JP4783888B2 - Microchip manufacturing method and manufacturing apparatus, and microchip - Google Patents

Description

  The present invention relates to a microchip manufacturing method, a manufacturing apparatus, and a microchip.

From the viewpoints of speeding up chemical reactions, reactions with very small amounts, on-site analysis, etc., the use of microchips to perform chemical reactions and microspaces has come to be performed. Detection data obtained by mixing, reacting, separating, and extracting samples in the liquid in microchannels or microgrooves (also referred to as channel channels or simply channels). It is made to get.
For this reason, various methods for manufacturing a microchip have been proposed.

  In Patent Document 1, a microchip refers to a glass substrate on which a groove is formed and another glass substrate on which a small hole for sample injection / discharge is arranged at a position corresponding to the groove. A part forms the above-mentioned fine flow path. As a method for joining two glass substrates constituting a microchip, a hydrofluoric acid aqueous solution or anhydrous silicic acid is dropped onto one glass substrate, and the other glass substrate is bonded to each other to apply a load for a long time. The surface of both glass substrates is cleaned with an alkali (NaOH), etc. and bonded by applying a light pressure, or both glass substrate surfaces are activated by irradiating an energy beam under high vacuum. It is remembered that what is to be joined is known.

Further, Patent Document 1 discloses a plate-like second glass having at least two through holes on the one surface of a plate-like first glass substrate having a groove on one surface at a position corresponding to the groove. A method of manufacturing a microchip comprising a bonding step for bonding substrates,
The first glass substrate and the second glass substrate have different temperature viscosity curves,
In the bonding step, a microchip manufacturing method is proposed in which the bonding is performed by heating the first glass substrate and the second glass substrate to a predetermined temperature.

In Patent Document 2, in the bonding of substrates including at least silicon oxide as a component on the surface to be bonded, a solution containing at least hexafluorosilicic acid (H ₂ SiF ₆ ) is bonded between the substrates to be bonded. A bonding method is described in which after the introduction, an appropriate compression pressure is applied between the bonded substrates.

Patent Document 3 discloses a manufacturing method of manufacturing a structure including a step of bonding members whose main components are SiO _{2 on the} surface, the bonding step being performed on the surface of either of the two members. A step of forming a groove dividing the region into a plurality of portions, superimposing the surface of another member on the surface where the groove is formed, and joining the two members with a solution for dissolving SiO ₂ on the joint surface A structure manufacturing method is described.

  Patent Document 4 describes a solid bonding method in which silicon oxide members, which are glasses to be bonded to each other, are exposed to hydrofluoric acid gas, and then both silicon oxide-based members are contacted and bonded.

  In Patent Document 5, a plurality of glass adhesion bodies are formed by closely adhering a plurality of glasses to be bonded, and the plurality of glass adhesion bodies are irradiated with a beam-shaped laser beam to melt a part of the glass. A method of joining a plurality of glasses to be joined by solidifying the molten glass is described.

  In Patent Document 6, two pieces of glass are arranged in a state in which their joint surfaces are abutted with each other, and light from a light source lamp for heating is applied to the joint surfaces while these joint surfaces are pressed against each other. There is described a method of joining plate glass in which the joining surface is melted by irradiating the joining portion to be included and heating and softening the joining surface.

  Further, in Patent Document 7, in a channel forming method of a chip member for a microchemical system having a predetermined pattern and having a predetermined cross-sectional shape on a glass substrate, the channel is formed on the glass substrate using a press method. A method for forming a channel of a chip member for a microchemical system, characterized in that formation is performed, is described.

  Further, Patent Document 8 describes a method for measuring an electrochemical reaction in an electrode integrated microchip.

JP 2003-215140 A JP 2002-316842 A JP 2004-238238 A JP 2002-97040 A JP 2001-247321 A JP 2003-63839 A JP 2003-275575 A JP, 2004-239781, A DISCLOSURE OF THE INVENTION [Problems to be Solved by the Invention]

  Conventionally, in order to join the microchip glass after the flow path processing, (1) a method of oxidizing the joining surface of the base glass and the cover glass using ammonium hydroxide / hydrogen peroxide solution, and superposing and heating them, (2) A 1% hydrofluoric acid aqueous solution is dropped onto the joint surface, and a superposition method is applied by applying a load for 24 hours, and (3) a wet method such as thinly applying water glass on the joint surface, superposing and applying a load. Was mainly used.

For (1) and (2), a relatively strong bond is obtained, but the metal electrode required in many biochemical systems has the disadvantage of being eroded and dissolved by an alkaline solution or an acidic solution. Technology and new technology such as surface plasmon resonance biosensor (SPR) cannot be made into a microchip.
As for (3), there is no erosion of the electrode, but there are difficulties in bonding strength and sealing performance. In addition, these wet methods generally have a drawback that the time required for bonding is long (several hours to one day).

On the other hand, the dry method includes (4) a dry method in which the joint surface is mirror-polished and then fused in an overlapping electric furnace, but has the disadvantage that the time required for polishing (several hours) and cost increase.
In addition, the conventional method cannot obtain sufficient strength in a system that requires pressure resistance, and is impossible due to deformation of the glass itself and heat resistance of the support device.

  The present invention has been made in view of the above, and an object of the present invention is to provide a microchip manufacturing method and manufacturing apparatus that have high bonding strength, good sealing (sealing) properties, and a short bonding time.

  It is another object of the present invention to provide a microchip that is manufactured by the above-described manufacturing method and manufacturing apparatus and that is low in cost and has little deformation.

  In the present invention, a plate-like glass substrate is disposed on one surface of a plate-like substrate having a fine groove (channel) on one surface, and at least two corresponding positions of the fine groove are provided. In a microchip manufacturing method, wherein a through hole is formed in the substrate or the glass substrate, and the bonding step of bonding the substrate and the glass substrate is performed, a heating device using a light source as a heat source line, or the stacked substrate and The step of moving the glass substrate in the XY-axis direction so that the heating device faces the substrate and the glass substrate, and irradiating the heat source line from the heating device to the joint between the substrate and the glass substrate And a joining step in which joining lines are formed on both sides of the fine groove.

  In the present invention, a plate-like glass substrate is disposed on one surface of a plate-like substrate having a fine groove on one surface, and at least two through holes are provided at corresponding positions of the fine groove. In the microchip manufacturing apparatus for manufacturing by bonding the glass substrate and the substrate formed on the substrate or the glass substrate, a heating device using a light source as a heat source, and the heating device or the superposed device A moving means for moving the substrate and the glass substrate in the XY directions so that the heating device and the superposed substrate and the glass substrate are arranged opposite to each other; and the heat source line from the heating device is connected to the substrate and the glass substrate. And a control unit that forms a bonding line on both sides of the fine groove, and provides a microchip manufacturing apparatus.

  In the present invention, a plate-like glass substrate is disposed on one surface of a plate-like glass substrate having a fine groove on one surface, and at least two penetrating holes are provided at corresponding positions of the fine groove. In the microchip in which holes are formed and bonded, the two glass substrates are bonded by a plurality of bonding lines on both sides of the fine groove.

  As described above, the present invention irradiates a heat source line from a heating device between both substrates including a glass substrate, and forms a plurality of bonding lines or fine grooves on both sides of the fine groove so as to be parallel to the fine groove. Since the enclosing bonding line is formed, it is possible to provide a manufacturing method and a manufacturing apparatus of a microchip that have high bonding strength, good sealing properties, and a short bonding time.

  Furthermore, these microchip manufacturing methods and manufacturing apparatuses are simple and low in cost, so that the microchip itself manufactured is also low in cost and does not deform the substrate due to the bonding by the bonding wire. Alternatively, a highly accurate microchip that requires very little can be provided.

  As described above, since the microchip can be made inexpensively and easily with a good sealing property, the fine grooves formed between the microchips can be subjected to various reactions in a more complicated manner. .

  A plate-like glass substrate is disposed on the one surface of the plate-like substrate having a fine groove (channel) on one surface, and at least two through holes are provided at corresponding positions of the fine groove. In a manufacturing method of a microchip formed on a substrate or the glass substrate and having a bonding step of bonding the substrate and the glass substrate, a heating device using a light source as a heat source line, or the stacked substrate and the glass substrate Moving in the XY-axis direction, causing the heating device to face the substrate and the glass substrate, irradiating the heat source line from the heating device to the joint between the substrate and the glass substrate, and Bonding lines are formed on both sides of the groove, and the bonding line has a bonding step formed adjacent to the fine groove. Manufacturing method of the microchip is configured to symptoms.

  In the above method, the through hole is formed on the outside of the microchip and the fine groove is formed on the inside, and the bonding line is formed so as to surround the through hole and the fine groove. A chip manufacturing method is configured.

  In the above method, the substrate is a glass plate, a metal plate, a silicon (Si) plate, or an aluminum (including alloy) plate, and a microchip manufacturing method is provided.

  In the above method, a thin film for sealing and bonding is not formed between the substrate and the glass substrate, and the bonding line is formed by direct contact with the substrate and the glass substrate by heat-bonding. A method for manufacturing the microchip is configured.

  In the above method, a thin film for sealing and bonding composed of a glass component is formed between the substrate and the glass substrate, and the sealing bonding thin film, the substrate and the glass substrate are subjected to reactive bonding by heating. A manufacturing method of a microchip configured to form a bonding line is configured.

  In the above method, the substrate is a glass substrate, a heat absorbing material is disposed on both sides of both glass substrates, a local electric furnace is formed between both glass substrates, and both glass substrates are melted locally. The manufacturing method of the microchip which forms the said joint line by is comprised.

  In the above method, the joining line is formed by a point focus method or a line focus method.

  Further, a plate-like glass substrate is placed on the one surface of the plate-like substrate having a fine groove on one surface, and at least two through holes are provided at the corresponding positions of the fine groove. Or in the manufacturing apparatus of the microchip which joins and manufactures the said board | substrate formed on the said glass substrate, and the said glass substrate, the heating apparatus which uses a light source as a heat ray source, the said heating apparatus, or the said board | substrate and the said glass which overlap | superposed A moving means for moving the substrate in the XY direction to dispose the heating device and the superimposed substrate and the glass substrate, and a heat source line from the heating device between the substrate and the glass substrate. Irradiating the joint, forming a joining line on both sides of the fine groove, and having storage means for storing the arrangement of the fine groove, the arrangement data of the fine groove stored in the storage means The microchip manufacturing device is formed constituted the amount of movement of the moving means and the control unit having a processing unit for calculating processed using.

In the above apparatus, a microchip manufacturing apparatus is provided, wherein an electrode protective film is formed on the upper surface of the glass substrate.
This embodiment may be combined with other known joining methods.
Embodiments of the present invention will be described below with reference to the drawings.

  FIG. 1 shows a configuration of a microchip manufacturing apparatus 100 according to an embodiment of the present invention. In FIG. 1, a microchip manufacturing apparatus 100 includes a heating device 1 using a light source as a heat source line, an XY stage 2 on which a microchip 10 is placed, an X-axis drive motor 3, a Y-axis drive motor 4 and a control unit 5. It is configured with. The control unit 5 includes a joining control unit and a stage control unit.

  The heating device 1 employs a heating means using a light source such as an infrared heating device or a laser irradiation device as a heat source line. In the first embodiment, an example of a heating device using infrared rays 12 as the heating means is shown. Infrared rays emitted from the infrared irradiation unit 11 are reflected and focused on the bonding surfaces (bonding portions) of the substrates that are the upper and lower plate members constituting the microchip 10 and are collected. In this embodiment, a glass substrate is used as the upper substrate, and a glass substrate, a metal substrate, a silicon (Si) substrate, or an aluminum (including aluminum alloy) substrate is used as the lower substrate. Hereinafter, an example in which a glass substrate is employed in both upper and lower directions will be described.

  The microchip 10 is mounted on the spring type glass substrate holder 6 or fixed by other suitable fastening means, and the glass substrate holder 6 is fixed to the XY stage 2 by screws or other suitable fastening means. The XY stage 2 has a space (part) 7 at the center, and the glass substrate holder 6 is fixed to the XY stage 2 across the space 7.

  The intensity of infrared rays emitted from the heating device 1, the position of the focal point, and the position, distance, and shape of the bonding line are controlled by control signals output from the bonding control unit of the control unit 5.

  The glass substrate holder 6 is fixed to the XY stage 2 as described above, and the surface is irradiated with infrared rays from the infrared irradiation unit 11 in a symmetrical manner, that is, one integrated irradiation. If a light source line as a line is assumed, the light source lines are arranged so as to be orthogonal to the light source line.

  The XY stage 2 is driven in the X-axis direction by the X-axis drive motor 3 and in the Y-axis direction by the Y-axis drive motor 4. The heating device 1 is driven in the Z-axis direction by a Z-axis drive motor (not shown). X-Y axis driving including driving in the Z-axis direction may be performed by the XY stage 2.

  The stage control unit of the control unit 5 has a control / monitoring function for the XY stage 2 or the heating device 1, and performs various controls including on / off of the corresponding power supply, and includes a program for that purpose.

  FIG. 2 shows means and a method for manufacturing the microchip 10 by joining the upper and lower glass substrates 15 and 16. In FIG. 2, as described above, the heating device 1 has the infrared irradiation unit 11, and the reflector 13 is provided so as to surround the infrared irradiation unit 11. In the case of this example, an ellipsoidal reflection type that has been subjected to precise curvature processing may be used, but another reflection type, for example, a parabolic reflection type may be used. An opening 14 is formed at the end of the ellipsoidal reflection shaped portion.

  An infrared lamp is used as the heating element. The infrared lamp is a rod-shaped lamp in which a tungsten filament is sealed in a quartz glass tube. This rod-shaped lamp becomes the infrared irradiation unit 11. High-speed and ultra-high temperature heating is realized by the high energy density infrared lamp and the above reflector. As the cooling means (not shown), a water cooling or glass cooling mechanism is used. The junction controller of the controller 1 (FIG. 1) freely controls the temperature of the junction by a combination of voltage adjustment of the highly responsive infrared lamp and programmable temperature control. Bonding using an infrared lamp can be performed in the air or in an airtight structure, and the temperature can be raised to 1900 to 2000 ° C. within 20 seconds.

A flow path 19 (channel) serving as a fine groove is formed on one surface of the lower glass substrate 16, and the glass substrate 16 on which the flow path 19 is formed serves as a flow path forming substrate.
The fine groove is used to form a flow of a solid sample such as microbeads useful as a reagent carrier for a purification operation, a synthesis reaction, or an immune reaction in the fine groove.

  A thin film (several tens of nanometers to a few tens of nanometers or more) used on the glass bonding surface of the upper glass substrate 15 or the lower glass substrate 16 as a sealing bonding thin film by vapor deposition or sputtering of aluminum, boron oxide, silicon monoxide or silicon as glass components. (Several microns) 17 is formed. A thin film 17 is formed, and the glass substrates 15 and 16 are overlaid. In the case of the present embodiment, electrodes (not shown) are provided on the glass substrates 15 and 16, and the temperature can be raised more quickly by the temperature raising action of these electrodes. An electrode protection film 20 made of a metal film, a gold vapor deposition film or the like is formed on the upper surface of the upper glass substrate 15, and an electrode is formed on the bottom of the flow path 19. After the glass substrates 15 and 16 and the thin film 17 are superposed, the light of the infrared lamp is condensed on the joint surface by the elliptical reflector 13 at one point along the joint line programmed in advance in the infrared image furnace. Heat and bond by reaction. As described above, since the superposed glass substrates 15 and 16 are supported by the glass substrate holder 6 of a dedicated mobile machine having the XY stage 2, the joining line is arbitrarily activated as indicated by an arrow. It is possible to avoid damage from heat, acid and alkali treatment of the electrode part.

  The microchip 10 is formed, that is, manufactured as described above. FIG. 3 shows an example of point focal joint (FIG. 3A) and an example of line focal joint (FIG. 3B). In these figures, the figure showing the microchip is a plan view including the figure seen from the side and the figure seen from above. A point focus type heating device is used for the heating device 1 shown in FIG. 3A, and a line focus type heating device is used for the heating device 1 shown in FIG. In the example shown in FIG. 3 (a), the electric furnace is not adopted, the heating method by the infrared irradiation unit 11 using an infrared lamp is adopted, and in the example shown in FIG. A furnace is adopted, and a light absorption local electric furnace 21 is formed by the light absorption mesh 22 above the electric furnace and the light absorption plate below. Further, in this example, the infrared lamps are arranged horizontally, and are arranged differently from the vertically arranged FIG.

  According to the point-focus type bonding according to FIG. 3A, a bonding line is formed by a point set, and according to the line-focus type bonding according to FIG. 3B, a bonding line is formed by line focusing.

  In the example shown in FIG. 3B, by arranging the light absorbing mesh (platinum mesh) 22 and the light absorbing plate (platinum sheet) 23 as described above and irradiating with infrared rays, infrared rays are emitted from the platinum portion. It is absorbed and generates heat to form a local electric furnace (formation of the light absorption local electric furnace 21).

  The joining method will be described with reference to FIGS. FIG. 4 is a diagram for explaining the microchip 10, and FIG. 4A is a thin film 17 used as a sealing bonded thin film, that is, the upper and lower glass substrates 15 and 16 are directly bonded without providing an intermediate layer. This is an example. In accordance with this example, the flow path 19 is formed directly on the lower glass substrate 16 or a flow path forming substrate provided with the flow path 19 is interposed on the glass substrate 16. According to the joining by this method, since the two glass substrates 15 and 16 are heat-sealed, the joining strength is increased.

  The upper glass substrate 15 is provided with a plurality of through holes 33 communicating with the flow path 19.

  FIG. 4B shows a thin film 17 used as a sealing bonded thin film, that is, an intermediate layer is provided, and the intermediate layer is melted, or a part of the glass substrates 15 and 16 is melted to melt the glass substrate 15. 16 is an example of joining. As shown in the figure, an electrode 31 and an encapsulating electrode 32 are provided. Since the intermediate glass component and the glass substrates 15 and 16 are reacted with each other after bonding, the glass becomes an integrated glass, so that the bonding strength is increased. Thus, an electrochemical reaction can be performed in an electrode integrated microchip in which microchannels are formed and microelectrodes are integrated. The thermal lens signal of the electrochemical reaction can be measured with a thermal lens microscope.

  FIGS. 5A and 5B are diagrams for explaining joining lines formed by various joining methods. FIG. 5A shows a point-focus joining-flow channel joining method (a), and FIG. FIG. 5 (c) shows the channel enveloping and joining method (c), and FIG.

  In the example of FIG. 5A, as shown by the arrows, the condensed light forms a joining line 41 along the flow path 19, that is, close to the flow path 19.

  Therefore, in the case of this example, the joining line 41 is formed close to both sides of the flow path 19, and the sealing performance of the flow path 19 is improved. The joining along the flow path 19 is based on the program of the control unit 5 shown in FIG.

  In accordance with the example of FIG. 5B, as shown by the arrow, the condensed light surrounds the flow path 19, that is, close to the flow path 19 to form the joint line 42. Therefore, in this example, the joining line 42 is formed so as to surround the flow path 19, and the sealing performance of the flow path 19 is improved. When the channel 19 has a complicated shape, the channel 19 may be surrounded. A joining line is formed close to both sides of the flow path 19.

  In the example of FIG. 5 (c), as shown by the arrows, the light is focused by a line focus, and one surface is joined at once. In this example, the one-surface collective bonding surface 43 is formed, but on both sides of the flow channel 19, the bonding lines (parts) are formed along the flow channel 19 as shown in FIG. 5A or FIG. 5B. ) Are formed close to each other, and the sealing performance is improved.

  The method for forming the bonding line is not limited to the example shown in FIG. 5 and may be performed by a combination of bonding lines. In short, the sealing performance is improved by forming a plurality of bonding lines that are opposed to the fine grooves on both sides of the fine grooves that are the flow paths 19 or a bonding line that surrounds the fine grooves. The joining lines 41, 42, and 43 are formed close to each other along the flow path 19 that becomes a fine groove.

  The through-hole 33 is formed inward along the outer side of the microchip 10 (in this example, the outer side of the upper glass substrate 5), and the joint lines 41, 42, and 43 are through-holes. 33 and the flow path 19 are formed in parallel or in an enclosed manner.

  FIG. 6 is a diagram illustrating an internal configuration of the control unit 5, and the bonding control unit and the stage control unit included in the control unit 1 are configured as follows.

  The control unit 5 includes a preprocessor 61 and a postprocessor 62. The preprocessor 61 includes a control data unit 63, a CPU processing unit 64, and a CPU storage unit 65. The postprocessor 62 includes the CPU storage unit 65 and the CPU processing described above. The unit 66 and the junction output unit 67 are configured.

  The control data unit 63 holds data such as microchip flow path data, microchip material as a joining condition, thickness, joining temperature, and speed.

  The CPU processing unit 64 uses the data in the control data unit 63 to calculate the bonding trajectory, the XY stage operation, and the temperature control program.

  The CPU storage unit 65 stores the bonding trajectory data, the XY stage operation data, and the temperature control program data calculated by the CPU processing unit 64.

  The CPU processing unit 66 generates a signal for XY stage control and a signal for heating apparatus control using various data stored in the CPU storage unit.

  The joining output unit 67 outputs the signal generated by the CPU processing unit 66 for controlling the XY stage and the heating device.

  As described above, according to the present embodiment, the plate-like glass substrate 15 is provided on the one surface of the plate-like substrate 16 (channel-forming substrate) having the fine groove (channel 19) on one surface. In the microchip manufacturing apparatus 100, which is manufactured by joining the glass substrate 15 and the substrate 16 in which the substrate 16 or the glass substrate 15 having the at least two through-holes 33 formed in the corresponding positions of the fine grooves are bonded to each other. Then, the heating device 1 using the light source as a heat ray source, the heating device 1 or the stacked substrate 16 and the glass substrate 15 are moved in the XY direction, and the heating device 1 and the stacked substrate 16 and the glass substrate 15 are moved. , For example, an XY stage 2 and a heat source line from the heating device 1 are irradiated to the joint between the substrate 16 and the glass substrate 15, and the joint lines 41 to 44 are formed on both sides of the fine groove. Formation A control unit 5 which, microchip manufacturing device is formed having a.

The control unit 5 can form the joining lines 41 to 44 so as to surround the fine groove.
In addition, the control unit 5 includes a storage unit that stores the arrangement of the fine grooves, and a processing unit that calculates the movement amount of the XY stage 2 using the arrangement data of the fine grooves stored in the storage unit Have

  With this configuration, the infrared rays are condensed and heated to form a high energy spot, and the reaction or heat fusion can be performed in a short time. For example, the time required can be shortened by 30 minutes even when ten or more hours are conventionally required. Moreover, if it is this structure, grinding | polishing the glass substrates 15 and 16 will no longer be essential, and cost can be reduced. Further, since the joining line is condensing fusion, the completed microchip 10 is hardly deformed.

  FIG. 7 is a flowchart showing a microchip manufacturing process according to the present embodiment. In FIG. 7, flow path processing is performed on the lower glass substrate 16 by an etching method (S1), and then an electrode is deposited (S2). A sealing thin film process is performed to form a seal bonding thin film with the glass substrate 15 (S3), and then an electrode protective film process is performed (S4). According to the above-described technique, optical bonding is performed (S5), and the electrode protective film is peeled off to manufacture a microchip (S6).

  As described above, the plate-like glass substrate 15 is disposed on one surface of the plate-like substrate 16 having fine grooves on one surface, and at least two through-holes 33 are disposed at corresponding positions of the fine grooves. Is formed on the substrate 16 or the glass substrate 15, and in the method of manufacturing a microchip having a bonding step of bonding the substrate 16 and the glass substrate 15, the heating apparatus 1 using a light source as a heat source line, or the stacked substrate 16 and glass Moving the substrate 15 in the XY-axis direction, causing the heating device 1 to face the substrate 16 and the glass substrate 15, and irradiating the joint between the substrate 16 and the glass substrate 15 with a heat source line from the heating device 1; The manufacturing method has a joining step in which joining lines 41 to 44 are formed on both sides of the fine groove.

  Bonding lines 41 to 44 are formed close to the fine grooves. The substrate 16 is a glass substrate, and a local electric furnace is formed between the glass substrates by arranging heat absorbing materials on both sides of the glass substrates. The joining lines 41 to 44 can be formed by locally melting both glass plates.

  In this method, cold wall can be used. For example, in order to partially heat-bond the joint surface with increased infrared absorption efficiency using an infrared condensing heater, the temperature of the support equipment other than the joint is increased and the glass itself is deformed. Can be prevented. In addition, electrode attachment, which is impossible with the wet method, can be performed without causing thermal melting by providing a light reflection mask on the electrode portion.

  FIG. 8 is a diagram showing another embodiment, which corresponds to FIG. 5B of the previous embodiment. The same configuration as the previous embodiment is omitted, only the main part is shown, and the previous embodiment is referred to for many explanations.

  In FIG. 8, a laser irradiation device is used as the heating device 1. The laser irradiation device emits laser light 81. The intensity and focus position of the laser beam 81 are controlled by a laser beam control signal output by the bonding controller. The bonding method by optical bonding is the same as in the previous embodiment, and will not be described repeatedly. In this way, the joining line 44 is formed.

  A plate-like glass substrate 15 is disposed on one surface of the plate-like glass substrate 16 having fine grooves on one surface, and at least two through holes 33 are formed at corresponding positions of the fine grooves. The two glass substrates 15 and 16 are joined by a plurality of joining lines 41 to 44 on both sides of the fine groove to constitute a microchip.

  This method can be completed in 30 minutes or less by the glass microchip automated bonding equipment. Since glass microchip is used, photoreaction using ultraviolet, infrared, laser, photocatalyst, photoanalysis, acid, Various reactions and analyzes using solvents are possible. Furthermore, since this method can produce microfluidic chips encapsulating electrodes, it has been attracting attention in recent years, including surface plasmon resonance biosensors (SPR) and electrochemical detection elements, and functional elements (molecules such as DNA and enzymes). ) Fixation and the provision of electrolytic reaction fields.

The figure which shows schematic structure of the Example of this invention. The figure which shows the manufacturing apparatus and method of the Example of this invention. FIGS. 3A and 3B are diagrams illustrating a bonding method, in which FIG. 3A illustrates an example of point-focus bonding, and FIG. 3B illustrates an example of line-focus bonding. 4A and 4B are explanatory diagrams of a microchip, in which FIG. 4A shows an example without an intermediate layer, and FIG. 4B shows an example with an intermediate layer. 5A and 5B are diagrams showing various bonding methods, in which FIG. 5A shows a point-focus bonding-flow channel contact method, FIG. 5B shows a point-focus bonding-flow channel surrounding bonding method, and FIG. 5C shows a line. The figure which shows a focal one surface collective joining system. The figure which shows the detail of a control part. FIG. The figure which shows the structure of another Example.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Heating device, 2 ... XY stage, 3 ... X-axis drive motor, 4 ... Y-axis drive motor, 5 ... Control part, 6 ... Glass substrate holder, 7 ... Space (part), 10 ... Microchip, 11 Infrared irradiation part (infrared lamp), 12 infrared rays, 13 reflector (reflecting surface), 15 upper glass substrate, 16 lower glass substrate, 17 thin film (sealing bonded thin film), 18 flow path Forming substrate, 19 ... channel (fine groove), 20 ... electrode protective film, 31 ... electrode, 32 ... encapsulated electrode, 33 ... through hole, 41, 42, 43, 44 ... bonding line, 100 ... microchip manufacturing apparatus .

Claims (13)

A plate-like glass substrate is disposed on the one surface of the plate-like substrate having a fine groove (channel) on one surface, and at least two through holes are provided at corresponding positions of the fine groove. In the method of manufacturing a microchip, which is formed on a substrate or the glass substrate and includes a bonding step of bonding the substrate and the glass substrate.
A heating device having a light source as a heat source line, or a step of moving the superposed substrate and the glass substrate in an XY axis direction so that the heating device faces the substrate and the glass substrate;
The joining step of irradiating the joint between the substrate and the glass substrate with the heat source line from the heating device to form a joint line on both sides of the fine groove;
A method for producing a microchip, comprising:   2. The method of manufacturing a microchip according to claim 1, wherein the joining line is formed close to the fine groove.   2. The through hole according to claim 1, wherein the through hole is formed outward of the microchip and the fine groove is formed inward, and the joining line is formed so as to surround the through hole and the fine groove. A method for manufacturing a microchip.   2. The method of manufacturing a microchip according to claim 1, wherein the substrate is a glass plate, a metal plate, a silicon (Si) plate, or an aluminum (including alloy) plate.   In Claim 1, the thin film for sealing joining is not formed between the said board | substrate and the said glass substrate, it is made to contact directly, and the said bonding line is formed by the reactive joining by heating the said board | substrate and the said glass substrate. A method of manufacturing a microchip, comprising:   In Claim 1, the thin film for sealing joining which consists of a glass component is formed between the said board | substrate and the said glass substrate, By the reactive joining by heating between this sealing joining thin film, the said board | substrate, and the said glass substrate A method of manufacturing a microchip, wherein the bonding line is formed.   In Claim 1, the said board | substrate is a glass substrate, arrange | positions a heat absorption material on both sides of both glass substrates, forms a local electric furnace between both glass substrates, and melts both glass substrates locally. A method of manufacturing a microchip, characterized in that the joining line is formed.   8. The method of manufacturing a microchip according to claim 1, wherein the joining line is formed by a point focus method or a line focus method. A plate-like glass substrate is disposed on the one surface of the plate-like substrate having a fine groove on one surface, and at least two through-holes are provided in the corresponding position of the fine groove. In the microchip manufacturing apparatus for bonding and manufacturing the substrate formed on the glass substrate and the glass substrate,
A heating device having a light source as a heat source;
Moving means for moving the heating device or the stacked substrate and the glass substrate in the XY directions to dispose the heating device and the stacked substrate and the glass substrate opposite to each other;
A controller that irradiates the joint between the substrate and the glass substrate with the heat source wire from the heating device, and forms a joint on both sides of the fine groove;
A microchip manufacturing apparatus comprising:   10. The microchip manufacturing apparatus according to claim 9, wherein the control unit forms the joining line so as to surround the fine groove.   The control unit according to claim 9, wherein the control unit includes a storage unit that stores the arrangement of the fine grooves, and uses the arrangement data of the fine grooves stored in the storage unit to calculate the movement amount of the movement unit. An apparatus for manufacturing a microchip, comprising: a processing unit that performs processing. The microchip manufacturing apparatus according to claim 9 , wherein an electrode protective film is formed on an upper surface of the glass substrate. A plate-like glass substrate is placed on one surface of a plate-like glass substrate having a fine groove on one surface, and at least two through holes are formed at the corresponding positions of the fine groove and bonded. In the microchip
The two glass substrates are bonded by a plurality of bonding lines on both sides of the fine groove.

Images