JP4786406B2 - パターン形成方法 - Google Patents
パターン形成方法 Download PDFInfo
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- JP4786406B2 JP4786406B2 JP2006134022A JP2006134022A JP4786406B2 JP 4786406 B2 JP4786406 B2 JP 4786406B2 JP 2006134022 A JP2006134022 A JP 2006134022A JP 2006134022 A JP2006134022 A JP 2006134022A JP 4786406 B2 JP4786406 B2 JP 4786406B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
- G02B5/201—Filters in the form of arrays
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/207—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a prefabricated paste pattern, ink pattern or powder pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/105—Using an electrical field; Special methods of applying an electric potential
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1142—Conversion of conductive material into insulating material or into dissolvable compound
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Theoretical Computer Science (AREA)
- Printing Methods (AREA)
- Formation Of Various Coating Films On Cathode Ray Tubes And Lamps (AREA)
- Optical Filters (AREA)
Description
図1には、この発明の実施の形態に係るパターン形成装置10の要部の構成を概略的に示してある。ここで説明するパターン形成装置10は、例えば、平面型画像表示装置の表示パネルの内面に蛍光体層やカラーフィルターを形成するための装置である。
まず、図6に示すように、制御装置5がステージ4(ここでは図示せず)を一定速度で移動させて帯電装置3を凹版1に対して矢印T方向に相対的に一定速度で移動させ、凹版1の高抵抗層14の表面14aを帯電させる。このとき、凹版1の共通電極12および全てのパターン電極13が接地電位(0[V])となるように、電源装置6のスイッチ15を切り換えておく。
[実施例1]
図13に示すように、絶縁性の被転写媒体として厚さ2.8[mm]の高歪点ガラス31を用意し、このガラス板31の表面31aにナガセケムテックス社製のデナトロンG−115S(商標)をバーコータにて直接塗布して乾燥させ、0.2[μm]の膜厚を有する電極層32を形成した。この電極層32の抵抗値をシルテックス社製表面抵抗測定計(SLT−YKH4101)を用いて測定したところ、その抵抗値は6.3×105[Ω/□]を示した。
図14に示すように、絶縁性の被転写媒体として厚さ2.8[mm]の高歪点ガラス31を用意し、このガラス板31の表面31aに約5[μm]のブラックマトリックス層42のベタ膜を形成し、ナガセケムテックス社製のデナトロンG−115S(商標)をバーコータにて層42上に塗布して乾燥させ、0.18[μm]の膜厚を有する電極層32を形成した。この場合においても、電極層32の抵抗値をシルテックス社製表面抵抗測定計(SLT−YKH4101)を用いて測定したところ、その抵抗値は4.2×104[Ω/□]を示した。
図15に示すように、絶縁性の被転写媒体として厚さ2.8[mm]の高歪点ガラス31を用意し、このガラス板31の表面31aに約5[μm]のブラックマトリックス層のベタ膜を形成し、このベタ膜をフォトエッチングによってパターニングしてブラックマトリックスのパターン44を形成し、ナガセケムテックス社製のデナトロンG−115S(商標)をバーコータにて層44上に塗布して乾燥させ、0.19[μm]の膜厚を有する電極層32を形成した。この場合においても、電極層32の抵抗値をシルテックス社製表面抵抗測定計(SLT−YKH4101)を用いて測定したところ、その抵抗値は8.8×104[Ω/□]を示した。
Claims (10)
- 像保持体に帯電した現像剤によるパターン像を形成する現像工程と、
上記像保持体に対向する対向面側に電極層を有する被転写媒体を上記像保持体に対向配置し、上記像保持体と上記電極層との間に電界を形成して上記パターン像を上記被転写媒体へ転写する転写工程と、
上記電極層を消失させる消失工程と、
を有することを特徴とするパターン形成方法。 - 上記消失工程では、上記電極層を加熱により蒸発させることを特徴とする請求項1に記載のパターン形成方法。
- 上記消失工程では、上記電極層を加熱により昇華させることを特徴とする請求項1に記載のパターン形成方法。
- 像保持体に帯電した現像剤によるパターン像を形成する現像工程と、
前記現像工程の後に、上記像保持体に対向する対向面側に導電性有機成分からなる電極層を有する被転写媒体を上記像保持体に対向配置し、上記像保持体と上記電極層との間に電界を形成して上記パターン像を上記被転写媒体へ転写する転写工程と、
前記転写工程の後に、上記電極層を加熱して分解、蒸発、もしくは昇華させることにより高抵抗化させる高抵抗化工程と、
を有することを特徴とするパターン形成方法。 - 上記電極層は、界面活性剤型帯電防止剤、高分子系持続性帯電防止剤、および共役系導電性ポリマーのうち少なくとも1種を含む材料により形成されていることを特徴とする請求項2乃至請求項4のいずれか1項に記載のパターン形成方法。
- 絶縁性基板の表面側にパターン状の電極層を形成する電極層形成工程と、
上記絶縁性基板の表面側に対向配置した供給部材を介して帯電した現像剤を上記絶縁性基板へ供給し、上記供給部材と上記電極層との間に電界を形成して上記電極層に上記現像剤を集めてパターン像を形成する現像工程と、
上記電極層を消失させる消失工程と、
を有することを特徴とするパターン形成方法。 - 上記消失工程では、上記電極層を加熱により蒸発させることを特徴とする請求項6に記載のパターン形成方法。
- 上記消失工程では、上記電極層を加熱により昇華させることを特徴とする請求項6に記載のパターン形成方法。
- 絶縁性基板の表面側に導電性有機成分からなるパターン状の電極層を形成する電極層形成工程と、
前記電極形成工程の後に、上記絶縁性基板の表面側に対向配置した供給部材を介して帯電した現像剤を上記絶縁性基板へ供給し、上記供給部材と上記電極層との間に電界を形成して上記電極層に上記現像剤を集めてパターン像を形成する現像工程と、
前記現像工程の後に、上記電極層を加熱して分解、蒸発、もしくは昇華させることにより高抵抗化させる高抵抗化工程と、
を有することを特徴とするパターン形成方法。 - 上記電極層は、界面活性剤型帯電防止剤、高分子系持続性帯電防止剤、および共役系導電性ポリマーのうち少なくとも1種を含む材料により形成されていることを特徴とする請求項7乃至請求項9のいずれか1項に記載のパターン形成方法。
Priority Applications (7)
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JP2006134022A JP4786406B2 (ja) | 2006-05-12 | 2006-05-12 | パターン形成方法 |
CNA2007800169234A CN101443833A (zh) | 2006-05-12 | 2007-05-08 | 图案形成方法 |
PCT/JP2007/059522 WO2007132700A1 (ja) | 2006-05-12 | 2007-05-08 | パターン形成方法 |
EP07742957A EP2019387A4 (en) | 2006-05-12 | 2007-05-08 | PATTERN TRACING METHOD |
KR1020087027623A KR100993442B1 (ko) | 2006-05-12 | 2007-05-08 | 패턴 형성 방법 |
TW096116889A TW200804907A (en) | 2006-05-12 | 2007-05-11 | Pattern forming method |
US12/268,699 US7648813B2 (en) | 2006-05-12 | 2008-11-11 | Pattern forming method |
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EP (1) | EP2019387A4 (ja) |
JP (1) | JP4786406B2 (ja) |
KR (1) | KR100993442B1 (ja) |
CN (1) | CN101443833A (ja) |
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WO (1) | WO2007132700A1 (ja) |
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US4707382A (en) * | 1983-09-28 | 1987-11-17 | Ricoh Company, Ltd. | Developer carrier and a method for manufacturing the same |
JPH06265712A (ja) | 1993-03-10 | 1994-09-22 | Toppan Printing Co Ltd | カラーフィルタの製造方法およびそれに用いるトナーとその製造方法と現像液 |
JPH076692A (ja) * | 1993-06-14 | 1995-01-10 | Shinko Kagaku Kogyo Kk | 電極接合方法、これに用いるスペーサ転写シート及びこのスペーサ転写シートの製造方法 |
US5799225A (en) * | 1994-10-19 | 1998-08-25 | Sharp Kabushiki Kaisha | Image forming apparatus having variable transfer and attraction voltage |
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TWI359981B (ja) | 2012-03-11 |
JP2007305476A (ja) | 2007-11-22 |
KR20080109083A (ko) | 2008-12-16 |
US20090123855A1 (en) | 2009-05-14 |
EP2019387A4 (en) | 2010-08-11 |
TW200804907A (en) | 2008-01-16 |
WO2007132700A1 (ja) | 2007-11-22 |
CN101443833A (zh) | 2009-05-27 |
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