JP2015160334A - Method of joining resin member and method of manufacturing well chip for inspection - Google Patents
Method of joining resin member and method of manufacturing well chip for inspection Download PDFInfo
- Publication number
- JP2015160334A JP2015160334A JP2014035518A JP2014035518A JP2015160334A JP 2015160334 A JP2015160334 A JP 2015160334A JP 2014035518 A JP2014035518 A JP 2014035518A JP 2014035518 A JP2014035518 A JP 2014035518A JP 2015160334 A JP2015160334 A JP 2015160334A
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- JP
- Japan
- Prior art keywords
- resin
- resin members
- members
- joining
- laser light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
- B29C66/739—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset
- B29C66/7392—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoplastic
- B29C66/73921—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoplastic characterised by the materials of both parts being thermoplastics
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/16—Laser beams
- B29C65/1629—Laser beams characterised by the way of heating the interface
- B29C65/1635—Laser beams characterised by the way of heating the interface at least passing through one of the parts to be joined, i.e. laser transmission welding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/16—Laser beams
- B29C65/1629—Laser beams characterised by the way of heating the interface
- B29C65/1654—Laser beams characterised by the way of heating the interface scanning at least one of the parts to be joined
- B29C65/1661—Laser beams characterised by the way of heating the interface scanning at least one of the parts to be joined scanning repeatedly, e.g. quasi-simultaneous laser welding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/16—Laser beams
- B29C65/1677—Laser beams making use of an absorber or impact modifier
- B29C65/168—Laser beams making use of an absorber or impact modifier placed at the interface
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/05—Particular design of joint configurations
- B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
- B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
- B29C66/112—Single lapped joints
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/05—Particular design of joint configurations
- B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
- B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
- B29C66/112—Single lapped joints
- B29C66/1122—Single lap to lap joints, i.e. overlap joints
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/05—Particular design of joint configurations
- B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
- B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
- B29C66/114—Single butt joints
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/05—Particular design of joint configurations
- B29C66/20—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines
- B29C66/23—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines said joint lines being multiple and parallel or being in the form of tessellations
- B29C66/232—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines said joint lines being multiple and parallel or being in the form of tessellations said joint lines being multiple and parallel, i.e. the joint being formed by several parallel joint lines
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/05—Particular design of joint configurations
- B29C66/20—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines
- B29C66/24—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines said joint lines being closed or non-straight
- B29C66/242—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines said joint lines being closed or non-straight said joint lines being closed, i.e. forming closed contours
- B29C66/2424—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines said joint lines being closed or non-straight said joint lines being closed, i.e. forming closed contours being a closed polygonal chain
- B29C66/24243—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines said joint lines being closed or non-straight said joint lines being closed, i.e. forming closed contours being a closed polygonal chain forming a quadrilateral
- B29C66/24244—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines said joint lines being closed or non-straight said joint lines being closed, i.e. forming closed contours being a closed polygonal chain forming a quadrilateral forming a rectangle
- B29C66/24245—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines said joint lines being closed or non-straight said joint lines being closed, i.e. forming closed contours being a closed polygonal chain forming a quadrilateral forming a rectangle forming a square
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/05—Particular design of joint configurations
- B29C66/20—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines
- B29C66/24—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines said joint lines being closed or non-straight
- B29C66/244—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines said joint lines being closed or non-straight said joint lines being non-straight, e.g. forming non-closed contours
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
- B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
- B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
- B29C66/43—Joining a relatively small portion of the surface of said articles
- B29C66/434—Joining substantially flat articles for forming corner connections, fork connections or cross connections
- B29C66/4344—Joining substantially flat articles for forming fork connections, e.g. for making Y-shaped pieces
- B29C66/43441—Joining substantially flat articles for forming fork connections, e.g. for making Y-shaped pieces with two right angles, e.g. for making T-shaped pieces, H-shaped pieces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
- B29C66/733—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the optical properties of the material of the parts to be joined, e.g. fluorescence, phosphorescence
- B29C66/7336—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the optical properties of the material of the parts to be joined, e.g. fluorescence, phosphorescence at least one of the parts to be joined being opaque, transparent or translucent to visible light
- B29C66/73365—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the optical properties of the material of the parts to be joined, e.g. fluorescence, phosphorescence at least one of the parts to be joined being opaque, transparent or translucent to visible light at least one of the parts to be joined being transparent or translucent to visible light
- B29C66/73366—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the optical properties of the material of the parts to be joined, e.g. fluorescence, phosphorescence at least one of the parts to be joined being opaque, transparent or translucent to visible light at least one of the parts to be joined being transparent or translucent to visible light both parts to be joined being transparent or translucent to visible light
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/80—General aspects of machine operations or constructions and parts thereof
- B29C66/81—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps
- B29C66/812—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the composition, by the structure, by the intensive physical properties or by the optical properties of the material constituting the pressing elements, e.g. constituting the welding jaws or clamps
- B29C66/8122—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the composition, by the structure, by the intensive physical properties or by the optical properties of the material constituting the pressing elements, e.g. constituting the welding jaws or clamps characterised by the composition of the material constituting the pressing elements, e.g. constituting the welding jaws or clamps
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/80—General aspects of machine operations or constructions and parts thereof
- B29C66/81—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps
- B29C66/812—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the composition, by the structure, by the intensive physical properties or by the optical properties of the material constituting the pressing elements, e.g. constituting the welding jaws or clamps
- B29C66/8126—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the composition, by the structure, by the intensive physical properties or by the optical properties of the material constituting the pressing elements, e.g. constituting the welding jaws or clamps characterised by the intensive physical properties or by the optical properties of the material constituting the pressing elements, e.g. constituting the welding jaws or clamps
- B29C66/81266—Optical properties, e.g. transparency, reflectivity
- B29C66/81267—Transparent to electromagnetic radiation, e.g. to visible light
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/80—General aspects of machine operations or constructions and parts thereof
- B29C66/83—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
- B29C66/832—Reciprocating joining or pressing tools
- B29C66/8322—Joining or pressing tools reciprocating along one axis
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/34—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement"
- B29C65/3404—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" characterised by the type of heated elements which remain in the joint
- B29C65/342—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" characterised by the type of heated elements which remain in the joint comprising at least a single wire, e.g. in the form of a winding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/34—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement"
- B29C65/3404—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" characterised by the type of heated elements which remain in the joint
- B29C65/342—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" characterised by the type of heated elements which remain in the joint comprising at least a single wire, e.g. in the form of a winding
- B29C65/3428—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" characterised by the type of heated elements which remain in the joint comprising at least a single wire, e.g. in the form of a winding said at least a single wire having a waveform, e.g. a sinusoidal form
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/34—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement"
- B29C65/3404—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" characterised by the type of heated elements which remain in the joint
- B29C65/342—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" characterised by the type of heated elements which remain in the joint comprising at least a single wire, e.g. in the form of a winding
- B29C65/3432—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" characterised by the type of heated elements which remain in the joint comprising at least a single wire, e.g. in the form of a winding comprising several wires, e.g. in the form of several independent windings
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/34—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement"
- B29C65/3472—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" characterised by the composition of the heated elements which remain in the joint
- B29C65/3476—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" characterised by the composition of the heated elements which remain in the joint being metallic
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
- B29C66/731—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the intensive physical properties of the material of the parts to be joined
- B29C66/7316—Surface properties
- B29C66/73161—Roughness or rugosity
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electromagnetism (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
Description
本発明は、レーザー光透過性を有する樹脂部材の接合方法と、この接合方法を利用した検査用ウェルチップの製造方法に関する。 The present invention relates to a method for bonding a resin member having laser light transparency and a method for manufacturing a well chip for inspection using this bonding method.
哺乳動物胚の診断や各種物質の電気化学的計測等に使用される検査用ウェルチップとして、図8(a)〜(c)に示すように、共にPMMA(ポリメチルメタクリレート)の如き透明樹脂からなる四角板状の上側樹脂部材11と略立方体形の下側樹脂部材12とが接着剤層13を介して接合され、上側樹脂部材11の上面中央部に開口して下側樹脂部材12の上部に達する深さの逆円錐形の試料ウェル14を備えると共に、該試料ウェル14の内周面の径方向両側位置に、両樹脂部材11,12の対向面間に介在させた白金等よりなる直径10μm程度の金属細線15の一端部が電極15aとして露呈し、各金属細線15の他端側が下側樹脂部材12の対向する両側面に設けた上下方向の凹陥部12aに配置する電極板16に接続した構造のものが知られる(特許文献1)。
As test well chips used for diagnosis of mammalian embryos and electrochemical measurement of various substances, as shown in FIGS. 8A to 8C, both are made of transparent resin such as PMMA (polymethyl methacrylate). A rectangular plate-like
このような検査用ウェルチップを用いて例えば哺乳動物受精卵の診断を行う場合、図8(c)に示すように、まず試料ウェル14内に検査溶液Sを収容し、電極15aの電極電位を参照電極(一般に銀/塩化銀)に対して定電位(一般に−0.6V)に制御した上で、酸素還元電流(バルク電流)を測定し、次いで試料ウェル14内に受精卵Eを入れて酸素還元電流(試料電流)を測定し、このバルク電流と試料電流の測定値の差から受精卵Eの呼吸量(酸素消費量)を算出して健康度を診断評価する。 When a mammalian fertilized egg is diagnosed using such a test well chip, for example, as shown in FIG. 8C, first, the test solution S is accommodated in the sample well 14, and the electrode potential of the electrode 15a is set. The oxygen reduction current (bulk current) is measured after controlling to a constant potential (generally −0.6 V) with respect to the reference electrode (generally silver / silver chloride), and then the fertilized egg E is placed in the sample well 14. The oxygen reduction current (sample current) is measured, the respiration rate (oxygen consumption) of the fertilized egg E is calculated from the difference between the measured values of the bulk current and the sample current, and the health degree is diagnosed and evaluated.
ところが、上記従来の検査用ウェルチップでは、図9(a)(b)に示すように、金属細線15は、下側樹脂部材12の上面に設けた溝12b内で接着剤層13に包まれて配置し、該接着剤層13を介して弾性的に支持された状態にあるため、電極15aの位置を厳密に設定できない上、試料ウェル14内での露出長さも不均一になり、もって測定値の誤差が大きくなるという問題があった。また、試料ウェル14の周面に接着剤層13が露呈しているから、接着剤成分の溶出や化学作用等によって検査対象への悪影響や検査結果の信頼性低下を生じる懸念もあった。更に、試料ウェル14は切削工具を用いた研削加工にて形成していることから、加工時の押圧力による樹脂部材11,12の面精度や試料ウェル14の内周面及び電極15aの形状精度が低下すると共に、電極15aの研削面にバリが発生し易く、これらによって測定値のバラツキを生じ易いという難点もあった。従って、このような検査用ウェルチップでは、上下の樹脂部材11,12を接着剤を用いずに接合することが望ましい。
However, in the above-described conventional well chip for inspection, as shown in FIGS. 9A and 9B, the
従来、透明な樹脂部材同士を接着剤を用いずに接合する手段として、両樹脂部材間に光吸収性の薄い透明フィルムを介在させ、一方の樹脂部材側からレーザー光を照射して該フィルムを溶融させて両樹脂部材を溶着させる方法(特許文献2)、基台の光学鏡面をなす表面上に一方の樹脂部材を載置し、この樹脂部材の光吸収剤を塗付した上面に他方の樹脂部材を重ね、上方からレーザー光を照射することにより、光吸収剤塗付層の光吸収による発熱で両樹脂部材を溶着させる方法(特許文献3)、一方の樹脂部材の表面に吸収性波長の第一のレーザー光を照射して粗面領域を形成し、この粗面領域を有する該樹脂部材の表面に他方の樹脂部材を重ね合わせ、外側から透過性波長の第二のレーザー光を照射することにより、粗面領域での光散乱による発熱で両樹脂部材を溶着させる方法(特許文献4)等が知られている。 Conventionally, as a means for joining transparent resin members without using an adhesive, a thin light-absorbing transparent film is interposed between both resin members, and the film is irradiated with laser light from one resin member side. A method of melting and welding both resin members (Patent Document 2), placing one resin member on the surface of the optical mirror surface of the base, and applying the light absorber of the resin member to the other surface A method in which both resin members are welded with heat generated by light absorption of the light absorber coating layer by overlapping the resin members and irradiating the laser beam from above (Patent Document 3), the absorption wavelength on the surface of one resin member The first laser beam is irradiated to form a rough surface region, the other resin member is overlaid on the surface of the resin member having the rough surface region, and the second laser beam having a transmission wavelength is irradiated from the outside. Light scattering in the rough surface area How the two resin members is welded heating by (Patent Document 4), and the like are known.
しかしながら、検査用ウェルチップの上下の樹脂部材の接合に前記特許文献2及び3のようなレーザー光による溶着方法を適用した場合、電極形成用の金属細線が光吸収性フィルムや光吸収剤塗付層と樹脂部材表面との間に挟まれる形になるから、試料ウェルにおける電極の位置及び露出長さを高精度に均一に設定できず、測定値の誤差が大きくなり、また光吸収性フィルムの溶融層や光吸収剤塗付層が試料ウェルの周面に露呈することで、これらに含まれる光吸収剤によって検査対象への悪影響や検査結果の信頼性低下を生じる懸念があり、前記特許文献1のように両樹脂部材を接着剤で接合した場合と同様の問題が発生する。一方、特許文献4のように一方の樹脂部材の表面を粗面化してレーザー光で溶着する方法では、粗面化用と溶着用とで波長の異なるレーザー光による2段階のレーザー加工を行うから、それだけ手間及び時間を要すると共に、波長の違いに対応した異種のレーザー(例えば炭酸ガスレーザーと半導体レーザー)を用いる必要があり、設備コストも高く付くことになる。
However, when the welding method using laser light as described in
本発明者らは、上述の事情に鑑みて、検査用ウェルチップの上下の樹脂部材を既知手段によらずに接合する技術を開発すべく研究を重ねる過程で、電極形成用の金属細線自体がレーザー光に対する吸収性を有することに着目し、該金属細線にレーザー光を照射した際の光吸収に伴う発熱により、周囲の樹脂を溶融させて両樹脂部材を溶着させるという画期的な接合技術を見出すと共に、この接合技術を更に発展させて検査用ウェルチップ以外の広範な用途にも対応する透明樹脂同士の接合方法を確立し、本発明をなすに至った。 In view of the above-described circumstances, the inventors have conducted research to develop a technique for joining the upper and lower resin members of the inspection well chip without using known means. Focusing on its ability to absorb laser light, an innovative bonding technology that melts the surrounding resin and welds both resin members due to the heat generated when the metal thin wire is irradiated with laser light. In addition, the bonding technique has been further developed to establish a method for bonding transparent resins that can be used for a wide range of applications other than the inspection well chip, thereby achieving the present invention.
すなわち、本発明の請求項1に係る樹脂部材の接合方法は、図面の参照符号を付して示せば、レーザー光透過性を有する熱可塑性の樹脂部材1,2同士を、両者の対向面間に所要パターンの接合領域Zを設定するレーザー光吸収材(金属細線3,プリント配線7)を介在させて重ね合わせ、両樹脂部材1,2の一方を通してレーザビーム4をガルバノスキャナー21による高速走査で、該レーザー光吸収材3,7の接合領域Zに対応する全体にわたって略均等に照射し、該レーザー光吸収材3,7の発熱によってその周囲部の樹脂を溶融させることにより、両樹脂部材1,2を所要パターンで溶着することを特徴としている。
That is, the resin member joining method according to the first aspect of the present invention, if indicated by the reference numerals in the drawings, connects the
請求項2の発明は、上記請求項1の樹脂部材の接合方法において、両樹脂部材1,2が硬質の樹脂成形物からなると共に、レーザー光吸収材3,7が両樹脂部材1,2よりも高融点であり、レーザビーム4の照射に伴って固形の該レーザー光吸収材3,7が周囲部の溶融した樹脂中に埋入することにより、レーザビーム4照射前の両樹脂部材1,2の対向面間に存在していたレーザー光吸収材3,7の厚み分の隙間tが消滅するように構成されてなる。
According to a second aspect of the present invention, in the resin member joining method according to the first aspect, the
請求項3の発明は、上記請求項2の樹脂部材の接合方法において、レーザー光吸収材が電気配線を構成する導電体(金属細線3,プリント配線7)である構成としている。
According to a third aspect of the present invention, in the resin member joining method according to the second aspect, the laser light absorbing material is a conductor (a
請求項4の発明は、上記請求項3の樹脂部材の接合方法において、前記導電体が金属細線3である構成としている。
According to a fourth aspect of the present invention, in the method for joining resin members according to the third aspect, the conductor is a
請求項5の発明は、上記請求項3の樹脂部材の接合方法において、前記導電体が両樹脂部材1,2の一方の表面に設けられたプリント配線7である構成としている。
According to a fifth aspect of the present invention, in the resin member joining method according to the third aspect, the conductor is a printed wiring 7 provided on one surface of both the
また、請求項6の発明に係る検査用ウェルチップの製造方法では、両樹脂部材1,2は検査用ウェルチップTを構成する上下の樹脂部材であり、上記請求項4に記載の接合方法による接合後の上側樹脂部材1の上面側から、金属細線3の配線位置にパルスレーザー8を照射して三次元除去加工を行うことにより、下側樹脂部材2内に達する深さで内周面に金属細線3の除去両端部が対向する電極3a,3aとして露呈した試料ウェル6を形成することを特徴としている。
In the method for manufacturing a test well chip according to the sixth aspect of the invention, the two
更に、請求項7の発明に係る検査用ウェルチップの製造方法では、両樹脂部材1,2は検査用ウェルチップを構成する上下の樹脂部材であり、請求項4に記載の接合方法による接合後の上側樹脂部材1の上面側から、金属細線3の配線位置に切削加工によって下側樹脂部材2内に達する深さの試料ウェル用凹部を形成したのち、パルスレーザーの照射による三次元除去加工で該試料ウェル用凹部の内周部を仕上げることにより、内周面に金属細線3の除去両端部が対向する電極3a,3aとして露呈した試料ウェル6を形成することを特徴としている。
Furthermore, in the manufacturing method of the inspection well chip according to the invention of claim 7, both the
以下に、本発明の効果について、図面の参照符号を付して説明する。請求項1の発明によれば、樹脂部材1,2同士を対向面間にレーザー光吸収材(金属細線3,プリント配線7)を介在して重ね合わせた状態で、、所要パターンの接合領域Zを設定する両樹脂部材1,2の一方を通して該レーザー光吸収材3,7にレーザビーム4を照射すれば、該レーザー光吸収材3,7が光吸収によって発熱し、その温度が樹脂部材1,2の融点以上に上がることで、該レーザー光吸収材3,7に接する部分から周囲部の樹脂が溶融してゆき、その溶融部分で両樹脂部材1,2が溶着することになる。そして、この際のレーザビーム4の照射をガルバノスキャナー21による高速走査で行うから、該レーザー光吸収材3,7の接合領域Zに対応する全体を略同時に昇温させ、接合領域Zの全体にわたって樹脂の溶融を均等に進行させ、もって両樹脂部材1,2を歪のない状態で溶着できる。これに対し、XYテーブル等によって樹脂部材1,2側を移動させながら、レーザビーム4を定位置に照射する方式では、接合領域の始端側から終端側への溶融の時間差ひいては溶着の時間差により、接合後の両樹脂部材1,2に歪を生じ易くなる。
The effects of the present invention will be described below with reference numerals in the drawings. According to the first aspect of the present invention, in the state where the
しかして、このような接合方法では、両樹脂部材1,2間に光吸収性フィルムを介在させたり、表面に光吸収剤を塗付したり、更には粗面化を施したりする必要がないから、低コストで手間を要さずに短時間で接合操作できる。また、検査用ウエルチップTの試料ウェル6のように、両樹脂部材1,2の接合界面が現れる計測部を設ける用途でも、その接合界面には計測に悪影響を及ぼす異質材が露呈しないため、該異質材に起因した計測誤差を生じる懸念がない。
Therefore, in such a joining method, it is not necessary to interpose a light-absorbing film between the
請求項2の発明によれば、レーザー光吸収材3,7が硬質の樹脂成形物からなる両樹脂部材1,2に対して高融点であり、レーザビーム4の照射に伴って固形の該レーザー光吸収材3,7が周囲部の溶融した樹脂中に埋入し、レーザビーム4照射前の両樹脂部材1,2の対向面間に存在していたレーザー光吸収材3,7の厚み分の隙間tが消滅する。従って、両樹脂部材1,2は、接合領域Z以外の対向面部でも完全に密接し、レーザー光吸収材3,7の介在による歪が発生しない。また、レーザー光吸収材3,7は溶融後の硬化した樹脂中に固定されるから、該レーザー光吸収材3,7が機能的に配置の位置精度を要求されるものであっても厳密に定位置で保持できる。更に、この接合方法では、接合領域Zの全体にわたってレーザー光吸収材3,7が均等に溶融樹脂中に埋入してゆくから、両樹脂部材1,2は金属細線3の介在による影響を殆ど受けずに歪のない状態で溶着する。これに対し、前述のXYテーブル等で樹脂部材1,2側を移動させる方式では、接合途上において溶着済み部分では上記隙間tが消滅しているのに対し、未溶着部分では該隙間tが存在することで、両樹脂部材1,2に歪を生じることが避けられない。
According to the invention of
請求項3の発明によれば、レーザー光吸収材が電気配線を構成する導電体(金属細線3,プリント配線7)であるから、用途的に電気配線を設ける必要がある樹脂接合物において、別途に接合のための材料を用いる必要がなく、その電気配線のみを利用して両樹脂部材1,2を溶着接合できる上、電気配線が溶融した樹脂中に埋入して固定されるので機械的負荷による断線を生じなくなる。このような電気配線を構成する導電体としては、請求項4,5の発明で規定する金属細線3及びプリント配線7が挙げられる。
According to the invention of
また、請求項6の発明に係る検査用ウェルチップの製造方法では、上下の樹脂部材1,2の対向面間にレーザー光吸収材として介在する金属細線3が試料ウェル6の位置で除去され、その両端部が対向する電極3a,3aとして該試料ウェル6の内周面に露呈するが、該金属細線3は溶融後の硬化した樹脂中に埋入して固定されているため、電極3aの位置を厳密に設定できると共に、試料ウェル6内での該電極3a露出長さも均一になる上、試料ウェル6の内周には従来の接着剤層のような異質材の露出もない。そして、試料ウェル6をパルスレーザー8による三次元除去加工によって形成するから、従来の切削加工のような押圧による樹脂部材1,2の面精度の低下を回避できると共に、試料ウェル6及び電極3aの形状をナノオーダーまで精密に設定でき、また電極3aにバリが発生することもない。従って、得られた検査用ウェルチップTは、測定値の誤差やバラツキが非常に少なく、高精度の測定を行えて、且つ検査対象への悪影響を生じさせる懸念もなく、高い信頼性を備えるものとなる。
Further, in the method for manufacturing a test well chip according to the invention of
更に、請求項7の発明に係る検査用ウェルチップの製造方法によれば、試料ウェル6の形成に際し、まず切削加工で試料ウェル用凹部を形成し、その内周部をパルスレーザーの照射による三次元除去加工で仕上げるという二段階の加工を行うから、一段目の切削加工において試料ウェル容積の大部分を切削することで樹脂除去能率を高め、次いで二段目のパルスレーザーによる三次元除去加工にて試料ウェル6及び電極3aの形状をナノオーダーまで精密に仕上げることができる。 Furthermore, according to the inspection well chip manufacturing method of the seventh aspect of the invention, when the sample well 6 is formed, first, a sample well recess is formed by cutting, and the inner periphery thereof is tertiary by irradiation with a pulsed laser. Since the original removal process is used in a two-stage process, the resin removal efficiency is increased by cutting most of the sample well volume in the first stage cutting process, and then the second stage pulse laser is used for the three-dimensional removal process. Thus, the shape of the sample well 6 and the electrode 3a can be precisely finished to the nano order.
以下に、本発明に係る樹脂部材の接合方法の実施形態について、図面を参照して具体的に説明する。なお、各実施形態で共通する構成要素については、形態やサイズの違いがあっても同じ符号を付している。 Hereinafter, an embodiment of a method for joining resin members according to the present invention will be specifically described with reference to the drawings. In addition, about the component which is common in each embodiment, the same code | symbol is attached | subjected even if there is a difference in form or size.
図1〜図3で示す樹脂部材の接合方法は、PMMA(ポリメチルメタクリレート)等の高透明でレーザー光透過性の硬質樹脂成形物からなる上下の樹脂部材1,2間に、図2の斜線部で示す帯状の接合領域Zを設定するためのレーザー光吸収材として、直線状の金属細線3を介在させて両樹脂部材1,2を溶着接合するものである。
The method of joining the resin members shown in FIGS. 1 to 3 is shown by oblique lines in FIG. 2 between the upper and
まず、図1(a)に示すように、下側樹脂部材2上の所定位置に金属細線3を直線状に配置した状態で、この下側樹脂部材2上に図示仮想線の如く上側樹脂部材1を重ね合わせる。そして、同図(b)に示すように、上方から上側樹脂部材1を通してレーザビーム4を金属細線3に照射する。このとき、該レーザビーム4は、図3に示すようにレーザー発振器20から出射される連続発振光をガルバノスキャナー21を介した高速往復走査により、図2に示す金属細線3の接合領域Zに対応した長さLの全体にわたって略均等に照射する。これにより、該金属細線3の長さL分が光吸収に伴って略均等に発熱し、その熱が図1(c)の放射状の矢印で示す如く周囲へ放熱されることで、上下の樹脂部材1,2が金属細線3との接触部分から昇温して溶融温度に達して溶融してゆく。無論、照射するレーザビーム4は、樹脂部材1,2の樹脂が急加熱で炭化することがないように、そのビーム強度と走査時間を調整する。
First, as shown in FIG. 1 (a), in a state where the
上記の溶融に伴って金属細線3が溶融樹脂中に埋入してゆくため、図1(c)で示す両樹脂部材1,2間に存在していた金属細線3の太さに相当する隙間tが塞がってゆき、最終的に図1(d)に示すように溶融領域Zにおいて上下の両樹脂部材1,2が一体に溶着すると共に、該溶融領域Zを除いた両樹脂部材1,2の対向面間も隙間なく密着して密接界面10を形成し、図1(e)の如く両樹脂部材1,2が金属細線3の周囲部で溶着して完全に接合した状態となる。なお、金属細線3の長さLを越える両端側でも伝熱による昇温があるため、その両端側の周囲にも接合領域Zが図2に示すように次第に狭まる形で延長生成する。
Since the
ガルバノスキャナー21は、図3に示すように、各々モーター(ロータリーエンコーダー)にて可逆回転駆動する一対のガルバノミラーM1,M2と、光軸方向に進退駆動する結像レンズFとを内蔵した一般的なものであり、制御装置22を介して両ガルバノミラーM1,M2の回転と結像レンズFの移動を制御することにより、レーザビーム4を入力プログラムに基づく様々なパターンの照射域全体に高速走査できる。
As shown in FIG. 3, the
この接合方法によれば、接合領域Zの全体にわたって金属細線3の近傍から樹脂の溶融が均等に進行し、これに伴って該金属細線3がレーザビーム4の照射部全体(長さLの全長)で均等に溶融樹脂中に埋入してゆくから、両樹脂部材1,2は金属細線3の介在による影響を殆ど受けずに歪のない状態で溶着する。これに対し、XYテーブル等によって樹脂部材1,2側を移動させながら、レーザビーム4を定位置に照射する方式では、接合領域の始端側から終端側への溶着の時間差を生じるから、接合途上において、溶着済み部分では金属細線3の太さに相当する隙間tが消滅しているのに対し、未溶着部分では該隙間tが存在するから、両樹脂部材1,2とりわけ上側樹脂部材1に大きく歪を生じることになる。
According to this joining method, the melting of the resin proceeds uniformly from the vicinity of the
また、この接合方法では、両樹脂部材1,2間に光吸収性フィルムを介在させたり、表面に光吸収剤を塗付したり、更には粗面化を施したりする必要がないから、低コストで手間を要さずに短時間で接合操作できる。そして、得られる樹脂接合物は、用途的に両樹脂部材1,2の接合界面が現れる計測部を設けるものであっても、その接合界面には計測に悪影響を及ぼす異質材が露呈しないため、該異質材に起因した計測誤差を生じる懸念がない。加えて、金属細線3は溶融後の硬化した樹脂中に固定されて厳密に定位置で保持できるから、該金属細線3が機能的に配置の位置精度を要求される場合にも全く支障なく対応できる。
In addition, in this joining method, there is no need to interpose a light absorbing film between the
図4は、本発明の接合方法による検査用ウェルチップを対象とした接合装置を示す。この接合装置は、同図(a)に示すように、加工テーブル23の上方に、高収束型のレーザー発振器20に光路接続したガルバノスキャナー21が設置され、その直下に位置してチップ固定治具30が加工テーブル23上に配置しており、該チップ固定治具30に固定された接合前の検査用ウェルチップTに対し、レーザー発振器20から出射される連続発振のレーザビーム4をガルバノスキャナー21を介して、制御装置22に入力された加工プログラムに基づいて高速走査で照射するように構成されている。
FIG. 4 shows a bonding apparatus for testing well chips according to the bonding method of the present invention. In this bonding apparatus, as shown in FIG. 6A, a
そして、チップ固定治具30は、同図(b)(c)に示すように、厚板状の樹脂台座31上に順次、各々平面視正方形をなすチップ保持枠32と石英ガラスブロック33と押さえ枠34が積み重なると共に、樹脂台座31から突出した4本のボルト35がチップ保持枠32及び押さえ枠34の四隅部を貫通しており、チップ保持枠32の中央の角穴32aに接合対象の検査用ウェルチップTを嵌め込んだ状態で、各ボルト35に平座金37及びバネ座金38を介してナット36を螺着することにより、石英ガラスブロック33で該ウェルチップTを押さえて固定する構造になっている。なお、石英ガラスブロック33は四角環状の押さえ枠34によって周縁部を押さえられるが、その内側が上方に露呈していることでレーザビーム4を透過させる。また、ウェルチップTに加える押圧力はバネ座金38の弾発力で担わせる程度でよいから、各ボルト35に螺着したナット36を強く緊締する必要はない。
Then, as shown in FIGS. 2B and 2C, the
接合対象の検査用ウェルチップTは、従来の検査用ウェルチップと同様の形態であり、図5(a)(b)に示すように、共にPMMAの如き透明樹脂からなる四角板状の上側樹脂部材1と略立方体形の下側樹脂部材2とを、両者の対向面間に電極形成用の白金等よりなる金属細線3を介在させた状態で接合し、その接合後の後加工によって上側樹脂部材1の上面中央部に開口する逆円錐形の試料ウェル6を形成するようになっている。なお、金属細線3の両端は、下側樹脂部材2の対向する両側面に設けた上下方向の凹陥部2aに配置する電極板5に各々接続している。
The inspection well chip T to be bonded has the same form as a conventional inspection well chip, and as shown in FIGS. 5A and 5B, a square plate-like upper resin made of a transparent resin such as PMMA. The
この検査用ウェルチップTの上下の樹脂部材1,2の接合は、既述した本発明の接合方法に準じ、金属細線3をレーザー光吸収材として、その全長にわたってレーザビーム4をガルバノスキャナー21を介した高速往復走査で略均等に照射し、その光吸収によって該金属細線3を発熱させて周囲部の樹脂を溶融させることにより、該金属細線3に沿う接合領域で上下の樹脂部材1,2を溶着接合すればよい。
The upper and
かくして上下の樹脂部材1,2を接合した検査用ウェルチップTに対し、図5(c)に示すように、試料ウェル6を形成するためにパルスレーザー8による三次元除去加工を施す。この除去加工では、金属細線3の配線位置において上側樹脂部材1の上面側からパルスレーザー8を照射して樹脂を蒸発揮散させてゆくことにより、連続的に縮径する形で樹脂を除去して下側樹脂部材2内に達する逆円錐形の試料ウェル6を形成する。そして、この試料ウェル6の形成に伴い、金属細線3の該試料ウェル6を直径方向に横切る部分が除去され、同図(d)(e)で示すように、その除去した両端部が対向する電極3a,3aとして該試料ウェル6の内周面に露呈した検査用ウェルチップTの完成品が得られる。
As shown in FIG. 5C, the inspection well chip T joined with the upper and
このような検査用ウェルチップの製造方法によれば、上下の樹脂部材1,2の対向面間に介在する金属細線3が溶融後の硬化樹脂中に埋入して固定された状態であるため、試料ウェル6の形成に伴う該金属細線3の除去端部として形成される電極3aを厳密に位置設定できると共に、試料ウェル6内での該電極3a露出長さも均一になる上、試料ウェル6の内周には従来の接着剤層のような異質材の露出がない。そして、試料ウェル6をパルスレーザー8による三次元除去加工によって形成するから、従来の切削加工のような押圧による樹脂部材1,2の面精度の低下を回避できると共に、試料ウェル6及び電極3aの形状をナノオーダーまで精密に設定でき、また電極3aにバリが発生することもない。従って、得られた検査用ウェルチップTは、測定値の誤差やバラツキが非常に少なく、高精度の測定を行えて、且つ検査対象への悪影響を生じさせる懸念もなく、高い信頼性を備えるものとなる。
According to such a manufacturing method of a well chip for inspection, the
また、上述の検査用ウェルチップの製造方法ではパルスレーザー8による三次元除去加工のみで試料ウェル6を形成しているが、該試料ウェル6の形成に際し、まず切削加工で試料ウェル用凹部を形成し、その内周部をパルスレーザーの照射による三次元除去加工で仕上げるようにしてもよい。この場合、一段目の切削加工において試料ウェル容積の大部分を切削することで、パルスレーザー8による三次元除去加工のみで試料ウェル6を形成する場合に比較して樹脂除去能率を大幅に高めると共に、二段目のパルスレーザーによる三次元除去加工にて試料ウェル6及び電極3aの形状をナノオーダーまで精密に仕上げることができる。
Further, in the above-described method of manufacturing the inspection well chip, the sample well 6 is formed only by the three-dimensional removal processing by the
なお、検査用ウェルチップTの上下の樹脂部材1,2のサイズ及び形態は、適用する検査項目に応じて適宜設定すればよい。その樹脂材料についてもレーザー光透過性の種々の熱可塑性樹脂を採用できるが、PMMAのように透明性の高いものが好ましい。また、試料ウェル6は、数μL〜数mL程度の容積サイズであればよく、例示したような逆円錐形に限らず、円筒形や半球形等、検査対象とする試料の種類に応じて適宜設定できる。一方、金属細線3としては、白金に限らず、金、銀、銅、ニッケル等を始めとして、電気化学分野で作用電極に用いられている種々の金属材料を適宜選択して使用できると共に、その太さもチップサイズ及び検査項目に応じて2〜500μmの範囲で選択できる。
The size and form of the upper and
上記の検査用ウェルチップTでは電気配線となる金属細線3をレーザー光吸収材として利用しているが、本発明の樹脂部材の接合方法では、電気配線を構成する他の種々の導電体も同様のレーザー光吸収材として利用できる。例えば、図6(a)に示すように、上面にプリント配線7を設けた下側樹脂部材2に、上側樹脂部材1を仮想線で示すように重ね合わせ、この状態で既述同様にして、上方からガルバノスキャナーを介してレーザビームをプリント配線7全体に高速走査で略均等に照射すれば、該プリント配線7が光吸収によって発熱し、その熱によって該プリント配線7の周囲部の樹脂が溶融するから、その溶融領域において両樹脂部材1,2を溶着接合し、同図(b)に示すようにプリント配線7が完全に埋入し、溶融領域以外の対向面が密接界面をなす状態となる。
In the inspection well chip T described above, the metal
本発明の樹脂部材の接合方法において、上記の金属細線3やプリント配線7のような電気配線を構成する導電体をレーザー光吸収材として利用すれば、用途的に電気配線を設ける必要がある樹脂接合物において、別途に接合のための材料を用いる必要がなく、その電気配線のみを利用して両樹脂部材1,2を溶着接合できる上、電気配線が溶融した樹脂中に埋入して固定されるので機械的負荷による断線を生じなくなるという利点がある。
In the method for joining resin members of the present invention, if a conductor constituting the electrical wiring such as the metal
一方、本発明の接合方法によって電気配線を有しない樹脂接合物を得る場合、レーザー光吸収材として種々の材質及び形態のものを採用できると共に、該レーザー光吸収材によって設定する溶融領域Zについても要求される接合強度や樹脂接合物の用途に応じて様々なパターンを選択できる。特に、レーザー光吸収材として金属細線3のような線状物や帯状物を使用すれば、その曲げ形態や複数本の配列によって溶融領域Zを、例えば図7(a)の如きコルゲートパターン、同(b)の如き平行パターン、同(c)の如き矩形環状パターン等、種々のパターンに容易に設定できる。なお、ガルバノスキャナーによれば、溶融領域Zが図7(b)の如く非連続パターンであっても、また複雑な面状のパターンであっても、対応するレーザー光吸収材へのレーザビームの高速走査により、パターン全体を略同時に昇温させて溶融することができる。
On the other hand, when obtaining a resin joined product having no electrical wiring by the joining method of the present invention, various materials and forms can be adopted as the laser light absorbing material, and the melting region Z set by the laser light absorbing material can also be used. Various patterns can be selected according to the required bonding strength and application of the resin bonded material. In particular, if a linear object such as a
更に、本発明の接合方法は、接合する樹脂部材の一方又は両方がシート状等の非硬質成形物である場合にも適用可能であり、また3以上の樹脂部材を重ねて接合する場合にも適用できる。 Furthermore, the joining method of the present invention can be applied to the case where one or both of the resin members to be joined are non-rigid molded products such as sheets, and also when three or more resin members are joined together. Applicable.
実施例1
PMMA(住友化学工業社製の商品名スミペックE)の硬質成形物からなる下側樹脂部材(縦横50mm、厚さ5mm)の上面中央に沿って直径100μmの銅線を直線状に配置し、その上に同様の硬質成形物からなる上側樹脂部材(縦横50mm、厚さ5mm)を重ね合わせ、ディスクレーザー発振器(トルンプ社製)から出射される連続発振のレーザビーム(照射径2mm、出力400W)をガルバノスキャナー(Arges社製)を介して、上側樹脂部材を通して銅線の全長50mmにわたってスポット移動速度0.4m/秒の高速走査で照射し、照射部分の該銅線の温度が上記PMMAの溶融温度に達した時点でレーザビームの照射を停止させることにより、銅線の周囲の樹脂を平面幅で5mm程度まで溶融させて上下の樹脂部材を溶着接合した。得られた樹脂接合物は、銅線全体が樹脂中に埋入すると共に、両樹脂部材が溶融部以外の対向面でも密接界面を形成する状態で完全に接合しており、歪がなく高い表面精度を有していた。
Example 1
A copper wire having a diameter of 100 μm is linearly arranged along the center of the upper surface of a lower resin member (length and width: 50 mm, thickness: 5 mm) made of a rigid molded product of PMMA (trade name Sumipec E manufactured by Sumitomo Chemical Co., Ltd.) An upper resin member (50 mm in length and width, 5 mm in thickness) made of the same rigid molded product is overlaid on top, and a continuous oscillation laser beam (irradiation diameter: 2 mm, output: 400 W) emitted from a disk laser oscillator (manufactured by Trumpf). Irradiated through a galvano scanner (made by Arges) through the upper resin member at a high-speed scanning with a spot moving speed of 0.4 m / sec over a total length of 50 mm of the copper wire, When the laser beam irradiation is stopped, the resin around the copper wire is melted to a plane width of about 5 mm, and the upper and lower resin members are He was wearing junction. The resulting resin bonded product has the entire copper wire embedded in the resin and is completely bonded with both resin members forming a close interface even on the opposing surface other than the molten part, and has a high surface without distortion. Had accuracy.
実施例2
検査用ウェルチップの構成材として、PMMA(前出)の硬質成形物からなる立方体ブロック状の下側樹脂部材(一辺8mm)と、同様の硬質成形物からなる正方形厚板状の上側樹脂部材(縦横10mm、厚さ1mm)とを用い、下側樹脂部材の上面中央に沿って直径約10μmの白金線を配設し、その上に上側樹脂部材を重ね合わせた状態で、図4(b)(c)で示すようにチップ固定治具30に固定し、同図(a)に示す接合装置により、実施例1と同様のディスクレーザー発振器及びガルバノスキャナーを介して、実施例1と同様のスポット径及び出力の連続発振のレーザビームを、上側樹脂部材を通して白金線の全長8mmにわたってスポット移動速度0.4m/秒の高速走査で照射し、白金線の温度がPMMAの溶融温度に達した時点でレーザビームの照射を停止させることにより、白金線の周囲の樹脂を平面幅で5mm程度まで溶融させて上下の樹脂部材を溶着接合した。得られた樹脂接合物は、白金線全体が樹脂中に埋入すると共に、両樹脂部材が溶融部以外の対向面でも密接界面を形成する状態で完全に接合しており、歪がなく高い表面精度を有していた。
Example 2
As a constituent material of the inspection well chip, a cubic resin-like lower resin member (
次に、この接合後の上側樹脂部材1の上面中央部に、切削加工によって前記白金線の配設部を中心とする直径1.9mm、深さ1.9mmの逆円錐形の試料ウェル用凹部を形成したのち、該試料ウェル用凹部の内周面に超短パルスレーザ発振器から出射されるパルスレーザー光をガルバノスキャナー(前出)を介して照射して三次元除去加工を行うことにより、開口径2.0mm、深さ2.0mmで内周面に白金線の除去両端部が対向する電極として露呈した逆円錐形の試料ウェルを形成し、検査用ウェルチップを作製した。
Next, an inverted conical concave portion for a sample well having a diameter of 1.9 mm and a depth of 1.9 mm centered on the platinum wire arrangement portion is formed in the central portion of the upper surface of the joined
1 上側樹脂部材
2 下側樹脂部材
3 金属細線(レーザー光吸収材)
3a 電極
4 レーザビーム
6 試料ウェル
7 プリント配線(レーザー光吸収材)
10 密接界面
20 レーザー発振器
21 ガルバノスキャナー
T 検査用ウェルチップT
Z 接合領域
1
10
Z junction area
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016117504A1 (en) * | 2015-01-22 | 2016-07-28 | オムロン株式会社 | Method for producing junction structure, and junction structure |
WO2018010919A1 (en) * | 2016-07-12 | 2018-01-18 | Robert Bosch Gmbh | Method for forming a laser-welded connection and composite component |
WO2021139066A1 (en) * | 2020-01-10 | 2021-07-15 | 深圳技术大学 | Laser transmission welding method used for plastic part |
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2014
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016117504A1 (en) * | 2015-01-22 | 2016-07-28 | オムロン株式会社 | Method for producing junction structure, and junction structure |
WO2018010919A1 (en) * | 2016-07-12 | 2018-01-18 | Robert Bosch Gmbh | Method for forming a laser-welded connection and composite component |
CN109476091A (en) * | 2016-07-12 | 2019-03-15 | 罗伯特·博世有限公司 | Form the method and composite component of laser welding connection |
CN109476091B (en) * | 2016-07-12 | 2021-01-08 | 罗伯特·博世有限公司 | Method for producing a laser-welded connection and composite component |
US11351629B2 (en) | 2016-07-12 | 2022-06-07 | Robert Bosch Gmbh | Method for forming a laser-welded connection and composite component |
WO2021139066A1 (en) * | 2020-01-10 | 2021-07-15 | 深圳技术大学 | Laser transmission welding method used for plastic part |
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