JP4756245B2 - Metal blade - Google Patents

Description

  The present invention relates to a metal blade used when precisely cutting an electronic material such as a silicon wafer.

For the purpose of precisely cutting an electronic material made of silicon, ferrite, glass, ceramic or the like, a metal ultrathin blade in which an abrasive layer is formed using abrasive grains such as diamond and cBN is used.
In general, the abrasive layer of these ultrathin metal blades is often a single-layer blade having a single composition. In addition, if you want to make the surface roughness of the cut groove side of the work material fine, that is, if you place importance on cutting quality, or if the blade wear does not become chevron or concave, the abrasive layer has a multilayer structure One example is described in Patent Document 1.

Japanese Patent No. 2644545

  The manufacturing method of the ultra-thin cutting blade described in Patent Document 1 is a method in which abrasive grains, a metal binder, and a printing paste are kneaded and formed and sintered on a printing screen in multiple layers and sintered. . According to this manufacturing method, abrasive grains are not present on the boundary surfaces of the layers formed in multiple layers, and the metal layers are surface-bonded. As a result, a region where no abrasive grains exist is formed in the circumferential direction of the abrasive layer.

When a work piece is cut with a blade having an abrasive layer having this structure, a region where no abrasive grains exist is formed in the vicinity of the boundary portion. Therefore, the wear resistance of the boundary portion is low, and the abrasive layer is unevenly distributed on the boundary surface. Wear occurs, making precise cutting impossible.
The present invention has been made to solve such problems, and an object of the present invention is to provide a metal blade capable of precise cutting by preventing uneven wear at the boundary surface of each layer of an abrasive layer. And

  In order to solve the above problems, the present invention is a metal blade consisting only of a thin disc-shaped abrasive layer, the abrasive layer is formed by laminating a plurality of layers in which abrasive grains are bonded with a binder, The boundary part of the plurality of layers has a wave-like unevenness whose depth is less than or equal to the size of one abrasive grain to be used, and a width of 600 μm or less. The metal blade is characterized in that no region where abrasive grains are present is not formed in the circumferential direction.

  The boundary portion of the plurality of layers has a wavy unevenness whose depth is less than or equal to the size of one abrasive grain used, the width is 600 μm or less, and the abrasive grains are arranged on the unevenness, By avoiding the formation of areas where no abrasive grains exist in the circumferential direction, it is possible to prevent the boundary portion from causing uneven wear during cutting, and to prevent chipping of the abrasive layer caused by uneven wear. it can. Further, the cut groove bottom of the work material can be processed flat, and the processing accuracy can be improved.

  If the depth of the wavy unevenness formed at the boundary exceeds the size of one abrasive grain to be used, it is not preferable because many abrasive grains are distributed in the overlapping area, and the width of the wavy unevenness is not preferable. When the thickness exceeds 600 μm, there are few overlapping areas, and a region in which no abrasive grains exist is formed in the circumferential direction of the abrasive layer, and therefore, uneven wear tends to occur.

  According to the present invention, it is possible to prevent the boundary portion from causing uneven wear during the cutting process, and it is possible to prevent chipping of the abrasive grain layer caused by the uneven wear. Further, the cut groove bottom of the work material can be processed flat, and the processing accuracy can be improved.

Below, the metal blade of this invention is demonstrated based on the embodiment.
FIG. 1 shows a metal blade according to an embodiment of the present invention. FIG. 1A is an overall view of the metal blade 1, and FIG. 1B is a partial detail view of the side surface of the abrasive grain layer.

The metal blade 1 is composed of only a thin disc-shaped abrasive grain layer 2, and the abrasive grain layer 2 is formed by bonding abrasive grains 3 made of diamond or the like with a binder 4. The binder 4 contains copper and tin as components. The abrasive grain layer 2 is formed by laminating a plurality of layers 2a, and the boundary portion 5 of each layer has a depth D equal to or less than the size of one abrasive grain used, and a width W of 600 μm or less. It has wavy unevenness, and the abrasive grains 3 are arranged on the wavy unevenness.
FIG. 2 shows a conventional structure in which the boundary portion 15 of each layer 12a forming the abrasive grain layer 12 is linear. When the abrasive grain layer 12 is formed in this way, each layer forming the abrasive grain layer 12 is shown. In the boundary portion 15 of 12a, the abrasive grains 13 cannot exist, and in the circumferential direction of the abrasive layer 12, there is a region where the abrasive grains 13 do not exist. However, according to the embodiment of the present invention shown in FIG. 1B, unlike the conventional one shown in FIG. 2, a region where the abrasive grains 3 do not exist is not formed in the circumferential direction of the abrasive grain layer 2. can do.

Such an abrasive grain layer 2 can be manufactured by the following method.
The abrasive grains 3 and the metal binder are blended, and the printing paste is mixed according to its fluidity and particle size, and sufficiently kneaded using a kneader. The combined paste obtained by kneading is screen printed on a mold and the surface is dried. On this printed bonded paste molded body, a binder paste is produced by changing the kind of abrasive grains, the particle size, the concentration, the hardness of the binder, etc., and screen-printed and applied. In this printing, the size of the wavy irregularities can be controlled by selecting the screen mesh size according to the size of the abrasive grains.
Since the printed surface has wavy irregularities overlapping each other and the printed surface is in the form of a paste, the adhesiveness to the next applied paste is good. Therefore, the abrasive grains 3 can exist at the boundary portion 5 of each layer.

Specific production examples and test examples are shown below.
Abrasive grains made of synthetic diamond with a particle size of 20 to 40 μm are mixed with a binder for printing with a concentration of 75 and an average particle size of 2 to 10 μm of copper, tin and cobalt and a printing paste, and kneaded using a kneader. did. The binder paste obtained by kneading was screen-laminated and printed on a mold and subjected to pressure sintering to produce an example having the structure shown in FIG. On the other hand, the conventional example of the structure shown in FIG. 2 obtained by laminating and sintering a screen-printed and sintered material on a mold was prepared.

  A cutting test was conducted on this example, the conventional example, and the comparative example shown below. Test conditions are shown in Table 1, and test results are shown in Table 2.

In Table 2, the grinding ratio is an amount defined by the amount of work material deleted per unit wear volume of the abrasive layer. That is, grinding ratio = work material deleted volume ÷ abrasive layer wear volume.
Moreover, the abrasion state about each case is shown in FIG. 3A shows the wear state of the example, FIG. 3B shows the wear state of the conventional example, FIG. 3C shows the wear state of Comparative Example 1, and FIG.

  In the embodiment, by providing the wavy unevenness at the boundary portion, it is possible to prevent formation of a region where no abrasive grains exist in the circumferential direction of the abrasive layer, so that uneven wear does not occur at the boundary portion. The cutting performance has been improved. On the other hand, in the conventional example, since no wavy irregularities are provided, abrasive grains are not arranged at the boundary portions of the respective layers, uneven wear occurs at the boundary portions of the respective layers, and the flatness of the abrasive layer surface is lost. Yes. Moreover, in the comparative example 1, the depth of a wavy unevenness | corrugation is too deep, and convex wear has generate | occur | produced. In Comparative Example 2, since the width of the wavy unevenness is too large, the effect of providing the wavy unevenness cannot be sufficiently obtained, and moderate uneven wear occurs.

  INDUSTRIAL APPLICABILITY The present invention can be used as a metal blade that can prevent uneven wear at the boundary surface of each layer of an abrasive grain layer and can be precisely cut.

It is a figure which shows the metal blade which concerns on embodiment of this invention. It is a figure which shows the structure of a prior art example. It is a figure which shows the condition of the partial wear about an Example, a prior art example, and a comparative example.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Metal blade 2 Abrasive grain layer 2a layer 3 Abrasive grain 4 Binder 5 Boundary part

Claims (1)

  In a metal blade composed only of a thin disc-shaped abrasive layer, the abrasive layer is formed by laminating a plurality of layers obtained by bonding abrasive grains with a binder, and the boundary portion of the plurality of layers uses a depth. A region having no abrasive grains in the circumferential direction of the abrasive layer is formed at the boundary between the plurality of layers. A metal blade characterized by not being used.

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