input-output. The figure which shows the Example which has a projection part for a deformation | transformation prevention in a circuit. The figure which shows the Example which has two or more deformation | transformation prevention protrusion parts in a circuit.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Optical bench 11, 12 Positioning depression part 13 Deformation prevention depression part 14 Deformation prevention spacer 15 Deformation prevention projection part 20 Chip 21, 22 Positioning projection part 23 Deformation prevention projection part 24 Deformation prevention spacer 24

Claims (11)

An optical bench, and a chip on which a Y- branch waveguide circuit including two branching waveguides mounted at a predetermined position on the mounting surface and spaced apart from the chip mounting surface of the optical bench is fixed An optical component comprising:
A positioning projection or depression formed on the chip mounting surface of the optical bench, and a positioning depression or projection formed on the chip that fits into the projection or depression of the optical bench. A fitting part consisting of
Separately from the fitting portion, one or a plurality of deformation preventing means that come into contact with the optical bench or the chip for the first time when the optical bench or the chip is deformed by the weight are the two branch guides. An optical component formed on the optical bench or the chip at a position corresponding to the center of a waveguide. An optical bench and a waveguide circuit pattern including a multi- stage Y- branch waveguide circuit that is mounted at a predetermined position on the mounting surface apart from the chip mounting surface of the optical bench and fixed by applying a weight are manufactured. An optical component with a chip,
A positioning projection or depression formed on the chip mounting surface of the optical bench, and a positioning depression or projection formed on the chip that fits into the projection or depression of the optical bench. A fitting part consisting of
Separately from the fitting portion, one or a plurality of deformation preventing means that come into contact with the optical bench or the chip for the first time when the optical bench or the chip is deformed by the weighting is the waveguide circuit pattern. An optical component formed on the optical bench or the chip at a position corresponding to a position having symmetry of the multi- stage Y- branch waveguide circuit. 3. The optical component according to claim 1, wherein the deformation preventing means is a spacer which is not materially continuous with the optical bench or the chip but is manufactured separately. The deformation preventing means corresponds to the deformation preventing depression or deformation preventing protrusion formed on the chip mounting surface of the optical bench, and the deformation preventing depression or deformation preventing protrusion of the optical bench. optical component according to claim 1 or 2, characterized in that it consists of said chip fabricated deformation preventing projection or for preventing deformation recess for. The optical component according to claim 4 , wherein a height of the deformation preventing projection is lower than a height of the positioning projection. The optical component according to claim 4 , wherein a width of the deformation preventing projection is smaller than a width of the positioning projection. 5. The optical component according to claim 4 , wherein a width of the depression for preventing deformation is larger than a width of the depression for positioning. 5. The optical component according to claim 4 , wherein a depth of the deformation preventing dent is deeper than a depth of the positioning dent. The deformation preventing means includes the deformation preventing means and the chip when the chip is mounted at a predetermined position on the mounting surface of the optical bench and fixed in a state where the optical bench or the chip is not deformed. Alternatively, the optical component according to any one of claims 1 to 8 , wherein the optical component is formed so that a distance between the optical bench and the optical bench is 1 µm or less. The deformation prevention means, optical component according to any one of claims 1 to 9, characterized in that formed on the straight line connecting the two said fitting portions. The optical component according to any one of claims 1 to 10, wherein the deformation prevention means is formed further than 100μm from said chip fabricated waveguide circuit pattern.

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