JP4796677B2 - Sealing film forming apparatus and sealing film forming method - Google Patents
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- JP4796677B2 JP4796677B2 JP2006164908A JP2006164908A JP4796677B2 JP 4796677 B2 JP4796677 B2 JP 4796677B2 JP 2006164908 A JP2006164908 A JP 2006164908A JP 2006164908 A JP2006164908 A JP 2006164908A JP 4796677 B2 JP4796677 B2 JP 4796677B2
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- 238000007789 sealing Methods 0.000 title claims description 66
- 238000000034 method Methods 0.000 title claims description 20
- 239000000758 substrate Substances 0.000 claims description 172
- 239000000178 monomer Substances 0.000 claims description 152
- 230000004888 barrier function Effects 0.000 claims description 75
- 238000006116 polymerization reaction Methods 0.000 claims description 62
- 230000007246 mechanism Effects 0.000 claims description 55
- 238000007740 vapor deposition Methods 0.000 claims description 38
- 238000000151 deposition Methods 0.000 claims description 28
- 230000008021 deposition Effects 0.000 claims description 21
- 229920006254 polymer film Polymers 0.000 claims description 16
- 230000015572 biosynthetic process Effects 0.000 claims description 15
- 238000001816 cooling Methods 0.000 claims description 13
- 238000010438 heat treatment Methods 0.000 claims description 7
- 230000000379 polymerizing effect Effects 0.000 claims description 7
- 229920000642 polymer Polymers 0.000 claims description 3
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 10
- 238000011109 contamination Methods 0.000 description 8
- 238000009792 diffusion process Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 230000007723 transport mechanism Effects 0.000 description 1
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Description
本発明は、封止膜形成装置及び封止膜形成方法に関するものである。 The present invention relates to a sealing film forming apparatus and a sealing film forming method.
有機ＥＬ素子の耐湿性を向上させるために、例えば特許文献１に開示されるように、有機ＥＬ素子上に有機物から成り有機ＥＬ素子上の凹凸をなくすポリマ膜と、このポリマ膜上に積層される封止性能を有する無機物から成るバリア膜との少なくとも２層から成る封止膜で有機ＥＬ素子を被覆する構成が提案されている。 In order to improve the moisture resistance of the organic EL element, for example, as disclosed in Patent Document 1, a polymer film made of an organic material on the organic EL element and having unevenness on the organic EL element is laminated on the polymer film. The structure which coat | covers an organic EL element with the sealing film which consists of an at least 2 layer with the barrier film which consists of an inorganic material which has the sealing performance which has been proposed.
ところで、上記封止膜を形成する封止膜形成装置としては、有機ＥＬ素子が形成された基板を装置内に搬入すると共にこの基板を成膜後に搬出するロードロック機構を備えたロードロック室と、搬入された前記基板にモノマを蒸着するモノマ蒸着機構を備えたモノマ蒸着室と、前記基板に蒸着されたモノマをＵＶ照射により重合せしめて硬化させることでポリマ膜を形成するモノマ重合機構を備えたモノマ重合室と、前記搬入された基板にバリア膜を形成するバリア膜形成機構を備えたバリア膜形成室とを、上記順序で開閉部を介して前後に直列状に連結した構成が用いられることが多い。 By the way, as a sealing film forming apparatus for forming the sealing film, a load lock chamber provided with a load lock mechanism for carrying a substrate on which an organic EL element is formed into the device and carrying out the substrate after film formation, A monomer deposition chamber having a monomer deposition mechanism for depositing a monomer on the loaded substrate, and a monomer polymerization mechanism for polymerizing the monomer deposited on the substrate by UV irradiation and curing it to form a polymer film. A structure in which the monomer polymerization chamber and the barrier film forming chamber provided with a barrier film forming mechanism for forming a barrier film on the loaded substrate are connected in series in the above order through the opening / closing part in the above order is used. There are many cases.
しかしながら、上記モノマ蒸着室のモノマ蒸着機構において生じるモノマ蒸気は、前記開閉部の開閉の際に両隣のロードロック室及びモノマ重合室に拡散し、両室を汚染してしまう。 However, monomer vapor generated in the monomer vapor deposition mechanism of the monomer vapor deposition chamber diffuses into the adjacent load lock chamber and monomer polymerization chamber when the opening / closing portion is opened and closed, and contaminates both chambers.
モノマ蒸気が拡散すると各室の排気効率が低下したり清掃処理が厄介となり、特に、ロードロック室は、通常、基板上に有機ＥＬ素子を製造する真空成膜装置と連結されることから、ロードロック室が汚染されると有機ＥＬ素子製造用の真空成膜装置内にもモノマ蒸気が拡散し、これらを汚染する原因となる。 When the monomer vapor diffuses, the exhaust efficiency of each chamber decreases and the cleaning process becomes troublesome. In particular, the load lock chamber is usually connected to a vacuum film forming apparatus that manufactures organic EL elements on a substrate. When the lock chamber is contaminated, the monomer vapor is diffused in the vacuum film forming apparatus for manufacturing the organic EL element, which causes the contamination.
本発明は、上述のような現状に鑑みなされたもので、可及的にモノマ蒸着室から各室へのモノマ蒸気の拡散を阻止してメンテナンス性の向上を図ることができる極めて実用性に秀れた封止膜形成装置及び封止膜形成方法を提供するものである。 The present invention has been made in view of the above-described situation, and is extremely practical in that it can prevent the diffusion of monomer vapor from the monomer vapor deposition chamber to each chamber as much as possible and can improve the maintainability. An encapsulating film forming apparatus and an encapsulating film forming method are provided.
添付図面を参照して本発明の要旨を説明する。 The gist of the present invention will be described with reference to the accompanying drawings.
有機ＥＬ素子が形成された基板を装置内に搬入すると共にこの基板を成膜後に搬出するロードロック機構と、搬入された前記基板にモノマを蒸着するモノマ蒸着機構と、前記基板に蒸着されたモノマを重合せしめて硬化させることでポリマ膜を形成するモノマ重合機構と、前記搬入された基板にバリア膜を形成するバリア膜形成機構とを備え、搬入された前記基板上にポリマ膜とバリア膜とから成る封止膜を形成して搬出する封止膜形成装置であって、前記ロードロック機構を有するロードロック室Ａ，前記バリア膜形成機構を有するバリア膜形成室Ｂ，前記モノマ重合機構を有するモノマ重合室Ｃ，前記モノマ蒸着機構を有するモノマ蒸着室Ｄの順に、夫々開閉部Ｅを介して前後に直列状に連結して成り、前記ロードロック室Ａから搬入され各室において所定の順序で処理が施されて前記封止膜が形成された基板を前記ロードロック室Ａから搬出し得るように構成したことを特徴とする封止膜形成装置に係るものである。 A load lock mechanism for carrying a substrate on which an organic EL element is formed into the apparatus and carrying out the substrate after film formation, a monomer vapor deposition mechanism for depositing a monomer on the carried substrate, and a monomer deposited on the substrate. A polymer polymerization mechanism that forms a polymer film by polymerizing and curing, and a barrier film formation mechanism that forms a barrier film on the loaded substrate, and the polymer film and the barrier film on the loaded substrate A sealing film forming apparatus for forming and carrying out a sealing film comprising: a load lock chamber A having the load lock mechanism; a barrier film forming chamber B having the barrier film forming mechanism; and the monomer polymerization mechanism. The monomer polymerization chamber C and the monomer vapor deposition chamber D having the monomer vapor deposition mechanism are connected in series in the front-rear direction via the opening / closing part E, and are loaded from the load lock chamber A. The present invention relates to a sealing film forming apparatus configured to be able to carry out a substrate on which the sealing film has been formed in each chamber in a predetermined order from the load lock chamber A. .
また、前記バリア膜形成室Ｂは、前記ロードロック室Ａ側から順に、前記基板を待機させておく第一基板待機ポジション２，前記基板にバリア膜を形成するバリア膜成膜ポジション３及び前記基板を待機させておく第二基板待機ポジション４を有することを特徴とする請求項１記載の封止膜形成装置に係るものである。 The barrier film forming chamber B includes, in order from the load lock chamber A side, a first substrate standby position 2 for waiting the substrate, a barrier film forming position 3 for forming a barrier film on the substrate, and the substrate. 2. The sealing film forming apparatus according to claim 1, further comprising a second substrate standby position 4 for waiting for the first substrate.
また、前記モノマ重合室Ｃは、前記バリア膜形成室Ｂ側から順に、前記基板を待機させておく第一基板待機ポジション５，前記モノマを重合せしめるモノマ重合ポジション６及び前記基板を待機させておく第二基板待機ポジション７を有することを特徴とする請求項１，２のいずれか１項に記載の封止膜形成装置に係るものである。 In addition, the monomer polymerization chamber C, in order from the barrier film forming chamber B side, waits for the first substrate standby position 5 for waiting the substrate, the monomer polymerization position 6 for polymerizing the monomer, and the substrate. 2. The sealing film forming apparatus according to claim 1, further comprising a second substrate standby position 7.
また、前記モノマ蒸着室Ｄは、前記モノマ重合室Ｃ側から順に、前記基板を待機させておく第一基板待機ポジション８，前記基板にモノマを蒸着するモノマ蒸着ポジション９及び前記基板を待機させておく基板待機ポジション10を有することを特徴とする請求項１〜３のいずれか１項に記載の封止膜形成装置に係るものである。 In addition, the monomer vapor deposition chamber D waits for the first substrate standby position 8 for waiting the substrate, the monomer vapor deposition position 9 for vapor depositing the monomer on the substrate, and the substrate in order from the monomer polymerization chamber C side. The sealing film forming apparatus according to claim 1, further comprising a substrate standby position 10.
また、前記モノマ重合室Ｃの第一基板待機ポジション５に、前記基板とマスクとの着脱及び基板とマスクとの位置合わせを行う位置合わせ機構を設けたことを特徴とする請求項３記載の封止膜形成装置に係るものである。 4. The sealing according to claim 3, wherein an alignment mechanism is provided at the first substrate standby position 5 of the monomer polymerization chamber C to attach and detach the substrate and the mask and align the substrate and the mask. The present invention relates to a stop film forming apparatus.
また、前記モノマ重合室Ｃのモノマ重合ポジション６に、前記基板を冷却する基板冷却機構を設けたことを特徴とする請求項３記載の封止膜形成装置に係るものである。 4. The sealing film forming apparatus according to claim 3, wherein a substrate cooling mechanism for cooling the substrate is provided at a monomer polymerization position 6 in the monomer polymerization chamber C.
また、前記モノマ重合室Ｃの第二基板待機ポジション７に、前記基板にマスクを密着させるためのマスク吸引用マグネットを冷却すると共に、この基板に前記マスク吸引用マグネットを載置するマグネット冷却・載置機構を設けたことを特徴とする請求項３，６のいずれか１項に記載の封止膜形成装置に係るものである。 In addition, a mask suction magnet for bringing the mask into close contact with the substrate is cooled at the second substrate standby position 7 in the monomer polymerization chamber C, and a magnet cooling / mounting device for placing the mask suction magnet on the substrate. 7. The sealing film forming apparatus according to claim 3, further comprising a placement mechanism.
また、前記ロードロック室Ａに、前記基板とマスクとの着脱及び基板とマスクとの位置合わせを行う位置合わせ機構を設けたことを特徴とする請求項１〜７のいずれか１項に記載の封止膜形成装置に係るものである。 The load lock chamber A is provided with an alignment mechanism for attaching and detaching the substrate and the mask and aligning the substrate and the mask. The present invention relates to a sealing film forming apparatus.
また、前記ロードロック室Ａに、前記基板を加熱する基板加熱機構を設けたことを特徴とする請求項８記載の封止膜形成装置に係るものである。 9. The sealing film forming apparatus according to claim 8, wherein the load lock chamber A is provided with a substrate heating mechanism for heating the substrate.
また、請求項１〜９いずれか１項に記載の封止膜形成装置を用いて、前記ロードロック室Ａから搬入された前記基板に、前記バリア膜成膜室Ｂにおいてバリア膜を成膜し、続いて、前記モノマ重合室Ｃにおいて冷却処理を施し、続いて、前記モノマ蒸着室Ｄにおいてモノマを蒸着し、続いて、前記モノマ重合室Ｃにおいてモノマ重合処理を施した後、前記バリア膜成膜室Ｂにおいてバリア膜を成膜して、このポリマ膜とバリア膜とから成る封止膜が形成された前記基板を前記ロードロック室Ａから搬出することを特徴とする封止膜形成方法に係るものである。 Further, a barrier film is formed in the barrier film forming chamber B on the substrate carried in from the load lock chamber A using the sealing film forming apparatus according to claim 1. Subsequently, a cooling process is performed in the monomer polymerization chamber C, a monomer is subsequently deposited in the monomer deposition chamber D, and a monomer polymerization process is subsequently performed in the monomer polymerization chamber C. A sealing film forming method characterized in that a barrier film is formed in the film chamber B, and the substrate on which the sealing film composed of the polymer film and the barrier film is formed is unloaded from the load lock chamber A. It is concerned.
また、請求項１〜９いずれか１項に記載の封止膜形成装置を用いて、前記ロードロック室Ａから搬入された前記基板に、前記モノマ蒸着室Ｄにおいてモノマを蒸着し、続いて、前記モノマ重合室Ｃにおいてモノマ重合処理を施した後、前記バリア膜成膜室Ｂにおいてバリア膜を成膜して、このポリマ膜とバリア膜とから成る封止膜が形成された前記基板を前記ロードロック室Ａから搬出することを特徴とする封止膜形成方法に係るものである。 Further, using the sealing film forming apparatus according to any one of claims 1 to 9, a monomer is vapor-deposited in the monomer vapor deposition chamber D on the substrate carried in from the load lock chamber A, and subsequently, After the monomer polymerization process is performed in the monomer polymerization chamber C, a barrier film is formed in the barrier film formation chamber B, and the substrate on which the sealing film composed of the polymer film and the barrier film is formed is formed on the substrate. The present invention relates to a method for forming a sealing film, which is carried out from a load lock chamber A.
本発明は、上述のように構成したから、可及的にモノマ蒸着室からの各処理室へのモノマ蒸気の拡散を阻止してメンテナンス性の向上を図ることができる極めて実用性に秀れた封止膜形成装置及び封止膜形成方法となる。 Since the present invention is configured as described above, it is excellent in practicality that can prevent the diffusion of monomer vapor from the monomer deposition chamber to each processing chamber as much as possible and can improve the maintainability. A sealing film forming apparatus and a sealing film forming method are provided.
好適と考える本発明の実施形態（発明をどのように実施するか）を、図面に基づいて本発明の作用を示して簡単に説明する。 Embodiments of the present invention that are considered suitable (how to carry out the invention) will be briefly described with reference to the drawings, illustrating the operation of the present invention.
ロードロック室Ａから搬入される有機ＥＬ素子が形成された基板に各室において所定の処理を施し、封止膜が形成された基板をロードロック室Ａから搬出する。 The substrate on which the organic EL element carried in from the load lock chamber A is formed is subjected to a predetermined treatment in each chamber, and the substrate on which the sealing film is formed is carried out of the load lock chamber A.
この際、モノマ蒸気が生じるモノマ蒸着機構を有するモノマ蒸着室Ｄは、最も奥側に位置し、モノマ重合室Ｃのみと直接連結する構成であるから、このモノマ蒸着室Ｄからモノマ蒸気が直接拡散する（処理）室はモノマ重合室Ｃのみとなり、モノマ蒸気による装置内の汚染を可及的に阻止できる。 At this time, the monomer vapor deposition chamber D having a monomer vapor deposition mechanism for generating monomer vapor is located at the innermost side and is directly connected to only the monomer polymerization chamber C. Therefore, the monomer vapor is directly diffused from the monomer vapor deposition chamber D. The processing (processing) chamber is only the monomer polymerization chamber C, and contamination of the apparatus by the monomer vapor can be prevented as much as possible.
特に、ロードロック室Ａは、前記モノマ重合室Ｃとバリア膜形成室Ｂとを介してモノマ蒸着室Ｄと連結されるため、ロードロック室Ａへのモノマ蒸気の拡散量は極めて少なくなり、従って、ロードロック室Ａと連結される有機ＥＬ素子製造用の真空成膜装置等の汚染も可及的に阻止できる。 Particularly, since the load lock chamber A is connected to the monomer vapor deposition chamber D through the monomer polymerization chamber C and the barrier film forming chamber B, the diffusion amount of the monomer vapor to the load lock chamber A is extremely small. Contamination of a vacuum film forming apparatus for manufacturing an organic EL element connected to the load lock chamber A can be prevented as much as possible.
従って、本発明は、モノマ蒸気による装置内の汚染を可及的に阻止することができ、メンテナンス性が向上し、より清浄な封止性の高い封止膜を形成できるものとなる。 Therefore, according to the present invention, contamination in the apparatus by monomer vapor can be prevented as much as possible, the maintainability is improved, and a cleaner and more highly sealing film can be formed.
本発明の具体的な実施例について図面に基づいて説明する。 Specific embodiments of the present invention will be described with reference to the drawings.
本実施例は、有機ＥＬ素子が形成された基板を装置内に搬入すると共にこの基板を成膜後に搬出するロードロック機構と、搬入された前記基板にモノマを蒸着するモノマ蒸着機構と、前記基板に蒸着されたモノマを重合せしめて硬化させることでポリマ膜を形成するモノマ重合機構と、前記搬入された基板にバリア膜を形成するバリア膜形成機構とを備え、搬入された前記基板上にポリマ膜とバリア膜とから成る封止膜を形成して搬出する封止膜形成装置であって、前記ロードロック機構を有するロードロック室Ａ，前記バリア膜形成機構を有するバリア膜形成室Ｂ，前記モノマ重合機構を有するモノマ重合室Ｃ，前記モノマ蒸着機構を有するモノマ蒸着室Ｄの順に、夫々開閉部Ｅを介して前後に直列状に連結して成り、前記ロードロック室Ａから搬入され各室において所定の順序で処理が施されて前記封止膜が形成された基板を前記ロードロック室Ａから搬出し得るように構成したものである。 In this embodiment, a substrate on which an organic EL element is formed is loaded into the apparatus, and a load lock mechanism for unloading the substrate after film formation, a monomer vapor deposition mechanism for depositing a monomer on the loaded substrate, and the substrate A monomer polymerization mechanism that forms a polymer film by polymerizing and curing the monomer deposited on the substrate, and a barrier film formation mechanism that forms a barrier film on the loaded substrate, and the polymer is formed on the loaded substrate. A sealing film forming apparatus for forming and transporting a sealing film composed of a film and a barrier film, comprising: a load lock chamber A having the load lock mechanism; a barrier film forming chamber B having the barrier film forming mechanism; The load lock chamber is formed by connecting a monomer polymerization chamber C having a monomer polymerization mechanism and a monomer deposition chamber D having the monomer deposition mechanism in series in order through an opening / closing portion E, respectively. In each chamber is conveyed from the one in which a substrate on which the sealing film processing is performed is formed in a predetermined order and configured so as to unloaded from the load lock chamber A.
各部を具体的に説明する。 Each part will be specifically described.
前記ロードロック室Ａは、クラスタータイプの有機ＥＬ製造用の真空成膜装置等と連結して、真空状態を保持したまま有機ＥＬ素子に封止膜を形成できるように構成している。このロードロック室Ａには、真空成膜装置から基板を受け取ると共に、封止膜成膜後に真空成膜装置に受け渡す搬送用ロボットを設けている。 The load lock chamber A is connected to a cluster type organic EL manufacturing vacuum film forming apparatus or the like so that a sealing film can be formed on the organic EL element while maintaining a vacuum state. The load lock chamber A is provided with a transfer robot that receives the substrate from the vacuum film forming apparatus and delivers the substrate to the vacuum film forming apparatus after forming the sealing film.
また、ロードロック室Ａには、前記基板とマスクとの着脱及び基板とマスクとの位置合わせ（アライメント）を行う位置合わせ機構とを設けている。この位置合わせ機構は、基板を保持した状態で上昇・下降・回転・水平移動等を行う駆動部を有し、適宜な設置部に設置されるマスクに対して基板を位置決めした状態で降下せしめてマスクと重合せしめるものである。このマスク及び基板は、重合状態が解除されないように各種搬送機構により搬送せしめられる。 Further, the load lock chamber A is provided with an alignment mechanism for attaching and detaching the substrate and the mask and aligning the substrate and the mask. This alignment mechanism has a drive unit that moves up, down, rotates, moves horizontally, etc. while holding the substrate, and lowers the substrate while positioning it with respect to the mask installed in the appropriate installation unit. It is superposed with the mask. The mask and the substrate are transported by various transport mechanisms so that the polymerization state is not released.
従って、真空成膜装置から搬入された基板は、ロードロック室Ａにおいてバリア膜形成用のマスクと位置決め状態で重合せしめられ、次のバリア膜形成室Ｂに搬送される。 Therefore, the substrate carried in from the vacuum film forming apparatus is superposed in the positioning state with the barrier film forming mask in the load lock chamber A, and is transferred to the next barrier film forming chamber B.
また、ロードロック室Ａには、次工程のバリア膜成膜室Ｂへの搬送前に、基板を均等に所定温度まで予備加熱する基板加熱機構を設けている。この基板加熱機構による基板の加熱により、基板洗浄時の水分の除去や所定の基板温度とすることによる次工程のバリア膜の成膜状態の安定化が成される。 In addition, the load lock chamber A is provided with a substrate heating mechanism for preheating the substrate uniformly to a predetermined temperature before being transferred to the barrier film forming chamber B in the next step. By heating the substrate by this substrate heating mechanism, moisture removal during substrate cleaning and stabilization of the film formation state of the barrier film in the next step by setting a predetermined substrate temperature are achieved.
尚、ロードロック室Ａ，バリア膜形成室Ｂ及びモノマ重合室Ｃ間の開閉部Ｅとしては、気密状態を保持し得るドアバルブが採用され、モノマ重合室Ｃとモノマ蒸着室Ｄとの間の開閉部Ｅとしては、可撓性を有し基板の搬送方向に移動自在なフラップが採用されている。また、上記ドアバルブを介しての基板の搬送は搬送用ロボットにより行われ、各室内及びフラップを介しての搬送はコンベア機構により行われるように構成している。また、コンベア機構による搬送は、基板及びマスクの端部をコンベアに固定し、中央の領域が露出した状態で搬送されるように構成している。 As an opening / closing portion E between the load lock chamber A, the barrier film forming chamber B, and the monomer polymerization chamber C, a door valve capable of maintaining an airtight state is adopted, and the opening / closing between the monomer polymerization chamber C and the monomer vapor deposition chamber D is adopted. As the part E, a flexible flap that is movable in the substrate transport direction is employed. Further, the substrate is transported through the door valve by a transport robot, and the transport through each room and the flap is performed by a conveyor mechanism. Further, the conveyance by the conveyor mechanism is configured such that the substrate and the end of the mask are fixed to the conveyor, and the substrate is conveyed with the central region exposed.
バリア膜形成室Ｂは、前記ロードロック室Ａ側から順に、前記基板を待機させておく第一基板待機ポジション２，前記基板にバリア膜を形成するバリア膜成膜ポジション３及び前記基板を待機させておく第二基板待機ポジション４を有している。 The barrier film forming chamber B, in order from the load lock chamber A side, waits for the first substrate standby position 2 for waiting the substrate, the barrier film forming position 3 for forming a barrier film on the substrate, and the substrate. A second substrate standby position 4 is provided.
具体的には、バリア膜成膜ポジション３においてスパッタリング機構によりバリア膜を形成するように構成している。即ち、搬送される基板がスパッタリング機構による成膜が適正に行われる位置（ターゲットと正対する位置）をバリア膜成膜ポジション３とし、このバリア膜成膜ポジション３の搬送方向前後位置の空間部を第一・第二基板待機ポジション２・４としている。 Specifically, the barrier film is formed by the sputtering mechanism at the barrier film forming position 3. That is, a position where the substrate to be transported is properly deposited by the sputtering mechanism (a position facing the target) is defined as a barrier film deposition position 3, and a space portion before and after the barrier film deposition position 3 in the transport direction is defined as a barrier film deposition position 3. The first and second substrate standby positions 2 and 4 are set.
従って、バリア膜形成用マスクが重合せしめられた基板は、バリア膜成膜ポジション３においてスパッタリングによりバリア膜が形成され、次のモノマ重合室Ｃに搬送される。 Therefore, the substrate on which the barrier film forming mask is polymerized is formed with the barrier film by sputtering at the barrier film forming position 3 and is transferred to the next monomer polymerization chamber C.
具体的には、図１に図示したように、ロードロック室内１においてバリア膜形成用マスクが重合せしめられ予備加熱された基板は、第二基板待機ポジション４まで搬送されスパッタリングの準備が完了するまで待機せしめられ、バリア膜成膜ポジション３においてバリア膜がスパッタリングされて、第一基板待機ポジション２で待機せしめられた後、第二基板待機ポジション４でドアバルブが開放するまで待機せしめられ、ドアバルブ開放と略同時にモノマ重合室Ｃ内に搬送される（手順Ｘ）。 Specifically, as shown in FIG. 1, the substrate heated in the load lock chamber 1 with the barrier film formation mask superposed and preheated is transported to the second substrate standby position 4 until the preparation for sputtering is completed. After the barrier film is sputtered at the barrier film deposition position 3 and waited at the first substrate standby position 2, it is allowed to wait until the door valve is opened at the second substrate standby position 4. Substantially simultaneously, they are transferred into the monomer polymerization chamber C (procedure X).
モノマ重合室Ｃは、前記バリア膜形成室Ｂ側から順に、前記基板を待機させておく第一基板待機ポジション５，前記モノマを重合せしめるモノマ重合ポジション６及び前記基板を待機させておく第二基板待機ポジション７を有している。 In the monomer polymerization chamber C, in order from the barrier film forming chamber B side, a first substrate standby position 5 for waiting the substrate, a monomer polymerization position 6 for polymerizing the monomer, and a second substrate for waiting the substrate. A standby position 7 is provided.
具体的には、モノマ重合ポジション６においてＵＶ照射装置によりモノマを重合せしめるように構成している。即ち、搬送される基板がＵＶ照射装置により適正にＵＶが照射される位置（ＵＶ照射装置と正対する位置）をモノマ重合ポジション６（ＵＶ照射ポジション６）とし、このＵＶ照射ポジション６の搬送方向前後位置の空間部を第一・第二基板待機ポジション５・７としている。 Specifically, the monomer is polymerized by the UV irradiation device at the monomer polymerization position 6. That is, the position at which the substrate to be transported is properly irradiated with UV by the UV irradiation apparatus (position facing the UV irradiation apparatus) is the monomer polymerization position 6 (UV irradiation position 6). The space portion of the position is set to the first and second substrate standby positions 5 and 7.
更に、モノマ重合室Ｃの第一基板待機ポジション５には、上記ロードロック室Ａと同様の前記基板とマスクとの着脱及び基板とマスクとの位置合わせを行う位置合わせ機構を設けている。 Further, the first substrate standby position 5 in the monomer polymerization chamber C is provided with an alignment mechanism for attaching and detaching the substrate and the mask and aligning the substrate and the mask as in the load lock chamber A.
また、モノマ重合室Ｃのモノマ重合ポジション６には、モノマ蒸着室Ｄのモノマ蒸気を基板上で効率的に結晶化させるために前記基板を冷却する基板冷却機構を設けている。 The monomer polymerization position 6 in the monomer polymerization chamber C is provided with a substrate cooling mechanism for cooling the substrate in order to efficiently crystallize the monomer vapor in the monomer vapor deposition chamber D on the substrate.
更に、前記モノマ重合室Ｃの第二基板待機ポジション７には、重合した基板とマスクとを密着させるためのマスク吸引用マグネットを冷却すると共に、このマスク吸引用マグネットを基板上に載置するマグネット冷却・載置機構を設けている。 Further, the second substrate standby position 7 of the monomer polymerization chamber C cools a mask suction magnet for bringing the superposed substrate and the mask into close contact with each other, and also places the mask suction magnet on the substrate. A cooling and mounting mechanism is provided.
従って、バリア膜が成膜された基板は、モノマ重合室Ｃにおいて、一旦上昇せしめられてバリア膜成膜用マスクが離脱せしめられ、新たに配置されるモノマ蒸着用マスクと位置決めした状態で降下せしめられて、冷却機構により冷却せしめられると共に、冷却されたマスク吸引用マグネットが載置され基板とマスクとが重合密着せしめられた状態で、次のモノマ蒸着室Ｄに搬送される。 Therefore, the substrate on which the barrier film is formed is raised in the monomer polymerization chamber C, the barrier film forming mask is released, and the substrate is lowered while being positioned with the newly disposed monomer vapor deposition mask. Then, while being cooled by the cooling mechanism, the cooled mask attracting magnet is placed, and the substrate and the mask are brought into close contact with each other and conveyed to the next monomer vapor deposition chamber D.
具体的には、図１に図示したように、モノマ蒸着用マスクと重合せしめられた基板は、ＵＶ照射ポジション６で冷却された後、第二基板待機ポジション７において冷却されたマスク吸引用マグネットが載置され、フラップを介してモノマ蒸着室Ｄ内に搬送される（手順Ｙ）。 Specifically, as shown in FIG. 1, the substrate superposed with the monomer vapor deposition mask is cooled at the UV irradiation position 6, and then the mask suction magnet cooled at the second substrate standby position 7 is used. It is placed and conveyed into the monomer vapor deposition chamber D via a flap (procedure Y).
モノマ蒸着室Ｄは、前記モノマ重合室Ｃ側から順に、前記基板を待機させておく第一基板待機ポジション８，前記基板にモノマを蒸着するモノマ蒸着ポジション９及び前記基板を待機させておく第二基板待機ポジション10を有している。 In the monomer vapor deposition chamber D, in order from the monomer polymerization chamber C, a first substrate standby position 8 for waiting the substrate, a monomer vapor deposition position 9 for depositing a monomer on the substrate, and a second substrate for waiting for the substrate. Substrate standby position 10 is provided.
具体的には、モノマ蒸着ポジション９においてモノマ蒸着機構によりモノマを蒸着するように構成している。即ち、搬送される基板がモノマ蒸着機構の蒸着源により適正にモノマが蒸着される位置（モノマ蒸着源と正対する位置）をモノマ蒸着ポジション９とし、このモノマ蒸着ポジション９の搬送方向前後位置の空間部を第一・第二基板待機ポジション８・10としている。 Specifically, the monomer is vapor-deposited by the monomer vapor deposition mechanism at the monomer vapor deposition position 9. That is, the position where the monomer is properly deposited by the vapor deposition source of the monomer vapor deposition mechanism (position facing the monomer vapor deposition source) is the monomer vapor deposition position 9, and the space before and after the monomer vapor deposition position 9 in the transport direction. The first and second board standby positions are 8 and 10.
従って、モノマ蒸着室Ｄにおいて、モノマ蒸着機構の蒸着源から蒸発するモノマ蒸気は、基板上で冷却せしめられて結晶化し、基板上にモノマ膜を形成する。このモノマ膜が形成された基板はモノマ重合室Ｃに搬送される。 Therefore, in the monomer vapor deposition chamber D, the monomer vapor evaporated from the vapor deposition source of the monomer vapor deposition mechanism is cooled on the substrate and crystallized to form a monomer film on the substrate. The substrate on which the monomer film is formed is transferred to the monomer polymerization chamber C.
具体的には、図１に図示したように、基板は第二基板待機ポジション10まで搬送されモノマ蒸着準備が完了するまで待機せしめられ、モノマ蒸着ポジション９でモノマが蒸着せしめられた後、第一基板待機ポジション８で待機せしめられ、所定時間経過後フラップを介してモノマ重合室Ｃに搬送される。続いて、モノマ重合室Ｃに搬送されたモノマ膜が形成された基板は、第二基板待機ポジション７でＵＶ照射準備が完了するまで待機せしめられ、ＵＶ照射ポジション６でＵＶが照射されてモノマが重合してポリマ膜が形成された後、第一基板待機ポジション５で待機せしめられ、第二基板待機ポジション７においてマスク吸引用マグネットが取り外され、再度第一基板待機ポジション５に搬送されてモノマ蒸着用マスクが離脱せしめられると共にバリア膜形成用マスクと重合せしめられてドアバルブが開放するまで待機せしめられ、ドアバルブ開放と略同時にバリア膜成膜室Ｂ内に搬送され、上記手順Ｘと同様にしてバリア膜が形成される（手順Ｚ）。 Specifically, as shown in FIG. 1, the substrate is transported to the second substrate standby position 10 and waited until the monomer deposition preparation is completed. After the monomer is deposited at the monomer deposition position 9, the first It is made to wait at the substrate standby position 8 and is transferred to the monomer polymerization chamber C via a flap after a predetermined time has elapsed. Subsequently, the substrate on which the monomer film transported to the monomer polymerization chamber C is made to wait until the UV irradiation preparation is completed at the second substrate standby position 7, and UV is irradiated at the UV irradiation position 6 so that the monomer is irradiated. After the polymer film is formed by polymerization, the first substrate standby position 5 is made to stand by, the mask suction magnet is removed at the second substrate standby position 7, and it is transported again to the first substrate standby position 5 for monomer deposition. The mask is removed and overlapped with the barrier film forming mask and is allowed to stand by until the door valve opens, and is transferred into the barrier film forming chamber B almost simultaneously with the opening of the door valve. A film is formed (Procedure Z).
即ち、上記手順Ｘの後、手順Ｙ及び手順Ｚを繰り返すことで、有機ＥＬ素子上に直接形成したバリア膜上に、複数のポリマ膜とバリア膜とを交互に積層した封止膜を得ることができる。 That is, by repeating the procedure Y and the procedure Z after the procedure X, a sealing film in which a plurality of polymer films and barrier films are alternately laminated on the barrier film directly formed on the organic EL element is obtained. Can do.
尚、本実施例は、上述のようにしているが、有機ＥＬ素子上にポリマ膜を成膜した後、バリア膜を設けるようにしても良い。即ち、上記手順Ｙ，Ｚの順に処理を行うように設定しても良い。この場合、プロセス中の基板温度安定化のために、ＵＶ照射ポジション６（及び第二基板待機ポジション７のマスク吸引用マグネット）で基板冷却を行わない方が好ましい。 In this embodiment, as described above, a barrier film may be provided after a polymer film is formed on the organic EL element. That is, the processing may be set to be performed in the order of the procedures Y and Z. In this case, it is preferable not to cool the substrate at the UV irradiation position 6 (and the mask suction magnet at the second substrate standby position 7) in order to stabilize the substrate temperature during the process.
以上のようにして、所望の封止膜が形成された基板は、バリア膜成膜室Ｂの第一基板待機ポジション２からドアバルブを介してロードロック室Ａに搬送され、ロードロック室内１にてマスクが離脱せしめられ、外部に搬出せしめられる。 As described above, the substrate on which the desired sealing film is formed is transported from the first substrate standby position 2 of the barrier film forming chamber B to the load lock chamber A through the door valve, and in the load lock chamber 1. The mask is removed and taken out to the outside.
本実施例は上述のように構成したから、ロードロック室Ａから搬入される有機ＥＬ素子が形成された基板に各室において所定の処理を施し、封止膜が形成された基板をロードロック室Ａから搬出する際、モノマ蒸気による装置内の汚染を可及的に阻止できる。 Since the present embodiment is configured as described above, the substrate on which the organic EL element carried in from the load lock chamber A is formed is subjected to predetermined treatment in each chamber, and the substrate on which the sealing film is formed is loaded into the load lock chamber. When carrying out from A, the contamination in the apparatus by the monomer vapor can be prevented as much as possible.
特に、ロードロック室Ａは、前記モノマ重合室Ｃ及びバリア膜形成室Ｂと密閉性の高いドアバルブを介してモノマ蒸着室Ｄと連結され、しかも、ドアバルブが開放するまでドアバルブ直前の基板待機ポジションにて待機して、ドアバルブ開放後、直ちに搬送・閉塞するため、ロードロック室Ａへのモノマ蒸気の拡散量は極めて少なくなり、従って、ロードロック室Ａと連結される有機ＥＬ素子製造用の真空成膜装置等の汚染も可及的に阻止できることになる。 In particular, the load lock chamber A is connected to the monomer vapor deposition chamber D through the monomer polymerization chamber C and the barrier film forming chamber B through a highly airtight door valve, and the substrate lock position immediately before the door valve is opened until the door valve is opened. Therefore, the amount of monomer vapor diffused into the load lock chamber A is extremely small after the door valve is opened, so that the vacuum formation for manufacturing an organic EL element connected to the load lock chamber A is extremely small. Contamination of the membrane device can be prevented as much as possible.
また、モノマ重合室Ｃとモノマ蒸着室Ｄとの間のフラップは、ドアバルブと異なり基板の搬送に応じて搬送方向に撓んで基板の通過を許容する構成であるため、モノマ蒸着室Ｄ内に基板を搬送する際に開口量が最小限で済み、このモノマ蒸着室Ｄからのモノマ蒸気の拡散はこの点においても可及的に阻止できることになる。 Further, unlike the door valve, the flap between the monomer polymerization chamber C and the monomer deposition chamber D is configured to bend in the transport direction in accordance with the transport of the substrate and allow the substrate to pass. In this case, the amount of opening can be minimized, and the diffusion of the monomer vapor from the monomer vapor deposition chamber D can be prevented as much as possible.
更に、有機ＥＬ素子上にバリア膜を形成した後、ポリマ膜とバリア膜とを積層して成る一層封止効果の高い封止膜を、順次各室において処理を行い極めて効率的に成膜することができ、単にモノマ蒸気による装置の汚染度を低減できるだけでなく、各室の配置構成を変更しつつ一層封止効果が高く、効率的な成膜が可能な封止膜を実現できることになる。 Further, after a barrier film is formed on the organic EL element, a sealing film having a higher sealing effect formed by laminating a polymer film and a barrier film is sequentially processed in each chamber to form an extremely efficient film. In addition to simply reducing the degree of contamination of the apparatus by monomer vapor, it is possible to realize a sealing film that has a higher sealing effect and enables efficient film formation while changing the arrangement configuration of each chamber. .
従って、本実施例は、モノマ蒸気による装置内の汚染を可及的に阻止することができ、メンテナンス性が向上し、より清浄な封止性の高い封止膜を形成できる極めて実用性に秀れた封止膜形成装置となる。 Therefore, the present embodiment can prevent contamination of the apparatus by monomer vapor as much as possible, improves the maintainability, and can form a cleaner sealing film having a higher sealing performance, which is extremely practical. Thus, a sealing film forming apparatus is obtained.
本発明は、本実施例に限られるものではなく、各構成要件の具体的構成は適宜設計し得るものである。 The present invention is not limited to this embodiment, and the specific configuration of each component can be designed as appropriate.
Ａ ロードロック室
Ｂ バリア膜形成室
Ｃ モノマ重合室
Ｄ モノマ蒸着室
Ｅ 開閉部
２・５・８ 第一基板待機ポジション
３ バリア膜成膜ポジション
４・７・10 第二基板待機ポジション
６ モノマ重合ポジション（ＵＶ照射ポジション）
９ モノマ蒸着ポジション
A Load-lock chamber B Barrier film formation chamber C Monomer polymerization chamber D Monomer deposition chamber E Opening / closing section 2, 5, 8 First substrate standby position 3 Barrier film deposition position 4, 7, 10 Second substrate standby position 6 Monomer polymerization position (UV irradiation position)
9 Monomer deposition position
Claims (11)
A monomer is vapor-deposited in the monomer vapor deposition chamber on the substrate carried in from the load lock chamber using the sealing film forming apparatus according to claim 1, and then the monomer polymerization chamber. After performing the monomer polymerization process in step 1, a barrier film is formed in the barrier film forming chamber, and the substrate on which the sealing film composed of the polymer film and the barrier film is formed is unloaded from the load lock chamber. A method for forming a sealing film.
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