JP4771097B2 - Resonator, filter, capacitor device, and method of manufacturing resonator - Google Patents

Description

  The present invention relates to a resonator, a filter, a capacitor device, and a method for manufacturing the resonator.

  For example, the resonator is used as a filter in an electronic device such as a mobile phone. For example, Patent Document 1 discloses an LC resonator in which an inductor conductor is perpendicular to an insulating sheet and a capacitor electrode is parallel to the insulating sheet in order to reduce eddy current generated in the capacitor electrode. ing.

  The filter obtains a desired frequency characteristic by arranging a plurality of resonators and mutually electromagnetically coupling them. However, in the above LC resonator, the capacitor electrode is provided in parallel to the insulating sheet, so that there is a distance limitation in arrangement, and there is a limit in miniaturization and low profile in configuring the filter. There is a problem.

In addition, with respect to the conventional capacitor device with reduced equivalent series inductance (ESL), as disclosed in, for example, Patent Document 2 and Patent Document 3, an electrode extending in the plate surface direction of the multilayer substrate is formed. However, there is a problem that there is a limit to miniaturization and low profile.
Japanese Patent No. 3501327 Japanese Patent Laid-Open No. 2005-243889 JP 2003-22936 A

  An object of the present invention is to provide a resonator, a filter, and a capacitor device that are suitable for miniaturization and low profile.

  Another object of the present invention is to provide a manufacturing method suitable for the above-described resonator.

1. Resonator In order to solve the above-described problem, a resonator according to the present invention includes a dielectric substrate, a first internal electrode, and a second internal electrode. The first internal electrode has a cylindrical shape and is embedded in the dielectric substrate. The second internal electrode has a columnar shape and is embedded in the dielectric base so that the outer peripheral surface thereof faces the inner peripheral surface of the first internal electrode. The dielectric substrate is present in a region sandwiched between the first internal electrode and the second internal electrode, and the first internal electrode and the second internal electrode are insulated.

  As described above, since the first internal electrode and the second internal electrode are insulated and sandwich the dielectric base, a coupling capacitance is generated between the first internal electrode and the second internal electrode. is doing. In addition, since the first internal electrode and the second internal electrode have an inductor component, the resonator according to the present invention is a series circuit of a capacitor and an inductor.

  Furthermore, since the second internal electrode is columnar, while the first internal electrode is cylindrical and the second internal electrode is arranged inside the cylinder, the resonator according to the present invention is It can be formed in an elongated shape. Therefore, since there is no distance limitation when arranging a plurality of resonators, the plurality of resonators can be arranged with high density, which is suitable for miniaturization and low profile.

2. Filter The filter according to the present invention includes a plurality of resonators. The filter according to the present invention is, for example, a bandpass filter. Each of the plurality of resonators is a resonator according to the present invention, and the outer peripheral surfaces of the first internal electrodes are arranged facing each other.

  Since the filter according to the present invention uses the resonator according to the present invention, the filter according to the present invention can enjoy the excellent operational effects of the resonator according to the present invention.

3. Capacitor Device A capacitor device according to the present invention includes a plurality of resonators. Each of the plurality of resonators is the resonator according to claim 1 or 2, wherein the outer peripheral surfaces of the first internal electrodes are arranged facing each other.

  In the first and second internal electrodes, one end portion and the other end portion of adjacent ones are alternately connected in sequence, thereby forming a series of conductive paths. In adjacent pairs of the plurality of resonators, the end portions of the first internal electrodes connected to each other are on the side opposite to the end portions of the second internal electrodes connected to each other.

  As described above, the first internal electrode and the second internal electrode included in the same resonator are sequentially connected to the adjacent first and second internal electrodes at the ends opposite to each other. , The directions of the currents flowing through them can be made opposite to each other. Also, the adjacent first internal electrodes and the adjacent second internal electrodes are alternately connected to each other, so that the directions of current flow are opposite to each other. Therefore, the magnetic field generated by the current is also opposite, and the resonators cancel each other out by arranging them appropriately close to each other, so that ESL can be reduced. At this time, the coupling capacity of the resonator described above is not affected.

  Furthermore, since the capacitor device according to the present invention uses the resonator according to the present invention, the capacitor device according to the present invention can enjoy the excellent operational effects of the resonator according to the present invention.

4). Method for Manufacturing Resonator A method for manufacturing a resonator according to the present invention includes the following first to fifth steps. In the first step, a through hole is formed in the dielectric sheet. In the second step, a first internal electrode is formed on the wall surface of the through hole. In the third step, the through hole is filled with a dielectric.

  In the fourth step, a through hole penetrating the dielectric is formed. In the fifth step, the second internal electrode is formed by filling the through hole formed in the fourth step with a conductor.

  According to the resonator manufacturing method of the present invention described above, since the first and second internal electrodes are formed using the through holes provided in the dielectric sheet, the resonator of the present invention can be easily formed. Obtainable. This manufacturing method can also be applied to the manufacture of filters and the like.

  As described above, according to the present invention, it is possible to provide a resonator, a filter, and a capacitor device that are suitable for miniaturization and low profile.

  Further, according to the present invention, it is possible to provide a manufacturing method suitable for the above-described resonator.

1. 1 is a perspective view showing a capacitor device according to the present invention, FIG. 2 is a cross-sectional view taken along line II-II of the capacitor device shown in FIG. 1, and FIG. 3 is III of the capacitor device shown in FIG. FIG. The capacitor device includes resonators Q1 to Q4. First, the resonators Q1 to Q4 will be described. Since the resonators Q1 to Q4 have the same structure, only the resonator Q1 will be described.

  The resonator Q1 includes a dielectric substrate D, a first internal electrode 11, and a second internal electrode 12. The dielectric substrate D is a laminate of ceramic substrates, for example, and has a rectangular parallelepiped shape.

  The first internal electrode 11 has a cylindrical shape and is embedded in the dielectric substrate D. The second internal electrode 12 has a columnar shape and is embedded in the dielectric substrate D so that the outer peripheral surface thereof faces the inner peripheral surface of the first internal electrode 11. Specifically, the first internal electrode 11 has a cylindrical shape, and a columnar second internal electrode 12 is provided concentrically inside the cylinder. Note that the first internal electrode 11 may have a rectangular cylindrical shape, and the second internal electrode 12 may also have a quadrangular prism shape.

  As for the 2nd internal electrode 12, upper end part A11 and lower end part A12 (refer FIG. 1) protrude from the up-and-down opening surface of the 1st internal electrode 11, respectively. In a region E (see FIG. 3) sandwiched between the first internal electrode 11 and the second internal electrode 12, there is a dielectric substrate D, and the first internal electrode 11 and the second internal electrode 12 are insulated. Has been.

  As described above, since the first internal electrode 11 and the second internal electrode 12 are insulated and sandwich the dielectric base D, the first internal electrode 11 and the second internal electrode 12 are sandwiched between them. Has a coupling capacitance C. Further, since the first internal electrode 11 and the second internal electrode 12 have an inductor component L, the resonator according to the present invention includes a series circuit of a capacitor C and an inductor L as shown in FIG. It becomes. Here, the size of the inductor L changes according to the lengths ΔH1 and ΔH2 of the second internal electrode 12 protruding from the opening surface of the first internal electrode 11 (see FIG. 2).

  Further, the second internal electrode 12 has a columnar shape, while the first internal electrode 11 has a cylindrical shape, and the second internal electrode 12 is disposed inside the cylinder, and therefore the resonance according to the present invention. The vessel may be formed in an elongated shape. Therefore, since there is no distance limitation when arranging a plurality of resonators, the plurality of resonators can be arranged with high density, which is suitable for miniaturization and low profile.

  For example, as described later, when the resonator Q1 is manufactured using a dielectric sheet, the height H of the first internal electrode 11 is 800 (μm), the diameter W1 is 200 (μm), and the thickness W2 is 5 ( On the other hand, the diameter W3 of the second internal electrode 12 can be 100 (μm) (see FIG. 2).

  The resonators Q1 to Q4 are arranged such that the outer peripheral surfaces of the first inner electrodes 11, 21, 31, 41 are opposed to each other. Specifically, the resonators Q <b> 1 to Q <b> 4 are adjacent to each other with a predetermined interval in a state where the height direction is matched with the thickness direction of the dielectric substrate D.

  The first internal electrodes 11, 21, 31, 41 and the second internal electrodes 12, 22, 32, 42 are connected one after the other alternately, and the other ends are sequentially connected alternately. As a result, a series of conductive paths are formed. In addition, the adjacent pairs of the resonators Q1 to Q4 are connected to the second internal electrodes 12, 22, 32, 42 in which the ends of the first internal electrodes 11, 21, 31, 41 connected to each other are connected to each other. On the opposite side of the edge.

  The connection of the resonators Q1 to Q4 will be specifically described below. In the resonator Q 1 and the resonator Q 2, upper end portions B 11 and B 21 of the first internal electrodes 11 and 21 are connected to each other by a flat conductor 51. On the other hand, lower end portions A <b> 12 and A <b> 22 of the second inner electrodes 12 and 22 are connected to each other by a flat conductor 54.

  In the resonator Q 2 and the resonator Q 3, lower end portions B 22 and B 32 of the first internal electrodes 21 and 31 are connected to each other by a flat conductor 52. On the other hand, upper end portions A21 and A31 of the second inner electrodes 22 and 32 are connected to each other by a flat conductor 55.

  In the resonator Q3 and the resonator Q4, the upper end portions B31 and B41 of the first inner electrodes 31 and 41 are connected to each other by a flat conductor 53. On the other hand, lower end portions A 32 and A 42 of the second inner electrodes 32 and 42 are connected to each other by a flat conductor 56.

  As described above, the resonators Q1 to Q4 have the first and second internal electrodes 11, 21, 31, 41, 12, 22, 32, 42 connected to the same end portions, and the first The internal electrodes 11, 21, 31, 41 and the second internal electrodes 12, 22, 32, 42 are connected to opposite sides.

  The capacitor device is provided with four external terminals T11, T12, T21, and T22. The pair of external terminals T11, T12 and the other pair of external terminals T21, T22 are respectively provided on the side surfaces of the two dielectric bases D facing each other across one row formed by the resonators Q1 to Q4. Connection of these external terminals T11, T12, T21, and T22 will be described below.

  The external terminal T11 is connected to the upper end A11 of the second internal electrode 12 through a flat lead portion U11. The external terminal T12 is connected to the upper end portion A41 of the second internal electrode 42 through a flat lead portion U12.

  On the other hand, the external terminal T21 is connected to the lower end B12 of the first internal electrode 11 through a flat lead portion U21. The external terminal T22 is connected to the lower end B42 of the first internal electrode 41 through a flat lead portion U22.

  Therefore, the external terminals T21, T22 and the first internal electrodes 11, 21, 31, 41 constitute a series of conductive paths. Similarly, the external terminals T11, T12, the second internal electrodes 12, 22 , 32 and 42 and the external terminal T12 also constitute a series of conductive paths.

  As described above, the first internal electrodes 11, 21, 31, 41 and the second internal electrodes 12, 22, 32, 42 included in the same resonators Q1 to Q4 are opposite to each other. Are sequentially connected to the adjacent first and second internal electrodes 11, 21, 31, 41, 12, 22, 32, 42, so that the directions of the currents flowing through them can be made opposite to each other . That is, in the present embodiment, the current I1 may flow from the external terminal T11 toward the external terminal T12, and the current I2 flow from the external terminal T21 toward the external terminal T22 (see the dotted arrow in FIG. 1). ).

  In addition, the connected end portions of the adjacent first internal electrodes 11, 21, 31, 41 and the adjacent second internal electrodes 12, 22, 32, 42 are alternately arranged. Therefore, the directions in which the currents I1 and I2 flow are opposite to each other. Therefore, the magnetic fields generated by the currents I1 and I2 are also opposite to each other, and the ESL can be reduced because the resonators Q1 to Q4 are arranged close to each other so as to cancel each other. At this time, the coupling capacitance C of the resonators Q1 to Q4 described above is not affected.

  Therefore, an equivalent circuit diagram of the capacitor device shown in FIGS. 1 to 3 is expressed as shown in FIG. Here, the symbol Cq1 represents the coupling capacitance of the resonator Q1, the symbol Cq2 represents the coupling capacitance of the resonator Q2, the symbol Cq3 represents the coupling capacitance of the resonator Q3, and the symbol Cq4 represents the coupling capacitance of the resonator Q4. Thus, the coupling capacitors Cq1 to Cq4 (F) exist between the conductive path from the external terminal T21 to the external terminal T22 and the conductive path from the external terminal T11 to the external terminal T12. Therefore, the capacity of the entire capacitor device can be regarded as Cq1 + Cq2 + Cq3 + Cq4 (F).

  Furthermore, since the capacitor device according to the present invention uses the resonator according to the present invention, the capacitor device according to the present invention can enjoy the excellent operational effects of the resonator according to the present invention. That is, as described above, since the resonators Q1 to Q4 can be arranged with high density, in addition to the effect that ESL can be reduced by arranging them close enough to cancel the generated magnetic field, the capacitor device can be reduced in size and There is also a great effect that the height can be reduced.

  In the present embodiment, the resonators Q1 to Q4 are arranged in a line and embedded in the dielectric substrate D. However, the present invention is not limited to this. For example, the resonators Q1 and Q2 and the resonators Q3 and Q4 may be divided into separate rows and arranged 2 × 2 vertically and horizontally. At this time, when the connection relationship of the resonators Q1 to Q4 is the same as that of the present embodiment, the resonators Q1, Q4, and resonators are arranged so that the directions of the currents flowing through the adjacent resonators Q1 to Q4 are opposite. Q2 and resonator Q3 are adjacent to each other.

  In the present embodiment, four resonators are embedded in the dielectric substrate D. However, the present invention is not limited to this, and the number of resonators to be used may be appropriately determined according to the design.

2. Filter The filter according to the present invention includes a plurality of resonators. The filter according to the present invention is, for example, a bandpass filter. Each of the plurality of resonators included in the filter is a resonator according to the present invention. For example, as in the capacitor device described above, the first internal electrodes 11, 21, 31, 41 (FIGS. 1 to 3). The outer peripheral surfaces of each other are arranged so as to face each other.

  Since the filter according to the present invention uses the resonator according to the present invention, the filter according to the present invention can enjoy the excellent operational effects of the resonator according to the present invention. That is, as described above, since the resonators Q1 to Q4 can be arranged with high density, an effect that the filter can be reduced in size and height can be obtained.

3. Next, a manufacturing process of the resonator according to the present invention will be described. 6 to 17 show the manufacturing process of the resonator Q3 used in the capacitor device described above as an example, and shows the resonator Q3 as seen in the section taken along the line II-II shown in FIG. .

  First, as shown in FIG. 6, a dielectric sheet 60 having a conductor film S1 formed on a part of its surface is prepared. As the dielectric sheet 60, for example, a green sheet for an LTCC (Low Temperature Co-fired Ceramics) substrate can be used. The conductor film S can be formed by a thin film formation technique such as sputtering or vapor deposition, printing, plating, or a combination thereof.

  Next, as shown in FIG. 7, the through hole TH <b> 1 is formed in the dielectric sheet 60. Here, the remaining part of the conductor film S <b> 1 becomes the conductor 53. The through hole TH1 can be obtained, for example, by drilling using a general-purpose punching machine. Further, as shown in FIG. 8, after filling the through hole TH1 with the conductive paste M1 so as to be connected to the conductor 53, the dielectric sheet having the conductor film S2 formed on a part of the surface thereof as shown in FIG. 61 is laminated under the dielectric sheet 60 so that the conductor paste M1 and the conductor film S2 are connected.

  Next, as shown in FIG. 10, a through hole TH2 penetrating the conductor paste M1 and the dielectric sheet 61 is formed. Here, the remaining part of the conductor film S <b> 2 becomes the conductor 52. Thereby, the first internal electrode 31 connected to the conductors 52 and 53 is formed on the wall surface of the through hole TH1. At this time, instead of the conductor paste M1, a conductor film may be formed by sputtering to obtain the first internal electrode 31.

  Next, after filling the through hole TH1 with the dielectric paste M2 as shown in FIG. 11, another dielectric sheet 62 is laminated on the dielectric sheet 60 as shown in FIG.

  Next, as shown in FIG. 13, a through hole TH3 penetrating the dielectric sheet 62 and the dielectric paste M2 is formed. Then, as shown in FIG. 14, the second internal electrode 32 is formed by filling the through hole TH3 with a conductor paste.

  Next, as shown in FIG. 15, a conductor 55 is formed on the surface of the dielectric sheet 61 so as to be connected to the second internal electrode 32, and another dielectric is formed on the surface thereof as shown in FIG. The sheets 63 are stacked. Here, the conductor 55 can be formed by thin film formation techniques such as sputtering and vapor deposition, printing, plating, or a combination thereof.

  Finally, the dielectric sheet 64 having the conductor 56 formed on a part of the surface is laminated under the dielectric sheet 61 so that the conductor 56 and the second internal electrode 32 are connected.

  Thus, after laminating | stacking the dielectric material sheets 60-64, means, such as thermocompression bonding, are applied and integrated, and necessary processes, such as a baking and a terminal formation process, are performed. Thereby, the resonator Q3 used in the capacitor device shown in FIGS. 1 to 3 is obtained.

  According to this resonator manufacturing method, the first and second internal electrodes 31 and 32 are formed using the through holes TH1 to TH3 provided in the dielectric sheets 60 to 62, so that the resonance of the present invention is achieved. Can be easily obtained. This manufacturing method can also be applied when manufacturing filters, capacitor devices, and the like. In addition, the other electrode provided in a filter or a capacitor | condenser apparatus can be formed by thin film formation techniques, such as sputtering and vapor deposition, printing, plating, or those combinations.

  In the present embodiment, if the thicknesses of the dielectric sheets 61 and 62 are appropriately selected, the projecting lengths ΔH1 and ΔH2 shown in FIG. 2 can be changed. Therefore, the resonator Q3 having a different size of the inductor L can be suitably manufactured according to the thickness of the dielectric sheets 61 and 62.

  As described above, according to the present invention, it is possible to provide a resonator, a filter, and a capacitor device that are suitable for miniaturization and low profile. In addition, a manufacturing method suitable for manufacturing the above-described resonator can be provided.

  Although the contents of the present invention have been specifically described above with reference to the preferred embodiments, it is obvious that those skilled in the art can take various modifications based on the basic technical idea and teachings of the present invention. It is.

It is a perspective view which shows the capacitor | condenser apparatus which concerns on this invention. It is the II-II sectional view taken on the line of the capacitor | condenser apparatus shown in FIG. FIG. 3 is a cross-sectional view of the capacitor device shown in FIG. 2 taken along the line III-III. 1 is an equivalent circuit diagram of a resonator according to the present invention. FIG. 4 is an equivalent circuit diagram of the capacitor device shown in FIGS. 1 to 3. It is a figure which shows the manufacturing process of the resonator which concerns on this invention. It is a figure which shows the manufacturing process after the process of FIG. It is a figure which shows the manufacturing process after the process of FIG. It is a figure which shows the manufacturing process after the process of FIG. It is a figure which shows the manufacturing process after the process of FIG. It is a figure which shows the manufacturing process after the process of FIG. It is a figure which shows the manufacturing process after the process of FIG. It is a figure which shows the manufacturing process after the process of FIG. It is a figure which shows the manufacturing process after the process of FIG. It is a figure which shows the manufacturing process after the process of FIG. It is a figure which shows the manufacturing process after the process of FIG. It is a figure which shows the manufacturing process after the process of FIG.

Explanation of symbols

11, 21, 31, 41 First internal electrodes 12, 22, 32, 42 Second internal electrodes Q1-Q4 Resonators B11, B21, B31, B41 Upper end portions of the first internal electrodes B12, B22, B32, B42 Lower end of first internal electrode A11, A21, A31, A41 Upper end of second internal electrode A12, A22, A32, A42 Lower end of second internal electrode D Dielectric substrate T11, T12, T21, T22 External terminal 60 to 64 Dielectric sheet TH1, TH2, TH3 Through hole M2 Dielectric paste

Claims (2)

A capacitor device including a plurality of resonators,
Each of the plurality of resonators is
Including a dielectric substrate, a first internal electrode, a second internal electrode, a first external terminal, and a second external terminal;
The first internal electrode has a cylindrical shape and is embedded in the dielectric substrate.
The second internal electrode has a columnar shape and is embedded in the dielectric base so that an outer peripheral surface thereof faces an inner peripheral surface of the first internal electrode.
The dielectric substrate is present in a region sandwiched between the first internal electrode and the second internal electrode, and the first internal electrode and the second internal electrode are insulated;
The first and second external terminals are provided on the surface of the dielectric substrate, and are electrically connected to the first and second internal electrodes, respectively.
Wherein the plurality of resonators, respectively, are arranged in the front Symbol outer peripheral surface of the first inner electrodes are opposed to each other,
Each of said first internal electrode of said plurality of resonators, a first series of conductive paths configured, along the first set of conductive paths, successively, a pair of adjacent upper ends and lower ends The parts are connected to each other,
Each of the second inner electrodes of said plurality of resonators, a second set of conductive paths configured, along the second set of conductive paths, successively, a pair of upper ends and lower ends adjacent The parts are connected to each other,
In the adjacent pair of the plurality of resonators, the pair of connected end portions of the first internal electrode and the second internal electrode are located on opposite sides in the vertical direction.
Capacitor device. A method for manufacturing a resonator, comprising:
A first step of forming a through hole in the dielectric sheet;
A second step of forming a first internal electrode on the wall surface of the through hole;
A third step of filling the through hole with a dielectric;
A fourth step of forming a through hole penetrating the dielectric;
A fifth step of forming a second internal electrode by filling the through hole formed in the fourth step with a conductor.
A method for manufacturing a resonator.

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