JP4772906B2 - Component mounting equipment - Google Patents

Description

  The present invention relates to a component mounting apparatus, and more particularly, to a component mounting apparatus including a plurality of conveyance paths and a plurality of head units.

  Conventionally, a component mounting apparatus including a plurality of conveyance paths and a plurality of head units is known (for example, see Patent Document 1).

  In Patent Document 1, a front lane (first transport path) provided on the front side, a rear lane (second transport path) provided on the rear side, and a front mounting head (first head) provided on the front side are disclosed. Part) and a rear mounting head (second head part) provided on the rear side are disclosed. This component mounting machine is mounted on the front lane board with the front mounting head while transporting the front lane board and the rear lane board in synchronization with each other and mounted on the rear lane board with the rear mounting head ( Asynchronous transfer independent mounting) and asynchronous mode in which the front lane and rear lane boards are alternately mounted on the front lane board and rear lane board while the front lane and rear lane boards are asynchronously transferred to each other. From (asynchronous conveyance alternate lane mounting), the mode (mounting method) with the higher production efficiency is selected.

JP 2009-224664 A

  However, the above-mentioned Patent Document 1 has a disadvantage that only one of the synchronous mode (synchronous transport independent mounting) and the asynchronous mode (asynchronous transport alternate lane mounting) can be selected. Here, in synchronous mode (synchronous transport independent mounting), it is necessary to transport the substrates at the same timing in each lane, so a problem occurs in one lane or mounting head, and processing on one lane side is stagnant. In this case, the processing of the other lane cannot be continued. For this reason, even if either mounting method of synchronous mode (synchronous transport independent mounting) or asynchronous mode (asynchronous transport alternate lane mounting) is selected, if a problem occurs in one transport path or mounting head, the other Since the conveyance path side cannot be mounted, there is a problem that the production efficiency is lowered.

  The present invention has been made to solve the above-described problems, and one object of the present invention is to suppress a decrease in production efficiency when a plurality of conveyance paths are provided. A component mounting apparatus is provided.

Means for Solving the Problems and Effects of the Invention

In order to achieve the above object, a component mounting apparatus according to one aspect of the present invention includes a first transport path capable of transporting a first substrate, a second transport path capable of transporting a second substrate, and a first transport path side. Provided on the first transport path and on the second transport path side, the first head part capable of mounting electronic components on both the first substrate on the first transport path and the second substrate on the second transport path. A second head unit capable of mounting an electronic component on both the first substrate and the second substrate on the second conveyance path; substrate information including information on at least a mounted component of the first substrate and the second substrate; the first substrate and the second substrate; Based on at least one of the time information related to the processing time of the substrate and the facility information related to the mounting equipment, the first head portion and the second substrate are mounted on the first substrate by the first head unit while being asynchronously transferred to each other. And the second head part Asynchronous transfer independent mounting to be mounted on the second substrate, and alternately mounting on the first substrate and the second substrate by both the first head portion and the second head portion while transferring the first substrate and the second substrate asynchronously with each other. Asynchronous transfer alternating lane mounting, and the first substrate and the second substrate are transferred in synchronization with each other, mounted on the first substrate by the first head unit, and mounted on the second substrate by the second head unit, while one head And the synchronous transport on-board mounting that is mounted on the substrate being mounted by the unit in a predetermined case with the other head unit, and the first substrate and the second substrate are asynchronously transferred to each other and mounted on the first substrate by the first head unit. Mounting method for selecting an appropriate mounting method from mounting on the second substrate by the second head portion and mounting on the substrate being mounted by one head portion in a predetermined case by the other head portion. And a selection unit, the mounting method selecting unit, based on the time information, when mounting time is shorter than the non-mounting time is asynchronous transport independent implementation, asynchronous transport alternating lane implementation, the synchronization transport fly implementation and asynchronous conveyance rode Asynchronous transport alternating lane mounting is selected as an appropriate mounting method from the four mounting methods.

In the component mounting apparatus according to one aspect of the present invention, as described above, the first board and the second board are asynchronously conveyed based on at least one of board information, time information, and facility information. However, by providing a mounting method selection unit that selects an appropriate mounting method from the asynchronous transport independent mounting and the non-independent mounting that are mounted on the first substrate by the first head unit and mounted on the second substrate by the second head unit, If asynchronous transport independent mounting is selected based on at least one of board information, time information, and facility information, even if a problem occurs in one transport path or head, mounting on the other transport path side is continued. Therefore, it can suppress that production efficiency falls. Further, based on at least one of the board information, the time information, and the facility information, non-independent mounting can be selected and mounted in a predetermined case such as a case where asynchronous transport independent mounting cannot be performed. In addition, the mounting method selection unit is configured to connect the asynchronous transport independent mounting, the asynchronous transport alternating lane mounting, the first board, and the second board to each other based on at least one of the board information, time information, and facility information. When the first head unit is mounted on the first substrate and the second head unit is mounted on the second substrate while being synchronously transported to the substrate being mounted by one head unit, the other head unit performs a predetermined case. One of the heads is mounted while being mounted on the first substrate and the second substrate by asynchronously transporting the first substrate and the second substrate asynchronously and mounted on the first substrate by the first head unit and mounting on the second substrate by the second head unit. An appropriate mounting method is selected from the asynchronous transfer on-board mounting that is mounted in a predetermined case with the other head unit on the substrate being mounted by the unit. With this configuration, it is possible to suppress the decrease in production efficiency by selecting the asynchronous transport independent mounting, and also in the asynchronous transport alternate lane in a predetermined case such as when the asynchronous transport independent mounting cannot be performed. Mounting can be performed by selecting a mounting method that can further suppress the reduction in production efficiency from the three mounting methods of mounting, synchronous transport mounting, and asynchronous transport mounting. Further, the mounting method selection unit is configured to select the asynchronous transport alternating lane mounting as an appropriate mounting method when the mounting time is shorter than the non-mounting time based on the time information. With this configuration, even when the mounting time is shorter than the non-mounting time and the head stop time is longer, the asynchronous transport alternate lane mounting that can shorten the head stop time is selected to reduce the production efficiency. Can be suppressed.

In the component mounting apparatus according to the above aspect, preferably, the mounting method selection unit preferentially selects asynchronous transport independent mounting as an appropriate mounting method, and at least one of board information, time information, and facility information Based on the information, it is configured to select any one of asynchronous transport alternating lane mounting, synchronous transport onboard mounting, and asynchronous transport onboard mounting as a proper mounting method in a predetermined case. With this configuration, asynchronous transport independent mounting that can suppress a decrease in production efficiency is preferentially selected as an appropriate mounting method, and is based on at least one of board information, time information, and facility information. Thus, non-independent mounting can be selected and mounted only in a predetermined case, such as when asynchronous transport independent mounting cannot be performed.

In the component mounting apparatus according to the above aspect , the mounting method selection unit preferably selects either asynchronous transport independent mounting or asynchronous transport alternate lane mounting as an appropriate mounting method when priority is given to common setup. It is configured. With this configuration, when giving priority to common setups, it is desirable to save the number of feeders that supply parts as much as possible. Therefore, asynchronous transport that can save the number of feeders the most is possible as long as the number of feeders can be saved. Asynchronous lane mounting can be selected, and asynchronous transport independent mounting that can suppress a decrease in production efficiency can be selected under conditions where the number of feeders cannot be saved.

In the component mounting apparatus according to the above aspect , preferably, the mounting method selection unit is configured to perform asynchronous transport alternating lane mounting and synchronization when there is a mounting component common to the first board and the second board based on the board information. Either the carry-on mounting or the asynchronous carry-on mounting is selected as an appropriate mounting method. With this configuration, when there are mounting components common to the first substrate and the second substrate, even when the common mounting components are concentrated on one transport path, the asynchronous mounting that can be mounted on the substrate on the other transport path side is possible. The number of feeders can be saved by selecting the alternate conveyance lane implementation, the synchronous conveyance onboard mounting, or the asynchronous conveyance onboard mounting. Thereby, common setup can be easily realized.

In the component mounting apparatus according to the above aspect , the mounting method selection unit preferably performs either asynchronous transport independent mounting or asynchronous transport alternating lane mounting when the planned production number of the first board and the second board is different. It is configured to be selected as an appropriate mounting method. If comprised in this way, when the production schedule number of a 1st board | substrate and a 2nd board | substrate differs, the direction which selected asynchronous conveyance finally performed the process only in the one conveyance path side, and the other conveyance path side stopped. The production efficiency can be further improved as compared with the synchronous transfer that becomes the state.

In the component mounting apparatus according to the one aspect described above, preferably, a reception unit that receives any one mounting method desired by the user among asynchronous transport independent mounting, asynchronous transport alternate lane mounting, synchronous transport onboard mounting, or asynchronous transport onboard mounting And is configured to be mounted on the first substrate and the second substrate by the mounting method received by the receiving unit. With this configuration, the mounting method selection unit can automatically select an appropriate mounting method, but when the user desires a specific mounting method, the mounting method desired by the user can be mounted. .

  In the component mounting apparatus according to the above aspect, the mounting method selection unit is preferably configured to select a mounting method with the highest production efficiency as an appropriate mounting method. If comprised in this way, the mounting method with the highest production efficiency can be selected from asynchronous conveyance independent mounting and non-independent mounting based on at least one of board information, time information, and facility information. .

It is a schematic plan view which shows the whole structure of the surface mounter by 1st and 2nd embodiment of this invention. It is a block diagram which shows the whole structure of the surface mounter by 1st and 2nd embodiment of this invention. It is a flowchart for demonstrating the optimization process of the surface mounter by 1st and 2nd embodiment of this invention. It is a figure which shows the mounting method selection screen of the surface mounter by 1st and 2nd embodiment of this invention. It is a flowchart for demonstrating the mounting method determination process of 1st Embodiment of this invention in FIG.3 S4. It is a flowchart for demonstrating the process at the time of the production number same number of 1st Embodiment of this invention in FIG.5 S50. It is a flowchart for demonstrating the process at the time of production number odd number of 1st Embodiment of this invention in FIG.5 S51. It is a flowchart for demonstrating the mounting method determination process of 2nd Embodiment of this invention in FIG.3 S4. It is a flowchart for demonstrating the process at the time of the production number same number of 2nd Embodiment of this invention in FIG.8 S50. It is a top view for demonstrating the modification which considers the some board | substrate as one board | substrate, and mounts it in the surface mounting machine by 1st Embodiment of this invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(First embodiment)
With reference to FIG. 1 and FIG. 2, the structure of the surface mounter 100 by 1st Embodiment of this invention is demonstrated. The surface mounter 100 is an example of the “component mounting apparatus” in the present invention.

  As shown in FIG. 1, the surface mounter 100 according to the first embodiment includes a substrate transfer conveyor 1, a first head unit 2, and a second head unit 3. In addition, on the front side (Y2 direction side) and the rear side (Y1 direction side) of the substrate transport conveyor 1, a plurality of tape feeders 4 for supplying electronic components are arranged in the X direction so as to be adjacent to the substrate transport conveyor 1 Has been. In addition, a tray component supply device 5 and a tray storage unit 6 for storing a plurality of trays (not shown) are provided on the rear side (second transfer path 12 side) of the substrate transfer conveyor 1. In addition, a disposal station 7 is provided on the rear side (the second conveyance path 12 side) of the substrate conveyance conveyor 1 so as to be adjacent to the tray component supply device 5 and the tray storage unit 6. For this reason, the number of tape feeders 4 on the rear side (second transport path 12 side) of the substrate transport conveyor 1 is smaller than the number of tape feeders 4 on the front side (first transport path 11 side) of the substrate transport conveyor 1. ing. The first head unit 2 and the second head unit 3 are examples of the “first head unit” and the “second head unit” of the present invention, respectively.

  The substrate transfer conveyor 1 has two first transfer paths 11 and a second transfer path 12 formed so as to extend in the X direction. The first conveyance path 11 and the second conveyance path 12 are arranged so as to be adjacent to each other in the Y direction. The first transport path 11 is disposed on the front side (Y2 direction side) of the second transport path 12. Further, the substrate transfer conveyor 1 transfers the first substrate 110 on the first transfer path 11 and the second substrate 120 on the second transfer path 12 carried in from the upstream process in the X1 direction, and is fixed at a predetermined mounting position. Is configured to do. At this time, the substrate transport conveyor 1 stops the first substrate 110 at a predetermined mounting position by the stopper 11 a provided in the first transport path 11, and the second substrate 120 by the stopper 12 a provided in the second transport path 12. Is stopped at a predetermined mounting position. Moreover, the board | substrate conveyance conveyor 1 is comprised so that the 1st board | substrate 110 and the 2nd board | substrate 120 with which the mounting process was complete | finished may be conveyed in a X1, and carried out to a downstream process. The substrate transfer conveyor 1 is configured to be able to transfer the first substrate 110 on the first transfer path 11 and the second substrate 120 on the second transfer path 12 synchronously or asynchronously. In the first embodiment, the upstream process is a printing process, and the downstream process is a soldering process.

  The first head unit 2 is disposed on the front side (first transport path 11 side) of the substrate transport conveyor 1, and the second head unit 3 is disposed on the rear side (second transport path 12 side) of the substrate transport conveyor 1. Has been placed. The first head unit 2 and the second head unit 3 have the same configuration. The first head unit 2 (second head unit 3) is configured to be movable in the X direction, the Y direction, and the vertical direction. The first head unit 2 (second head unit 3) is provided with ten suction nozzles 21 (31) for sucking parts. Further, the first head unit 2 sucks the components supplied by the tape feeder 4 arranged on the front side (first transport path 11 side) of the substrate transport conveyor 1, and the first substrate 110 and the second substrate at the mounting position. A component can be mounted (mounted) on the substrate 120. Further, the second head unit 3 sucks the components supplied by the tape feeder 4 and the components supplied by the tray component supply device 5 arranged on the rear side (second conveyance path 12 side) of the substrate conveyance conveyor 1. Thus, components can be mounted (mounted) on the first substrate 110 and the second substrate 120 at the mounting positions. The components are small electronic components such as ICs, transistors, capacitors, and resistors.

  Specifically, the first head unit 2 (second head unit 3) can be mounted by four mounting methods: asynchronous transport independent mounting, asynchronous transport alternating lane mounting, synchronous transport onboard mounting, and asynchronous transport onboard mounting. It is configured. Asynchronous transfer independent mounting means that the first head unit 2 is mounted on the first substrate 110 on the first transfer path 11 when the first substrate 110 and the second substrate 120 are transferred asynchronously with each other, and the second This is a mounting method in which the head unit 3 is mounted on the second substrate 120 on the second transport path 12. In this case, the first head unit 2 and the second head unit 3 are not mounted on the substrates on the opposite conveyance path. For this reason, even when a problem occurs in one of the conveyance paths and the head unit, it is not necessary to stop the mounting on the other conveyance path side.

  In addition, the asynchronous transport alternate lane mounting means that both the first head unit 2 and the second head unit 3 are on the first transport path 11 when the first substrate 110 and the second substrate 120 are transported asynchronously. In this mounting method, the first substrate 110 and the second substrate 120 on the second transport path 12 are alternately mounted. That is, after both head units are mounted on the first substrate 110 on the first transport path 11, both head units are mounted on the second substrate 120 on the second transport path 12.

  In addition, the synchronous transport mounting is the first transport path 11 (second head unit 3) in the first head unit 2 (second head unit 3) when the first substrate 110 and the second substrate 120 are transported in synchronization with each other. 2 is a mounting method in which a component is mounted on a mating substrate in a predetermined case while being mounted on the first substrate 110 (second substrate 120) on the second transport path 12). Asynchronous transfer board mounting means that when the first substrate 110 and the second substrate 120 are transferred asynchronously with each other, the first transport path 11 (second head 2) in the first head unit 2 (second head unit 3). In this mounting method, components are mounted on a mating substrate in a predetermined case while being mounted on the first substrate 110 (second substrate 120) on the transport path 12). More specifically, in the synchronous transfer boarding mounting and the asynchronous transfer boarding mounting, the first substrate 110 (the second transport path 12) on the first transport path 11 (second transport path 12) is mainly used in the first head unit 2 (second head unit 3). While mounting on the second substrate 120), mounting is performed so as to assist the mounting on the other side in a predetermined case.

  As shown in FIG. 2, the surface mounter 100 further includes a control device 101, and is configured such that each operation of the surface mounter 100 is controlled by the control device 101. The control device 101 includes a main control unit 102, a drive control unit 103, an image processing unit 104, a valve control unit 105, a storage unit 106, and a communication unit 107. Further, the control device 101 includes a display unit 108 such as a liquid crystal display device and an input unit 109 such as a keyboard.

  The main control unit 102 includes a CPU that executes logical operations. Based on the mounting program 106a stored in the ROM of the storage unit 106, the main control unit 102 operates the substrate transport conveyor 1, the first head unit 2, the second head unit 3, and the like via the drive control unit 103. Configured to control. The main control unit 102 is configured to control the component imaging device 22 and the board imaging device 23 provided in the first head unit 2 (second head unit 3) via the image processing unit 104. The main control unit 102 is configured to control the negative pressure generator 24 provided in the first head unit 2 (second head unit 3) via the valve control unit 105. Thereby, the main control unit 102 can control the suction operation of the component by the suction nozzle 21 (31).

  Further, the main control unit 102 is configured to read the substrate data 106b stored in the storage unit 106 and acquire the size and fiducial mark position of the substrate to be mounted. Further, the board data 106b includes information on the mounting (mounting) position of each component on a predetermined board, information on an optimized mounting (mounting) procedure, and the like. Here, the optimized mounting (mounting) procedure is a procedure in which the mounting path (the movement path of the head unit) becomes shorter under a predetermined condition. In the first embodiment, the optimized mounting (mounting) procedure is acquired by an optimization process (see FIG. 3) described later by the main control unit 102. The main control unit 102 is an example of the “mounting method selection unit” and the “accepting unit” in the present invention.

  Further, the main control unit 102 moves the first head unit 2 and the second head unit 3 based on the component mounting (mounting) position information and the optimized mounting (mounting) procedure information based on the board data 106b. To mount the parts. At this time, the main control unit 102 corrects the component mounting (mounting) position (head unit movement destination) based on the positions of the fiducial marks 111 and 121 (see FIG. 1) provided on the board. It is configured.

  The drive control unit 103 is configured to control the motor drive of each part of the first head unit 2 and the second head unit 3 based on a control signal output from the main control unit 102. The drive control unit 103 is configured to control driving of motors (drive motor, rotation motor, and conveyance motor) of each unit of the substrate conveyance conveyor 1 based on a control signal output from the main control unit 102. Yes.

  The image processing unit 104 is configured to read an imaging signal at a predetermined timing from the component imaging device 22 and the board imaging device 23 based on a control signal output from the main control unit 102. Further, the image processing unit 104 performs predetermined image processing on the read imaging signal so as to generate image data suitable for recognizing components and fiducial marks 111 and 121 (see FIG. 1). It is configured.

  The storage unit 106 includes a ROM (Read Only Memory) that stores a program for controlling the CPU, a RAM (Random Access Memory) that temporarily stores various data during operation of the apparatus, and the like. In addition, the storage unit 106 stores a mounting program 106a, board data 106b, and an optimization program 106c.

  The communication unit 107 is provided to acquire information related to the processing status from the upstream process apparatus and the downstream process apparatus. Specifically, the main control unit 102 acquires information about the processing status from a printing device (not shown) in the upstream process and a soldering device (not shown) in the downstream process via the communication unit 107.

  The tape feeder 4 has a reel (not shown) on which a tape holding a plurality of components at a predetermined interval is wound. The tape feeder 4 is configured to send out a tape that holds a component by rotating a reel. Thereby, components are supplied from the tape feeder 4.

  The tray component supply device 5 is provided to supply electronic components to be mounted on the first substrate 110 and the second substrate 120 to the second head unit 3. The tray component supply device 5 is configured to place components on a tray (not shown). Thereby, it is possible to suck (acquire) the components on the tray by the second head unit 3.

  The tray storage unit 6 is provided to store a tray (not shown) disposed on the tray component supply device 5. Further, the tray storage unit 6 is configured to be able to store a plurality of trays.

  The disposal station 7 is provided for discarding defective electronic components. The defective electronic component discarded in the disposal station 7 is supplied again to the surface mounter 100 as an electronic component after the defective portion is corrected.

  Next, with reference to FIGS. 3 and 4, the optimization process by the optimization program 106c will be described. The optimization process is executed by the main control unit 102 based on a user instruction. It should be noted that the user performs the optimization process before performing the setup, and performs the setup based on the part allocation, the mounting procedure, and the like acquired by the optimization process.

  First, when there is an instruction to perform optimization processing from the user, the main control unit 102 displays a mounting method selection screen 108a on the display unit 108 in step S1, as shown in FIG. On the mounting method selection screen 108a, five items of automatic determination, asynchronous transport independent mounting, asynchronous transport alternate lane mounting, synchronous transport onboard mounting, and asynchronous transport onboard mounting are displayed in a selectable manner. In step S2, the main control unit 102 receives one of the five items desired by the user. In step S3, the main control unit 102 determines whether the received item is automatic determination. When the user selects an item other than automatic determination, in step S5, the main control unit 102 determines the mounting method to be performed as the mounting method selected by the user. For example, when the user selects the asynchronous transport alternating lane mounting, the main control unit 102 determines as a mounting method for implementing the asynchronous transport alternating lane mounting.

  On the other hand, when the user selects automatic determination, in step S4, the main control unit 102 executes a mounting method determination process. Next, the mounting method determination process in step S4 in the optimization process in FIG. 3 will be described with reference to FIG. In the first embodiment, in the mounting method determination process, the main control unit 102 preferentially selects asynchronous transport independent mounting as an appropriate mounting method, and performs asynchronous transport alternating lane mounting and synchronous transport onboard mounting in a predetermined case. Alternatively, one of the asynchronous transport board mounting is selected as an appropriate mounting method. As a result, in the normal case, it is possible to prevent the mounting on the other conveyance path side from being stopped even when a problem occurs in one conveyance path or the head unit.

  First, in step S41, the main control unit 102 acquires board information, facility information, and production information. Specifically, the main control unit 102 acquires information such as the size of the board to be mounted, the number and type of electronic components to be mounted (mounted), and the mounting (mounted) position as the board information. In addition, the main control unit 102 acquires information regarding facilities provided on each of the first transport path 11 side and the second transport path 12 side as the facility information. Specifically, for each of the first transport path 11 side and the second transport path 12 side, the number of tape feeders 4, the presence or absence of the tray component supply device 5, the presence or absence of the disposal station 7, the component imaging device 22 and the board imaging device 23. Information on the equipment related to the mounting, such as the type and the presence or absence of an automatic nozzle changer (not shown). In addition, the main control unit 102 includes, as production information, the planned number of boards to be transported in each of the first transport path 11 and the second transport path 12, the time interval for carrying in from a printing device (not shown), and the soldering device. Information such as an unloading time interval (not shown) and presence / absence of a common setup priority instruction is acquired. If the user desires common setup priority, the user can give an instruction in advance through a predetermined setting screen (not shown) before executing the optimization process.

  Here, common setup priority means that the installation position of the tape feeder 4, the type of the suction nozzle 21 (31), the arrangement position of components on the tray of the tray component supply device 5, etc. are shared among different types of substrates. Is a priority. By giving priority to the common setup, the number of setups can be reduced.

  Thereafter, in step S42, the main control unit 102 determines whether or not the non-mounting time is longer than the mounting time when the asynchronous transport independent mounting is performed. The non-mounting time is a time other than the mounting time including the substrate transfer waiting time, the substrate transfer time, and the time required for fixing the substrate on the first transfer path 11 (second transfer path 12). The main control unit 102 acquires a non-mounting time and a mounting time by performing a simulation in the case of performing asynchronous transport independent mounting based on the board information, facility information, and production information. If the non-mounting time is longer than the mounting time in any of the transport paths, in step S43, the main control unit 102 determines the mounting method to be implemented as asynchronous transport alternating lane mounting. That is, since the non-mounting time is long and the stand-by time of the head unit becomes long in independent mounting, mounting is performed by both head units on one substrate located at the mounting position by alternate lane mounting. Thereby, it can suppress that production efficiency falls.

  If the non-mounting time is equal to or shorter than the mounting time, in step S44, the main control unit 102 determines whether there is a common setup priority instruction. When giving priority to the common setup, the main control unit 102 determines in step S45 whether there is a common mounting component on the board on the first transport path 11 side and the second transport path 12 side. If there is a common component, the main control unit 102 determines the mounting method to be implemented to be asynchronous conveyance alternating lane mounting in step S43. Here, in order to make a common setup, it is necessary to set many types of parts in the tape feeder 4, so it is desirable to consolidate the common parts as much as possible to save the number of tape feeders 4. For this reason, in the case of common setup priority, when there are common parts, the common parts are collected in the tape feeder 4 on the one conveyance path side, so independent mounting cannot be performed. In the case where there is no common component in the case of common setup priority, the main control unit 102 determines the mounting method to be implemented as asynchronous transport independent mounting in step S46.

  If the common setup is not prioritized, the main control unit 102 determines in step S47 whether or not the planned production number of substrates on the first transport path 11 side and the second transport path 12 side is different. In the case where the scheduled production number is the same on the first conveyance path 11 side and the second conveyance path 12 side, in step S48, the main control unit 102 determines the mounting time on the first conveyance path 11 side and the second conveyance path 12 side. It is determined whether or not the difference is within a predetermined range P1 (for example, about 5%). Specifically, the main control unit 102 acquires a mounting time by performing a simulation in the case of performing asynchronous transport independent mounting based on board information, facility information, and production information. If the difference in the mounting time is within the predetermined range P1, the main control unit 102 determines the mounting method to be implemented to be asynchronous transport mounting in step S49. Accordingly, it is possible to execute on-board mounting capable of consolidating common components, unlike asynchronous mounting, while transporting asynchronously with a small transport waiting time. In addition, in mounting mounting, when it is not necessary to mount on the substrate of one transport path, it can be mounted on the substrate of the other transport path using one head unit, so the waiting time of one head unit Can be reduced. Thereby, the mounting time can be shortened. Also, in the mounting mounting, the mounting operation on the counterpart side is less than in the alternate lane mounting, and accordingly, the time for the head unit to wait for the processing of the other head unit to avoid interference is reduced.

  When the difference in mounting time is outside the predetermined range P1, the main control unit 102 performs a process when the number of produced sheets is the same in step S50. Next, with reference to FIG. 6, the process when the number of produced sheets is the same will be described.

  In step S501, the main control unit 102 determines whether or not independent mounting is possible. Specifically, the main control unit 102 determines whether or not mounting is possible independently on the first transport path 11 side and the second transport path 12 side based on the board information and facility information. For example, when the tray component supply device 5 is provided only on the second conveyance path 12 side as shown in FIG. 1, the main control unit 102 determines the tray component supply device for the substrate on the first conveyance path 11 side. When it is necessary to mount the components supplied by 5, the first head unit 2 on the first transport path 11 side cannot be mounted, so that it is determined that independent mounting is impossible.

  If independent mounting is possible, in step S502, the main control unit 102 determines whether the difference in mounting time is within a predetermined range P2 (for example, about 30%) between the first transport path 11 side and the second transport path 12 side. Determine whether. If the difference in mounting time is within the predetermined range P2, the main control unit 102 determines the mounting method to be implemented as asynchronous transport independent mounting in step S503. On the other hand, when independent mounting is not possible and when the difference in mounting time is outside the predetermined range P2, the main control unit 102 determines the mounting method to be implemented to be synchronous transport onboard mounting in step S504. When the number of produced sheets is the same on the first conveyance path 11 side and the second conveyance path 12 side and the mounting time difference is large, when asynchronous conveyance is performed, only one of the conveyance paths ends quickly, and between the two conveyance paths There is a risk that the difference in end time will increase and the intermediate inventory will increase. For this reason, when the number of produced sheets is the same and the difference in mounting time is large, synchronous conveyance that can make the end time between both conveyance paths substantially the same is advantageous. In addition, in the case of synchronous transfer mounting, when the difference in mounting time between both transport paths is large, the difference in mounting time between both transport paths can be shortened, so the substrates on both transport paths can be efficiently transported synchronously. be able to.

  In step S47 of FIG. 5, when the number of production scheduled sheets is different between the first conveyance path 11 side and the second conveyance path 12 side, the main control unit 102 performs processing when the number of production sheets is different in step S51. Next, with reference to FIG. 7, the processing when the number of produced sheets is different will be described.

  In step S511, the main control unit 102 determines whether or not independent mounting is possible. If independent mounting is possible, the main control unit 102 determines the mounting method to be implemented as asynchronous transport independent mounting in step S512. If independent mounting is impossible, the main control unit 102 determines the mounting method to be asynchronous transport alternating lane mounting in step S513. Thereby, the mounting method determination process shown in FIG. 5 is completed.

  When the mounting method determination process ends and the mounting method is determined, the main control unit 102 determines component allocation and mounting procedures in step S6 of FIG. Specifically, the main control unit 102 allocates the mounted components to the tape feeder 4 according to the mounting method determined by the mounting method determination process described above, the board transport order, and the mounting (mounting) of the components on the board. ) Determine the procedure. The user performs setup based on the determination result.

  In the first embodiment, as described above, based on the board information, time information, and facility information, the asynchronous transport independent mounting and the non-independent mounting (asynchronous transport alternate lane mounting, synchronous transport onboard mounting, and asynchronous transport onboard mounting) are used. By providing the main control unit 102 for selecting an appropriate mounting method, when the asynchronous transport independent mounting is selected, the mounting on the other transport path side is continued even when a problem occurs in one transport path or the head unit. Therefore, it can suppress that production efficiency falls. In addition, non-independent mounting (asynchronous transport alternate lane mounting, synchronous transport onboard mounting, and asynchronous transport onboard mounting), such as when asynchronous transport independent mounting cannot be performed based on board information, time information, and facility information Can be selected and implemented.

  In the first embodiment, the main control unit 102 preferentially selects asynchronous transport independent mounting as an appropriate mounting method, and predetermined based on at least one of board information, time information, and facility information. In this case, non-independent mounting (asynchronous transport alternate lane mounting, synchronous transport onboard mounting, and asynchronous transport onboard mounting) is selected as an appropriate mounting method. By configuring in this way, asynchronous transport independent mounting capable of suppressing a decrease in production efficiency is preferentially selected as an appropriate mounting method, and at least one of board information, time information, and facility information is selected. Based on this, non-independent mounting (asynchronous transport alternating lane mounting, synchronous transport onboard mounting, and asynchronous transport onboard mounting) can be selected and mounted only in a predetermined case such as when asynchronous transport independent mounting cannot be performed.

  In the first embodiment, when the mounting time is shorter than the non-mounting time, the main control unit 102 selects the asynchronous transport alternating lane mounting as an appropriate mounting method. By configuring in this way, even when the mounting time is shorter than the non-mounting time and the stop time of the head units 2 and 3 is long, the asynchronous transport alternating lane mounting that can reduce the stop time of the head units 2 and 3 is implemented. It can suppress that production efficiency falls by selecting.

  In the first embodiment, the main control unit 102 performs the asynchronous transport independent mounting, the asynchronous transport alternating lane mounting, and the synchronous transport on the basis of at least one of the board information, the time information, and the facility information. Select an appropriate mounting method from mounting and asynchronous transport mounting mounting. By configuring in this way, it is possible to suppress the decrease in production efficiency by selecting the asynchronous transport independent mounting, and the asynchronous transport alternating in a predetermined case such as when the asynchronous transport independent mounting cannot be performed. Mounting can be performed by selecting a mounting method that can further suppress the reduction in production efficiency from the three mounting methods of lane mounting, synchronous transport onboard mounting, and asynchronous transport onboard mounting.

  In the first embodiment, when priority is given to the common setup by the main control unit 102, either the asynchronous transport independent mounting or the asynchronous transport alternating lane mounting is selected as an appropriate mounting method. With this configuration, when priority is given to common setup, it is desirable to save the number of tape feeders 4 that supply parts as much as possible. Therefore, the tape feeder can be used as long as the number of tape feeders 4 can be saved. Asynchronous transport alternating lane mounting that can save the number of 4 is selected, and asynchronous transport independent mounting that can suppress the reduction in production efficiency is selected if the number of tape feeders 4 cannot be saved. it can.

  In the first embodiment, when there is a mounting component common to the first substrate 110 and the second substrate 120 based on the substrate information by the main control unit 102, the asynchronous transfer alternating lane mounting is an appropriate mounting method. Choose as. With this configuration, when there are mounting parts common to the first board 110 and the second board 120, even when the common mounting parts are concentrated on one transport path, the parts are mounted on the other transport path side board. A possible asynchronous transport alternate lane implementation can be selected to save the number of tape feeders 4. Thereby, common setup can be easily realized.

  In the first embodiment, when the planned production number of the first substrate 110 and the second substrate 120 is different by the main control unit 102, either the asynchronous transport independent mounting or the asynchronous transport alternating lane mounting is appropriately mounted. Choose as a method. With this configuration, when the number of first substrates 110 and the second substrate 120 that are to be produced is different, the asynchronous transport is finally performed only on one transport path side, and the other transport path side is selected. Can improve the production efficiency more than the synchronous transfer in a stopped state.

  In the first embodiment, the main control unit 102 accepts any one mounting method desired by the user among asynchronous transport independent mounting, asynchronous transport alternating lane mounting, synchronous transport onboard mounting, or asynchronous transport onboard mounting, It mounts on the 1st board | substrate 110 and the 2nd board | substrate 120 with the received mounting method. With this configuration, the main control unit 102 can automatically select an appropriate mounting method, but when the user desires a specific mounting method, the main mounting unit 102 can mount with the mounting method desired by the user. it can.

(Second Embodiment)
Next, a second embodiment will be described. In the second embodiment, unlike the first embodiment, a surface mounting machine 100 having a configuration in which the mounting method is determined as either the asynchronous transport independent mounting or the asynchronous transport alternating lane mounting in the mounting method determination process will be described.

  In the mounting method determination process of the surface mounter 100 according to the second embodiment of the present invention, as shown in FIG. 8, the main control unit 102 performs steps S48 and S49 of the mounting method determination process according to the first embodiment (FIG. 5). Do not perform the operation corresponding to That is, in the second embodiment, the main control unit 102 determines that the number of sheets to be produced is the same on the first conveyance path 11 side and the second conveyance path 12 side in step S50 regardless of the difference in mounting time between both conveyance paths. Processes when the number of productions is the same. In FIG. 8, the same processes as those in the first embodiment are given the same step numbers.

  In the process when the number of produced sheets is the same according to the second embodiment, the main control unit 102 determines whether or not independent mounting is possible in step S501 as shown in FIG. Regardless of the difference, the mounting method is determined to be asynchronous transport independent mounting in step S503. If independent mounting is impossible, the main control unit 102 determines the mounting method to be asynchronous conveyance alternating lane mounting in step S505.

  8 is the same as the processing when the number of produced sheets is different according to the first embodiment shown in FIG.

  In addition, the other structure of 2nd Embodiment is the same as that of the said 1st Embodiment.

  In the second embodiment, as described above, the main control unit 102 performs an appropriate mounting method based on the board information, the time information, and the facility information from the two mounting methods of asynchronous transport independent mounting and asynchronous transport alternating lane mounting. Asynchronous transfer independent mounting that can continue mounting on the other transfer path side even if a problem occurs in one transfer path or head unit, and the other transfer path while one transfer path is transferring a substrate It is possible to select an appropriate mounting method according to the conditions from the asynchronous conveyance alternating lane mounting which can be mounted on the substrate with both head units and the stop time of the head unit can be shortened.

  The remaining effects of the second embodiment are similar to those of the aforementioned first embodiment.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is shown not by the above description of the embodiments but by the scope of claims for patent, and further includes all modifications within the meaning and scope equivalent to the scope of claims for patent.

  For example, in the first and second embodiments, the example of the configuration in which the surface mounting machine as the component mounting apparatus includes two transport paths has been described, but the present invention is not limited to this. In the present invention, the surface mounting machine may be configured to include three or more conveyance paths. In this case, the structure provided with three or more head units as a head part may be sufficient.

  Moreover, in the said 1st and 2nd embodiment, although the printing process was shown as an example of an upstream process, this invention is not limited to this. In the present invention, for example, the upstream process may be a process other than the printing process, such as a mounting process by another component mounting apparatus.

  Moreover, in the said 1st and 2nd embodiment, although the soldering process was shown as an example of a downstream process, this invention is not limited to this. In the present invention, for example, the downstream process may be a process other than the soldering process, such as a mounting process using another component mounting apparatus.

  In the first and second embodiments, an example of a configuration in which only one surface mounting machine as a component mounting apparatus is provided between the upstream printing apparatus and the downstream soldering apparatus has been described. A configuration in which a plurality of component mounting apparatuses according to the present invention are provided between the apparatus and the soldering apparatus may be employed. In this case, optimization processing may be performed separately by a plurality of component mounting apparatuses according to the present invention, and different mounting methods may be determined between the plurality of component mounting apparatuses.

  Further, in the first embodiment, in the synchronous transport board mounting and the asynchronous transport board mounting, the first head unit 2 (second head unit 3) mainly performs the first transport on the first transport path 11 (second transport path 12). Although an example of a configuration in which mounting is performed so as to assist mounting on the other side in a predetermined case while mounting on one substrate 110 (second substrate 120) is shown, the present invention is not limited to this. In the present invention, in the synchronous transfer mounting and the asynchronous transfer mounting, even when the board is located at the mounting position on both transfer paths, the mounting is performed by regarding the two boards as one board. Good. In this case, as shown in FIG. 10, mounting is performed by an optimized mounting (mounting) procedure for the area surrounded by the broken line frame 110 a.

  Here, when optimizing a plurality of substrates as one substrate, unlike the case of optimizing each substrate as a separate substrate, a single mounting (mounting) operation by the head unit (the head unit is Consider mounting the component by moving across multiple boards in the operation after mounting (mounting) the component at a predetermined position after it is picked up and returning to the suction position again) Can do. That is, since the degree of freedom of the mounting (mounting) path is increased as compared with the case where each board is regarded as a separate board and optimized, it becomes easier to shorten the mounting (mounting) path of the head unit. It is possible to shorten the mounting time and improve the production efficiency.

  In the first and second embodiments, the example of the configuration in which the mounting method is selected based on all of the board information, the time information such as the mounting time, and the facility information in the mounting method determination process has been described. Is not limited to this. In this invention, the structure which selects the mounting method based on any one of board | substrate information, time information, and equipment information may be sufficient.

  In the second embodiment, the asynchronous transport alternating lane mounting is shown as an example of the non-independent mounting of the present invention, but the present invention is not limited to this. In the present invention, as long as the mounting method is not independent mounting, for example, the non-independent mounting may be synchronous transport board mounting or asynchronous transport board mounting.

  Further, in the first embodiment, an example of a configuration in which asynchronous transport alternating lane mounting is selected when common components exist on the boards of both transport paths in step S45 of the mounting method determination process (see FIG. 5). However, the present invention is not limited to this. In the present invention, when common parts are present on the boards of both transport paths, any mounting method that can collect and mount components on one transport path side may be used. It may be configured to select onboard implementation.

  In the first and second embodiments, in the mounting method determination process, an appropriate mounting method is selected based on the user's intention (intention to give priority to common setup) instead of production efficiency in a predetermined case. Although an example is shown, the present invention is not limited to this. In this invention, the structure which selects the mounting method with the highest production efficiency as an appropriate mounting method may be sufficient.

2 1st head unit (1st head part)
3 Second head unit (second head)
DESCRIPTION OF SYMBOLS 11 1st conveyance path 12 2nd conveyance path 100 Surface mounter (component mounting apparatus)
102 Main control unit (mounting method selection unit, reception unit)
110 First substrate 120 Second substrate

Claims (7)

A first transport path capable of transporting the first substrate;
A second transport path capable of transporting the second substrate;
A first head portion provided on the first transport path side, and capable of mounting electronic components on both the first substrate on the first transport path and the second substrate on the second transport path;
A second head unit provided on the second transport path side, and capable of mounting electronic components on both the first substrate on the first transport path and the second substrate on the second transport path;
Information on at least one of board information including information on at least mounting parts of the first board and the second board, time information on processing time of the first board and the second board, and facility information on mounting equipment. Based on the above, the first substrate and the second substrate are asynchronously transferred to each other and mounted on the first substrate by the first head unit, and are mounted on the second substrate by the second head unit. And asynchronous transfer alternating lanes that alternately mount the first substrate and the second substrate on the first substrate and the second substrate by both the first head portion and the second head portion while asynchronously transferring the first substrate and the second substrate. Mounting, transporting the first substrate and the second substrate in synchronization with each other, mounting the first substrate on the first substrate with the first head unit, Synchronous carry-on mounting, which is mounted on a substrate being mounted by one head unit in a predetermined case with the other head unit while being mounted on the second substrate at a gate unit, and the first substrate and the second substrate are mutually connected Asynchronously transported and mounted on the first substrate by the first head portion and mounted on the second substrate by the second head portion, while being mounted on the substrate being mounted by one head portion at the other head portion. and a mounting method selection unit for selecting a proper implementation of the asynchronous transport fly implementations that implement in the case of,
When the mounting time is shorter than the non-mounting time based on the time information, the mounting method selection unit, when the asynchronous transport independent mounting, the asynchronous transport alternate lane mounting, the synchronous transport onboard mounting, and the asynchronous transport onboard A component mounting apparatus configured to select the asynchronous transport alternating lane mounting as an appropriate mounting method from among four mounting methods of mounting.   The mounting method selection unit preferentially selects the asynchronous transport independent mounting as an appropriate mounting method, and a predetermined case based on at least one of the board information, the time information, and the facility information 2. The component mounting apparatus according to claim 1, wherein the component mounting apparatus is configured to select any one of the asynchronous transport alternating lane mounting, the synchronous transport onboard mounting, and the asynchronous transport onboard mounting as an appropriate mounting method. The mounting method selection unit, when the priority is given to the common setup, the is configured to select one of asynchronous transport independent implementation or the asynchronous transport alternating lane implemented as appropriate mounting method, according to claim 1 or 2. The component mounting apparatus according to 2. When there is a mounting component common to the first board and the second board based on the board information, the mounting method selection unit performs the asynchronous transfer alternating lane mounting, the synchronous transfer onboard mounting, or the asynchronous transfer. I rode one implementation is configured to select a proper mounting method, the component mounting apparatus according to any one of claims 1-3. The mounting method selection unit selects either the asynchronous transport independent mounting or the asynchronous transport alternate lane mounting as an appropriate mounting method when the production planned number of the first board and the second board is different. The component mounting apparatus of any one of Claims 1-4 comprised by these. Among the asynchronous transport independent mounting, the asynchronous transport alternating lane mounting, the synchronous transport onboard mounting or the asynchronous transport onboard mounting, further comprising a receiving unit that accepts any one mounting method desired by the user,
Wherein it is configured to implement the first substrate and the second substrate by the mounting method accepted by the accepting unit, the component mounting apparatus according to any one of claims 1-5. The mounting method selection unit is configured to select the highest production efficiency implementation as appropriate mounting method, the component mounting apparatus according to any one of claims 1-6.

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