JP4750604B2 - Circuit board housing case - Google Patents

Circuit board housing case Download PDF

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JP4750604B2
JP4750604B2 JP2006102593A JP2006102593A JP4750604B2 JP 4750604 B2 JP4750604 B2 JP 4750604B2 JP 2006102593 A JP2006102593 A JP 2006102593A JP 2006102593 A JP2006102593 A JP 2006102593A JP 4750604 B2 JP4750604 B2 JP 4750604B2
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circuit board
bottom wall
housing
pin terminal
terminal
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JP2007282322A (en
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勝也 大竹
章弘 小林
由彦 幸村
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NGK Spark Plug Co Ltd
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NGK Spark Plug Co Ltd
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  • Connections Arranged To Contact A Plurality Of Conductors (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Connection Or Junction Boxes (AREA)
  • Multi-Conductor Connections (AREA)

Description

本発明は、回路基板を収容して車両等に取り付けられる回路基板収容ケースに関するものである。   The present invention relates to a circuit board housing case that houses a circuit board and is attached to a vehicle or the like.

従来より、自動車などの排ガス中の特定ガス成分を検出するセンサ素子を備えたガスセンサが知られている。このガスセンサのセンサ素子は、自身を流れる電流の大きさあるいは電圧値が特定ガス成分の濃度に応じて変化することを利用して検出を行うものである。その電流を流すため、ガスセンサの外部には、センサ素子と電気的に接続されるセンサ制御回路が設けられている。センサ制御回路は自動車の電子制御を司るECU(電子制御ユニット)に電気的に接続されており、センサ素子の検出電流がセンサ制御回路で特定ガス成分の濃度を示す濃度信号に変換され、ECU(電子制御ユニット)に送信される。そしてECUでは、入力された検出信号に基づき特定ガス成分の濃度や空燃比が算出され、エンジンにおける燃料の噴射量の調整等が行われる。   Conventionally, a gas sensor including a sensor element that detects a specific gas component in exhaust gas of an automobile or the like is known. The sensor element of this gas sensor performs detection using the fact that the magnitude or voltage value of the current flowing through itself changes according to the concentration of the specific gas component. In order to flow the current, a sensor control circuit electrically connected to the sensor element is provided outside the gas sensor. The sensor control circuit is electrically connected to an ECU (electronic control unit) that controls electronic control of the automobile, and the detected current of the sensor element is converted into a concentration signal indicating the concentration of a specific gas component by the sensor control circuit. To the electronic control unit). The ECU calculates the concentration of the specific gas component and the air-fuel ratio based on the input detection signal, and adjusts the fuel injection amount in the engine.

ところで、上記したセンサ制御回路は回路基板に実装されており、この回路基板は配線接続用のケースに収容されている。このケースは、通常、自動車の車両の床下などに組み付けられるので、組み付け時の上下方向においてケース自身の高さが低くなるように構成されること(低背化)が望ましい。ケースの低背化を実現するためには、底壁およびこの底壁に一端が連結する側壁に囲まれた収容部を有するケースを構成し、ケースの車両への組み付け時の上下方向と直交する方向に底壁の面方向が配置されるように、ケースの組み付け構造を設計する。そして、回路基板の一方の板面(以下、「裏面」という。)側にセンサ制御回路を構成する比較的大きめな電子部品を配置し、他方の板面(以下、「主面」という。)にセンサ制御回路を構成する比較的小さめな電子部品を配置し、その上で主面が底壁に面するように回路基板を収容部内に収容し、回路基板の主面と底壁との間の距離が小さくなるようにケースを構成するとよい。   By the way, the sensor control circuit described above is mounted on a circuit board, and this circuit board is accommodated in a case for wiring connection. Since this case is normally assembled under the floor of a vehicle of an automobile, it is desirable that the case itself be configured to have a low height in the vertical direction during assembly (low profile). In order to reduce the height of the case, a case having a bottom wall and a housing part surrounded by a side wall connected at one end to the bottom wall is formed and orthogonal to the vertical direction when the case is assembled to a vehicle. The assembly structure of the case is designed so that the surface direction of the bottom wall is arranged in the direction. Then, a relatively large electronic component constituting the sensor control circuit is arranged on one plate surface (hereinafter referred to as “back surface”) side of the circuit board, and the other plate surface (hereinafter referred to as “main surface”). A relatively small electronic component that constitutes the sensor control circuit is disposed on the circuit board, and the circuit board is accommodated in the accommodating portion so that the main surface faces the bottom wall, and between the main surface and the bottom wall of the circuit board. The case may be configured so that the distance between the two becomes smaller.

また、センサ制御回路と、ガスセンサおよびECUなどの外部回路との電気的な接続を行うためのリード線が、ケースの車両への組み付け時の水平方向に向けてケースから引き出されるように、ケースを構成するとよい。このようなケースの設計を行った場合、予めリード線が接続された回路基板をケース内に収容する作業はし辛く、またケースのリード線の引き出し位置の封止も難しいため、回路基板とリード線(入出力用のケーブル)との間にピン端子(端子線)を介在させ、そのピン端子を予めケース(ケーシング)に、インサート成形により埋設させる場合がある。回路基板とリード線は、ピン端子の両端にそれぞれ接続される。ピン端子と回路基板との接続は収容部内で行われることとなるため、その接続における作業性を高めるには、回路基板に自身の厚み方向に貫通すると共に回路基板上に配置された電子部品と電気的に接続されたスルーホール導体を設ける。そして、回路基板のケース内への収容時にそのスルーホール導体に容易にピン端子を挿通できるように、ピン端子をケースの底壁から立設するとよい(例えば、特許文献1参照。)。こうすることで、ケース内に収容した回路基板のスルーホール導体とピン端子とのハンダ付け作業を容易に行うことができる。
特開2003−344337号公報
In addition, the case is placed so that the lead wires for electrical connection between the sensor control circuit and the external circuit such as the gas sensor and ECU are pulled out from the case in the horizontal direction when the case is assembled to the vehicle. Configure. When designing a case like this, it is difficult to house a circuit board with lead wires connected in advance in the case, and it is difficult to seal the lead position of the case lead wire. In some cases, pin terminals (terminal wires) are interposed between the wires (input / output cables) and the pin terminals are embedded in a case (casing) in advance by insert molding. The circuit board and the lead wire are respectively connected to both ends of the pin terminal. Since the connection between the pin terminal and the circuit board is performed in the housing portion, in order to improve the workability in the connection, an electronic component penetrating the circuit board in its thickness direction and disposed on the circuit board An electrically connected through-hole conductor is provided. Then, the pin terminal may be erected from the bottom wall of the case so that the pin terminal can be easily inserted into the through-hole conductor when the circuit board is accommodated in the case (see, for example, Patent Document 1). By doing so, the soldering work between the through-hole conductor and the pin terminal of the circuit board accommodated in the case can be easily performed.
JP 2003-344337 A

しかしながら、特許文献1の構成のケースに回路基板を収容し、回路基板の水密性を確保し環境から保護するためケース内に充填材を充填して回路基板を封止した場合、自動車の振動や充填材の熱膨張などの影響により、ケースの底壁に固定された(換言すれば、底壁に埋設された)ピン端子と、そのピン端子にハンダ付けにより固定された回路基板との間においてハンダ付け部分に負荷がかかり、ハンダに浮きや割れ等が生じて接触不良となる虞があった。   However, when the circuit board is housed in the case of the configuration of Patent Document 1, and the circuit board is sealed by filling the case with a filler in order to ensure the water-tightness of the circuit board and protect it from the environment, Between the pin terminal fixed to the bottom wall of the case (in other words, embedded in the bottom wall) and the circuit board fixed to the pin terminal by soldering due to the influence of thermal expansion of the filler. There is a possibility that a load is applied to the soldered portion and the solder floats or cracks, resulting in poor contact.

本発明は上記問題点を解決するためになされたものであり、低背化を実現しつつ、内部に収容される回路基板と外部回路との接続において介在されるピン端子と、その回路基板との電気的な接続の信頼性を長期にわたって維持することができる回路基板収容ケースを提供することを目的とする。   The present invention has been made to solve the above-described problems, and while realizing a low profile, a pin terminal interposed in connection between a circuit board housed inside and an external circuit, and the circuit board An object of the present invention is to provide a circuit board housing case capable of maintaining the reliability of electrical connection for a long period of time.

上記目的を達成するために、請求項1に係る発明の回路基板収容ケースは、底壁およびこの底壁に一端が連結する側壁に囲まれ天部が開口された収容部を有し、板厚方向に沿ってスルーホール導体が形成された回路基板が前記収容部内に収容されると共に、前記収容部内に充填された絶縁性の充填材により前記回路基板が封止されてなる回路基板収容ケースであって、外部回路と前記回路基板とを電気的に接続するため、一端部が前記収容部内に配置され、他端部が前記収容部外に配置されるように、前記収容部の前記側壁内に前記一端部と前記他端部との間の中胴部が埋設されたピン端子を備え、前記ピン端子の前記一端部は、自身が突出する前記側壁から遠ざかるように延びつつ自身の先端側の部位である接続端部を前記収容部の前記天部に向けて屈曲した状態で、前記底壁から離間して前記収容部内に配置され、前記一端部の前記接続端部は、前記回路基板の前記スルーホール導体に挿入されると共に、当該スルーホール導体に接合されており、前記ピン端子の前記中胴部が前記側壁内に埋設されるようにして、前記底壁と前記側壁とが一体で射出成形されてなり、前記ピン端子の前記一端部のうち、前記接続端部と前記中胴部との間の部位である先端胴部は、前記側壁からの自身の突出位置よりも前記底壁に近づくように延びる第1曲折部と、前記第1曲折部の先端に連結しつつ、前記突出位置から遠ざかるように延びて前記接続端部に連結される第2曲折部と、を含むことを特徴とする。 In order to achieve the above object, a circuit board housing case according to a first aspect of the present invention has a bottom wall and a housing portion that is surrounded by a side wall that is connected to one end of the bottom wall and has a top portion that is open. A circuit board housing case in which a circuit board on which through-hole conductors are formed along a direction is housed in the housing portion, and the circuit board is sealed with an insulating filler filled in the housing portion. In order to electrically connect an external circuit and the circuit board, one end portion is disposed in the housing portion and the other end portion is disposed outside the housing portion so that the inside of the side wall of the housing portion is disposed. A pin terminal in which a middle body portion between the one end and the other end is embedded, and the one end of the pin terminal extends away from the side wall from which the pin protrudes, The connection end portion that is a part of In the bent state, it is disposed in the accommodating portion apart from the bottom wall, and the connection end portion of the one end portion is inserted into the through-hole conductor of the circuit board, and the through-hole conductor The bottom wall and the side wall are integrally formed by injection molding so that the middle body portion of the pin terminal is embedded in the side wall, and the one end of the pin terminal is Among these, the front end barrel which is a portion between the connection end and the middle barrel is a first bent portion that extends closer to the bottom wall than its protruding position from the side wall, and the first A second bent portion that extends away from the protruding position and is connected to the connecting end portion while being connected to the tip of the bent portion .

また、請求項2に係る発明の回路基板収容ケースは、請求項1に記載の発明の構成に加え、前記回路基板は、前記収容部における前記底壁から前記天部に向けての高さ方向の中央位置よりも前記底壁側に位置する形態で、当該収容部内に収容されていることを特徴とする。   In addition to the configuration of the invention according to claim 1, the circuit board housing case of the invention according to claim 2 has a height direction from the bottom wall to the top part of the housing part. It is accommodated in the said accommodating part in the form located in the said bottom wall side rather than the center position of this.

また、請求項に係る発明の回路基板収容ケースは、請求項1または2に記載の発明の構成に加え、前記収容部の開口側から前記底壁の厚み方向に沿って前記底壁を見たときに、前記底壁の一の部位で、少なくとも前記ピン端子の前記一端部と向かい合う部位である端子配置部は、前記回路基板の前記底壁に面する主面より遠ざかるように凹状に形成されていることを特徴とする。 Further, the circuit board housing case of the invention according to claim 3, in addition to the configuration of the invention according to claim 1 or 2, viewing the bottom wall from the opening side of the receiving portion along the thickness direction of the bottom wall In this case, at least one part of the bottom wall facing the one end of the pin terminal is formed in a concave shape so as to be farther from the main surface facing the bottom wall of the circuit board. It is characterized by being.

また、請求項に係る発明の回路基板収容ケースは、請求項に記載の発明の構成に加え、前記底壁の前記端子配置部は、前記収容部外側において凸状に形成されていることを特徴とする。 Further, in the circuit board housing case of the invention according to claim 4 , in addition to the configuration of the invention of claim 3 , the terminal arrangement portion of the bottom wall is formed in a convex shape outside the housing portion. It is characterized by.

また、請求項に係る発明の回路基板収容ケースは、請求項に記載の発明の構成に加え、前記収容部外側において、前記底壁には、厚み方向に外方へ突出する複数のリブが設けられ、前記端子配置部とその端子配置部以外の前記底壁の部位とが、前記複数のリブのうちの一部のリブによって仕切られると共に、前記複数のリブの突出先端が、前記底壁の厚み方向と直交する平面に揃えられていることを特徴とする。 According to a fifth aspect of the present invention, there is provided a circuit board housing case, in addition to the structure of the fourth aspect of the present invention, and a plurality of ribs protruding outward in the thickness direction on the bottom wall outside the housing portion. The terminal arrangement portion and the portion of the bottom wall other than the terminal arrangement portion are partitioned by a part of the plurality of ribs, and the protruding tips of the plurality of ribs are It is characterized by being aligned on a plane perpendicular to the thickness direction of the wall.

また、請求項に係る発明の回路基板収容ケースは、請求項1乃至のいずれかに記載の発明の構成に加え、前記ピン端子の前記中胴部は平板状をなし、厚み方向に凹凸状の補強部が形成されていることを特徴とする。 In addition to the configuration of the invention according to any one of claims 1 to 5 , the circuit board housing case of the invention according to claim 6 has a flat plate shape in the pin terminal, and is uneven in the thickness direction. It is characterized in that a shaped reinforcing portion is formed.

請求項1に係る発明の回路基板収容ケースは、自身の側壁内に中胴部を埋設したピン端子の一端部を収容部内に配置し、その一端部の接続端部と回路基板のスルーホール導体とを接合した上で収容部内に充填材を充填したものである。ピン端子の一端部は、収容部内で自身が突出する側壁から遠ざかるように延び、また底壁からも離間した状態であるので、一端部全体としてバネ性を持って底壁に近づく方向ないし底壁から遠ざかる方向、あるいは左右方向に撓むことができる。収容部内には充填材が充填され回路基板が封止されるが、その充填材の熱膨張や、回路基板収容ケースが外部から受ける振動などにより収容部内で回路基板に位置ずれが生じても、ピン端子の一端部の撓みにより応力を吸収することができる。接続端部は回路基板に設けられたスルーホール導体と接合されるが、その接合は通常ハンダ等により行われる。この接合部に応力が加わるとハンダに割れや浮きが生じたりする虞があるが、本発明のようにピン端子の一端部が回路基板の位置ずれに追従して撓み、生じた応力を吸収すればハンダに割れや浮きを防止でき、長期にわたりピン端子と回路基板との接合を維持することができる。また、ピン端子が側壁に埋設され、他端部が側壁から収容部外に配置されるため、外部回路とピン端子との接続を回路基板収容ケースの側方で行うことができるので、低背化を実現することができる。
また、ピン端子の一端部の先端胴部を、底壁と離間した状態でありながらも底壁に近づけるように構成すれば、天部に向けて屈曲させる接続端部の屈曲位置をより底壁に近づけることができる。従って、接続端部に接合される回路基板をより底壁に近づけた上で接続端部と回路基板のスルーホール導体との接合を行うことができ、ひいては回路基板収容ケース全体の低背化を実現することができる。
In the circuit board housing case according to the first aspect of the present invention, one end portion of a pin terminal in which a middle body portion is embedded in its side wall is disposed in the housing portion, and a connection end portion of the one end portion and a through-hole conductor of the circuit board And the filler is filled in the accommodating portion. One end of the pin terminal extends away from the side wall from which the pin terminal protrudes in the accommodating portion, and is also separated from the bottom wall, so that the whole end portion has a spring property and approaches the bottom wall or the bottom wall. It is possible to bend in the direction away from the center or in the left-right direction. The container is filled with a filler and the circuit board is sealed, but even if the circuit board is misaligned in the container due to thermal expansion of the filler or vibration received by the circuit board housing case from the outside, Stress can be absorbed by bending of one end of the pin terminal. The connecting end is joined to a through-hole conductor provided on the circuit board, and the joining is usually performed by solder or the like. If stress is applied to the joint, the solder may be cracked or floated. However, as in the present invention, one end of the pin terminal bends following the displacement of the circuit board and absorbs the generated stress. As a result, the solder can be prevented from cracking and floating, and the bonding between the pin terminal and the circuit board can be maintained for a long time. In addition, since the pin terminal is embedded in the side wall and the other end portion is disposed outside the housing portion from the side wall, the connection between the external circuit and the pin terminal can be performed on the side of the circuit board housing case, so that the low height Can be realized.
In addition, if the tip body of one end of the pin terminal is configured to be close to the bottom wall while being separated from the bottom wall, the bending position of the connecting end to bend toward the top portion is further increased. Can be approached. Therefore, the connection end and the through-hole conductor of the circuit board can be joined after bringing the circuit board to be joined to the connection end closer to the bottom wall, and thus the overall height of the circuit board housing case can be reduced. Can be realized.

また、回路基板は自身のスルーホール導体にピン端子の接続端部を挿入してピン端子との接合を行うが、接続端部は収容部の天部に向くように屈曲されている。スルーホール導体は通常回路基板の厚み方向に貫通するように設けられるため、回路基板は収容部の高さ方向を自身の厚み方向として収容部に収容されることとなる。このとき、請求項2に係る発明のように、収容部の高さ方向の中央位置よりも底壁側に回路基板を位置する形態で収容部内への回路基板の収容を行えば、回路基板を底壁により近づけた状態で収容部内に配置させることができる。従って、回路基板を底壁に近づけた分だけ収容部の高さを低く構成することができるので、回路基板収容ケース全体の低背化を実現することができる。   Further, the circuit board inserts the connection end of the pin terminal into its through-hole conductor and joins it to the pin terminal, but the connection end is bent so as to face the top of the housing portion. Since the through-hole conductor is normally provided so as to penetrate in the thickness direction of the circuit board, the circuit board is accommodated in the accommodating portion with the height direction of the accommodating portion being the thickness direction of the accommodating portion. At this time, as in the invention according to claim 2, if the circuit board is housed in the housing portion in a form in which the circuit board is positioned on the bottom wall side with respect to the center position in the height direction of the housing portion, It can arrange | position in an accommodating part in the state approached by the bottom wall. Accordingly, since the height of the housing portion can be reduced by the amount that the circuit board is brought closer to the bottom wall, the overall height of the circuit board housing case can be reduced.

一方、請求項に係る発明のように、底壁の一の部位であって、ピン端子の一端部が底壁に向かい合う部位にあたる端子配置部を凹状に形成すれば、ピン端子の一端部が撓むための間隙を、底壁の厚み方向において広く確保することができる。これにより、ピン端子の一端部が撓んだ際に底壁に接触し、その撓みが規制されることにより、回路基板と接続端部との接合部に応力がかってしまうという虞が生じ難いので、長期にわたりピン端子と回路基板との接合を維持することができる。こうした構成は、特に回路基板収容ケースの低背化を実現する上でピン端子の一端部の先端胴部を底壁に近づけた構成とした場合に有効である。 On the other hand, as in the invention according to claim 3 , if the terminal arrangement portion corresponding to a portion of the bottom wall, where one end portion of the pin terminal faces the bottom wall, is formed in a concave shape, the one end portion of the pin terminal is A wide gap for bending can be secured in the thickness direction of the bottom wall. As a result, when one end portion of the pin terminal is bent, it contacts the bottom wall, and the bending is restricted, so that it is difficult to cause stress on the joint portion between the circuit board and the connection end portion. In addition, the bonding between the pin terminal and the circuit board can be maintained over a long period of time. Such a configuration is particularly effective when the tip body of one end of the pin terminal is close to the bottom wall in order to achieve a low profile of the circuit board housing case.

また、請求項に係る発明のように、底壁のうちで収容部内側にて凹状に形成した端子配置部を収容部外側において凸状に形成すれば、凹状に形成した部分の底壁の厚みだけが極端に薄くなるのを防止することができる。従って底壁の厚みは、端子配置部と、その端子配置部を除く部位との間で略一定に維持することができ、底壁の厚みに部分的な偏りが生ずることがなく、回路基板収容ケースの剛性を維持することができる。 Moreover, if the terminal arrangement | positioning part formed in concave shape inside the accommodating part among the bottom walls like the invention which concerns on Claim 4 is formed in convex shape in the accommodating part outer side, the bottom wall of the part formed in the concave shape Only the thickness can be prevented from becoming extremely thin. Therefore, the thickness of the bottom wall can be maintained substantially constant between the terminal arrangement portion and the portion excluding the terminal arrangement portion, and there is no partial deviation in the thickness of the bottom wall, so that the circuit board can be accommodated. The rigidity of the case can be maintained.

さらに、請求項に係る発明のように、底壁の外側にリブを設ければ、底壁を補強して剛性を高めることができる。また、上記のように底壁を、端子配置部とそれ以外の部位との間で厚み方向の位置をずらした構成とした場合でも、リブの突出先端の位置を揃えることで底壁は厚みが揃い、その底壁を用い回路基板収容ケースとして形成した場合に高さが部分的に異なることがないため、この回路基板収容ケースを他部材(例えば、このケースを保護する保護カバー)に組み付ける場合にも、両者の組み付けに制約を生じさせない利点がある。 Furthermore, if a rib is provided outside the bottom wall as in the invention according to claim 5 , the bottom wall can be reinforced to increase the rigidity. In addition, even when the bottom wall is configured such that the position in the thickness direction is shifted between the terminal arrangement portion and other parts as described above, the thickness of the bottom wall can be increased by aligning the protruding tip positions of the ribs. Even when the bottom wall is used to form a circuit board housing case, the height does not partially differ. Therefore, when this circuit board housing case is assembled to another member (for example, a protective cover for protecting the case) In addition, there is an advantage that the assembly of both is not restricted.

ところで、ピン端子は回路基板収容ケースの側壁内に中胴部が埋設される。こうした構成の回路基板収容ケースは、通常、樹脂を用いて射出成型により成形される。そこで請求項に係る発明のように、ピン端子の中胴部に補強部を形成すれば、その成形時に金型内に射出される材料の射出圧に中胴部が耐えることができ、成形後に収容部内に配置される一端部の配置位置にばらつきが生じたり、ピン端子に変形が生じたりすることがない。従って、製造過程において、回路基板収容ケースに回路基板を組み付ける際に、回路基板のスルーホール導体内にピン端子の接続端部を容易に挿入することができる。 By the way, as for the pin terminal, the middle body part is embedded in the side wall of the circuit board housing case. The circuit board housing case having such a configuration is usually molded by injection molding using a resin. Therefore, as in the invention according to claim 6 , if the reinforcing part is formed in the middle body part of the pin terminal, the middle body part can withstand the injection pressure of the material injected into the mold at the time of molding. There will be no variation in the position of the one end portion that will be disposed in the housing portion later, and the pin terminal will not be deformed. Therefore, when the circuit board is assembled to the circuit board housing case in the manufacturing process, the connection end of the pin terminal can be easily inserted into the through-hole conductor of the circuit board.

以下、本発明を具体化した回路基板収容ケースの一実施の形態について、図面を参照して説明する。本実施の形態では、自動車の排気管に取り付けられるガスセンサ(図示外)と、自動車の電子制御を司るECU(図示外)との間に介在されるセンサ制御回路を実装した回路基板40を収容するための収容ケース20を回路基板収容ケースの一例とし、その構造について説明する。   Hereinafter, an embodiment of a circuit board housing case embodying the present invention will be described with reference to the drawings. In the present embodiment, a circuit board 40 on which a sensor control circuit interposed between a gas sensor (not shown) attached to an exhaust pipe of an automobile and an ECU (not shown) for electronic control of the automobile is mounted is accommodated. The housing case 20 for this is taken as an example of a circuit board housing case, and the structure thereof will be described.

まず、図1,図2を参照し、収容ケース20の収容部21内に回路基板40を収容してなるセンサユニット10について説明する。図1は、収容ケース20の収容部21内に回路基板40を収容して形成したセンサユニット10を平面、背面および左側面から見た斜視図である。図2は、収容ケース20への保護カバー60の取り付けを行う前のセンサユニット10の様子を平面、背面および左側面から見た斜視図である。なお、本実施の形態のセンサユニット10は自動車の床下に取り付けられて使用されるものであり、収容ケース20を構成する構造体の各部の位置関係を容易に把握するため、取り付けられた自動車の上下方向、前後方向、左右方向を基準として六面方向を定めている。すなわち、本実施の形態において用いられる上下方向、前後方向および左右方向は、説明の便宜上定める方向であり、必ずしもその六面方向となるようにセンサユニット10が自動車に取り付けられることを限定するものではない。また、上下方向を垂直方向、前後方向および左右方向を水平方向とも称する。   First, the sensor unit 10 in which the circuit board 40 is accommodated in the accommodating portion 21 of the accommodating case 20 will be described with reference to FIGS. FIG. 1 is a perspective view of the sensor unit 10 formed by housing the circuit board 40 in the housing portion 21 of the housing case 20 as viewed from the top, back, and left side. FIG. 2 is a perspective view of the state of the sensor unit 10 before the protective cover 60 is attached to the housing case 20 as seen from the plane, back, and left side. The sensor unit 10 according to the present embodiment is used by being mounted under the floor of an automobile. In order to easily grasp the positional relationship of each part of the structure constituting the housing case 20, the sensor unit 10 of the attached automobile is used. Six directions are defined based on the vertical direction, the front-rear direction, and the left-right direction. That is, the up-down direction, the front-rear direction, and the left-right direction used in the present embodiment are directions defined for convenience of explanation, and do not necessarily limit that the sensor unit 10 is attached to the automobile so as to be in the six plane directions. Absent. Further, the vertical direction is also referred to as the vertical direction, and the front-rear direction and the left-right direction are also referred to as the horizontal direction.

図1に示す、センサユニット10は、ヒータ付きのガスセンサ(図示外)に接続される6本のセンサ側リード線89と、自動車の電子制御を行うECU(電子制御ユニット)に接続される4本のECU側リード線79との間を電気的に接続するための装置である。センサユニット10は、ガスセンサに電流を流して排気ガス中の特定成分のガス濃度に応じて大きさの変化する検出電流を得て、その検出電流を濃度信号に変換してECUに送信するためのセンサ制御回路(図示外)を実装した回路基板40を有している。回路基板40は樹脂からなる収容ケース20の収容部21内に収容され、ウレタン等のモールド樹脂50が収容部21内に充填されることにより、水密に封止されている。なお、モールド樹脂50が、本発明における「充填材」に相当する。   The sensor unit 10 shown in FIG. 1 has six sensor-side lead wires 89 connected to a gas sensor (not shown) with a heater, and four connected to an ECU (electronic control unit) that performs electronic control of the automobile. It is an apparatus for electrically connecting between the ECU side lead wire 79. The sensor unit 10 is configured to obtain a detection current whose magnitude changes in accordance with the gas concentration of a specific component in the exhaust gas by passing an electric current through the gas sensor, convert the detection current into a concentration signal, and transmit the detection signal to the ECU. It has a circuit board 40 on which a sensor control circuit (not shown) is mounted. The circuit board 40 is housed in the housing portion 21 of the housing case 20 made of resin, and is sealed watertight by filling the housing portion 21 with a mold resin 50 such as urethane. The mold resin 50 corresponds to the “filler” in the present invention.

図2に示すように、収容ケース20は、その外周面(具体的には後述するが、収容ケース20を構成する前側壁22、後側壁23、左側壁24、右側壁25および底壁26の各外周面)が金属製の保護カバー60により包まれるように覆われる。これにより、センサユニット10が自動車の床下に、収容ケース20の底壁26を下側にして取り付けて使用される際に、収容ケース20が石跳ね等による衝撃から保護される。また、保護カバー60には2つのブラケット61が設けられており、保護カバー60は、自動車の床下にセンサユニット10を固定する固定金具としても機能する。なお、収容ケース20の左側壁24および右側壁25には、保護カバー60を取り付けるための係合部27が2組ずつ設けられており、各係合部27に対応して設けられた保護カバー60の係合部62に係合されることで、図1に示すように、収容ケース20と保護カバー60とが強固に固定されるように構成されている。   As shown in FIG. 2, the storage case 20 has an outer peripheral surface (specifically, a front side wall 22, a rear side wall 23, a left side wall 24, a right side wall 25, and a bottom wall 26 constituting the storage case 20. Each outer peripheral surface) is covered with a metal protective cover 60. As a result, when the sensor unit 10 is used with the bottom wall 26 of the housing case 20 facing down under the floor of the automobile, the housing case 20 is protected from impact due to rock jumping or the like. Moreover, the two brackets 61 are provided in the protective cover 60, and the protective cover 60 functions also as a fixture which fixes the sensor unit 10 under the floor of a motor vehicle. The left side wall 24 and the right side wall 25 of the housing case 20 are provided with two sets of engaging portions 27 for attaching the protective cover 60, and the protective covers provided corresponding to the respective engaging portions 27. By being engaged with the engaging portion 62 of 60, the housing case 20 and the protective cover 60 are configured to be firmly fixed as shown in FIG.

また、収容ケース20の前側壁22および後側壁23にはそれぞれECU側コネクタ部70およびセンサ側コネクタ部80がそれぞれ設けられている。前述したように、ECU側リード線79とセンサ側リード線89とは回路基板40(図1参照)のセンサ制御回路(図示外)を介し、互いに電気的に接続される。そのための回路基板40とECU側リード線79およびセンサ側リード線89との電気的な接続は、収容ケース20の前側壁22および後側壁23に、それらを貫通した状態で埋設される後述のピン端子90(図7参照)を介して行われる。ECU側コネクタ部70およびセンサ側コネクタ部80では、ピン端子90とECU側リード線79およびセンサ側リード線89との電気的な接続がなされる。   The front side wall 22 and the rear side wall 23 of the housing case 20 are provided with an ECU side connector part 70 and a sensor side connector part 80, respectively. As described above, the ECU-side lead wire 79 and the sensor-side lead wire 89 are electrically connected to each other via the sensor control circuit (not shown) of the circuit board 40 (see FIG. 1). The electrical connection between the circuit board 40 and the ECU-side lead wire 79 and the sensor-side lead wire 89 for that purpose is a pin to be described later embedded in the front side wall 22 and the rear side wall 23 of the housing case 20 in a state of passing through them. This is done via the terminal 90 (see FIG. 7). In the ECU-side connector portion 70 and the sensor-side connector portion 80, the pin terminal 90, the ECU-side lead wire 79, and the sensor-side lead wire 89 are electrically connected.

より詳細には、図2におけるセンサ側コネクタ部80の分解斜視図に示すように、6本のピン端子90が収容ケース20の後側壁23内に並んで埋設され、各ピン端子90の後端部93が、後側壁23に突設された端子台231からそれぞれ露出される。そして、各後端部93には6本のセンサ側リード線89の芯線がそれぞれ加締め固定され、電気的に接続される。センサ側コネクタ部80の構造は、この接続部位を保護し水密性を維持するための構造であり、個々のセンサ側リード線89を挿通するための挿通孔831が設けられた端子台キャップ83が、端子台231との間にゴム製のパッキン82を介在させた状態で、後端部93とセンサ側リード線89との接続部位ごと端子台231を覆って、端子台231に固定される。また、端子台キャップ83の各挿通孔831内にはシールラバー84が挿入され、内部を挿通するセンサ側リード線89との間に介在されることで、端子台キャップ83内の水密性の維持がなされる。更に、センサ側リード線89が挿通可能な孔が設けられた端子台キャップカバー81が端子台キャップ83に嵌められ、シールラバー84の抜け防止がなされる。一方、ECU側コネクタ部70は、4本のECU側リード線79と、対応するピン端子90との接続部位の保護構造である。ECU側コネクタ部70の内部構造については図示しないが、センサ側コネクタ部80と同様の構造を有する。   More specifically, as shown in an exploded perspective view of the sensor-side connector portion 80 in FIG. 2, six pin terminals 90 are embedded side by side in the rear side wall 23 of the housing case 20, and the rear end of each pin terminal 90 The portions 93 are respectively exposed from the terminal blocks 231 protruding from the rear side wall 23. Then, the core wires of the six sensor-side lead wires 89 are caulked and fixed to each rear end portion 93 and are electrically connected. The structure of the sensor side connector part 80 is a structure for protecting this connection part and maintaining watertightness. A terminal block cap 83 provided with an insertion hole 831 for inserting each sensor side lead wire 89 is provided. The terminal block 231 is covered and fixed to the terminal block 231 together with the connection portion between the rear end portion 93 and the sensor-side lead wire 89 with the rubber packing 82 interposed between the terminal block 231 and the terminal block 231. In addition, a seal rubber 84 is inserted into each insertion hole 831 of the terminal block cap 83 and is interposed between the sensor side lead wire 89 that passes through the inside, thereby maintaining water tightness in the terminal block cap 83. Is made. Further, a terminal block cap cover 81 provided with a hole through which the sensor-side lead wire 89 can be inserted is fitted into the terminal block cap 83 to prevent the seal rubber 84 from coming off. On the other hand, the ECU-side connector portion 70 is a protection structure for a connection portion between the four ECU-side lead wires 79 and the corresponding pin terminals 90. Although the internal structure of the ECU side connector part 70 is not illustrated, it has the same structure as the sensor side connector part 80.

次に、図3〜図16を参照し、収容ケース20について説明する。図3は、収容ケース20を平面、背面および左側面から矢視方向に見た斜視図である。図4は、収容ケース20の平面図である。図5は、図4の一点鎖線A−Aにおいて左側面側から矢視方向に見た収容ケース20の断面図である。図6は、回路基板40を収容した収容ケース20の平面図である。図7は、図6の一点鎖線B−Bにおいて左側面側から見た回路基板40を収容した収容ケース20の断面図である。図8は、ピン端子90の斜視図である。図9は、ピン端子90の平面図である。図10は、ピン端子90の側面図である。図11は、図9の一点鎖線C−Cにおいて矢視方向に見たピン端子90の断面図である。図12は、図9の一点鎖線D−Dにおいて矢視方向に見たピン端子90の断面図である。図13は、収容ケース20を底面、背面および右側面から見た斜視図である。図14は、収容ケース20の底面図である。図15は、図14の一点鎖線E−Eにおいて右側面側から矢視方向に見た収容ケース20の断面図である。図16は、図14の一点鎖線F−Fにおいて右側面側から矢視方向に見た収容ケース20の断面図である。   Next, the housing case 20 will be described with reference to FIGS. FIG. 3 is a perspective view of the housing case 20 as seen in the direction of the arrow from the plane, back surface, and left side surface. FIG. 4 is a plan view of the storage case 20. FIG. 5 is a cross-sectional view of the housing case 20 as viewed in the direction of the arrow from the left side surface along the alternate long and short dash line AA in FIG. 4. FIG. 6 is a plan view of the housing case 20 that houses the circuit board 40. FIG. 7 is a cross-sectional view of the housing case 20 that houses the circuit board 40 as viewed from the left side surface along the one-dot chain line BB in FIG. 6. FIG. 8 is a perspective view of the pin terminal 90. FIG. 9 is a plan view of the pin terminal 90. FIG. 10 is a side view of the pin terminal 90. FIG. 11 is a cross-sectional view of the pin terminal 90 viewed in the direction of the arrows along the one-dot chain line CC in FIG. FIG. 12 is a cross-sectional view of the pin terminal 90 viewed in the direction of the arrows along the one-dot chain line DD in FIG. FIG. 13 is a perspective view of the housing case 20 as seen from the bottom, back, and right side. FIG. 14 is a bottom view of the housing case 20. FIG. 15 is a cross-sectional view of the housing case 20 as viewed in the direction of the arrow from the right side surface along the alternate long and short dash line EE in FIG. 14. FIG. 16 is a cross-sectional view of the housing case 20 as viewed in the direction of the arrow from the right side surface along the alternate long and short dash line FF in FIG. 14.

図3〜図5に示すように、収容ケース20は、平面視、略正方形で角部が丸みを帯びた形状をなす底壁26を有し、この底壁26と、その外縁から直立させた4つの側壁、すなわち、前側壁22、後側壁23、左側壁24および右側壁25とで囲まれ、天部28(図5参照)が開口された収容部21を有する箱形のケースである。各側壁22〜25の底壁26に連結する側の縁端とは反対側の縁端211は、各側壁22〜25の直立方向と直交する平面に揃うように構成されている。また、収容ケース20が扁平な形状となるように、各側壁22〜25の板面の形状が横長に形成されている(図3参照)。   As shown in FIGS. 3 to 5, the storage case 20 has a bottom wall 26 having a substantially square shape with rounded corners in plan view, and is upright from the bottom wall 26 and its outer edge. This is a box-shaped case having an accommodating part 21 surrounded by four side walls, that is, a front side wall 22, a rear side wall 23, a left side wall 24, and a right side wall 25 and having a top portion 28 (see FIG. 5) opened. The edge 211 on the opposite side to the edge connected to the bottom wall 26 of each side wall 22-25 is comprised so that it may align with the plane orthogonal to the upright direction of each side wall 22-25. Moreover, the shape of the plate | board surface of each side wall 22-25 is formed horizontally long so that the storage case 20 may become a flat shape (refer FIG. 3).

収容ケース20の収容部21内において、底壁26と側壁22〜25との4箇所の隅部分には基板載置台212が形成されている。この収容部21には、図6,図7に示すように、前述したセンサ制御回路を実装した回路基板40が、その厚み方向を上下方向にして収容される。このとき、基板載置台212には回路基板40の4つ角が載置され、回路基板40の底壁26側の板面(主面41)と底壁26の内面261との間で一定の距離が保たれるように構成されている。なお、回路基板40の主面41にはセンサ制御回路を構成する比較的大きめの電子部品(図示外)が実装され、この主面41とは反対側の裏面42にはセンサ制御回路を構成する比較的小さめの電子部品が実装される構成となっている。このため、収容部21内において回路基板40の主面41と底壁26の内面261との間の距離よりも、回路基板40の裏面42と側壁22〜25の縁端211との間の距離が大きくなるように、底壁26の内面261からの基板載置台212の高さが決められている。   In the housing part 21 of the housing case 20, substrate mounting tables 212 are formed at four corner portions of the bottom wall 26 and the side walls 22 to 25. As shown in FIGS. 6 and 7, the accommodating portion 21 accommodates the circuit board 40 on which the sensor control circuit described above is mounted with the thickness direction thereof being the vertical direction. At this time, the four corners of the circuit board 40 are placed on the board mounting table 212, and there is a constant gap between the plate surface (main surface 41) on the bottom wall 26 side of the circuit board 40 and the inner surface 261 of the bottom wall 26. The distance is maintained. A relatively large electronic component (not shown) constituting the sensor control circuit is mounted on the main surface 41 of the circuit board 40, and the sensor control circuit is formed on the back surface 42 opposite to the main surface 41. A relatively small electronic component is mounted. For this reason, the distance between the back surface 42 of the circuit board 40 and the edge 211 of the side walls 22-25 rather than the distance between the main surface 41 of the circuit board 40 and the inner surface 261 of the bottom wall 26 in the accommodating part 21. The height of the substrate mounting table 212 from the inner surface 261 of the bottom wall 26 is determined.

また、図3〜図5に示すように、収容ケース20の前側壁22および後側壁23のそれぞれの外周面には、前述したECU側コネクタ部70およびセンサ側コネクタ部80を構成する端子台221および端子台231がそれぞれ一体的に設けられている。端子台221は、前側壁22の右側壁25寄りの位置(図4参照)で、上下方向の略中央の位置(図5参照)に形成されている。また、端子台231は、後側壁23の左側壁24寄りの位置(図4参照)で、上下方向の略中央の位置(図5参照)に形成されている。そして図5に示すように、端子台231が形成された位置の後側壁23内、および端子台221が形成された位置の前側壁22内にピン端子90が埋設され、端子台231を含む後側壁23、および端子台221を含む前側壁22をそれぞれ貫通している。   As shown in FIGS. 3 to 5, on the outer peripheral surfaces of the front side wall 22 and the rear side wall 23 of the housing case 20, a terminal block 221 constituting the ECU side connector part 70 and the sensor side connector part 80 described above. And a terminal block 231 are integrally provided. The terminal block 221 is formed at a position near the right side wall 25 of the front side wall 22 (see FIG. 4) and at a substantially central position in the vertical direction (see FIG. 5). Further, the terminal block 231 is formed at a position near the left side wall 24 of the rear side wall 23 (see FIG. 4) and at a substantially central position in the vertical direction (see FIG. 5). As shown in FIG. 5, the pin terminal 90 is embedded in the rear side wall 23 where the terminal block 231 is formed and in the front side wall 22 where the terminal block 221 is formed. The side wall 23 and the front side wall 22 including the terminal block 221 are respectively penetrated.

ここで、ピン端子90について説明する。図8〜図10に示すように、ピン端子90は導電性金属からなる板体に塑性加工を施し成形したものである。ピン端子90は、図5にも示すように、端子台221が形成された位置の前側壁22の内部や端子台231が形成された位置の後側壁23の内部に埋設される中胴部92と、収容部21内に配置される先端部91と、端子台221もしくは端子台231から露出される後端部93とから構成される。なお、先端部91および後端部93が、それぞれ、本発明における「一端部」および「他端部」に相当する。   Here, the pin terminal 90 will be described. As shown in FIGS. 8 to 10, the pin terminal 90 is formed by subjecting a plate made of a conductive metal to plastic working. As shown in FIG. 5, the pin terminal 90 has a middle barrel portion 92 embedded in the front side wall 22 at the position where the terminal block 221 is formed and the rear side wall 23 where the terminal block 231 is formed. And a front end portion 91 disposed in the accommodating portion 21 and a rear end portion 93 exposed from the terminal block 221 or the terminal block 231. The front end portion 91 and the rear end portion 93 correspond to “one end portion” and “the other end portion” in the present invention, respectively.

ピン端子90の中胴部92は、収容ケース20に埋設されたときに収容部21側に配置される第1埋設部921と、その第1埋設部921から後端部93側に向けて、板体の幅方向(収容ケース20に埋設されたときの左右方向)を広げた状態で長く延びる第2埋設部922とから構成される。この第2埋設部922には、図11,図12に示すように、自身の縁部分を残して、長円形状をなす凹面部923が板体の厚み方向に凹部形成されている。更に凹面部923の周縁よりも内側であって且つ凹面部923の底面には、長円形状の長手方向に沿って連なる3つの凸面部924が板体の厚み方向に凸部形成されている。この構成により、第2埋設部922の幅方向の断面(図12参照)および第2埋設部922の長手方向の断面(図11参照)がジグザグ状の補強構造をなし、中胴部92の剛性が高められている。収容ケース20は射出成型により形成されるが、この補強構造を有することにより、収容ケース20の形成時に、金型内に充填(射出)される材料の射出圧に第2埋設部922は耐えることができる。なお、凹面部923および凸面部924が、本発明における「補強部」に相当する。   The middle body portion 92 of the pin terminal 90 is disposed on the housing portion 21 side when buried in the housing case 20, and from the first embedded portion 921 toward the rear end portion 93 side, It is comprised from the 2nd embedding part 922 extended long in the state which extended the width direction (left-right direction when embedding in the storage case 20) of the plate. As shown in FIGS. 11 and 12, the second embedded portion 922 is formed with a concave portion 923 having an oval shape in the thickness direction of the plate body, leaving its own edge portion. Further, on the bottom surface of the concave surface portion 923 that is inside the periphery of the concave surface portion 923, three convex surface portions 924 that are continuous along the longitudinal direction of the oval shape are formed as convex portions in the thickness direction of the plate body. With this configuration, the cross section in the width direction of the second embedded portion 922 (see FIG. 12) and the cross section in the longitudinal direction of the second embedded portion 922 (see FIG. 11) form a zigzag reinforcing structure, and the rigidity of the middle trunk portion 92 Has been increased. Although the storage case 20 is formed by injection molding, the second embedded portion 922 can withstand the injection pressure of the material filled (injected) into the mold when the storage case 20 is formed by having this reinforcing structure. Can do. The concave surface portion 923 and the convex surface portion 924 correspond to the “reinforcing portion” in the present invention.

次に、図8〜図10に示すように、ピン端子90の先端部91は、中胴部92の板面と直交する方向に立設された接続端部911と、その接続端部911と中胴部92の第1埋設部921とを接続する先端胴部914とから構成される。更に先端胴部914は、中胴部92の第1埋設部921側の末端から中胴部92の延設方向と直交する方向に曲折された第1曲折部912と、第1曲折部912の末端から中胴部92の延設方向に曲折された第2曲折部913とから構成される。接続端部911は、第2曲折部913の末端から中胴部92の延設方向と直交する方向で第1曲折部912とは反対方向に曲折されており、第1曲折部912と第2曲折部913と接続端部911とで、図10に示すように、側面視、コの字形状をなしている。また、接続端部911には、第2曲折部913側に第2曲折部913と同じ幅の幅広部916が形成され、その幅広部916の先端側に幅広部916よりも細幅の幅狭部915が形成されている。   Next, as shown in FIGS. 8 to 10, the tip portion 91 of the pin terminal 90 includes a connection end portion 911 erected in a direction orthogonal to the plate surface of the middle body portion 92, and the connection end portion 911. It is comprised from the front-end | tip trunk | drum 914 which connects the 1st embedding part 921 of the middle trunk | drum 92. FIG. Further, the front end barrel portion 914 includes a first bent portion 912 that is bent from the end of the middle barrel portion 92 on the first embedded portion 921 side in a direction orthogonal to the extending direction of the middle barrel portion 92, and the first bent portion 912. The second bent portion 913 is bent from the end in the extending direction of the middle barrel portion 92. The connecting end portion 911 is bent in the direction orthogonal to the extending direction of the middle trunk portion 92 from the end of the second bent portion 913 in the direction opposite to the first bent portion 912, and the first bent portion 912 and the second bent portion 912 As shown in FIG. 10, the bent portion 913 and the connecting end portion 911 form a U shape as viewed from the side. Further, the connection end portion 911 is formed with a wide portion 916 having the same width as the second bent portion 913 on the second bent portion 913 side, and narrower than the wide portion 916 on the distal end side of the wide portion 916. A portion 915 is formed.

次いで、図8〜図10に示すように、ピン端子90の後端部93には、中胴部92の第2埋設部922側の末端から連続して中胴部92の延設方向に延びる後端胴部931と、その後端胴部931に連結し、ECU側リード線79やセンサ側リード線89との接続を行う接続部932とが形成されている。接続部932は幅方向に広く形成され、その幅方向の両端が同一方向に折り曲げられて溝形状をなし、リード線の芯線を挟み込む形態(加締め固定可能な形態)となっている。   Next, as shown in FIGS. 8 to 10, the rear end portion 93 of the pin terminal 90 extends continuously in the extending direction of the middle barrel portion 92 from the end of the middle barrel portion 92 on the second embedded portion 922 side. A rear end body portion 931 and a connection portion 932 that is connected to the rear end body portion 931 and connects to the ECU side lead wire 79 and the sensor side lead wire 89 are formed. The connecting portion 932 is formed wide in the width direction, and both ends in the width direction are bent in the same direction to form a groove shape, and the lead wire core wire is sandwiched (a shape that can be crimped and fixed).

このような形状を有するピン端子90は、図5に示すように、収容ケース20の前側壁22や後側壁23内に中胴部92が埋設され、後端部93が端子台221,231から外部に露出されると共に、先端部91が収容部21内に露出される。収容部21内では、図3〜図5に示すように、先端部91の前側壁22における突出位置222や後側壁23における突出位置232から先端胴部914の第1曲折部912が底壁26に向けて延びた状態に配置される。その第1曲折部912の末端に接続する第2曲折部913は、底壁26と一定距離だけ離間した状態を保って前側壁22や後側壁23から遠ざかる方向に延びるように配置される。そして接続端部911は、第2曲折部913の末端から上方(天部28側)に向けて直立した状態に配置される。従って、接続端部911は、突出位置222や突出位置232から突出した先端胴部914により、収容部21内で上下方向、左右方向および前後方向に位置ずれ可能に弾性保持されることとなる。接続端部911は上方に向けて直立され、先端胴部914が突出位置222,232から突き出された状態であり、先端部91全体としてバネ性をもって撓むことができる形態となっている。   As shown in FIG. 5, the pin terminal 90 having such a shape has a middle barrel portion 92 embedded in the front side wall 22 and the rear side wall 23 of the housing case 20, and a rear end portion 93 extending from the terminal blocks 221 and 231. While being exposed to the outside, the distal end portion 91 is exposed in the accommodating portion 21. As shown in FIGS. 3 to 5, the first bent portion 912 of the front end body portion 914 from the protruding position 222 of the front side wall 22 of the front end portion 91 and the protruding position 232 of the rear side wall 23 is located in the bottom wall 26. It arrange | positions in the state extended toward. The second bent portion 913 connected to the end of the first bent portion 912 is disposed so as to extend away from the front side wall 22 and the rear side wall 23 while maintaining a state of being apart from the bottom wall 26 by a certain distance. The connection end 911 is disposed in an upright state from the end of the second bent portion 913 upward (toward the top portion 28). Accordingly, the connection end 911 is elastically held in the accommodating portion 21 so that the connection end portion 911 can be displaced in the vertical direction, the horizontal direction, and the front-back direction by the distal end body portion 914 protruding from the protruding position 222 or the protruding position 232. The connecting end portion 911 is erected upward, and the distal end body portion 914 protrudes from the projecting positions 222 and 232, and the distal end portion 91 as a whole can be bent with springiness.

ところで、前述したように、収容部21内には回路基板40が収容される。この回路基板40には、図6,図7に示すように、収容時の前後方向両端それぞれにおいて縁端に沿って、個々のピン端子90の接続端部911をそれぞれ挿通するためのスルーホール導体45が列設されており、それぞれ厚み方向に貫通して形成されている。これら各スルーホール導体45は、回路基板40上に実装されたセンサ制御回路(図示外)の回路末端に設けられており、センサ制御回路を構成する電子部品と電気的に接続されている。なお、スルーホール導体45とは、回路基板40の板厚方向に沿って貫通されたスルーホールの内壁に沿って形成された導体を指すものである。収容部21内で、回路基板40は、基板載置台212上に四つ角を載置した状態で各スルーホール導体45内に各ピン端子90の接続端部911が挿通され、スルーホール導体45と接続端部911とがハンダ付けにより接合される。これにより、ピン端子90を介し、ECU側リード線79およびセンサ側リード線89とセンサ制御回路との電気的な接続がなされると共に、回路基板40が収容部21内で、ピン端子90により位置ずれ可能に支えられた状態となる。この状態で収容部21内には前述したモールド樹脂50(図1参照)が充填され、回路基板40は水密に封止される。   By the way, as described above, the circuit board 40 is accommodated in the accommodating portion 21. As shown in FIGS. 6 and 7, the circuit board 40 has through-hole conductors for inserting the connection end portions 911 of the individual pin terminals 90 along the edges at both ends in the front-rear direction when accommodated. 45 are arranged in a line, and each is formed penetrating in the thickness direction. Each of these through-hole conductors 45 is provided at a circuit end of a sensor control circuit (not shown) mounted on the circuit board 40, and is electrically connected to electronic components constituting the sensor control circuit. The through-hole conductor 45 refers to a conductor formed along the inner wall of the through-hole penetrating along the thickness direction of the circuit board 40. In the accommodating portion 21, the circuit board 40 is connected to the through-hole conductor 45 by inserting the connection end portions 911 of the pin terminals 90 into the respective through-hole conductors 45 in a state where the four corners are placed on the board mounting table 212. The end portion 911 is joined by soldering. As a result, the ECU side lead wire 79 and the sensor side lead wire 89 are electrically connected to the sensor control circuit via the pin terminal 90, and the circuit board 40 is positioned by the pin terminal 90 in the accommodating portion 21. It will be in the state supported so that deviation is possible. In this state, the accommodating portion 21 is filled with the above-described mold resin 50 (see FIG. 1), and the circuit board 40 is sealed in a watertight manner.

そして、図3〜図5に示すように、収容ケース20の底壁26には、その内面261上の2箇所に、平面視矩形の端子配置部264,265が凹部形成されている。端子配置部264は、前側壁22の端子台221が形成された位置で収容部21内側の壁面に突出された4本のピン端子90の先端部91が、上下方向において、底壁26と重なる位置を含めるようにして形成されている。同様に、端子配置部265は、後側壁23の端子台231が形成された位置で収容部21内側の壁面に突出された6本のピン端子90の先端部91が、上下方向に底壁26と重なる位置を含めるようにして形成されている。これら端子配置部264,265の凹部構造により、図5に示すように、各ピン端子90の第2曲折部913を、より底壁26に近い位置に配置させても、底壁26とは非接触の状態に維持することができる。つまり、ピン端子90の先端部91の上下方向における位置ずれ(先端部91の撓み)に対し、底壁26による規制が生じないため、ピン端子90に支えられる回路基板40を、より底壁26に近い位置に配置することが可能となる。なお、収容ケース20に埋設されるピン端子90を成形時に支持し、成形後に抜き取る金型の構造を実現するため、図3,図4に示すように、端子配置部264,265は水平方向に広い面積をもって形成されている。   As shown in FIGS. 3 to 5, the bottom wall 26 of the housing case 20 is formed with recesses in the terminal arrangement portions 264 and 265 that are rectangular in plan view at two locations on the inner surface 261. In the terminal arrangement portion 264, the tip end portions 91 of the four pin terminals 90 protruding from the wall surface inside the housing portion 21 at the position where the terminal block 221 of the front side wall 22 is formed overlap the bottom wall 26 in the vertical direction. It is formed so as to include the position. Similarly, in the terminal arrangement portion 265, the tip end portions 91 of the six pin terminals 90 protruding from the wall surface inside the housing portion 21 at the position where the terminal block 231 of the rear side wall 23 is formed have the bottom wall 26 in the vertical direction. It is formed so as to include the overlapping position. Due to the concave structure of these terminal arrangement portions 264 and 265, even if the second bent portion 913 of each pin terminal 90 is arranged closer to the bottom wall 26 as shown in FIG. It can be maintained in contact. That is, since the bottom wall 26 does not restrict the vertical displacement of the distal end portion 91 of the pin terminal 90 (bending of the distal end portion 91), the circuit board 40 supported by the pin terminal 90 is more secured to the bottom wall 26. It becomes possible to arrange | position in the position near. In addition, in order to implement | achieve the structure of the metal mold | die which supports the pin terminal 90 embedded at the storage case 20 at the time of shaping | molding, and is extracted after shaping | molding, as shown in FIG.3, FIG.4, the terminal arrangement | positioning parts 264,265 are horizontal. It is formed with a large area.

上記のように底壁26の内面261側に端子配置部264,265を形成したことで、底壁26厚みが部分的に薄くなるため、底壁26にはその補強構造が設けられている。図13〜図16に示すように、底壁26の収容部21外側の板面である外面262には、厚み方向に盛り上がるリブ29が板面方向に格子状に設けられている。リブ29の盛り上がりの高さ、つまり底壁26の厚み方向における突出先端位置は、図15,図16に示すように、底壁26の厚み方向と直交する仮想平面Sに揃えられている。そして、底壁26の内面261上で、端子配置部264,265が形成されていない部位である中底部263に対し、端子配置部264,265は、厚み方向において下方に突出した状態に設けられている。すなわち、底壁26を構成する中底部263と端子配置部264,265とは厚みが略同一に形成され、端子配置部264,265が収容部21内で凹部状に形成された分、中底部263に対し厚み方向にずらした構成となっている。   Since the terminal arrangement portions 264 and 265 are formed on the inner surface 261 side of the bottom wall 26 as described above, the thickness of the bottom wall 26 is partially reduced. Therefore, the reinforcing structure is provided on the bottom wall 26. As shown in FIGS. 13 to 16, ribs 29 swelled in the thickness direction are provided in a lattice shape in the plate surface direction on the outer surface 262 which is the plate surface outside the accommodating portion 21 of the bottom wall 26. The protruding height of the rib 29, that is, the protruding tip position in the thickness direction of the bottom wall 26 is aligned with a virtual plane S orthogonal to the thickness direction of the bottom wall 26, as shown in FIGS. On the inner surface 261 of the bottom wall 26, the terminal arrangement portions 264, 265 are provided in a state of projecting downward in the thickness direction with respect to the middle bottom portion 263, which is a portion where the terminal arrangement portions 264, 265 are not formed. ing. That is, the middle bottom portion 263 and the terminal arrangement portions 264 and 265 constituting the bottom wall 26 are formed to have substantially the same thickness, and the terminal arrangement portions 264 and 265 are formed in a recessed shape in the accommodating portion 21, so that the middle bottom portion The structure is shifted in the thickness direction with respect to H.263.

この部位ごとのずれは、図13〜図16に示すように、厚み方向において、底壁26の内面261側の中底部263の位置と、リブ29の突出先端の位置との間の範囲にて、底壁26を平面視したときにリブ29で区切られたブロック単位でなされている。すなわち、端子配置部264,265にそれぞれ対応するブロック267,268では、底壁26の厚み方向における外面262の位置がリブ29の突出先端の位置(仮想平面S)に、より近い位置となる。一方、中底部263に対応するブロック266では、底壁26の厚み方向における外面262の位置がリブ29の突出先端の位置(仮想平面S)に、ブロック267,268よりも遠い位置となる。換言すれば、リブ29の突出先端を基準として、ブロック267,268は、ブロック266よりも浅い凹部として形成されている。   As shown in FIGS. 13 to 16, the displacement for each part is in a range between the position of the middle bottom 263 on the inner surface 261 side of the bottom wall 26 and the position of the protruding tip of the rib 29 in the thickness direction. When the bottom wall 26 is viewed in a plan view, the bottom wall 26 is divided into blocks divided by ribs 29. That is, in the blocks 267 and 268 respectively corresponding to the terminal arrangement portions 264 and 265, the position of the outer surface 262 in the thickness direction of the bottom wall 26 is closer to the position of the protruding tip of the rib 29 (virtual plane S). On the other hand, in the block 266 corresponding to the middle bottom portion 263, the position of the outer surface 262 in the thickness direction of the bottom wall 26 is farther than the blocks 267 and 268 in the position of the protruding tip of the rib 29 (virtual plane S). In other words, the blocks 267 and 268 are formed as recesses shallower than the block 266 with reference to the protruding tip of the rib 29.

底壁26をこのように構成することにより、ピン端子90の先端部91をより底壁26に近づけ、ひいては回路基板40を底壁26に近づけることができ、収容ケース20の低背化が実現される。また、端子配置部264,265が凹部形成されることによる底壁26の部分的な薄肉化も、中底部263を端子配置部264,265と同じ厚みに構成することで厚みの大きな偏りが解消される。更にリブ29による補強構造により、底壁26自体の強度が確保される。更に、リブ29の突出先端の位置が揃えられるため、底壁26全体としての厚みはリブ29の突出先端の位置と中底部263における内面261の位置との距離に揃えれることとなり、収容ケース20として完成したときの高さが揃い傾きを生じない。   By configuring the bottom wall 26 in this way, the tip 91 of the pin terminal 90 can be brought closer to the bottom wall 26, and the circuit board 40 can be brought closer to the bottom wall 26, thereby realizing a reduction in the height of the housing case 20. Is done. In addition, the partial thinning of the bottom wall 26 due to the recessed portions of the terminal arrangement portions 264 and 265 is also eliminated by configuring the middle bottom portion 263 to have the same thickness as the terminal arrangement portions 264 and 265. Is done. Further, the strength of the bottom wall 26 itself is ensured by the reinforcing structure by the ribs 29. Further, since the positions of the projecting tips of the ribs 29 are aligned, the thickness of the bottom wall 26 as a whole is aligned with the distance between the projecting tips of the ribs 29 and the position of the inner surface 261 in the middle bottom 263. As a result, the height when completed is uniform and no tilt occurs.

なお、本発明は各種の変形が可能なことはいうまでもない。例えば、底壁26の厚み方向における外面262の位置の調整はリブ29で区切られたブロック単位でなされたが、底壁26を平面視したときの端子配置部264,265の位置と中底部263の位置をそのまま区切り位置として、ブロック内で外面262に段差が生ずる構成としてもよい。   Needless to say, the present invention can be modified in various ways. For example, the position of the outer surface 262 in the thickness direction of the bottom wall 26 is adjusted in units of blocks divided by ribs 29. However, the positions of the terminal arrangement portions 264 and 265 and the middle bottom portion 263 when the bottom wall 26 is viewed in plan view. The position may be used as a separation position as it is, and a step may be formed on the outer surface 262 in the block.

また、図17に示す、収容ケース120のように、ECUやガスセンサとの接続を行うリード線135と、ピン端子190との接続を、着脱可能なコネクタ130により行ってもよい。この場合、収容ケース120にコネクタ係合部170を設け、そのコネクタ係合部170には、コネクタ130の先端部131が挿入可能な口部175を形成する。そして口部175内にピン端子190の後端部を延べ板状あるいはピン状にして配置する。一方、コネクタ130の先端部131にはピン端子190の後端部が挿入される挿入孔134を形成し、その内部にリード線135との接続端子を設ける。さらに先端部131の外周に、先端部131を口部175内に挿入した際に口部175の内周面に当接して口部175内に水滴等が浸入しないようにするためのOリング133を設けるとよい。こうした構成とすれば、自動車の床下に収容ケース20が組み付けられたセンサユニットを取り付ける際にリード線135を外した状態で作業を行うことができ、取り付けが容易である。なお、ここではコネクタ130の先端部131をコネクタ係合部170に内装させたが、コネクタ130をコネクタ係合部170に外装させるようにしてもよい。   In addition, as in the housing case 120 shown in FIG. 17, the lead wire 135 for connection to the ECU and the gas sensor and the pin terminal 190 may be connected by a detachable connector 130. In this case, the housing case 120 is provided with a connector engaging portion 170, and the connector engaging portion 170 is formed with a mouth portion 175 into which the distal end portion 131 of the connector 130 can be inserted. Then, the rear end portion of the pin terminal 190 is arranged in a plate shape or a pin shape in the mouth portion 175. On the other hand, an insertion hole 134 into which the rear end portion of the pin terminal 190 is inserted is formed in the front end portion 131 of the connector 130, and a connection terminal for the lead wire 135 is provided therein. Further, an O-ring 133 is provided on the outer periphery of the tip 131 so as to prevent water droplets or the like from entering the mouth 175 by contacting the inner periphery of the mouth 175 when the tip 131 is inserted into the mouth 175. It is good to provide. With such a configuration, when attaching the sensor unit in which the housing case 20 is assembled under the floor of the automobile, the work can be performed with the lead wire 135 removed, and attachment is easy. Here, the tip 131 of the connector 130 is housed in the connector engaging portion 170, but the connector 130 may be externally mounted on the connector engaging portion 170.

また、本実施の形態では ピン端子90の先端部91の先端胴部914から接続端部911までをコの字状に曲折して、接続端部911を上方(天部28)に向けて直立させたが、必ずしもこの形態に限られず、先端胴部914は真っ直ぐ延ばしてもよいし、弧状に屈曲させてもよい。つまり、接続端部911が上方に向けて直立され、先端胴部914が突出位置222,232から突き出し且つ底壁26から離間した状態となって、先端部91全体がバネ性を有し撓むことができる形態であればよい。   In the present embodiment, the tip body portion 914 to the connection end portion 911 of the tip end portion 91 of the pin terminal 90 are bent in a U-shape, and the connection end portion 911 is directed upward (upper portion 28). However, the present invention is not necessarily limited to this form, and the distal end body portion 914 may extend straight or be bent in an arc shape. That is, the connection end 911 is erected upward, the tip body 914 protrudes from the projecting positions 222 and 232 and is separated from the bottom wall 26, and the entire tip 91 is bent with springiness. Any form can be used.

電子部品を搭載した回路基板を収容し、充填材により回路基板を封止するケースに適用できる。   The present invention can be applied to a case in which a circuit board on which electronic components are mounted is accommodated and the circuit board is sealed with a filler.

収容ケース20の収容部21内に回路基板40を収容して形成したセンサユニット10を平面、背面および左側面から見た斜視図である。FIG. 3 is a perspective view of the sensor unit 10 formed by housing the circuit board 40 in the housing portion 21 of the housing case 20 as seen from the plane, back surface, and left side surface. 収容ケース20への保護カバー60の取り付けを行う前のセンサユニット10の様子を平面、背面および左側面から見た斜視図である。It is the perspective view which looked at the mode of sensor unit 10 before attaching protection cover 60 to storage case 20 from the plane, back, and left side. 収容ケース20を平面、背面および左側面から矢視方向に見た斜視図である。It is the perspective view which looked at the storage case 20 in the arrow direction from the plane, the back surface, and the left side surface. 収容ケース20の平面図である。4 is a plan view of the storage case 20. FIG. 図4の一点鎖線A−Aにおいて左側面側から矢視方向に見た収容ケース20の断面図である。It is sectional drawing of the storage case 20 seen in the arrow direction from the left side surface in the dashed-dotted line AA of FIG. 回路基板40を収容した収容ケース20の平面図である。3 is a plan view of a housing case 20 that houses a circuit board 40. FIG. 図6の一点鎖線B−Bにおいて左側面側から見た回路基板40を収容した収容ケース20の断面図である。FIG. 7 is a cross-sectional view of the housing case 20 that houses the circuit board 40 as viewed from the left side surface along the one-dot chain line BB in FIG. 6. ピン端子90の斜視図である。3 is a perspective view of a pin terminal 90. FIG. ピン端子90の平面図である。3 is a plan view of a pin terminal 90. FIG. ピン端子90の側面図である。3 is a side view of a pin terminal 90. FIG. 図9の一点鎖線C−Cにおいて矢視方向に見たピン端子90の断面図である。It is sectional drawing of the pin terminal 90 seen in the arrow direction in the dashed-dotted line CC of FIG. 図9の一点鎖線D−Dにおいて矢視方向に見たピン端子90の断面図である。It is sectional drawing of the pin terminal 90 seen in the arrow direction in the dashed-dotted line DD of FIG. 収容ケース20を底面、背面および右側面から見た斜視図である。It is the perspective view which looked at the storage case 20 from the bottom face, the back, and the right side. 収容ケース20の底面図である。4 is a bottom view of the storage case 20. FIG. 図14の一点鎖線E−Eにおいて右側面側から矢視方向に見た収容ケース20の断面図である。It is sectional drawing of the storage case 20 seen in the arrow direction from the right side surface in the dashed-dotted line EE of FIG. 図14の一点鎖線F−Fにおいて右側面側から矢視方向に見た収容ケース20の断面図である。It is sectional drawing of the storage case 20 seen in the arrow direction from the right side surface in the dashed-dotted line FF of FIG. 変形例としての収容ケース120の構造を示す断面図である。It is sectional drawing which shows the structure of the storage case 120 as a modification.

20 収容ケース
21 収容部
22 前側壁
23 後側壁
24 左側壁
25 右側壁
26 底壁
28 天部
29 リブ
40 回路基板
41 主面
45 スルーホール導体
50 モールド樹脂
90 ピン端子
91 先端部
92 中胴部
93 後端部
222,232 突出位置
264,265 端子配置部
911 接続端部
912 第1曲折部
913 第2曲折部
914 先端胴部
922 第2埋設部
923 凹面部
924 凸面部
DESCRIPTION OF SYMBOLS 20 Storage case 21 Storage part 22 Front side wall 23 Rear side wall 24 Left side wall 25 Right side wall 26 Bottom wall 28 Top part 29 Rib 40 Circuit board 41 Main surface 45 Through-hole conductor 50 Mold resin 90 Pin terminal 91 Tip part 92 Middle trunk part 93 Rear end portion 222, 232 Protruding position 264, 265 Terminal arrangement portion 911 Connection end portion 912 First bent portion 913 Second bent portion 914 Tip trunk portion 922 Second embedded portion 923 Concave surface portion 924 Convex surface portion

Claims (6)

底壁およびこの底壁に一端が連結する側壁に囲まれ天部が開口された収容部を有し、板厚方向に沿ってスルーホール導体が形成された回路基板が前記収容部内に収容されると共に、前記収容部内に充填された絶縁性の充填材により前記回路基板が封止されてなる回路基板収容ケースであって、
外部回路と前記回路基板とを電気的に接続するため、一端部が前記収容部内に配置され、他端部が前記収容部外に配置されるように、前記収容部の前記側壁内に前記一端部と前記他端部との間の中胴部が埋設されたピン端子を備え、
前記ピン端子の前記一端部は、自身が突出する前記側壁から遠ざかるように延びつつ自身の先端側の部位である接続端部を前記収容部の前記天部に向けて屈曲した状態で、前記底壁から離間して前記収容部内に配置され、
前記一端部の前記接続端部は、前記回路基板の前記スルーホール導体に挿入されると共に、当該スルーホール導体に接合されており、
前記ピン端子の前記中胴部が前記側壁内に埋設されるようにして、前記底壁と前記側壁とが一体で射出成形されてなり、
前記ピン端子の前記一端部のうち、前記接続端部と前記中胴部との間の部位である先端胴部は、前記側壁からの自身の突出位置よりも前記底壁に近づくように延びる第1曲折部と、前記第1曲折部の先端に連結しつつ、前記突出位置から遠ざかるように延びて前記接続端部に連結される第2曲折部と、を含むことを特徴とする回路基板収容ケース。
A circuit board having a bottom wall and a housing part surrounded by a side wall connected at one end to the bottom wall and having an opening at the top and having through-hole conductors formed along the plate thickness direction is housed in the housing part. A circuit board housing case in which the circuit board is sealed with an insulating filler filled in the housing portion,
In order to electrically connect the external circuit and the circuit board, the one end is disposed in the side wall of the housing portion so that one end portion is disposed in the housing portion and the other end portion is disposed outside the housing portion. A pin terminal in which a middle body portion between the portion and the other end portion is embedded,
The one end portion of the pin terminal extends in a direction away from the side wall from which the pin terminal protrudes, and the connection end portion, which is a portion on the tip side of the pin terminal, is bent toward the top portion of the housing portion, Arranged in the housing part away from the wall,
The connection end of the one end is inserted into the through-hole conductor of the circuit board and is joined to the through-hole conductor .
The bottom wall and the side wall are integrally molded by injection so that the middle body portion of the pin terminal is embedded in the side wall,
Of the one end portion of the pin terminal, a front end barrel portion that is a portion between the connection end portion and the middle barrel portion extends so as to be closer to the bottom wall than its own protruding position from the side wall. A circuit board housing comprising: a first bent portion; and a second bent portion that is connected to a distal end of the first bent portion and extends away from the protruding position and is connected to the connection end portion. Case.
前記回路基板は、前記収容部における前記底壁から前記天部に向けての高さ方向の中央位置よりも前記底壁側に位置する形態で、当該収容部内に収容されていることを特徴とする請求項1に記載の回路基板収容ケース。   The circuit board is housed in the housing part in a form that is located closer to the bottom wall than a center position in the height direction from the bottom wall toward the top part in the housing part. The circuit board housing case according to claim 1. 前記収容部の開口側から前記底壁の厚み方向に沿って前記底壁を見たときに、前記底壁の一の部位で、少なくとも前記ピン端子の前記一端部と向かい合う部位である端子配置部は、前記回路基板の前記底壁に面する主面より遠ざかるように凹状に形成されていることを特徴とする請求項1または2に記載の回路基板収容ケース。 When the bottom wall is viewed along the thickness direction of the bottom wall from the opening side of the housing portion, the terminal arrangement portion is a portion facing at least the one end portion of the pin terminal at one portion of the bottom wall. 3. The circuit board housing case according to claim 1, wherein the circuit board housing case is formed in a concave shape so as to be farther from a main surface facing the bottom wall of the circuit board. 前記底壁の前記端子配置部は、前記収容部外側において凸状に形成されていることを特徴とする請求項に記載の回路基板収容ケース。 The circuit board housing case according to claim 3 , wherein the terminal arrangement portion of the bottom wall is formed in a convex shape outside the housing portion. 前記収容部外側において、前記底壁には、厚み方向に外方へ突出する複数のリブが設けられ、
前記端子配置部とその端子配置部以外の前記底壁の部位とが、前記複数のリブのうちの一部のリブによって仕切られると共に、
前記複数のリブの突出先端が、前記底壁の厚み方向と直交する平面に揃えられていることを特徴とする請求項に記載の回路基板収容ケース。
On the outside of the housing part, the bottom wall is provided with a plurality of ribs protruding outward in the thickness direction,
The terminal placement portion and the portion of the bottom wall other than the terminal placement portion are partitioned by some of the plurality of ribs,
5. The circuit board housing case according to claim 4 , wherein projecting tips of the plurality of ribs are aligned on a plane perpendicular to the thickness direction of the bottom wall.
前記ピン端子の前記中胴部は平板状をなし、厚み方向に凹凸状の補強部が形成されていることを特徴とする請求項1乃至のいずれかに記載の回路基板収容ケース。 Wherein in the body of the pin terminal is a flat plate-shaped, the circuit board housing case according to any one of claims 1 to 5, characterized in that uneven reinforcing portion is formed in the thickness direction.
JP2006102593A 2006-04-03 2006-04-03 Circuit board housing case Expired - Fee Related JP4750604B2 (en)

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