JP4757127B2 - Substrate mounting apparatus and method - Google Patents

Description

  The present invention relates to a substrate mounting apparatus and method, and more particularly to a pressure bonding apparatus and method using an anisotropic conductive resin.

  In the prior art, an anisotropic conductive resin film is first applied to a rigid substrate or a flexible substrate using a resin film application device in the film application process, and then both are aligned and temporarily pressure-bonded using a component mounting device in the installation process. Then, the resin film is temporarily fixed with the adhesiveness of the resin film, and is further heated and pressed by a pressure bonding apparatus in the pressure bonding step to cure the resin, thereby completing the bonding (for example, see Patent Document 1).

JP 2006-24592 A

  In the prior art, it is necessary to perform the crimping process in the state where the flexible substrate is temporarily fixed using the adhesiveness of the resin at the time of the crimping bonding. When the adhesiveness of the resin is low or the viscosity of the resin is low, the mounting process High-precision crimp bonding is difficult because it cannot be temporarily fixed.

  According to the present invention, a part of a wiring board is sucked and held at the time of pressure bonding and the wiring board is securely fixed to perform high-precision bonding.

  In the substrate mounting apparatus according to the present invention, the outside of the pressure bonding portion adsorbing and holding a part other than the pressure bonding portion of the wiring board to be bonded to the wiring substrate to be bonded, and the pressure bonding portion of the wiring board are held by suction. Pressure bonding part adsorbing means, adsorption part vertical driving means for simultaneously driving up and down the pressure bonding part outside adsorption means and pressure bonding part adsorption means, and relative position moving means for changing the relative position of the wiring board and the bonded wiring board A retracting part driving means for retracting only the crimping joint adsorbing means from above the crimping joint of the wiring board, a pressure heating means for pressurizing and heating the crimping joint of the wiring board, and the pressurization Heating / pressurizing unit driving means for driving the heating means up and down is provided.

  Further, in the substrate mounting method according to the present invention, the outside of the pressure bonding part that sucks and holds a part other than the pressure bonding part of the wiring board to be bonded to the wiring board to be bonded, and the pressure bonding part of the wiring board. A pressure bonding part suction means to be held, a suction part vertical driving means for simultaneously driving up and down the pressure bonding part outside suction means and the pressure bonding part suction means, and a relative position for changing the relative position of the wiring board and the bonded wiring board. A moving means; a retracting part driving means for retracting only the pressure bonding part adsorbing means from the pressure bonding part of the wiring board; a pressure heating means for pressing and heating the pressure bonding part of the wiring board; When mounting the substrate by the heating and pressurizing unit driving unit that drives the pressurizing and heating unit up and down, a part other than the crimping joint portion of the wiring board is sucked and held by the outer side of the crimping joint, and the wiring board The adhering / bonding portion is adsorbed and held by the pressure bonding adsorbing portion adsorbing means, the relative position of the wiring substrate and the bonded wiring substrate is adjusted to a predetermined state by the relative position moving means, and the adsorbing portion vertical driving means and the wiring substrate are fixed. After the circuit board to be bonded is brought into contact with the adhesive resin, the pressure bonding part adsorbing unit is moved by the retracting part driving unit while maintaining the state where the bonding unit outside adsorption unit adsorbs a part of the wiring substrate. Is retracted from above the pressure bonding portion, and the pressure heating means is driven by the pressure heating portion driving means, and the pressure bonding portion is pressurized and heated to perform bonding.

  According to the present invention, a part of the wiring board can be adsorbed and held at the time of pressure bonding to securely fix the wiring board, and high-precision bonding can be performed.

Embodiment 1 FIG.
A first embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a side view showing the configuration of the substrate mounting apparatus according to the first embodiment with respect to a mounting preparation process. FIG. 2 is a side view showing the configuration of the substrate mounting apparatus according to the first embodiment with respect to the mounting process. FIG. 3 is a side view showing the configuration of the substrate mounting apparatus according to the first embodiment with respect to the crimping preparation step. FIG. 4 is a side view showing the configuration of the substrate mounting apparatus according to the first embodiment with respect to the crimping process.

First, the configuration will be described.
As shown in FIGS. 1 to 4, the substrate mounting apparatus according to the first embodiment includes a suction tool 14 that sucks and holds a portion other than the crimp joint portion of the flexible substrate 2 to be joined to the rigid substrate 1, and a flexible An alignment mounting head 11 that sucks and holds the crimping joint of the substrate 2, an actuator 22 that simultaneously drives the suction tool 14 and the alignment mounting head 11 up and down, and a θ table that changes the relative positions of the flexible substrate 2 and the rigid substrate 1. 32, an XY table 33, an actuator 21 for retracting only the positioning mounting head 11 from the crimping joint of the flexible substrate 2, a crimping head 12 for pressurizing and heating the crimping joint of the flexible substrate 2, and a crimping head And an actuator 23 that drives the motor 12 up and down.

The flexible substrate 2 is sucked and held by the alignment mounting head 11 and the suction tool 14.
The alignment mounting head 11 and the suction tool 14 are guided by a linear guide 26 and held vertically movable, and are simultaneously driven up and down by an actuator 22. The alignment mounting head 11 is supported by the actuator 21 and moved relative to the suction tool 14.
The pressure-bonding head 12 is guided by a linear guide 25 and is held up and down and is driven up and down by an actuator 23. The crimping head 12 is provided with a heater 13 so that the temperature can be adjusted.
A substrate stage 31 for fixing the rigid substrate 1 is supported by a θ table 32 and an XY table 33 and is driven in the X direction, the Y direction, and the θ direction.
An anisotropic conductive resin 3 is mounted on the rigid substrate 1. In the first embodiment, the anisotropic conductive resin 3 is mounted on the rigid substrate 1, but the present invention is not limited to this and may be mounted on the flexible substrate 2. Moreover, as the anisotropic conductive resin 3, for example, an epoxy resin containing conductive fine particles is used, and the form may be a film shape or a liquid form. Furthermore, when electrical connection that does not require anisotropy is performed, an isotropic conductive resin may be used. In the case of simply bonding without performing electrical connection, for example, an epoxy resin may be used.

Next, the operation will be described.
[Installation preparation process]
First, as shown in FIG. 1, the rigid substrate 1 is fixed to the substrate stage 31 in the mounting preparation process. Although not shown, the fixing means is fixed by vacuum suction or clamping.
Further, the supplied flexible substrate 2 is vacuum-sucked. At this time, the crimping joint portion of the flexible substrate 2 is sucked and held by the positioning mounting head 11, and a part other than the crimping joint portion is sucked by the suction tool 14.
In this way, by adhering the crimping joint portion of the flexible substrate 2 with the positioning mounting head 11, the shape of the flexible substrate 2 that is flexible and easily deformable can be maintained, and the alignment mark provided in the vicinity of the crimping joint portion is provided. Can be recognized correctly.
In this state, an alignment mark on the rigid board 1 and an alignment mark on the flexible board 2 are recognized by a recognition means (not shown), and the rigid board 1 and the flexible board 2 are aligned at a predetermined relative position by an arithmetic means (not shown). Then, the movement amounts of the θ table 32 and the XY table 33 are calculated, and the θ table 32 and the XY table 33 are driven by control means (not shown). Thereby, the preparation for mounting the flexible substrate 2 on the rigid substrate 1 is performed.

[Mounting process]
Next, as shown in FIG. 2, in the mounting process, the alignment mounting head 11 and the suction tool 14 sucking the flexible substrate 2 by driving the actuator 22 are lowered, and the flexible substrate 2 is placed on the rigid substrate 1. Press against the anisotropic conductive resin 3. At this time, the actuator 22 is driven by position control for driving the flexible substrate 2 to a predetermined height, force control for pressing the flexible substrate 2 against the anisotropic conductive resin 3 on the rigid substrate 1 with a predetermined load, or position Control and force control may be used in combination. The actuator may be a servo motor, a linear motor, or a cylinder, for example. Thereby, the flexible substrate 2 is mounted on the rigid substrate 1 via the anisotropic conductive resin 3.

[Crimping preparation process]
Next, as shown in FIG. 3, in the crimping preparation step, after the vacuum mounting of the alignment mounting head 11 is stopped, the actuator 21 is driven to retract the alignment mounting head 11 from above the crimp bonding portion of the flexible substrate 2. . At this time, since the flexible substrate 2 is sucked and held by the suction tool 14, the position does not shift. As a result, preparation for pressure bonding of the flexible substrate 2 to the rigid substrate 1 is performed.

[Crimping process]
In this state, as shown in FIG. 4, in the crimping process, the actuator 23 is driven to lower the crimping head 12 and press against the crimping joint of the flexible substrate 2, thereby electrically connecting the rigid substrate 1 and the flexible substrate 2. And the anisotropic conductive resin 3 is cured by heat from the pressure-bonding head 12 to ensure the mechanical bonding strength. At this time, since the flexible substrate 2 is sucked and held by the sucking tool 14 and is not displaced, the crimping head 12 does not need a sucking means, and a flat tool having no sucking holes or sucking grooves or the like is used as the crimping head 12 or illustrated. A cushioning material such as a Teflon (registered trademark) sheet or silicone rubber that is not used can be interposed between the pressure-bonding head 12 and the flexible substrate 2 to be pressurized and heated. Thereby, the flexible substrate 2 is pressure-bonded to the rigid substrate 1 via the anisotropic conductive resin 3. The anisotropic conductive resin 3 has conductivity only in the thickness direction, and performs an accurate electrical connection between the predetermined conductive portion of the rigid substrate 1 and the predetermined conductive portion of the flexible substrate 2, misconnection, etc. Does not occur.
As described above, the pressure bonding by the pressure bonding apparatus as the substrate mounting apparatus in the first embodiment is completed.

Thus, in the first embodiment according to the present invention, the mounting process and the crimping process are performed by the same apparatus.
Specifically, the adhering tool 14 that adsorbs and holds a part of the flexible substrate 2 in a pressure bonding apparatus as a substrate mounting apparatus, and the alignment that adsorbs and holds the bonded part of the flexible substrate 2 when performing alignment and mounting. When the mounting head 11 and the pressure-bonding head 12 that performs pressure heating are provided and a portion of the flexible substrate 2 is sucked and held by the suction tool 14 and the flexible substrate 2 is positioned and mounted on the rigid substrate 1, The alignment mounting head 11 performs the alignment and mounting by sucking and holding the crimped joint portion of the flexible substrate 2, and the alignment mounting head 11 is held while the suction tool 14 holds the part of the flexible substrate 2 by suction. Retract and press and heat the pressure bonding portion of the flexible substrate 2 with the pressure bonding head 12 to perform the pressure bonding to the rigid substrate 2. Cormorant.

  In Embodiment 1 according to the present invention, when bonding with anisotropic conductive resin 3 is performed, high-precision bonding is possible even with a resin that cannot be bonded with a conventional crimp bonding apparatus, such as when the adhesiveness is low or the viscosity is low. It becomes possible.

  According to the first embodiment of the present invention, the pressure bonding is made of the suction tool 14 for sucking and holding a part other than the pressure bonding portion of the wiring board made of the flexible substrate 2 to be joined to the bonded wiring board made of the rigid substrate 1. An outside adsorbing means, an adhering joint adsorbing means comprising an alignment mounting head 11 for adsorbing and holding a adhering bonded portion of a wiring board comprising the flexible substrate 2; The relative positions of the adsorbing part vertical driving means consisting of the actuator 22 that simultaneously drives the crimping bonding part adsorbing means consisting of the positioning mounting head 11 up and down, and the bonded wiring board consisting of the flexible board 2 and the rigid board 1 are shown. Relative position moving means comprising a changing θ table 32 and an XY table 33; A retracting portion driving means comprising an actuator 21 for retracting only the crimping joint adsorbing means comprising the cable 11 from above the crimping joining portion of the wiring board comprising the flexible substrate 2; and a crimping joint portion of the wiring board comprising the flexible substrate 2 Pressurizing and heating means composed of a pressure-bonding head 12 that pressurizes and heats, and heating / pressurizing unit driving means composed of an actuator 23 that drives the pressure-heating means composed of the pressure-bonding head 12 up and down. A part other than the crimping joint portion of the wiring board to be formed is sucked and held by an outer suction means of the crimping joint made of the suction tool 14, and the crimping joint portion of the wiring board made of the flexible substrate 2 is made of the alignment mounting head 11. Relative position movement consisting of the θ table 32 and the XY table 33, which is held by suction by the pressure bonding part suction means. The relative position of the wiring board made of the flexible board 2 and the bonded wiring board made of the rigid board 1 is adjusted to a predetermined state by a step, and the wiring board made of the flexible board 2 by the suction portion vertical driving means made of the actuator 22. And the bonded wiring board made of the rigid board 1 are brought into contact with each other through the anisotropic conductive resin 3, and then the adhering means outside the crimp bonding part made of the suction tool 14 removes a part of the wiring board made of the flexible board 2. While maintaining the sucked state, the pressure bonding heating unit consisting of the actuator 23 is moved by retracting the pressure bonding bonding unit suction unit consisting of the positioning mounting head 11 from above the pressure bonding unit by the retraction unit driving unit consisting of the actuator 21. The pressure heating means comprising the crimping head 12 is driven by the part driving means, and the crimping joint is Since the bonding is performed by pressure and heating, a substrate mounting apparatus is provided that can hold a part of the wiring board by suction and securely fix the wiring board at the time of pressure bonding and can perform high-precision bonding. be able to.

  In addition, according to the first embodiment of the present invention, the suction tool 14 that sucks and holds a part other than the crimp-bonded portion of the wiring board made of the flexible board 2 joined to the joined wiring board made of the rigid board 1 is formed. An outside pressure bonding part suction means, a pressure bonding part suction means consisting of an alignment mounting head 11 for sucking and holding a pressure bonding part of a wiring board made of the flexible substrate 2, and a pressure bonding part outside suction means consisting of the suction tool 14. And an adhering part vertical driving means comprising an actuator 22 that simultaneously drives an adjoining pressure adhering part adsorbing means comprising the positioning mounting head 11 and a wiring board comprising the flexible board 2 and a bonded wiring board comprising the rigid board 1 relative to each other. Relative position moving means comprising a θ table 32 and an XY table 33 for changing the position; A retracting part driving means comprising an actuator 21 for retracting only the crimping joint adsorbing means comprising the mounting head 11 from above the crimping joint of the wiring board comprising the flexible board 2 and the crimping joining of the wiring board comprising the flexible board 2. By means of a substrate mounting apparatus comprising a pressurizing and heating means comprising a pressure-bonding head 12 for pressurizing and heating the part, and a heating-and-pressing part drive means comprising an actuator 23 for driving the pressurizing and heating means comprising the pressure-bonding head 12 up and down When performing board mounting, a part other than the crimping joint portion of the wiring board made of the flexible substrate 2 is sucked and held by a suction joining portion outside suction means made of the suction tool 14, and the wiring board made of the flexible substrate 2 is crimped. The bonded portion is sucked and held by a pressure bonding bonding portion suction means including the alignment mounting head 11, and the θ table The relative position of the wiring board made of the flexible substrate 2 and the bonded wiring board made of the rigid substrate 1 is adjusted to a predetermined state by the relative position moving means made up of the XY table 33 and the XY table 33, and the suction portion up / down drive from the actuator 22 is driven. After the contact between the wiring substrate made of the flexible substrate 2 and the bonded wiring substrate made of the rigid substrate 1 through the adhesive resin made of the anisotropic conductive resin 3 by means, the outside adhesion of the pressure bonding portion made of the suction tool 14 While maintaining the state in which the means sucks a part of the wiring board made of the flexible substrate 2, the retracting portion driving means made of the actuator 21 causes the pressure bonding joint sucking means made of the alignment mounting head 11 to be Retracted from above, the pressure heating unit driving means comprising the actuator 23 moves forward. Since the pressure heating means comprising the pressure bonding head 12 is driven and the pressure bonding portion is pressurized and heated to perform bonding, a part of the wiring substrate is sucked and held at the time of pressure bonding and the wiring substrate is surely secured. It is possible to provide a substrate mounting method capable of fixing and performing highly accurate bonding via an anisotropic conductive resin.

Embodiment 2. FIG.
A second embodiment of the present invention will be described with reference to FIGS. FIG. 5 is a side view showing the configuration of the substrate mounting apparatus according to the second embodiment for the mounting process. FIG. 6 is a side view showing the configuration of the substrate mounting apparatus according to the second embodiment for the crimping preparation step.
In the second embodiment, the configuration and method other than the specific configuration and method described here are the same as the configuration and method in the first embodiment described above, and have the same effect. . In the drawings, the same reference numerals indicate the same or corresponding parts.

  In the first embodiment described above, in the crimping preparation step, the positioning mounting head 11 is retracted as shown in FIG. 3 but is not limited to this. For example, as shown in FIG. 5 and FIG. Rotational movement using a link mechanism may be used.

In the substrate mounting apparatus according to the second embodiment, the alignment mounting head 11 is supported by a bearing 28 and connected by an actuator 24 and a bearing 27. The actuator 24 is rotatably supported by a bearing 29.
FIG. 5 shows a state where the flexible substrate 2 is mounted on the rigid substrate 1 by the pressure bonding apparatus of the second embodiment.

Next, as shown in FIG. 6, the actuator 24 is driven to retract the alignment mounting head 11 from above the pressure bonding portion of the flexible substrate 2. At this time, the alignment mounting head 11 is rotatably supported and rotates around the center of rotation.
Thereafter, the actuator 23 is driven to lower the pressure-bonding head 12 and press the pressure-bonding head 12 against the pressure-bonding joint portion of the flexible substrate 2, thereby obtaining electrical bonding of the rigid substrate 1 and the flexible substrate 2 and anisotropically by heat from the pressure-bonding head 12. The conductive conductive resin 3 is cured to ensure mechanical bonding strength.
As described above, the bonding by the pressure bonding apparatus as the board mounting apparatus in the second embodiment is completed.

Embodiment 3 FIG.
A third embodiment of the present invention will be described with reference to FIG. FIG. 7 is a side view showing the configuration of the substrate mounting apparatus according to the third embodiment for the mounting preparation process.
In the third embodiment, the configuration and method other than the specific configuration and method described here are the same as those in the first embodiment or the second embodiment described above, and have the same functions. It plays. In the drawings, the same reference numerals indicate the same or corresponding parts.

  In the first embodiment described above, in the mounting preparation process, the substrate stage 31 is moved by the θ table 32 and the XY table 33 for alignment, but the present invention is not limited to this. For example, as shown in FIG. The head unit 41 may be moved by the θ table 34 and the XY table 35.

Embodiment 4 FIG.
A fourth embodiment of the present invention will be described with reference to FIG. FIG. 8 is a side view showing a bonded state of the substrates in the fourth embodiment.
In the fourth embodiment, the configuration and method other than the specific configuration and method described here are the same as those in any of the first to third embodiments described above. Have the same effect. In the drawings, the same reference numerals indicate the same or corresponding parts.

  In the description from the first embodiment to the third embodiment, the substrates to be bonded are the flexible substrate 2 and the rigid substrate 1, but the scope of application of the present invention is not limited to this. For example, as shown in FIG. 2 and the flexible substrate 4 may be joined. In the configuration of the fourth embodiment shown in FIG. 8, the flexible substrate 2 and the flexible substrate 4 are joined via the anisotropic conductive resin 3.

It is a side view which shows the structure of the board | substrate mounting apparatus in Embodiment 1 by this invention about a mounting preparation process. It is a side view which shows the structure of the board | substrate mounting apparatus in Embodiment 1 by this invention about a mounting process. It is a side view which shows the structure of the board | substrate mounting apparatus in Embodiment 1 by this invention about a crimping | compression-bonding preparatory process. It is a side view which shows the structure of the board | substrate mounting apparatus in Embodiment 1 by this invention about a crimping | compression-bonding process. It is a side view which shows the structure of the board | substrate mounting apparatus in Embodiment 2 by this invention about a mounting process. It is a side view which shows the structure of the board | substrate mounting apparatus in Embodiment 2 by this invention about a crimping | compression-bonding preparatory process. It is a side view which shows the structure of the board | substrate mounting apparatus in Embodiment 3 by this invention about a mounting preparation process. It is a side view which shows the joining state of the board | substrate in Embodiment 4 by this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Rigid board | substrate, 2 Flexible board | substrate, 3 Anisotropic conductive resin, 4 Flexible board | substrate, 11 Positioning mounting head, 12 Crimp head, 13 Heater, 21 Actuator, 22 Actuator, 23 Actuator, 24 Actuator, 25 Linear guide, 26 Linear Guide, 27, 28, 29 Bearing, 31 Substrate stage, 32 θ table, 33 XY table, 34 θ table, 35 XY table, 41 Head part.

Claims (2)

  An outside pressure bonding part adsorbing means for adsorbing and holding a part other than the pressure bonding part of the wiring board to be bonded to the bonded wiring board, a pressure bonding part adsorbing means for adsorbing and holding the pressure bonding part of the wiring board, and the pressure bonding Adsorption unit up-and-down drive means for simultaneously driving up-and-down-adsorption means and the pressure-bonding joint adsorption means, relative position moving means for changing the relative position of the wiring board and the bonded wiring board, and only the pressure-bonding joint adsorption means Evacuating part driving means for retreating from above the pressure bonding part of the wiring board, pressure heating means for pressurizing and heating the pressure bonding part of the wiring board, and heating and pressurization for driving the pressure heating means up and down A board mounting apparatus comprising a unit driving means. An outside pressure bonding part adsorbing means for adsorbing and holding a part other than the pressure bonding part of the wiring board to be bonded to the bonded wiring board, a pressure bonding part adsorbing means for adsorbing and holding the pressure bonding part of the wiring board, and the pressure bonding Adsorption unit up-and-down drive means for simultaneously driving up-and-down-adsorption means and the pressure-bonding joint adsorption means, relative position moving means for changing the relative position of the wiring board and the bonded wiring board, and only the pressure-bonding joint adsorption means Evacuating part driving means for retreating from above the pressure bonding part of the wiring board, pressure heating means for pressurizing and heating the pressure bonding part of the wiring board, and heating and pressurization for driving the pressure heating means up and down When mounting the board by the unit driving means, a part other than the crimping joint portion of the wiring board is sucked and held by the outer crimping joint suction means, and the crimping joint portion of the wiring board is held by the crimping joint suction means. Suck And holding the relative position between the wiring board and the bonded wiring board in a predetermined state by the relative position moving means, and bringing the wiring board and the bonded wiring board into contact with each other via the adhesive resin by the suction unit vertical driving means. After that, while maintaining the state in which the outside of the crimping joint adsorbs a part of the wiring board, the retracting part driving means retracts the crimping joint adsorbing means from above the crimping joint, A substrate mounting method, wherein the pressure heating unit is driven by the pressure heating unit driving unit, and the pressure bonding part is pressurized and heated to perform bonding.

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