JP4762800B2 - Method for manufacturing printed circuit board - Google Patents

Description

The present invention relates to a method for manufacturing a printed circuit board , and more particularly to a method for manufacturing a printed circuit board used for a TAB tape carrier or the like.

  A printed circuit board such as a TAB tape carrier has a metal support layer such as a copper foil as a reinforcing layer. In such a printed circuit board, first, an insulating layer is formed on a metal support layer, a conductor pattern is formed on the insulating layer, and then the metal support layer is left with a portion requiring reinforcement. It is manufactured by etching away (see, for example, Patent Document 1 and FIG. 2).

In the above manufacturing, usually, before removing the metal support layer, the shape of the conductor pattern is optically inspected. More specifically, for example, as shown in FIG. Further, the surface of the insulating layer 32 including the conductor pattern 41 is irradiated with light (indicated by a solid line arrow), and the light reflected by the conductor pattern 41 is detected to determine the quality of the shape.
Further, for example, in such a printed circuit board, by setting the surface glossiness of the metal support layer to 150 to 500%, in the inspection of the conductor pattern, the reflected light from the metal support layer is diffused, and the inspection is performed. It has been proposed to reduce misjudgment (see, for example, Patent Document 2).
JP 2000-340617 A JP 2005-333028 A

However, in the above-described inspection, the reflected light from the metal support layer 33 (indicated by a chain arrow in FIG. 7) may cause an erroneous determination of the inspection. It is necessary to prevent erroneous misjudgment.
However, in the printed circuit board described in Patent Document 2, such erroneous determination is prevented, but with the finer pitch of the conductor pattern in recent years, further improvement in inspection accuracy for pass / fail determination is required. However, in the printed circuit board described in Patent Document 2, it may be difficult to sufficiently meet such a demand.

An object of the present invention is to provide a method of manufacturing a printed circuit board on which a highly reliable conductor pattern is formed.

In order to achieve the above object, a method of manufacturing a wired circuit board according to the present invention includes a step of forming a metal support layer made of a metal foil having a particle size number of 10.1 to 13.0 defined by JIS G0551 , an insulating layer to form on the metal supporting layer step, a step of forming a conductive pattern on the insulating layer, by irradiating the conductor pattern and the light on the surface of the insulating layer a metal comprising a support layer, with the conductive pattern A step of optically inspecting the shape of the conductor pattern by detecting the reflected light, and a step of opening a metal support layer that overlaps a conductor pattern forming portion in which the conductor pattern is formed in the insulating layer It is characterized by having.
In the method for manufacturing a printed circuit board according to the present invention, the conductor pattern includes a plurality of wires, and a total length of the width of the wires and a distance between the wires adjacent to each other is 30 μm or less. It is preferable that this portion is included.

In the method for manufacturing a printed circuit board according to the present invention, the particle size number defined by JIS G0551 of the metal foil of the metal support layer is set to 10.1 to 13.0. When the inspection is performed, the reflected light from the metal support layer can be diffused. Therefore, it is possible to reduce inspection misjudgment and improve inspection accuracy. As a result, it is possible to provide a printed circuit board on which a highly reliable conductor pattern is formed.

FIG. 1 is a partial plan view showing a TAB tape carrier manufactured by an embodiment of the method for manufacturing a printed circuit board according to the present invention, and FIG. 2 is a partially enlarged plan view of the TAB tape carrier shown in FIG. 3 is a partial rear view of the TAB tape carrier shown in FIG. 1, and FIGS. 4 and 5 are cross-sectional views taken along line AA ′ in FIG. 2 of the manufacturing process diagram for manufacturing the TAB tape carrier shown in FIG. It is.
For example, as shown in FIG. 5 (j), the TAB tape carrier 1 includes a tape-shaped metal support layer 2 extending continuously in the longitudinal direction, and an insulating layer 3 formed on the metal support layer 2. And a conductor pattern 4 formed on the insulating layer 3.

Further, in this TAB tape carrier 1, as shown in FIG. 1, the insulating layer 3 has a longitudinal direction of the metal support layer 2 (the same as the longitudinal direction of the TAB tape carrier 1. Hereinafter, it may be simply referred to as a longitudinal direction). .), A plurality of conductor pattern forming portions 5 are provided at predetermined intervals.
As shown in FIG. 2, each conductor pattern forming portion 5 has a substantially rectangular shape in plan view, and a mounting portion 10 having a substantially rectangular shape in plan view for mounting an electronic component (not shown) is provided at the center thereof. ing.

The conductor pattern 4 is formed on both sides in the longitudinal direction of the mounting portion 10 in each conductor pattern forming portion 5. That is, the conductor pattern 4 includes a plurality of wirings 6 arranged at a predetermined interval from each other, and each wiring 6 includes an inner lead 7, an outer lead 8 and a relay lead 9 continuously and integrally.
Each inner lead 7 faces the inside of the mounting portion 10, extends along the longitudinal direction, and is arranged in parallel in the width direction of the TAB tape carrier 1 at a predetermined interval.

  The pitch of each inner lead 7 (that is, the total length of the width of one inner lead 7 and the width (interval) between adjacent inner leads 7) IP is 30 μm or less, preferably 25 μm or less. Usually, it is set to 20 μm or more. Thus, by setting the pitch IP of each inner lead 7 to 30 μm or less, high-density wiring can be realized.

The width of each inner lead 7 is set to 7 to 15 μm, preferably 8 to 11 μm, and the width (interval) between the inner leads 7 adjacent to each other is set to 10 to 23 μm, preferably 10 to 15 μm. Yes.
Each outer lead 8 extends along the longitudinal direction at both ends in the longitudinal direction of each conductor pattern forming portion 5 and is arranged in parallel in the width direction at a predetermined interval.

  The pitch of each outer lead 8 (that is, the total length of the width of one outer lead 8 and the width (interval) between adjacent outer leads 8) OP is, for example, with respect to the pitch IP of each inner lead 7 , About 100-1000%. That is, the pitch OP of each outer lead 8 is set to be wider or the same width as the pitch IP of each inner lead 7.

Each relay lead 9 relays each inner lead 7 and each outer lead 8 so that each inner lead 7 and each outer lead 8 are continuous. For example, each relay lead 9 has a wide pitch from the inner lead 7 side with a narrow pitch. It is arranged so as to spread radially in the longitudinal direction toward each outer lead 8 side.
In the region where each relay lead 9 is arranged, a coating layer 11 such as a solder resist is provided on the insulating layer 3 so as to cover each relay lead 9. That is, the covering layer 11 is formed in a substantially rectangular frame shape so as to surround the mounting portion 10 in each pattern forming portion 5, and is provided so as to cover all the relay leads 9.

Although not shown, the inner lead 7 and the outer lead 8 are preferably appropriately covered with a nickel plating layer or a gold plating layer.
Further, the TAB tape carrier 1 has a metal support layer 2 and a back view in which the mounting portion 10 is exposed corresponding to the back surface of each conductor pattern forming portion 5 (see FIG. 1) as shown in FIG. A rectangular opening 16 is formed.

  Further, the TAB tape carrier 1 is formed with a transport portion 12 for transporting the TAB tape carrier 1. As shown in FIG. 1, the transport unit 12 is provided along the longitudinal direction at both side edges in the width direction of the TAB tape carrier 1. A plurality of feed holes 13 for meshing with a sprocket or the like for conveying the TAB tape carrier 1 are formed in each conveying portion 12 so as to face each other in the width direction. Each feed hole 13 is perforated so as to penetrate the TAB tape carrier 1 (through the metal support layer 2 and the insulating layer 3) at equal intervals in the longitudinal direction of the TAB tape carrier 1. Each feed hole 13 is perforated in a square hole shape of, for example, 1.981 × 1.981 mm, and the interval between the feed holes 13 is set to 4.75 mm, for example.

Next, a method for manufacturing the TAB tape carrier 1 will be described.
In this method, first, a metal support layer 2 is prepared as shown in FIG.
The metal support layer 2 is made of a metal foil such as a stainless steel foil, a copper foil, or a copper alloy foil. Preferably, it consists of stainless steel foil. As the stainless steel foil, for example, SUS301, SUS304, SUS305, SUS309, SUS310, SUS316, SUS317, SUS321, SUS347 or the like is used based on the standard of AISI (American Iron and Steel Institute).

  The metal foil has a particle size number defined by JIS G0551, for example, 10.1 to 13.0, preferably 10.5 to 13.0, and more preferably 10.5 to 12.5. Is prepared. If the particle size number is not within the above range, the particle diameter (particle size) on the surface of the metal foil is excessively large or small, so that erroneous determination is likely to occur in the inspection of the shape of the conductor pattern 4 described later.

The thickness of the metal support layer 2 is, for example, 3 to 100 μm, preferably 5 to 30 μm, and more preferably 8 to 20 μm. If the thickness of the metal support layer 2 is less than the above range, the rigidity of the TAB tape carrier 1 may be reduced. Moreover, if the thickness of the metal support layer 2 exceeds the above-described range, the TAB tape carrier 1 may be bent.
Moreover, the width | variety of the metal support layer 2 is suitably selected by the objective and use of the TAB tape carrier 1, for example, is 100-1000 mm, Preferably, it is 150-400 mm.

The particle size number of the metal foil used for the metal support layer 2 can be measured according to JIS G0551 (2005 version) “particle size number—measurement method”. More specifically, the particle size number of the metal foil refers to the value of G calculated by the following formula expressed using the average number of crystals m per 1 mm ^{2 of the} surface.
m = 8 × 2 ^G
Such particle size number is measured by, for example, polishing the surface of the metal foil with polishing paper (# 1000), and then scratching the polished surface until the surface scratches caused by polishing of the polishing paper are not visually confirmed. After polishing with diamond, crystal grains appear by electrolytic etching. Then, the average number m of crystal grains is counted with a microscope. Thereby, a particle size number can be measured.

  Moreover, the particle size number of metal foil can be adjusted to said range by adjusting suitably the conditions in an annealing (annealing) process at the time of manufacture of metal foil, for example. That is, in the annealing step, for example, after heating to an appropriate temperature (annealing temperature), the temperature is maintained for an appropriate time, and then cooled. More specifically, in this annealing step, the annealing temperature is, for example, 900 to 1100 ° C., preferably 900 to 980 ° C., and the holding time is, for example, 10 to 60 seconds, preferably 35 to 55 seconds. The cooling rate is, for example, 10 to 60 ° C./second, and preferably 20 to 40 ° C./second from the viewpoint of cooling cost. Moreover, the final temperature of an annealing process is 15-30 degreeC, for example.

Moreover, in the above-described annealing step, for example, the treatment is performed in an oxygen-containing atmosphere such as air, for example, in an inert gas atmosphere such as nitrogen, preferably in an inert gas atmosphere. If the treatment is performed under an inert gas atmosphere, the particle diameter on the surface of the metal foil is prevented from becoming excessively large, and the particle size number of the metal foil is well adjusted to the above-described range.
In addition, as metal foil used for the metal support layer 2, you may make it anneal again the metal foil which is not annealed on the above-mentioned conditions on the above-mentioned conditions at the time of manufacture of the TAB tape carrier 1. FIG.

The metal foil used for the metal support layer 2 has a specular gloss at an incident angle of 45 °, for example, 150 to 500%, preferably 150 to 450%, more preferably in the above range of the particle size number. 150-250% can also be used.
The specular gloss can be measured at an incident angle of 45 ° in accordance with JIS Z 8741-1997 “Specular Gloss—Measurement Method”. Such specular gloss can be measured with a normal gloss meter.

In addition, the mirror surface glossiness of the metal support layer 2 can be adjusted to the above range by adjusting the roughness of the surface of the rolling roll, for example, in the rolling step during the production of the metal foil. Moreover, it can adjust to said range with the roughening process by a chemical | medical solution etc. with respect to metal foil with high specular glossiness.
4 and FIG. 5 show one row of TAB tape carriers 1, but usually, after a plurality of rows of TAB tape carriers 1 are simultaneously formed in the width direction of the metal support layer 2, Slit for each row.

For example, with a 250 mm wide metal foil, four rows of 48 mm wide TAB tape carriers 1 are produced simultaneously. In the case of a 300 mm wide metal foil, 6 rows of TAB tape carriers 1 having a width of 48 mm or 4 rows of TAB tape carriers 1 having a width of 70 mm are produced simultaneously.
Next, as shown in FIG. 4B, an insulating layer 3 is formed on the metal support layer 2. As the insulator forming the insulating layer 3, for example, a synthetic resin such as a polyimide resin, an acrylic resin, a polyether nitrile resin, a polyether sulfone resin, a polyethylene terephthalate resin, a polyethylene naphthalate resin, or a polyvinyl chloride resin is used. Preferably, a polyimide resin is used.

  And in order to form the insulating layer 3 on the metal support layer 2, for example, a resin solution is apply | coated on the metal support layer 2, and it heat-hardens after drying. The resin solution can be prepared by dissolving the above resin in an organic solvent or the like. As the resin solution, for example, a polyamic acid resin solution which is a polyimide precursor is used. The resin is applied by a known application method such as a doctor blade method or a spin coat method. And after drying by heating suitably, the insulating layer 3 which consists of a resin film which has flexibility is formed on the metal support layer 2, for example by making it heat-harden at 200-600 degreeC.

The insulating layer 3 can also be formed as a predetermined pattern by, for example, applying a solution of a photosensitive resin such as a photosensitive polyamic acid resin on the metal support layer 2, exposing and developing.
Furthermore, the insulating layer 3 can also be formed by sticking a resin film previously formed into a film shape to the metal support layer 2 via an adhesive.

The thickness of the insulating layer 3 formed in this way is, for example, 50 μm or less, preferably 30 μm or less, more preferably 25 μm or less, usually 3 μm or more. In addition, if the thickness of the insulating layer 3 is less than the above-described range, an erroneous determination may be easily caused in the inspection of the shape of the conductor pattern 4 described later.
Next, in this method, the conductor pattern 7 is formed on the surface of the insulating layer 3 as the above-described wiring circuit pattern.

  As a conductor for forming the conductor pattern 4, for example, a conductor such as copper, nickel, gold, solder, or an alloy thereof is used. Preferably, copper is used. The formation of the conductor pattern 4 is not particularly limited, and the conductor pattern 4 is formed on the surface of the insulating layer 3 by a known patterning method such as a subtractive method or an additive method. Of these patterning methods, the additive method is preferably used as shown in FIGS. 4C to 5H from the viewpoint of forming the conductor pattern 4 with a fine pitch.

  That is, in the additive method, first, as shown in FIG. 4C, a thin film of a conductor that becomes the seed film 14 is formed on the entire surface of the insulating layer 3. For the formation of the seed film 14, for example, a vacuum vapor deposition method, preferably a sputter vapor deposition method is used. Further, the conductor to be the seed film 14 is preferably made of chromium or copper. More specifically, for example, a chromium thin film and a copper thin film are sequentially formed on the entire surface of the insulating layer 3 by sputtering deposition. In forming the seed film 14, for example, the thickness of the chromium thin film is set to 100 to 600 mm and the thickness of the copper thin film is set to 500 to 2000 mm.

  Next, in this method, as shown in FIG. 4 (d), the plurality of feed holes 13 are formed along the longitudinal direction at the both side edges in the width direction of the TAB tape carrier 1 with the metal support layer 2 and the insulation. Drilling is performed so as to penetrate the thickness direction of the layer 3 and the seed film 14. For the drilling of the feed hole 13, for example, a known processing method such as drilling, laser processing, punching processing, etching or the like is used. Preferably, punching is used.

In this method, as shown in FIG. 5E, the plating resist 15 is formed on the seed film 14 in the reverse pattern of the wiring circuit pattern described above. The plating resist 15 is formed as a predetermined resist pattern by a known method using, for example, a dry film resist. The plating resist 15 is also formed on the entire surface of the metal support layer 2.
Next, as shown in FIG. 5 (f), the conductor pattern 4 is formed with the above-described wiring circuit pattern on the seed film 14 exposed from the plating resist 15 by electrolytic plating. The electrolytic plating is preferably electrolytic copper plating.

Then, as shown in FIG. 5 (g), the plating resist 15 is removed by a known etching method such as chemical etching (wet etching) or peeling, and then, as shown in FIG. Similarly, the seed film 14 exposed from 4 is removed by a known etching method such as chemical etching (wet etching).
As a result, the conductor pattern 4 is formed on the insulating layer 3 as a wiring circuit pattern of the wiring 6 in which the inner lead 7, the outer lead 8 and the relay lead 9 are continuously formed integrally as described above. . In addition, the thickness of the conductor pattern 4 is 3-50 micrometers, for example, Preferably, it is 5-25 micrometers.

  In this method, the shape of the conductor pattern 4 is optically inspected at this stage. In this inspection, as shown in FIG. 6, a reflective optical sensor 24 including a light emitting part 22 and a light receiving part 23 is disposed above the insulating layer 3 including the conductive pattern 4 so as to face the conductive pattern 4. By irradiating detection light from the light emitting part 22 toward the insulating layer 3 including the conductor pattern 4 and detecting the reflected light (detection light) reflected by the conductor pattern 4 by the light receiving part 23, the shape of the conductor pattern 4 is obtained. Judge the quality.

  In this inspection, as indicated by a chain line arrow in FIG. 6, even if the detection light emitted from the light emitting unit 22 passes through the insulating layer 3 and is reflected by the metal support layer 2, the metal foil of the metal support layer 2. Is set to 10.1 to 13.0, the reflected light (detection light) can be diffused in the metal support layer 2. Therefore, it is possible to reduce inspection misjudgment and improve inspection accuracy.

Next, in this method, as shown in FIG. 5 (i), the covering layer 11 is formed in a rectangular frame shape that covers the relay lead 9 of each wiring 6 and surrounds the mounting portion 10. The covering layer 11 is formed by a known method using a photosensitive solder resist or the like.
Thereafter, although not shown, the exposed portions of each wiring 6, that is, the inner leads 7 and the outer leads 8, are covered with a nickel plating layer and a gold plating layer. The nickel plating layer and the gold plating layer are formed by, for example, nickel plating and gold plating, respectively.

Then, as shown in FIG. 5 (j), the TAB tape carrier 1 is obtained by forming the opening 16 at a position corresponding to the conductor pattern forming portion 5 in the metal support layer 2.
In order to form the opening 16 in the metal support layer 2, the portion of the metal support layer 2 that overlaps the conductor pattern forming portion 5 is opened by wet etching (chemical etching). For etching, the portion other than the opening 16 is covered with an etching resist, and after etching using a known etching solution such as a ferric chloride solution, the etching resist is removed. Thereafter, when a plurality of TAB tape carriers 1 are produced in the width direction of the metal support layer 2, slits are made for each row.

In the case where a plurality of rows of TAB tape carriers 1 are simultaneously formed in the width direction of the metal support layer 2 and slits are made for each row, the metal support layer 2 in the slit portion between the TAB tape carriers 1 is opened. It is removed simultaneously with the part 16.
In the TAB tape carrier 1 thus obtained, as described above, the particle number of the metal foil of the metal support layer 2 is set to 10.1 to 13.0. Is accurately and reliably determined. Therefore, it can be provided as a TAB tape carrier 1 on which a highly reliable conductor pattern 4 is formed.

  Moreover, in the TAB tape carrier 1, the pitch IP of the inner leads 7 of the conductor pattern 4 is set to 30 μm or less, so that high-density wiring can be realized. In the inspection of the conductor pattern 4 formed in such a fine pitch, it may be easy to make an erroneous determination. However, in the TAB tape carrier 1, the particle size number of the metal foil of the metal support layer 2 is 10.1. Since it is set to ˜13.0, erroneous determination can be effectively reduced even if the conductor pattern 4 is formed with the fine pitch described above. Therefore, it can be provided as a TAB tape carrier 1 on which a highly reliable conductor pattern 4 is formed.

In the above description, the printed circuit board manufactured by the method for manufacturing a wired circuit board according to the present invention has been described by taking the TAB tape carrier as an example, but manufactured by the method for manufacturing a wired circuit board according to the present invention. The printed circuit board is not limited to this, and can be widely applied to other wired circuit boards such as various flexible printed circuit boards in which the metal support layer 2 is provided as a reinforcing layer.

Hereinafter, the present invention will be described more specifically with reference to examples and comparative examples.
In the following Examples and Comparative Examples, the operation of simultaneously producing 6 rows of 48 mm wide TAB tape carriers using a 300 mm wide stainless steel foil was repeated a plurality of times.
Example 1
Annealing temperature was set to 940 ° C., holding time was 30 seconds, cooling rate was 20 ° C./second, and final temperature was set to about 500 ° C., and under a nitrogen atmosphere, stainless steel foil (SUS304, thickness 20 μm, width 300 mm). As a result, a stainless steel foil having a particle size number of 11.5 defined by JIS G0551 was obtained. This was used as a metal support layer (see FIG. 4A).

Next, a polyamic acid resin solution was applied onto the metal support layer, dried and then heat-cured to form an insulating layer made of a polyimide resin having a thickness of 25 μm (see FIG. 4B).
Next, a seed film was formed by sequentially forming a chromium thin film having a thickness of 300 mm and a copper thin film having a thickness of 2000 mm on the surface of the insulating layer by a sputtering vapor deposition method (see FIG. 4C).

Thereafter, the feed hole is punched by punching so as to penetrate the thickness direction of the metal support layer, the insulating layer, and the seed film (see FIG. 4D), and then a plating resist is formed on the surface of the seed film. And a pattern formed on the entire surface of the metal support layer (see FIG. 5E).
Next, this is immersed in an electrolytic copper sulfate plating solution, and electrolytic copper plating is performed on the seed film exposed from the plating resist at 2.5 A / dm ² for about 20 minutes, thereby forming a conductor pattern having a thickness of 10 μm. (See FIG. 5F).

  The conductor pattern was formed as a plurality of wiring patterns that are arranged at a predetermined interval from each other and in which inner leads, outer leads, and relay leads are formed continuously and integrally. Further, the inner lead has a pitch (total length of one inner lead and a width between adjacent inner leads) of 30 μm, a width of 10 μm, and the outer lead has a pitch (the width of one outer lead The total length of the outer leads adjacent to each other was 100 μm, and the width was 80 μm.

Next, after removing the plating resist by chemical etching (see FIG. 5G), the seed film exposed from the conductor pattern was similarly removed by chemical etching. (See FIG. 5 (h)).
After that, using an automatic appearance inspection device (reflection type optical sensor), the light reflection method is used to inspect the presence or absence of a short circuit between the wirings based on the shape of the conductor pattern (see FIG. 6), and a good product and a defective product are judged. And sorted. Thereafter, a confirmation inspection was conducted by an electrical continuity inspection, and it was confirmed that there was no erroneous determination by an automatic visual inspection apparatus.

Thereafter, a photosensitive solder resist is formed so as to surround the conductor pattern forming portion so as to cover the relay lead of each wiring (see FIG. 5I), and then the inner lead and the outer lead are nickel-plated and gold-plated. And coated.
Then, after the portions other than the positions corresponding to the conductor pattern forming portion and the slit forming portion in the metal support layer are covered with an etching resist, the metal support layer is etched using a ferric chloride solution, so that the openings and TAB are formed. A slit portion was formed between the tape carriers for use (see FIG. 5 (j)). As a result, a TAB tape carrier was obtained.

Example 2
Annealing temperature is set to 970 ° C., holding time is 40 seconds, cooling rate is set to 20 ° C./second, and final temperature is set to about 500 ° C. Under a nitrogen atmosphere, stainless steel foil (SUS304, thickness 20 μm, width) 300 mm). As a result, a stainless steel foil having a particle size number of 10.6 defined by JIS G0551 was obtained. This was used as a metal support layer (see FIG. 4A). Thereafter, a TAB tape carrier was obtained in the same manner as in Example 1.

In the inspection of the TAB tape carrier by the light reflection method for the shape of the conductor pattern, it was confirmed by the subsequent continuity inspection that there was no erroneous determination.
Comparative Example 1
Annealing temperature is set to 1000 ° C., holding time is 40 seconds, cooling rate is set to 20 ° C./second, and final temperature is set to about 500 ° C., under a nitrogen atmosphere, stainless steel foil (SUS304, thickness 20 μm, width) 300 mm). As a result, a stainless steel foil having a particle size number of 10.0 defined by JIS G0551 was obtained. This was used as a metal support layer (see FIG. 4A). Thereafter, a TAB tape carrier was obtained in the same manner as in Example 1.

  In addition, in the inspection of the TAB tape carrier by the light reflection method for the shape of the conductor pattern, it was confirmed that defective products that are short-circuited were mixed in the non-defective products by the subsequent continuity inspection. It was.

It is a partial top view which shows the tape carrier for TAB manufactured by one Embodiment of the manufacturing method of the printed circuit board of this invention. FIG. 2 is a partially enlarged plan view of the TAB tape carrier shown in FIG. 1. FIG. 2 is a partial rear view of the TAB tape carrier shown in FIG. 1. 2 is a cross-sectional view taken along the line AA ′ in FIG. 2 of the manufacturing process diagram for manufacturing the TAB tape carrier shown in FIG. 1, wherein (a) is a step of preparing a metal support layer, and (b) is a metal. A step of forming an insulating layer on the support layer, (c) shows a step of forming a seed film on the entire surface of the insulating layer, and (d) shows a step of drilling a feed hole. FIG. 4 is a cross-sectional view taken along the line AA ′ in FIG. 2 of the manufacturing process diagram for manufacturing the TAB tape carrier shown in FIG. 1, and (e) shows a plating resist on the seed film. Forming step, (f) forming a conductive pattern on the seed film exposed from the plating resist by electrolytic plating, (g) removing the plating resist, and (h) exposing from the conductive pattern. (I) shows a step of forming a covering layer, and (j) shows a step of forming an opening at a position corresponding to the conductor pattern forming portion in the metal support layer. FIG. 2 is an explanatory diagram for explaining a step of optically inspecting the shape of a conductor pattern in manufacturing the TAB tape carrier shown in FIG. 1. It is explanatory drawing for demonstrating the process of optically inspecting the quality of the shape of a conductor pattern in manufacture of the conventional tape carrier for TAB.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 TAB tape carrier 2 Metal support layer 3 Insulating layer 4 Conductor pattern 6 Wiring 7 Inner lead 8 Outer lead 9 Relay lead

Claims (2)

A step of forming a metal support layer made of a metal foil having a particle size number of 10.1 to 13.0 defined by JIS G0551 ,
Forming an insulating layer on the metal support layer ;
Forming a conductor pattern on the insulating layer ;
Irradiating the surface of the metal support layer including the conductor pattern and the insulating layer with light, and detecting the light reflected by the conductor pattern, thereby optically inspecting the shape of the conductor pattern; and ,
A method for manufacturing a printed circuit board , comprising: a step of opening a metal support layer that overlaps a conductor pattern forming portion in which the conductor pattern is formed in the insulating layer . The conductor pattern includes a plurality of wirings, and includes a portion in which a total length of a width of the wirings and a distance between the wirings adjacent to each other is 30 μm or less. 2. A method for manufacturing a printed circuit board according to 1.

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