JP4767939B2 - Method for manufacturing aluminum substrate for magnetic disk - Google Patents
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- JP4767939B2 JP4767939B2 JP2007338793A JP2007338793A JP4767939B2 JP 4767939 B2 JP4767939 B2 JP 4767939B2 JP 2007338793 A JP2007338793 A JP 2007338793A JP 2007338793 A JP2007338793 A JP 2007338793A JP 4767939 B2 JP4767939 B2 JP 4767939B2
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Description
この発明は、磁気ディスク装置の記録媒体の基材として用いられる磁気ディスク用アルミニウム基板の製造方法に関する。 The present invention relates to a method for manufacturing an aluminum substrate for a magnetic disk used as a base material of a recording medium of a magnetic disk device.
なお、この明細書において、「アルミニウム」の語はアルミニウムおよびその合金の両者を含む意味で用いられる。 In this specification, the term “aluminum” is used to include both aluminum and its alloys.
上記アルミニウム基板としては、例えば図4(A)(B)に示すような中心に孔部(10)が形成されたドーナツ状の円形基板(S’)がある。前記アルミニウム基板(S’)は、外周端面(11)および内周端面(12)において、基板(S’)の板厚方向の両縁が面取角度(θ)、面取長さ(L)で面取加工がなされ、それぞれ面取部(13)(14)が形成されている。面取加工は、例えばNC旋盤による施削加工において、図5に示すように切削バイト(図示省略)を矢印の経路で移動させることによって実施されている。 An example of the aluminum substrate is a donut-shaped circular substrate (S ′) having a hole (10) formed in the center as shown in FIGS. 4 (A) and 4 (B). The aluminum substrate (S ′) has a chamfering angle (θ) and a chamfering length (L) at both edges in the plate thickness direction of the substrate (S ′) on the outer peripheral end surface (11) and the inner peripheral end surface (12). The chamfering process is performed at, and chamfered portions (13) and (14) are formed, respectively. The chamfering is performed, for example, by moving a cutting tool (not shown) along a path indicated by an arrow as shown in FIG. 5 in machining using an NC lathe.
このようにして面取加工されたアルミニウム基板(S’)は、磁気データを記憶させる記憶面(17)の平面研削、ニッケル−リンめっき処理、めっき層の表面平滑化を目的とする研磨加工といった複数の工程を経て磁気ディスクに加工される。 The aluminum substrate (S ′) thus chamfered is subjected to surface grinding of the storage surface (17) for storing magnetic data, nickel-phosphorus plating treatment, polishing processing for the purpose of smoothing the surface of the plating layer, and the like. The magnetic disk is processed through a plurality of processes.
上述の製造過程における各工程間の基板(S’)の受け渡しは、図2(A)に示すように、アルミニウム基板(S’)の周縁部を断面V字形の治具(20)でチャッキングして行われる。 As shown in FIG. 2A, the delivery of the substrate (S ′) between the respective steps in the above manufacturing process is performed by chucking the peripheral portion of the aluminum substrate (S ′) with a jig (20) having a V-shaped cross section. Done.
なお、磁気ディスク基板の周端面の面取部に関する従来技術には次のようなものがある。例えば、面取部にRを付けることによって記録再生時のエラーを防止する技術、面取部にRを付けることによって記録再生機能の低下を防止する技術、面取部にRを付けることによって皮膜の耐久性向上を図る技術に関するものである(特許文献1、2、3参照)。
図2(A)(B)に示したように、断面V字形の治具(20)を用いてアルミニウム基板(S)の周縁部をチャッキングすると、面取部(13)の端面(11)側の角部(15')(15')が治具(20)と接触する。図2(A)のようにアルミニウム基板(S’)の中心線(P1)と治具(20)の中心線(P2)とが一致する場合は、治具(20)における両方(図面において左右)の角部(15')(15')の受け面角度は等しい。 As shown in FIGS. 2 (A) and 2 (B), when the peripheral portion of the aluminum substrate (S) is chucked using a jig (20) having a V-shaped cross section, the end surface (11) of the chamfered portion (13) is obtained. The side corners (15 ') (15') are in contact with the jig (20). If the center line (P1) of the aluminum substrate (S ′) and the center line (P2) of the jig (20) coincide with each other as shown in FIG. ) Corners (15 ′) and (15 ′) have equal receiving surface angles.
しかしながら、実際の操業下では、アルミニウム基板(S’)の配置位置や治具(20)のアプローチ姿勢の僅かなずれ等によって、図2(B)のように両者の中心線(P1)(P2)がずれることがある。そして、アルミニウム基板(S’)の中心線(P1)と治具(20)の中心線(P2)がずれると、左右の角部(15')(15')の受け面角度に差を生じ、端面側の角部(15')(15')を起点として記憶面(17)側の角部(18)(18)に微小なスクラッチ等のキズを生じることがある。 However, under actual operation, the center lines (P1) and (P2) of the two as shown in FIG. 2 (B) due to the slight displacement of the position of the aluminum substrate (S ′) and the approach posture of the jig (20). ) May shift. When the center line (P1) of the aluminum substrate (S ′) and the center line (P2) of the jig (20) are deviated, a difference occurs in the angle of the receiving surface of the left and right corners (15 ′) (15 ′) From the corners (15 ′) and (15 ′) on the end face side, scratches such as minute scratches may occur in the corner parts (18) and (18) on the storage face (17) side.
アルミニウム基板(S)あるいはニッケル−リンめっき仕上げ後の磁気ディスク基板にこのようなキズが存在していると、読み書き不能な欠陥部分が生じ、記憶容量の低下や読み書きヘッドのクラッシュの原因となるため、製品検査によって不良品とされる。 If such a scratch exists on the aluminum substrate (S) or the magnetic disk substrate after nickel-phosphorus plating, a defective portion that cannot be read / written occurs, which causes a decrease in storage capacity and a crash of the read / write head. The product is inferior by product inspection.
近時は磁気ディスク基板の記録容量の増大への要望が強く、記録密度が増大され、あるいは記憶領域として使用される領域が広くなっている。このため、従前では許容されていた微小なキズや、内外周部、特に外周部における微小なキズもを排除する必要があり、製品歩留まりの悪化が問題となっている。 Recently, there is a strong demand for increasing the recording capacity of the magnetic disk substrate, and the recording density is increased or the area used as a storage area is widened. For this reason, it is necessary to eliminate minute scratches that have been allowed in the past and minute scratches in the inner and outer peripheral portions, particularly the outer peripheral portion, and there is a problem of deterioration in product yield.
なお、図2ではアルミニウム基板(S’)の外周部におけるチャッキング状態を示しているが、内周部においても同様の治具(20)によってチャッキングされ、面取部(14)の周端面(12)側の角部(16')(16')で治具が接触し、記憶面(19)側の角部にキズが生じることがある。 FIG. 2 shows the chucked state at the outer peripheral portion of the aluminum substrate (S ′), but the inner peripheral portion is also chucked by the similar jig (20), and the peripheral end surface of the chamfered portion (14). The jig may come into contact with the corner portions (16 ′) and (16 ′) on the (12) side, and the corner portion on the storage surface (19) side may be scratched.
上述したキズの発生は、チャッキング治具(20)が角部(15')(15')、(16')(16')に不均等な角度で接触することが一因であると推測される。アルミニウム基板(S’)の配置位置や治具(20)のアプローチ姿勢の僅かなずれを解消することも問題解決の一策であるが、アルミニウム基板(S’)の面取部側でキズの発生を抑制する方法が模索されている。上述した各特許文献はいずれも面取部にRをつけるというものであるが、チャッキングによるキズとの関係を示すものではなく、基板材料もアルミニウム等の金属ではなくガラスである。 It is assumed that the above-mentioned scratch is caused by the chucking jig (20) coming into contact with the corners (15 ') (15'), (16 ') (16') at unequal angles. Is done. Eliminating slight deviations in the position of the aluminum substrate (S ') and the approach posture of the jig (20) is one solution to the problem, but there is a scratch on the chamfered side of the aluminum substrate (S'). A method for suppressing the occurrence is being sought. Each of the above-mentioned patent documents is to chamfer the chamfered portion, but does not show a relationship with scratches caused by chucking, and the substrate material is not a metal such as aluminum but glass.
この発明は、上述の技術背景に鑑み、チャッキング治具に対する接触角度にばらつきが生じても面取部におけるキズの発生を抑制しうる磁気ディスク用アルミニウム基板の製造方法の提供を目的とする。 In view of the above-described technical background, an object of the present invention is to provide a method for manufacturing an aluminum substrate for a magnetic disk that can suppress the occurrence of scratches in a chamfered portion even if the contact angle with respect to a chucking jig varies.
即ち、本発明の磁気ディスク用アルミニウム基板の製造方法は下記の構成を有する。
[1]ドーナツ状のアルミニウム基板を用いた磁気ディスク用アルミニウム基板の製造方法であって、
基板の外周端面、内周端面のうちの少なくとも一方について、基板の板厚方向の両縁に面取部を形成する工程と、
前記面取部の周端面側の角部を曲率半径(r)が0.05〜0.2mmとなるように曲面に加工する工程と、
該曲面加工部をV字形の断面を有する治具によりチャッキングして次の加工工程に基板を受け渡す工程と、
基板の記憶面を平面研削する工程と、
基板にニッケル−リンめっきをする工程とを
上記の順で実施することを特徴とする磁気ディスク用アルミニウム基板の製造方法。
That is, the manufacturing method of the aluminum substrate for magnetic disks of this invention has the following structure.
[1] A method of manufacturing an aluminum substrate for a magnetic disk using a donut-shaped aluminum substrate,
A step of forming chamfered portions on both edges in the plate thickness direction of the substrate for at least one of the outer peripheral end surface and the inner peripheral end surface of the substrate;
Processing the corner on the peripheral end surface side of the chamfered portion into a curved surface so that the radius of curvature (r) is 0.05 to 0.2 mm;
A step of chucking the curved surface processing portion with a jig having a V-shaped cross section and delivering the substrate to the next processing step;
Surface grinding the memory surface of the substrate;
A method for producing an aluminum substrate for a magnetic disk, comprising: performing nickel-phosphorous plating on a substrate in the order described above.
[2] 前記面取部を形成する工程および角部を曲面に加工する工程を施削加工により行い、前記施削加工は、切削バイトの移動により面取部から周端面、あるいは周端面から面取部の加工を連続して行い、かつ面取部と周端面の間の角部で円弧状に切削バイトを移動させることによって曲面に形成する前項1に記載の磁気ディスク用アルミニウム基板の製造方法。 [2] The step of forming the chamfered portion and the step of processing the corner portion into a curved surface are performed by machining, and the machining is performed from the chamfered portion to the peripheral end surface or from the peripheral end surface by moving the cutting tool. 2. The method for producing an aluminum substrate for a magnetic disk according to item 1, wherein the chamfered portion is continuously processed, and the cutting tool is moved in an arc shape at a corner between the chamfered portion and the peripheral end surface to form a curved surface. .
[3]前記アルミニウム基板はJIS A5086からなる前項1または2に記載の磁気ディスク用アルミニウム基板の製造方法。 [3] The method for manufacturing an aluminum substrate for a magnetic disk according to item 1 or 2, wherein the aluminum substrate is made of JIS A5086.
上記[1]に記載の発明によれば、角部への応力集中が回避され、チャッキング時のキズの発生を防止または抑制しうるアルミニウム基板を製造できる。すなわち、チャッキング時に治具と基板との接触角度にばらつきが生じても角部への応力集中が回避されてキズの発生が防止または抑制される。 According to the invention described in [1] above, it is possible to manufacture an aluminum substrate that can avoid stress concentration at the corners and prevent or suppress the occurrence of scratches during chucking. That is, even if the contact angle between the jig and the substrate varies during chucking, stress concentration on the corners is avoided and the generation of scratches is prevented or suppressed.
上記[2]に記載の発明によれば、チャッキング時のキズの発生を防止または抑制しうるアルミニウム基板を、従来の基板製造と同等の工数で製造することができる。 According to the invention described in [2] above, an aluminum substrate that can prevent or suppress generation of scratches during chucking can be manufactured with the same number of man-hours as conventional substrate manufacturing.
上記[3]に記載の発明によれば、強度、めっき性、切削性等の点で優れた磁気ディスク基板を製造できる。 According to the invention described in [3] above, it is possible to manufacture a magnetic disk substrate that is excellent in terms of strength, plating ability, machinability and the like.
図1に本発明によって製造される磁気ディスク用アルミニウム基板の一実施形態を示す。 FIG. 1 shows an embodiment of an aluminum substrate for a magnetic disk manufactured according to the present invention.
アルミニウム基板(S)は、中心に孔部(10)を有するドーナツ状の円形板であり(図4(A)従来のアルミニウム基板(S’)の全体形状を参照)、外周端面(11)および内周端面(12)において、基板(S)の板厚方向の両縁に面取角度(θ)、面取長さ(L)の面取部(13)(14)が形成されている。これらの面取部(13)(14)は、周端面側の角部(15)(15)(16)(16)が曲率半径(r)の曲面に形成されている。図中、(17)は磁気データが記憶される記憶面、(18)(19)は面取部(13)(14)の記憶面(17)側の角部である。 The aluminum substrate (S) is a donut-shaped circular plate having a hole (10) in the center (refer to FIG. 4 (A), the overall shape of a conventional aluminum substrate (S ′)), an outer peripheral end surface (11), and On the inner peripheral end surface (12), chamfered portions (13) and (14) having a chamfering angle (θ) and a chamfering length (L) are formed on both edges in the plate thickness direction of the substrate (S). In these chamfered portions (13) and (14), the corner portions (15), (15), (16), and (16) on the peripheral end surface side are formed into curved surfaces having a curvature radius (r). In the figure, (17) is a storage surface for storing magnetic data, and (18) and (19) are corners on the storage surface (17) side of the chamfered portions (13) and (14).
図2(A)(B)および図3に示すように、前記アルミニウム基板(S)は断面V字形の治具(20)によって外周部をチャッキングされると、面取部(13)の周端面(11)側の角部(15)(15)で治具(20)と接触する。図2(A)は、アルミニウム基板(S)の板厚方向の中心線(P1)と治具(20)の中心線(P2)が一致している状態を示し、治具(20)の開き角度を(β1)とすると、2つの角部(15)(15)における治具(20)の受け面角度は等しくβ1/2となる。一方、図2(B)はアルミニウム基板(S)の中心線(P1)が治具の中心線(P2)から角度(α)で傾斜してチャッキングされている状態を示し、2つの角部(15)(15)における受け面角度は傾斜角度(α)の分だけ差が生じる。なお、図2ではアルミニウム基板(S)の外周部におけるチャッキング状態を示しているが、内周部においても同様の治具(20)によってチャッキングされ、面取部(14)の周端面(12)側の角部(16)(16)で治具が接触する。 As shown in FIGS. 2A and 2B and FIG. 3, when the outer peripheral portion of the aluminum substrate (S) is chucked by a jig (20) having a V-shaped cross section, the circumference of the chamfered portion (13) is increased. It contacts the jig (20) at the corners (15) and (15) on the end face (11) side. FIG. 2A shows a state in which the center line (P1) in the thickness direction of the aluminum substrate (S) is coincident with the center line (P2) of the jig (20), and the opening of the jig (20) is shown. When the angle is (β1), the receiving surface angle of the jig (20) at the two corners (15) and (15) is equal to β1 / 2. On the other hand, FIG. 2B shows a state in which the center line (P1) of the aluminum substrate (S) is chucked at an angle (α) with respect to the center line (P2) of the jig, and two corner portions are shown. (15) The receiving surface angle in (15) is different by the inclination angle (α). 2 shows the chucked state at the outer peripheral portion of the aluminum substrate (S), the inner peripheral portion is also chucked by the similar jig (20), and the peripheral end surface ( 12) The jig contacts at the corners (16) and (16) on the side.
図3に、面取部(13)の一方の角部(15)と治具(20)との接触部分の模式的拡大図を示す。本図において、アルミニウム基板(S)の面取角度(θ)は25°、治具(20)の開き角度(β1)は90°である。また、実線はアルミニウム基板(S)と治具(20)の中心線(P1)(P2)が一致し、受け面角度(β2)がβ1/2=45°となる場合を示している。 In FIG. 3, the typical enlarged view of the contact part of one corner | angular part (15) of a chamfering part (13) and a jig | tool (20) is shown. In this figure, the chamfering angle (θ) of the aluminum substrate (S) is 25 °, and the opening angle (β1) of the jig (20) is 90 °. The solid line shows the case where the aluminum substrate (S) and the center lines (P1) (P2) of the jig (20) coincide, and the receiving surface angle (β2) is β1 / 2 = 45 °.
前記アルミニウム基板(S)は面取部(13)(14)の周端面(11)(12)側の角部(15)(16)が曲面に形成されている。このため、従来の角張った角部(15')(16')よりも広い面積で治具(20)に接触し、応力集中が回避されて安定した接触状態が得られる。また、一点鎖線で示すように、両者の中心線(P1)(P2)がずれても接触部分が同一曲面上を移動するだけであり、やはり曲面で接触することで応力集中が回避されて安定した接触状態が得られる。図示例では、アルミニウム基板(S)の中心線(P1)が治具(20)の中心線(P2)から角度(α)で傾斜し、治具(20)の受け面角度(β3)がβ1/2−αとなるとともに、面取部(13)が治具(20)に接近する方向に回転移動し、接触部分が図面上の左方向にずれている。逆に、図示しない他方の角部(15)においては、受け面角度がβ1/2+αとなり、面取部(13)が治具(20)から遠ざかる方向に回転移動して接触部分は左方向にずれ、同様にチャッキング時の応力集中が回避される。また、図示しない内周部の曲面状角部(16)においても同様に応力集中が回避される。これにより、面取部(13)(14)の周端面(11)(12)側の角部(15)(16)が曲面に形成された本発明のアルミニウム基板(S)では、接触部分における応力集中が回避され、記憶面(17)側の角部(18)(19)におけるスクラッチの発生が防止されあるいは抑制されるものと推測される。 In the aluminum substrate (S), the corners (15) and (16) on the peripheral end surfaces (11) and (12) side of the chamfered portions (13) and (14) are formed into curved surfaces. Therefore, the jig (20) is brought into contact with a larger area than the conventional angular corners (15 ′) and (16 ′), stress concentration is avoided, and a stable contact state is obtained. Further, as indicated by the alternate long and short dash line, even if the center lines (P1) and (P2) of both are shifted, the contact portion only moves on the same curved surface, and the stress concentration is avoided and stabilized by contacting with the curved surface. Contact state is obtained. In the illustrated example, the center line (P1) of the aluminum substrate (S) is inclined at an angle (α) from the center line (P2) of the jig (20), and the receiving surface angle (β3) of the jig (20) is β1. / 2-α, the chamfered portion (13) rotates in a direction approaching the jig (20), and the contact portion is shifted to the left in the drawing. Conversely, at the other corner (15) (not shown), the receiving surface angle is β1 / 2 + α, the chamfered portion (13) rotates and moves away from the jig (20), and the contact portion moves to the left. Misalignment as well as stress concentration during chucking is avoided. Similarly, stress concentration is avoided at the curved corner portion (16) of the inner peripheral portion (not shown). Thereby, in the aluminum substrate (S) of the present invention in which the corners (15) and (16) on the side of the peripheral end surfaces (11) and (12) of the chamfered portions (13) and (14) are formed in a curved surface, in the contact portion. It is presumed that stress concentration is avoided and the occurrence of scratches at the corners (18) and (19) on the memory surface (17) side is prevented or suppressed.
曲面に形成された角部(15)(16)において、大きな傾斜角度(α)に対して安定した接触状態を得るためには曲面の円弧長さを長く設定することが有効である。 In order to obtain a stable contact state with respect to a large inclination angle (α) at the corners (15) and (16) formed on the curved surface, it is effective to set the arc length of the curved surface long.
ここで、通常の製造工程において発生しうる傾斜角度に鑑み、安定したチャッキングが可能となる有効接触領域の円弧長さ(M)を半径(r)の円における中心角40°(±20°)の円弧長さであると想定すると、円弧長さ(M)は半径(r)の設定値に伴って後掲の表1に示す数値となる。表1に示すように、有効接触領域の円弧長さ(M)は曲率半径(r)に比例して増大し、チャッキングの安定性が向上する。曲率半径(r)が0.05mm未満では円弧長さ(M)が短く、応力集中を回避する効果に乏しい。一方、曲率半径(r)を大きくすると円弧長さ(M)は長くなり応力集中回避効果も向上するが、通常のアルミニウム基板(S)の板厚が0.635〜1.27mm、面取角度(θ)が20〜50°、面取部(13)(14)の長さ(L)が0.13〜0.21mmであることを考慮すると、0.2mmを越える長さは現実的ではない。従って、前記角部(15)(16)における曲率半径(r)は、0.05mm〜0.2mmが好ましい。特に好ましい曲率半径(r)は0.08〜0.15mmである。 Here, in view of the inclination angle that can occur in the normal manufacturing process, the arc length (M) of the effective contact region that enables stable chucking is set to a central angle of 40 ° (± 20 °) in a circle of radius (r). ), The arc length (M) is a numerical value shown in Table 1 below according to the set value of the radius (r). As shown in Table 1, the arc length (M) of the effective contact area increases in proportion to the radius of curvature (r), and the stability of chucking is improved. When the radius of curvature (r) is less than 0.05 mm, the arc length (M) is short and the effect of avoiding stress concentration is poor. On the other hand, when the radius of curvature (r) is increased, the arc length (M) is increased and the stress concentration avoidance effect is improved. However, the thickness of the normal aluminum substrate (S) is 0.635 to 1.27 mm, and the chamfer angle is increased. Considering that (θ) is 20 to 50 ° and the length (L) of the chamfered portions (13) and (14) is 0.13 to 0.21 mm, a length exceeding 0.2 mm is not realistic. Absent. Accordingly, the radius of curvature (r) at the corners (15) and (16) is preferably 0.05 mm to 0.2 mm. A particularly preferred radius of curvature (r) is 0.08 to 0.15 mm.
また、この発明のアルミニウム基板においては、チャッキング治具に接触する角部が曲面に形成されていれば足りる。従って、外周部または内周部の一方のみでチャッキングされるアルミニウム基板であれば、一方のみが曲面に形成されていれば良く、このようなアルミニウム基板も本発明に含まれる。 Moreover, in the aluminum substrate of this invention, it is sufficient if the corners that come into contact with the chucking jig are formed in a curved surface. Accordingly, if the aluminum substrate is chucked only at one of the outer peripheral portion or the inner peripheral portion, only one of the aluminum substrates may be formed on a curved surface, and such an aluminum substrate is also included in the present invention.
また、前記アルミニウム基板を構成するアルミニウムは限定されないが、JIS A5086を推奨できる。強度、めっき性、切削性等の点で優れた磁気ディスク基板となし得るからである。 Moreover, although the aluminum which comprises the said aluminum substrate is not limited, JIS A5086 can be recommended. This is because the magnetic disk substrate can be excellent in terms of strength, plating property, machinability and the like.
上述の面取部(13)(14)および曲面に形成された角部(15)(16)は、例えば施削加工によって形成することができる。施削加工では、図5に示すように、切削バイト(図示省略)を矢印の経路(一方の面取部〜周端面〜他方の面取部)で移動させて面取部(13)(14)を形成する際に、角部(15)(16)で円弧を描くように移動させることによって曲面に形成することができる。即ち、周端面(11)(12)から面取部(13)(14)への移動経路、面取部(13)(14)から周端面(11)(12)への移動経路を円弧状とすることにより、これらの2面間の角部を曲面に形成することができる。この方法によれば、角部の曲面形成のために別工程を設ける必要がなく、本発明のアルミニウム基板を従来と同等の工数で製造することができる。 The chamfered portions (13) and (14) and the corner portions (15) and (16) formed on the curved surface can be formed by, for example, machining. In the machining process, as shown in FIG. 5, a cutting tool (not shown) is moved along a path indicated by an arrow (one chamfered portion-a peripheral end surface-the other chamfered portion) to chamfered portions (13) (14 ) Can be formed into a curved surface by moving the corners (15) and (16) so as to draw an arc. That is, the movement path from the peripheral end faces (11) and (12) to the chamfered parts (13) and (14) and the movement path from the chamfered parts (13) and (14) to the peripheral end faces (11) and (12) are arcuate. By doing so, the corner between these two surfaces can be formed into a curved surface. According to this method, it is not necessary to provide a separate process for forming the curved surface of the corner, and the aluminum substrate of the present invention can be manufactured with the same number of steps as in the prior art.
上述の方法で製造されたアルミニウム基板(S)は、記憶面(17)を平面研削した後、磁性層を形成して磁気ディスクとなされる。前記磁気ディスクは、基板としてキズのない、あるいはキズの数や大きさが抑制されたアルミニウム基板を用いることによって、磁性層における欠陥が抑制され、ひいては記録密度の増大や記憶領域の拡大に対応しうるものである。前記磁性層の種類は限定されず、ニッケル−リン等の磁性薄膜を例示できる。また形成方法はめっきを例示できる。また、本発明における磁性層には単層および複層の両方が含まれ、さらには下地層や表面保護層も含まれる。 The aluminum substrate (S) manufactured by the above-described method is formed into a magnetic disk by forming a magnetic layer after surface-grinding the storage surface (17). The magnetic disk uses an aluminum substrate with no scratches or a reduced number and size of scratches as a substrate, thereby suppressing defects in the magnetic layer, and thus corresponding to an increase in recording density and an expansion of a storage area. It can be. The kind of the magnetic layer is not limited, and examples thereof include a magnetic thin film such as nickel-phosphorus. The forming method can be exemplified by plating. Further, the magnetic layer in the present invention includes both a single layer and a multilayer, and further includes an underlayer and a surface protective layer.
JIS A5086相当のドーナツ状アルミニウム製ブランク材(外径:95mm、孔部径:25mm、厚さ:1.27mm)を多数準備した。 A large number of donut-shaped aluminum blanks (outer diameter: 95 mm, hole diameter: 25 mm, thickness: 1.27 mm) corresponding to JIS A5086 were prepared.
前記ブランク材に対し、外周部および内周部において面取角度(θ)=25°、面取長さ(L)=0.19mmの面取加工を施した。面取加工は、NC旋盤による切削バイトを用いた施削加工により行うものとし、図5に示すように、切削バイト(図示省略)を矢印の経路で移動させた。この面取加工において、切削バイトを円弧状に移動させることにより、面取部(13)(14)の端面(11)(12)側の角部(15)(15)(16)(16)を曲面状に加工した(図1参照)。角部(15)(16)の曲率半径(r)は、0.01mm、0.05mm、0.10mm、0.15mm、0.20mmとし、異なる曲面状角部を有する5種類のアルミニウム基板(S)を製作した。但し、曲率半径(r):0.01mmとは、施削加工において角部(15)の曲率半径(r)を設定せずとも不可避的に形成される極微小な曲面である。換言すれば、従来の面取加工によって形成された角張った面取部である。 The blank material was chamfered with a chamfering angle (θ) = 25 ° and a chamfering length (L) = 0.19 mm at the outer peripheral portion and the inner peripheral portion. The chamfering is performed by a cutting process using a cutting tool by an NC lathe, and the cutting tool (not shown) is moved along a path indicated by an arrow as shown in FIG. In this chamfering process, by moving the cutting tool in an arc shape, the corners (15) (15) (16) (16) on the end surface (11) (12) side of the chamfered part (13) (14) Was processed into a curved surface (see FIG. 1). The radius of curvature (r) of the corners (15) and (16) is 0.01 mm, 0.05 mm, 0.10 mm, 0.15 mm, and 0.20 mm, and five types of aluminum substrates having different curved corners ( S) was produced. However, the curvature radius (r): 0.01 mm is an extremely small curved surface that is unavoidably formed without setting the curvature radius (r) of the corner portion (15) in the machining process. In other words, it is an angular chamfer formed by conventional chamfering.
製作した各アルミニウム基板(S)について、図2(A)(B)に示すように、開き角度(β)が90°のV字形の治具(20)を用いてチャッキング試験を行った。チャッキングは、アルミニウム基板(S)の外周部で3箇所(外周の三等分位置)、内周部で3箇所(内周上の三等分位置)の合計6箇所でチャッキングするものとした。そして、チャッキング−移動−離脱の一連の動作を1回とし、これを150回繰り返した。前記繰り返し回数は、記憶面(17)の平面研削、ニッケル−リンめっき処理、めっき層の研磨加工といった通常の磁気ディスク基板の製造工程で行われるチャッキング回数の5倍に相当する。そして、スクラッチ等のキズの発生状況により評価結果を表1に示す。 Each manufactured aluminum substrate (S) was subjected to a chucking test using a V-shaped jig (20) having an opening angle (β) of 90 ° as shown in FIGS. Chucking is performed at a total of 6 locations, 3 locations on the outer periphery of the aluminum substrate (S) (peripheral positions on the outer periphery) and 3 locations on the inner periphery (three positions on the inner periphery). did. Then, a series of operations of chucking-moving-leaving was defined as one time, and this was repeated 150 times. The number of repetitions corresponds to five times the number of chucking performed in a normal magnetic disk substrate manufacturing process such as surface grinding of the storage surface (17), nickel-phosphorus plating treatment, and polishing of the plating layer. Table 1 shows the evaluation results according to the occurrence of scratches such as scratches.
◎:キズは発生しなかった。 (Double-circle): The crack did not generate | occur | produce.
○:僅かにキズが発生したが、通常の製品検査において合格品であると判断される程度である。 ○: Slightly scratched, but to the extent that it is judged to be an acceptable product in normal product inspection.
×:通常の製品検査において不良品であると判断されるキズが発生した。 X: Scratches determined to be defective in normal product inspection occurred.
表1の結果より、チャッキング治具に接触する面取部の角部を曲面に形成することによりキズの発生が抑制されることを確認した。 From the results in Table 1, it was confirmed that the formation of scratches was suppressed by forming the corners of the chamfered portions that contact the chucking jig into curved surfaces.
次に、表1の評価で◎または○と評価されたアルミニウム基板、即ち面取部の角部の曲率半径が本発明の範囲内に形成されたアルミニウム基板(S)に対し、記憶面(17)の平面研削を行った後、磁性層を形成して磁気ディスクを作製した。磁性層の形成は、常法により脱脂洗浄、エッチング、ジンケート処理を施した後、次亜りん酸塩を還元剤とした硫酸ニッケル浴にて、浴温90℃、pH4.5、処理時間2.0時間の条件でニッケル−リンめっきし、湯洗後乾燥させ、加熱処理し、さらに仕上げ研磨を施すものとした。 Next, with respect to the aluminum substrate evaluated as 評 価 or ○ in the evaluation of Table 1, that is, the aluminum substrate (S) formed with the curvature radius of the corner portion of the chamfered portion within the range of the present invention, the storage surface (17 ) Was subjected to surface grinding, and then a magnetic layer was formed to produce a magnetic disk. The magnetic layer is formed by degreasing, etching and zincate treatment by a conventional method, followed by a nickel sulfate bath using hypophosphite as a reducing agent, bath temperature 90 ° C., pH 4.5, treatment time 2. Nickel-phosphorus plating was performed under conditions of 0 hours, followed by washing with hot water, drying, heat treatment, and finishing polishing.
上述の磁気ディスクについて、光干渉式形状測定装置にて記憶面の表面状態を観察したところ、いずれの磁気ディスクにおいても記録再生機能あるいは記憶容量を低下させるレベルのキズは発生していなかった。 When the surface state of the storage surface was observed with the optical interference type shape measuring apparatus for the above-described magnetic disk, no scratches of a level that would reduce the recording / reproducing function or the storage capacity occurred in any of the magnetic disks.
本発明によれば、チャッキング治具に対するるキズの発生を抑制しうる磁気ディスク用アルミニウム基板を製造できるから、磁気ディスクの製造に適用できる。 According to the present invention, an aluminum substrate for a magnetic disk that can suppress the occurrence of scratches on the chucking jig can be manufactured, and therefore, it can be applied to the manufacture of a magnetic disk.
S、S’…磁気ディスク用アルミニウム基板
θ…面取角度
r…曲率半径
L…面取長さ
10…孔部
11…外周端面
12…内周端面
13,14…面取部
15,16…端面側の角部
17…記憶面
18,19…記憶面側の角部
S, S '... Aluminum substrate for magnetic disk θ ... Chamfer angle r ... Radius of curvature L ... Chamfer length
10 ... hole
11… Outer end face
12 ... Inner peripheral edge
13,14… Chamfer
15,16… Corner on the end face side
17 Memory
18,19… The corner on the memory side
Claims (3)
基板の外周端面、内周端面のうちの少なくとも一方について、基板の板厚方向の両縁に面取部を形成する工程と、
前記面取部の周端面側の角部を曲率半径(r)が0.05〜0.2mmとなるように曲面に加工する工程と、
該曲面加工部をV字形の断面を有する治具により、前記基板の外周部を外周の三等分位置の3箇所、または内周部を内周の三等分位置の3箇所でチャッキングし、次の加工工程に基板を受け渡す工程と、
基板の記憶面を平面研削する工程と、
基板にニッケル−リンめっきをする工程とを
上記の順で実施することを特徴とする磁気ディスク用アルミニウム基板の製造方法。 A method of manufacturing an aluminum substrate for a magnetic disk using a donut-shaped aluminum substrate,
A step of forming chamfered portions on both edges in the plate thickness direction of the substrate for at least one of the outer peripheral end surface and the inner peripheral end surface of the substrate;
Processing the corner on the peripheral end surface side of the chamfered portion into a curved surface so that the radius of curvature (r) is 0.05 to 0.2 mm;
Using a jig having a V-shaped cross section, the curved surface processed portion is chucked at the outer periphery of the substrate at three locations on the outer periphery at three locations or at the inner periphery at three locations on the inner periphery. , The process of delivering the substrate to the next processing process,
Surface grinding the memory surface of the substrate;
A method for producing an aluminum substrate for a magnetic disk, comprising: performing nickel-phosphorous plating on a substrate in the order described above.
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