JP2015160334A - Method of joining resin member and method of manufacturing well chip for inspection - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of obtaining a resin joining object having high shape accuracy and having high reliability for use in an inspection by joining together transparent resin members, such as upper and lower rein members of a well chip for an inspection, without using adhesive.SOLUTION: Thermoplastic resin members 1 and 2 having laser beam permeability are welded together in a required pattern by overlapping the resin members 1 and 2 in a state in which a thin metal wire 3 for setting a joint region Z of the required pattern is interposed between their opposing surfaces; approximately uniformly irradiating a laser beam 4 through one of the resin members 1 and 2 over a length L corresponding to the joint region Z of the thin metal wire 3 with high-speed scanning by a galvano scanner 21; and melting the resin in a circumferential part by exothermic heat of the thin metal wire 3.

Description

  The present invention relates to a method for bonding a resin member having laser light transparency and a method for manufacturing a well chip for inspection using this bonding method.

  As test well chips used for diagnosis of mammalian embryos and electrochemical measurement of various substances, as shown in FIGS. 8A to 8C, both are made of transparent resin such as PMMA (polymethyl methacrylate). A rectangular plate-like upper resin member 11 and a substantially cubic lower resin member 12 are joined via an adhesive layer 13, open to the center of the upper surface of the upper resin member 11, and the upper portion of the lower resin member 12. And a diameter made of platinum or the like interposed between the opposing surfaces of the resin members 11 and 12 at both radial positions on the inner peripheral surface of the sample well 14. One end of a thin metal wire 15 of about 10 μm is exposed as an electrode 15 a, and the other end of each thin metal wire 15 is disposed on an electrode plate 16 disposed in a vertical recess 12 a provided on both opposing side surfaces of the lower resin member 12. Connected structure Known to (Patent Document 1).

  When a mammalian fertilized egg is diagnosed using such a test well chip, for example, as shown in FIG. 8C, first, the test solution S is accommodated in the sample well 14, and the electrode potential of the electrode 15a is set. The oxygen reduction current (bulk current) is measured after controlling to a constant potential (generally −0.6 V) with respect to the reference electrode (generally silver / silver chloride), and then the fertilized egg E is placed in the sample well 14. The oxygen reduction current (sample current) is measured, the respiration rate (oxygen consumption) of the fertilized egg E is calculated from the difference between the measured values of the bulk current and the sample current, and the health degree is diagnosed and evaluated.

  However, in the above-described conventional well chip for inspection, as shown in FIGS. 9A and 9B, the fine metal wire 15 is wrapped in the adhesive layer 13 in the groove 12b provided on the upper surface of the lower resin member 12. The position of the electrode 15a cannot be set precisely, and the exposed length in the sample well 14 is non-uniform, so that the measurement is performed. There was a problem that the error of the value became large. Moreover, since the adhesive layer 13 is exposed on the peripheral surface of the sample well 14, there is a concern that the elution of the adhesive component, the chemical action, and the like may adversely affect the inspection target and reduce the reliability of the inspection result. Furthermore, since the sample well 14 is formed by grinding using a cutting tool, the surface accuracy of the resin members 11 and 12 due to the pressing force during processing and the shape accuracy of the inner peripheral surface of the sample well 14 and the electrode 15a. In addition, there is a problem that burrs are easily generated on the ground surface of the electrode 15a, and variations in measured values are easily caused by these. Therefore, in such a test well chip, it is desirable to join the upper and lower resin members 11 and 12 without using an adhesive.

  Conventionally, as a means for joining transparent resin members without using an adhesive, a thin light-absorbing transparent film is interposed between both resin members, and the film is irradiated with laser light from one resin member side. A method of melting and welding both resin members (Patent Document 2), placing one resin member on the surface of the optical mirror surface of the base, and applying the light absorber of the resin member to the other surface A method in which both resin members are welded with heat generated by light absorption of the light absorber coating layer by overlapping the resin members and irradiating the laser beam from above (Patent Document 3), the absorption wavelength on the surface of one resin member The first laser beam is irradiated to form a rough surface region, the other resin member is overlaid on the surface of the resin member having the rough surface region, and the second laser beam having a transmission wavelength is irradiated from the outside. Light scattering in the rough surface area How the two resin members is welded heating by (Patent Document 4), and the like are known.

JP 2012-63287 A JP 2003-181931 A WO2008-117717 JP 2007-230051 A

  However, when the welding method using laser light as described in Patent Documents 2 and 3 is applied to the bonding of the upper and lower resin members of the inspection well chip, the thin metal wires for electrode formation are coated with a light absorbing film or a light absorbing agent. Since the electrode is sandwiched between the layer and the resin member surface, the position and the exposed length of the electrode in the sample well cannot be set uniformly with high accuracy, resulting in a large error in the measured value and the light absorbing film. There is a concern that the melted layer and the light absorbent coating layer are exposed on the peripheral surface of the sample well, and the light absorbent contained therein may cause adverse effects on the test object and decrease the reliability of the test results. As in 1, the same problem occurs when both resin members are joined with an adhesive. On the other hand, in the method in which the surface of one resin member is roughened and welded with laser light as in Patent Document 4, two-stage laser processing is performed with laser light having different wavelengths for roughening and welding. Therefore, it takes time and labor, and it is necessary to use different types of lasers (for example, a carbon dioxide laser and a semiconductor laser) corresponding to the difference in wavelength, resulting in high equipment costs.

  In view of the above-described circumstances, the inventors have conducted research to develop a technique for joining the upper and lower resin members of the inspection well chip without using known means. Focusing on its ability to absorb laser light, an innovative bonding technology that melts the surrounding resin and welds both resin members due to the heat generated when the metal thin wire is irradiated with laser light. In addition, the bonding technique has been further developed to establish a method for bonding transparent resins that can be used for a wide range of applications other than the inspection well chip, thereby achieving the present invention.

  That is, the resin member joining method according to the first aspect of the present invention, if indicated by the reference numerals in the drawings, connects the thermoplastic resin members 1 and 2 having laser light transmittance between the opposing surfaces. And a laser beam absorbing material (metal fine wire 3, printed wiring 7) for setting a bonding area Z of a required pattern is overlapped, and the laser beam 4 is scanned at high speed by a galvano scanner 21 through one of the resin members 1 and 2. Both the resin members 1 are irradiated by substantially evenly irradiating the entire region corresponding to the joining region Z of the laser light absorbing materials 3 and 7 and melting the resin in the surroundings by the heat generation of the laser light absorbing materials 3 and 7. , 2 are welded in a required pattern.

  According to a second aspect of the present invention, in the resin member joining method according to the first aspect, the resin members 1 and 2 are made of a hard resin molded product, and the laser light absorbing materials 3 and 7 are formed of the resin members 1 and 2. Is also a high melting point, and the solid laser light absorbing materials 3 and 7 are embedded in the melted resin in the peripheral portion as the laser beam 4 is irradiated, so that both the resin members 1 before the laser beam 4 irradiation. The gap t corresponding to the thickness of the laser light absorbing materials 3 and 7 existing between the two opposing surfaces is eliminated.

  According to a third aspect of the present invention, in the resin member joining method according to the second aspect, the laser light absorbing material is a conductor (a thin metal wire 3, a printed wiring 7) constituting the electric wiring.

  According to a fourth aspect of the present invention, in the method for joining resin members according to the third aspect, the conductor is a fine metal wire 3.

  According to a fifth aspect of the present invention, in the resin member joining method according to the third aspect, the conductor is a printed wiring 7 provided on one surface of both the resin members 1 and 2.

  In the method for manufacturing a test well chip according to the sixth aspect of the invention, the two resin members 1 and 2 are upper and lower resin members constituting the test well chip T, and the bonding method according to the fourth aspect is used. A three-dimensional removal process is performed by irradiating a pulse laser 8 to the wiring position of the fine metal wire 3 from the upper surface side of the upper resin member 1 after joining, so that the inner resin surface 2 has a depth reaching the lower resin member 2. The sample well 6 exposed as the electrodes 3a, 3a facing both ends of the thin metal wire 3 is formed.

  Furthermore, in the manufacturing method of the inspection well chip according to the invention of claim 7, both the resin members 1 and 2 are upper and lower resin members constituting the inspection well chip, and after joining by the joining method according to claim 4 After forming a concave portion for the sample well having a depth reaching the lower resin member 2 by cutting at the wiring position of the thin metal wire 3 from the upper surface side of the upper resin member 1, the three-dimensional removal processing by pulse laser irradiation is performed. By finishing the inner peripheral portion of the concave portion for the sample well, the sample well 6 exposed as the electrodes 3a, 3a opposed to both ends of the thin metal wire 3 on the inner peripheral surface is formed.

  The effects of the present invention will be described below with reference numerals in the drawings. According to the first aspect of the present invention, in the state where the resin members 1 and 2 are overlapped with the laser light absorbing material (metal thin wire 3 and printed wiring 7) between the opposing surfaces, the joining region Z of the required pattern is obtained. If the laser beam absorbers 3 and 7 are irradiated with the laser beam 4 through one of the resin members 1 and 2 that set the temperature, the laser beam absorbers 3 and 7 generate heat due to light absorption, and the temperature thereof is the resin member 1. , 2, the surrounding resin melts from the portions in contact with the laser light absorbing materials 3, 7, and both resin members 1, 2 are welded at the melted portions. Since the irradiation of the laser beam 4 at this time is performed by high-speed scanning by the galvano scanner 21, the entire temperature corresponding to the bonding region Z of the laser light absorbing materials 3 and 7 is raised substantially simultaneously, and the entire bonding region Z is covered. By melting the resin evenly, both resin members 1 and 2 can be welded without distortion. On the other hand, in the method of irradiating the laser beam 4 to a fixed position while moving the resin members 1 and 2 side by an XY table or the like, due to the time difference of melting from the start side to the end side of the joining region, and the time difference of welding, It becomes easy to produce distortion in both the resin members 1 and 2 after joining.

  Therefore, in such a joining method, it is not necessary to interpose a light-absorbing film between the resin members 1 and 2, apply a light absorbent on the surface, or further roughen the surface. Therefore, the joining operation can be performed in a short time without the need for labor at a low cost. In addition, even in the application of providing a measurement part where the bonding interface between the resin members 1 and 2 appears like the sample well 6 of the inspection well chip T, a foreign material that adversely affects the measurement is not exposed at the bonding interface. There is no concern of causing measurement errors due to the foreign material.

  According to the invention of claim 2, the laser light absorbing materials 3, 7 have a high melting point with respect to both the resin members 1, 2 made of a hard resin molded product, and the laser beam that is solid as the laser beam 4 is irradiated. The light absorbing materials 3 and 7 are embedded in the melted resin in the peripheral portion, and the thickness of the laser light absorbing materials 3 and 7 existing between the opposing surfaces of both the resin members 1 and 2 before the laser beam 4 irradiation. The gap t disappears. Therefore, both the resin members 1 and 2 are completely brought into close contact with each other on the opposing surface portion other than the joining region Z, and distortion due to the interposition of the laser light absorbing materials 3 and 7 does not occur. Further, since the laser light absorbing materials 3 and 7 are fixed in the cured resin after melting, even if the laser light absorbing materials 3 and 7 are functionally required for positional accuracy of arrangement, they are strictly Can be held in place. Further, in this joining method, since the laser light absorbing materials 3 and 7 are uniformly embedded in the molten resin over the entire joining region Z, both the resin members 1 and 2 are hardly affected by the intervention of the thin metal wire 3. Weld without welding and without distortion. On the other hand, in the method in which the resin members 1 and 2 are moved by the XY table described above, the gap t disappears in the welded part during joining, whereas the gap t exists in the unwelded part. By doing so, it is inevitable that the resin members 1 and 2 are distorted.

  According to the invention of claim 3, since the laser light absorbing material is a conductor (metal fine wire 3, printed wiring 7) constituting the electric wiring, in the resin joined product that needs to be provided with electric wiring for the purpose, It is not necessary to use a material for bonding, and both the resin members 1 and 2 can be welded and bonded using only the electric wiring, and the electric wiring is fixed by being embedded in the molten resin. No disconnection due to load. Examples of the conductor constituting such an electric wiring include the fine metal wire 3 and the printed wiring 7 defined in the inventions of claims 4 and 5.

  Further, in the method for manufacturing a test well chip according to the invention of claim 6, the thin metal wire 3 interposed as a laser light absorbing material between the opposing surfaces of the upper and lower resin members 1, 2 is removed at the position of the sample well 6, Both ends of the electrode 3a are exposed to the inner peripheral surface of the sample well 6 as opposed electrodes 3a, 3a, but the fine metal wire 3 is fixed by being embedded in a cured resin after melting. The position can be set precisely, the exposed length of the electrode 3a in the sample well 6 is uniform, and the inner periphery of the sample well 6 is not exposed to a foreign material such as a conventional adhesive layer. Since the sample well 6 is formed by three-dimensional removal processing using the pulse laser 8, it is possible to avoid a decrease in the surface accuracy of the resin members 1 and 2 due to pressing as in the conventional cutting processing, and the sample well 6 and the electrode 3a. The shape can be precisely set to nano-order, and no burrs are generated on the electrode 3a. Therefore, the obtained inspection well chip T has very little measurement error and variation, can perform high-accuracy measurement, and has high reliability without fear of adversely affecting the inspection target. It becomes.

  Furthermore, according to the inspection well chip manufacturing method of the seventh aspect of the invention, when the sample well 6 is formed, first, a sample well recess is formed by cutting, and the inner periphery thereof is tertiary by irradiation with a pulsed laser. Since the original removal process is used in a two-stage process, the resin removal efficiency is increased by cutting most of the sample well volume in the first stage cutting process, and then the second stage pulse laser is used for the three-dimensional removal process. Thus, the shape of the sample well 6 and the electrode 3a can be precisely finished to the nano order.

The bonding method of the resin member which concerns on one Embodiment of this invention is shown, (a) is the state before overlapping resin members, (b) is the state which overlaps resin members and irradiates a metal beam with a laser beam , (C) is a heat generation state of the fine metal wire, (d) is a melting state of the peripheral portion of the fine metal wire, and (e) is a longitudinal front view of the state after welding joining. It is a top view which shows the laser beam irradiation length and joining area | region with respect to the metal fine wire in the joining method. It is a schematic diagram which illustrates the irradiation method of the laser beam in the joining method. 1A and 1B show a bonding apparatus for inspection well chips according to the bonding method of the present invention, wherein FIG. 1A is a schematic side view of the whole, FIG. 2B is a plan view of a chip fixing jig, and FIG. It is a vertical side view. The sample well forming operation in the inspection well chip is shown, (a) is a plan view after joining the upper and lower resin members, (b) is a cross-sectional view taken along line XX in (a), (c). Is a longitudinal side view in the process of forming a sample well by a pulse laser, (d) is a plan view of the well chip after the formation of the sample well, and (e) is a longitudinal side view showing an enlarged vicinity of the electrode of the sample well after the formation. is there. The joining method of the resin member which concerns on other embodiment of this invention is shown, (a) is the state before stacking resin members, (b) is a longitudinal front view of the state after welding joining of resin members, respectively. is there. The pattern of the joining area | region in the joining method of this invention is illustrated, (a) is a corrugated pattern, (b) is a parallel pattern, (c) is the rectangular annular pattern, The resin member which has arrange | positioned the metal fine wire which each sets a joining area | region FIG. 1 shows a conventional well chip for inspection, (a) is a plan view, (b) is a cross-sectional view taken along line Y-Y in (a), and (c) is a sample well in an imaginary line circle C in (b). It is an enlarged view shown in the state which accommodated the fertilized egg and the test solution. The electrode well vicinity of the sample well in the conventional inspection well chip | tip is expanded and shown, (a) is a vertical side view, (b) is arrow sectional drawing in the ZZ line of (a).

  Hereinafter, an embodiment of a method for joining resin members according to the present invention will be specifically described with reference to the drawings. In addition, about the component which is common in each embodiment, the same code | symbol is attached | subjected even if there is a difference in form or size.

  The method of joining the resin members shown in FIGS. 1 to 3 is shown by oblique lines in FIG. 2 between the upper and lower resin members 1 and 2 made of a highly transparent and laser-light-transmitting hard resin molding such as PMMA (polymethyl methacrylate). As a laser light absorbing material for setting a belt-like joining region Z indicated by a portion, both the resin members 1 and 2 are welded and joined with a linear thin metal wire 3 interposed.

  First, as shown in FIG. 1 (a), in a state where the thin metal wires 3 are linearly arranged at predetermined positions on the lower resin member 2, the upper resin member is shown on the lower resin member 2 as shown in the phantom line. 1 is overlapped. Then, as shown in FIG. 5B, the laser beam 4 is irradiated onto the fine metal wire 3 through the upper resin member 1 from above. At this time, the laser beam 4 corresponds to the joining region Z of the fine metal wire 3 shown in FIG. 2 by high-speed reciprocating scanning of the continuous wave light emitted from the laser oscillator 20 via the galvano scanner 21 as shown in FIG. Irradiate substantially uniformly over the entire length L. As a result, the length L of the fine metal wire 3 generates heat approximately uniformly with light absorption, and the heat is dissipated to the surroundings as indicated by the radial arrows in FIG. The members 1 and 2 are heated from the contact portion with the fine metal wires 3 to reach the melting temperature and melt. Of course, the intensity and scanning time of the laser beam 4 to be irradiated are adjusted so that the resin of the resin members 1 and 2 is not carbonized by rapid heating.

  Since the fine metal wire 3 is embedded in the molten resin with the melting, a gap corresponding to the thickness of the fine metal wire 3 existing between the two resin members 1 and 2 shown in FIG. As shown in FIG. 1 (d), the upper and lower resin members 1 and 2 are integrally welded together in the molten region Z, and both the resin members 1 and 2 excluding the molten region Z are finally sealed. As shown in FIG. 1E, both resin members 1 and 2 are welded around the metal thin wire 3 and are completely joined together. In addition, since the temperature rises due to heat transfer at both end sides exceeding the length L of the thin metal wire 3, the joining region Z is extended and formed in the form gradually narrowing as shown in FIG.

  As shown in FIG. 3, the galvano scanner 21 generally includes a pair of galvanometer mirrors M1 and M2 that are reversibly rotated by motors (rotary encoders) and an imaging lens F that is advanced and retracted in the optical axis direction. By controlling the rotation of both galvanometer mirrors M1 and M2 and the movement of the imaging lens F via the control device 22, the laser beam 4 is scanned at high speed over the entire irradiation area of various patterns based on the input program. it can.

  According to this joining method, the melting of the resin proceeds uniformly from the vicinity of the fine metal wires 3 over the whole joining region Z, and accordingly, the fine metal wires 3 are exposed to the entire irradiated portion of the laser beam 4 (the total length of the length L). The resin members 1 and 2 are hardly affected by the intervention of the thin metal wires 3 and are welded in a strain-free state. On the other hand, in the method of irradiating the laser beam 4 to a fixed position while moving the resin members 1 and 2 side with an XY table or the like, a welding time difference occurs from the start side to the end side of the bonding region. In FIG. 2, the gap t corresponding to the thickness of the thin metal wire 3 disappears in the welded portion, whereas the gap t exists in the unwelded portion. Large distortion will occur.

  In addition, in this joining method, there is no need to interpose a light absorbing film between the resin members 1 and 2, or to apply a light absorbent on the surface, or to roughen the surface. The joining operation can be performed in a short time without cost and labor. And even if the obtained resin joint is to provide a measurement part where the joint interface of both resin members 1 and 2 appears for the purpose, the joint interface does not expose a foreign material that adversely affects measurement, There is no concern of causing measurement errors due to the foreign material. In addition, since the fine metal wire 3 is fixed in the cured resin after melting and can be held in a strictly fixed position, even when the fine metal wire 3 is functionally required for positional accuracy, it can be handled without any problem. it can.

  FIG. 4 shows a bonding apparatus for testing well chips according to the bonding method of the present invention. In this bonding apparatus, as shown in FIG. 6A, a galvano scanner 21 connected to a high-convergent laser oscillator 20 is connected above a processing table 23, and a chip fixing jig is positioned immediately below the scanner. 30 is arranged on the processing table 23, and the continuous oscillation laser beam 4 emitted from the laser oscillator 20 is applied to the galvano scanner 21 with respect to the inspection well chip T before bonding fixed to the chip fixing jig 30. And is configured to irradiate at high speed scanning based on a machining program input to the control device 22.

  Then, as shown in FIGS. 2B and 2C, the chip fixing jig 30 sequentially holds a chip holding frame 32, a quartz glass block 33, and a pressing plate each having a square shape on a plan view on a thick plate-like resin base 31. While the frames 34 are stacked, four bolts 35 protruding from the resin pedestal 31 pass through the four corners of the chip holding frame 32 and the holding frame 34, and inspection of a bonding target in the central square hole 32 a of the chip holding frame 32. In a state where the well chip T is fitted, a nut 36 is screwed to each bolt 35 via a plain washer 37 and a spring washer 38, so that the well chip T is pressed and fixed by the quartz glass block 33. It has become. The peripheral edge of the quartz glass block 33 is pressed by a square annular holding frame 34, but the inner side of the quartz glass block 33 is exposed upward to transmit the laser beam 4. Further, since the pressing force applied to the well chip T may be carried by the elastic force of the spring washer 38, it is not necessary to tighten the nut 36 screwed to each bolt 35.

  The inspection well chip T to be bonded has the same form as a conventional inspection well chip, and as shown in FIGS. 5A and 5B, a square plate-like upper resin made of a transparent resin such as PMMA. The member 1 and the substantially cubic lower resin member 2 are joined together with a thin metal wire 3 made of platinum or the like for electrode formation interposed between the opposing surfaces, and the upper resin is obtained by post-processing after the joining. An inverted conical sample well 6 opening at the center of the upper surface of the member 1 is formed. Note that both ends of the thin metal wire 3 are respectively connected to electrode plates 5 arranged in the recessed portions 2a in the vertical direction provided on opposite side surfaces of the lower resin member 2.

  The upper and lower resin members 1 and 2 of the well chip T for inspection are bonded in accordance with the bonding method of the present invention described above using the metal thin wire 3 as a laser light absorber and the laser beam 4 through the galvano scanner 21 over its entire length. The upper and lower resin members 1 and 2 are joined in the joining region along the thin metal wire 3 by irradiating substantially uniformly by high-speed reciprocating scanning via the light source and generating heat by absorbing the light to melt the surrounding resin. May be welded together.

  As shown in FIG. 5C, the inspection well chip T joined with the upper and lower resin members 1 and 2 is subjected to three-dimensional removal processing by the pulse laser 8 to form the sample well 6. In this removal processing, the resin is removed in a form of continuously reducing the diameter by irradiating the pulse laser 8 from the upper surface side of the upper resin member 1 at the wiring position of the fine metal wires 3 to evaporate the resin. An inverted conical sample well 6 reaching the lower resin member 2 is formed. Then, along with the formation of the sample well 6, the portion of the fine metal wire 3 that crosses the sample well 6 in the diametrical direction is removed, and as shown in FIGS. A finished product of the inspection well chip T exposed on the inner peripheral surface of the sample well 6 as the electrodes 3a, 3a is obtained.

  According to such a manufacturing method of a well chip for inspection, the fine metal wires 3 interposed between the opposing surfaces of the upper and lower resin members 1 and 2 are in a state of being embedded and fixed in the cured resin after melting. The electrode 3a formed as the removal end portion of the fine metal wire 3 along with the formation of the sample well 6 can be precisely positioned, and the exposed length of the electrode 3a in the sample well 6 is also uniform, and the sample well 6 There is no exposure of extraneous material like the conventional adhesive layer on the inner circumference. Since the sample well 6 is formed by three-dimensional removal processing using the pulse laser 8, it is possible to avoid a decrease in the surface accuracy of the resin members 1 and 2 due to pressing as in the conventional cutting processing, and the sample well 6 and the electrode 3a. The shape can be precisely set to nano-order, and no burrs are generated on the electrode 3a. Therefore, the obtained inspection well chip T has very little measurement error and variation, can perform high-accuracy measurement, and has high reliability without fear of adversely affecting the inspection target. It becomes.

  Further, in the above-described method of manufacturing the inspection well chip, the sample well 6 is formed only by the three-dimensional removal processing by the pulse laser 8, but when forming the sample well 6, first, the concave portion for the sample well is formed by cutting. Then, the inner peripheral portion may be finished by three-dimensional removal processing by pulse laser irradiation. In this case, by cutting a large part of the sample well volume in the first stage cutting, the resin removal efficiency is greatly enhanced as compared with the case where the sample well 6 is formed only by the three-dimensional removal processing by the pulse laser 8. The shape of the sample well 6 and the electrode 3a can be precisely finished to the nano order by three-dimensional removal processing by the second-stage pulse laser.

  The size and form of the upper and lower resin members 1 and 2 of the inspection well chip T may be set as appropriate according to the inspection item to be applied. As the resin material, various laser light transmissive thermoplastic resins can be adopted, but those having high transparency like PMMA are preferable. The sample well 6 may have a volume size of about several μL to several mL, and is not limited to the inverted conical shape as illustrated, but may be appropriately selected according to the type of sample to be inspected, such as a cylindrical shape or a hemispherical shape. Can be set. On the other hand, the fine metal wire 3 is not limited to platinum, and can be selected and used as appropriate from various metal materials used for working electrodes in the electrochemical field, including gold, silver, copper, nickel and the like. The thickness can also be selected in the range of 2 to 500 μm depending on the chip size and the inspection item.

  In the inspection well chip T described above, the metal thin wire 3 serving as an electric wiring is used as a laser light absorbing material. However, in the resin member bonding method of the present invention, the same applies to various other conductors constituting the electric wiring. It can be used as a laser light absorber. For example, as shown in FIG. 6A, the upper resin member 1 is superimposed on the lower resin member 2 provided with the printed wiring 7 on the upper surface as shown by the phantom line, and in this state, as described above, If the entire printed wiring 7 is irradiated with a laser beam from the upper side through the galvano scanner at high speed, the printed wiring 7 generates heat by light absorption, and the resin around the printed wiring 7 is melted by the heat. Therefore, both the resin members 1 and 2 are welded and joined in the melting region, and the printed wiring 7 is completely embedded as shown in FIG. Become.

  In the method for joining resin members of the present invention, if a conductor constituting the electrical wiring such as the metal thin wire 3 or the printed wiring 7 is used as a laser light absorbing material, it is necessary to provide an electrical wiring for a purpose. There is no need to use a separate material for joining in the joint, both resin members 1 and 2 can be welded and joined using only the electrical wiring, and the electrical wiring is embedded and fixed in the molten resin. Therefore, there is an advantage that disconnection due to mechanical load does not occur.

  On the other hand, when obtaining a resin joined product having no electrical wiring by the joining method of the present invention, various materials and forms can be adopted as the laser light absorbing material, and the melting region Z set by the laser light absorbing material can also be used. Various patterns can be selected according to the required bonding strength and application of the resin bonded material. In particular, if a linear object such as a thin metal wire 3 or a band-like object is used as the laser light absorber, the molten region Z can be formed into a corrugated pattern such as that shown in FIG. Various patterns such as a parallel pattern as shown in (b) and a rectangular annular pattern as shown in (c) can be easily set. According to the galvano scanner, whether the fusion zone Z is a discontinuous pattern as shown in FIG. 7B or a complex surface pattern, the laser beam is applied to the corresponding laser light absorber. By high-speed scanning, the entire pattern can be melted by raising the temperature almost simultaneously.

  Furthermore, the joining method of the present invention can be applied to the case where one or both of the resin members to be joined are non-rigid molded products such as sheets, and also when three or more resin members are joined together. Applicable.

Example 1
A copper wire having a diameter of 100 μm is linearly arranged along the center of the upper surface of a lower resin member (length and width: 50 mm, thickness: 5 mm) made of a rigid molded product of PMMA (trade name Sumipec E manufactured by Sumitomo Chemical Co., Ltd.) An upper resin member (50 mm in length and width, 5 mm in thickness) made of the same rigid molded product is overlaid on top, and a continuous oscillation laser beam (irradiation diameter: 2 mm, output: 400 W) emitted from a disk laser oscillator (manufactured by Trumpf). Irradiated through a galvano scanner (made by Arges) through the upper resin member at a high-speed scanning with a spot moving speed of 0.4 m / sec over a total length of 50 mm of the copper wire, When the laser beam irradiation is stopped, the resin around the copper wire is melted to a plane width of about 5 mm, and the upper and lower resin members are He was wearing junction. The resulting resin bonded product has the entire copper wire embedded in the resin and is completely bonded with both resin members forming a close interface even on the opposing surface other than the molten part, and has a high surface without distortion. Had accuracy.

Example 2
As a constituent material of the inspection well chip, a cubic resin-like lower resin member (side 8 mm) made of a hard molded product of PMMA (supra) and a square thick plate-like upper resin member made of a similar hard molded material ( 4 (b) in a state where a platinum wire having a diameter of about 10 μm is disposed along the center of the upper surface of the lower resin member and the upper resin member is overlaid thereon. As shown in (c), the same spot as in Example 1 is fixed to the chip fixing jig 30 via the disk laser oscillator and galvano scanner as in Example 1 by the bonding apparatus shown in FIG. A continuous oscillation laser beam with a diameter and output was irradiated through the upper resin member at a high-speed scanning with a spot moving speed of 0.4 m / sec over the entire length of 8 mm of the platinum wire, and the temperature of the platinum wire reached the melting temperature of PMMA. By stopping the irradiation of the laser beam at the point, and fusion bonded to the upper and lower resin members by melting the resin around the platinum wire to about 5mm in plan width. The obtained resin bonded product is completely bonded with the entire platinum wire embedded in the resin, and the two resin members are completely bonded in a state where a close interface is formed even on the opposite surface other than the melted part, and there is no distortion and a high surface. Had accuracy.

  Next, an inverted conical concave portion for a sample well having a diameter of 1.9 mm and a depth of 1.9 mm centered on the platinum wire arrangement portion is formed in the central portion of the upper surface of the joined upper resin member 1 by cutting. Then, the inner peripheral surface of the recess for the sample well is irradiated with a pulse laser beam emitted from an ultrashort pulse laser oscillator through a galvano scanner (described above) to perform three-dimensional removal processing, thereby opening the sample well. An inverted conical sample well with an aperture of 2.0 mm and a depth of 2.0 mm was exposed on the inner peripheral surface as electrodes facing both ends of the platinum wire removal, and a test well chip was produced.

1 Upper resin member 2 Lower resin member 3 Metal wire (laser light absorbing material)
3a electrode 4 laser beam 6 sample well 7 printed wiring (laser light absorber)
10 Intimate interface 20 Laser oscillator 21 Galvano scanner T Well chip T for inspection
Z junction area

Claims (7)

  Laser beam-transmitting thermoplastic resin members are overlapped with each other with a laser light absorbing material that sets the required pattern joining area between the opposing surfaces, and the laser beam is galvano-scanned through one of the resin members. By irradiating the entire area corresponding to the bonding region of the laser light absorbing material substantially uniformly by high-speed scanning according to the above, and by melting the resin in the surrounding area by heat generation of the laser light absorbing material, both resin members are A method for joining resin members, characterized by welding in a pattern.   Both the resin members are made of a hard resin molded product, and the laser light absorbing material has a higher melting point than both resin members, and the solid laser light absorbing material is melted around the laser beam irradiation. 2. The gap according to claim 1, wherein the gap corresponding to the thickness of the laser light absorbing material existing between the opposing surfaces of both resin members before laser beam irradiation disappears by being embedded in the resin. Resin member joining method.   The method for joining resin members according to claim 2, wherein the laser light absorbing material is a conductor constituting electric wiring.   The resin member joining method according to claim 3, wherein the conductor is a thin metal wire.   The resin member joining method according to claim 3, wherein the conductor is a printed wiring provided on one surface of the both resin members.   The two resin members are upper and lower resin members constituting a well chip for inspection, and a pulse laser is irradiated from the upper surface side of the upper resin member after bonding by the bonding method according to claim 4 to the wiring position of the metal thin wire. By performing three-dimensional removal processing, a sample well exposed as an electrode facing both ends of the thin metal wire is formed on the inner peripheral surface at a depth reaching the lower resin member. Well chip manufacturing method.   The both resin members are upper and lower resin members constituting a well chip for inspection, and are cut from the upper surface side of the upper resin member after bonding by the bonding method according to claim 4 to the wiring position of the metal thin wire by cutting. After forming the recess for the sample well with a depth reaching the resin member, the inner peripheral surface of the recess for the sample well is finished by three-dimensional removal processing by pulse laser irradiation to remove the fine metal wires on the inner peripheral surface. A method for producing a well chip for inspection, comprising forming a sample well exposed as an electrode having opposite ends.

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